A SOP300mil 8L isolation structure frame package

Abstract

The invention provides an isolation structure frame package of SOP300mil 8L, comprising a SOP300mil8L lead frame unit; 140 lead frame units are arranged in a matrix on the SOP300mil 8L lead frame unit; every two lead frame units form a group in the horizontal direction, a flushing channel groove is provided between the two lead frame units in each group, internal force elimination grooves are provided on both sides of each group of lead frame units in the horizontal direction, and process grooves are provided on both sides of each group of lead frame units in the vertical direction; the lead frame unit comprises a first base island and a second base island arranged in sequence from top to bottom, and inner pins are used for electrical connection; first base island coplanarity balancing platforms are provided on both sides of the first base island, and second base island coplanarity balancing platforms are provided on both sides of the second base island; base island support ribs are provided on the first base island and the second base island; an IC chip, a first digital isolation chip and a second digital isolation chip are installed in a chip mounting area, and a plastic package is coated on the outside of the first base island and the second base island.

Description

Technical Field

[0001] The invention belongs to the field of integrated circuit packaging applications, and in particular belongs to an isolation structure frame packaging component of SOP300mil 8L. Background Art

[0002] The production of integrated circuit devices has evolved from the production of transistors of a single component to the large-scale and ultra-large-scale integration of multiple components. The integration of integrated circuits has become increasingly higher, and the functions have become increasingly complex. Correspondingly, semiconductor packaging has gradually developed and changed in the direction of high integration, high performance, high reliability, small size, low cost, and multi-chip combination. The semiconductor packaging density is getting higher and higher, the volume is getting smaller, the weight is getting lighter, and the cost is getting lower. From the perspective of packaging development, under the consideration of the characteristics of electronic products such as volume, processing speed, and product isolation, semiconductor packaging has gradually developed towards isolator product packaging.

[0003] Traditional isolators mostly use optocoupler isolators, but with the continuous advancement of CMOS technology, digital isolation technology has begun to advance in great strides and has gradually been recognized by the market; digital isolators also have the advantages of lower noise and electromagnetic interference (EMI), higher safety and longer service life, easier integration of peripheral components, and can significantly reduce system footprint and bill of materials costs. Therefore, digital isolator products will occupy an important position in the overall isolation market in the future.

[0004] At present, the existing SOP300mil 8L products have problems of low production efficiency, high product packaging costs caused by lead frame density production, lead frame material utilization and production process flow. Summary of the invention

[0005] In order to solve the problems existing in the prior art, the present invention provides a SOP300mil 8L isolation structure frame package, which can improve product production efficiency, innovate lead frame density production and lead frame material utilization rate and production process flow, reduce product packaging costs, and improve product quality and reliability.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A SOP300mil 8L isolation structure frame package, comprising a SOP300mil 8L lead frame unit;

[0008] The SOP300mil 8L lead frame unit has 140 lead frame units arranged in a matrix;

[0009] Every two lead frame units form a group in the horizontal direction. A flushing channel groove is provided between the two lead frame units in each group. Internal force elimination grooves are provided on both sides of each group of lead frame units in the horizontal direction. Process grooves are provided on both sides of each group of lead frame units in the vertical direction. Internal force elimination grooves are provided between every four groups of lead frame units in the horizontal direction.

[0010] The lead frame unit comprises a first base island and a second base island arranged in sequence from top to bottom, and the first base island and the second base island are both provided with inner pins for electrical connection; first base island coplanarity balancing platforms are provided on both sides of the first base island, and second base island coplanarity balancing platforms are provided on both sides of the second base island; base island support ribs are provided on the first base island and the second base island; base island electroplating silver layers are provided on the first base island and the second base island, and inner pin electroplating silver layers are provided on the inner pins, and the corresponding base island electroplating silver layers and inner pin electroplating silver layers are connected by welding wires; base island locking holes are provided on the first base island and the second base island;

[0011] The middle area of ​​the first base island and the second base island is a chip mounting area, and the IC chip, the first digital isolation chip and the second digital isolation chip are mounted in the chip mounting area; the IC chip, the first digital isolation chip and the second digital isolation chip are electrically connected to the corresponding inner pins through interconnection welding wires, and the number of interconnection welding wires ranges from one to four;

[0012] The IC chip, the first digital isolation chip, the second digital isolation chip, and the first base island and the second base island are externally covered with a plastic package.

[0013] Preferably, the inner pin is in the shape of a snake head, a horseshoe, an L shape, a T shape, a duckbill shape, a long strip shape or a shovel shape.

[0014] Preferably, the inner pins are all provided with inner pin locking holes, and the inner pin locking holes include circular locking holes, small elliptical locking holes and large elliptical locking holes.

[0015] Preferably, the base island locking hole includes a circular locking hole, an elliptical locking hole, a concave locking hole and an inverted locking hole.

[0016] Preferably, the overall size of the SOP300mil 8L lead frame unit is 269.6000×83.0000×0.2540mm.

[0017] Preferably, an anti-reverse hole is provided on the top of the SOP300mil 8L lead frame unit.

[0018] Preferably, the distance from the positioning hole to the corner notch of the lead frame sheet is 7.0200 mm at the beginning and 11.8800 mm at the end.

[0019] Preferably, the IC chip, the first digital isolation chip and the second digital isolation chip are mounted on the chip mounting area by chip bonding adhesive.

[0020] Preferably, the base island support rib is in a trapezoidal structure, and a back U-shaped groove or a back V-shaped groove is provided on the back of the base island support rib.

[0021] Preferably, the bonding wire is a gold wire, a copper wire or a silver alloy wire.

[0022] Compared with the prior art, the present invention has the following beneficial technical effects:

[0023] The present invention provides an isolation structure frame package of SOP300mil 8L. By bonding digital isolation chips and IC chips with different functions on different base islands of a lead frame unit, using gold wires, copper wires or silver alloy wires to perform chip and ground wire isolation islands and inner pin bonding, the length of the bonding wires after bonding is shorter, so that the resistance of the SOP300mil 8L package product is smaller, the on-current is increased, the heat generation of the product is reduced, and the electrical signal suppression capability of the product is improved. At the same time, by increasing the number of interconnection welding wires between chips, the product performance requirements of the interconnection channels of the SOP300mil 8L package product from one channel to three channels and the matching of multi-channel product operation are realized, thereby meeting the packaging requirements of the product outputting a larger current, improving the application performance and use range of the SOP300mil 8L package product, and also reducing the packaging cost of the SOP300mil 8L product.

[0024] The SOP300mil 8L multi-base island isolation structure lead frame package of the present invention can ensure the coplanarity of the base island of the lead frame by setting a base island coplanarity balancing platform and a base island supporting rib structure, so that the deformation of the lead frame in production, delivery and transportation can be controlled, and the process stability of the product at the bonding and wire welding stations is guaranteed, so that the product quality is guaranteed.

[0025] Compared with the existing SOP150mil8L base island isolation lead frame, the SOP300mil 8L multi-base island isolation structure lead frame of the present invention has a large base island area, a large range of adjustable isolation spacing between base islands, and a high encapsulation strength of the product. At the same time, it can carry multiple chips with different functions or larger-sized chips. The product has a wide range of uses; it can greatly improve the production efficiency of existing products, save a lot of manpower and material resources, and the SOP300mil 8L product has a small colloid size and a high material utilization rate of the entire product.

[0026] Furthermore, a locking hole is designed on the inner pin connected to the base island, and the plastic sealing material passes through the locking hole during plastic sealing, which can ensure that the plastic sealing body and the base island are firmly combined and prevent moisture from penetrating into the carrier, thereby improving product reliability.

[0027] Furthermore, by designing a special isolation structure for the base island ground wire area, the base island ground wire is designed to be an isolated island shape, and at the same time, corresponding "C"-shaped, "L"-shaped, "concave"-shaped, "inverted"-shaped and long elliptical hole-shaped locking hole structures are added to the ground wire base island area. Only the areas on the entire lead frame base island structure that require wire welding are electroplated with silver, and the bare copper in the remaining areas is roughened. In this way, the safety of the base island ground wire welding is guaranteed while the quality and reliability of the product are guaranteed.

[0028] Furthermore, by setting the base island support rib structure located near the plastic package body to a trapezoidal shape and adding a "U" groove or a "V" groove on its back, the problems of product creepage, product high-voltage discharge and product abnormality on the middle rib are completely solved, while also improving product quality and reliability, so that the product has greater advantages in terms of low cost, high cost performance, and usage, and has broader market application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the matrix structure of the SOP300mil 8L lead frame of the present invention;

[0030] Figure 2 This is a schematic diagram of the SOP300mil 8L lead frame unit structure of the present invention;

[0031] Figure 3 This is a second schematic diagram of the SOP300mil 8L lead frame unit structure of the present invention;

[0032] Figure 4 The third schematic diagram of the SOP300mil 8L lead frame unit structure of the present invention;

[0033] Figure 5 This is a fourth schematic diagram of the SOP300mil 8L lead frame unit structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the SOP300mil 8L lead frame unit structure of the present invention;

[0035] Figure 7 This is a schematic diagram of a silver-plated layer of a SOP300mil 8L lead frame unit structure of the present invention;

[0036] Figure 8 This is a schematic diagram of the second electroplated silver layer of the SOP300mil 8L lead frame unit structure of the present invention;

[0037] Fig. 9 This is a schematic diagram of the three-electroplated silver layers of the SOP300mil 8L lead frame unit structure of the present invention;

[0038] Fig.10 It is a schematic diagram of four silver-plated layers of the SOP300mil 8L lead frame unit structure of the present invention;

[0039] Fig.11 It is a schematic diagram of five electroplated silver layers of the SOP300mil 8L lead frame unit structure of the present invention;

[0040] Fig.12 This is a schematic diagram of a chip bonding of a SOP300mil 8L package of the present invention;

[0041] Fig.13 This is a schematic diagram of two-chip bonding of the SOP300mil 8L package of the present invention;

[0042] Fig.14 This is a schematic diagram of three-chip bonding of the SOP300mil 8L package of the present invention;

[0043] Fig.15 This is a schematic diagram of four-chip bonding of the SOP300mil 8L package of the present invention;

[0044] Fig.16 This is a schematic diagram of five-chip bonding of the SOP300mil 8L package of the present invention;

[0045] Fig.17 This is a schematic diagram of a wire bonding of a SOP300mil 8L lead frame package of the present invention;

[0046] Fig.18 It is a schematic diagram of two bonding wires of the SOP300mil 8L lead frame package of the present invention;

[0047] Fig.19 This is a schematic diagram of three welding wires of the SOP300mil 8L lead frame package of the present invention;

[0048] Fig. 20 This is a schematic diagram of four bonding wires of the SOP300mil 8L lead frame package of the present invention;

[0049] Fig.21 It is a schematic diagram of five bonding wires of the SOP300mil 8L lead frame package of the present invention;

[0050] Fig. 22 This is a diagram of the back structure of the SOP300mil 8L base island support ribs and a diagram of the back dimples of the base island of the present invention;

[0051] Fig.23 This is a schematic diagram of the wire bonding method of the digital isolation chip interconnection wires of the SOP300mil 8L package of the present invention;

[0052] Fig.24This is the process flow chart of SOP300mil 8L of the present invention.

[0053] In the attached figure: 1 is the SOW8L lead frame unit; 2 is the flushing channel groove; 3 is the internal force elimination groove; 4 is the process groove; 5 is the anti-reverse hole; 6 is the plastic package; 7 is the IC chip; 8 is the first digital isolation chip; 9 is the second digital isolation chip; 10 is the chip adhesive; 11 is the first solder joint; 11-1 is the second solder joint; 12 is the first inflection point; 13 is the second inflection point; 14 is the length of the digital isolation chip interconnection line platform; 15 is the first base island; 16 is the second base island; 17 is the coplanarity of the first base island 18 is the coplanarity balancing platform of the second base island; 19 is the ground wire isolation island of the first base island; 20 is the ground wire isolation island of the second base island; 21 is the base island isolation spacing; 22 is the inner pin; 23 is the inner pin locking hole; 24 is the base island locking hole; 25 is the inner pin electroplating silver layer; 26 is the base island electroplating silver layer; 27 is the first welding wire; 28 is the second welding wire; 29 is the third welding wire; 30 is the base island supporting rib; 31 is the back U-shaped groove; 32 is the back V-shaped groove; 33 is the back dimple of the base island. DETAILED DESCRIPTION

[0054] The present invention is further described in detail below in conjunction with specific embodiments, which are intended to explain the present invention rather than to limit it.

[0055] The present invention discloses a multi-base island isolation structure lead frame which can significantly shorten the length of the welding wire between the chip and the inner pins, realize the functions of the existing SOP300mil18L product, and at the same time has a SOP300mil8L small wide body with a small product area and a small number of external pins. The design scheme solves the product quality problems caused by creepage and base island support rib structure of high-voltage isolation products.

[0056] The present invention develops a novel SOP300mil 8L small wide body multi-island isolation lead frame by adopting a matrix lead frame design scheme, thereby improving the utilization rate of the lead frame so that it has a higher number of rows and a lead frame structure and size that better meets product requirements.

[0057] The present invention develops a new ground wire base island isolation structure, a unit base island-free rib connection structure, an inner pin locking structure, a base island locking structure, a base island coplanarity balancing platform structure, a "U"-shaped groove or "V"-shaped groove structure on the back of the base island support rib, and a SOP300mil 8L small wide body package body carrying chips with different functions, aiming at a SOP300mil 8L small wide body multi-base island isolation lead frame, so as to realize complex IC functions, expand the original SOP150mil 8L multi-base island isolation structure lead frame design, and use the lead frame as a carrier to adopt a 2D packaging structure to seal isolation chips of different functions and sizes (some products are equipped with IC chips) together. The product manufacturing process and production method.

[0058] Figure 1 The SOP300mil 8L lead frame of the structure includes a plurality of lead frame units arranged in a matrix type with high density and a one-fill-two structure for multi-row multi-island multi-chip packaging.

[0059] SOP300mil 8L lead frame: 5 rows and 28 columns each, a total of 140 lead unit frames, frame dimensions length × width × thickness: 269.6000 × 83.0000 × 0.2540mm, large unit pitch: 38.6000mm, small unit pitch: 19.3000mm, cumulative unit pitch: 250.9000mm, center distance between two plastic packaging bodies: 7.4000mm, distance from positioning hole to lead frame corner cut, starting end 7.0200mm, end end 11.8800mm.

[0060] SOP300mil 8L small wide body isolation multi-island structure lead frame is used to electrically connect IC chips, digital isolation chips and external pins. The lead frame includes a number of one-fill-two structure lead frame units arranged in a matrix; every two lead frame units are a group in the horizontal direction, and a flushing channel groove is provided between each group of lead frame units, and an internal force elimination groove is provided between every two groups of lead frame units in the horizontal direction.

[0061] The SOP300mil 8L small wide body isolated multi-island lead frame unit vertically includes a first base island and a second base island arranged in sequence from top to bottom. The first base island and the second base island of the lead frame are a group, and an internal force elimination groove is provided between each group of lead frame units; vertically, each group of lead frame units is provided with left (upper left, upper right) and right (lower left, lower right) two groups of process grooves and an internal force elimination groove is provided at the upper and lower ends.

[0062] The SOP300mil 8L small wide body isolated multi-base island lead frame unit arranges the first base island and the second base island from top to bottom, the SOP300mil 8L lead frame has 8 inner pins on the upper and lower sides of the first base island and the second base island, and 2 base island support ribs, wherein the inner pin heads of the lead frame, as well as the first base island and the second base island (partial area) are all provided with an electroplated silver layer.

[0063] Circular locking holes are set on the eight inner pins on both sides of the SOP300mil 8L lead frame unit, among which the two inner pins on the upper right and lower right are respectively connected to the corresponding base islands on the SOP300mil 8L;

[0064] Each base island support rib on the SOP300mil8L lead frame unit is connected to the corresponding base island on each lead frame unit; Fig. 20In addition to the base island coplanarity balancing platforms on the left and right areas of the first base island of the lead frame structure unit, each SOP300mil 8L lead frame unit is only provided with base island coplanarity balancing platforms in the first base island and the left area of ​​the second base island respectively. The upper and lower base islands (partial areas) are respectively provided with circular, small elliptical, large elliptical, "C"-shaped, "concave" and "inverted" locking holes, and the base island ground wire isolates the island.

[0065] The middle area of ​​the first base island and the second base island of the SOP300mil 8L multi-base island lead frame unit is the chip mounting area. The first base island is connected to the lead frame through a group of process grooves on the upper left and upper right and an internal force elimination groove at the upper end. The second base island is connected to the lead frame through a group of process grooves on the lower left and lower right and an internal force elimination groove at the lower end. The entire lead frame unit has no base island connecting rib structure design. The back of the first base island and the second base island are respectively provided with a base island back dimple structure, and the entire lead frame is roughened, thereby providing safety protection for product quality and reliability.

[0066] The top of the SOP300mil 8L lead frame body is equipped with anti-reverse holes at the corresponding positions of each lead frame unit to prevent the lead frame from being mixed or reversed during production, which would cause the packaged products to be scrapped.

[0067] The SOP300mil 8L package of the multi-island isolation structure lead frame of the present invention comprises the above-mentioned SOP300mil8L lead frame unit, the SOP300mil8L first digital isolation chip and the second digital isolation chip, and the IC chip. The first digital isolation chip and the second digital isolation chip are respectively bonded to the chip mounting area in the middle area of ​​the first base island and the second base island of the SOP300mil8L, and the IC chip is respectively bonded to the chip mounting area in the upper center area of ​​the first base island of the SOP300mil8L; the first surfaces of the first digital isolation chip, the second digital isolation chip and the IC chip are interconnected by corresponding interconnecting welding wires, and are connected to the corresponding lead frame inner pins or the base island area electroplated silver layer through the inner pin welding wires and the base island welding wires, thereby realizing the product electrical connection of the SOP300mil8 lead frame package, and the second surfaces of the SOP300mil8L package lead frame unit, the first digital isolation chip, the second digital isolation chip and the IC chip are externally coated with a plastic package body.

[0068] The SOP300mil 8L multi-base island isolation structure lead frame of the present invention designs the inner pins located at one end of the lead frame unit into a "snake head" shape, a "horseshoe" shape, an "L" shape, a "T" shape, a "duckbill" shape (with a circular locking hole arranged thereon) or a "long strip" shape, a "shovel" shape (connected to the base island). On the one hand, the plastic encapsulation material can firmly fix the inner pins, reduce the stress caused by thermal expansion that causes the inner pins to move, and prevent the inner pins from being pulled out of the plastic encapsulation body when the outer pins are punched and formed in the rib cutting molding mold, thereby preventing the product colloid from being damaged, greatly improving the encapsulation and reliability of the product; on the other hand, the bonding force between the lead frame copper alloy substrate and the plastic encapsulation material is strengthened, and the sealing and waterproof and moisture-proof performance of the SOP300mil 8L lead frame package product is improved.

[0069] The SOP300mil 8L multi-island isolation structure lead frame package of the present invention adheres digital isolation chips and IC chips with different functions to different islands of the lead frame unit, uses gold wire, copper wire or silver alloy wire to perform chip and ground isolation island and inner pin bonding, and the length of the bonding wire after bonding is shorter, so that the resistance of the SOP300mil 8L package product is smaller, the on-current is increased, the product heat generation is reduced, and the product electrical signal suppression capability is improved. At the same time, by increasing the number of interconnection welding wires between chips, the product performance requirements of the SOP300mil8L package product interconnection channels from one channel to three channels and the matching of multi-channel product operations are achieved, thereby meeting the packaging requirements of the product outputting a larger current, improving the application performance and use range of the SOP300mil 8L package product, and also reducing the packaging cost of the SOP300mil 8L product.

[0070] The SOP300mil 8L multi-island isolation structure lead frame seal of the present invention has a locking hole designed on the inner pin connected to the base island. During plastic sealing, the plastic sealing material passes through the locking hole, which can ensure that the plastic sealing body and the base island are firmly combined and prevent moisture from penetrating into the carrier, thereby improving product reliability.

[0071] The SOP300mil 8L multi-base island isolation structure lead frame package of the present invention has a special isolation structure design for the base island ground wire area. The base island ground wire is designed to be an isolated island shape, and corresponding "C"-shaped, "L"-shaped, "concave"-shaped, "inverted"-shaped and long elliptical hole-shaped locking hole structures are added to the ground wire base island area. Only the area where the welding wire is required on the entire lead frame base island structure is subjected to electroplating silver layer treatment, and the bare copper in the remaining area is roughened. In this way, the safety of the base island ground wire welding is guaranteed, and the quality and reliability of the product are guaranteed at the same time.

[0072] The SOP300mil 8L multi-base island isolation structure lead frame seal of the present invention has base island coplanarity balancing platforms respectively arranged on the left and right side areas of the first base island and the second base island in the horizontal direction of the lead frame, and base island support rib structures are respectively arranged on the upper and lower corresponding areas of the first base island and the second base island in the longitudinal direction of the lead frame. This structure not only ensures the coplanarity of the lead frame base islands, so that the deformation of the lead frame in production, delivery and transportation can be controlled, but also ensures the process stability of the product at the bonding and wire welding stations, so that the product quality is guaranteed.

[0073] The SOP300mil 8L multi-base island isolation structure lead frame of the present invention has a large base island area, a large range of adjustable isolation spacing between base islands, a high encapsulation strength of the product, and can carry multiple chips with different functions or larger chips at the same time, and the product has a wide range of uses; it can greatly improve the production efficiency of existing products, save a lot of manpower and material resources, and the colloid size of the SOP300mil 8L product is small, and the material utilization rate of the whole product is high. At the same time, the SOP300mil 8L multi-base island lead frame structure design is optimized and innovated, the base island left and right sides are kept without the base island connecting rib structure design, and the base island base island support rib structure located near the plastic package body is set to a trapezoid, and a "U" groove or "V" groove is added on its back, so as to completely solve the product creepage, product high-voltage discharge and product abnormality problems of the middle rib upper belt, and also improve the product quality and reliability, so that the product has greater advantages in terms of low cost, high cost performance, and use, and a broader market application prospect. The comparison of lead frame related dimensions is shown in Table 1.

[0074] Table 1 Comparison of dimensions of the frame of the present invention and existing frames

[0075]

[0076] Example

[0077] like Figure 1 As shown, a SOP300mil 8L isolation structure frame package of the present invention is used for a digital isolation chip, and the IC chip is electrically connected to an external pin; the SOP300mil 8L multi-island isolation lead frame includes 5 rows and 28 columns, a total of 140 lead frame units.

[0078] like Figures 2 to 12 As shown, each group of lead frame units 1 on the top of the SOP300mil 8L multi-base island isolation structure lead frame body is provided with an anti-reverse hole 5 at the corresponding position, and each two lead frame base islands are grouped in the longitudinal direction to form a complete lead frame base island structure unit. Figure 2 , Figure 3 , Figure 4, Figure 5 , Figure 6 A rectangular internal force elimination groove 3 is provided between each lead frame unit, a flushing channel groove 2 is provided between each group of lead frame units, an internal force elimination groove 3 is provided between every two groups of lead frame units 1 laterally, and process grooves 4 and internal force elimination grooves 3 with the same structure are provided on both sides of the upper and lower pins of each group of lead frame units.

[0079] The lead frame unit 1 includes a first base island 15 and a second base island 16 arranged in sequence from top to bottom, and inner pins 22 in the shape of a "snake head", "horseshoe", "L", "T", "strip", and "shovel" are distributed on the upper side of the first base island 15. Inner pin locking holes 23 are provided on the inner pins 22, and the inner pin locking holes include circular locking holes, small elliptical locking holes, and large elliptical locking holes. The base island support rib 30 connected to the frame base island, the base island support rib 30 located next to the plastic package body 6 is set to a trapezoidal shape at the head, and a "U" groove 31 or a "V" groove 32 is added to the back thereof;

[0080] The connection relationship between the inner pin 22 and the first base island 15 is as follows: Figures 2 to 6 As shown, the connection relationship between the inner pin 22 and the first base island 16 is as follows Figures 2 to 6 As shown; the lower side of the second base island 16 is distributed with inner pins 22 in "T" shape, "L" shape, "snake head" shape, "strip" shape, "horseshoe" shape, and "shovel" shape, and an inner pin locking hole 23 is set on the inner pin 22, and the inner pin locking hole 23 includes a circular locking hole, a small elliptical locking hole and a large elliptical locking hole.

[0081] like Figure 2 As shown, the right area of ​​the first base island 15 bearing area in the lead frame structure unit is respectively provided with a group of "C"-shaped base island locking holes 24, the first base island ground wire isolation island 19, the first base island ground wire isolation island 19 distributed on the inner pin 22, and the left area is provided with a group of circular base island locking holes 24, the first base island ground wire isolation island 19, and the left area is provided with a first base island coplanarity balancing platform 17; the right area of ​​the second base island bearing area is provided with a group of elliptical base island locking holes 24, the second base island ground wire isolation island 20 distributed on the inner pin, the left area is provided with a group of circular base island locking holes 24, the left area is provided with a second base island coplanarity balancing platform 18, and a base island isolation spacing 21 is set between the first base island 15 and the second base island 16.

[0082] like Figure 3As shown, a group of "concave" shaped base island locking holes 24 are provided in the right area of ​​the bearing area of ​​the first base island 15 in the lead frame structure unit, a first base island ground wire isolation island 19, and a first base island coplanarity balancing platform 17 is provided in the left area, a group of inverted "buckle" shaped base island locking holes 24 are provided in the right area of ​​the bearing area of ​​the second base island 16, a second base island ground wire isolation island 20, and a second base island coplanarity balancing platform 18 is provided in the left area, and a base island isolation distance 21 is set between the first base island 15 and the second base island 16.

[0083] like Figure 4 As shown, in the lead frame structural unit, a first base island ground wire isolation island 19 and an elliptical base island locking hole 24 are arranged on the inner pin 22 connected to the first base island 15, a first base island coplanarity balancing platform 17 is arranged on the left side of the first base island 15, a second base island ground wire isolation island 20 and an elliptical base island locking hole 24 are arranged on the inner pin 22 connected to the second base island 16, a second base island coplanarity balancing platform 18 is arranged in the left area of ​​the second base island bearing area, and a base island isolation distance 21 is arranged between the first base island 15 and the second base island 16.

[0084] like Figure 5 As shown, an elliptical base island locking hole 24 is set in the right area of ​​the bearing area of ​​the first base island 15 in the lead frame structure unit, an elliptical base island locking hole 24 is set in the central area of ​​the bearing area, the inner pin 22 connected to the first base island 15 is provided with a first base island ground wire isolation island 19, an elliptical inner pin locking hole 23, a first base island coplanarity balancing platform 17 is set on the left and right areas of the base island, an elliptical inner pin locking hole 23 and an elliptical base island locking hole 24 are set on the inner pin 22 connected to the second base island 16, a second base island coplanarity balancing platform 18 and an elliptical base island locking hole 24 are set in the left area of ​​the bearing area of ​​the second base island 16, and a base island isolation distance 21 is set between the first base island 15 and the second base island 16;

[0085] like Figure 6 As shown, an elliptical base island locking hole 24 is arranged on the right side of the bearing area of ​​the first base island 15 in the lead frame structure unit, an oblong inner pin locking hole 23 is arranged on the inner pin 22 connected to the first base island 15, an elliptical locking hole 24 is arranged on the left side of the base island, a first base island coplanarity balancing platform 17 is arranged, and an oblong inner pin locking hole 23 and an elliptical base island locking hole 24 are arranged on the inner pin 22 connected to the second base island 16; a second base island coplanarity balancing platform 18 and a base island locking hole 24 are arranged on the left side of the bearing area of ​​the second base island 16, and a base island isolation distance 21 is arranged between the first base island 15 and the second base island 16;

[0086] like Figures 7 to 11As shown, a base island electroplated silver layer 26 is arranged on the ground wire isolation island of the first base island 15 and the second base island 16 and next to the base island locking hole 24, and an inner pin electroplated silver layer 25 is arranged on the inner pin head; the surface of the base island and the other areas of the inner pin is bare copper, and a corresponding base island back dimple structure 33 is arranged on the back; the central area of ​​the first base island 15 and the second base island 16 is the chip mounting area, and the entire lead frame structure is a flat plate structure without bending, and the entire lead frame is treated with a roughening process. Through the above special structural design and combined with the corresponding electroplated silver layer, the coplanarity of the multi-island lead frame, the safety of the base island ground wire and the inner pin welding wire, and the quality and reliability of the product are guaranteed. At the same time, the first base island 15 is connected to the lead frame unit 1 through the process groove 4 and the internal force elimination groove 3 respectively, and the second base island 16 is connected to the lead frame unit 1 through the process groove 4 and the internal force elimination groove 3 respectively. There is no base island connecting rib structure design on the left and right sides of the entire lead frame unit base island; in this way, the packaging process flow and product creepage distance requirements of the SOP300mil 8L multi-base island lead frame package are met.

[0087] like Figures 12 to 21 As shown, a SOP300mil 8L multi-island isolation structure lead frame package includes the above-mentioned lead frame unit 1, an IC chip 7, a first digital isolation chip 8 and a second digital isolation chip 9, according to Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 The chip bonding position in the chip bonding schematic diagram is that the chip bonding glue 10 is sprayed on the chip mounting area in the middle of the first base island 15 and the second base island 16 of the lead frame, and the IC chip 7, the first digital isolation chip 8 and the second digital isolation chip 9 are respectively bonded to the chip mounting area in the middle of the first base island 15 and the second base island 16 of the lead frame; the first surface pad of the IC chip 7 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first bonding wire 27, and is connected to the chip interconnection pad on the first surface of the first digital isolation chip 8 through the second bonding wire 28; the first surface of the first digital isolation chip 8 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first bonding wire 27, and is connected to the chip interconnection pad on the first surface of the first digital isolation chip 8 through the third bonding wire 28. The wire 29 is connected to the base island electroplated silver layer 26 on the first base island ground wire isolation island 19 on the first base island 15, and is connected to the chip interconnection pad on the first surface of the second digital isolation chip 9 through the second welding wire 28. The chip pad on the first surface of the second digital isolation chip 9 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the base island electroplated silver layer 26 next to the base island locking hole 24 on the second base island 16 through the third welding wire 29; the second surface of the lead frame unit 2 and the IC chip 7, the first digital isolation chip 8, and the second digital isolation chip 9 are externally coated with a plastic package 6.

[0088] The first surface pad of the first digital isolation chip 8 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the base island electroplated silver layer 26 on the first base island ground wire isolation island 19 semi-enclosed by the "concave" base island locking hole 24 on the first base island 15 through the third welding wire 29. The chip interconnection pads on the first surface of the first digital isolation chip 8 and the second digital isolation chip 9 are connected through the second welding wire 28. The chip pad on the first surface of the second digital isolation chip 9 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the base island electroplated silver layer 26 on the second base island ground wire isolation island 20 semi-enclosed by the "inverted" base island locking hole 24 on the second base island 16 through the third welding wire 29. The second surfaces of the lead frame unit 3 and the first digital isolation chip 8 and the second digital isolation chip 9 are externally covered with a plastic package 6.

[0089] The first surface pad of the first digital isolation chip 8 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the inner pin electroplated silver layer 25 on the first base island ground wire isolation island 19 on the inner pin 22 through the third welding wire 29. The chip interconnection pads on the first surface of the first digital isolation chip 8 and the second digital isolation chip 9 are connected through the second welding wire 28. The chip pad on the first surface of the second digital isolation chip 9 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and the inner pin electroplated silver layer 25 on the second base island ground wire isolation island 20 on the inner pin 22 is connected through the third welding wire 29. The lead frame unit 4 is externally covered with a plastic package 6 with the second surfaces of the first digital isolation chip 8 and the second digital isolation chip 9.

[0090] The first surface pad of the IC chip 7 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the base island electroplated silver layer 26 on the inner pin 22 through the third welding wire 29. The base island electroplated silver layer 26 on the left side of the elliptical base island locking hole 24 on the first base island 15 is connected. The chip interconnection pad on the first surface of the IC chip 7 is connected to the chip interconnection pad on the first surface of the first digital isolation chip 8 through the second welding wire 28. The first surface of the first digital isolation chip 8 is connected to the base island electroplated silver layer 26 on both sides of the elliptical base island locking hole 24 on the first base island 15 through the third welding wire 29. The first digital isolation chip 8 is connected to the base island electroplated silver layer 26 on both sides of the elliptical base island locking hole 24 on the first base island 15 through the second welding wire 28. The chip interconnect pads on the first surface of the isolation chip 8 are connected to the chip interconnect pads on the first surface of the second digital isolation chip 9, the chip pads on the first surface of the second digital isolation chip 9 are connected to the base island electroplated silver layers 26 on both sides of the elliptical base island locking hole 24 on the second base island 16 through the third welding wire 29, are connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and are connected to the base island electroplated silver layer 26 on the second base island ground wire isolation island 20 on the second base island 16 through the third welding wire 29; the lead frame unit 5 and the second surfaces of the IC chip 7, the first digital isolation chip 8, and the second digital isolation chip 9 are externally covered with a plastic package 6.

[0091] The first surface pad of the first digital isolation chip 8 is connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and is connected to the base island electroplated silver layer 26 on both sides of the elliptical base island locking hole 24 on the first base island 15 through the third welding wire 29. The chip interconnection pads on the first surface of the first digital isolation chip 8 and the second digital isolation chip 9 are connected through the second welding wire 28. The chip pads on the first surface of the second digital isolation chip 9 are connected to the base island electroplated silver layer 26 on both sides of the elliptical base island locking hole 24 on the second base island 16 through the third welding wire 29. The chip pads on the first surface of the second digital isolation chip 9 are connected to the inner pin electroplated silver layer 25 on the inner pin 22 through the first welding wire 27, and are connected to the base island electroplated silver layer 26 on the second base island ground wire isolation island 20 on the second base island 16 through the third welding wire 29; the lead frame unit 6 is externally coated with the plastic package 6 on the second surface of the first digital isolation chip 8 and the second digital isolation chip 9.

[0092] like Fig.23As shown, the SOP300mil 8L multi-island isolation structure lead frame package digital isolation chip interconnect wire bonding method of the present invention, according to the wire diameter requirement of the packaged product, firstly, a solder ball is planted on the pad of the chip first surface interconnect wire of the second digital isolation chip 9, and the solder ball height is controlled to be 5μm±2μm, and then the first solder joint 11 is set on the pad of the chip first surface interconnect wire of the first digital isolation chip 8, and then the first inflection point height 12 of the wire arc is set, so that the wire arc height is controlled between 150μm±30μm, and then the wire platform length 14 is set, so that the wire arc platform length is controlled to be 70% of 1 to 2 times of the SOP300mil8L multi-island isolation structure lead frame base island isolation spacing 21, the second inflection point height 13 of the wire arc is controlled to be between 150μm±30μm, and finally according to the SOP300mil The wire diameter of the 8L multi-island isolated lead frame package product requires setting the second welding point 11-1 of the digital isolation chip interconnection line, and finally forming a complete interconnection line second welding wire 28 after the wire is welded.

[0093] like Fig.24 As shown, the production process flow of the SOP300mil 8L multi-island isolated lead frame multi-chip sealed package of the present invention starts with the inspection of incoming wafers, goes through multiple manufacturing stations such as dicing and thinning, die attaching and wafer bonding, and finally completes product packaging and shipment. The stations to be passed in the middle and the corresponding process flow requirements form a complete production process flow.

[0094] The SOP300mil 8L multi-island isolated lead frame multi-chip package of the present invention has the following production method:

[0095] The first step is to conduct corresponding wafer inspection on the customer's incoming wafers according to the wafer inspection standards and requirements. After completion, the qualified customer wafers will be input to the packaging department's thinning and dicing station; the thinning and dicing station uses a fully automatic placement machine to automatically place the IC chip 7 wafer, the first digital isolation chip 8 wafer, and the second digital isolation chip 9 wafer on the 8-inch or 12-inch film collapse ring respectively; according to SOP300mil The chip thickness of the 8L product is controlled within the packaging thickness requirement of 200μm±10μm. A fully automatic thinning machine is used to thin the wafer of IC chip 7, the wafer of the first digital isolation chip 8, and the wafer of the second digital isolation chip 9 in turn. The wafer is automatically thinned from the incoming material thickness of 725μm±20μm according to the thickness control requirement of 200μm±10μm. Then, a fully automatic chip placement & film removal machine is used to automatically place and remove the film of the thinned IC chip 7, the wafer of the first digital isolation chip 8, and the wafer of the second digital isolation chip 9 in turn. After the placement & film removal is completed, they are placed in an oven at a temperature of 60℃±5℃ and baked for 5mins~10mins; after baking is completed Then, a fully automatic dicing machine is used to cut the wafer of IC chip 7, the wafer of the first digital isolation chip 8, and the wafer of the second digital isolation chip 9 into individual IC chips 7, the first digital isolation chip 8, and the second digital isolation chip 9 respectively; then, a high-pressure air gun is used to blow away the waste residue and water stains on the cut IC chips 7, the first digital isolation chip 8, and the second digital isolation chip 9, and then two-light % inspections are carried out in turn. During the inspection, the IC chips 7, the first digital isolation chip 8, and the second digital isolation chip 9 with product quality defects are marked accordingly so that the later site can accurately identify them during product packaging. After completion, the qualified IC chips 7, the first digital isolation chip 8, and the second digital isolation chip 9 are transported to the chip loading site.

[0096] In the second step, when the product is bonded, the core loading station uses a three-in-a-row or two-in-a-row fully automatic core loading machine with three or two bonding heads to automatically absorb a SOP300mil 8L multi-island isolation lead frame of the present invention and place it on the core loading machine transmission guide rail, and the lead frame is automatically transmitted to the center of the core loading machine workbench through the automatic transmission system of the core loading machine and automatically clamped.

[0097] For the SOP300mil 8L multi-island isolation structure lead frame package, the dispensing robot of the die bonding machine is arranged on the chip mounting area of ​​the first base island 15 and the second base island 16 of the SOP300mil 8L multi-island isolation lead frame unit 2 according to Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16According to the requirements of the bonding position, apply appropriate amount of adhesive in sequence, use a fully automatic die bonding machine with three or two bonding joints, and follow the die bonding procedure set before die bonding. Fig.17 , Fig.18 , Fig.19 , Fig. 20 , Fig.21 The chip bonding requires to sequentially take one of the IC chips 17 through the first bonding joint and place it on the chip bonding glue 10, take one of the first digital isolation chips 8 through the second bonding joint and place it on the chip bonding glue 10, and take one of the second digital isolation chips 9 through the third bonding joint and place it on the chip bonding glue 10. The required number of chip bonding products is completed in this order, and then the core bonding one-time curing process is adopted to bake in the anti-detachment layer of the high-temperature oven to solidify the adhesive, so as to achieve a firm bond between the chip and the lead frame base island. After baking, the product with the core bonded is transported to the pressure welding station for product wire bonding.

[0098] The third step is to perform plasma cleaning on the SOP300mil 8L multi-island isolation structure lead frame package product before the pressure welding wire to clean the pollutants on the multi-island isolation structure lead frame and the IC chip 7, the first digital isolation chip 8 and the second digital isolation chip 9 to improve the product quality and reliability during the product welding wire. Then, use the fully automatic ultrasonic wire bonding machine according to the SOP300mil 8L lead frame package welding wire schematic diagram Fig.17 , Fig.18 , Fig.19 , Fig. 20 , Fig.21 And the related welding wire requirements are to bond the first surface pads of the IC chip 7, the first digital isolation chip 8 and the second digital isolation chip 9 to the pins 22 in the lead frame, the ground isolation island and the electroplated silver layer in the lead frame base island isolation area with corresponding welding wires. In this way, the required number of product welding wires of SOP300mil 8L are completed. After the product welding wires are completed, they pass the three-light % inspection, and the products with quality defects are marked next to the lead frame for easy identification by the back-end site, and then sent to the plastic packaging site for product packaging.

[0099] The fourth step is to perform plasma cleaning on the product before plastic encapsulation to eliminate pollutants on the multi-island isolation structure lead frame and IC chip 7, the first digital isolation chip 8 and the second digital isolation chip 9, oxides and other substances on the lead frame base island, so as to improve the quality and reliability of the encapsulated product. Then, a fully automatic encapsulation machine is used to select plastic encapsulation materials of corresponding specifications to complete the encapsulation of the SOP300mil 8L product, and then the encapsulated SOP300mil 8L product is sent to a post-curing high-temperature oven for curing. The oven temperature is set at 170℃±10℃, and the baking time is controlled at 8h±0.5h. After the SOP300mil 8L product is cured and baked, it is sent to a reflow soldering furnace for a reflow soldering process. The SOP300mil 8L product is selected, and the SOP300mil 8L product with quality abnormalities is selected and marked on the colloid surface of the product so that the post-packaging station can be located at the SOP300mil The 8L lead frame package products are removed during separation. According to this production method, the quality and reliability of the products are guaranteed. After that, the products are sent to the tinning station for product tinning treatment.

[0100] In the fifth step, the SOP300mil 8L lead frame package product completed by the previous station is first treated with a hot boiling softening process to remove overflow, and then subjected to a tinning and post-tinning baking process. After completion, the product is sent to the printing station for product printing.

[0101] In the sixth step, the printing station uses a fully automatic laser printer to print the SOP300mil 8L lead frame package that has been tinned according to the corresponding printing specifications and customer requirements for the product. After completion, the product is sent to the rib cutting station.

[0102] The seventh step is to use the fully automatic rib cutting and forming integrated machine equipment at the rib cutting station, add a pre-cutting station during the operation of the equipment, first use the rib cutting mold to pre-punch the SOP300mil 8L lead frame package product, and punch the base island support rib structure on the lead frame base island from the "U" groove or "V" groove position on its back, and then use the SOP300mil 8L rib cutting mold to perform the product rib cutting process, and then perform the product molding and separation process in four steps. The first step is to pre-form the pins of the SOP300mil 8L lead frame package product, the second step is to form the pins of the product, the third step is to cut off the eight inner pins 22 of the SOP300mil 8L lead frame package product, and the fourth step is to cut off the pins connected to the process groove 4 and the internal force elimination groove 3 of the SOP300mil 8L lead frame package product. In this way, the SOP300mil The 8L lead frame package products are separated, and then baked before packaging to obtain the finished package products. Finally, they are packaged and shipped to complete the packaging of the entire SOP300mil 8L lead frame package product.

[0103] The production method of the SOP150mil8L lead frame package of the present invention adds a second light % inspection process requirement to the scoring site, thereby ensuring the quality and reliability of the products of the scoring site.

[0104] The chip bonding station utilizes a three-in-a-row or two-in-a-row fully automatic chip bonding machine with three or two bonding joints and a one-time curing and baking process, which shortens the time for chip bonding of the product, improves the working efficiency of chip bonding, and reduces the packaging cost of the product. More importantly, the chip bonding station adopts a one-time curing and baking process, which not only solves the problems of contamination and oxidation of the IC chip 7, the first digital isolation chip 8, the second digital isolation chip 9 and the multi-island isolation lead frame caused by chip bonding baking, but also ensures the product quality and reliability after chip bonding.

[0105] Plasma cleaning is used before pressure welding, and three-light inspection is performed after the pressure welding line is completed, which ensures the quality and reliability of the pressure welding station products after welding.

[0106] The plasma cleaning process is used to treat the product after the wire bonding before plastic sealing, which not only eliminates the pollutants of the multi-island isolation lead frame and IC chip 1, the first digital isolation chip 8 and the second digital isolation chip 9, the factors affecting the product quality and reliability, but also provides a strong guarantee for the quality and reliability of the product after plastic sealing. At the same time, a reflow soldering process is added after the product is post-cured, and the tinning adopts the hot boiling softening process treatment requirements, so that the product quality and reliability are fully guaranteed, which is more beneficial to the product quality and reliability.

[0107] The rib cutting station performs a pre-punching action before cutting the center rib, then cuts the center rib, then forms the lead, and finally cuts the lead. This series of process steps not only effectively solves the risk of the base island support rib structure of the multi-island isolation structure lead frame package not being able to be cut off at the rib cutting station, but also meets the process requirements of the rib cutting station products, and meets the process requirements of the special structure design of the multi-island isolation structure lead frame without base island connecting ribs during product rib cutting and forming, and also fully guarantees the product quality and reliability of the rib cutting station.

Claims

1. A SOP300mil 8L isolation structure frame package, characterized in that: Includes SOP300mil 8L lead frame unit (1); The SOP300mil 8L lead frame unit (1) has 140 lead frame units arranged in a matrix; Every two lead frame units form a group in the horizontal direction, a flushing channel groove (2) is provided between the two lead frame units in each group, internal force elimination grooves (3) are provided on both sides of each group of lead frame units in the horizontal direction, and process grooves (4) are provided on both sides of each group of lead frame units in the vertical direction; and internal force elimination grooves (3) are provided between every four groups of lead frame units in the horizontal direction; The lead frame unit comprises a first base island (15) and a second base island (16) arranged in sequence from top to bottom, and the first base island (15) and the second base island (16) are both provided with inner pins (22) for electrical connection; first base island coplanarity balancing platforms (17) are provided on both sides of the first base island (15), and second base island coplanarity balancing platforms (18) are provided on both sides of the second base island (16); base island support ribs (30) are provided on the first base island (15) and the second base island (16); base island electroplated silver layers (26) are provided on the first base island and the second base island, and inner pin electroplated silver layers (25) are provided on the inner pins, and the corresponding base island electroplated silver layers (26) and inner pin electroplated silver layers (25) are connected by welding wires; base island locking holes (24) are provided on the first base island (15) and the second base island (16); The middle areas of the first base island and the second base island are chip mounting areas, and the IC chip (7), the first digital isolation chip (8) and the second digital isolation chip (9) are mounted in the chip mounting areas; the IC chip (7), the first digital isolation chip (8) and the second digital isolation chip (9) are electrically connected to corresponding inner pins (22) via interconnecting welding wires, and the number of interconnecting welding wires ranges from one to four; The IC chip (7), the first digital isolation chip (8) and the second digital isolation chip (9) are externally coated with a plastic package (6) as well as the first base island and the second base island.

2. A SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The inner pin (22) is in the shape of a snake head, a horseshoe, an L, a T, a duckbill, a long strip or a shovel.

3. A SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The inner pins are all provided with inner pin locking holes (23), and the inner pin locking holes (23) include circular locking holes, small elliptical locking holes and large elliptical locking holes.

4. A SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The base island locking hole (24) includes a circular locking hole, an elliptical locking hole, a concave locking hole and an inverted locking hole.

5. A SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The overall dimensions of the SOP300mil 8L lead frame unit (1) are 269.6000×83.0000×0.2540 mm.

6. A SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: An anti-reverse hole (5) is provided on the top of the SOP300mil 8L lead frame unit (1).

7. The SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The distance from the positioning hole to the corner notch of the lead frame is 7.0200mm at the beginning and 11.8800mm at the end.

8. The SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The IC chip (7), the first digital isolation chip (8) and the second digital isolation chip (9) are mounted in the chip mounting area by means of a chip bonding adhesive (10).

9. The SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The base island support rib (30) is in a trapezoidal structure, and a back U-shaped groove (31) or a back V-shaped groove (32) is provided on the back of the base island support rib (30).

10. The SOP300mil 8L isolation structure frame package according to claim 1, characterized in that: The bonding wire is a gold wire, a copper wire or a silver alloy wire.

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