Chip and heat sink assembly equipment

Abstract

The present application relates to an assembly device for chips and heat sinks, which includes a base, a feeding mechanism, a feeding mechanism and a combined mechanism. The feeding mechanism includes a feeding tube, a load plate and a first push cylinder for driving the load plate to move toward the feeding mechanism. The first push cylinder is mounted on the base, and the feeding tube and the load plate are slidably matched. The feeding mechanism includes a feeding tube and a rotating assembly for docking the feeding tube and the feeding tube, and the rotating assembly is located between the feeding tube and the feeding tube. The rotating assembly includes a rotating table, a fixed base and a telescopic cylinder for driving the rotating table to rotate. The fixed base and the telescopic cylinder are both mounted on the base, and the rotating table is located at the output end of the telescopic cylinder. The rotating table is rotatably connected to the fixed base. The combined mechanism includes a mechanical arm, a mounting plate, a pressing part and a pressing cylinder for driving the pressing part to move. The mechanical arm and the pressing cylinder are mounted on the base, and the pressing part and the mounting plate are slidably matched. The present application has a high degree of automation.

Description

Technical Field

[0001] The present application relates to the field of mechanical processing technology, and in particular to an assembly device for a chip and a heat sink. Background Art

[0002] Chips are widely used in semiconductors, automobiles, electronic equipment and other fields. Chips will emit heat when performing calculations. The long-term accumulation of heat will cause the temperature inside the chip to continue to rise. Under high temperature conditions for a long time, the chip is easily damaged. In the prior art, heat sinks are used to dissipate heat from chips. Heat sinks are devices that dissipate heat from heat-prone electronic components in electrical appliances. They are mostly made of aluminum alloy, brass or bronze, and their shapes can be set to various forms according to heat dissipation needs. Heat sinks are generally provided with terminals and threaded holes for mounting the heat sink on a circuit board.

[0003] In the relevant technical means, the chip and heat sink manufacturing process first processes the chip terminals according to the processing requirements, then processes the heat sink through other equipment, and then transfers the processed chip to the processed heat sink through a conveying mechanism for assembly, and then sends the assembled heat sink to the assembly equipment for pressing to fix the heat sink and the chip. After the installation is completed, the heat sink is sent to the tapping equipment to tap the pre-opened end teeth on the heat sink.

[0004] Regarding the above-mentioned related technical means, there is a defect that the traditional chip and heat sink process has a low degree of automation, resulting in low work efficiency. Summary of the invention

[0005] In order to improve the defect of low automation level in the chip and heat sink assembly process, which leads to low work efficiency, the present application provides a chip and heat sink assembly device.

[0006] The present application provides a chip and heat sink assembly device that adopts the following technical solution:

[0007] A chip and heat sink assembly device, comprising:

[0008] abutment;

[0009] A feeding mechanism, used for accommodating and conveying chips or heat sinks, comprising a feeding tube, a carrying plate, and a first pushing cylinder for driving the carrying plate to move toward the unloading mechanism, wherein the first pushing cylinder is mounted on the base, and the feeding tube is slidably matched with the carrying plate;

[0010] The material unloading mechanism comprises a material feeding pipe and a rotating assembly for connecting the material feeding pipe and the material placing pipe, wherein the rotating assembly is located between the material placing pipe and the material feeding pipe; the rotating assembly comprises a rotating table, a fixed base and a telescopic cylinder for driving the rotating table to rotate, wherein the fixed base and the telescopic cylinder are both mounted on the base, the rotating table is located at the output end of the telescopic cylinder, and the rotating table is rotatably connected to the fixed base;

[0011] The combined mechanism includes a mechanical arm for moving the chip onto the heat sink, a mounting plate for placing the heat sink, a pressing piece, and a pressing cylinder for driving the pressing piece to move. The mechanical arm and the pressing cylinder are installed on the base, and the pressing piece is slidably matched with the mounting plate.

[0012] By adopting the above technical solution, the chip or heat sink is located in the material placement tube, the first push cylinder drives the material placement tube to move to the rotating table, the telescopic cylinder drives the rotating table to rotate, thereby driving the material placement tube to rotate so that the material placement tube and the feeding tube are docked, and the chip or heat sink is unloaded and processed by entering the feeding tube from the material placement tube; the robot arm absorbs the chip and places it on the mounting plate and above the heat sink, and the pressing cylinder drives the pressing part to make the heat sink and the chip clamped to complete the assembly. Compared with the existing technology, the chip and the heat sink are unloaded at the same time, and the robot arm cooperates with various components to assemble the chip and the heat sink. The combined process improves the degree of automation, greatly saves the time required for the assembly line processing process, and thus improves work efficiency.

[0013] Optionally, the rotating assembly also includes a first clamping block for clamping the feeding tube, a second clamping block cooperating with the first clamping block, and a clamping cylinder driving the first clamping block to move, the clamping cylinder is installed on the base, the first clamping block is installed on the output end of the clamping cylinder, the second clamping block is fixedly connected to the rotating table, and the second clamping block is pressed against the feeding tube.

[0014] By adopting the above technical solution, the clamping cylinder drives the first clamping block to move toward the second clamping block, and the first clamping block and the second clamping block cooperate to clamp the material placing tube, so that the material placing tube rotates under the drive of the telescopic cylinder, thereby maintaining the stability of the material placing tube and improving the docking accuracy of the material placing tube and the feeding tube.

[0015] Optionally, the unloading mechanism also includes a protrusion and a first clamping cylinder that drives the protrusion to move toward the rotating table; the rotating table is provided with a material passing trough for passing chips or heat sinks; the material placing pipe has a material containing trough, the material passing trough is connected to the material containing trough, and the protrusion contacts and presses against the bottom of the material passing trough.

[0016] By adopting the above technical solution, the first clamping cylinder drives the protrusion to press against the bottom of the feeding trough, and the chip or heat sink rotates with the feeding tube, and enters the feeding trough through the material containing trough under the action of gravity. The protrusion limits the chip or heat sink from sliding down when rotating and tilting, thereby preventing the chip or heat sink from falling when the rotating table and the feeding tube are not connected. When unloading, the first clamping cylinder drives the protrusion to move away from the bottom of the feeding trough to a distance higher than the height of the chip, so that the chip can move smoothly from the feeding tube to the feeding tube, thereby improving the effective processing rate of the product during the processing.

[0017] Optionally, a bending mechanism is also included, which includes a pressure plate for pressing the chip, a stamping plate for processing the chip terminals, and a third pushing cylinder for driving the stamping plate to move toward or away from the pressure plate, the pressure plate is fixedly connected to the feed tube, the stamping plate is located at the output end of the third pushing cylinder, and the third pushing cylinder is installed on the feed tube; the feed tube has a to-be-processed area and a processing area, the processing area is provided with an avoidance hole, and the stamping plate is located in the avoidance hole.

[0018] By adopting the above technical solution, the chip moves from the waiting area of ​​the feeding tube to the processing area, the pressure plate presses the end face of the chip, and the third pushing cylinder drives the stamping plate to penetrate the avoidance hole and move toward the pressure plate, and the pressure plate and the stamping plate press against each other to complete the processing of the chip terminal; after the processing is completed, the third pushing cylinder drives the stamping plate to move toward the base, and the chip leaves the processing area, and at the same time, the chip in the waiting area enters the processing area for processing.

[0019] Optionally, the bending mechanism also includes a diversion component, which includes a pressure rod for positioning the second chip or heat sink in the processing area, a baffle plate for blocking the first chip or heat sink in the processing area, a second clamping cylinder for driving the pressure rod to move, and a third clamping cylinder for driving the baffle plate to move, the second clamping cylinder and the third clamping cylinder are both fixedly connected to the feed tube, the pressure rod and the baffle plate are both slidably cooperated with the feed tube, and the baffle plate blocks the feed tube.

[0020] By adopting the above technical scheme, the third clamping cylinder drives the baffle plate to move, and the baffle plate moves to the inner wall of the feeding tube and presses against the inner wall of the feeding tube to block the first chip in the processing area; the second clamping cylinder drives the pressing rod to make the pressing rod press against the second chip in the processing area, so that the chips or heat sinks in the processing area enter the processing area one by one in sequence, so that when a single chip is bent, the chips in the processing area are separated and will not affect the adjacent chips; at the same time, it avoids the adjacent chips from exerting force on the chips in the processing area when processing the chip terminals, thereby affecting the processing quality of the chip terminals.

[0021] Optionally, the bending mechanism also includes a first positioning plate, a second positioning plate, a fourth clamping cylinder and a fifth clamping cylinder, the first positioning plate is located at the output end of the fourth clamping cylinder, the second positioning plate is located at the output end of the fifth clamping cylinder, the first positioning plate and the second positioning plate are respectively located on both sides of the chip in the processing area, and the fourth clamping cylinder and the fifth clamping cylinder are both fixedly connected to the feed pipe.

[0022] By adopting the above technical solution, the fourth clamping cylinder drives the first positioning plate to move toward the direction of the processing area terminal, and the fifth clamping cylinder drives the second positioning plate to move toward the direction of the processing area terminal. The first positioning plate and the second positioning plate are respectively located on both sides of the chip, and the chip in the processing area is limited along the direction of material feeding, thereby reducing the displacement of the chip terminal due to stamping during the processing process, and further improving the processing quality of the chip terminal.

[0023] Optionally, the feeding mechanism also includes a feeding rack for stacking the feeding tubes, a pressing piece, and a second pushing cylinder for driving the supporting plate to move. The feeding rack and the second pushing cylinder are both installed on the base. The feeding rack has a waiting area and a loading area. The loading area is where the lowest feeding tube is located. The waiting area is located above the loading area, and the pressing piece presses against the feeding tube in the waiting area.

[0024] By adopting the above technical solution, the feeding rack can place multiple feeding pipes, the feeding pipes in the loading area are located on the supporting plate, the top pressure piece limits the feeding pipes in the waiting area to move toward the supporting plate, and the second driving cylinder pushes the supporting plate to move outside the feeding rack, while driving the feeding pipes on the supporting plate to move. On the one hand, it can enable the equipment to accommodate more materials and reduce the waste of loading time caused by loading; on the other hand, it enables the feeding pipe to complete the docking with the feeding pipe, providing avoidance space for the rotation of the feeding pipe.

[0025] Optionally, the rotating assembly further includes a first buffer and a connecting block for limiting the rotation angle of the rotating table, the first buffer and the connecting block are both mounted on the fixed base, and the first buffer is pressed against or away from the connecting block.

[0026] By adopting the above technical solution, in the process of the telescopic cylinder driving the material placing tube to rotate, the material placing tube rotates relative to the fixed base. When the material placing tube moves to dock with the material feeding tube, the first buffer member contacts and presses against the connecting member, thereby limiting the material placing tube from continuing to rotate, reducing the position deviation of the material placing tube and the material feeding tube when docking, and improving the correctness of the docking between the material placing tube and the material feeding tube; at the same time, the first buffer member slows down the movement inertia generated in the process of the material placing tube turning from rotation to stillness, thereby improving the stability of the material placing tube after rotation.

[0027] Optionally, the rotating assembly further includes a second buffer component, which is mounted on the fixed base, and the second buffer component faces the direction of the feeding tube and presses against or moves away from the feeding tube.

[0028] By adopting the above technical solution, after the material placing tube is docked with the material feeding tube and the material is unloaded, the telescopic cylinder drives the material placing tube to rotate to the supporting plate and contact the second buffer member, thereby slowing down the movement inertia generated by the material placing tube in the process of changing from rotation to stillness, improving the stability of the material placing tube after rotation, and at the same time reducing the impact between the material placing tube and the supporting plate, thereby increasing the service life of the parts.

[0029] Optionally, the unloading mechanism further includes a vibrating member for vibrating the material placing tube, the vibrating member is fixedly connected to the material feeding rack, and the vibrating member is located on the rotation track of the material placing tube.

[0030] By adopting the above technical solution, during the unloading process, the vibrator strikes the feeding tube, thereby reducing the situation where the chip or heat sink in the feeding tube cannot be unloaded due to excessive friction caused by jamming, so that the chip or heat sink in the feeding tube can be unloaded smoothly along the inclined direction, further improving the working efficiency of the equipment.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] 1. Compared with the prior art, the chip or heat sink is located in the material placement tube, the first push cylinder drives the material placement tube to move to the rotating table, the telescopic cylinder drives the rotating table to rotate, thereby driving the material placement tube to rotate so that the material placement tube and the feeding tube are docked, and the chip or heat sink enters the feeding tube from the material placement tube to complete the unloading and processing; the robot arm absorbs the chip and places it on the mounting plate and above the heat sink, and the pressing cylinder drives the pressing part to make the heat sink and the chip snap into place to complete the assembly. The combined process of this application improves the degree of automation, greatly saves the time required for the assembly line processing process, and thus improves work efficiency.

[0033] 2. The first clamping cylinder drives the protrusion to press against the bottom of the feeding trough. The chip or heat sink rotates with the feeding tube and enters the feeding trough through the material trough under the action of gravity. The protrusion limits the chip or heat sink from sliding down when it rotates and tilts, avoiding the chip or heat sink from falling when the rotary table and the feeding tube are not connected. When unloading, the first clamping cylinder drives the protrusion to move away from the bottom of the feeding trough to a distance higher than the height of the chip, so that the chip can move smoothly from the feeding tube to the feeding tube, thereby improving the effective processing rate of the product during the processing.

[0034] 3. In the process of the telescopic cylinder driving the material placement tube to rotate, when the material placement tube moves to dock with the feeding tube, the first buffer member contacts and presses against the connecting member, thereby limiting the material placement tube from continuing to rotate, reducing the position deviation of the material placement tube and the feeding tube when docking, and improving the correctness of the docking between the material placement tube and the feeding tube; after the material placement tube completes the docking with the feeding tube and unloads the material, the telescopic cylinder drives the material placement tube to rotate to the supporting plate and contact the second buffer member, reducing the impact between the material placement tube and the supporting plate, and improving the service life of the parts.

[0035] 4. The third clamping cylinder drives the baffle plate to move, and the baffle plate moves to the inner wall of the feeding tube and presses against the inner wall of the feeding tube to block the first chip in the processing area; the second clamping cylinder drives the pressing rod to press against the second chip in the processing area, so that the chips or heat sinks in the processing area enter the processing area one by one in sequence, so that when a single chip is bent, it will not affect the adjacent chips; at the same time, it avoids the adjacent chips from exerting force on the chips in the processing area when processing the chip terminals, thereby affecting the processing quality of the chip terminals.

[0036] 5. The feeding rack can hold multiple feeding pipes. The top pressure piece presses against the feeding pipes in the waiting area, and the feeding pipes in the loading area are located on the carrying plate. The second driving cylinder pushes the carrying plate to move outside the feeding rack, and at the same time drives the feeding pipes on the carrying plate to move. On the one hand, it can enable the equipment to accommodate more materials and reduce the waste of loading time caused by loading; on the other hand, it enables the feeding pipe to complete the docking with the feeding pipe, providing avoidance space for the rotation of the feeding pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of a chip and heat sink assembly device according to an embodiment of the present application;

[0038] Figure 2 is a schematic diagram highlighting the internal structure of an embodiment of the present application;

[0039] Figure 3 is a structural schematic diagram highlighting the feeding mechanism in an embodiment of the present application;

[0040] Figure 4 This is a structural schematic diagram of the embodiment of the present application highlighting the unloading mechanism;

[0041] Figure 5 is a structural schematic diagram highlighting the rotating assembly in an embodiment of the present application;

[0042] Figure 6 is a structural schematic diagram highlighting the bending mechanism in an embodiment of the present application;

[0043] Figure 7 is a cross-sectional view highlighting the bending mechanism of an embodiment of the present application;

[0044] Figure 8 It is a structural schematic diagram highlighting the combination mechanism of an embodiment of the present application.

[0045] Fig. 9 is a cross-sectional view highlighting the combined mechanism of an embodiment of the present application;

[0046] Description of reference numerals:

[0047] 1. Base; 11. First step; 12. Second step; 2. Feeding mechanism; 21. Feeding rack; 211. Waiting area; 212. Loading area; 22. Material placement pipe; 221. Material storage tank; 23. Pressing member; 231. Pressing column; 232. First connecting plate; 24. Loading plate; 241. Loading tank; 242. Clamping slot; 243. First guiding inclined plane; 25. Positioning member; 251. Positioning vertical plate; 252. Lifting cylinder; 26. First pushing cylinder; 27. Second pushing cylinder; 28. Collection basket; 281, inclined plate; 282, second guide inclined plane; 29, push plate; 3, unloading mechanism; 31, feeding pipe; 311, processing area; 3111, avoidance hole; 312, waiting area for processing; 313, feeding trough; 314, second avoidance trough; 315, third avoidance trough; 316, fourth avoidance trough; 317, fifth avoidance trough; 32, rotating assembly; 321, rotating table; 3211, feeding trough; 322, fixed base; 323, telescopic cylinder; 3231, rotating base; 3232, driving rod; 324, first a clamping block; 325, a second clamping block; 326, a clamping cylinder; 327, a first buffer; 328, a connecting block; 329, a second buffer; 33, a first pressing cylinder; 34, a protrusion; 35, a vibrating member; 351, a vibrating block; 352, a vibrating cylinder; 4, a bending mechanism; 41, a pressing plate; 42, a stamping plate; 43, a second connecting plate; 431, a receiving groove; 432, a first spring; 44, a locking block; 441, a first avoidance groove; 45, a third pushing cylinder; 46, a first positioning plate; 47, a second Positioning plate; 48, fourth clamping cylinder; 49, fifth clamping cylinder; 410, diverter assembly; 4101, pressure rod; 4102, baffle plate; 4103, second clamping cylinder; 4104, third clamping cylinder; 5, combined mechanism; 51, mechanical arm; 52, mounting plate; 521, sixth avoidance groove; 522, lifting plate; 523, second spring; 524, lifting groove; 53, pressing piece; 54, pressing cylinder; 55, mounting frame; 56, cover plate; 561, first limiting groove; 562, second limiting groove. DETAILED DESCRIPTION

[0048] The following is combined with Figure 1-9 This application is described in further detail.

[0049] The embodiment of the present application discloses a chip and heat sink assembly device.

[0050] Reference Figure 1 The chip and heat sink assembly equipment includes a base 1 for providing an installation base, a feeding mechanism 2 for accommodating and conveying chips or heat sinks, a feeding mechanism 3 for unloading chips or heat sinks, a bending mechanism 4 for processing chip terminals, and a combination mechanism 5 for assembling chips and heat sinks; the feeding mechanism 2, the unloading mechanism 3, and the combination mechanism 5 are all installed on the base 1, and the bending mechanism 4 is installed on the unloading mechanism 3. In this embodiment, the feeding mechanism 2 and the unloading mechanism 3 are both set in two groups; the left group of feeding mechanisms 2 and unloading mechanisms 3 are used for loading and unloading heat sinks, and the right group of feeding mechanisms 2 and unloading mechanisms 3 are used for loading and unloading chips. The heat sink is transported from the left feeding mechanism 2 to the unloading mechanism 3, and moves from the unloading mechanism 3 to the combination mechanism 5; the chip is transported from the right feeding mechanism 2 to the unloading mechanism 3, and is bent by the bending mechanism 4 and transferred to the combination mechanism 5 to complete assembly. Since the chip and the heat sink are both in block shape, for the sake of clarity, one set of the feeding mechanism 2 and the unloading mechanism 3 is taken as an example for explanation.

[0051] Reference Figure 2 The base 1 is generally in the shape of a rectangular parallelepiped. In this embodiment, the base 1 has a first step portion 11 and a second step portion 12, and the height of the first step portion 11 from the ground is higher than the height of the second step portion 12 from the ground.

[0052] Reference Figure 2 and Figure 3 The feeding mechanism 2 includes a material placement tube 22, a feeding rack 21, a top pressure piece 23, a supporting plate 24, a limiting piece 25, a collecting basket 28, a first pushing cylinder 26 and a second pushing cylinder 27; the feeding rack 21, the limiting piece 25, the collecting basket 28 and the first pushing cylinder 26 are all installed on the first step portion 11 of the base 1.

[0053] The material placing tube 22 is generally in the shape of a long rectangular parallelepiped, and has a material containing groove 221 for accommodating chips or heat sinks. In this embodiment, there are multiple material placing tubes 22, and the multiple material placing tubes 22 are stacked and placed on the feeding rack 21 along the vertical direction, and the lowest material placing tube 22 is pressed against the upper surface of the carrying plate 24.

[0054] The feeding rack 21 has a material waiting area 211 and a material loading area 212 . The position where the lowest material placing tube 22 is located is the material loading area 212 , and the material waiting area 211 is located above the material loading area 212 .

[0055] The bearing plate 24 is installed at the output end of the second pushing cylinder 27 . The bearing plate 24 is slidably matched with the feeding rack 21 . The second pushing cylinder 27 and the pressing member 23 are both installed on the feeding rack 21 .

[0056] In order to further improve the accuracy of the pushing cylinder in pushing the material placing tube 22, in the present embodiment, a push plate 29 is arranged between the first pushing cylinder 26 and the material placing tube 22, and the push plate 29 is located at the output end of the first pushing cylinder 26. The first pushing cylinder 26 pushes the material placing tube 22 to move toward or away from the unloading mechanism 3 through the push block.

[0057] Reference Figure 3 , the pressing piece 23 is used to limit the movement of the feeding tube 22 in the waiting area 211, and the pressing piece 23 is located on the left side of the feeding rack 21. The pressing piece 23 includes a pressing column and a first connecting plate 232, and the first connecting plate 232 has a group of connecting parts perpendicular to the feeding rack 21 and a mounting part parallel to the length direction of the feeding rack 21, one end of the connecting part is fixedly connected to the mounting part, and the other end is fixedly connected to the feeding rack 21. The pressing column is detachably connected to the mounting part, and the end of the pressing column away from the mounting part contacts and presses the side wall of the feeding tube 22 located in the waiting area 211. In the present embodiment, four pressing columns are provided. The pressing column 23 limits the feeding tube 22 pressed against the upper surface of the supporting plate 24, and limits the feeding tube 22 in the loading area from sliding in the direction of the collecting basket 28.

[0058] Reference Figure 2 and Figure 3 The carrying plate 24 is located in the loading area 212, and the carrying plate 24 is provided with a carrying groove 241 for carrying the material placing tube 22. The second pushing cylinder 27 drives the carrying plate 24 to move toward or away from the limiting member 25. In this embodiment, the opening of the carrying groove 241 faces away from the ground and the collecting basket 28. A clamping groove 242 is provided on one side of the carrying plate 24 facing the limiting vertical plate 251, and the top pressing vertical plate passes through the clamping groove 242 to contact and press the carrying plate 24.

[0059] Reference Figure 2 The limiting member 25 and the first push cylinder 26 are located on the same side of the feeding rack 21. The limiting member 25 is used to limit the movement of the material placing tube 22 located on the supporting plate 24 in the direction away from the material placing rack 21. The limiting member 25 includes a limiting vertical plate 251 and a lifting cylinder 252. The limiting vertical plate 251 is located at the output end of the lifting cylinder 252. The lifting cylinder 252 drives the limiting vertical plate 251 to move. The end surface of the limiting vertical plate 251 toward the supporting plate 24 and the end surface of the material placing tube 22 toward the limiting column are pressed against or away from each other. In this embodiment, the limiting member 25 is provided in two groups.

[0060] The collecting basket 28 is located on the side of the limiting member 25 away from the feeding rack 21. The collecting basket 28 is provided with an inclined plate 281, and the inclined plate 281 has a second guiding inclined surface 282. The supporting plate 24 is provided with a first guiding inclined surface 243. The plane where the center of gravity of the feeding tube 22 is located intersects with the first guiding inclined surface 243. The height of the end of the first guiding inclined surface 243 close to the collecting basket 28 from the ground gradually decreases along the direction of the collecting basket 28; the first guiding inclined surface 243 and the second guiding inclined surface 282 are located on the same plane.

[0061] The lifting cylinder 252 drives the limiting plate 251 to move toward the direction close to the base 1, and the limiting plate 251 gradually moves away from the side of the feeding tube 22 in the loading area 212. The feeding tube 22 lacks the blocking of the limiting plate 251 on the side wall of the feeding tube 22, so that the center of gravity of the feeding tube 22 is shifted, and the feeding tube 22 slides along the first guide slope 243 toward the second guide slope 282, thereby entering the collection basket 28 to complete the collection of the feeding tube 22.

[0062] Reference Figure 4 The unloading mechanism 3 includes a feeding tube 31 for unloading, a rotating assembly 32 for connecting the feeding tube 31 and the placing tube 22, a protrusion 34 for limiting the movement of the chip or heat sink, a first clamping cylinder 33 for driving the protrusion 34 to move, and a vibrating member 35 for vibrating the placing tube 22.

[0063] The feeding tube 31 is generally in the shape of a long rectangular parallelepiped, and is provided with a feeding trough 313 for feeding chips or heat sinks. One end of the feeding tube 31 is mounted on the rotating assembly 32, and the other end is mounted on the second step portion 12 of the base 1. In this embodiment, the feeding tube 31 has a processing area 311 and a waiting area 312, the waiting area 312 is located at the end of the feeding tube 31 close to the feeding mechanism 2, and the processing area 311 is located at the end of the feeding tube 31 far from the feeding mechanism 2.

[0064] Reference Figure 4 and Figure 5 The rotating assembly 32 is installed on the first step portion 11 of the base 1, and the rotating assembly 32 is located between the material placement tube 22 and the material feeding tube 31. The rotating assembly 32 includes a rotating table 321, a fixed base 322, and a telescopic cylinder 323 for driving the rotating table 321 to rotate. The fixed base 322 and the telescopic cylinder 323 are both fixedly connected to the base 1. The rotating table 321 is located at the output end of the telescopic cylinder 323, and the rotating table 321 is rotatably connected to the fixed base 322. In this embodiment, the telescopic cylinder 323 has a rotating base 3231 and a telescopic rod hinged to the rotating base 3231, and the telescopic rod is hinged to the rotating table 321.

[0065] The rotating platform 321 is generally in the shape of a rectangular parallelepiped, and the end of the rotating platform 321 that is closest to the feeding rack 21 contacts and presses against one end of the material placement tube 22 located in the loading area 212. The rotating platform 321 is provided with a material feeding trough 3211 for feeding chips or heat sinks, and the material feeding trough 3211 is arranged along the length direction of the material placement tube 22. The material feeding trough 3211, the material storage trough 221 and the material feeding trough 313 are connected, and the material placement tube 22 is connected to the material feeding tube 31 through the material feeding trough 3211.

[0066] In order to maintain the rotation stability of the material placement tube 22 and improve the docking accuracy of the material placement tube 22 and the material feeding tube 31. The rotating assembly 32 also includes a first clamping block 324 for clamping the material placement tube 22, a second clamping block 325 cooperating with the first clamping block 324, and a clamping cylinder 326 for driving the first clamping block 324 to move toward the second clamping block 325; the clamping cylinder 326 is installed on the base 1, the first clamping block 324 is installed at the output end of the clamping cylinder 326, and the second clamping block 325 is fixedly connected to the rotating table 321. In this embodiment, the second clamping block 325 and the rotating table 321 are both located at the output end of the telescopic cylinder 323. The clamping cylinder 326 drives the first clamping block 324 to move toward the second clamping block 325. The first clamping block 324 and the second clamping block 325 cooperate to clamp the material placing tube 22. The telescopic cylinder 323 drives the second clamping block 325 and the rotating table 321 to drive the material placing tube 22 to rotate, so that the material placing tube 22 and the feeding tube 31 are accurately docked.

[0067] In order to slow down the movement inertia of the feeding tube 22 in the process of changing from rotation to stillness and ensure the accuracy of the rotation position of the feeding tube 22, the rotating assembly 32 is also provided with a first buffer 327 for limiting the rotation angle of the feeding tube 22 toward the feeding tube 31, a connecting block 328 cooperating with the first buffer 327 and a second buffer 329 for limiting the return angle of the feeding tube 22; the first buffer 327 and the second buffer 329 are both installed on the fixed base 322, and the connecting block 328 is fixedly connected to the rotating table 321.

[0068] The first buffer 327 faces the direction of the connecting block 328, and the first buffer 327 is located on the rotation track of the connecting block 328 and is pressed against or away from the connecting block 328; the second buffer 329 faces the direction of the material tube 22 and is located on the rotation track of the material tube 22. The telescopic cylinder 323 drives the rotating table 321 to rotate, and the rotating table 321 drives the material tube 22 to rotate toward the feeding tube 31 until the material tube 22 and the feeding tube 31 are docked, and the first buffer 327 contacts and presses against the connecting member, and the first buffer 327 restricts the material tube 22 from continuing to rotate, so that the material tube 22 is accurately docked with the feeding tube 31 through the rotating table 321; after the chips and heat sinks in the material tube 22 are unloaded, the telescopic cylinder 323 drives the rotating table 321 and the second clamping block 325 to rotate, so that the rotating table 321 drives the material tube 22 to rotate until it contacts and presses against the second buffer 329, reducing the collision between the material tube 22 and the supporting plate 24.

[0069] The first pressing cylinder 33 is installed on the rotating table 321, and the protrusion 34 is located at the output end of the first pressing cylinder 33. The first pressing cylinder 33 drives the protrusion 34 to move toward the direction of the feeding groove 3211. In this embodiment, the protrusion 34 is arranged in a "T" shape, and the first pressing cylinder 33 drives the protrusion 34 to contact and press against the bottom of the feeding groove 3211. The chip or heat sink rotates together with the feeding tube 22, and the end of the feeding tube 22 away from the rotating table 321 gradually moves away from the carrier plate 24. The protrusion 34 limits the movement trend of the chip or heat sink, thereby controlling the chip or heat sink to move from the feeding groove 221 to the feeding groove 3211.

[0070] The vibrating member 35 is installed on the feeding rack 21, and the vibrating member 35 includes a vibrating block 351 and a vibrating cylinder 352 for driving the vibrating block 351 to move. In this embodiment, in order to facilitate the adjustment of the position of the vibrating member 35, the feeding rack 21 is provided with a mounting plate 52, and the mounting plate 52 is detachably connected to the feeding rack 21 by bolts; the vibrating cylinder 352 is fixedly connected to the mounting plate 52, and the vibrating block 351 is fixedly connected to the output end of the vibrating cylinder 352, and the vibrating block 351 is located on the rotation track of the feeding tube 22 and the inclination direction of the vibrating block 351 is consistent with the inclination direction of the feeding tube 31. After the feeding tube 22 rotates to dock with the feeding tube 31, during the unloading process, if the chip or heat sink in the feeding tube 22 is blocked due to excessive friction or stuck, the vibrating cylinder 352 drives the vibrating block 351 to knock the feeding tube 22, so that the chip or heat sink in the feeding tube 22 can be unloaded smoothly along the inclination direction.

[0071] Reference Figure 6 and Figure 7The bending mechanism 4 includes a pressure plate 41, a punching plate 42, a third pushing cylinder 45 for driving the punching plate 42 to move toward the pressure plate 41, a pressure rod 4101, a baffle plate 4102, a second clamping cylinder 4103 for driving the pressure rod 4101 to move, and a third clamping cylinder 4104 for driving the baffle plate 4102 to move; the third pushing cylinder 45, the second clamping cylinder 4103 and the third clamping cylinder 4104 are all installed on the feeding tube 31, the pressure plate 41, the punching plate 42 and the third pushing cylinder 45 are located in the processing area 311 of the feeding tube 31, and the pressure rod 4101, the baffle plate 4102, the second clamping cylinder 4103 and the third clamping cylinder 4104 are located in the to-be-processed area 312 of the feeding tube 31.

[0072] The pressing plate 41 is used to press the chip, and the pressing plate 41 is generally arranged in a rectangular block. In this embodiment, the pressing plate 41 has a mounting portion connected to the feeding tube 31 and a pressing portion in the shape of a matching stamping plate 42, the pressing portion contacts and presses the chip terminal, and the mounting portion is fixedly connected to the feeding tube 31.

[0073] The stamping plate 42 is used to cooperate with the pressing plate 41 to bend the chip terminal, and the stamping plate 42 is located at the output end of the third pushing cylinder 45; the processing area 311 of the feeding tube 31 is provided with an avoidance hole 3111, and the stamping plate 42 is located in the avoidance hole 3111 and slides with the feeding tube 31. In this embodiment, a second connecting plate 43 is provided between the third pushing cylinder 45 and the stamping plate 42, one end of the second connecting plate 43 is fixedly connected to the output end of the third pushing cylinder 45, and the other end of the second connecting plate 43 is fixedly connected to the stamping plate 42.

[0074] Furthermore, in order to improve the quality of chip terminal stamping. The bending mechanism 4 is also provided with a locking block 44 for positioning the chip terminal. The second connecting plate 43 is provided with a receiving groove 431, the locking block 44 is located in the receiving groove 431 and is slidably matched with the second connecting plate 43, and a first spring 432 is provided at the bottom of the receiving groove 431. One end of the locking block 44 contacts and presses against the first spring 432, and the other end of the locking block 44 contacts and presses against the terminal of the chip. In this embodiment, the locking block 44 is provided with a first avoidance groove 441 for avoiding the stamping plate 42, and the stamping plate 42 is penetrated with the first avoidance groove 441 and slides relative to the locking block 44.

[0075] The chip moves from the processing area 312 of the feeding tube 31 to the processing area 311, and the pressing part of the pressing plate 41 presses the end face of the chip. The third pushing cylinder 45 drives the second connecting plate 43 to move toward the feeding tube 31, and the second connecting plate 43 drives the locking block 44 and the stamping plate 42 to move together. The locking block 44 always keeps the chip terminal tightly pressed. Driven by the second connecting plate 43, the stamping plate 42 is simultaneously penetrated by the first avoidance groove 441 and the avoidance hole 3111 to move toward the chip terminal, and the stamping plate 42 and the pressing plate 41 cooperate with each other to complete the processing of the chip terminal; after the processing is completed, the third pushing cylinder 45 drives the stamping plate 42 and the locking block 44 to move toward the base 1, and the chip leaves the processing area 311, and the chip in the processing area 312 enters the processing area 311 for processing.

[0076] Reference Figure 6 In order to reduce the displacement of the chip terminals caused by stamping during the processing, the yield rate of chip terminal processing is improved. The bending mechanism 4 is also provided with a first positioning plate 46, a second positioning plate 47, a fourth clamping cylinder 48 and a fifth clamping cylinder 49. The first positioning plate 46 is located at the output end of the fourth clamping cylinder 48, the second positioning plate 47 is located at the output end of the fifth clamping cylinder 49, the fourth clamping cylinder 48 and the fifth clamping cylinder 49 are both fixedly connected to the feeding tube 31, and the first positioning plate 46 and the second positioning plate 47 are respectively located on both sides of the chip; the feeding tube 31 is provided with a second avoidance groove 314 for avoiding the first positioning plate 46 and a third avoidance groove 315 for avoiding the second positioning plate 47, and the second avoidance groove 314 and the third avoidance groove 315 are connected to the feeding groove 313. The fourth clamping cylinder 48 drives the first positioning plate 46 to move from the second avoidance groove 314 to the feeding groove 313 and press against the left side of the terminal of the processing area 311, and at the same time, the fifth clamping cylinder 49 drives the second positioning plate 47 to pass through the third avoidance groove to move to the feeding groove 313 and press against the right side of the terminal of the processing area 311, thereby limiting the chip in the processing area 311 along the feeding direction; after processing, the fourth clamping cylinder 48 drives the first positioning plate 46 to move from the feeding groove 313 to the second avoidance groove 314 away from the terminal of the processing area 311, and at the same time, the fifth clamping cylinder 49 drives the second positioning plate 47 to move from the feeding groove 313 to the third avoidance groove 315 and away from the right side of the terminal of the processing area 311, so that the chip in the processing area 311 enters the combination mechanism.

[0077] Furthermore, in order to allow the chips or heat sinks in the processing area 312 to enter the processing area 311 one by one in sequence, the bending mechanism 4 is also provided with a diverter assembly 410, which includes a pressure rod 4101, a baffle plate 4102, a second clamping cylinder 4103 driving the pressure rod 4101 to move, and a third clamping cylinder 4104 driving the baffle plate 4102 to move, the second clamping cylinder 4103 and the third clamping cylinder 4104 are both installed on the feeding tube 31, and the pressure rod 4101 and the baffle plate 4102 are both slidably matched with the feeding tube 31. In this embodiment, the second clamping cylinder 4103 and the third clamping cylinder 4104 are both located on one side of the feeding tube 31 and the driving directions of the second clamping cylinder 4103 and the third clamping cylinder 4104 are perpendicular to the feeding direction. The material feeding pipe 31 is provided with a fourth avoidance groove 316 for avoiding the pressing rod 4101 and a fifth avoidance groove 317 for avoiding the baffle plate 4102 . The fourth avoidance groove 316 and the fifth avoidance groove 317 are connected to the material feeding groove 313 .

[0078] The pressure rod 4101 is used to position the second chip or heat sink in the processing area 312, and the pressure rod 4101 is located at the output end of the second clamping cylinder 4103; the second clamping cylinder 4103 drives the pressure rod 4101 to move from the fourth avoidance groove 316 to the feed groove 313, and presses against the end of the second chip in the processing area 312 to limit the sliding of the second chip in the processing area 312.

[0079] The baffle plate 4102 is used to block the first chip or heat sink in the processing area 312. One end of the baffle plate 4102 is fixedly connected to the third clamping cylinder 4104, and the other end of the baffle plate 4102 is pressed against the inner wall of the feed tube 31. The third clamping cylinder 4104 drives the baffle plate 4102 to move, and the baffle plate 4102 moves from the fifth avoidance groove 317 to the feed groove 313 and is pressed against the inner wall of the feed groove 313 to block the first chip in the processing area 312.

[0080] Reference Figure 8 In other embodiments, the second pressing cylinder 4103 and the third pressing cylinder 4104 are both located above the feeding tube 31, and the projections of the end faces of the pressing rod 4101 and the baffle plate 4102 facing the feeding tube 31 are located in the feeding trough 313; the second pressing cylinder 4103 drives the pressing rod 4101 to move in the direction of the feeding trough 313, and presses against the upper end face of the second heat sink of the processing area 312. The third pressing cylinder 4104 drives the baffle plate 4102 to move in the direction of the feeding trough 313, and the baffle plate 4102 presses against the end face of the feeding trough 313 and the bottom of the feeding trough 313, thereby limiting the sliding of the first chip in the processing area 312.

[0081] Reference Figure 8 and Fig. 9The combined mechanism 5 includes a mechanical arm 51 for moving the chip onto the heat sink, a mounting plate 52, a pressing piece 53, a pressing cylinder 54 for driving the pressing piece 53 to move, a cover plate 56 and a mounting frame 55; the mechanical arm 51 and the mounting frame 55 are installed on the second step portion 12 of the base 1, and the mechanical arm 51 and the mounting frame 55 are respectively fixedly connected to the base 1, the pressing cylinder 54 is fixedly connected to the mounting frame 55, and the pressing piece 53 is located at the output end of the pressing cylinder 54.

[0082] The mounting plate 52 is used to place the heat sink, and the mounting plate 52 is fixedly connected to the mounting frame 55. In this embodiment, the mounting plate 52 is generally rectangular, and the length direction of the mounting plate 52 is perpendicular to the length direction of the feed tube. The mounting plate 52 contacts the end of the feed tube 31 away from the feed rack 21.

[0083] The pressing piece 53 is used to press the chip and the heat sink, and the pressing piece 53 and the mounting plate 52 are slidably matched. In this embodiment, the pressing piece 53 and the pressing cylinder 54 are set as two groups, and the two groups of pressing pieces 53 and pressing cylinders 54 correspond to each other and are located on both sides of the mounting plate 52 along the feeding direction. The mounting plate 52 is provided with two groups of sixth avoidance grooves 521 to avoid the movement of the two groups of pressing pieces 53. The two groups of pressing cylinders 54 drive the corresponding pressing pieces 53 to pass through the sixth avoidance grooves 521 and move toward the heat sink. The two groups of pressing pieces 53 cooperate with each other to press the heat sink, so that the heat sink is bent and connected with the chip, thereby completing the assembly.

[0084] The cover plate 56 is located on the upper end surface of the mounting plate 52 and is fixedly connected to the mounting plate 52. The cover plate 56 is provided with a first limiting groove 561 for preventing the material feeding tube 31 from moving and a second limiting groove 562 for accommodating and limiting the heat sink; the material feeding tube 31 contacts and presses the first limiting groove 561 toward the side wall of the material feeding tube 31, and the second limiting groove 562 is connected to the material feeding groove 313.

[0085] Furthermore, in order to reduce the buffering force of the mechanical arm 51 during the installation of the chip and the heat sink, the installation plate 52 is provided with a lifting plate 522 for lifting the heat sink, a second spring 523 for buffering, and a lifting slot 524 for accommodating the lifting plate 522 and the spring; the lifting plate 522 and the second spring 523 are located in the lifting slot 524, one end of the second spring 523 is fixedly connected to the bottom of the lifting slot 524, one end of the lifting plate 522 is fixedly connected to the end of the second spring 523 away from the bottom of the lifting slot 524, and the other end of the lifting plate 522 is in contact with the heat sink. The mechanical arm 51 absorbs the chip and places it on the heat sink, and applies force to press the chip and the heat sink tightly; the force applied by the mechanical arm 51 simultaneously drives the lifting plate 522 to compress the second spring 523 to move toward the direction of the mounting frame 55, and the spring reduces the impact force of the mechanical arm 51 on the installation plate 52; the pressing cylinder 54 drives the pressing part 53 to press the heat sink to complete the assembly of the chip and the heat sink.

[0086] The implementation principle of the chip and heat sink assembly equipment of the embodiment of the present application is as follows: the chip and the heat sink are respectively located in the placing tubes 22 at the feeding racks 21 on the left and right sides 271, and the placing tubes 22 in the loading area 212 are in contact with the carrying plate 24 and are located in the carrying groove 241, the clamping column 231 is pressed against the placing tubes 22 in the waiting area 211, the second pushing cylinder 27 drives the carrying plate 24 to move in the direction of the limiting vertical plate 251, and at the same time the lifting cylinder 252 drives the limiting vertical plate 251 to move in the direction away from the base 1 until it contacts and presses with the carrying plate 24; the first pushing cylinder 26 drives the push plate 29 to move, and the push plate 29 presses the placing tube 22 toward the rotating table 32 1, so that the containing groove 431 and the material passing groove 3211 are connected and communicated, one end of the material placing tube 22 is located on the second clamping block 325, and the clamping cylinder 326 drives the first clamping block 324 to move in the direction of the second clamping block 325, and the first clamping block 324 and the second clamping block 325 cooperate to clamp the material placing tube 22; the telescopic cylinder 323 drives the rotating table 321 to rotate, and the rotating table 321 drives the material placing tube 22 to rotate synchronously until the connecting block 328 and the second buffer 329 are pressed against each other, at this time, the material placing tube 22 is connected to the material feeding tube 31, and the chip or heat sink enters the material feeding groove 313 from the containing groove 221 through the groove 3211; the third pressing cylinder 4104 The baffle plate 4102 is driven to press against the side wall of the feeding trough 313 to intercept the first chip or heat sink in the processing area 312, the second pressing cylinder 4103 drives the pressing rod 4101 to press against the second chip or heat sink in the processing area 312, the third pressing cylinder 4104 drives the baffle plate 4102 to move away from the feeding trough 313, and the first chip or heat sink in the processing area 312 enters the processing area 311, the second pressing cylinder 4103 drives the pressing rod 4101 to move away from the feeding trough 313, and the second chip or heat sink in the processing area 312 presses against the baffle plate 4102, and the chips in the processing area 312 are sequentially cycled. The chip and the heat sink are diverted; the fourth clamping cylinder 48 drives the first positioning plate 46, the fifth clamping cylinder 49 drives the second positioning plate 47 to press against the left and right sides 271 of the chip entering the processing area 311 respectively, and the third pushing cylinder 45 drives the stamping plate 42 to move in the direction of the pressing plate 41, and the stamping plate 42 and the pressing plate 41 cooperate with each other to bend the terminals of the chip; the processed terminals are transported to the heat sink via the robot arm 51, and the robot arm 51 presses the chip and the heat sink, and the pressing cylinder 54 drives the pressing part 53 to move in the direction of the heat sink, and the two groups of pressing parts 53 cooperate with each other to press the heat sink, so that the heat sink is bent and snapped into the chip, thereby completing the assembly.

[0087] After the chips or heat sinks in the material storage tank 221 are unloaded, the telescopic cylinder 323 drives the rotating table 321 to rotate in the opposite direction, and the rotating table 321 drives the feeding tube 22 to rotate synchronously until the feeding tube 22 is pressed against the first buffer member 327. At this time, the feeding tube 22 is located on the supporting plate 24; the clamping cylinder 326 drives the first clamping block 324 to move in the direction away from the second clamping block 325, and the first clamping block 324 is separated from the second clamping block 325. At the same time, the lifting cylinder 252 drives the limiting vertical plate 251 to move in the direction of the base 1, and the limiting vertical plate 251 is away from the supporting plate 24; the feeding tube 22 moves along the first guide inclined surface 243 to the second guide inclined surface 282, enters the collecting basket 28, and completes the collection of the feeding tube 22.

[0088] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. The same parts are represented by the same figure marks. It should be noted that the words "left", "right", "upper" and "lower" used in the above description refer to the directions in the drawings, and the words "inner" and "outer" refer to the directions toward or away from the geometric center of a specific component, respectively. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A chip and heat sink assembly device, characterized in that: include, A base (1) is provided for providing an installation foundation, a feeding mechanism (2) for accommodating and conveying a chip or a heat sink, a material unloading mechanism (3) for unloading a chip or a heat sink, a bending mechanism (4) for processing a chip terminal, and a combined mechanism (5) for assembling a chip and a heat sink; the feeding mechanism (2), the material unloading mechanism (3), and the combined mechanism (5), and the bending mechanism (4) is installed on the material unloading mechanism (3); the feeding mechanism (2) and the material unloading mechanism (3) are both arranged in two groups; one group of the feeding mechanism (2) and the material unloading mechanism (3) is used for loading and unloading the heat sink, and the other group of the feeding mechanism (2) and the material unloading mechanism (3) is used for chip Loading and unloading; the heat sink is transported from the feeding mechanism (2) on one side to the unloading mechanism (3), and then moves from the unloading mechanism (3) to the assembly mechanism (5); the chip is transported from the feeding mechanism (2) on one side to the unloading mechanism (3), and then is bent by the bending mechanism (4) and then transferred to the assembly mechanism (5) for assembly; the feeding mechanism (2) comprises a placing tube (22), a carrying plate (24), and a first pushing cylinder (26) for driving the carrying plate (24) to move toward the unloading mechanism (3); the first pushing cylinder (26) is mounted on the base (1), and the placing tube (22) and the carrying plate (24) are slidably matched; The material unloading mechanism (3) comprises a material feeding pipe (31) arranged obliquely and a rotating assembly (32) for connecting the material feeding pipe (31) and the material placing pipe (22), wherein the rotating assembly (32) is located between the material placing pipe (22) and the material feeding pipe (31); the rotating assembly (32) comprises a rotating table (321), a fixed base (322) and a telescopic cylinder (323) for driving the rotating table (321) to rotate, wherein the fixed base (322) ) and the telescopic cylinder (323) are both mounted on the base (1); the rotating platform (321) is located at the output end of the telescopic cylinder (323); the rotating platform (321) is rotatably connected to the fixed base (322); the rotating platform (321) is provided with a material passing trough (3211) for feeding chips or heat sinks; the material placement pipe (22) has a material containing trough (221), and the material passing trough (3211) is connected to the material containing trough (221); The feeding pipe (31) is provided with a feeding trough (313) for unloading chips or heat sinks. The rotating platform (321) rotates under the driving action of the telescopic cylinder and drives the feeding pipe to rotate synchronously until it is docked with the feeding trough. The chips or heat sinks pass from the feeding trough (221) through the feeding trough (3211) and enter the feeding trough (313). The bending mechanism (4) comprises a pressing plate (41) for pressing the chip, a stamping plate (42) for processing the chip terminals, and a third pushing cylinder (45) for driving the stamping plate (42) to move toward or away from the pressing plate (41), and the pressing plate (41) is fixedly connected to the feeding tube (31); The combined mechanism (5) comprises a mechanical arm (51) for moving a chip onto a heat sink, a mounting plate (52) for placing the heat sink, a pressing piece (53) and a pressing cylinder (54) for driving the pressing piece (53) to move, wherein the mechanical arm (51) and the pressing cylinder (54) are mounted on the base (1), and the pressing piece (53) is slidably matched with the mounting plate (52).

2. The chip and heat sink assembly device according to claim 1, characterized in that: The rotating assembly (32) also includes a first clamping block (324) for clamping the material placing tube (22), a second clamping block (325) cooperating with the first clamping block (324), and a clamping cylinder (326) for driving the first clamping block (324) to move, wherein the clamping cylinder (326) is mounted on the base (1), the first clamping block (324) is mounted on the output end of the clamping cylinder (326), the second clamping block (325) is fixedly connected to the rotating table (321), and the second clamping block (325) is pressed against the material placing tube (22).

3. The chip and heat sink assembly device according to claim 1, characterized in that: The unloading mechanism (3) further comprises a protrusion (34) and a first pressing cylinder (33) for driving the protrusion (34) to move toward or away from the rotating platform (321); the protrusion (34) contacts and presses against the bottom of the material trough (3211).

4. The chip and heat sink assembly device according to claim 1, characterized in that: The punching plate (42) is located at the output end of the third pushing cylinder (45), and the third pushing cylinder (45) is installed on the feeding tube (31); the feeding tube (31) has a waiting area (312) and a processing area (311), and the processing area (311) is provided with an avoidance hole (3111), and the punching plate (42) is located in the avoidance hole (3111).

5. The chip and heat sink assembly device according to claim 4, characterized in that: The bending mechanism (4) further comprises a flow diversion component (410), the flow diversion component (410) comprising a pressure rod (4101) for positioning the second chip or heat sink in the processing area (312), a baffle plate (4102) for blocking the first chip or heat sink in the processing area (312), a second pressing cylinder (4103) for driving the pressure rod (4101) to move, and a third pressing cylinder (4104) for driving the baffle plate (4102) to move, the second pressing cylinder (4103) and the third pressing cylinder (4104) are both fixedly connected to the feeding tube (31), the pressure rod (4101) and the baffle plate (4102) are both slidably matched with the feeding tube (31), and the baffle plate (4102) blocks the feeding tube (31).

6. The chip and heat sink assembly equipment according to claim 4, characterized in that: The bending mechanism (4) also includes a first positioning plate (46), a second positioning plate (47), a fourth clamping cylinder (48) and a fifth clamping cylinder (49), wherein the first positioning plate (46) is located at the output end of the fourth clamping cylinder (48), the second positioning plate (47) is located at the output end of the fifth clamping cylinder (49), the first positioning plate (46) and the second positioning plate (47) are respectively located on both sides of the chip in the processing area (311), and the fourth clamping cylinder (48) and the fifth clamping cylinder (49) are both fixedly connected to the feeding tube (31).

7. The chip and heat sink assembly equipment according to claim 1, characterized in that: The feeding mechanism (2) further comprises a feeding rack (21) for stacking the material placement tubes (22), a pressing member (23) and a second pushing cylinder (27) for driving the support plate (24) to move. The feeding rack (21) and the second pushing cylinder (27) are both mounted on the base (1). The feeding rack (21) comprises a material waiting area (211) and a material loading area (212). The material loading area (212) is where the lowest material placement tube (22) is located. The material waiting area (211) is located above the material loading area (212). The pressing member (23) presses against the material placement tube (22) in the material waiting area (211).

8. The chip and heat sink assembly device according to claim 1, characterized in that: The rotating assembly (32) further comprises a first buffer member (327) and a connecting block (328) for limiting the rotation angle of the rotating platform (321); the first buffer member (327) and the connecting block (328) are both mounted on the fixed base (322); the first buffer member (327) and the connecting block (328) are pressed against or away from each other.

9. The chip and heat sink assembly device according to claim 1, characterized in that: The rotating assembly (32) further comprises a second buffer member (329), wherein the second buffer member (329) is mounted on the fixed base (322), and the second buffer member (329) faces the direction of the material placing tube (22) and presses against or moves away from the material placing tube (22).

10. The chip and heat sink assembly equipment according to claim 7, characterized in that: The unloading mechanism (3) further comprises a vibrating member (35) for vibrating the material placing tube (22); the vibrating member (35) is fixedly connected to the material supply rack (21); and the vibrating member (35) is located on the rotation track of the material placing tube (22).

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