A hierarchical microchannel phase change cooling module and cooling system for electronic devices

Abstract

The present invention relates to the field of electronic device heat dissipation technology, in particular to a layered microchannel phase change cooling module and cooling system for electronic devices, wherein the cooling module comprises a heat dissipation cover plate, a microchannel layer, an upper manifold shunt layer, a lower manifold shunt layer, a liquid supply pool layer, a liquid collection pool layer and a liquid inlet and outlet base; the heat dissipation cover plate is connected to a heat source of the electronic device; a plurality of parallel rectangular microchannels are arranged in the microchannel layer; a second liquid inlet shunt channel and a first liquid outlet shunt channel are arranged in the upper manifold shunt layer; a cooling medium flows into the rectangular microchannel through the second liquid inlet shunt channel, thereby cooling the heat source on the heat dissipation cover plate, and then flows out through the first liquid outlet shunt channel; the cooling system is composed of a phase change cooling module, a liquid storage tank, a filter, a gear pump, a flow meter, a chiller, a one-way valve, a power supply device, a sensor system, a data acquisition system and a computer.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to a layered microchannel phase-change cooling module and a cooling system for electronic devices. Background Art

[0002] With the development of high-power electronic devices and micro-electromechanical systems, the integration of electronic circuits and the capacity of various high-power electronic devices are increasing rapidly. Therefore, the heat flux density generated by electronic devices has increased from tens of W / cm in the early days. 2 Increased to thousands of W / cm 2 , traditional cooling methods are not enough to dissipate such a huge heat flux density. In recent years, microchannel heat sinks have become one of the most effective means of thermal management for high-power electronic devices, because the device can effectively dissipate a large amount of input heat in a small footprint, and has the advantages of large surface area per unit volume, high heat dissipation efficiency per unit area, and light weight. However, the uneven flow distribution between microchannels interconnected by inlet manifolds and outlet manifolds is one of the main obstacles affecting the normal operation of microchannel cooling systems. Therefore, it is necessary to develop an effective microchannel phase change cooling module system with uniform flow distribution characteristics to enter the heat dissipation of electronic devices, which will significantly reduce the operating temperature of electronic devices, alleviate the generation of local high-temperature hot spots, and significantly improve the temperature uniformity and service life of high-power electronic devices.

[0003] In the patent application with application number 201910478924.5 and titled "A High-efficiency Heat Dissipation Structure of a Liquid-Cooled Channel", a "C"-shaped groove microchannel is disclosed, in which 6 "C"-shaped groove microchannels are arranged in a circular cold plate. However, the microchannels of this structure occupy a relatively small area of ​​the cold plate, and the flow time of the cooling medium in the cold plate is relatively short; in addition, the C-shaped groove flow channel has a large turning point, which is not conducive to the uniform flow of the cooling medium in the microchannel, which leads to the need to further improve the heat dissipation effect of the cold plate. Summary of the invention

[0004] The purpose of the present invention is to solve the technical problems of uneven flow distribution in microchannel cooling modules, limited cooling capacity and inability to use intelligent control methods to efficiently handle the heat dissipation of electronic devices.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A layered microchannel phase change cooling module for electronic devices, comprising a heat dissipation cover plate, a microchannel layer, an upper manifold shunt layer, a lower manifold shunt layer, a liquid supply pool layer, a liquid collection pool layer and a liquid inlet and outlet base, wherein the heat dissipation cover plate is a rectangular parallelepiped and is connected to a heat source of the electronic device;

[0007] Furthermore, a plurality of parallel rectangular microchannels are evenly arranged in the microchannel layer, and the channel width and the distance between the channels of the rectangular microchannels are the same;

[0008] Furthermore, a second liquid inlet shunt channel and a first liquid outlet shunt channel are provided in the upper manifold shunt layer; the cooling medium flows into the rectangular microchannel through the second liquid inlet shunt channel, thereby cooling the heat source of the electronic device connected to the heat dissipation cover plate; the cooling medium flowing through the rectangular microchannel flows out through the first liquid outlet shunt channel;

[0009] Furthermore, a first liquid inlet shunt channel and a second liquid outlet shunt channel are provided in the layer of the lower manifold shunt layer; the first liquid inlet shunt channel and the second liquid outlet shunt channel are respectively connected with the second liquid inlet shunt channel and the first liquid outlet shunt channel in the upper manifold shunt layer; the first liquid inlet shunt channel and the second liquid outlet shunt channel are respectively rectangular and trapezoidal in height direction;

[0010] Furthermore, the liquid supply pool layer is provided with a third liquid inlet, a liquid supply pool and a third liquid outlet shunt channel; the third liquid inlet and the liquid supply pool are connected to each other, and the cooling medium is transported to the first liquid inlet shunt channel in the lower manifold shunt layer via the liquid supply pool; the liquid supply pool is in an I-shape with symmetry on both sides; the third liquid inlet and the second liquid outlet shunt channel are connected and are located at the center of the bottom surface of the liquid supply pool;

[0011] Furthermore, the liquid collecting pool layer is provided with a second liquid inlet and a first liquid collecting pool; the second liquid inlet is located at the center of the layer and is connected to the third liquid inlet; the first liquid collecting pool is arranged in a stepped manner and is connected to the third liquid outlet shunt channel for recovering the cooling medium after heating;

[0012] Furthermore, a first liquid inlet, a second liquid collecting tank and a liquid outlet are arranged in the layer of the inlet and outlet base; the first liquid inlet provides cooling medium and is connected to the second liquid inlet; the second liquid collecting tank is connected to the first liquid collecting tank and is arranged alternately, with both sides presenting symmetrical rectangles; the liquid outlet is located at the center of the bottom of the second liquid collecting tank and is connected to the lower side of the second liquid collecting tank.

[0013] A cooling system for a layered microchannel phase change cooling module, comprising the layered microchannel phase change cooling module, a liquid storage tank, a filter, a magnetic coupling gear pump, a flow meter, a No. 1 chiller, a check valve, a power supply device, a sensor system, a No. 2 chiller, a data acquisition system and a computer;

[0014] Furthermore, the liquid storage tank, filter, magnetic coupling gear pump, flow meter, No. 1 chiller, one-way valve, stratified microchannel phase change cooling module and No. 2 chiller are connected in sequence; the power supply device provides heat to the heat dissipation cover plate of the stratified microchannel phase change cooling module; the liquid storage tank is used for supplying and recovering the cooling medium of the flow circuit; the filter is used to filter impurities in the flow circuit, and the magnetic coupling gear pump is used to control the supply flow rate of the cooling medium; the flow meter is used to monitor the supply flow rate of the cooling medium; the No. 1 chiller is used to control the initial temperature of the cooling medium entering the stratified microchannel phase change cooling module; the one-way valve is used to control the flow and stop of the cooling medium; the No. 2 chiller is used to cool the heated cooling medium flowing out of the stratified microchannel phase change cooling module;

[0015] Further, the sensor system includes a first pressure sensor disposed between the first liquid inlet and the one-way valve, for measuring the pressure of the first liquid inlet of the stratified microchannel phase change cooling module; a second pressure sensor disposed between the liquid outlet and the second chiller, for measuring the pressure of the liquid outlet of the stratified microchannel phase change cooling module; a first temperature sensor, a second temperature sensor, a third temperature sensor and a fourth temperature sensor disposed on the heat dissipation cover of the stratified microchannel phase change cooling module, for measuring the temperature distribution on the heat dissipation cover of the stratified microchannel phase change cooling module;

[0016] Furthermore, the data acquisition system is used to receive signals from the sensor system, and the computer is used to process data signals and obtain measurement data.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention designs a layered microchannel phase change cooling module, in which layers are stacked on top of each other, occupying a small area, and facilitating the arrangement and installation of multiple cooling modules;

[0019] 2. The cooling medium flows evenly from bottom to top through multiple liquid inlet shunt channels into the upper parallel microchannels, and then flows evenly from the upper parallel microchannels into multiple liquid outlet shunt channels from top to bottom, which can ensure that the flow rate between each channel in the microchannel is the same, improve the temperature uniformity of the heat dissipation cover, alleviate the problem of excessively high temperature of local hot spots, and play a role in efficient heat dissipation;

[0020] 3. The layered microchannel phase change cooling module is equipped with multiple large-volume liquid collection pools, which can effectively avoid the problem of bubble blockage in the microchannel caused by bubbles generated by the evaporation and boiling of the cooling medium in the microchannel;

[0021] 4. The inlet and outlet of the layered microchannel phase change cooling module and the heat dissipation cover are located on the upper and lower sides of the module respectively, with a long distribution distance, which can effectively reduce the water, electricity and fire risks caused by leakage of cooling medium;

[0022] 5. Using visual data monitoring control methods as the control method for controlling magnetic coupling gear pumps, chillers and power supply devices can effectively reduce the temperature in time according to the temperature changes of the heat source and improve the cooling degree of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the structure of the hierarchical microchannel phase change cooling module for electronic devices in the present invention;

[0024] Figure 2 It is a structural schematic diagram of the heat dissipation cover plate in the present invention;

[0025] Figure 3 Schematic diagram of the structure of the microchannel layer in the present invention;

[0026] Figure 4 It is a schematic diagram of the structure of the upper manifold splitter layer of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the lower manifold splitter layer of the present invention;

[0028] Figure 6 It is a schematic structural diagram of the liquid supply pool layer in the present invention;

[0029] Figure 7 It is a schematic structural diagram of the liquid collection pool layer in the present invention;

[0030] Figure 8 It is a structural schematic diagram of the liquid inlet and outlet base in the present invention;

[0031] Fig. 9 It is a schematic diagram of the total flow channel structure in the present invention;

[0032] Fig.10 is a system flow circuit architecture diagram of the cooling system of the present invention;

[0033] Fig.11 is a velocity distribution diagram in the microchannel in Example 1 of the present invention;

[0034] Fig.12 It is a temperature distribution diagram of the heat dissipation cover plate in Example 1 of the present invention.

[0035] In the figure: 1, heat dissipation cover; 2, microchannel layer; 21, rectangular microchannel; 3, upper manifold shunt layer; 31, second liquid inlet shunt channel; 32, first liquid outlet shunt channel; 4, lower manifold shunt layer; 41, first liquid inlet shunt channel; 42, second liquid outlet shunt channel; 5, liquid supply pool layer; 51, third liquid inlet; 52, liquid supply pool; 53, third liquid outlet shunt channel; 6, liquid collection pool layer; 61, second liquid inlet; 62, first liquid collection pool; 7, liquid inlet and outlet base; 71, first liquid inlet; 72, second liquid collection pool; 73, liquid outlet;

[0036] 81. Liquid storage tank; 82. Filter; 83. Magnetic coupling gear pump; 84. Flow meter; 85. Chiller No. 1; 86. One-way valve; 87. Power supply unit; 88. First pressure sensor; 89. First temperature sensor; 810. Second temperature sensor; 811. Third temperature sensor; 812. Fourth temperature sensor; 813. Second pressure sensor; 814. Chiller No. 2; 815. Data acquisition system; 816. Computer. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Example 1

[0039] The present invention provides a technical solution:

[0040] like Figure 1 As shown, a layered microchannel phase change cooling module for electronic devices includes a heat dissipation cover plate 1, a microchannel layer 2, an upper manifold diversion layer 3, a lower manifold diversion layer 4, a liquid supply pool layer 5, a liquid collection pool layer 6 and a liquid inlet and outlet base 7. The size of the entire cooling module is 30mm×30mm×40mm;

[0041] like Figure 2 As shown, the heat dissipation cover plate layer 1 is a rectangular parallelepiped, and the upper surface 11 of the heat dissipation cover plate layer is connected to the heat source of the electronic device;

[0042] like Figure 3 As shown, a plurality of parallel rectangular microchannels 21 are evenly arranged in the microchannel layer 2, and the total number of rectangular microchannels is 29. The width and height of a single microchannel are both 0.5 mm, and the length is 28.5 mm;

[0043] like Figure 4As shown, the second liquid inlet shunt channel 31 and the first liquid outlet shunt channel 32 are alternately arranged in the layer of the upper manifold shunt layer 3; the cooling medium flows into the rectangular microchannel 21 through the second liquid inlet shunt channel 31, thereby cooling the heat source of the electronic device connected to the heat dissipation cover plate 1; the second liquid inlet shunt channel 31 and the first liquid outlet shunt channel 32 have a length of 28.5 mm, a width of 1.5 mm, a height of 5 mm, and a spacing between the shunt channels of 6.75 mm;

[0044] like Figure 5 As shown, a first liquid inlet shunt channel 41 and a second liquid outlet shunt channel 42 are provided in the layer of the lower manifold shunt layer 4; the first liquid inlet shunt channel 41 and the second liquid outlet shunt channel 42 are respectively connected with the second liquid inlet shunt channel 31 and the first liquid outlet shunt channel 32 in the upper manifold shunt layer 3; the first liquid inlet shunt channel 41 has a length of 28.5 mm, a width of 1.5 mm, and a height of 6 mm; the second liquid outlet shunt channel 42 branches from the first liquid outlet shunt channel 32, and gradually shrinks downward with height to form a trapezoidal channel; the upper side length of the second liquid outlet shunt channel 42 is 28.5 mm, the lower side length is 6.5 mm, the width is 1.5 mm, and the height is 6 mm;

[0045] like Figure 6 As shown, the liquid supply pool layer 5 is provided with a third liquid inlet 51, a liquid supply pool 52 and a third liquid outlet shunt channel 53; the third liquid inlet 51 is connected with the liquid supply pool 52 and is located at the center of the bottom surface of the liquid supply pool 52; the diameter of the third liquid inlet 51 is 5 mm and the height is 5 mm; the cooling medium is transported to the first liquid inlet shunt channel 41 in the lower manifold shunt layer 4 through the liquid supply pool 52; the liquid supply pool 52 is 28.5 mm long, and the two sides are symmetrical I-shaped, the width of the two sides of the I-shaped is 3.4 mm, and the width of the center of the I-shaped is 6.6 mm; the third liquid outlet shunt channel 53 is connected with the second liquid outlet shunt channel 42; the length of the third liquid outlet shunt channel 53 is 6.5 mm, the width is 1.5 mm, and the height is 5 mm;

[0046] like Figure 7 As shown, the liquid collecting pool layer 6 is provided with a second liquid inlet 61 and a first liquid collecting pool 62; the second liquid inlet 61 is located at the center of the layer and is connected with the third liquid inlet 51; the second liquid inlet 61 has a diameter of 5 mm and a height of 4 mm; the upper side of the first liquid collecting pool 62 is connected with the third liquid outlet diversion channel 53; the first liquid collecting pool 62 presents a two-layer stepped type, each step height is 2 mm, the upper step length is 28.5 mm, the width is 6.5 mm, and three parallel rectangular blocks are arranged on the lower step, with lengths of 3.95 mm, 8.6 mm and 3.95 mm, respectively, and a width of 6.5 mm.

[0047] like Figure 8As shown, the layer of the inlet and outlet base 7 is provided with a first liquid inlet 71, a second liquid collecting pool 72 and a liquid outlet 73, the first liquid inlet 71 provides cooling medium and is connected to the second liquid inlet 61; the first liquid inlet 71 has a diameter of 5 mm and a height of 18.5 mm; the second liquid collecting pool 72 has symmetrical rectangles on both sides and is connected to the first liquid collecting pool 62; the second liquid collecting pool 72 has a length of 21.5 mm, a width of 6.5 mm and a height of 2 mm; the liquid outlet 73 is located at the bottom center of the second liquid collecting pool 72; the liquid outlet 73 has a diameter of 5 mm and a height of 16.5 mm;

[0048] like Fig. 9 As shown, the flow path of the layered microchannel phase change cooling module is: the cooling medium flows in through the first liquid inlet 71 of the liquid outlet base 7, flows through the second liquid inlet 61 and the third liquid inlet 51 to the two first liquid inlet diversion channels 41, and then flows from the first liquid inlet diversion channel 41 into the second liquid inlet diversion channel 31 to the upper parallel rectangular microchannel 21. The cooling medium flowing through the microchannel flows downward into the three first liquid outlet diversion channels 32, and then branches into the six second liquid outlet diversion channels 42 and the six third liquid outlet diversion channels 53 in sequence, and then is recovered to the first liquid collecting pool 62 and the second liquid collecting pool 72, and finally flows out of the phase change cooling module from the two liquid outlets 73.

[0049] The layered microchannel phase change cooling module can be integrally formed by 3D printing.

[0050] This embodiment provides a cooling system based on a layered microchannel phase change cooling module, such as Fig.10 As shown, it includes a stratified microchannel phase change cooling module, a liquid storage tank 81, a filter 82, a magnetic coupling gear pump 83, a flow meter 84, a No. 1 chiller 85, a one-way valve 86, a power supply device 87, a sensor system, a No. 2 chiller 814, a data acquisition system 815 and a computer 816; the liquid storage tank 81, the filter 82, the magnetic coupling gear pump 83, the flow meter 84, the No. 1 chiller 85, the one-way valve 86, the stratified microchannel phase change cooling module and the No. 2 chiller 814 are connected in sequence; the power supply device 87 The heat dissipation cover plate 1 of the phase change cooling module is heated, the liquid storage tank 81 is used for supplying and recovering the cooling medium of the flow circuit, the filter 82 and the magnetic coupling gear pump 83 are used for filtering impurities in the flow circuit and controlling the supply flow of the cooling medium respectively; the flow meter 84 is used to monitor the supply flow of the cooling medium; the No. 1 chiller 85 is used to control the initial temperature of the cooling medium entering the cooling module; the one-way valve 86 is used to control the flow and stop of the cooling medium; the No. 2 chiller 814 is used to cool the heated cooling medium flowing out of the layered microchannel phase change cooling module;

[0051] The first pressure sensor 88 and the second pressure sensor 813 are respectively used to measure the liquid inlet pressure and the liquid outlet pressure of the layered microchannel phase change cooling module; the first temperature sensor 89, the second temperature sensor 810, the third temperature sensor 811 and the fourth temperature sensor 812 arranged on the heat dissipation cover plate of the layered microchannel phase change cooling module are respectively used to measure the temperature distribution on the heat dissipation cover plate 1 of the layered microchannel phase change cooling module; the data acquisition system 815 receives the signal of the sensor system, and the computer 816 is used to process the data signal and obtain the measurement data.

[0052] The working principle of the heat dissipation system is: using a visual data monitoring and control method as a control method for controlling the magnetic coupling gear pump 83, the No. 1 chiller 85, the No. 2 chiller 814, the one-way valve 86 and the power supply device 87, that is, first turning on the switches of the magnetic coupling gear pump 83, the No. 1 chiller 85, the No. 2 chiller 814 and the one-way valve 86, so that the refrigerant in the flow circuit is in a circulating flow state, and the value changes of each sensor are monitored by a computer and the threshold parameters for safe operation are set; then the control switch of the power supply device 87 is turned on to heat the heat dissipation cover of the cooling module in steps, gradually increase the heating power, monitor the data changes, and adjust the working fluid flow, cooling temperature and heating power in real time according to the threshold parameters.

[0053] The performance of the layered microchannel phase change cooling module is described below.

[0054] Simulation conditions: The microchannel phase change cooling modules are all made of copper, and the cooling medium is deionized water. The inlet conditions are: the flow rate and temperature of the cooling medium inlet are 0.6L / min and 20℃ respectively. The outlet conditions are: the pressure outlet, the pressure value is standard atmospheric pressure. Heating device: The upper cover of the phase change cooling module is close to a heat source with a size of 30mm×30mm×80mm, and the heat source heating power is 2000W.

[0055] Simulation results: The velocity distribution in the microchannel is shown in Fig.11 As shown in Figure 1, the flow rate difference between adjacent channels is less than 7%, so the flow velocity distribution in the channel is uniform. The surface temperature distribution of the heat dissipation cover 1 is shown in Figure 1. Fig.12 As shown, the peak temperature of the heat dissipation cover plate 1 is 109.5°C, the lowest temperature is 104.6°C, and under the condition of high heating power, the maximum temperature difference of the upper cover plate is only 4.9°C. In summary, the use of layered microchannel phase change cooling module can significantly improve the heat dissipation efficiency, and the flow velocity distribution in the channel is uniform, and the temperature difference of the heat dissipation cover plate is small.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A hierarchical microchannel phase change cooling module for electronic devices, characterized in that: It comprises a heat dissipation cover plate (1), a microchannel layer (2), an upper manifold flow-dividing layer (3), a lower manifold flow-dividing layer (4), a liquid supply pool layer (5), a liquid collection pool layer (6), and a liquid inlet and outlet base (7); The microchannel layer (2) has a plurality of parallel rectangular microchannels (21) evenly arranged in the layer; The upper manifold flow-dividing layer (3) is provided with a second liquid inlet flow-dividing channel (31) and a first liquid outlet flow-dividing channel (32); the cooling medium flows into the rectangular microchannel (21) through the second liquid inlet flow-dividing channel (31), thereby cooling the heat source of the electronic device connected to the heat dissipation cover plate (1); the cooling medium flowing through the rectangular microchannel (21) flows out downwards through the first liquid outlet flow-dividing channel (32); The lower manifold flow diversion layer (4) is provided with a first liquid inlet flow diversion channel (41) and a second liquid outlet flow diversion channel (42); the first liquid inlet flow diversion channel (41) and the second liquid outlet flow diversion channel (42) are respectively rectangular and trapezoidal in height direction; the first liquid inlet flow diversion channel (41) and the second liquid outlet flow diversion channel (42) are respectively connected to the second liquid inlet flow diversion channel (31) and the first liquid outlet flow diversion channel (32) in the upper manifold flow diversion layer (3); The liquid supply pool layer (5) is provided with a third liquid inlet (51), a liquid supply pool (52) and a third liquid outlet shunt channel (53); the third liquid inlet (51) and the I-shaped liquid supply pool (52) are connected to each other, and the cooling medium is transported to the first liquid inlet shunt channel (41) in the lower manifold shunt layer (4) via the liquid supply pool (52); the third liquid outlet shunt channel (53) is connected to the second liquid outlet shunt channel (42); The liquid collecting pool layer (6) is provided with a second liquid inlet (61) and a first liquid collecting pool (62); the second liquid inlet (61) is in communication with the third liquid inlet (51); the first liquid collecting pool (62) is arranged in a stepped manner and is used to recover the cooling medium flowing through the third liquid outlet shunt channel (53); A first liquid inlet (71), a second liquid collecting pool (72) and a liquid outlet (73) are provided in the layer of the liquid inlet and outlet base (7); the first liquid inlet (71) provides cooling medium and is connected to the second liquid inlet (61); the second liquid collecting pool (72) is rectangular and is connected to the first liquid collecting pool (62); the liquid outlet (73) is located at the bottom center of the second liquid collecting pool (72) and is used to discharge the heated cooling medium.

2. A cooling system based on the layered microchannel phase change cooling module according to claim 1, characterized in that: The invention comprises the stratified microchannel phase change cooling module, a liquid storage tank (81), a filter (82), a magnetic coupling gear pump (83), a flow meter (84), a first chiller (85), a one-way valve (86), a power supply device (87), a sensor system, a second chiller (814), a data acquisition system (815) and a computer (816), wherein the first liquid inlet (71) of the stratified microchannel phase change cooling module is connected to the one-way valve (86), and the liquid outlet (73) is connected to the second chiller (814), and is used to cool the heated cooling medium flowing out of the stratified microchannel phase change cooling module.

3. The cooling system of the layered microchannel phase change cooling module according to claim 2 is characterized in that: The sensor system comprises a first pressure sensor (88) arranged between the first liquid inlet (71) and the one-way valve (86), and a second pressure sensor (813) arranged between the liquid outlet (73) and the second chiller (814).

4. The cooling system of the layered microchannel phase change cooling module according to claim 3 is characterized in that: The sensor system further comprises a first temperature sensor (89), a second temperature sensor (810), a third temperature sensor (811) and a fourth temperature sensor (812) arranged on the layered microchannel phase change cooling module heat dissipation cover plate (1); the data acquisition system (815) is used to receive signals from the sensor system, and the computer (816) is used to process data signals.

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