A controllable adhesion device based on shape memory multi-ring suction cup structure and its application

Abstract

The present application discloses a controllable adhesion device based on a shape memory multi-ring suction cup structure and its application. The controllable adhesion device includes a shape memory adhesion foot pad, an arc-shaped hand claw and a connecting arm. The shape memory adhesion foot pad and the arc-shaped hand claw are both hinged to the rotating shaft. The connecting arm is tightly connected to the rotating shaft. A reset mechanism is provided between the shape memory adhesion foot pad and the arc-shaped hand claw. In the initial state, the tip of the arc-shaped hand claw is lower than the shape memory adhesion foot pad. The shape memory adhesion foot pad includes a shape memory polymer adhesion layer, a rigid support layer, and a temperature rise and fall layer. The rigid support layer is connected to the rotating shaft. The bottom surface of the rigid support layer is provided with a shape memory polymer adhesion layer, and the top surface of the rigid support layer is provided with a temperature rise and fall layer. The present invention can realize the functions of controllable adhesion and peeling, can adapt to more complex working environments, and can realize different functions in a series-parallel manner and has a wider range of applications.

Description

Technical Field

[0001] The invention relates to the field of controllable grasping, and in particular to a controllable adhesion device based on a shape memory multi-ring suction cup structure and application thereof. Background Art

[0002] Controllable adhesion devices have good surface adaptability (roughness, surface shape, etc.). In engineering, they have the advantages of low damage, high reliability, and strong adhesion due to their controllable characteristics. However, existing controllable adhesion devices such as friction grip, magnetic adsorption, and vacuum adsorption have limitations in adaptability to the adhesion surface, and have defects such as poor controllability, weak environmental adaptability, and high destructiveness to the adhesion surface. Therefore, it is necessary to design a controllable adhesion device with strong controllability, strong environmental adaptability, and low destructiveness.

[0003] Domestic and foreign research on the adhesion technology of wall-climbing robots and flexible mechanical claws can provide new ideas for the research on the adhesion of flexible adhesive devices. Patent CN108501015A discloses a bionic flexible grasping device with mixed contact of adhesion and claws. Under the action of air pressure, the adhesive material adheres to the target while the claws extend to hook the target. The combination of adhesion and claws can achieve stable adhesion with the target. However, its adhesion device is easy to damage the surface of the grasped object, and its adhesion performance on smooth surfaces is poor. Patent CN215794132A discloses an anti-slip wall-climbing robot with a suction cup. Its suction cup structure can effectively improve the climbing ability of the wall-climbing robot on smooth walls. However, it can only adhere to smooth surfaces, and its adhesion performance on rough surfaces is greatly reduced.

[0004] Shape memory polymer refers to a type of polymer material that has a certain original shape and can automatically return to its original shape and size under specific external conditions (such as heat, electricity, light, magnetism or solution stimulation) after being deformed and fixed. It has a series of excellent properties such as shape deformation and recovery performance and easy driving. The present invention applies shape memory polymer to the adhesive device to solve the problems existing in the prior art. Summary of the invention

[0005] The purpose of the present invention is to provide a controllable adhesion device based on a shape memory multi-ring suction cup structure. The device has the function of achieving controllable adhesion and peeling with surfaces of different roughness in dry and wet environments, has the characteristics of being able to adapt to more complex working environments, and can achieve different functions (grasping, wall climbing, etc.) in series and parallel modes. The controllable adhesion device has a wider range of applications.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical solutions:

[0007] A controllable adhesion machine device based on a shape memory multi-ring suction cup structure comprises: a shape memory adhesion foot pad, an arc-shaped hand claw and a connecting arm, wherein the shape memory adhesion foot pad and the arc-shaped hand claw are both hinged to a rotating shaft, the connecting arm is tightly connected to the rotating shaft, a reset mechanism is arranged between the shape memory adhesion foot pad and the arc-shaped hand claw, in an initial state, the tip of the arc-shaped hand claw is lower than the shape memory adhesion foot pad, the connecting arm rotates to drive the shape memory adhesion foot pad and the arc-shaped hand claw to move, the position of the shape memory adhesion foot pad and the arc-shaped hand claw with respect to the contact surface and the position of the tip of the arc-shaped hand claw relative to the shape memory adhesion foot pad can be adjusted, the shape memory adhesion foot pad comprises a shape memory polymer adhesion layer, a rigid support layer and a temperature rise and fall layer, the rigid support layer is connected to the rotating shaft, the bottom surface of the rigid support layer is provided with a shape memory polymer adhesion layer, and the top surface of the rigid support layer is provided with a temperature rise and fall layer.

[0008] Preferably, the reset mechanism is a torsion spring.

[0009] Preferably, the temperature rise and fall layer includes a temperature rise device and a temperature drop device, the temperature rise device is a ring-shaped resistance wire, the temperature drop device is a semiconductor cooling plate and a heat sink, the resistance wire is arranged below the heat sink, and the semiconductor cooling plate is arranged above the heat sink. More preferably, the semiconductor cooling plate has a cold surface and a hot surface, and the cold surface and the hot surface are tightly connected to the temperature rise device and the heat sink respectively with heat dissipation silicone grease.

[0010] Preferably, the shape memory polymer adhesive layer comprises a shape memory polymer substrate and a shape memory polymer multi-ring suction cup disposed on the substrate surface, and the substrate is fixed to the rigid support layer. More preferably, the multi-ring suction cup is coaxially disposed with a plurality of annular suction cups, and the radius and height of the annular suction cups increase from the central axis to the outside.

[0011] Preferably, the controllable bonding machine device is provided with a rotating timing mechanism, which includes a rotating pointer, a housing with a switch scale, a timing device and a connecting arm control device. The rotating pointer is rigidly connected to the rotating shaft, and the rotating pointer points to the scale on the housing to reflect the rotation angle of the connecting arm.

[0012] Preferably, the shape memory adhesive layer is made of shape memory polymer materials such as epoxy resin, polyurethane and polyamide, and its glass transition temperature is 50°C-70°C.

[0013] A working process of a controllable adhesive device based on a shape memory multi-ring suction cup structure includes the following steps:

[0014] Step 1, initial state stage: the arc-shaped gripper is at a certain angle to the contact surface, the connecting arm maintains a natural angle with the arc-shaped gripper under the action of the torsion spring, and the shape memory adhesive pad remains suspended; the heating device is powered on to heat the shape memory polymer adhesive layer.

[0015] Step 2, contact surface stage: the tip of the arc-shaped gripper touches the contact surface, and the timing device starts the first timing; the timing device feeds back the start timing signal to the connecting arm control device, the connecting arm control device presses down the connecting arm, and the connecting arm starts to rotate together with the rotating axis. When the connecting arm rotates to be perpendicular to the contact surface, the shape memory polymer adhesion layer reaches the glass transition temperature and maintains it, and the stiffness of the shape memory adhesion layer reaches the minimum state; the shape memory polymer adhesion layer is fully contacted and squeezed with the contact surface under the action of the connecting arm and the torsion spring.

[0016] Step 3, controllable adhesion stage: when the shape memory polymer adhesion layer is in complete contact with the rough surface and the connecting arm rotates to be perpendicular to the contact surface, the timing device starts the second timing; the connecting arm control device controls the cooling device to power on and start cooling, and the stiffness of the shape memory adhesion layer increases; the connecting arm control device controls the connecting arm and the central rotation axis to continue rotating. At this stage, the stiffness of the shape memory adhesion layer reaches the maximum state, and the shape memory polymer adhesion layer forms a mechanical interlocking and vacuum adsorption with the contact surface to complete the adhesion with the rough contact surface.

[0017] Step 4, controlled peeling stage: when the connecting arm control device controls the connecting arm and the central rotating axis to continue rotating until they contact the arc-shaped claw, the timing device starts timing for the third time; the timing device feeds back the signal to the connecting arm control device, and the connecting arm control device controls the heating device to power on and heat, and the stiffness of the shape memory polymer adhesion layer decreases; the connecting arm continues to rotate to pry the shape memory foot pad apart from the rough contact surface.

[0018] Step 5, controllable recovery state: when the arc-shaped gripper is separated from the rough surface, the timing device starts the fourth timing, and the timing device feeds back the signal to the connecting arm control device, and the connecting arm control device controls the connecting arm to move upward. Under the action of the torsion spring, each component returns to the initial state, and the heating device is always in the power-on heating state.

[0019] The controllable adhesive machine device based on the shape memory multi-ring suction cup structure detaches from the contact surface and moves to the next target adhesion location, repeating steps one to five to achieve controllable automatic adhesion and peeling.

[0020] The controllable adhesion machine device based on the shape memory multi-ring suction cup structure of the present invention is applied to a wall-climbing robot, a grasping manipulator, etc.

[0021] The present invention has the following beneficial effects:

[0022] (1) The shape memory adhesive foot pad and the arc-shaped gripper are connected by a torsion spring, which has excellent strength and shock resistance. In the initial state, the tip of the arc-shaped gripper is lower than the shape memory adhesive foot pad, and the arc-shaped gripper contacts the contact surface before the shape memory adhesive foot pad. The "lever structure" is used to design the structure of the adhesive device so that the entire device is evenly stressed when adhering to the contact surface.

[0023] (2) Shape memory polymer material is used as the adhesion layer, so that the adhesion effect can be adjusted according to temperature changes. The surface of the shape memory polymer adhesion layer has a multi-ring suction cup structure, which can achieve stable adhesion on different rough contact surfaces, and dust on the contact surface will not adhere to the suction cup, which has a self-cleaning function.

[0024] (3) The shape memory adhesive foot pad adopts a rigid-flexible integrated design (rigid support layer + flexible shape memory adhesive layer). The shape memory adsorption disks are distributed under the shape memory polymer base to achieve smooth grasping and improve grasping force and stability.

[0025] (4) The timing device, the temperature rise and fall device layer, and the connecting arm cooperate to achieve controllable automatic adhesion and peeling.

[0026] (5) The controllable adhesion device based on the shape memory multi-ring suction cup structure has functional expandability. Four controllable adhesion devices based on the shape memory multi-ring suction cup structure can be coordinated to form a wall climbing structure, or three controllable adhesion devices based on the shape memory multi-ring suction cup structure can be coordinated to form a grasping structure. Different coordination methods can also form structures with other functions, which has wide application significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 and Figure 2 It is a three-dimensional diagram of the controllable adhesion device of the present invention.

[0028] Figure 3 It is a rear view of the controllable adhesion device of the present invention.

[0029] Figure 4 It is a side view of the controllable adhesion device of the present invention.

[0030] Figure 5 It is a side sectional view of the controllable adhesion device of the present invention.

[0031] Figure 6 Schematic diagram of removing the arc-shaped claw of the controllable adhesion device of the present invention.

[0032] Figure 7 It is a front cross-sectional view of the controllable adhesion device of the present invention.

[0033] Figure 8 This is an enlarged view of the shape memory adhesion layer.

[0034] Fig. 9 Schematic diagram of shape memory polymer multi-ring suction cup.

[0035] Fig.10 Schematic diagram of the structure of the shape memory adhesive foot pad.

[0036] Fig.11 Schematic diagram of the structure of the curved gripper.

[0037] Fig.12 Schematic diagram of the connecting arm structure.

[0038] Fig.13 Schematic diagram of the heat sink structure.

[0039] Fig.14 Schematic diagram of the resistance wire structure.

[0040] Fig.15 Schematic diagram of the rotary timing switch structure.

[0041] Fig.16 Schematic diagram of different states of the controllable bonding machine during operation.

[0042] Fig.17 This is a schematic diagram of the application of the controllable adhesion device of the present invention in a wall-climbing robot.

[0043] Among them, 1- shape memory adhesive pad, 11- shape memory polymer adhesive layer, 12- rigid support layer, 13- temperature rise and fall layer, 14 axis connection part, 111- shape memory polymer base, 112 shape memory polymer multi-ring suction cup, 131- heating device, 132- cooling device, 1321- semiconductor refrigeration sheet, 1322- heat sink, 13221 bottom, 13222 heat dissipation blade, 2- arc claw, 21 axis connection part, 22- extrusion slope, 23 heat dissipation hole, 24 tip, 3- rotating axis, 4- torsion spring, 5- connecting arm, 51- lower connecting part, 52- upper connecting part, 53- pressing plate, 6- rotating timing mechanism, 61 shell, 62 rotating pointer, 63 timing device, 64 connecting arm control device. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0045] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] A controllable adhesive machine device based on a shape memory multi-ring suction cup structure, such as Figure 1-Figure 5 As shown, it mainly includes: a shape memory adhesive foot pad 1, an arc-shaped hand claw 2, a rotating shaft 3, a connecting arm 5 and a rotating timing mechanism 6. The shape memory adhesive foot pad 1 and the arc-shaped hand claw 2 are both hinged to the rotating shaft 3, and the connecting arm 5 is tightly connected to the rotating shaft 3. In this embodiment, the rotating shaft 3 passes through the shaft connection part 21 on the arc-shaped hand claw 2 and the shaft connection part 14 of the shape memory adhesive foot pad 1 to be rotated and hinged, and the lower connection part 51 of the connecting arm 5 is interference fit with the rotating shaft 3. The upper connection part 52 of the connecting arm 5 is connected to the mechanism for controlling the rotation of the connecting arm 5. A reset mechanism is provided between the shape memory adhesive foot pad 1 and the arc-shaped hand claw 2, and the reset mechanism is preferably a torsion spring 4, which is sleeved on the rotating shaft 3. In the initial state, the tip 24 of the arc-shaped hand gripper (i.e., the free end of the arc-shaped hand gripper 2) is lower than the shape memory adhesive foot pad 1, and the connecting arm 5 rotates to drive the shape memory adhesive foot pad 1 and the arc-shaped hand gripper 2 to move, so that the positions of the shape memory adhesive foot pad 1 and the arc-shaped hand gripper 2 with respect to the contact surface and the position of the tip 24 of the arc-shaped hand gripper relative to the shape memory adhesive foot pad 1 can be adjusted. The position of the tip 24 of the arc-shaped hand gripper can be higher than the position of the shape memory adhesive foot pad 1 (e.g., Figure 4 ), or it may be lower than the position of the shape memory adhesive foot pad 1 (as shown in Figure 5 In this embodiment, the arc-shaped gripper 2 is provided with an extrusion slope 22, and the middle main body of the connecting arm 5 forms a pressing plate 53, which acts on the extrusion slope 22, thereby pressing down the arc-shaped gripper 2. After the connecting arm 5 rotates to release the effect on the extrusion slope 22, the arc-shaped gripper 2 is reset under the action of the reset mechanism.

[0047] The shape memory adhesive foot pad 1 is divided into a shape memory polymer adhesive layer 11, a rigid support layer 12, and a temperature rise and fall layer 13 from bottom to top. The rigid support layer 12 is connected to the rotating shaft 3. The bottom surface of the rigid support layer 12 is provided with a shape memory polymer adhesive layer 11, and the top surface of the rigid support layer 12 is provided with a temperature rise and fall layer 13. The shape memory adhesive layer 11 of this embodiment includes a shape memory polymer substrate 111 and a shape memory polymer multi-ring suction cup 112 structure on the substrate surface. The multi-ring suction cup structure on the substrate surface is periodically arranged and distributed under the shape memory polymer substrate 111, as shown in FIG. Figure 2 The rigid support layer 12 is a heat-conducting rigid material. The temperature rise and fall layer 13 includes a temperature rise device 131 and a temperature fall device 132. The temperature rise device 131 is a ring-shaped resistance wire, and its structure is as follows: Fig.14 As shown, the cooling device 132 is above the heating device 131. The cooling device 132 is a semiconductor cooling plate 1321 and a heat sink 1322, and the heat sink 1322 is a copper heat sink 1322. The heat sink 1322 has a structure as shown in FIG. Fig.13As shown, the bottom 13221 of the heat sink 1322 contacts the semiconductor cooling sheet 1321, and there are multiple heat sink blades 13222. During the cooperation between the arc-shaped gripper 2 and the shape memory adhesive foot pad 1, the heat sink blades 13222 are located in the heat dissipation holes 23 of the arc-shaped gripper 2, and the arc-shaped gripper 2 will not affect the heat dissipation of the heat sink 1322. The semiconductor cooling sheet 1321 has a cold surface and a hot surface to enable heat to be quickly transferred from the cold surface to the hot surface. The cold surface is closely connected to the heating device 131 through heat dissipation silicone grease, and the hot surface is closely connected to the copper heat sink 1322 by heat dissipation silicone grease. The stiffness of the shape memory polymer adhesion layer 11 changes with temperature. When the heating device 131 is powered on for heating, the heat is transferred to the shape memory adhesion layer 11 through the rigid support layer 12, the temperature of the shape memory adhesion layer 11 increases, and the stiffness decreases; the cooling device 132 transfers the heat from the bottom to the top through the semiconductor cooling plate 1321 by passing direct current, and then dissipates the heat through the copper heat sink 1322. The heat can be absorbed by the semiconductor cooling plate 1321 through the rigid support layer 12, the temperature of the shape memory polymer adhesion layer 11 decreases, and the stiffness increases.

[0048] The shape memory adhesive layer 11 can be made of typical shape memory polymer materials such as epoxy resin, polyurethane and polyamide, and the glass transition temperature thereof can be controlled within a range of 50° C. to 70° C. by controlling the material ratio.

[0049] The multi-ring suction cup is coaxially provided with a plurality of annular suction cups, such as Fig. 9 As shown, the radius and height of the annular suction cup increase from the central axis to the outside. The structural size of the multi-ring suction cup is in the micron level to improve the adhesion effect of surfaces with different roughness, and can achieve a certain vacuum adsorption effect. The spacing between the multi-ring suction cups can be adjusted according to the different roughness surfaces.

[0050] The controllable bonding machine device is provided with a rotation timing mechanism 6, which includes a rotation pointer 62, a housing 61 with a switch scale, a timing device 63 and a connecting arm control device 64. The rotation pointer 62 is rigidly connected to the rotating shaft 3, and the rotation pointer 62 points to the scale on the housing 61 to reflect the rotation angle of the connecting arm 5. The timing device 63 can perform signal detection according to the rotation angle, and feed back the timing signal to the connecting arm control device 64. The connecting arm control device 64 controls the temperature rise and fall of the temperature rise and fall layer 13 and the rotation of the connecting arm 5 according to the feedback signal.

[0051] The working process of a controllable adhesive device based on a shape memory multi-ring suction cup structure of the present invention comprises the following steps:

[0052] Step 1: Initial state stage: Fig.16As shown in (a), the arc-shaped gripper 2 is at a certain angle to the contact surface, the connecting arm 5 maintains a natural angle with the arc-shaped gripper 2 under the action of the torsion spring 4, and the shape memory adhesive pad 1 remains suspended; the heating device 131 is powered on to heat the shape memory polymer adhesive layer 11. The stiffness of the shape memory polymer adhesive layer 11 decreases as the temperature increases.

[0053] Step 2: Contact surface stage: Fig.16 As shown in (b), the tip 24 of the arc-shaped gripper 2 touches the contact surface, and the timing device 63 starts the first timing; the timing device 63 feeds back the start timing signal to the connecting arm control device 64, and the connecting arm control device 64 presses down the connecting arm 5, and the connecting arm 5 starts to rotate together with the rotating shaft 3. When the connecting arm 5 rotates to be perpendicular to the contact surface, the shape memory polymer adhesion layer 11 reaches the glass transition temperature and maintains it, and the stiffness of the shape memory adhesion layer 11 reaches the minimum state; the shape memory polymer adhesion layer 11 is fully in contact and extruded with the contact surface under the action of the connecting arm 5 and the torsion spring 4. Since the deformation between the micron-level multi-ring suction cups is not affected, the micron-level multi-ring energy absorption fully conforms to the rough surface and produces a relatively close contact under vacuum adsorption conditions.

[0054] Step 3: Controllable adhesion stage: Fig.16 As shown in (c), when the shape memory polymer adhesion layer 11 is in full contact with the rough surface and the connecting arm 5 rotates to be perpendicular to the contact surface, the timing device 63 starts the second timing; the connecting arm control device 64 controls the cooling device 132 to be powered on and start cooling, and the stiffness of the shape memory adhesion layer 11 increases. The semiconductor cooling plate 1321 in the cooling device 132 has the characteristic of rapid cooling, and can quickly transfer heat from the shape memory adhesion layer 11 to the copper heat sink 1322. The connecting arm control device 64 controls the connecting arm 5 and the central rotating shaft 3 to continue rotating. At this stage, the stiffness of the shape memory adhesion layer 11 reaches the maximum state. The shape memory polymer adhesion layer 11 forms a mechanical interlock and vacuum adsorption with the contact surface, completing the adhesion with the rough contact surface.

[0055] Step 4: Controllable stripping stage: Fig.16 As shown in (d), when the connecting arm control device 64 controls the connecting arm 5 and the central rotating shaft 3 to continue rotating until they contact the arc-shaped gripper 2, the timing device 63 starts timing for the third time; the timing device 63 feeds back the signal to the connecting arm control device 64, and the connecting arm control device 64 controls the heating device 131 to be powered on and heated, and the stiffness of the shape memory polymer adhesion layer 11 is reduced; the connecting arm 5 continues to rotate to pry the shape memory foot pad away from the rough contact surface. When the connecting arm 5 collides with the arc-shaped gripper 2, the arc-shaped gripper 2 and the connecting arm 5 form a lever structure with the tip 24 of the arc-shaped gripper 2 as the fulcrum, and the connecting arm 5 continues to rotate to pry the shape memory foot pad away from the rough contact surface.

[0056] Step 5, controllable recovery state: when the arc-shaped claw 2 is separated from the rough surface, the timing device 63 starts the fourth timing, and the timing device 63 feeds back the signal to the connecting arm control device 64. The connecting arm control device 64 controls the connecting arm 5 to move upward. Under the action of the torsion spring 4, each component returns to the initial state, and the heating device 131 is always in the power-on heating state.

[0057] The controllable adhesive machine device based on the shape memory multi-ring suction cup structure detaches from the contact surface and moves to the next target adhesion location, repeating steps one to five to achieve controllable automatic adhesion and peeling.

[0058] The controllable adhesive device based on the shape memory multi-ring suction cup structure of the present invention is applied to wall climbing robots, grasping manipulators, etc. Fig.17 As shown, four controllable adhesion devices based on shape memory multi-ring suction cup structures can cooperate to form a wall climbing structure.

[0059] The multi-ring suction cup structure based on shape memory polymer of the present invention has good controllability and surface adaptability, and can effectively solve the problems of insufficient controllability of stiffness and deformation, insufficient surface adaptability and the like of controllable adhesion devices in the prior art.

[0060] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A controllable adhesive device based on a shape memory multi-ring suction cup structure, characterized in that: It includes a shape memory adhesive foot pad, an arc-shaped hand claw and a connecting arm. The shape memory adhesive foot pad and the arc-shaped hand claw are both hinged to the rotating shaft. The connecting arm is tightly connected to the rotating shaft. A reset mechanism is provided between the shape memory adhesive foot pad and the arc-shaped hand claw. In the initial state, the tip of the arc-shaped hand claw is lower than the shape memory adhesive foot pad. The rotation of the connecting arm drives the shape memory adhesive foot pad and the arc-shaped hand claw to move. The position of the shape memory adhesive foot pad and the arc-shaped hand claw with the contact surface and the position of the tip of the arc-shaped hand claw relative to the shape memory adhesive foot pad can be adjusted. The shape memory adhesive foot pad includes a shape memory polymer adhesive layer, a rigid support layer and a temperature rise and fall layer. The rigid support layer is connected to the rotating shaft. The bottom surface of the rigid support layer is provided with a shape memory polymer adhesive layer, and the top surface of the rigid support layer is provided with a temperature rise and fall layer.

2. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 1, characterized in that: The reset mechanism is a torsion spring.

3. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 1, characterized in that: The heating and cooling layer includes a heating device and a cooling device. The heating device is a ring-shaped resistance wire, and the cooling device is a semiconductor cooling sheet and a heat sink. The resistance wire is arranged below the heat sink, and the semiconductor cooling sheet is arranged above the heat sink.

4. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 3, characterized in that: The semiconductor refrigeration sheet has a cold surface and a hot surface, and the cold surface and the hot surface are tightly connected with the temperature raising device and the heat sink respectively by heat dissipation silicone grease.

5. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 1, characterized in that: The shape memory polymer adhesion layer comprises a shape memory polymer substrate and a shape memory polymer multi-ring suction cup arranged on the surface of the substrate, and the substrate is fixed to the rigid support layer.

6. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 5, characterized in that: The multi-ring suction cup is coaxially provided with a plurality of annular suction cups, and the radius and height of the annular suction cups increase successively from the central axis to the outer side; the structural size of the multi-ring suction cup is at the micron level.

7. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 1, characterized in that: The shape memory adhesive layer is made of shape memory polymer materials such as epoxy resin, polyurethane and polyamide, and its glass transition temperature is between 50°C and 70°C.

8. The controllable adhesion device based on the shape memory multi-ring suction cup structure according to claim 1, characterized in that: The controllable bonding machine device is provided with a rotating timing mechanism, which includes a rotating pointer, a shell with a switch scale, a timing device and a connecting arm control device. The rotating pointer is rigidly connected to the rotating shaft, and the rotating pointer points to the scale on the shell to reflect the rotation angle of the connecting arm.

9. A working method of a controllable adhesive machine device based on a shape memory multi-ring suction cup structure, using a controllable adhesive machine device based on a shape memory multi-ring suction cup structure, the controllable adhesive machine device based on a shape memory multi-ring suction cup structure comprises a shape memory adhesive foot pad, an arc-shaped hand claw and a connecting arm, the shape memory adhesive foot pad and the arc-shaped hand claw are both hinged to the rotating shaft, the connecting arm is tightly connected to the rotating shaft, a reset mechanism is provided between the shape memory adhesive foot pad and the arc-shaped hand claw, in the initial state, the tip of the arc-shaped hand claw is lower than the shape memory adhesive foot pad, and the connecting arm is connected to the rotating shaft. The rotation of the connecting arm drives the shape memory adhesive foot pad and the arc-shaped hand claw to move, and the position of the shape memory adhesive foot pad and the arc-shaped hand claw with respect to the contact surface and the position of the tip of the arc-shaped hand claw relative to the shape memory adhesive foot pad can be adjusted. The shape memory adhesive foot pad includes a shape memory polymer adhesive layer, a rigid support layer, and a temperature rise and fall layer. The rigid support layer is connected to the rotating shaft, the bottom surface of the rigid support layer is provided with a shape memory polymer adhesive layer, and the upper surface of the rigid support layer is provided with a temperature rise and fall layer; the reset mechanism is a torsion spring; the temperature rise and fall layer includes a heating device and a cooling device. The heating device is a resistance wire distributed in an annular shape, and the cooling device is a semiconductor refrigeration sheet and a heat sink; the resistance wire is arranged below the heat sink, and the semiconductor refrigeration sheet is arranged above the heat sink; the semiconductor refrigeration sheet has a cold surface and a hot surface, and the cold surface and the hot surface are tightly connected to the heating device and the heat sink respectively by heat dissipation silicone grease; the shape memory polymer adhesion layer includes a shape memory polymer substrate and a shape memory polymer multi-ring suction cup arranged on the surface of the substrate, and the substrate is fixed to the rigid support layer; the multi-ring suction cup is coaxially arranged with a plurality of annular suction cups, and the radius and height of the annular suction cup increase from the central axis to the outer side; the structural size of the multi-ring suction cup is in the micron level; the shape memory adhesion layer is made of shape memory polymer materials such as epoxy resin, polyurethane and polyamide, and its glass transition temperature is 50°C~70°C; a rotary timing mechanism is provided on the controllable adhesion machine device, and the rotary timing mechanism includes a rotary pointer, a shell with a switch scale, a timing device and a connecting arm control device, the rotary pointer is rigidly connected to the rotating shaft, and the rotary pointer points to the scale on the shell to reflect the rotation angle of the connecting arm; it is characterized in that: The method comprises the following steps: Step 1, initial state stage: the arc-shaped hand claw forms a certain angle with the contact surface, the connecting arm maintains a natural angle with the arc-shaped hand claw under the action of the torsion spring, and the shape memory adhesive foot pad remains suspended; The heating device is powered on to heat the shape memory polymer adhesion layer; Step 2, contact surface stage: the tip of the arc-shaped gripper touches the contact surface, and the timing device starts the first timing; the timing device feeds back the start timing signal to the connecting arm control device, the connecting arm control device presses down the connecting arm, and the connecting arm starts to rotate together with the rotating shaft. When the connecting arm rotates to be perpendicular to the contact surface, the shape memory polymer adhesion layer reaches the glass transition temperature and maintains it, and the stiffness of the shape memory adhesion layer reaches the minimum state; the shape memory polymer adhesion layer is fully contacted and extruded with the contact surface under the action of the connecting arm and the torsion spring; Step 3, controllable adhesion stage: when the shape memory polymer adhesion layer is in full contact with the rough surface, and the connecting arm rotates to be perpendicular to the contact surface, the timing device starts the second timing; the connecting arm control device controls the cooling device to be powered on to start cooling, and the stiffness of the shape memory adhesion layer increases; the connecting arm control device controls the connecting arm and the central rotating shaft to continue to rotate. At this stage, the stiffness of the shape memory adhesion layer reaches the maximum state, and the shape memory polymer adhesion layer forms a mechanical interlock and vacuum adsorption with the contact surface to complete the adhesion with the rough contact surface; Step 4, controllable peeling stage: when the connecting arm control device controls the connecting arm and the central rotating axis to continue rotating until they contact the arc-shaped claw, the timing device starts the third timing; the timing device feeds back the signal to the connecting arm control device, and the connecting arm control device controls the heating device to power on and heat, and the stiffness of the shape memory polymer adhesion layer is reduced; the connecting arm continues to rotate to pry the shape memory foot pad apart from the rough contact surface; Step 5, controllable recovery state: when the arc-shaped claw is separated from the rough surface, the timing device starts the fourth timing, the timing device feeds back the signal to the connecting arm control device, and the connecting arm control device controls the connecting arm to move upward, and under the action of the torsion spring, each component returns to the initial state, and the heating device is always in the power-on heating state; the controllable adhesion machine device based on the shape memory multi-ring suction cup structure detaches from the contact surface and moves to the next target adhesion location, repeating steps one to five to achieve controllable automatic adhesion and peeling.

10. A wall-climbing robot or a grasping manipulator, characterized in that: It comprises a controllable adhesion machine device based on a shape memory multi-ring suction cup structure as described in any one of claims 1 to 8.

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