Sensor packaging structure

Abstract

The present application discloses a sensor packaging structure, comprising a substrate, a sensing chip disposed on the substrate, a plurality of electrical connection components respectively connecting a plurality of welding pads of the substrate and a plurality of connection pads of the sensing chip, a supporting adhesive layer formed on the sensing chip, and a light-transmitting sheet disposed on the supporting adhesive layer. Any of the electrical connection components comprises a head solder, a wire, and a tail solder. The head solder is disposed on one of the connection pads, the first end of the wire extends from the head solder so that its second end is connected to one of the welding pads, and the tail solder is fixed to the second end and the corresponding welding pad. The head solder of any of the electrical connection components and the first bend of the wire adjacent thereto are buried in the supporting adhesive layer. Accordingly, the sensor packaging structure can not only be formed with a thinner thickness, but also have better reliability.

Description

Technical Field

[0001] The present application relates to a sensor packaging structure, and more particularly to a wire-bonding sensor packaging structure. Background Art

[0002] The conventional bonding methods of the sensor package structure include normal bond and reverse bond. The normal bond can only form the sensor package structure with a larger thickness, while the reverse bond can easily reduce the reliability of the sensor package structure.

[0003] Therefore, the applicant believes that the above defects can be improved, and has devoted himself to research and applied scientific principles to finally propose a sensor packaging structure that is reasonably designed and effectively improves the above defects. Summary of the invention

[0004] The embodiments of the present application provide a sensor packaging structure, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The present application discloses a sensor packaging structure, which includes: a substrate, including a chip fixing area and a plurality of welding pads located outside the chip fixing area; a sensing chip, which is arranged on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; a plurality of electrical connection components, which are respectively electrically connected between the plurality of connection pads and the plurality of welding pads, and any one of the electrical connection components includes: a head solder, which is arranged on the corresponding connection pad; a wire, whose first end extends from the head solder, so that the second end of the wire is connected to the corresponding welding pad, and the wire is formed with a first bending portion adjacent to the head solder; and a tail solder, which is fixed to the second end of the wire and the corresponding welding pad; a supporting glue layer, which is formed on the top surface of the sensing chip and surrounds the outside of the sensing area, and the head solder of any electrical connection component and the first bending portion of the wire are buried in the supporting glue layer; and a transparent sheet, which is arranged on the supporting glue layer, so that the transparent sheet, the supporting glue layer, and the top surface of the sensing chip are surrounded together to form a closed space.

[0006] Optionally, in any electrical connection assembly, a maximum distance is formed between the conductive wire at the first bending portion and the substrate.

[0007] Optionally, the first bending portion of any electrical connection component is spaced from the top surface of the sensing chip by a distance ranging from 50 μm to 100 μm.

[0008] Optionally, in any electrical connection assembly, the conductive wire includes a second bending portion, and the second bending portion is located between the first bending portion and the second end.

[0009] Optionally, in any electrical connection component, the conductive wire has a lateral segment located between the first bending portion and the second bending portion, and the lateral segment and the top surface of the sensing chip form an angle of no more than 15 degrees.

[0010] Optionally, the sensor package structure further includes a package body formed on the substrate, and the sensor chip, the tail solder of any electrical connection component, the wire portion outside the supporting glue layer, the supporting glue layer, and part of the transparent sheet are all buried in the package body.

[0011] The present application also discloses a sensor packaging structure, which includes: a substrate, including a chip fixing area and a plurality of welding pads located outside the chip fixing area; a sensing chip, which is arranged on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; a plurality of electrical connection components, which are respectively electrically connected between the plurality of connection pads and the plurality of welding pads, and any of the electrical connection components includes: a head solder, which is arranged on the corresponding connection pad; a wire, whose first end extends from the head solder, so that the second end of the wire is connected to the corresponding welding pad; and a tail solder, which is fixed to the second end of the wire and the corresponding welding pad; a supporting glue layer, which is formed on the top surface of the sensing chip and surrounds the outside of the sensing area, and the head solder of any electrical connection component and the part of the wire are all buried in the supporting glue layer; wherein, the part of any wire buried in the supporting glue layer has a highest point, and a maximum distance is formed between it and the substrate; and a transparent sheet, which is arranged on the supporting glue layer, so that the transparent sheet, the supporting glue layer, and the top surface of the sensing chip are surrounded together to form a closed space.

[0012] Optionally, the highest point of any electrical connection component is spaced from the top surface of the sensing chip by a distance ranging from 50 μm to 100 μm.

[0013] The present application also discloses a sensor packaging structure, which includes: a substrate, including a chip fixing area and a plurality of welding pads located outside the chip fixing area; a sensing chip, which is arranged on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; a plurality of electrical connection components, which are respectively electrically connected between the plurality of connection pads and the plurality of welding pads, and any of the electrical connection components includes: a head end solder, which is arranged on the corresponding connection pad; a wire, whose first end extends from the head end solder so that the second end of the wire is connected to the The lead wire is connected to the corresponding welding pad, and has a first bending portion adjacent to the head end solder and a second bending portion between the first bending portion and the second end; and a tail end solder is fixed to the second end of the lead wire and the corresponding welding pad; a supporting glue layer is formed on the top surface of the sensing chip and surrounds the outside of the sensing area, and the head end solder and part of the lead wire of any electrical connection component are buried in the supporting glue layer; and a transparent sheet is arranged on the supporting glue layer, so that the transparent sheet, the supporting glue layer, and the top surface of the sensing chip are surrounded together to form a closed space.

[0014] Optionally, in any electrical connection component, the conductive wire has a lateral segment located between the first bending portion and the second bending portion, and the lateral segment and the top surface of the sensing chip form an angle of no more than 15 degrees.

[0015] In summary, the sensor packaging structure disclosed in the embodiments of the present application, through the structural design of any one of the electrical connection components (such as: the head end solder of any one of the electrical connection components and the first bend portion of the wire are both buried in the supporting adhesive layer; or, the part of any one of the wires buried in the supporting adhesive layer has the highest point that forms the maximum distance with the substrate; or, any one of the wires forms the first bend portion adjacent to the head end solder and the second bend portion located between the first bend portion and the second end), so that the sensor packaging structure can not only be formed with a thinner thickness but also have better reliability.

[0016] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, such description and drawings are only used to illustrate the present application and are not intended to limit the scope of protection of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 1 is a schematic top view of a sensor packaging structure according to an embodiment of the present application.

[0018] Figure 2 for Figure 1 Schematic cross-sectional view along section line II-II.

[0019] Figure 3for Figure 2 An enlarged schematic diagram of site III in FIG.

[0020] Figure 4 for Figure 2 An enlarged schematic diagram of site IV in FIG. DETAILED DESCRIPTION

[0021] The following is an explanation of the implementation methods of the "sensor packaging structure" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. In addition, it is stated in advance that the drawings of this application are only simple schematic illustrations and are not depicted according to actual sizes. The following implementation methods will further explain the relevant technical contents of this application in detail, but the disclosed contents are not intended to limit the scope of protection of this application.

[0022] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0023] See also Figures 1 to 4 , which is an embodiment of the present application. This embodiment discloses a sensor packaging structure 100, which includes a substrate 1, a sensor chip 2 disposed on the substrate 1, a plurality of electrical connection components 3 electrically connecting the substrate 1 and the sensor chip 2, a supporting adhesive layer 4 formed on the sensor chip 2, a light-transmitting sheet 5 disposed on the supporting adhesive layer 4, and a packaging body 6 formed on the substrate 1.

[0024] Although the sensor package structure 100 is described as including the above components in this embodiment, the sensor package structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in this application, the sensor package structure 100 can also omit the package body 6.

[0025] The substrate 1 is rectangular in this embodiment, but the present application is not limited thereto. The substrate 1 has a first board surface 11 and a second board surface 12 located on opposite sides, and the substrate 1 includes a chip fixing area 111 and a plurality of welding pads 112 located outside the chip fixing area 111. In this embodiment, the chip fixing area 111 is approximately located at the center of the first board surface 11, and the plurality of welding pads 112 are located on the first board surface 11 and arranged in a ring shape, but the present application is not limited thereto.

[0026] In addition, the substrate 1 may also be provided with a plurality of solder balls (not shown in the figure) on the second board surface 12, and the sensor packaging structure 100 can be soldered and fixed on an electronic component (not shown in the figure) through the plurality of solder balls, so that the sensor packaging structure 100 can be installed and electrically connected to the electronic component.

[0027] The sensing chip 2 is described as an image sensing chip in this embodiment, but the invention is not limited thereto. The sensing chip 2 is disposed on the chip fixing area 111 of the substrate 1. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 22 and a plurality of connection pads 23 located outside the sensing area 22, and the positions of the plurality of connection pads 23 preferably correspond to the positions of the plurality of welding pads 112. In this embodiment, the plurality of connection pads 23 are arranged in a substantially annular shape to surround the sensing area 22, but the invention is not limited thereto.

[0028] For example, in other embodiments not shown in the present application, the plurality of connection pads 23 may be arranged in two rows and distributed on opposite sides of the sensing area 22, the plurality of welding pads 112 may also be arranged in two rows and distributed on opposite sides of the chip fixing area 111, and the positions of the plurality of connection pads 23 correspond to the positions of the plurality of welding pads 112 respectively.

[0029] The plurality of electrical connection components 3 are respectively electrically connected between the plurality of connection pads 23 of the sensing chip 2 and the plurality of welding pads 112 of the substrate 1; that is, one electrical connection component 3 is correspondingly connected between one connection pad 23 and one welding pad 112. Since the structures of the plurality of electrical connection components 3 in this embodiment are substantially the same, for the convenience of describing this embodiment, only the structure of a single electrical connection component 3 is described below, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the structures of the plurality of electrical connection components 3 may be slightly different.

[0030] In this embodiment, the electrical connection component 3 includes a head solder 31, a wire 32, and a tail solder 33. The head solder 31 is disposed on the corresponding connection pad 23. The wire 32 has a first end 321 and a second end 322 located at two opposite ends, and the first end 321 extends from the head solder 31 so that the second end 322 is connected to the corresponding welding pad 112. The tail solder 33 is fixed to the second end 322 of the wire 32 and the corresponding welding pad 112.

[0031] In more detail, the conductive wire 32 in this embodiment is formed with a first bending portion 323 adjacent to the head solder 31, and a second bending portion 324 located between the first bending portion 323 and the second end 322. The conductive wire 32 forms a maximum distance Dmax between the position of the first bending portion 323 (e.g., the vertex of the first bending portion 323) and the substrate 1 (the first board surface 11); that is, the distances between other positions of the conductive wire 32 and the substrate 1 (the first board surface 11) are all less than the maximum distance Dmax. It should be additionally noted that the thickness of the sensing chip 2 can be adjusted according to design requirements, but the first bending portion 323 (the vertex) and the top surface 21 of the sensing chip 2 are preferably separated by a distance D321 between 50 micrometers (μm) and 100 micrometers.

[0032] In addition, the conductive wire 32 may further have a third bent portion 325 between the second bent portion 324 and the second end 322, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the conductive wire 32 may also have at least one fourth bent portion between the third bent portion 325 and the second end 322.

[0033] From another perspective, the conductive wire 32 includes a pulling section 326 between the first end 321 and the first bending portion 323, a lateral section 327 between the first bending portion 323 and the second bending portion 324, and a lower pull-down section 328 between the second bending portion 324 and the second end 322. The lateral section 327 formed by the first bending portion 323 and the second bending portion 324 forms an angle α of no more than 15 degrees with the top surface 21 of the sensing chip 2, thereby effectively reducing the maximum distance Dmax, thereby reducing the possibility of the conductive wire 32 touching the light-transmitting sheet 5.

[0034] It should be further explained that the electrical connection component 3 in this embodiment is described as having the above-mentioned structure and conditions, but the specific structure and conditions of the electrical connection component 3 can also be adjusted and changed according to design requirements, and are not limited to the present embodiment. For example, in other embodiments not shown in this application, the maximum distance Dmax can be between the position of the wire 32 at the second bending portion 324 and the substrate 1 (the first board surface 11); or, the wire 32 can not have the third bending portion 325; or, the wire 32 can also not have the second bending portion 324, the third bending portion 325, and the lateral section 327.

[0035] In addition, although the second bending portion 324 of the electrical connection component 3 is adjacent to the head solder 31 in the diagram of this embodiment, the specific position of the second bending portion 324 can be adjusted and changed according to design requirements and is not limited thereto. For example, in other embodiments not shown in this application, the wire 32 may not have the third bending portion 325, and the second bending portion 324 is located at the approximate center of the wire 32, so that the pull-down section 328 extends from the second bending portion 324 toward the corresponding solder pad 112, and effectively lengthens the length of the lateral section 327.

[0036] The supporting glue layer 4 is formed on the top surface 21 of the sensing chip 2 and surrounds the outside of the sensing area 22, and the supporting glue layer 4 is annular in this embodiment and its outer edge does not protrude from the top surface 21 of the sensing chip 2. The head solder 31 of any one of the electrical connection components 3 and a part of the wire 32 are buried in the supporting glue layer 4, and the part of any one of the wires 32 buried in the supporting glue layer 4 has a highest point that forms the maximum distance Dmax with the substrate 1. In other words, the highest point is separated from the top surface 21 of the sensing chip 2 by a distance between 50 microns and 100 microns.

[0037] Further, in any of the wires 32 of this embodiment, the highest point is located at the first bending portion 323 (e.g., the top of the first bending portion 323), and it is buried in the supporting rubber layer 4, while the second bending portion 324 is located outside the supporting rubber layer 4 (that is, the part of any of the wires 32 buried in the supporting rubber layer 4 includes the first end 321, the pulling section 326, the first bending portion 323, and at least part of the lateral section 327), but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the second bending portion 324 of any of the wires 32 can also be buried in the supporting rubber layer 4 and form the highest point.

[0038] Accordingly, the sensor packaging structure 100 in this embodiment can be designed by the structure of any one of the electrical connection components 3 (such as: the head end solder 31 of any one of the electrical connection components 3 and the first bending portion 323 of the conductive wire 32 are both buried in the supporting adhesive layer 4; or, the part of any one of the conductive wires 32 buried in the supporting adhesive layer 4 has the highest point that forms the maximum distance Dmax with the substrate 1; or, any one of the conductive wires 32 is formed with the first bending portion 323 adjacent to the head end solder 31 and the second bending portion 324 located between the first bending portion 323 and the second end 322), so that the sensor packaging structure 100 can not only be formed with a thinner thickness but also have better reliability.

[0039] The light-transmitting sheet 5 is illustrated as a transparent flat glass in this embodiment, but the present application is not limited thereto. The light-transmitting sheet 5, the supporting adhesive layer 4, and the top surface 21 of the sensing chip 2 together surround a closed space S; that is, the supporting adhesive layer 4 is sandwiched between the light-transmitting sheet 5 and the top surface 21 of the sensing chip 2, and the sensing area 22 is located in the closed space S and faces the light-transmitting sheet 5.

[0040] The package body 6 is arranged on the first board surface 11 of the substrate 1, and the sensing chip 2, the tail solder 33 of any one of the electrical connection components 3 and the part of the wire 32 located outside the supporting glue layer 4 (such as: part of the lateral section 327, the second bending section 324, the pull-down section 328, the second end 322), the supporting glue layer 4, and part of the transparent sheet 5 are all buried in the package body 6.

[0041] Furthermore, the package body 6 is described as a liquid compound in this embodiment, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the top of the package body 6 can further be formed with a molding compound; or, the package body 6 can also be a molding compound.

[0042] In summary, the sensor packaging structure disclosed in the embodiments of the present application, through the structural design of any one of the electrical connection components (such as: the head end solder of any one of the electrical connection components and the first bend portion of the wire are both buried in the supporting adhesive layer; or, the part of any one of the wires buried in the supporting adhesive layer has the highest point that forms the maximum distance with the substrate; or, any one of the wires forms the first bend portion adjacent to the head end solder and the second bend portion located between the first bend portion and the second end), so that the sensor packaging structure can not only form a thinner structure but also have better reliability.

[0043] Furthermore, the sensor packaging structure disclosed in the embodiment of the present application has an angle of no more than 15 degrees with the top surface of the sensing chip through the lateral displacement section located at the first bending portion and the second bending portion, thereby effectively reducing the maximum distance and thereby reducing the possibility of the wire touching the light-transmitting sheet, thereby improving the reliability of the sensor packaging structure.

[0044] The contents disclosed above are only preferred feasible embodiments of the present application, and are not intended to limit the patent scope of the present application. Therefore, all equivalent technical changes made using the description and drawings of the present application are included in the patent scope of the present application.

Claims

1. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: A substrate including a chip fixing area and a plurality of welding pads located outside the chip fixing area; A sensing chip is disposed on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; A plurality of electrical connection components are electrically connected between the plurality of connection pads and the plurality of welding pads, respectively, and any of the electrical connection components comprises: A head solder is disposed on the corresponding connection pad; A wire, a first end of which extends from the head end solder so that the second end of the wire is connected to the corresponding solder pad, and the wire is formed with a first bend portion adjacent to the head end solder, a second bend portion located between the first bend portion and the second end, and a lateral section located between the first bend portion and the second bend portion, and the lateral section and the top surface of the sensing chip form an angle of no more than 15 degrees; and A tail solder, fixed to the second end of the wire and the corresponding welding pad; a supporting glue layer, formed on the top surface of the sensing chip and surrounding the outside of the sensing area, and the head solder of any one of the electrical connection components and the first bent portion of the wire are buried in the supporting glue layer; and A light-transmitting sheet is disposed on the supporting adhesive layer, so that the light-transmitting sheet, the supporting adhesive layer, and the top surface of the sensing chip together surround a closed space.

2. The sensor packaging structure according to claim 1, characterized in that: In any of the electrical connection components, a maximum distance is formed between the conductive wire at the first bending portion and the substrate.

3. The sensor packaging structure according to claim 1, characterized in that: The first bending portion of any one of the electrical connection components is spaced from the top surface of the sensing chip by a distance ranging from 50 μm to 100 μm.

4. The sensor packaging structure according to claim 1, characterized in that: The sensor packaging structure further includes a packaging body formed on the substrate, and the sensing chip, the tail solder of any one of the electrical connection components, the wire portion located outside the supporting glue layer, the supporting glue layer, and part of the transparent sheet are all buried in the packaging body.

5. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: A substrate including a chip fixing area and a plurality of welding pads located outside the chip fixing area; A sensing chip is disposed on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; A plurality of electrical connection components are electrically connected between the plurality of connection pads and the plurality of welding pads, respectively, and any of the electrical connection components comprises: A head solder is disposed on the corresponding connection pad; A wire, a first end of which extends from the head end solder so that the second end of the wire is connected to the corresponding solder pad, and the wire is formed with a first bend portion adjacent to the head end solder, a second bend portion located between the first bend portion and the second end, and a lateral section located between the first bend portion and the second bend portion, and the lateral section and the top surface of the sensing chip form an angle of no more than 15 degrees; and A tail solder, fixed to the second end of the wire and the corresponding welding pad; a supporting glue layer, formed on the top surface of the sensing chip and surrounding the outside of the sensing area, and the head solder of any one of the electrical connection components and a part of the wire are buried in the supporting glue layer; wherein the part of any one of the wires buried in the supporting glue layer has a highest point, and a maximum distance is formed between the part and the substrate; and A light-transmitting sheet is disposed on the supporting adhesive layer, so that the light-transmitting sheet, the supporting adhesive layer, and the top surface of the sensing chip together surround a closed space.

6. The sensor packaging structure according to claim 5, characterized in that: The highest point of any one of the electrical connection components is spaced from the top surface of the sensing chip by a distance ranging from 50 μm to 100 μm.

7. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: A substrate including a chip fixing area and a plurality of welding pads located outside the chip fixing area; A sensing chip is disposed on the chip fixing area, and the top surface of the sensing chip has a sensing area and a plurality of connection pads located outside the sensing area; A plurality of electrical connection components are electrically connected between the plurality of connection pads and the plurality of welding pads, respectively, and any of the electrical connection components comprises: A head solder is disposed on the corresponding connection pad; A wire, a first end of which extends from the head end solder so that the second end of the wire is connected to the corresponding solder pad, and the wire is formed with a first bend portion adjacent to the head end solder, a second bend portion located between the first bend portion and the second end, and a lateral section located between the first bend portion and the second bend portion, and the lateral section and the top surface of the sensing chip form an angle of no more than 15 degrees; and A tail solder, fixed to the second end of the wire and the corresponding welding pad; a supporting glue layer formed on the top surface of the sensing chip and surrounding the outside of the sensing area, and the head solder of any one of the electrical connection components and a part of the wire are buried in the supporting glue layer; and A light-transmitting sheet is disposed on the supporting adhesive layer, so that the light-transmitting sheet, the supporting adhesive layer, and the top surface of the sensing chip together surround a closed space.

Images