Integrated heating plate and manufacturing method thereof
By using aqueous nano-silicon resin and ceramic-based materials in the heating plate, the integrated heating plate structure is formed, and the problem of insufficient thermal conductivity and durability of the encapsulated layer is solved, efficient thermal conductivity and insulation are achieved, and service life is extended. Increases the strength of the heating plate.
Patent Information
- Application Number
- CN202111683251.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-31
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2041-12-31
AI Technical Summary
The encapsulation layer materials of the existing heating plates have limited thermal conductivity and poor durability, resulting in low heating efficiency and short service life. There are gaps between the heat generating body layers that affect the thermal conductivity and insufficient support strength.
The aqueous nano-silicon resin is used as the encapsulation layer material, and the ceramic base material is used for the shaping layer to form an integrated heating plate structure, the ceramic base insulating layer is coated with the heating element, and the ceramic base insulating layer and the thermal insulation layer are formed integrally. Use ceramic materials to improve strength and insulation, and aqueous nano-silicon resins provide good thermal conductivity and insulation.
It realizes efficient thermal conductivity and insulation of the heating plate, extends the service life, improves the strength and safety of the heating plate, and meets the needs of diverse use scenarios.
Smart Images

Figure CN114423102B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of heating plate processing technology, and in particular to an integrated heating plate and a manufacturing method thereof. Background Art
[0002] The heating plate is a widely used product. The existing heating plate structure includes an insulating support substrate, a conductive layer, a heating element, an encapsulation layer, etc. The encapsulation layer is an important part of ensuring the normal and safe operation of the heating plate. It needs to have a good heat conduction effect so that the heat generated by the heating element can be quickly and efficiently conducted to the heating surface. It also needs to have excellent insulation to ensure that the heating plate will not leak electricity and cause safety accidents. The existing encapsulation layer is generally made of organic materials such as resin, which has good insulation, but the thermal conductivity is limited, and it is easy to denature under the high temperature and repeated baking of the heating element, which affects the normal operation of the heating plate and shortens the service life of the heating plate. In addition, the existing heating plate is generally assembled, and there may be gaps between the layers from the heating element to the heating surface, which further reduces the thermal conductivity, is not conducive to rapid heating and energy saving, and the support strength is not high, which is not convenient for installation and use. Summary of the invention
[0003] In response to the problem in the prior art that the encapsulation layer of the heating plate is not durable, which affects the normal use of the heating plate, the present invention provides an integrated heating plate and a manufacturing method thereof, which uses water-based nano-silicon resin as an encapsulation layer to cover the heating element from top to bottom, and not only has good thermal conductivity and insulation, but also has good high temperature resistance, can heat up quickly, and extend the service life of the heating plate; at the same time, ceramic is used as a shaping material, and the heating structure of the heating plate is integrally formed in the ceramic shaping layer, which not only prevents water vapor from entering the electrode layer, but also improves the strength of the heating plate, so that the heating plate can meet the usage requirements of different usage scenarios.
[0004] The technical solution adopted by the present invention to solve its technical problems is: an integrated heating plate, which is provided with a ceramic-based insulating layer, a high-temperature resistant heating film and a thermal insulation layer from top to bottom, the high-temperature resistant heating film includes a heating element and a high-temperature resistant insulating layer, the high-temperature resistant insulating layer covers the heating element from the upper and lower sides, and the high-temperature resistant insulating layer is a water-based nano-silicone resin layer; the ceramic-based insulating layer, the high-temperature resistant heating film and the thermal insulation layer are integrally formed, and the surface of the ceramic-based insulating layer is integrally formed with a power supply electrode electrically connected to the high-temperature resistant heating film.
[0005] The technical solution adopted by the present invention to solve the technical problem further includes:
[0006] In the integrated heating plate as described above, the heating element is one of a graphene heating element, an iron-chromium-aluminum heating wire, a nickel-chromium metal heating element or an electromagnetic heating coil.
[0007] In the integrated heating plate as described above, a metal heat conducting plate is provided above the ceramic-based insulating layer.
[0008] In the integrated heating plate as described above, a connecting screw is provided between the metal heat conducting plate and the ceramic-based insulating layer, one end of the connecting screw is inserted into the metal heat conducting plate, and the other end of the connecting screw is integrally formed in the ceramic-based insulating layer.
[0009] In the integrated heating plate as described above, the thermal insulation layer is nano-silicon dioxide aerogel felt or metal aerogel felt.
[0010] In the integrated heating plate as described above, the raw material of the ceramic-based insulating layer includes ceramic powder resin.
[0011] A method for manufacturing an integrated heating plate as described above comprises the following steps:
[0012] S100, processing the high temperature resistant heating film, using spraying, brushing, roller coating or lamination to cover the high temperature resistant insulating layer on the upper and lower surfaces of the heating body, and curing it at room temperature or high temperature according to the needs of the high temperature resistant insulating layer;
[0013] S200, install the high temperature resistant heating film, and use water-based nano-silicon resin to fix the high temperature resistant heating film on the thermal insulation layer;
[0014] S300, processing the ceramic shaping layer, placing the material obtained in the previous step into a mold, pouring it with a ceramic-based thermal insulation material, and then sintering it to obtain an integrated heating plate.
[0015] In the manufacturing method of an integrated heating plate as described above, the following steps are also provided before step S300: selecting a metal sheet of suitable size and thickness as the metal heat-conducting plate according to requirements, and ensuring that the metal sheet is not bent, removing burrs and rough edges on the metal sheet, and using a connecting piece to fix the metal sheet to one side of the high-temperature resistant heating film of the material obtained in step S300.
[0016] In the manufacturing method of an integrated heating plate as described above, the connecting part is a connecting screw, holes are drilled on the material obtained in step S300, and one or more connecting screws are installed. The length of the connecting screw is greater than the thickness of the obtained material, so that space for processing the ceramic shaping layer is left between the high-temperature resistant heating film and the metal sheet.
[0017] The beneficial effects of the present invention are as follows: the integrated heating plate of the present invention and its manufacturing method utilize aqueous nano-silicon resin as an encapsulation layer. The aqueous nano-silicon resin is a non-continuous phase compound with good thermal conductivity and insulation, and good high temperature resistance, which can extend the service life of the heating plate. It is used to coat the heating element to form a high-temperature resistant heating film, which not only enables the heating film to have good thermal conductivity, can heat up quickly, and dissipate heat quickly after use, but also has good insulation and is safer to use. At the same time, ceramic-based materials are used as further insulation and shaping, and the heating structure of the heating plate is integrally formed in the ceramic-based insulating layer, which not only avoids the gap between different functional layers affecting heat conduction, but also improves the strength of the heating plate, so that the heating plate can meet the usage requirements of more usage scenarios.
[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of a preferred embodiment of the integrated heating plate of the present invention;
[0020] In the figure, 1. ceramic-based insulating layer, 11. power supply electrode, 2. high-temperature resistant heating film, 21. heating element, 22. high-temperature resistant insulating layer, 3. thermal insulation layer, 4. metal heat conductive plate, 5. connecting screws. DETAILED DESCRIPTION
[0021] This embodiment is a preferred implementation mode of the present invention. Other embodiments whose principles and basic structures are the same or similar to those of this embodiment are within the protection scope of the present invention.
[0022] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0024] The preferred embodiment of the integrated heating plate of the present invention is shown in FIG. Figure 1 As shown, a ceramic-based insulating layer 1, a high-temperature resistant heating film 2 and a thermal insulation layer 3 are provided from top to bottom. The high-temperature resistant heating film 2 includes a heating element 21 and a high-temperature resistant insulating layer 22. The high-temperature resistant insulating layer 22 covers the heating element 21 from both sides. The high-temperature resistant insulating layer 22 is a water-based nano-silicon resin layer. The ceramic-based insulating layer 1, the high-temperature resistant heating film 2 and the thermal insulation layer 3 are integrally formed. In order to facilitate the power supply to the high-temperature resistant heating film 3, a power supply electrode 11 electrically connected to the high-temperature resistant heating film 2 is integrally formed on the surface of the ceramic-based insulating layer 1.
[0025] In this embodiment, the heating element 21 of the high temperature resistant heating film 2 is an iron-chromium-aluminum heating wire, which is laid flat into a mesh according to the size of the integrated heating plate, and the high temperature resistant insulating layer 22 can be directly applied to the surface of the heating element 21 from the upper and lower sides by spraying, brushing or roller coating, or can be prefabricated into a thin film-like heat insulation layer and pressed and wrapped on the mesh heating element 21 from the upper and lower sides to form a high temperature resistant heating film 2. In the specific production implementation, a graphene heating element, a nickel-chromium metal heating element or an electromagnetic heating coil can be selected as the heating element 21 according to the use requirements.
[0026] In this embodiment, in order to better protect the ceramic-based insulating layer 1, a metal heat-conducting plate 4 is provided above the ceramic-based insulating layer 1, which prevents the ceramic-based insulating layer 1 from being easily damaged due to collision during use, while not affecting the heating speed of the integrated heating plate. In order to ensure that the metal heat-conducting plate 4 can be firmly fixed on the ceramic-based insulating layer 1 and improve the bonding strength of the integrated heating plate, a connecting screw 5 is provided between the metal heat-conducting plate 4 and the ceramic-based insulating layer 1 of this embodiment, one end of the connecting screw 5 is inserted into the metal heat-conducting plate 4, and the other end of the connecting screw 5 is integrally formed in the ceramic-based insulating layer 1.
[0027] In this embodiment, in order to ensure the thermal insulation effect, the thermal insulation layer 3 is nano-silicon dioxide aerogel felt. In the specific production implementation, the thermal insulation layer 3 can be made of nano-silicon dioxide aerogel felt or metal aerogel felt according to the needs of thermal insulation.
[0028] In this embodiment, in order to enhance the insulation and strength of the ceramic-based insulating layer, the raw material of the ceramic-based insulating layer 1 includes ceramic powder resin.
[0029] A method for manufacturing the integrated heating plate as described above according to the present invention comprises the following steps:
[0030] S100, processing the high temperature resistant heating film 2, coating the upper and lower surfaces of the heating body with the high temperature resistant insulating layer 22 by spraying, brushing or roller coating, and curing the high temperature resistant insulating layer 22 at room temperature or high temperature according to the needs of the high temperature resistant insulating layer 22;
[0031] S200, installing the high temperature resistant heating film 2, and fixing the high temperature resistant heating film 2 on the thermal insulation layer 3 using a water-based nano-silicon resin;
[0032] S201, select a metal sheet of suitable size and thickness as the metal heat conducting plate 4 according to the requirements, ensure that the metal sheet is not bent, remove burrs and rough edges on the metal sheet, and use a connector to fix the metal sheet to one side of the high temperature resistant heating film 2 obtained in step S300;
[0033] S300, processing the ceramic shaping layer, placing the material obtained in the previous step into a mold, pouring it with a ceramic-based thermal insulation material, and then sintering it to obtain an integrated heating plate.
[0034] In this embodiment, the connecting member is a connecting screw 5. During installation, holes are drilled on the material obtained in step S300 according to the size of the integrated heating plate and the arrangement of the heating element 21 in the high-temperature resistant heating film 2, and one or more connecting screws 5 are installed. The length of the connecting screw 5 is greater than the thickness of the obtained material, so that there is space for processing the ceramic shaping layer between the high-temperature resistant heating film 2 and the metal sheet.
[0035] The integrated heating plate and the manufacturing method thereof of the present invention utilize aqueous nano-silicon resin as an encapsulation layer. The aqueous nano-silicon resin is a non-continuous phase compound with good thermal conductivity and insulation and good high temperature resistance, which can extend the service life of the heating plate. It is used to coat the heating element to form a high-temperature resistant heating film, which not only enables the heating film to have good thermal conductivity, be able to heat up quickly, and dissipate heat quickly after use, but also has good insulation and is safer to use. At the same time, ceramic-based materials are used as further insulation and shaping, and the heating structure of the heating plate is integrally formed in the ceramic-based insulating layer, which not only avoids the gap between different functional layers affecting heat conduction, but also improves the strength of the heating plate, so that the heating plate can meet the usage requirements of more usage scenarios.
Claims
1. An integrated heating plate, characterized in that: A ceramic-based insulating layer (1), a high-temperature resistant heating film (2) and a heat-insulating layer (3) are sequentially provided from top to bottom, the high-temperature resistant heating film (2) comprising a heating element (21) and a high-temperature resistant insulating layer (22), the high-temperature resistant insulating layer (22) covering the heating element (21) from both upper and lower sides, and the high-temperature resistant insulating layer (22) is a water-based nano-silicon resin layer; The ceramic-based insulating layer (1), the high-temperature resistant heating film (2) and the thermal insulation layer (3) are integrally formed, and a power supply electrode (11) electrically connected to the high-temperature resistant heating film (2) is integrally formed on the surface of the ceramic-based insulating layer (1); A metal heat conducting plate (4) is provided above the ceramic-based insulating layer (1); A connecting screw (5) is provided between the metal heat conducting plate (4) and the ceramic-based insulating layer (1), one end of the connecting screw (5) is inserted into the metal heat conducting plate (4), and the other end of the connecting screw (5) is integrally formed in the ceramic-based insulating layer (1); The manufacturing method of the integrated heating plate comprises the following steps: S100, processing the high temperature resistant heating film (2), using spraying, brushing or roller coating to cover the high temperature resistant insulating layer (22) on the upper and lower surfaces of the heating element (21), and curing the high temperature resistant insulating layer (22) at room temperature or high temperature according to the needs of the high temperature resistant insulating layer (22); S200, installing the high temperature resistant heating film (2), and fixing the high temperature resistant heating film (2) on the thermal insulation layer (3) using a water-based nano-silicon resin; S300, processing the ceramic shaping layer, placing the material obtained in the previous step into a mold, pouring it with a ceramic-based thermal insulation material, and then sintering it to obtain an integrated heating plate; Holes are drilled on the material obtained in step S300, and one or more connecting screws (5) are installed. The length of the connecting screws (5) is greater than the thickness of the obtained material, so that space for processing the ceramic shaping layer is left between the high-temperature resistant heating film (2) and the metal sheet.
2. The integrated heating plate according to claim 1, characterized in that: The heating element (21) is one of a graphene heating element, an iron-chromium-aluminum heating wire, a nickel-chromium metal heating element, or an electromagnetic heating coil.
3. The integrated heating plate according to claim 1, characterized in that: The thermal insulation layer (3) is nano silicon dioxide aerogel felt or metal aerogel felt.
4. The integrated heating plate according to claim 1, characterized in that: The raw material of the ceramic-based insulating layer (1) includes ceramic powder resin.
5. The integrated heating plate according to claim 1, characterized in that: The following steps are also provided before step S300: selecting a metal sheet of suitable size and thickness as the metal heat-conducting plate (4) according to requirements, ensuring that the metal sheet is not bent, removing burrs and rough edges on the metal sheet, and fixing the metal sheet to one side of the high-temperature resistant heating film (2) obtained in step S300 using connecting screws (5).
Citation Information
Patent Citations
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