Method for manufacturing circuit board, circuit board and lens module

Abstract

A method for manufacturing a circuit board includes the following steps: providing a circuit substrate, the circuit substrate including a dielectric layer and a circuit layer located on the surface of the dielectric layer, the circuit substrate being divided from the inside to the outside into a first area, a second area, and a third area connected in sequence; covering two opposite surfaces of the circuit substrate located in the first area and the third area with a shielding layer; removing the dielectric layer located in the second area; and removing the shielding layer to form a circuit board in which the circuit layer located in the second area is hollowed out of the dielectric layer, wherein the circuit layer located in the second area connects the first area and the third area. The present application also provides a circuit board and a lens module including the circuit board.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to a method for manufacturing a circuit board, a circuit board, and a lens module. Background Art

[0002] With the development of multimedia technology, electronic devices such as digital cameras and camcorders are becoming more and more popular among consumers. The frequency of users' use of lens modules has also greatly increased, and the requirements for the shooting performance of lens modules have become higher and higher.

[0003] The lens module includes a sensor for photosensing and a circuit board. The sensor is connected to the circuit board, and the imaging signal is transmitted to the circuit board for imaging through the sensor's photosensing function. During the actual shooting process, due to the influence of external factors, the electronic device remains completely still, causing the sensor to shake, making it impossible for the lens module to focus quickly, resulting in blurred images. Summary of the invention

[0004] In view of this, it is necessary to provide a method for manufacturing a circuit board that avoids causing the sensor to shake, so as to solve the above problem.

[0005] It is also necessary to provide a circuit board and a lens module including the circuit board and a sensor.

[0006] A method for manufacturing a circuit board comprises the following steps:

[0007] A circuit substrate is provided, the circuit substrate comprising a dielectric layer and a circuit layer located on the surface of the dielectric layer, the circuit substrate being divided from the inside to the outside into a first area, a second area and a third area connected in sequence; covering two opposite surfaces of the circuit substrate located in the first area and the third area with a shielding layer; removing the dielectric layer located in the second area; and removing the shielding layer to form a circuit board in which the circuit layer located in the second area is hollowed out from the dielectric layer, wherein the circuit layer located in the second area connects the first area and the third area.

[0008] In some embodiments, the manufacturing method further includes the following steps: performing surface treatment on the circuit layer to form a protective layer on the surface of the circuit layer.

[0009] In some embodiments, the circuit substrate further includes a fourth area, the first area is surrounded by the fourth area, and the fourth area is not provided with the dielectric layer and the circuit layer.

[0010] In some embodiments, the step of forming the circuit substrate includes: providing a single-sided copper clad laminate, the single-sided copper clad laminate including the dielectric layer and a copper layer located on the surface of the dielectric layer, wherein the single-sided copper clad laminate is divided from the inside to the outside into the first area, the second area, and the third area connected in sequence; and performing circuit production on the copper layer to form the circuit layer.

[0011] In some embodiments, a portion of the dielectric layer and a portion of the circuit layer in the first region are removed to form the circuit substrate having the fourth region.

[0012] In some embodiments, after the step of removing the shielding layer, the method for manufacturing a circuit board further includes the following steps: forming a solder resist layer on two opposite surfaces of the dielectric layer, wherein the solder resist layer also covers the circuit layer.

[0013] In some embodiments, the circuit layers are disposed on two opposite surfaces of the dielectric layer.

[0014] A circuit board comprises a dielectric layer and a circuit layer located on the surface of the dielectric layer. The circuit board is divided from the inside to the outside into a first area, a second area and a third area which are connected in sequence. The first area and the third area are both provided with the dielectric layer and the circuit layer, and the second area is provided with the circuit layer but not the dielectric layer.

[0015] In some embodiments, the circuit board further includes a fourth area, the first area is surrounded by the fourth area, and the circuit layer and the dielectric layer are not provided in the fourth area.

[0016] A lens module, the lens module includes the circuit board, the lens module also includes a sensor, and the sensor is connected to the circuit layer located in the first area.

[0017] The circuit board formed by the circuit board manufacturing method provided in the present application, the circuit layer located in the third area is used to connect with the external circuit to form a static platform; the circuit layer located in the first area is used to connect with the sensor, and the sensor located in the first area is connected to the static platform through the circuit layer located in the second area. The sensor can dynamically move in a plane through the circuit layer without the dielectric layer to form a dynamic platform to maintain the balance of the sensor, thereby realizing the anti-shake function of the lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A top view of a single-sided copper clad laminate including a first area, a second area, a third area, and a fourth area provided in an embodiment of the present application.

[0019] Figure 2 for Figure 1Schematic diagram of the cross section of the single-sided copper clad laminate shown.

[0020] Figure 3 For Figure 2 The schematic cross-sectional view of the circuit substrate obtained after the copper layer is subjected to circuit fabrication to form a circuit layer.

[0021] Figure 4 For Figure 3 The schematic cross-sectional view shows two opposite surfaces of the circuit substrate located in the first area and the third area after being covered with a shielding layer.

[0022] Figure 5 To remove Figure 4 Schematic cross-sectional view of the dielectric layer behind the second zone.

[0023] Figure 6 To remove Figure 5 Schematic diagram of the cross section after the shielding layer.

[0024] Figure 7 This is a top view of the circuit board obtained after removing the shielding layer.

[0025] Figure 8 For Figure 7 The schematic cross-sectional view of the circuit board along the AA' direction after surface treatment is shown.

[0026] Fig. 9 For Figure 7 The schematic cross-sectional view of the circuit board along the BB' direction after surface treatment is shown.

[0027] Fig.10 For Figure 7 The schematic cross-sectional view of the circuit board along the C-C' direction after surface treatment is shown.

[0028] Fig.11 For Figure 7 The schematic cross-sectional view of the circuit board along the D-D' direction after surface treatment is shown.

[0029] Fig.12 for Figure 8 The schematic cross-sectional view of the circuit board along the AA' direction after solder mask treatment is shown.

[0030] Fig.13 A top view of the lens module provided in an embodiment of the present application.

[0031] Main component symbols

[0032] Circuit Board 100 Circuit board 10 Dielectric layer 12 Circuit layer 14 Single-sided copper clad laminate 20 Copper Layer 22 Shielding layer 30 Protective layer 40 Solder mask 50 Lens module 200 sensor 210 District 1 I District 2 II District 3 III District 4 IV

[0033] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0036] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0037] See also Figures 1 to 12 The present invention provides a method for manufacturing a circuit board 100, comprising the following steps:

[0038] Step S1: Please refer to Figures 1 to 3 , a circuit substrate 10 is provided, the circuit substrate 10 includes a dielectric layer 12 and a circuit layer 14 located on the surface of the dielectric layer 12, and the circuit substrate 10 is divided into a first area I, a second area II and a third area III which are connected in sequence from the inside to the outside.

[0039] The second area II is surrounded by the first area I, and the third area III is surrounded by the second area II. The first area I, the second area II, and the third area III all have the dielectric layer 12 and the circuit layer 14. The circuit layer 14 may be located on one surface of the dielectric layer 12, or may be located on two opposite surfaces of the dielectric layer 12. In this embodiment, the circuit layer 14 is located on one surface of the dielectric layer 12 as an example.

[0040] Furthermore, in some embodiments, the circuit substrate 10 further includes a fourth area IV, and the fourth area IV is located at the center of the first area I, that is, the first area I is surrounded by the fourth area IV. The fourth area IV is hollow, that is, the circuit layer 14 and the dielectric layer 12 are not provided in the fourth area IV.

[0041] In some embodiments, the step of forming the circuit substrate 10 may include:

[0042] Step S101: Please refer to Figure 1 and Figure 2 , providing a single-sided copper clad laminate 20, the single-sided copper clad laminate 20 includes the dielectric layer 12 and the copper layer 22 located on the surface of the dielectric layer 12, wherein the single-sided copper clad laminate 20 is divided into a first zone I, a second zone II and a third zone III which are connected in sequence from the inside to the outside.

[0043] Step S102: Please refer to Figure 3 , the copper layer 22 is subjected to circuit manufacturing to form the circuit layer 14. Figure 3 It is a schematic cross-sectional view along the AA' direction.

[0044] In some embodiments, the step of forming the circuit substrate 10 further includes step S103: Figure 3 For further information, see Figure 7 and Fig. 9 , removing part of the dielectric layer 12 and part of the circuit layer 14 in the first area I to form the circuit substrate 10 having the fourth area IV. That is, the fourth area IV is hollow, and the dielectric layer 12 and the circuit layer 14 are not provided.

[0045] Step S2: Please refer to Figure 4 The shielding layer 30 is covered on two opposite surfaces of the circuit substrate 10 located in the first area I and the third area III.

[0046] The shielding layer 30 is used to prevent the dielectric layer 12 in the first area I and the third area III covered by the shielding layer 30 from being removed, and the uncovered dielectric layer 12 can be removed. When the shielding layer 30 covers the dielectric layer 12 in the first area I and the third area III, it also covers the circuit layer 14 in the first area I and the third area III.

[0047] Step S3: Please refer to Figure 5 , remove the dielectric layer 12 located in the second region II.

[0048] The dielectric layer 12 in the second area II is removed, and the circuit layer 14 in the second area II is retained to form a hollowed-out circuit layer 14. The circuit layer 14 in the second area II is connected to the circuit layers 14 in the first area I and the third area III.

[0049] Step S4: Please refer to Figure 6 as well as Figure 7 , removing the shielding layer 30, forming a circuit board 100 in which the circuit layer 14 located in the second area II is hollowed out in the dielectric layer 12, wherein the circuit layer 14 located in the second area II connects the first area I and the third area III.

[0050] After the shielding layer 30 is removed, the dielectric layer 12 and the circuit layer 14 that have not been removed are exposed.

[0051] It can be understood that the formed circuit board 100 includes the first zone I, the second zone II and the third zone III, the second zone II only has a circuit layer 14, and the dielectric layer 12 is not set, the first zone I and the third zone III are dynamically connected through the circuit layer 14 located in the second zone II.

[0052] In some embodiments, the formed circuit board 100 further includes a fourth region IV, the fourth region IV is located at the center of the first region I, and the fourth region IV is not provided with a circuit layer 14 and a dielectric layer 12 .

[0053] In some embodiments, the method for manufacturing the circuit board 100 further includes the following steps:

[0054] Step S5: Please refer to Figures 8 to 11 , the circuit layer 14 is subjected to surface treatment to form a protective layer 40 on the surface of the circuit layer 14, which is used to protect the circuit layer 14 and prevent the circuit layer 14 from being oxidized. Figures 8 to 11 They are Figure 7 The cross-sectional schematic diagrams along the directions A-A', B-B', C-C', and D-D' are all formed in the same steps, and the specific formation process will not be repeated here.

[0055] The step of surface treatment may be performed after forming the circuit layer 14 , that is, the step of forming the protection layer 40 may be performed before covering the shielding layer 30 or after removing the shielding layer 30 .

[0056] In some embodiments, the method for manufacturing the circuit board 100 further includes the following steps:

[0057] Step S6: Please participate Fig.12A solder mask 50 is formed on two opposite surfaces of the dielectric layer 12 , and the solder mask 50 also covers the circuit layer 14 .

[0058] See also Figures 7 to 11 The embodiment of the present application further provides a circuit board 100, the circuit board 100 comprising a dielectric layer 12 and a circuit layer 14 located on the surface of the dielectric layer 12, the circuit board 100 being divided from the inside to the outside into a first zone I, a second zone II and a third zone III which are connected in sequence, the first zone I and the third zone III both being provided with the dielectric layer 12 and the circuit layer 14, the second zone II being provided with the circuit layer 14 but not the dielectric layer 12.

[0059] The circuit board 100 further includes a fourth area IV, the first area I is surrounded by the fourth area IV, and the fourth area IV is not provided with the circuit layer 14 and the dielectric layer 12. The hollow fourth area IV can reduce the weight of the first area I and improve the movement flexibility of the first area I.

[0060] See also Fig.12 In some embodiments, the circuit board 100 further includes a solder mask layer 50 , and the solder mask layer 50 covers the dielectric layer 12 and the circuit layer 14 .

[0061] See also Fig.13 The embodiment of the present application further provides a lens module 200 , and the lens module 200 includes the circuit board 100 and a sensor 210 connected to the circuit board 100 .

[0062] Among them, the circuit layer 14 located in the third area III is used to connect with the external circuit to form a static platform; the circuit layer 14 located in the first area I is used to connect with the sensor 210, and the sensor 210 located in the first area I is connected to the static platform through the circuit layer 14 located in the second area II. The sensor 210 can move dynamically in a plane through the circuit layer 14 without the medium layer 12 to form a dynamic platform to maintain the balance of the sensor 210, thereby realizing the anti-shake function of the lens module 200.

[0063] Furthermore, when the sensor 210 is connected to the first area I and moves, the setting of the hollow fourth area IV reduces the weight of the first area I, which is conducive to more flexible movement of the sensor 210.

[0064] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a circuit board, characterized in that: The following steps are involved: A circuit substrate is provided, the circuit substrate comprising a dielectric layer and a circuit layer located on a surface of the dielectric layer, the circuit substrate being divided into a fourth area, a first area, a second area and a third area connected in sequence from the inside to the outside, the first area being arranged around the fourth area, the second area being arranged around the first area, and the third area being arranged around the second area; Covering two opposite surfaces of the circuit substrate located in the first area and the third area with a shielding layer; removing the dielectric layer located in the second region; removing the dielectric layer and the circuit layer located in the fourth area; as well as The shielding layer is removed to form a circuit board in which the circuit layer located in the second area is hollowed out from the dielectric layer, wherein the circuit layer located in the second area connects the first area and the third area.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The production method further comprises the following steps: The circuit layer is subjected to surface treatment to form a protective layer on the surface of the circuit layer.

3. The method for manufacturing a circuit board according to claim 1, characterized in that: The steps of forming the circuit substrate include: A single-sided copper-clad laminate is provided, wherein the single-sided copper-clad laminate comprises the dielectric layer and a copper layer located on the surface of the dielectric layer, wherein the single-sided copper-clad laminate is divided from the inside to the outside into the first area, the second area, and the third area which are connected in sequence; Performing circuit fabrication on the copper layer to form the circuit layer; and A portion of the dielectric layer and a portion of the circuit layer in the first area are removed to form a circuit substrate having the fourth area.

4. The method for manufacturing a circuit board according to claim 1, characterized in that: After the step of removing the shielding layer, the method for manufacturing the circuit board further comprises the following steps: A solder resist layer is formed on two opposite surfaces of the dielectric layer, and the solder resist layer also covers the circuit layer.

5. The method for manufacturing a circuit board according to claim 1, characterized in that: The circuit layers are arranged on two opposite surfaces of the dielectric layer.

6. A lens module, characterized in that: The lens module comprises: A circuit board, the circuit board is manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 5, the circuit board comprises a dielectric layer and a circuit layer located on a surface of the dielectric layer, the circuit board is divided from the inside to the outside into a fourth area, a first area, a second area and a third area connected in sequence, the first area and the third area are both provided with a dielectric layer and a circuit layer, the second area is provided with a circuit layer but no dielectric layer, the first area is surrounded by the fourth area, and the fourth area is not provided with a circuit layer and a dielectric layer; and A sensor is connected to the circuit layer located in the first area.

Images