Electronic devices

Abstract

The present application provides an electronic device. The electronic device of the embodiment of the present application includes a middle frame; a circuit board, which is arranged on the middle frame, and the circuit board includes a substrate and a first heat source and a second heat source arranged on two opposite surfaces of the substrate, and the second heat source is arranged facing the middle frame; a shell assembly, which is arranged on the side of the middle frame where the circuit board is arranged, and the shell assembly has a first air duct connected to the outside world, and the shell assembly is thermally connected to the first heat source; a gas drive mechanism, which is arranged in the middle frame and is respectively connected to the first air duct and the outside world, and is used to drive the gas to flow in the first air duct to dissipate heat for the first heat source; and a heat sink, which is arranged on the side of the middle frame away from the shell assembly, and the heat sink is respectively thermally connected to the gas drive mechanism and the second heat source, and is used to dissipate heat for the second heat source. The electronic device of the embodiment of the present application has better heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to an electronic device. Background Art

[0002] Currently, electronic devices have more and more functions. Therefore, the load of their system-on-chip (SOC chip), radio frequency chip, power chip, etc. is getting heavier, resulting in more and more heat generated by electronic devices per unit time. Existing electronic equipment heat dissipation components can no longer meet the heat dissipation needs of electronic devices. Summary of the invention

[0003] In view of the above problems, an embodiment of the present application provides an electronic device with better heat dissipation efficiency.

[0004] An embodiment of the present application provides an electronic device, comprising:

[0005] Middle frame;

[0006] A circuit board is arranged on the middle frame, the circuit board comprises a substrate and a first heat source and a second heat source arranged on two opposite surfaces of the substrate, the second heat source is arranged facing the middle frame;

[0007] A housing component is arranged on a side of the middle frame where the circuit board is arranged, the housing component has a first air duct connected to the outside, and the housing component is thermally connected to the first heat source;

[0008] a gas driving mechanism, which is disposed in the middle frame and is respectively connected to the first air duct and the outside, and is used to drive gas to flow in the first air duct to dissipate heat from the first heat source; and

[0009] The heat sink is arranged on a side of the middle frame away from the shell assembly. The heat sink is thermally connected to the gas drive mechanism and the second heat source respectively, and is used to dissipate heat from the second heat source.

[0010] The electronic device of the embodiment of the present application is provided with a first air duct on the shell assembly, and the shell assembly is thermally connected to the first heat source. When the gas drive mechanism is turned on, the gas drive mechanism drives the gas to enter through the first air duct, and then discharges it after passing through the gas drive mechanism, thereby bringing the heat generated by the first heat source out of the electronic device to dissipate the heat of the first heat source. In addition, the heat sink is thermally connected to the gas drive mechanism and the second heat source respectively. In addition to dissipating the heat generated by the second heat source through the heat sink, when the gas flows through the gas drive mechanism, it can also take away the heat on the heat sink, thereby accelerating the heat on the heat sink out of the electronic device, accelerating the heat dissipation of the second heat source, and improving the heat dissipation efficiency of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0013] Figure 2 It is a structural schematic diagram of an electronic device from another perspective of an embodiment of the present application.

[0014] Figure 3 An electronic device according to an embodiment of the present application Figure 2 Schematic diagram of the cross-sectional structure in the AA direction.

[0015] Figure 4 It is a schematic diagram of the exploded structure of an electronic device according to an embodiment of the present application.

[0016] Figure 5 This application Figure 3 Enlarged view of the dashed box I in the middle.

[0017] Figure 6 It is a schematic structural diagram of a middle frame of an embodiment of the present application.

[0018] Figure 7 It is a structural schematic diagram of a shell assembly according to an embodiment of the present application.

[0019] Figure 8 It is a structural schematic diagram of a driving mechanism of an embodiment of the present application.

[0020] Fig. 9 It is a schematic diagram of the assembly relationship of a driving mechanism, a heat sink and a first thermal conductive coating according to an embodiment of the present application.

[0021] Fig.10 It is a schematic diagram of the assembly relationship of a circuit board, a first shielding component and a second shielding component according to an embodiment of the present application.

[0022] Description of reference numerals:

[0023] 100-electronic device, 10-middle frame, 101-air inlet channel, 1011-first air inlet sub-channel, 1012-second air inlet sub-channel, 102-air outlet channel, 103-through hole, 104-through hole, 20-circuit board, 21-substrate, 23-first heat source, 25-second heat source, 30-shell assembly, 301-first air duct, 302-second air duct, 31-shell, 33-heat conductive sheet, 40-gas drive mechanism, 41-metal shell, 50-heat sink, 60-display screen, 71-first thermal conductive coating, 72-second thermal conductive coating, 73-third thermal conductive coating, 74-fourth thermal conductive coating, 75-fifth thermal conductive coating, 80-first shielding assembly, 81-first shielding member, 83-second shielding member, 90-second shielding assembly, 91-third shielding member, 93-fourth shielding member. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0026] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0027] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0028] The middle frame of electronic devices (such as mobile phones and tablets) usually includes metal, which has good thermal conductivity. Therefore, chips with high heat generation on electronic devices, such as system-on-chip (SOC chip), are usually arranged on the surface of the circuit board facing the middle frame. In order to dissipate heat from heat-generating chips such as system-on-chip, a heat sink such as a heat spreader can be arranged on the chip to dissipate heat from the heat-generating chip. However, the heat sink is only arranged at the position corresponding to the heat-generating chip, and its heat dissipation capacity is limited.

[0029] In view of this, an embodiment of the present application provides an electronic device 100. The electronic device 100 of the embodiment of the present application may be, but is not limited to, a portable electronic device 100 such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console, etc. In the following embodiments of the present application, the electronic device 100 is illustrated by taking a mobile phone as an example, which should not be understood as a limitation on the electronic device 100 of the present application.

[0030] See also Figures 1 to 4 The present application provides an electronic device 100, which includes a middle frame 10, a circuit board 20, a shell assembly 30, a gas drive mechanism 40 and a heat sink 50. The circuit board 20 is arranged on the middle frame 10, and the circuit board 20 includes a substrate 21 and a first heat source 23 and a second heat source 25 arranged on two opposite surfaces of the substrate 21, and the second heat source 25 is arranged facing the middle frame 10; the shell assembly 30 is arranged on the side of the middle frame 10 where the circuit board 20 is arranged, and the shell assembly 30 has a first air duct 301 connected to the outside, and the shell assembly 30 is thermally connected to the first heat source 23; the gas drive mechanism 40 is penetrated by the middle frame 10, and is respectively connected to the first air duct 301 and the outside, and is used to drive the gas to flow in the first air duct 301 to dissipate heat for the first heat source 23; the heat sink 50 is arranged on the side of the middle frame 10 away from the shell assembly 30, and the heat sink 50 is respectively thermally connected to the gas drive mechanism 40 and the second heat source 25, and is used to dissipate heat for the second heat source 25.

[0031] The term "thermally conductive connection" refers to a connection between two components that allows heat to be conducted between the two components. The two components can be directly connected or connected through other thermally conductive components. The term "communication" refers to the ability of gas or air flow to flow between the two components in communication.

[0032] It can be understood that the middle frame 10 and the housing assembly 30 are stacked, and the circuit board 20 is disposed between the middle frame 10 and the housing assembly 30. The gas drive mechanism 40 and the circuit board 20 are spaced apart and are both carried on the middle frame 10.

[0033] Optionally, the first heat source 23 may be, but is not limited to, at least one of a radio frequency chip, a power management chip, etc. Optionally, the number of the first heat source 23 may be one or more. When there are multiple first heat sources 23, the multiple first heat sources 23 are spaced apart on the surface of the substrate 21 facing the housing component 30, and the multiple first heat sources 23 are all thermally connected to the housing component 30.

[0034] Optionally, the second heat source 25 may be, but is not limited to, a system-on-chip (SOC chip), etc. Optionally, the number of the second heat source 25 may be one or more. When there are multiple second heat sources 25, the multiple second heat sources 25 are spaced apart on the surface of the substrate 21 facing the middle frame 10, and the multiple second heat sources 25 are all thermally connected to the heat sink 50.

[0035] Optionally, the gas driving mechanism 40 may be, but is not limited to, a fan (such as a micro fan), a blower (micro blower), or other device capable of driving gas to flow.

[0036] It can be understood that the heat sink 50 is carried by the middle frame 10 , and the heat sink 50 can be bonded to the middle frame 10 by gluing or the like.

[0037] Optionally, the heat sink 50 may be, but is not limited to, a heat sink with high thermal conductivity such as a heat spreader, a heat dissipation metal plate, etc. A heat spreader has good heat dissipation performance and can improve the heat dissipation effect on the second heat source 25 .

[0038] Optionally, the heat sink 50 extends from the side of the second heat source 25 away from the gas drive mechanism 40 to the side of the gas drive mechanism 40 away from the heat sink 50. This can better improve the heat dissipation efficiency of the heat sink 50 and improve the heat dissipation effect on the second heat source 25.

[0039] The electronic device 100 of the embodiment of the present application is provided with a first air duct 301 on the housing assembly 30, and the housing assembly 30 is connected to the first heat source 23 by thermal conduction. When the gas driving mechanism 40 is turned on, the gas driving mechanism 40 drives the gas to enter through the first air duct 301, and the gas is discharged after passing through the gas driving mechanism 40, thereby taking the heat generated by the first heat source 23 out of the electronic device 100 to dissipate the heat of the first heat source 23. In addition, the heat sink 50 is thermally connected to the gas driving mechanism 40 and the second heat source 25, respectively. In addition to dissipating the heat generated by the second heat source 25 through the heat sink 50, when the gas flows through the gas driving mechanism 40, it can also take away the heat on the heat sink 50, thereby accelerating the heat on the heat sink 50 out of the electronic device 100, accelerating the heat dissipation of the second heat source 25, and improving the heat dissipation efficiency of the heat sink 50.

[0040] It should be noted that the electronic device 100 of the present application forms a heat dissipation path on opposite sides of the middle frame 10, one of which is on the housing assembly 30, and the other (heat sink 50) is on the side of the middle frame 10 away from the housing assembly 30, which can dissipate heat for all heat sources carried on the middle frame 10. Therefore, it can be understood that these two heat dissipation paths can not only dissipate heat for the first heat source 23 and the second heat source 25 on the circuit board 20, but also dissipate heat for other heat-generating components carried on the middle frame 10.

[0041] In some embodiments, the electronic device 100 of the present application further includes a display screen 60, which is disposed on a side of the heat sink 50 away from the middle frame 10 for displaying. The side of the middle frame 10 is exposed to the display screen 60 and the housing assembly 30. It can be understood that the heat sink 50 is disposed between the middle frame 10 and the display screen 60.

[0042] Optionally, the display screen 60 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0043] In some embodiments, the middle frame 10 has an air inlet channel 101 and an air outlet channel 102; the air inlet channel 101 is located on the side of the middle frame 10 away from the gas drive mechanism 40, and is connected to the first air duct 301 to connect the first air duct 301 with the outside; the air outlet channel 102 is located on the side of the middle frame 10 close to the gas drive mechanism 40, and is connected to the gas drive mechanism 40 to connect the gas drive mechanism 40 with the outside; the gas drive mechanism 40 is used to drive the gas to flow from the air inlet channel 101 into the first air duct 301 and the gas drive mechanism 40, and flow out through the air outlet channel 102, so as to transfer the heat generated by the first heat source 23 and the heat transferred to the heat sink 50 by the second heat source 25 to the outside through the air flow. It can be understood that the gas drive mechanism 40 is arranged between the air outlet channel 102 and the first air duct 301, and the gas drive mechanism 40 is connected to the outside through the air outlet channel 102.

[0044] The gas drive mechanism 40 is arranged between the air inlet channel 101 and the first air duct 301, or at other positions in the air duct, and the heat dissipation effect of the first heat source 23 can also be achieved. However, when the gas drive mechanism 40 is arranged between the air inlet channel 101 and the first air duct 301, when the gas drive mechanism 40 is started, the inside of the electronic device 100 is in a pressurized state (that is, the air pressure inside the electronic device 100 is greater than the external atmospheric pressure). If the airtightness of the first air duct 301 is not good, the dust flowing into the first air duct 301 will be blown to the circuit board 20 side of the electronic device 100, which may easily cause the electronic device 100 to be unable to charge, the speaker outlet hole to be blocked, the sound is relatively mixed, and the call cannot be heard clearly. There will also be impurities on the camera of the electronic device 100, resulting in unclear photos, etc. When the gas driving mechanism 40 is arranged between the air outlet channel 102 and the first air duct 301, when the gas driving mechanism 40 is started, the interior of the electronic device 100 is in a negative pressure state, which can better prevent the dust flowing into the first air duct 301 from entering the circuit board 20 side of the electronic device 100 and affecting the function of the electronic device 100.

[0045] Optionally, the air inlet channel 101 and the air outlet channel 102 are respectively arranged at opposite ends of the middle frame 10, so that when the gas driving mechanism 40 is started, the area or path through which the airflow flows in the electronic device 100 is larger, thereby better dissipating the heat of the electronic device 100 and improving the heat dissipation efficiency of the electronic device 100.

[0046] Please also see Figure 3 and Figure 5 Optionally, the air inlet channel 101 includes a first air inlet sub-channel 1011 and a second air inlet sub-channel 1012 connected to each other in a bent manner, wherein the first air inlet sub-channel 1011 is connected to the first air duct 301, and the second air inlet sub-channel 1012 is connected to the outside. When the gas drive mechanism 40 is started, the airflow enters from the second air inlet sub-channel 1012, flows through the first air inlet sub-channel 1011, the first air duct 301, and the gas drive mechanism 40 in sequence, and flows out from the air outlet channel 102, thereby continuously taking away the heat generated by the first heat source 23 and the heat transferred by the heat sink 50, so as to cool down the first heat source 23 and the second heat source 25.

[0047] Optionally, the middle frame 10 may be, but is not limited to, a metal middle frame 10, such as at least one of an aluminum alloy middle frame and a magnesium alloy middle frame, etc. The use of the metal middle frame 10 can better transfer the heat generated by the second heat source 25 to the entire electronic device 100, thereby better dissipating the heat of the second heat source 25.

[0048] Optionally, the heat generated by the second heat source 25 is greater than the heat generated by the first heat source 23. The middle frame 10 is generally made of metal, which has good thermal conductivity. The second heat source 25 with a larger heat generation is arranged on the side of the substrate 21 facing the middle frame 10, so that the heat generated by the second heat source 25 can be better transferred to the entire electronic device 100, so that the second heat source 25 can be better dissipated.

[0049] See also Figure 6 Optionally, along the stacking direction of the shell assembly 30 and the middle frame 10, the middle frame 10 has a through hole 103, and the through hole 103 is used to set the gas drive mechanism 40. Optionally, the gas drive mechanism 40 can be fixed to the middle frame 10 by dispensing glue, adhesive, fasteners, etc., and the present application does not specifically limit the fixing method of the gas drive mechanism 40.

[0050] Optionally, the middle frame 10 has a through hole 104 at a position corresponding to the second heat source 25. Providing the through hole 104 at a position corresponding to the second heat source 25 of the middle frame 10 can make the second heat source 25 and the heat sink 50 better connected for thermal conductivity, and better dissipate the heat generated by the second heat source 25 through the heat sink 50, thereby improving the heat dissipation effect of the second heat source 25.

[0051] See also Figure 7 In some embodiments, the housing assembly 30 includes a housing 31 and a heat conductive sheet 33, wherein the heat conductive sheet 33 is disposed between the housing 31 and the circuit board 20, wherein the housing 31 and the heat conductive sheet 33 define the first air duct 301, and the heat conductive sheet 33 is thermally connected to the first heat source 23. The housing 31 and the heat conductive sheet 33 define the first air duct 301, which can better prevent the airflow in the first air duct 301 from passing through the first air duct 301 and entering the side of the heat conductive sheet 33 close to the circuit board 20, thereby affecting the performance of the electronic device 100. In addition, by using the heat conductive sheet 33 as a part of the first air duct 301, the heat generated by the first heat source 23 can be better transferred to the heat conductive sheet 33, so as to improve the heat dissipation effect of the first heat source 23.

[0052] It should be noted that, except for the entrance (i.e., the connection with the air inlet channel 101) and the outlet of the first air duct 301, the shell 31 and the heat conductive sheet 33 are sealed by adhesive, etc. to prevent air leakage in the first air duct 301 and prevent gas from flowing to the circuit board 20 and other locations, thereby affecting the performance of the electronic device 100.

[0053] Optionally, the heat conducting sheet 33 may be, but is not limited to, a metal sheet, such as a metal sheet with a high thermal conductivity coefficient, such as stainless steel, iron sheet, copper sheet, aluminum sheet, etc. When the heat conducting sheet 33 is a metal sheet, it has better thermal conductivity, and can better transfer the heat generated by the first heat source 23 to the heat conducting sheet 33, so as to improve the heat dissipation effect of the first heat source 23.

[0054] Please see again Figure 3 In some embodiments, the housing 31 and the middle frame 10 define a second air duct 302, the second air duct 302 is provided corresponding to the gas drive mechanism 40, and the second air duct 302 is connected to the gas drive mechanism 40 and the first air duct 301 respectively. When the gas drive mechanism 40 is turned on, the gas enters the first air duct 301 through the air inlet channel 101, flows through the second air duct 302 and the gas drive mechanism 40 in sequence, and flows out from the air outlet channel 102.

[0055] It should be noted that the shell 31 and the middle frame 10 correspond to the outer periphery of the second air duct 302, except for the inlet and outlet (not shown) of the second air duct 302, and can be sealed by adhesive, adhesive, etc. to improve the airtightness of the second air duct 302 and prevent the second air duct 302 from leaking air, and the gas flows to the circuit board 20 and other positions, affecting the performance of the electronic device 100.

[0056] It should be noted that the electronic device 100 of the present application may have both the first air duct 301 and the second air duct 302, or may have only the first air duct 301. When the electronic device 100 has only the first air duct 301, the heat conductive sheet 33 extends from the end of the air inlet channel 101 to the position corresponding to the gas drive mechanism 40, and the heat conductive sheet 33 has a through hole at a position overlapping with the air inlet of the gas drive mechanism 40, so that the gas drive mechanism 40 is connected to the first air duct 301.

[0057] See also Figure 8 In some embodiments, the gas drive mechanism 40 includes a metal shell 41, and the metal shell 41 is thermally connected to the heat sink 50. The gas drive mechanism 40 uses the metal shell 41, which can better transfer the heat of the heat sink 50 to the airflow flowing through the gas drive mechanism 40 through the metal shell 41, so that the heat is taken away by the airflow, thereby accelerating the speed of the heat sink 50 to the second heat source 25 and improving the heat dissipation effect.

[0058] Optionally, the metal shell 41 may be, but is not limited to, at least one of a stainless steel shell, a copper shell, and the like.

[0059] See also Fig. 9In some embodiments, the electronic device 100 of the present application further includes a first thermal conductive coating 71, which is disposed between the metal housing 41 and the heat sink 50, and respectively connects the metal housing 41 and the heat sink 50. Even if the metal housing 41 is pressed against the heat sink 50, since the flatness of the metal housing 41 and the heat sink 50 is usually limited, there will still be a partial gap between the metal housing 41 and the heat sink 50, and the air in these gaps has a heat insulating effect. Therefore, the first thermal conductive coating 71 is disposed between the metal housing 41 and the heat sink 50, and the metal housing 41 and the heat sink 50 are thermally connected by the first thermal conductive coating 71, so that the heat of the heat sink 50 can be better transferred to the metal housing 41 through the first thermal conductive coating 71, and then transferred to the airflow flowing through the gas drive mechanism 40.

[0060] Optionally, the first thermal conductive coating 71 may be, but is not limited to, at least one of coatings having good thermal conductivity, such as thermal conductive gel and thermal conductive silicone grease.

[0061] See also Fig.10 In some embodiments, the electronic device 100 also includes a first shielding component 80, the first shielding component 80 includes a first shielding member 81 and a second shielding member 83, the first shielding member 81 is arranged on the periphery of the first heat source 23, the second shielding member 83 is arranged on the side of the first heat source 23 away from the substrate 21, and the second shielding member 83 is thermally connected to the first heat source 23 and the heat conductive sheet 33 respectively.

[0062] It can be understood that the first shielding assembly 80 covers the first heat source 23 like a shielding cover to prevent the radiation signal of the first heat source 23 from leaking and causing radiation interference with other signals of the electronic device 100.

[0063] By providing the first shielding component 80, it is possible to better prevent the signal radiated by the first heat source 23 from leaking and generating radiation interference with other signals of the electronic device 100. In addition, the first shielding component 80 can also play a role in waterproofing and dustproofing the first heat source 23, preventing water vapor and dust from affecting the performance of the first heat source 23. Furthermore, the first shielding component 80 is usually made of metal, which has good thermal conductivity and can better conduct the heat generated by the first heat source 23 to the heat conductive sheet 33, and be carried away by the airflow flowing through the first air duct 301.

[0064] Optionally, the first shielding member 81 is electrically connected to the second shielding member 83 , and the first shielding member 81 is grounded.

[0065] Optionally, the first shielding member 81 may be, but is not limited to, a conductive metal member such as copper, iron, or aluminum, and the second shielding member 83 may be, but is not limited to, a conductive metal sheet such as copper foil, silver foil, or aluminum foil.

[0066] In some embodiments, the electronic device 100 also includes a second thermally conductive coating 72 and a third thermally conductive coating 73; the second thermally conductive coating 72 is disposed between the second shielding component 83 and the first heat source 23, and is respectively connected to the second shielding component 83 and the first heat source 23; the third thermally conductive coating 73 is disposed between the second shielding component 83 and the thermally conductive sheet 33, and is respectively connected to the second shielding component 83 and the thermally conductive sheet 33.

[0067] The flatness of the surface of the first heat source 23, the surface of the second shielding component 83, and the surface of the thermal conductive sheet 33 is usually limited. Even if the three are stacked and abutted in sequence, there will still be partial gaps at the connections between the first heat source 23, the second shielding component 83, and the thermal conductive sheet 33. The air in these gaps has a heat insulating effect. Therefore, a second thermal conductive coating 72 is arranged between the second shielding component 83 and the first heat source 23, and a third thermal conductive coating 73 is arranged between the second shielding component 83 and the thermal conductive sheet 33. The first heat source 23, the second shielding component 83, and the thermal conductive sheet 33 can be better thermally connected through the second thermal conductive coating 72 and the third thermal conductive coating 73, and the heat generated by the first heat source 23 can be better transferred to the first air duct 301, so as to be transferred to the outside of the electronic device 100 through the airflow flowing through the first air duct 301.

[0068] It can be understood that the heat generated by the first heat source 23 is eventually brought out of the electronic device 100 through the following path: the second thermal conductive coating 72 - the second shielding member 83 - the third thermal conductive coating 73 - the thermal conductive sheet 33 - the gas in the first air duct 301, and the gas in the first air duct 301 flows through the second air duct 302, the gas driving mechanism 40, and the air outlet channel 102 in sequence and is discharged from the outside of the electronic device 100.

[0069] Optionally, the second thermally conductive coating 72 may be, but is not limited to, at least one of coatings having good thermal conductivity, such as thermally conductive gel and thermally conductive silicone grease.

[0070] Optionally, the third thermal conductive coating 73 may be, but is not limited to, at least one of coatings having good thermal conductivity, such as thermal conductive gel and thermal conductive silicone grease.

[0071] In some embodiments, the electronic device 100 of the present application also includes a second shielding component 90, the second shielding component 90 includes a third shielding component 91 and a fourth shielding component 93, the third shielding component 91 is arranged on the periphery of the second heat source 25, the fourth shielding component 93 is arranged on the side of the second heat source 25 away from the substrate 21, and the fourth shielding component 93 is thermally connected to the second heat source 25 and the heat sink 50 respectively.

[0072] It can be understood that the second shielding assembly 90 covers the second heat source 25 like a shielding cover to prevent the radiation signal of the second heat source 25 from leaking and causing radiation interference with other signals of the electronic device 100.

[0073] By providing the second shielding assembly 90, it is possible to better prevent the signal radiated by the second heat source 25 from leaking and generating radiation interference with other signals of the electronic device 100. In addition, the second shielding assembly 90 can also provide waterproof and dustproof protection for the second heat source 25, preventing water vapor and dust from affecting the performance of the second heat source 25. Furthermore, the second shielding assembly 90 is usually made of metal, which has good thermal conductivity and can better conduct the heat generated by the second heat source 25 to the heat sink 50, and then conduct it to the airflow flowing through the gas drive mechanism 40 to be taken away.

[0074] Optionally, the third shielding member 91 is electrically connected to the fourth shielding member 93 , and the third shielding member 91 is grounded.

[0075] Optionally, the third shielding member 91 may be, but is not limited to, a conductive metal member such as copper, iron, or aluminum, and the fourth shielding member 93 may be, but is not limited to, a conductive metal sheet such as copper foil, silver foil, or aluminum foil.

[0076] In some embodiments, the electronic device 100 of the embodiment of the present application also includes a fourth thermally conductive coating 74 and a fifth thermally conductive coating 75; the fourth thermally conductive coating 74 is arranged between the fourth shielding component 93 and the second heat source 25, and is respectively connected to the fourth shielding component 93 and the second heat source 25; the fifth thermally conductive coating 75 is arranged between the fourth shielding component 93 and the heat sink 50, and is respectively connected to the fourth shielding component 93 and the heat sink 50.

[0077] The flatness of the surface of the second heat source 25, the surface of the fourth shielding member 93, and the surface of the heat sink 50 is usually limited. Even if the three are stacked and abutted in sequence, there will still be partial gaps at the connections between the second heat source 25, the fourth shielding member 93, and the heat sink 50. The air in these gaps has a heat insulating effect. Therefore, a fourth thermal conductive coating 74 is arranged between the fourth shielding member 93 and the second heat source 25, and a fifth thermal conductive coating 75 is arranged between the fourth shielding member 93 and the heat sink 50. The fourth thermal conductive coating 74 and the fifth thermal conductive coating 75 can better connect the second heat source 25, the fourth shielding member 93, and the heat sink 50 through the fourth thermal conductive coating 74 and the fifth thermal conductive coating 75, and the heat generated by the second heat source 25 can be better transferred to the heat sink 50, and then transferred to the gas drive mechanism 40 through the heat sink 50, so as to be transferred to the outside of the electronic device 100 through the airflow flowing through the gas drive mechanism 40.

[0078] It can be understood that the heat generated by the second heat source 25 is eventually brought out of the electronic device 100 through the following path: fourth thermal conductive coating 74 - fourth shielding member 93 - fifth thermal conductive coating 75 - heat sink 50 - metal casing 41 of gas drive mechanism 40 - gas in gas drive mechanism 40 - air outlet channel 102 to be discharged to the outside of the electronic device 100.

[0079] Optionally, the fourth thermal conductive coating 74 may be, but is not limited to, at least one of coatings having good thermal conductivity, such as thermal conductive gel and thermal conductive silicone grease.

[0080] Optionally, the fifth thermal conductive coating 75 may be, but is not limited to, at least one of coatings having good thermal conductivity, such as thermal conductive gel and thermal conductive silicone grease.

[0081] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0082] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. An electronic device, characterized in that: include: A middle frame, wherein the middle frame has a through hole; A circuit board is arranged on the middle frame, the circuit board includes a substrate and a first heat source and a second heat source arranged on two opposite surfaces of the substrate, the second heat source is arranged facing the middle frame, and the second heat source is arranged corresponding to the through hole; A housing component is arranged on a side of the middle frame where the circuit board is arranged, the housing component has a first air duct connected to the outside, and the housing component is thermally connected to the first heat source; A gas driving mechanism, which is disposed in the middle frame and is respectively connected to the first air duct and the outside, and is used to drive gas to flow in the first air duct to dissipate heat from the first heat source; as well as A heat sink is arranged on a side of the middle frame away from the shell assembly, and the heat sink is thermally connected to the gas drive mechanism and the second heat source respectively. The heat sink extends from a side of the second heat source away from the gas drive mechanism to a side of the gas drive mechanism away from the heat sink, and the gas drive device cooperates with the heat sink to dissipate heat from the second heat source.

2. The electronic device according to claim 1, characterized in that: The middle frame has an air inlet channel and an air outlet channel; the air inlet channel is located on the side of the middle frame away from the gas drive mechanism, and is connected to the first air duct; the air outlet channel is located on the side of the middle frame close to the gas drive mechanism, and is connected to the gas drive mechanism, and the gas drive mechanism is used to drive the gas to flow from the air inlet channel into the first air duct and the gas drive mechanism, and flow out through the air outlet channel.

3. The electronic device according to claim 1, characterized in that: The gas driving mechanism includes a metal shell, and the electronic device also includes a first thermal conductive coating, which is arranged between the metal shell and the heat sink and is respectively connected to the metal shell and the heat sink.

4. The electronic device according to claim 1, characterized in that: The housing assembly includes a housing and a heat conductive sheet, wherein the heat conductive sheet is disposed between the housing and the circuit board, the housing and the heat conductive sheet define the first air duct, and the heat conductive sheet is thermally connected to the first heat source.

5. The electronic device according to claim 4, characterized in that: The electronic device also includes a first shielding component, which includes a first shielding member and a second shielding member. The first shielding member is arranged on the periphery of the first heat source, and the second shielding member is arranged on the side of the first heat source away from the substrate. The second shielding member is thermally connected to the first heat source and the heat conductive sheet respectively.

6. The electronic device according to claim 5, characterized in that: The electronic device further comprises a second thermal conductive coating and a third thermal conductive coating; The second thermally conductive coating is disposed between the second shielding member and the first heat source, and is respectively connected to the second shielding member and the first heat source; the third thermally conductive coating is disposed between the second shielding member and the thermally conductive sheet, and is respectively connected to the second shielding member and the thermally conductive sheet.

7. The electronic device according to claim 4, characterized in that: The heat conducting sheet is a metal sheet, and the heat sink is a heat spreader.

8. The electronic device according to claim 1, characterized in that: The electronic device also includes a second shielding component, the second shielding component includes a third shielding component and a fourth shielding component, the third shielding component is arranged on the periphery of the second heat source, the fourth shielding component is arranged on the side of the second heat source away from the substrate, and the fourth shielding component is thermally connected to the second heat source and the heat sink respectively.

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a fourth thermal conductive coating and a fifth thermal conductive coating; The fourth thermal conductive coating is disposed between the fourth shielding component and the second heat source, and is respectively connected to the fourth shielding component and the second heat source; the fifth thermal conductive coating is disposed between the fourth shielding component and the heat sink, and is respectively connected to the fourth shielding component and the heat sink.

10. The electronic device according to claim 2, characterized in that: The shell and the middle frame define a second air duct, the second air duct is arranged corresponding to the gas driving mechanism, and the second air duct is respectively connected to the gas driving mechanism and the first air duct.

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