Touch-sensitive water-cooling chassis and AI workstation

Abstract

The present invention discloses a touch-type water-cooled heat dissipation chassis, wherein the touch-type water-cooled heat dissipation chassis comprises: a chassis body, a mounting plate, a touch-screen display, a water-cooling structure and a transparent cover plate. The chassis body has a first mounting opening and a second mounting opening that are opposite to each other, and a heat dissipation hole group is provided on the peripheral wall, and the heat dissipation hole group connects the inside of the chassis body with the outside of the chassis body; the mounting plate is arranged on the chassis body, and the first mounting opening and the second mounting opening correspond to a first mounting space and a second mounting space respectively; the touch-screen display is arranged in the first mounting space, and the touch-screen display cover is arranged in the first mounting opening; the water-cooling structure is arranged in the second mounting space, and comprises a circulating pump, a water-cooling pipe and a mounting bracket, the circulating pump is connected to the water-cooling pipe, and the mounting bracket is used to support the water-cooling pipe so that the water-cooling pipe is suspended in the second mounting space. The technical solution of the present invention enables the air flow channel to fully cover the chassis body, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a touch-controlled water-cooling heat dissipation chassis and an AI workstation. Background Art

[0002] With the rapid development of information technology, the performance of electronic equipment has been continuously improved, but the accompanying air cooling and natural heat dissipation methods have long been unable to meet the heat dissipation needs of existing equipment, especially inside chassis with high circuit integration, complex circuits, numerous devices and narrow space.

[0003] If the temperature inside the chassis cannot be dissipated in time, it will continue to accumulate, eventually causing the equipment inside the chassis to be in an extremely high temperature environment, thereby affecting the working performance of the equipment, and even worse, causing dangers such as fire. Summary of the invention

[0004] The main purpose of the present invention is to provide a touch-controlled water-cooled heat dissipation chassis, aiming to enable the air flow channel to fully cover the chassis body, thereby improving the heat dissipation effect.

[0005] To achieve the above-mentioned purpose, the present invention proposes a touch-type water-cooled heat dissipation chassis, comprising: a chassis body, a mounting plate, a touch-screen display, a water-cooling structure and a transparent cover. The chassis body has a first mounting opening and a second mounting opening that are separated from each other, and a heat dissipation hole group is provided on the peripheral wall of the chassis body, and the heat dissipation hole group connects the interior of the chassis body with the exterior of the chassis body; the mounting plate is arranged on the chassis body, and the mounting plate divides part of the space of the chassis body into a first mounting space and a second mounting space, the first mounting opening corresponds to the first mounting space, and the second mounting opening corresponds to the second mounting space; the touch-screen display is arranged in the first mounting space, and the touch-screen display cover is arranged in the first mounting opening; the water-cooling structure is arranged in the second mounting space, and the water-cooling structure includes a circulation pump, a water-cooling pipe and a mounting bracket, the circulation pump is connected to the water-cooling pipe, and the mounting bracket supports the water-cooling pipe so that the water-cooling pipe is suspended in the second mounting space; the transparent cover is detachably covered on the second mounting opening.

[0006] Optionally, a bottom heat dissipation component and a foot pad are provided at the bottom of the chassis body; the bottom heat dissipation component is detachably provided on the bottom wall of the chassis body, and the foot pad is provided on the bottom wall of the chassis body.

[0007] Optionally, the bottom heat dissipation assembly includes a heat dissipation plate and multiple bottom heat dissipation fans; the heat dissipation hole group includes a first heat dissipation hole, the heat dissipation plate is detachably arranged at the bottom of the chassis body, and the heat dissipation plate is provided with the first heat dissipation hole, the bottom heat dissipation fan is arranged on the heat dissipation plate corresponding to the first heat dissipation hole, and the bottom heat dissipation fan is arranged close to the interior of the chassis body.

[0008] Optionally, the heat dissipation hole group includes a second heat dissipation hole, and the top wall of the chassis body and a side wall of the chassis body are both provided with the second heat dissipation hole; the water cooling structure is provided with multiple water-cooling cooling fans, and the second heat dissipation hole close to the top wall of the chassis body is provided with the water-cooling cooling fan, and the second heat dissipation hole close to the side wall of the chassis body is provided with the water-cooling cooling fan.

[0009] Optionally, the water cooling structure is also provided with a heat dissipation duct and a heat dissipation pipe, and the heat dissipation duct and the heat dissipation pipe are arranged corresponding to the water-cooled heat dissipation fan; the heat dissipation pipe is passed through the heat dissipation duct, and the water-cooled heat dissipation fan is arranged on one side of the heat dissipation duct and blows wind to the other side of the heat dissipation duct.

[0010] Optionally, a movable door body is provided on the other side wall of the chassis body, and the movable door body can be rotatably provided on the chassis body; the heat dissipation hole group also includes a third heat dissipation hole, and the movable door body is provided with a third heat dissipation hole; an air flow path is formed on the chassis body, and air flows into the chassis body from the third heat dissipation hole and the first heat dissipation hole, and then flows out of the chassis body from the second heat dissipation hole.

[0011] Optionally, the foot pad includes a movable part and a limiting part, the limiting part is hollow and has a limiting opening, one end of the movable part is connected to the chassis body, and the other end of the movable part is a free end, and the free end is movably inserted into the limiting opening; a first telescopic spring is provided between the chassis body and the limiting part, the movable part is inserted into the first telescopic spring, and a second telescopic spring is provided between the free end and the limiting part.

[0012] Optionally, the chassis body also includes a third installation space, a third installation opening is provided on the outer surface of the chassis body, and the third installation opening corresponds to the third installation space; the chassis body is provided with an automatic door, and the automatic door can be movably provided in the third installation opening and covers the third installation space.

[0013] Optionally, a plurality of handles are provided upward on the top wall of the chassis body.

[0014] The present invention also proposes an AI workstation, characterized in that it includes: a touch-type water-cooled heat dissipation chassis, a mainboard module, functional devices and a reinforcement structure. The mainboard module is arranged in the touch-type water-cooled heat dissipation chassis; the functional devices include an environmental detection device, a 5G module, a power supply device, a power supply safety device and a sound playback device, and the functional devices are all arranged in the touch-type water-cooled heat dissipation chassis and are electrically connected to the mainboard module; the reinforcement structure includes a mainboard reinforcement device for fixing the mainboard module to the mounting plate.

[0015] The technical solution of the present invention is to improve the ventilation capacity of the chassis body by opening a heat dissipation hole group on the peripheral wall of the chassis body, so that the heat dissipation effect is greatly improved. Specifically, the mounting plate is arranged on the chassis body to separate part of the space of the chassis body into a first mounting space and a second mounting space. The chassis body has a first mounting opening and a second mounting opening that are opposite to each other. The first mounting opening is arranged corresponding to the first mounting space, and the second mounting opening is arranged corresponding to the second mounting space. The touch-sensitive display is installed in the first mounting space from the first mounting opening, and the water-cooling structure is installed in the second mounting space from the second mounting opening. The heat generated by the touch-sensitive display will be transferred to the second mounting space through the mounting plate. Since the mounting bracket in the water-cooling structure suspends the water-cooling pipe in the second mounting space, the suspended water-cooling pipe can absorb heat evenly from all sides, and then absorb the heat existing in the second mounting space at the maximum rate. In addition, if it is necessary to dissipate heat to the maximum extent, the transparent cover plate covering the second mounting opening can be removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the internal structure of an embodiment of a touch-type water-cooling heat dissipation chassis of the present invention;

[0018] Figure 2 An exploded view of the bottom heat dissipation component of the touch-type water-cooled heat dissipation chassis of the present invention;

[0019] Figure 3 It is a schematic diagram of the air flow path of the touch-type water-cooling heat dissipation chassis of the present invention;

[0020] Figure 4 It is a front view of an embodiment of a touch-type water-cooling heat dissipation chassis of the present invention;

[0021] Figure 5It is an oblique second side view of an embodiment of a touch-type water-cooling heat dissipation chassis of the present invention;

[0022] Figure 6 A side view of an embodiment of a touch-type water-cooling heat dissipation chassis of the present invention;

[0023] Figure 7 It is a schematic diagram of the foot pad structure of the touch-type water-cooling heat dissipation chassis of the present invention;

[0024] Figure 8 A top view of the memory module heat dissipation device of the touch-controlled water-cooled heat dissipation chassis of the present invention;

[0025] Fig. 9 It is a side view of the memory bar heat dissipation device of the touch-type water-cooled heat dissipation chassis of the present invention;

[0026] Fig.10 It is a schematic diagram of the memory bar protection shell structure of the touch-type water-cooling heat dissipation chassis of the present invention;

[0027] Fig.11 It is a structural schematic diagram of an embodiment of a water cooling structure of a touch-type water-cooling heat dissipation chassis of the present invention;

[0028] Fig.12 It is a structural schematic diagram of another embodiment of the water cooling structure of the touch-type water-cooling heat dissipation chassis of the present invention;

[0029] Fig.13 This is a schematic diagram of the structure of the environment detection device of the touch-type water-cooling heat dissipation chassis of the present invention.

[0030]

[0031]

[0032] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] The invention provides a touch-controlled water-cooling heat dissipation chassis.

[0038] refer to Figures 1 to 13 In one embodiment of the present invention, the touch-type water-cooling heat dissipation chassis includes: a chassis body 1, a mounting plate 2, a touch-type display 3, a water-cooling structure 4 and a transparent cover. The chassis body 1 has a first installation opening 121 and a second installation opening 122 which are opposite to each other, and a heat dissipation hole group is opened on the peripheral wall of the chassis body 1, and the heat dissipation hole group connects the interior of the chassis body 1 with the exterior of the chassis body 1; a mounting plate 2 is arranged on the chassis body 1, and the mounting plate 2 divides part of the space of the chassis body 1 into a first installation space and a second installation space, the first installation opening 121 corresponds to the first installation space, and the second installation opening 122 corresponds to the second installation space; a touch display 3 is arranged in the first installation space, and the touch display 3 is covered on the first installation opening 121; a water cooling structure 4 is arranged in the second installation space, and the water cooling structure 4 includes a circulating pump 41, a water cooling pipe 42 and a mounting bracket 43, the circulating pump 41 is connected to the water cooling pipe 42, and the mounting bracket 43 supports the water cooling pipe 42 so that the water cooling pipe 42 is suspended in the second installation space; a transparent cover plate is detachably covered on the second installation opening 122.

[0039] The technical solution of the present invention is to improve the ventilation capacity of the chassis body 1 by opening a heat dissipation hole group on the peripheral wall of the chassis body 1, so that the heat dissipation effect is greatly improved. Specifically, the mounting plate 2 is arranged on the chassis body 1 to separate part of the space of the chassis body 1 into a first installation space and a second installation space. The chassis body 1 has a first installation opening 121 and a second installation opening 122 that are separated from each other. The first installation opening 121 is arranged corresponding to the first installation space, and the second installation opening 122 is arranged corresponding to the second installation space. The touch display 3 is installed in the first installation space from the first installation port, and the water cooling structure 4 is installed in the second installation space from the second installation port. The heat generated by the touch display 3 will be transferred to the second installation space through the mounting plate 2. Since the mounting bracket 43 in the water cooling structure 4 suspends the water cooling pipe 42 in the second installation space, the suspended water cooling pipe 42 can absorb the heat uniformly from all sides, and then absorb the heat existing in the second installation space at the maximum rate. In addition, if it is necessary to dissipate heat to the maximum extent, the transparent cover plate covering the second installation opening 122 can be removed.

[0040] The bottom of the chassis body 1 is provided with a bottom heat dissipation component 11 and a foot pad 15; Figure 2 , the bottom heat dissipation assembly 11 is detachably arranged on the bottom wall of the chassis body 1, and the foot pad 15 is arranged on the bottom wall of the chassis body 1. Specifically, the bottom heat dissipation assembly 11 includes a heat dissipation plate 113 and a plurality of bottom heat dissipation fans 111; the heat dissipation hole group includes a first heat dissipation hole 131, the heat dissipation plate 113 is detachably arranged on the bottom of the chassis body 1, and the heat dissipation plate 113 is provided with the first heat dissipation hole 131, the bottom heat dissipation fan 111 is arranged on the heat dissipation plate 113 corresponding to the first heat dissipation hole 131, and the bottom heat dissipation fan 111 is arranged close to the inside of the chassis body 1. The bottom heat dissipation fan 111 is detachably installed on the heat dissipation plate 113, and the heat dissipation plate 113 is detachably installed at the bottom position of the chassis body 1. Since the bottom heat dissipation assembly 11 is arranged at the bottom of the chassis body 1, dust in the chassis body 1 is more likely to accumulate and adhere to the bottom heat dissipation assembly 11. By setting the bottom heat dissipation fan 111 and the heat dissipation plate 113 to be detachable, the bottom heat dissipation assembly 11 that is full of dust can be easily disassembled for cleaning to prevent the flowing air from blowing the dust to all parts of the chassis body 1, thereby affecting the normal operation of the functional equipment. In addition, in order to prevent the bottom heat dissipation fan from hitting the heat dissipation plate 113 during the process of rotating and dissipating heat, a partition 112 is arranged between the bottom heat dissipation fan 111 and the heat dissipation plate 113.

[0041] The foot pad 15 can raise the distance between the bottom wall of the chassis body 1 and the ground, so that the air flow remains smooth. Figure 7 The foot pad 15 includes a movable portion 151 and a limiting portion 152. The limiting portion 152 is hollow and has a limiting opening. One end of the movable portion 151 is connected to the chassis body 1. The other end of the movable portion 151 is a free end. The free end is movably inserted into the limiting opening. A first telescopic spring 153 is provided between the chassis body 1 and the limiting portion 152. The movable portion 151 is inserted into the first telescopic spring 153. A second telescopic spring 154 is provided between the free end and the limiting portion 152. The first telescopic spring 153 and the second telescopic spring 154 work together to reduce the impact force between the chassis body 1 and the ground, thereby keeping the functional devices inside the chassis body 1 safe and reducing the interference and influence of external vibration on the functional devices inside the chassis body 1.

[0042] The heat dissipation hole group includes a second heat dissipation hole 132, and the top wall of the chassis body 1 and the side wall of the chassis body 1 are both provided with the second heat dissipation hole 132; the water cooling structure 4 is provided with a plurality of water cooling fans 44, and the second heat dissipation hole 132 near the top wall of the chassis body 1 is provided with the water cooling fan 44, and the second heat dissipation hole 132 near the side wall of the chassis body 1 is provided with the water cooling fan 44. The water cooling fan 44 can discharge the high temperature gas inside the chassis body 1 from the second heat dissipation hole 132 to the outside of the chassis body 1, thereby improving the heat dissipation effect of the chassis body 1. In one embodiment, further, the water cooling structure 4 is further provided with a heat dissipation duct 45 and a heat dissipation pipe 46, and the heat dissipation duct 45 and the heat dissipation pipe 46 are arranged corresponding to the water cooling fan 44; the heat dissipation pipe 46 is arranged through the heat dissipation duct 45, and the water cooling fan is arranged on one side of the heat dissipation duct 45, and blows the wind to the other side of the heat dissipation duct 45. The heat dissipation capacity of the water-cooling liquid in the water-cooling structure 4 can be improved by providing a heat dissipation duct 45 and a heat dissipation pipe 46. Specifically, the water-cooling liquid flows through most of the functional devices of the chassis body 1 through the water-cooling pipe 42, absorbs and takes away the heat generated by the functional devices. If the water-cooling liquid only absorbs and does not release for a long time, the temperature in the water-cooling liquid will continue to rise and eventually reach a peak value. At this time, the water-cooling liquid will not be able to absorb the heat generated by the functional devices, and the temperature in the chassis body 1 will continue to rise. In order to solve the above problems, the water-cooling structure 4 is provided with a heat dissipation duct 45 and a heat dissipation pipe 46 passing through the heat dissipation duct 45. The heat dissipation pipe 46 is connected to the water-cooling pipe 42. The high-temperature water-cooling liquid flows through the water-cooling pipe and the heat will remain at the position of the heat dissipation pipe 46. The heat is then transferred from the heat dissipation pipe 46 to the heat dissipation duct 45. The water-cooling heat dissipation fan 44 is provided on one side of the heat dissipation duct 45, and can blow air from one side of the heat dissipation duct 45 to the other side, and can also take away the heat remaining in the heat dissipation duct 45, and take the heat out of the inside of the chassis body 1. In addition, the water cooling structure 4 is further provided with a pressure detection device 47 and a flow monitor 48, both of which are electrically connected to the mainboard module 6, for real-time monitoring of the pressure and flow in the water cooling pipe 42. Fig.11 , a plurality of heat dissipation pipes 46 are arranged in parallel and pass through the heat dissipation duct 45. In another embodiment, referring to Fig.12 A heat dissipation pipe 46 is bent and penetrates the heat dissipation duct 45 .

[0043] The other side wall of the chassis body 1 is provided with a movable door body 14, and the movable door body 14 is rotatably provided on the chassis body 1; the heat dissipation hole group also includes a third heat dissipation hole 133, and the movable door body 14 is provided with a third heat dissipation hole 133; Figure 3The chassis body 1 is formed with an air flow path, and air flows into the chassis body 1 from the third heat dissipation hole 133 and the first heat dissipation hole 131, and then flows out of the chassis body 1 from the second heat dissipation hole 132. In this way, the circulation process of the air flow path inside the chassis body 1 is realized, and the heat generated by the functional devices inside the chassis body 1 is further completely discharged to the outside of the chassis body 1.

[0044] The chassis body 1 also includes a third installation space, and the outer surface of the chassis body 1 is provided with a third installation opening 123, and the third installation opening 123 corresponds to the third installation space; the chassis body 1 is provided with an automatic door 16, and the automatic door 16 can be movably arranged in the third installation opening 123 and cover the third installation space. The automatic door 16 can protect the functional equipment inside the chassis body 1 on the one hand, and can improve the heat dissipation effect of the chassis body 1 by opening the automatic door 16 on the other hand. Specifically, the chassis body 1 is provided with an installation opening, and a fixed frame is provided corresponding to the installation opening, and the fixed frame and the automatic door 16 form an installation space, which includes but is not limited to installing a sound playing device 75, and the automatic door 16 can be movably arranged in the installation opening. In this embodiment, the automatic door 16 is a sliding opening and closing, but the sliding direction is not limited, including but not limited to left and right sliding, up and down sliding, front and back sliding and lateral sliding. However, the present design is not limited to this. In other embodiments, the automatic door 16 can also be a rotating opening and closing, a telescopic type, etc. In another embodiment, the installation space can also store external devices, such as a mouse, a keyboard, a headset, a USB flash drive, a router, and other external devices.

[0045] In order to improve the portability of the chassis body 1, a plurality of handles 17 are provided on the top wall of the chassis body 1. In this embodiment, two handles 17 are provided and are located on opposite sides of the top of the chassis body 1. The handles 17 are metal curved handles 17, but the present design is not limited thereto. In other embodiments, the handles 17 can also be hidden and rotated to be exposed at the top of the chassis body 1. A second cooling fan is provided at the bottom wall of the chassis to discharge the high-temperature gas inside the chassis body 1 to the outside of the chassis body 1. Reference Figure 4 A face recognition module 78 is also provided on the top of the touch screen, and the face recognition module 78 can recognize face information and then control functions such as opening the touch screen and unlocking the door lock.

[0046] The present invention also proposes an AI workstation, which includes a mainboard module 6, functional equipment, a reinforcement structure 8 and a touch-type water-cooled heat dissipation chassis. The specific structure of the touch-type water-cooled heat dissipation chassis refers to the above-mentioned embodiment. Since the present AI workstation adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Among them, the mainboard module 6 is arranged in the touch-type water-cooled heat dissipation chassis; the functional equipment includes an environmental detection device 71, a 5G module 72, a power supply device 73, a power supply safety device 74 and a sound playback device 75, and the functional equipment are all arranged in the touch-type water-cooled heat dissipation chassis, and are all electrically connected to the mainboard module 6; the reinforcement structure 8 includes a mainboard reinforcement device for fixing the mainboard module 6 to the mounting plate 2.

[0047] The reinforcement structure 8 includes a memory bar reinforcement device 81, which is set corresponding to the memory bar. Figures 8 to 10 ,; the memory bar reinforcement device 81 includes a fixed cover for covering the memory bar and a memory bar cooling fan 8122 arranged in the fixed cover; a heat dissipation hole for ventilation is provided on the top of the fixed cover. The memory bar on the mainboard is protected by the memory bar reinforcement device 81, so that the memory bar can be prevented from being damaged or falling when the chassis body 1 is subjected to external impact. Specifically, the memory bar is protected by a memory bar protection shell 811, and a memory bar heat dissipation device 812 is also provided on the top of the memory bar protection shell 811, so that the present solution can achieve the ability of heat dissipation while protecting the memory bar, thereby extending the service life of the memory bar. The heat dissipation of the memory bar includes two ways. First, the memory bar heat dissipation device 812 specifically includes a heat dissipation frame 8121 and a first heat dissipation fan. The top of the heat dissipation frame 8121 is provided with a heat dissipation slot 8123, and the first heat dissipation fan is fixed in the heat dissipation frame 8121. The first heat dissipation fan discharges the heat generated by the memory bar protection shell 811 into the chassis body 1, and finally discharges it from the chassis body 1 to the outside of the AI ​​workstation. Secondly, in order to further improve the heat dissipation capacity of the memory stick heat sink 812, the outer wall of the heat sink 8121 is provided with heat dissipation ribs 8124, and the heat dissipation ribs 8124 are laterally protruding. In this way, the heat accumulated in the memory stick and the memory stick protective shell 811 can be conducted to the heat dissipation ribs 8124 through the heat sink 8121 for heat dissipation.

[0048] The functional device also includes a power supply device 73 and a power supply safety device 74, which are arranged on the side wall of the chassis body 1, and the power supply device 73 is electrically connected to the power supply safety device 74; the power supply safety device 74 is used to monitor and control the on-off of the wire flowing through the power supply device 73. When the power supply safety device 74 detects that the circuit parameters or voltage parameters in the power supply device 73 are abnormal, it will directly disconnect the power supply, causing the entire AI workstation to stop working.

[0049] Specifically, the power supply safety device 74 is also communicatively connected with the environment detection device 71. The environment detection device 71 is arranged in the chassis body 1. The side wall of the chassis body 1 is also provided with a second heat dissipation hole 132 for ventilation. The environment detection device 71 is arranged close to the second heat dissipation hole 132. The environment detection device 71 can directly detect the environmental parameters in the chassis body 1, including but not limited to temperature, humidity and other environmental parameters. When the temperature and humidity reach the threshold, it may have a direct impact on the power supply circuit and electronic components. Therefore, the power supply safety device 74 can directly obtain the communication signal of the environment detection device 71, and judge whether the value of the environmental parameter will directly affect the working state of the power supply device 73. If the environmental value is higher than the threshold, the power supply will be directly disconnected to stop the power supply device 73 from working. If it is lower than the threshold, the power supply device 73 will maintain safe operation. Reference Figure 6 , the chassis body 1 is provided with a manual switch 742 and a power socket 743, and the manual switch 742 is electrically connected to the power socket 743. Specifically, the power safety device 74 disconnects the passage between the power socket 743 and the power device 73, so that the power socket 743 stops supplying power to the power device 73, thereby stopping the entire AI workstation from working. In order to further improve the safety performance of the AI ​​workstation, a manual switch 742 is provided next to the power socket 743 to manually control the conduction or disconnection of the power socket 743. In addition, the power safety device 74 is also provided with a protective cover to isolate the components in the power safety device 74 from other devices in the chassis body 1 to prevent the water cooling structure 4 in the chassis body 1 from leaking and causing the power safety device 74 to stop working. Specifically, the power safety device 74 includes a current detector and a voltage detection device 744. The current detector is used to detect the output current delivered by the power supply device 73 to different functional devices, and the power detection device is used to detect the output voltage of functional devices including the power supply device 73. However, the essence of the power detection device is a controller, which can control the opening and closing of the circuit and the real-time numerical display of parameters while detecting the voltage.

[0050] Furthermore, the side wall of the chassis body 1 is also provided with an I / O port 741, and the I / O port 741 is communicatively connected with the mainboard module 6. The I / O port 741 is used to expand the function of the AI ​​workstation, that is, the AI ​​workstation can directly connect with large-scale equipment for data transmission, and directly transmit information such as drawings, processes, and modeling to large-scale equipment, so as to realize detailed work purposes such as operation, operation, programming, and parameter modification of large-scale equipment.

[0051] The functional device also includes a 5G module 72, through which the AI ​​workstation can achieve high-speed upload and download of data and improve the Internet access rate. In addition, the 5G module 72 also includes a wireless network card, so that the AI ​​workstation can be connected to the Internet anytime and anywhere while being portable. Specifically, the 5G module 72 is arranged close to the third heat dissipation hole 133, and the heat generated by the operation of the 5G module 72 can be quickly brought out to the outside of the chassis body 1 along the air entering the third heat dissipation hole 133, so that the 5G module 72 can keep working for a long time and extend the service life of the 5G module 72. Corresponding to the 5G module 72, the chassis body 1 is also provided with a 5G module fixing frame 82.

[0052] The functional device also includes a dual graphics card device, which includes a first graphics card, a first fixing frame 83, a second graphics card, a second fixing frame 84, a crossfire bridge 77 and a third fixing frame 85; the first graphics card fixing frame and the second graphics card fixing frame are installed on the mounting plate 2, and both are provided with a heat dissipation hole group, the first graphics card is fixedly connected to the first fixing frame 83, the second graphics card is fixedly connected to the second fixing frame 84, the crossfire bridge 77 communicatively connects the first graphics card and the second graphics card, and the third fixing frame 85 is installed on the mounting plate 2 and fixes the crossfire bridge 77.

[0053] The functional device includes a parameter display, which is communicatively connected to the mainboard module 6, and is at least used to display the temperature of the mainboard module 6. Specifically, the environment detection device 71 is communicatively connected to the mainboard module 6, and transmits the detected environmental parameters to the mainboard module 6, wherein the parameters detected by the environment detection device 71 include but are not limited to temperature, humidity, atmospheric pressure, carbon monoxide concentration, carbon dioxide concentration, etc. And the corresponding environment detection device 71 is provided with a corresponding parameter detection sensor and a control module, and the specific structure is not elaborated in detail. In this embodiment, the parameter display is set away from the touch screen, and a transparent cover is used on one side of the chassis body 1. The user can observe the specific parameter information in the parameter display through the parameter display, and the transparent cover is also provided with an anti-theft system, which can monitor the installation and disassembly of the transparent cover, and obtain the disassembly information through the remote terminal.

[0054] In addition, a light strip and a light controller 76 are also provided inside the chassis body 1. The light controller 76 controls the light parameters of the light strip, specifically including the color and brightness of the light strip. Furthermore, the chassis body 1 is also provided with a speed controller (not shown) for controlling the speed of the cooling fan and monitoring and uploading the speed of the cooling fan in real time. It should be understood that the user can control the speed of the cooling fan according to the temperature inside the chassis body 1 obtained in the parameter display, so that the temperature inside the chassis body 1 can be maintained within a safe range as much as possible. Furthermore, by setting a corresponding program, the speed of the cooling fan can be increased when the temperature inside the chassis body 1 exceeds a threshold, so that the temperature inside the chassis body 1 always maintains a safe value or lower.

[0055] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A touch-type water-cooling heat dissipation chassis, characterized in that: include: A chassis body, having a first installation opening and a second installation opening which are separated from each other, a peripheral wall of the chassis body is provided with a heat dissipation hole group, and the heat dissipation hole group connects the interior of the chassis body with the exterior of the chassis body; A mounting plate is provided on the chassis body, and the mounting plate divides a part of the space of the chassis body into a first mounting space and a second mounting space, the first mounting opening corresponds to the first mounting space, and the second mounting opening corresponds to the second mounting space; A touch display is disposed in the first installation space, and the touch display cover is disposed in the first installation opening; a water cooling structure, arranged in the second installation space, the water cooling structure comprising a circulation pump, a water cooling pipe and a mounting bracket, the circulation pump being in communication with the water cooling pipe, the mounting bracket supporting the water cooling pipe so that the water cooling pipe is suspended in the second installation space to uniformly absorb heat from all sides; and A transparent cover plate, detachably covering the second installation opening; The chassis body further includes a third installation space, which can be used to accommodate functional devices of the heat dissipation chassis. The outer surface of the chassis body is provided with a third installation opening, and the third installation opening corresponds to the third installation space. The chassis body is provided with an automatic door, which can be movably arranged at the third installation opening and covers the third installation space. The top wall of the chassis body is upwardly provided with a plurality of handles, and the handles can be hidden.

2. The touch-controlled water-cooling heat dissipation chassis according to claim 1, characterized in that: The bottom of the chassis body is provided with a bottom heat dissipation component and a foot pad; The bottom heat dissipation component is detachably arranged on the bottom wall of the chassis body, and the foot pad is arranged on the bottom wall of the chassis body.

3. The touch-controlled water-cooling heat dissipation chassis according to claim 2, characterized in that: The bottom heat dissipation assembly includes a heat dissipation plate and a plurality of bottom heat dissipation fans; The heat dissipation hole group includes a first heat dissipation hole, the heat dissipation plate is detachably arranged at the bottom of the chassis body, and the heat dissipation plate is provided with the first heat dissipation hole, the bottom heat dissipation fan is arranged on the heat dissipation plate corresponding to the first heat dissipation hole, and the bottom heat dissipation fan is arranged close to the inside of the chassis body.

4. The touch-controlled water-cooling heat dissipation chassis according to claim 3, characterized in that: The heat dissipation hole group includes a second heat dissipation hole, and the top wall of the chassis body and a side wall of the chassis body are both provided with the second heat dissipation hole; The water cooling structure is provided with a plurality of water cooling fans. The second heat dissipation hole close to the top wall of the chassis body is provided with the water cooling fan, and the second heat dissipation hole close to a side wall of the chassis body is provided with the water cooling fan.

5. The touch-controlled water-cooling heat dissipation chassis according to claim 4, characterized in that: The water cooling structure is also provided with a heat dissipation duct and a heat dissipation pipe, and the heat dissipation duct and the heat dissipation pipe are arranged corresponding to the water cooling heat dissipation fan; The heat dissipation pipe is arranged in the heat dissipation air duct, and the water-cooled heat dissipation fan is arranged on one side of the heat dissipation air duct and blows wind to the other side of the heat dissipation air duct.

6. The touch-controlled water-cooling heat dissipation chassis according to claim 4, characterized in that: A movable door body is provided on the other side wall of the chassis body, and the movable door body is rotatably arranged on the chassis body; The heat dissipation hole group further includes a third heat dissipation hole, and the movable door body is provided with the third heat dissipation hole; The chassis body is formed with an air flow path, and air flows into the chassis body from the third heat dissipation hole and the first heat dissipation hole, and then flows out of the chassis body from the second heat dissipation hole.

7. The touch-controlled water-cooling heat dissipation chassis according to claim 2, characterized in that: The foot pad includes a movable part and a limiting part, the limiting part is hollow and has a limiting opening, one end of the movable part is connected to the chassis body, and the other end of the movable part is a free end, and the free end is movably arranged in the limiting opening; A first telescopic spring is arranged between the chassis body and the limiting portion, the movable portion is penetrated by the first telescopic spring, and a second telescopic spring is arranged between the free end and the limiting portion.

8. An AI workstation, characterized in that: include: The touch-controlled water-cooling heat dissipation chassis according to any one of claims 1 to 7; A mainboard module is arranged in the touch-type water-cooling heat dissipation chassis; Functional devices, including an environment detection device, a 5G module, a power supply device, a power supply safety device and a sound playback device, and the functional devices are all arranged in the touch-type water-cooled heat dissipation chassis and are electrically connected to the mainboard module; The reinforcement structure at least includes a mainboard reinforcement device for fixing the mainboard module to the mounting plate.

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