Temperature control device and dry type fluorescent immunoassay incubator

Abstract

The present invention discloses a temperature control device and a dry type fluorescent immunoassay incubator, the temperature control device comprises a mounting plate, a semiconductor cooling sheet, a heat conducting component and an incubation clamping plate, the mounting plate is formed with a clearance hole which passes through from top to bottom; the semiconductor cooling sheet is arranged at the upper end of the mounting plate, and the hot end of the semiconductor cooling sheet is exposed in the clearance hole; the heat conducting component comprises a heat conducting plate and a heat transfer plate, the lower end surface of the heat conducting plate abuts against the cold end of the semiconductor cooling sheet, the heat transfer plate is arranged at the lower end of the mounting plate, the upper end surface of the heat transfer plate is formed with a heat transfer part, the heat transfer part is adapted to extend into the clearance hole to abut against the hot end of the semiconductor cooling sheet; the incubation clamping plate is arranged at the upper end of the heat conducting plate, and the incubation clamping plate is used to place a reagent card. Temperature control is performed by the semiconductor cooling sheet, which solves the problem of poor temperature control accuracy of the temperature control device in the existing dry type fluorescent immunoassay.

Description

Technical Field

[0001] The invention relates to the technical field of dry type fluorescent immunoassay analyzers, and in particular to a temperature control device and an incubator for dry type fluorescent immunoassay analyzers. Background Art

[0002] The reagent card of the dry fluorescent immunoassay analyzer has high requirements for the ambient temperature and must be kept within a certain temperature range to ensure the accuracy and repeatability of the measurement results. At present, the temperature adjustment of the incubator of the dry fluorescent immunoassay analyzer is generally driven by a fan directly to dissipate heat, which has poor heat dissipation control, low temperature control accuracy, and large temperature fluctuations in the incubator, making it difficult for the reagent card of the dry fluorescent immunoassay analyzer to reach the required temperature in the incubator. Summary of the invention

[0003] The main purpose of the present invention is to provide a temperature control device and a dry type fluorescent immunoassay incubator, aiming to solve the problem of poor temperature control accuracy of the temperature control device in the existing dry type fluorescent immunoassay.

[0004] To achieve the above object, the present invention provides a temperature control device for a dry fluorescent immunoassay incubator, the temperature control device comprising:

[0005] A mounting plate, wherein a vertically penetrating hole is formed on the mounting plate;

[0006] A semiconductor cooling chip is arranged on the upper end of the mounting plate, and the hot end of the semiconductor cooling chip is exposed in the clearance hole;

[0007] A heat conduction assembly, comprising a heat conduction plate and a heat transfer plate, wherein the lower end surface of the heat conduction plate abuts against the cold end of the semiconductor refrigeration plate, the heat transfer plate is arranged at the lower end of the mounting plate, and the upper end surface of the heat transfer plate is formed with a heat transfer portion, and the heat transfer portion is adapted to extend into the clearance hole to abut against the hot end of the semiconductor refrigeration plate; and,

[0008] An incubation splint is arranged on the upper end of the heat conducting plate, and the incubation splint is used for placing the reagent card.

[0009] Optionally, a receiving groove is formed upward on the lower end surface of the mounting plate, and the upper wall surface of the receiving groove is in communication with the clearance hole;

[0010] The heat transfer plate is adapted to be installed in the receiving groove so that the lower end surface of the heat transfer plate is flush with the lower surface of the mounting plate.

[0011] Optionally, the temperature control device also includes a heat dissipation device, which includes a heat sink, and the heat sink has a plurality of heat dissipation fins arranged at intervals along the left and right directions and a connecting plate connecting the upper ends of the plurality of heat dissipation fins, and the upper end surface of the connecting plate at least partially abuts against the lower end surface of the heat transfer plate.

[0012] Optionally, a heat dissipation duct extending in the front-to-back direction is formed between two adjacent heat dissipation fins;

[0013] The heat dissipation device also includes a heat dissipation fan and a wind blocking cover. The heat dissipation fan is arranged at the rear end of the plurality of heat dissipation fins to draw air into the plurality of heat dissipation air ducts. The wind blocking cover has a wind blocking plate connected to the lower end surfaces of the plurality of heat dissipation fins. The rear side surface of the wind blocking plate is flush with the rear side surface of the heat dissipation fins, and the front end of the wind blocking plate extends to the bottom of the heat transfer plate accordingly.

[0014] Optionally, the temperature control device further comprises a heat insulation plate, the heat insulation plate is arranged between the mounting plate and the heat conducting plate, the heat insulation plate is formed with an installation hole which passes through from top to bottom, and the installation hole is used to place the semiconductor refrigeration plate; and / or,

[0015] The temperature control device also includes a heat insulation cover, which is connected to the front end surface to form an installation cavity, and the installation cavity is used to adapt to the installation of the incubation clamp. The lower end surface of the heat insulation cover is provided with a second clearance hole, and the second clearance hole is used to accommodate the heat conduction plate.

[0016] Optionally, a thermally conductive silica gel is attached between the heat conducting plate and the semiconductor refrigeration sheet; and / or,

[0017] Thermally conductive silica gel is attached between the heat transfer plate and the semiconductor refrigeration sheet.

[0018] Optionally, the heat conducting plate is made of aluminum alloy; and / or,

[0019] The heat transfer plate is made of aluminum alloy.

[0020] Optionally, the incubation splint is provided with a plurality of incubation cavities which are open forward and are used to place a plurality of reagent cards.

[0021] Optionally, a partition block is formed between two adjacent incubation chambers, and a mounting hole is formed in each of the partition blocks and extends upward to the upper end surface of the incubation clamping plate;

[0022] The temperature control device further comprises a temperature regulating component, and the temperature regulating component comprises:

[0023] A control circuit board, the control circuit board is arranged on the upper end surface of the mounting plate, the control circuit board is electrically connected to the semiconductor cooling plate; and

[0024] A plurality of temperature sensors are respectively disposed in the plurality of mounting holes and electrically connected to the control circuit board.

[0025] The present invention also provides a dry fluorescent immunoassay incubator, comprising the above-mentioned temperature control device, wherein the temperature control device comprises:

[0026] A mounting plate, wherein a vertically penetrating hole is formed on the mounting plate;

[0027] A semiconductor cooling chip is arranged on the upper end of the mounting plate, and the hot end of the semiconductor cooling chip is exposed in the clearance hole;

[0028] A heat conduction assembly, comprising a heat conduction plate and a heat transfer plate, wherein the lower end surface of the heat conduction plate abuts against the cold end of the semiconductor refrigeration plate, the heat transfer plate is arranged at the lower end of the mounting plate, and the upper end surface of the heat transfer plate is formed with a heat transfer portion, and the heat transfer portion is adapted to extend into the clearance hole to abut against the hot end of the semiconductor refrigeration plate; and,

[0029] An incubation splint is arranged on the upper end of the heat conducting plate, and the incubation splint is used for placing the reagent card.

[0030] In the technical solution provided by the present invention, the temperature difference between the cold end and the hot end of the semiconductor refrigeration plate can be controlled by controlling the magnitude of the current flowing through the semiconductor refrigeration plate, thereby achieving the purpose of accurately controlling the temperature inside the incubation splint, and then through the arrangement of the heat conductive plate and the heat transfer plate, the semiconductor refrigeration plate can more quickly reach a heat dissipation state that meets the expected temperature of the incubation splint. Moreover, by arranging the heat transfer plate on the lower end surface of the mounting plate, the heat transfer portion passes through the give way hole and abuts against the hot end of the semiconductor refrigeration plate, so that the incubation splint, the heat conductive component and the semiconductor refrigeration plate are supported without affecting the heat dissipation effect of the semiconductor refrigeration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of an incubator for a dry-type fluorescent immunoassay analyzer provided by the present invention;

[0033] Figure 2 for Figure 1Schematic diagram of the exploded structure of the dry fluorescent immunoassay incubator;

[0034] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of the mounting plate (the other direction);

[0035] Figure 4 for Figure 1 Schematic diagram of the three-dimensional structure of the heat transfer plate.

[0036] Description of Figure Numbers:

[0037] Label name Label name 100 Temperature control device 5 Heat dissipation device 1 Mounting Plate 51 Heat sink 11 Make way hole 511 Cooling fins 12 Storage slot 512 Connecting plate 2 Semiconductor Refrigeration Chip 52 Cooling fan 3 Thermal Conductive Components 53 Wind hood 31 Heat conduction plate 531 Wind choke 32 Heat transfer plate 6 Insulation board 321 Heat transfer unit 7 Heat shield 4 Incubation splint 8 Temperature control components 41 Incubation chamber 81 Control circuit board 42 Separator 82 Temperature Sensor 421 Mounting holes 9 Reagent Card

[0038] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be noted that if a directional indication is involved in the embodiment of the present invention, the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0041] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0042] The reagent card of the dry fluorescent immunoassay analyzer has high requirements for the ambient temperature and must be kept within a certain temperature range to ensure the accuracy and repeatability of the measurement results. At present, the temperature adjustment of the incubator of the dry fluorescent immunoassay analyzer is generally driven by a fan directly to dissipate heat, which has poor heat dissipation control, low temperature control accuracy, and large temperature fluctuations in the incubator, making it difficult for the reagent card of the dry fluorescent immunoassay analyzer to reach the required temperature in the incubator.

[0043] In view of this, the present invention proposes a temperature control device, which aims to solve the problem of poor temperature control accuracy of the temperature control device in the incubator of the existing dry fluorescent immunoassay analyzer. Figures 1 to 4 This is a schematic structural diagram of an embodiment of a temperature control device provided by the present invention.

[0044] See also Figure 1 , Figure 2 and Figure 4 The temperature control device 100 includes a mounting plate 1, a semiconductor refrigeration sheet 2, a heat-conducting component 3 and an incubation clamp 4. The mounting plate 1 is formed with a clearance hole 11 that passes through from top to bottom; the semiconductor refrigeration sheet 2 is arranged at the upper end of the mounting plate 1, and the hot end of the semiconductor refrigeration sheet 2 is exposed in the clearance hole 11; the heat-conducting component 3 includes a heat-conducting plate 31 and a heat-transfer plate 32, the lower end surface of the heat-conducting plate 31 abuts against the cold end of the semiconductor refrigeration sheet 2, the heat-transfer plate 32 is arranged at the lower end of the mounting plate 1, and the upper end surface of the heat-transfer plate 32 is formed with a heat-transfer portion 321, and the heat-transfer portion 321 is adapted to extend into the clearance hole 11 to abut against the hot end of the semiconductor refrigeration sheet 2; the incubation clamp 4 is arranged at the upper end of the heat-conducting plate 31, and the incubation clamp 4 is used to place the reagent card 9.

[0045] In the technical solution provided by the present invention, the temperature difference between the cold end and the hot end of the semiconductor refrigeration chip 2 can be controlled by controlling the magnitude of the current flowing through the semiconductor refrigeration chip 2, thereby achieving the purpose of accurately controlling the temperature inside the incubation splint 4, and then through the arrangement of the heat conducting plate 31 and the heat transfer plate 32, the semiconductor refrigeration chip 2 can more quickly reach a heat dissipation state that meets the expected temperature of the incubation splint 4. Moreover, by arranging the heat transfer plate 32 on the lower end surface of the mounting plate 1, the heat transfer portion 321 passes through the make way hole 11 and abuts against the hot end of the semiconductor refrigeration chip 2, so that the incubation splint 4, the heat conducting component 3 and the semiconductor refrigeration chip 2 are supported without affecting the heat dissipation effect of the semiconductor refrigeration chip 2.

[0046] It is understandable that the areas of the heat conducting plate 31 and the heat transfer plate 32 are both larger than the area of ​​the semiconductor cooling plate 2, so as to achieve the effect of accelerating heat conduction.

[0047] It should be noted that the semiconductor cooling plate 2 is a heat transfer tool. When a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form an electric couple, after a direct current is connected in this circuit, energy transfer can be generated. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end; the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. The heat between the plates will also be reversely transferred through the air and the semiconductor material itself. When the cold and hot ends reach a certain temperature difference and the amount of these two heat transfers is equal, a balance point will be reached, and the positive and reverse heat transfers will cancel each other out. At this time, the temperature of the cold and hot ends will not continue to change; the amount of heat absorption and heat release is determined by the size of the current and the number of element pairs of the semiconductor materials N and P.

[0048] For further information, see Figure 3 The lower end surface of the mounting plate 1 is upwardly formed with a receiving groove 12, and the upper wall surface of the receiving groove 12 is in communication with the clearance hole 11; the heat transfer plate 32 is adapted to be installed in the receiving groove 12, so that the lower end surface of the heat transfer plate 32 is flush with the lower surface of the mounting plate 1. In this way, the heat transfer plate 32 is built into the lower end of the mounting plate 1, which does not affect the heat dissipation efficiency of the heat transfer plate 32, and reduces the overall thickness of the temperature control device 100.

[0049] In order to accelerate the heat dissipation effect of the heat transfer plate 32, so that the semiconductor cooling plate 2 can more quickly reach the heat dissipation state that meets the expected temperature of the incubation splint 4, please refer to Figure 2 In this embodiment, the temperature control device 100 further includes a heat dissipation device 5, which includes a heat dissipation element 51. The heat dissipation element 51 has a plurality of heat dissipation fins 511 arranged at intervals along the left-right direction and a connecting plate 512 connecting the upper ends of the plurality of heat dissipation fins 511. The upper end surface of the connecting plate 512 at least partially abuts against the lower end surface of the heat transfer plate 32. In this arrangement, the contact area between the heat dissipation element 51 and the air is increased through the extended arrangement of the plurality of heat dissipation fins 511, thereby improving the efficiency of natural heat dissipation of the heat transfer plate 32.

[0050] In order to further improve the heat dissipation efficiency of the heat transfer plate 32, a forced cooling device can be used for heat dissipation. The forced cooling device includes an air cooling device and a water cooling device. In order to avoid leakage of the water cooling device to damage the components inside the temperature control device 100, please refer to Figure 2In this embodiment, a heat dissipation duct extending in the front-to-back direction is formed between two adjacent heat dissipation fins 511; the heat dissipation device 5 also includes a heat dissipation fan 52 and a wind blocking cover 53, the heat dissipation fan 52 is arranged at the rear end of the plurality of heat dissipation fins 511 to draw air into the plurality of heat dissipation ducts, the wind blocking cover 53 has a wind blocking plate 531 connected to the lower end surfaces of the plurality of heat dissipation fins 511, the rear side surface of the wind blocking plate 531 is flush with the rear side surface of the heat dissipation fins 511, and the front end of the wind blocking plate 531 extends to the bottom of the heat transfer plate accordingly. By setting the wind baffle plate 531, the air drawn by the cooling fan 52 can pass through the cooling duct completely, and the external air can be used to take away the heat in the cooling duct to the greatest extent. At the same time, the front end of the wind baffle plate 531 extends to the bottom of the heat transfer plate, so that the area of ​​the heat dissipation fins 511 corresponding to the heat transfer plate 32 is not closed by the wind baffle cover 53, so that it can dissipate heat naturally. At the same time, air can enter from the front end and the lower end of the heat dissipation channel and pass through the area of ​​the heat dissipation fins 511 corresponding to the heat transfer plate 32, thereby increasing the air intake and improving the heat dissipation efficiency. Not only that, while the cooling fan 52 is forcing heat dissipation, it can also effectively increase the temperature difference between the cold end and the hot end, thereby increasing the cooling range of the semiconductor refrigeration plate 2.

[0051] In order to reduce the impact of the external environment on the operation of the semiconductor cooling plate 2, please refer to Figure 2 In this embodiment, the temperature control device 100 also includes a heat insulation plate 6, which is arranged between the mounting plate 1 and the heat conducting plate. The heat insulation plate 6 is formed with an installation hole that passes through from top to bottom, and the installation hole is used to place the semiconductor refrigeration plate 2. The heat insulation plate 6 is arranged to cover the side of the semiconductor refrigeration plate 2, which not only blocks the external environment, but also plays a certain supporting role, and can effectively prevent the semiconductor refrigeration plate 2 from being crushed.

[0052] In order to prevent the external environment from affecting the constant temperature incubation of the incubation splint 4, please refer to Figure 2 The temperature control device 100 also includes a heat insulation cover 7, and the heat insulation cover 7 is penetrated to the front end surface to form an installation cavity, and the installation cavity is used to adapt to the installation of the incubation clamp 4. The lower end surface of the heat insulation cover 7 is provided with a second clearance hole, and the second clearance hole is used to accommodate the heat conductive plate 31. Through the setting of the heat insulation cover 7, it is possible to prevent the situation where the semiconductor refrigeration plate 2 needs to maintain a large current input to maintain the temperature in the incubation clamp 4 due to a large difference between the temperature in the incubation clamp 4 and the external ambient temperature.

[0053] It should be noted that the above two parallel technical features "the temperature control device 100 also includes a heat insulation plate 6, the heat insulation plate 6 is arranged between the mounting plate 1 and the heat conducting plate, the heat insulation plate 6 is formed with an installation hole which passes through from top to bottom, and the installation hole is used to place the semiconductor refrigeration plate 2" and "the heat insulation cover 7 passes through to the front end surface to form an installation cavity, and the installation cavity is used to adapt to the installation of the incubation splint 4, and the lower end surface of the heat insulation cover 7 is provided with a second clearance hole, and the second clearance hole is used to accommodate the heat conducting plate 31" can be set one by one, or can be set at the same time. Obviously, the effect of setting them at the same time is better.

[0054] In order to enhance the heat absorption efficiency of the cold end of the semiconductor refrigeration sheet 2, in the present embodiment, a thermally conductive silicone is attached between the heat conducting plate 31 and the semiconductor refrigeration sheet 2. The thermally conductive silicone has good thermal conductivity and is flexible. Both ends of the thermally conductive silicone can fit tightly to the semiconductor refrigeration sheet 2 and the heat conducting plate 31, thereby ensuring the heat conduction efficiency. At the same time, it can also prevent the semiconductor refrigeration sheet 2 from being crushed by the excessive pressing force of the heat conducting plate 31 to a certain extent.

[0055] In order to enhance the heat dissipation efficiency of the hot end of the semiconductor refrigeration sheet 2, in the present embodiment, a thermally conductive silicone is attached between the heat transfer plate 32 and the semiconductor refrigeration sheet 2. The thermally conductive silicone has good thermal conductivity and is flexible. Both ends of the thermally conductive silicone can fit tightly to the semiconductor refrigeration sheet 2 and the heat transfer plate 32, thereby ensuring the heat conduction efficiency. At the same time, it can also prevent the semiconductor refrigeration sheet 2 from being crushed by the excessive pressing force of the heat transfer plate 32 to a certain extent.

[0056] It should be noted that the above two parallel technical features "thermal conductive silicone is attached between the heat conducting plate 31 and the semiconductor refrigeration sheet 2" and "thermal conductive silicone is attached between the heat transfer plate 32 and the semiconductor refrigeration sheet 2" can be set one by one or at the same time. Obviously, the effect of setting them at the same time is better.

[0057] In order to enhance the heat absorption efficiency of the cold end of the semiconductor refrigeration plate 2, in this embodiment, the material of the heat conducting plate 31 is aluminum alloy, which has good thermal conductivity and is more economical than copper.

[0058] In order to enhance the heat dissipation efficiency of the hot end of the semiconductor refrigeration plate 2, in this embodiment, the heat transfer plate 32 is made of aluminum alloy. Aluminum alloy has good thermal conductivity and is more economical than copper.

[0059] It should be noted that the above two parallel technical features "the material of the heat conducting plate 31 is aluminum alloy" and "the material of the heat transfer plate 32 is aluminum alloy" can be set either one or both. Obviously, the effect of setting them together is better, which can simultaneously improve the heat absorption effect of the cold end and the heat dissipation effect of the hot end of the semiconductor refrigeration plate 2, so that the semiconductor refrigeration plate 2 can quickly reach the heat dissipation balance state of the expected temperature.

[0060] See also Figure 2 In this embodiment, the incubation splint 4 is provided with a plurality of incubation cavities 41 which are open forwardly and are used to place a plurality of reagent cards 9. Thus, a plurality of reagent cards 9 can be incubated at the same time, thereby improving the incubation efficiency.

[0061] Since the incubation splint 4 conducts temperature through the heat conducting sheet, it is understandable that the temperature of the incubation chamber 41 farther from the semiconductor refrigeration sheet 2 will be different from the temperature of the incubation chamber 41 closer to the semiconductor refrigeration sheet 2. Based on this, please refer to Figure 2 In this embodiment, a partition block 42 is formed between two adjacent incubation chambers 41, and a mounting hole 421 is formed in each of the partition blocks 42 and extends upward to the upper end surface of the incubation clamp 4; the temperature control device 100 also includes a temperature control component 8, the temperature control component 8 includes a control circuit board 81 and a plurality of temperature sensors 82, the control circuit board 81 is arranged on the upper end surface of the mounting plate 1, and the control circuit board 81 is electrically connected to the semiconductor refrigeration sheet 2; the plurality of temperature sensors 82 are respectively arranged in the plurality of mounting holes 421, and are electrically connected to the control circuit board 81. By respectively arranging a plurality of temperature sensors 82 in the mounting holes 421 in each of the partition blocks 42, the temperature of the reagent card 9 in each of the incubation chambers 41 can be monitored in real time, and then it can be determined whether the temperature in each of the incubation chambers 41 is within the expected temperature range, and then the current flowing through the semiconductor refrigeration sheet 2 can be controlled in real time by the control circuit board 81, so as to ensure that the incubation temperature of the reagent cards 9 of the same batch meets the standard, and the accuracy and repeatability of the measurement results of the reagent cards 9 are guaranteed.

[0062] Since the control circuit board 81 will also generate a lot of heat during operation, if the control circuit board 81 is not heat-dissipated, the control effect of the control circuit board 81 will be affected, causing delays in feedback regulation. Figure 2In this embodiment, the control circuit board 81 is arranged at the rear side of the semiconductor refrigeration plate 2, and the mounting plate 1 even has a third clearance hole at the position corresponding to the installation of the control circuit board 81. A second heat transfer plate is arranged in the third clearance hole, and the heat dissipation duct extends backward at least to the bottom of the second heat transfer plate. With such an arrangement, the heat dissipation device 5 can be used to simultaneously dissipate heat for the control circuit board 81 and the semiconductor refrigeration plate 2, thereby simplifying the structure of the temperature control device 100 and saving manufacturing costs.

[0063] In addition, to achieve the above-mentioned purpose, the present invention also provides a dry fluorescent immunoassay incubator, which includes the temperature control device 100 described in the above-mentioned technical solution. It should be noted that the detailed structure of the temperature control device 100 of the dry fluorescent immunoassay incubator can refer to the above-mentioned embodiment of the temperature control device 100, which will not be repeated here; since the above-mentioned temperature control device 100 is used in the dry fluorescent immunoassay incubator of the present invention, the embodiment of the dry fluorescent immunoassay incubator of the present invention includes all technical solutions of all embodiments of the above-mentioned temperature control device 100, and the technical effects achieved are also exactly the same, which will not be repeated here.

[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A temperature control device for a dry fluorescent immunoassay incubator, characterized in that: The temperature control device comprises: A mounting plate, wherein a vertically penetrating hole is formed on the mounting plate; A semiconductor cooling chip is arranged on the upper end of the mounting plate, and the hot end of the semiconductor cooling chip is exposed in the clearance hole; A heat conduction assembly, comprising a heat conduction plate and a heat transfer plate, wherein the lower end surface of the heat conduction plate abuts against the cold end of the semiconductor refrigeration sheet, the heat transfer plate is arranged at the lower end of the mounting plate, and the upper end surface of the heat transfer plate is formed with a heat transfer portion, and the heat transfer portion is adapted to extend into the clearance hole to abut against the hot end of the semiconductor refrigeration sheet; An incubation splint, disposed on the upper end of the heat conducting plate, and used for placing the reagent card; The temperature control device further includes a heat dissipation device, the heat dissipation device includes a heat dissipation element, the heat dissipation element has a plurality of heat dissipation fins arranged in a left-right direction and a connecting plate connecting the upper ends of the plurality of heat dissipation fins, the upper end surface of the connecting plate at least partially abuts against the lower end surface of the heat transfer plate; and A heat dissipation duct extending in the front-to-back direction is formed between two adjacent heat dissipation fins; The heat dissipation device also includes a heat dissipation fan and a wind blocking cover. The heat dissipation fan is arranged at the rear end of the plurality of heat dissipation fins to draw air into the plurality of heat dissipation air ducts. The wind blocking cover has a wind blocking plate connected to the lower end surfaces of the plurality of heat dissipation fins. The rear side surface of the wind blocking plate is flush with the rear side surface of the heat dissipation fins, and the front end of the wind blocking plate extends to the bottom of the heat transfer plate accordingly.

2. The temperature control device according to claim 1, characterized in that: The lower end surface of the mounting plate is upwardly formed with a receiving groove, and the upper wall surface of the receiving groove is in communication with the clearance hole; The heat transfer plate is adapted to be installed in the receiving groove so that the lower end surface of the heat transfer plate is flush with the lower surface of the mounting plate.

3. The temperature control device according to claim 1, characterized in that: The temperature control device further comprises a heat insulation plate, the heat insulation plate is arranged between the mounting plate and the heat conducting plate, the heat insulation plate is formed with a placement hole which passes through from top to bottom, and the placement hole is used to place the semiconductor refrigeration plate; and / or, The temperature control device also includes a heat insulation cover, which is connected to the front end surface to form an installation cavity, and the installation cavity is used to adapt to the installation of the incubation clamp. The lower end surface of the heat insulation cover is provided with a second clearance hole, and the second clearance hole is used to accommodate the heat conduction plate.

4. The temperature control device according to claim 1, characterized in that: Thermally conductive silica gel is attached between the heat conducting plate and the semiconductor refrigeration sheet; and / or, Thermally conductive silica gel is attached between the heat transfer plate and the semiconductor refrigeration sheet.

5. The temperature control device according to claim 1, characterized in that: The heat conducting plate is made of aluminum alloy; and / or, The heat transfer plate is made of aluminum alloy.

6. The temperature control device according to claim 1, characterized in that: The incubation splint is open forwardly and is provided with a plurality of incubation cavities for accommodating a plurality of reagent cards.

7. The temperature control device according to claim 6, characterized in that: A partition block is formed between two adjacent incubation chambers, and a mounting hole is formed in each of the partition blocks and extends upward to the upper surface of the incubation clamping plate; The temperature control device further comprises a temperature regulating component, and the temperature regulating component comprises: A control circuit board, the control circuit board is arranged on the upper end surface of the mounting plate, the control circuit board is electrically connected to the semiconductor cooling plate; and A plurality of temperature sensors are respectively disposed in the plurality of mounting holes and electrically connected to the control circuit board.

8. A dry fluorescent immunoassay incubator, characterized in that: Comprising the temperature control device according to any one of claims 1 to 7.

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