Capacitor arrays and composite electronic components

Abstract

The present invention provides a capacitor array and a composite electronic component that integrate multiple solid electrolytic capacitor elements into one and have a high degree of freedom in layout. The capacitor array comprises: multiple solid electrolytic capacitor elements, which are formed by dividing a solid electrolytic capacitor sheet; and a sealing layer, the solid electrolytic capacitor sheet comprises: an anode plate, which is composed of a valve-acting metal; a porous layer, which is arranged on at least one main surface of the anode plate; a dielectric layer, which is arranged on the surface of the porous layer; and a cathode layer, which includes a solid electrolyte layer arranged on the surface of the dielectric layer, the solid electrolytic capacitor sheet has a first main surface and a second main surface that are opposite to each other in the thickness direction, the first main surface side and the second main surface side of each of the multiple solid electrolytic capacitor elements are covered by the sealing layer, and the solid electrolytic capacitor elements are divided by a slit-shaped sheet removal portion, and the sheet removal portion has a tapered shape whose width decreases from one main surface of the solid electrolytic capacitor element toward the other main surface.

Description

[0001] This application is a divisional application, and its original application is an invention patent application with application date of March 27, 2020, application number 202010233923.7, and the name of the invention is "Capacitor Array and Composite Electronic Components". Technical Field

[0002] The present invention relates to capacitor arrays and composite electronic components. Background Art

[0003] Patent document 1 discloses a solid electrolytic capacitor array, characterized in that it comprises: a capacitor element group, which is composed of a plurality of capacitor elements; one or more anode terminals, which are respectively connected to and led out of one or more anode lead-out lines of the capacitor elements of the capacitor element group; one or more cathode terminals, which are connected to and led out of the cathode layers of the capacitor elements; and an outer resin layer, which covers the capacitor elements and constitutes the anode terminals and the cathode terminals as external terminals.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2004-281750

[0007] According to Patent Document 1, a plurality of capacitor elements are connected to anode terminals and cathode terminals to form an array structure, thereby achieving low ESR (equivalent series resistance) and low ESL (equivalent series inductance), and making it easy to manufacture a solid electrolytic capacitor array with excellent high-frequency characteristics.

[0008] However, when multiple capacitor elements are arrayed using the method described in Patent Document 1, the pre-formed capacitor elements need to be connected to each other, so there are problems such as the manufacturing process becoming complicated and the overall volume capacitance density of the capacitor array being low. Therefore, it cannot be said that the performance for high frequency is optimal. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The present invention is made to solve the above-mentioned problems, and its purpose is to provide a capacitor array which integrates a plurality of solid electrolytic capacitor elements into one and has a high degree of layout freedom. In addition, the present invention also aims to provide a composite electronic component in which electronic components are mounted on external electrodes of the capacitor array.

[0011] Technical solutions to solve problems

[0012] The capacitor array of the present invention comprises: a plurality of solid electrolytic capacitor elements, which are formed by dividing a solid electrolytic capacitor sheet; and a sealing layer, wherein the solid electrolytic capacitor sheet comprises: an anode plate, which is made of a valve-acting metal; a porous layer, which is arranged on at least one main surface of the anode plate; a dielectric layer, which is arranged on the surface of the porous layer; and a cathode layer, which includes a solid electrolyte layer arranged on the surface of the dielectric layer, wherein the solid electrolytic capacitor sheet has a first main surface and a second main surface which are opposite to each other in the thickness direction, and the first main surface side and the second main surface side of each of the plurality of solid electrolytic capacitor elements are covered by the sealing layer, and the solid electrolytic capacitor elements are divided by a slit-shaped sheet removal portion, and the sheet removal portion has a tapered shape whose width decreases from one main surface of the solid electrolytic capacitor element toward the other main surface.

[0013] The composite electronic component of the present invention comprises: the capacitor array of the present invention; an external electrode arranged outside the sealing layer of the capacitor array and connected to the anode plate and the cathode layer of the capacitor array respectively; and an electronic component connected to the external electrode.

[0014] Effects of the Invention

[0015] According to the present invention, it is possible to provide a capacitor array in which a plurality of solid electrolytic capacitor elements are integrated into one and which has a high degree of freedom in layout, and a composite electronic component in which electronic components are mounted on external electrodes of the capacitor array. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a cross-sectional view schematically showing an example of a capacitor array according to the present invention.

[0017] Figure 2 It is an enlarged cross-sectional view schematically showing another example of the sheet removing portion.

[0018] Figure 3A is a perspective view schematically showing an example of a process for preparing a chemically formed foil. Figure 3B is its cross-sectional view.

[0019] Figure 4A is a perspective view schematically showing an example of a process for forming an insulating layer, Figure 4B is its cross-sectional view.

[0020] Figure 5 It is a perspective view schematically showing an example of a process of forming a through hole.

[0021] Fig. 6A is a perspective view schematically showing an example of a process for forming a solid electrolyte layer, Figure 6B is its cross-sectional view.

[0022] Fig. 7A is a perspective view schematically showing an example of a process for forming a carbon layer, Figure 7B is its cross-sectional view.

[0023] Fig. 8A is a perspective view schematically showing an example of a process for forming a copper layer, Figure 8B is its cross-sectional view.

[0024] Fig. 9A is a perspective view schematically showing an example of a process of configuring a first sealing layer, Fig. 9B is its cross-sectional view.

[0025] Fig. 10A is a perspective view schematically showing an example of a process of cutting a solid electrolytic capacitor sheet, Fig. 10B is its cross-sectional view.

[0026] Fig.11 This is a perspective view schematically showing an example of a process of arranging a capacitor element of a type different from the solid electrolytic capacitor element.

[0027] Fig. 12A is a perspective view schematically showing an example of a process of configuring a second sealing layer, Fig. 12B is its cross-sectional view.

[0028] Fig.13A is a perspective view schematically showing an example of a process of dividing into a plurality of capacitor arrays, Fig. 13B is its cross-sectional view.

[0029] Fig.14 It is a perspective view schematically showing an example of a process of forming an anode external electrode.

[0030] Fig.15 This is a perspective view schematically showing an example of a process of forming a cathode external electrode.

[0031] Fig.16 It is a perspective view schematically showing another example of the process of forming the cathode external electrode.

[0032] Fig.17 It is used to explain the function of the through hole. Fig.15 perspective view.

[0033] Fig.18 It is used to explain the function of the through hole. Fig.16 perspective view.

[0034] Fig.19A is a projected plan view of a first variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig.19B It is along Fig.19A Projected cross-sectional view of line bb.

[0035] Fig. 20A is a projected plan view of a second variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 20B It is along Fig. 20A Projected cross-sectional view of line bb.

[0036] Fig.21A is a projected plan view of a third variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 21B It is along Fig.21A Projected cross-sectional view of line bb.

[0037] Fig.22A is a projected plan view of a fourth variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 22B It is along Fig.22A Projected cross-sectional view of line bb.

[0038] Fig.23 This is a perspective view schematically showing another example of the process of cutting the solid electrolytic capacitor sheet.

[0039] Fig.24 FIG. 1 is a plan view schematically showing an example of a capacitor portion whose planar shape is not a rectangle.

[0040] Fig.25 is a cross-sectional view schematically showing an example of a capacitor array having a stress relief layer.

[0041] Fig.26 is schematically shown for making Fig.25 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown.

[0042] Fig. 27 is a cross-sectional view schematically showing another example of a capacitor array having a stress relief layer.

[0043] Fig.28 is schematically shown for making Fig. 27 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown.

[0044] Fig.29 is a cross-sectional view schematically showing another example of a capacitor array having a stress relief layer.

[0045] Fig.30 is schematically shown for making Fig.29 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown.

[0046] Description of Reference Numerals

[0047] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G: capacitor array;

[0048] 10A, 10B, 10C, 10D, 10E, 10F: solid electrolytic capacitor elements;

[0049] 11: 1st sealing layer;

[0050] 12: The second sealing layer;

[0051] 13: stress relief layer;

[0052] 20: formed into foil;

[0053] 21: anode plate;

[0054] 22: porous layer;

[0055] 23: dielectric layer;

[0056] 24: cathode layer;

[0057] 24a: solid electrolyte layer;

[0058] 24b: carbon layer;

[0059] 24c: copper layer;

[0060] 25, 25A: sheet removal portion;

[0061] 30: insulation layer;

[0062] 31, 31X, 31Y, 31Z, 32: through holes;

[0063] 41A, 41B, 41C, 41D, 41E, 41F: anode external electrodes;

[0064] 42A, 42B, 42C, 42D: cathode external electrodes;

[0065] 50: wire conductor;

[0066] 50A: via conductor;

[0067] 51: anode through-electrode;

[0068] 52: anode via conductor;

[0069] 53, 54: anode wiring pattern;

[0070] 61: cathode through electrode;

[0071] 62: cathode via conductor;

[0072] 63, 64: cathode wiring pattern;

[0073] 70: capacitor;

[0074] 71: through hole;

[0075] 72: insulation part;

[0076] 100: solid electrolytic capacitor sheet;

[0077] 110: Capacitor elements of a type different from solid electrolytic capacitor elements;

[0078] S1: 1st main surface;

[0079] S2: second main surface;

[0080] D 10 : The spacing of the anode plates;

[0081] X: anode;

[0082] Y: cathode. DETAILED DESCRIPTION

[0083] Hereinafter, the capacitor array and the composite electronic component of the present invention will be described.

[0084] However, the present invention is not limited to the following configurations, and can be applied with appropriate changes within the scope of the present invention. In addition, a configuration combining two or more of the preferred configurations of the present invention described below is also the present invention.

[0085] [Capacitor Array]

[0086] The capacitor array of the present invention comprises a plurality of solid electrolytic capacitor elements, a sheet-shaped first sealing layer, and a sheet-shaped second sealing layer. The first main surface side of each of the plurality of solid electrolytic capacitor elements is arranged on the first sealing layer, and the second sealing layer is arranged to cover the plurality of solid electrolytic capacitor elements on the first sealing layer from the second main surface side.

[0087] In the capacitor array of the present invention, the plurality of solid electrolytic capacitor elements are originally one solid electrolytic capacitor sheet, and the solid electrolytic capacitor elements are divided by slit-shaped sheet removal portions.

[0088] By forming a plurality of solid electrolytic capacitor elements from a single sheet, a capacitor array with high layout freedom can be manufactured at low cost, thereby flexibly responding to different wiring paths for each application such as a central processing unit (CPU) or a power management IC (PMIC).

[0089] Furthermore, by changing the size of the solid electrolytic capacitor element when it is divided, solid electrolytic capacitor elements with different characteristics can be arranged in the capacitor array, thereby making it possible to make the characteristic impedance of a wide frequency band uniform when connected in parallel.

[0090] In the capacitor array of the present invention, the first sealing layer and the second sealing layer are layers containing sealing resins such as epoxy resin and phenolic resin. It is necessary to control the glass transition temperature Tg and elastic modulus of the sealing layer so that stress is not applied to the element part due to these sealing layers when the capacitor array is formed and when thermal stress is applied. Specifically, it is preferred that the sealing layer is highly filled with inorganic fillers such as alumina and silica.

[0091] Figure 1 FIG. 1 is a cross-sectional view schematically showing an example of a capacitor array according to the present invention.

[0092] Figure 1 The capacitor array 1 shown in the figure includes a plurality of solid electrolytic capacitor elements 10A, 10B, and 10C, a sheet-shaped first sealing layer 11, and a sheet-shaped second sealing layer 12. The solid electrolytic capacitor element 10A has a thickness direction (in the Figure 1 The first main surface S1 and the second main surface S2 are opposite to each other in the vertical direction (in the vertical direction), and the first main surface S1 side is arranged on the first sealing layer 11. The same is true for the solid electrolytic capacitor elements 10B and 10C. The second sealing layer 12 is arranged to cover the plurality of solid electrolytic capacitor elements 10A, 10B and 10C on the first sealing layer 11 from the second main surface S2 side. Therefore, Figure 1 The capacitor array 1 shown has a sheet-like shape as a whole.

[0093] exist Figure 1 In the capacitor array 1 shown, the solid electrolytic capacitor element 10A includes: an anode plate 21; a porous layer 22 provided on at least one main surface of the anode plate 21; a dielectric layer 23 provided on the surface of the porous layer 22; and a cathode layer 24 provided on the surface of the dielectric layer 23. Figure 1 In the embodiment, the cathode layer 24 includes: a solid electrolyte layer 24a disposed on the surface of the dielectric layer 23; a carbon layer 24b disposed on the surface of the solid electrolyte layer 24a; and a copper layer 24c disposed on the surface of the carbon layer 24b. Figure 1 In the embodiment, the porous layer 22 and the dielectric layer 23 are provided on both main surfaces of the anode plate 21, and the cathode layer 24 is provided only on the second main surface S2 side. However, the cathode layer 24 may be provided only on the first main surface S1 side, or may be provided on both the first main surface S1 side and the second main surface S2 side. In addition, the porous layer 22 may be provided on both main surfaces of the anode plate 21, or may be provided on any one main surface. The same is true for the solid electrolytic capacitor elements 10B and 10C.

[0094] The solid electrolytic capacitor elements 10A, 10B, and 10C are originally a solid electrolytic capacitor sheet 100 (see Fig. 8A as well as Figure 8B The solid electrolytic capacitor element 10A and the solid electrolytic capacitor element 10B, and the solid electrolytic capacitor element 10B and the solid electrolytic capacitor element 10C are divided by the slit-shaped sheet removal portion 25. Therefore, the structures of the solid electrolytic capacitor elements 10A, 10B, and 10C are the same. In addition, the distance from the bottom surface of the second sealing layer 12 to the anode plate 21 of each solid electrolytic capacitor element 10A, 10B, and 10C is constant.

[0095] like Figure 1 As shown, it is preferred that the second sealing layer 12 enters between the anode plates 21 of the solid electrolytic capacitor elements adjacent to each other on the first sealing layer 11 toward the first sealing layer 11 and further enters a portion of the first sealing layer 11 .

[0096] When the second sealing layer 12 enters a portion of the first sealing layer 11 , the adhesion between the first sealing layer 11 and the second sealing layer 12 is improved, so the reliability of the capacitor array 1 is improved.

[0097] Although in Figure 1 In the capacitor array 1 shown, the second sealing layer 12 enters between the anode plates 21 of all adjacent solid electrolytic capacitor elements on the first sealing layer 11 toward the first sealing layer 11, and further enters a portion of the first sealing layer 11, but there may be a portion where the second sealing layer 12 does not enter a portion of the first sealing layer 11. In addition, the second sealing layer 12 may not enter the first sealing layer 11.

[0098] like Figure 1 As shown, it is preferable that an insulating layer 30 for insulating the anode plate 21 and the cathode layer 24 is provided on the surface of the dielectric layer 23 on the second main surface S2 side where the cathode layer 24 is not provided. Figure 1 In the embodiment, the insulating layer 30 is provided on the surface of the dielectric layer 23 on the first main surface S1 side. However, the insulating layer 30 may not be provided on the surface of the dielectric layer 23 on the first main surface S1 side.

[0099] Although in Figure 1 Although not shown, as will be described later, external electrodes connected to the anode plate 21 and the cathode layer 24 are provided outside the first sealing layer 11 or the second sealing layer 12 .

[0100] The method of connecting the anode plate or cathode layer and the external electrode is not particularly limited, but it is preferred that a through electrode is provided that penetrates the first sealing layer or the second sealing layer in the thickness direction, and the anode plate or cathode layer and the external electrode are connected via the through electrode. By using the through electrode, the lead-out distance from the anode plate or cathode layer to the external electrode can be shortened.

[0101] Although in Figure 1 In the capacitor array 1 shown, the side surfaces of the solid electrolytic capacitor elements 10A and 10C are exposed, but they may be covered by, for example, the first sealing layer or the second sealing layer, or may be covered by an insulating layer. In addition, a stress relief layer, a moisture-proof film, etc. may be provided between the solid electrolytic capacitor element and the first sealing layer or the second sealing layer.

[0102] In the capacitor array of the present invention, the distance between the anode plates of the adjacent solid electrolytic capacitor elements on the first sealing layer (in Figure 1 D 10 The length shown in the figure is not particularly limited, but is preferably 15 μm or more, more preferably 30 μm or more, and further preferably 50 μm or more. On the other hand, the spacing between the anode plates of the adjacent solid electrolytic capacitor elements on the first sealing layer is preferably 500 μm or less, more preferably 200 μm or less, and further preferably 150 μm or less.

[0103] In the capacitor array of the present invention, the number of solid electrolytic capacitor elements arranged on the first sealing layer can be two or more, without any particular limitation. The solid electrolytic capacitor elements can be arranged in a straight line or in a plane on the first sealing layer. In addition, the solid electrolytic capacitor elements can be arranged regularly or irregularly on the first sealing layer. The size, shape, etc. of the solid electrolytic capacitor elements can be the same, or they can be partially or completely different.

[0104] Figure 2 It is an enlarged cross-sectional view schematically showing another example of the sheet removing portion.

[0105] Figure 2 The sheet-removed portion 25A shown has a tapered shape whose width decreases from the second main surface S2 toward the first main surface S1 of the solid electrolytic capacitor elements 10A and 10B. The tapered shape of the sheet-removed portion 25A does not reach the porous layer 22 on the first main surface S1 side of the solid electrolytic capacitor elements 10A and 10B, nor does it reach the anode plate 21.

[0106] In the capacitor array of the present invention, it is preferred that the sheet material removal portion has a tapered shape whose width decreases from one main surface toward the other main surface of the solid electrolytic capacitor element. The sheet material removal portion may have a tapered shape whose width decreases from the second main surface toward the first main surface of the solid electrolytic capacitor element, or may have a tapered shape whose width decreases from the first main surface toward the second main surface of the solid electrolytic capacitor element.

[0107] Preferably, the above-mentioned taper does not reach the anode plate of the solid electrolytic capacitor element. In particular, in the case where the porous layer is provided on both main surfaces of the anode plate, it is preferred that the above-mentioned taper does not reach the porous layer on the other main surface side of the solid electrolytic capacitor element. In the case of a taper having a width that decreases from the second main surface toward the first main surface of the solid electrolytic capacitor element, it is preferred that the above-mentioned taper does not reach the porous layer on the first main surface side of the solid electrolytic capacitor element. On the other hand, in the case of a taper having a width that decreases from the first main surface toward the second main surface of the solid electrolytic capacitor element, it is preferred that the above-mentioned taper does not reach the porous layer on the second main surface side of the solid electrolytic capacitor element.

[0108] In the capacitor array of the present invention, the insulating layer is preferably composed of a resin. As the resin constituting the insulating layer, for example, insulating resins such as polyphenylsulfone resin, polyethersulfone resin, cyanate resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), polyimide resin, polyamide-imide resin, epoxy resin, and their derivatives or precursors can be cited. In addition, the insulating layer can be composed of the same resin as the first sealing layer and the second sealing layer. Unlike the first sealing layer and the second sealing layer, if an inorganic filler is included in the insulating layer, it is possible to adversely affect the effective part of the solid electrolytic capacitor element, so it is preferred that the insulating layer is composed of only resin alone.

[0109] In the capacitor array of the present invention, the first sealing layer and the second sealing layer are preferably composed of resin. As the resin constituting the first sealing layer and the second sealing layer, for example, epoxy resin, phenolic resin, etc. can be cited. Furthermore, the first sealing layer and the second sealing layer preferably contain fillers. As fillers contained in the first sealing layer and the second sealing layer, for example, inorganic fillers such as silica particles, alumina particles, and metal particles can be cited. The resin constituting the first sealing layer may be the same as the resin constituting the second sealing layer, or it may be different.

[0110] The first sealing layer and the second sealing layer may each be composed of only one layer or more than two layers. The number of layers constituting the first sealing layer may be the same as or different from the number of layers constituting the second sealing layer. In the case where the first sealing layer or the second sealing layer is composed of more than two layers, a through electrode penetrating each sealing layer between the anode plate or cathode layer and the external electrode in the thickness direction may also be provided, and an internal electrode may be provided between each sealing layer, and the anode plate or cathode layer and the external electrode are connected via the through electrode and the internal electrode.

[0111] In the capacitor array of the present invention, the anode plate of the solid electrolytic capacitor element is composed of a valve metal showing a so-called valve action. As the valve metal, for example, metal single substances such as aluminum, tantalum, niobium, titanium, zirconium, or alloys containing these metals can be listed. Among them, aluminum or aluminum alloys are preferred.

[0112] The shape of the anode plate is preferably a flat plate, more preferably a foil. The anode plate only needs to have a porous layer on at least one main surface, or may have a porous layer on both main surfaces. Preferably, the porous layer is an etching layer formed on the surface of the anode plate.

[0113] The thickness of the anode plate before etching is preferably 60 μm or more and 200 μm or less. The thickness of the core portion that has not been etched after etching is preferably 15 μm or more and 70 μm or less. The thickness of the porous layer is designed to match the required withstand voltage and electrostatic capacitance, but the porous layers on both sides of the core portion are preferably combined to be 10 μm or more and 180 μm or less.

[0114] In the capacitor array of the present invention, the dielectric layer of the solid electrolytic capacitor element is arranged on the surface of the porous layer. The dielectric layer is formed along the surface of the porous layer, thereby forming small holes (recesses). The dielectric layer is preferably composed of an oxide film of the above-mentioned valve action metal. For example, when aluminum foil is used as an anode plate, the surface of the aluminum foil is anodized (also called chemical treatment) in an aqueous solution containing ammonium adipate, etc., so that a dielectric layer composed of an oxide film can be formed.

[0115] The thickness of the dielectric layer is designed in accordance with the required withstand voltage and electrostatic capacitance, but is preferably not less than 10 nm and not more than 100 nm.

[0116] In the capacitor array of the present invention, the cathode layer of the solid electrolytic capacitor element is disposed on the surface of the dielectric layer. The cathode layer includes a solid electrolyte layer disposed on the surface of the dielectric layer. The cathode layer preferably further includes a conductor layer disposed on the surface of the solid electrolyte layer.

[0117] As materials constituting the solid electrolyte layer, for example, conductive polymers such as polypyrroles, polythiophenes, and polyanilines can be cited. Among them, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene) called PEDOT is particularly preferred. In addition, the conductive polymers may also contain dopants such as polystyrene sulfonic acid (PSS).

[0118] The solid electrolyte layer is formed, for example, by a method of forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer using a treatment solution containing a monomer such as 3,4-ethylenedioxythiophene; a method of applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) or the like to the surface of the dielectric layer and drying it; etc. In addition, it is preferred that an outer layer covering the dielectric layer is formed after an inner layer that fills the pores (recesses) of the dielectric layer is formed, thereby forming the solid electrolyte layer.

[0119] The solid electrolyte layer can be formed in a given region by applying the above-mentioned treatment liquid or dispersion liquid onto the dielectric layer by sponge transfer, screen printing, dispenser, inkjet printing, etc. The thickness of the solid electrolyte layer is preferably 2 μm or more and 20 μm or less.

[0120] The conductor layer includes at least one of a conductive resin layer and a metal layer. The conductor layer may be only a conductive resin layer or only a metal layer. The conductor layer preferably covers the entire surface of the solid electrolyte layer.

[0121] Examples of the conductive resin layer include a conductive adhesive layer containing at least one conductive filler selected from the group consisting of a silver filler, a copper filler, a nickel filler, and a carbon filler.

[0122] Examples of the metal layer include a metal plating film and a metal foil.

[0123] The metal layer is preferably composed of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as main components. The term "main component" refers to an element component having the largest abundance ratio (weight %).

[0124] The conductor layer includes, for example: a carbon layer provided on the surface of the solid electrolyte layer; and a cathode lead layer provided on the surface of the carbon layer.

[0125] The carbon layer is provided to electrically and mechanically connect the solid electrolyte layer and the cathode lead layer.

[0126] The carbon layer can be formed in a given area by applying carbon paste to the solid electrolyte layer using sponge transfer, screen printing, dispenser, inkjet printing, etc. In addition, the carbon layer is preferably laminated on the cathode lead layer of the next process in a sticky state before drying. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

[0127] The cathode lead layer is, for example, a printed electrode layer.

[0128] The printed electrode layer can be formed by printing an electrode paste onto the carbon layer using sponge transfer, screen printing, spraying, a dispenser, inkjet printing, etc. As the electrode paste, an electrode paste mainly composed of silver, copper or nickel is preferably used. In the case of screen printing, the thickness of the cathode lead layer can also be made greater than 2 μm and less than 20 μm.

[0129] The capacitor array of the present invention is preferably manufactured as follows.

[0130] The method for manufacturing a capacitor array of the present invention comprises: a step of preparing a solid electrolytic capacitor sheet having a first main surface and a second main surface facing each other in a thickness direction; a step of disposing a sheet-shaped first sealing layer on the first main surface side of the solid electrolytic capacitor sheet; a step of cutting the solid electrolytic capacitor sheet in the thickness direction from the second main surface side to thereby divide the solid electrolytic capacitor sheet into a plurality of solid electrolytic capacitor elements disposed on the first sealing layer; and a step of disposing a sheet-shaped second sealing layer so as to cover the plurality of solid electrolytic capacitor elements on the first sealing layer from the second main surface side.

[0131] When multiple solid electrolytic capacitor elements are individually arranged on the first sealing layer, it is necessary to provide gaps between adjacent solid electrolytic capacitor elements. Therefore, the greater the number of solid electrolytic capacitor elements, the greater the proportion of the gaps, while on the other hand, the smaller the proportion of the effective portion of the solid electrolytic capacitor element.

[0132] In contrast, by cutting the solid electrolytic capacitor sheet from the second main surface side with the first sealing layer disposed on the first main surface side to divide it into a plurality of solid electrolytic capacitor elements, a capacitor array in which the effective portion of the solid electrolytic capacitor elements occupies a large proportion can be manufactured.

[0133] Hereinafter, an example of each step will be described.

[0134] First, if Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 5 , Fig. 6A , Figure 6B , Fig. 7A , Figure 7B , Fig. 8Aas well as Figure 8B As shown, prepare a solid electrolytic capacitor sheet.

[0135] Figure 3A is a perspective view schematically showing an example of a process for preparing a chemically formed foil. Figure 3B is its cross-sectional view.

[0136] A chemical foil 20 of aluminum or the like is prepared as the anode plate 21 having a porous layer 22 provided on at least one main surface and a dielectric layer 23 provided on the surface of the porous layer 22. Alternatively, instead of the chemical foil 20, for example, an aluminum foil may be prepared as the anode plate, and the porous layer may be formed by etching the surface of the aluminum foil, and then anodizing the aluminum foil in an aqueous solution containing ammonium adipate or the like may be performed to form a dielectric layer composed of an oxide film.

[0137] Figure 4A is a perspective view schematically showing an example of a process for forming an insulating layer, Figure 4B is its cross-sectional view.

[0138] In order to separate the effective part of the solid electrolytic capacitor element, an insulating resin is applied on the dielectric layer 23 to form the insulating layer 30. The method of applying the insulating resin is not particularly limited, and examples thereof include a dispenser, screen printing, and the like. Figure 4A In the example, a region where a total of six solid electrolytic capacitor elements (3 vertically and 2 horizontally) are mounted constitutes one capacitor array unit.

[0139] Figure 5 It is a perspective view schematically showing an example of a process of forming a through hole.

[0140] A through hole 31 is formed at a predetermined position around the capacitor array unit, and the through hole 31 penetrates the chemically formed foil 20 on which the insulating layer 30 is formed in the thickness direction.

[0141] As described later, a through electrode is formed in the through hole 31. The through electrode is used to connect the anode plate and the external electrode, or to connect the cathode layer and the external electrode. The through electrode can also be used to connect the cathode layers that are formed to sandwich the anode plate. In addition, the through electrode can also be used for connections other than those mentioned above. As described in [Composite Electronic Components], the capacitor array of the present invention becomes a composite electronic component by installing electronic components. In the composite electronic component, the external electrode of the capacitor array and the electronic component are connected in the thickness direction, or the electronic components outside the capacitor array are connected in the thickness direction via the through electrode formed in the through hole 31.

[0142] Furthermore, it is also possible to Figure 5As shown, through-hole 32 is formed for arranging a capacitor element of a type different from the solid electrolytic capacitor element.

[0143] Fig. 6A is a perspective view schematically showing an example of a process for forming a solid electrolyte layer, Figure 6B is its cross-sectional view.

[0144] The solid electrolyte layer 24a is formed on the dielectric layer 23. For example, the solid electrolyte layer can be formed by a method including forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer using a treatment solution containing a monomer such as 3,4-ethylenedioxythiophene; applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer and drying it; etc. In addition, it is preferred that the solid electrolyte layer is formed by forming an outer layer covering the dielectric layer after forming an inner layer that fills the pores of the dielectric layer.

[0145] Fig. 7A is a perspective view schematically showing an example of a process for forming a carbon layer, Figure 7B is its cross-sectional view.

[0146] The carbon layer 24b is formed on the solid electrolyte layer 24a. For example, the carbon layer can be formed by applying a conductive adhesive paste containing a carbon filler and drying it.

[0147] Fig. 8A is a perspective view schematically showing an example of a process for forming a copper layer, Figure 8B is its cross-sectional view.

[0148] The copper layer 24c is formed on the carbon layer 24b. As a result, the cathode layer 24 including the solid electrolyte layer 24a, the carbon layer 24b and the copper layer 24c is formed on the dielectric layer 23. For example, the copper layer can be formed using a conductive adhesive paste containing a copper filler, or by copper plating.

[0149] Based on the above, the following solid electrolytic capacitor sheet 100 can be obtained, which includes: an anode plate 21; a porous layer 22 provided on at least one main surface of the anode plate 21; a dielectric layer 23 provided on the surface of the porous layer 22; and a cathode layer 24 provided on the surface of the dielectric layer 23. Figure 8B As shown, the solid electrolytic capacitor sheet 100 has a first main surface S1 and a second main surface S2 that are opposed to each other in the thickness direction.

[0150] Then, if Fig. 9A as well as Fig. 9B As shown in FIG. 1 , a sheet-shaped first sealing layer is disposed on the first main surface side of the solid electrolytic capacitor sheet.

[0151] Fig. 9A is a perspective view schematically showing an example of a process of configuring a first sealing layer, Fig. 9B is its cross-sectional view.

[0152] The first sealing layer 11 is disposed on the first main surface S1 side of the solid electrolytic capacitor sheet 100 . For example, a sheet made of an insulating resin is bonded to the solid electrolytic capacitor sheet. The first sealing layer 11 may enter a portion of the through holes 31 and 32 .

[0153] Next, if Fig. 10A as well as Fig. 10B As shown, the solid electrolytic capacitor sheet is cut in the thickness direction from the second main surface side to be divided into a plurality of solid electrolytic capacitor elements arranged on the first sealing layer. Examples of the cutting method include laser processing and scribing processing.

[0154] Fig. 10A is a perspective view schematically showing an example of a process of cutting a solid electrolytic capacitor sheet, Fig. 10B is its cross-sectional view.

[0155] The solid electrolytic capacitor sheet 100 is cut in the thickness direction from the second main surface S2 side using the first sealing layer 11 on the first main surface S1 side as a support. At this time, it is preferred that a portion of the first sealing layer 11 is also cut. Thus, the solid electrolytic capacitor sheet 100 is divided into solid electrolytic capacitor elements 10A, 10B, 10C, 10D, 10E, and 10F by the slit-shaped sheet removal portion 25 in a state of being arranged on the first sealing layer 11. Strictly speaking, Fig. 10A As shown, the solid electrolytic capacitor element is not divided in the adjacent portions of the capacitor array units, but it can be considered that the solid electrolytic capacitor elements 10A, 10B, 10C, 10D, 10E, and 10F are divided in one capacitor array unit.

[0156] The width of the sheet removal portion is not particularly limited, but is preferably 15 μm or more, more preferably 30 μm or more, and further preferably 50 μm or more. On the other hand, the spacing between the anode plates of the adjacent solid electrolytic capacitor elements on the first sealing layer is preferably 500 μm or less, more preferably 200 μm or less, and further preferably 150 μm or less.

[0157] The aspect ratio of the sheet removed portion, which is a ratio of length to width, is preferably 10 or more, and more preferably 100 or more. On the other hand, the aspect ratio of the sheet removed portion is preferably 1000 or less.

[0158] Fig.11 This is a perspective view schematically showing an example of a process of arranging a capacitor element of a type different from the solid electrolytic capacitor element.

[0159] like Fig.11 As shown, a capacitor element 110 of a different type from the solid electrolytic capacitor element may be arranged in the space where the through hole 32 is formed. Examples of the capacitor element of a different type from the solid electrolytic capacitor element include a multilayer ceramic capacitor and a silicon capacitor.

[0160] Then, if Fig. 12A as well as Fig. 12B As shown, the sheet-shaped second sealing layer is arranged so as to cover the plurality of solid electrolytic capacitor elements on the first sealing layer from the second main surface side.

[0161] Fig. 12A is a perspective view schematically showing an example of a process of configuring a second sealing layer, Fig. 12B is its cross-sectional view.

[0162] The second sealing layer 12 is arranged so as to cover the plurality of solid electrolytic capacitor elements 10A, 10B, 10C, 10D, 10E, and 10F from the second main surface S2 side. For example, a sheet made of an insulating resin is bonded to the solid electrolytic capacitor element. At this time, the second sealing layer 12 enters between the anode plates 21 of the solid electrolytic capacitor elements adjacent to each other on the first sealing layer 11 toward the first main surface S1 side, and further enters a portion of the first sealing layer 11.

[0163] Fig.13A is a perspective view schematically showing an example of a process of dividing into a plurality of capacitor arrays, Fig. 13B is its cross-sectional view.

[0164] like Fig.13A as well as Fig. 13B As shown, by cutting each capacitor array unit, a capacitor array 1 in which a plurality of solid electrolytic capacitor elements 10A, 10B, 10C, 10D, 10E, and 10F are mounted in one array can be obtained.

[0165] In the above method, a large sheet of chemically formed foil is used and divided into a plurality of capacitor arrays. However, a chemically formed foil having a size sufficient to obtain one capacitor array may be used without performing the step of dividing into capacitor arrays.

[0166] In the method for manufacturing a capacitor array of the present invention, it is preferred that the second sealing layer is arranged after the solid electrolytic capacitor sheet is cut as in the above-mentioned method. However, it is also possible to arrange a portion of the second sealing layer, cut the solid electrolytic capacitor sheet together with the second sealing layer, and then arrange the remaining second sealing layer on the second main surface side.

[0167] Based on the above, the capacitor array of the present invention can be manufactured.

[0168] After the capacitor array is manufactured as described above, external electrodes connected to the anode plate and cathode layer of the capacitor array are preferably formed on the outside of the first sealing layer or the second sealing layer of the capacitor array. For example, an external electrode having a desired pattern can be formed by etching after the copper foil is attached. Hereinafter, the external electrode connected to the anode plate is also referred to as an anode external electrode, and the external electrode connected to the cathode layer is also referred to as a cathode external electrode.

[0169] Fig.14 It is a perspective view schematically showing an example of a process of forming an anode external electrode.

[0170] exist Fig.14 In the embodiment, anode external electrodes 41A, 41B, 41C, 41D, 41E and 41F are formed on the outer side of the second sealing layer 12 for each anode plate 21. Fig.14 As shown, anode external electrode 41B may be formed so as to connect solid electrolytic capacitor element 10B and capacitor element 110 in parallel.

[0171] Fig.15 This is a perspective view schematically showing an example of a process of forming a cathode external electrode.

[0172] exist Fig.15 In the embodiment, cathode external electrodes 42A, 42B, 42C, and 42D are formed outside the second sealing layer 12. The cathode external electrode 42A is commonly connected to the cathode layer 24 of the solid electrolytic capacitor elements 10A and 10B, and the cathode external electrode 42C is commonly connected to the cathode layer 24 of the solid electrolytic capacitor elements 10D and 10E. Alternatively, a cathode external electrode may be formed on each cathode layer.

[0173] Fig.16 It is a perspective view schematically showing another example of the process of forming the cathode external electrode.

[0174] exist Fig.16 In the embodiment, cathode external electrodes 42A and 42B are formed outside the second sealing layer 12. The cathode external electrode 42A is commonly connected to the cathode layer 24 of the solid electrolytic capacitor elements 10A, 10B, 10D, and 10E, and the cathode external electrode 42B is commonly connected to the cathode layer 24 of the solid electrolytic capacitor elements 10C and 10F.

[0175] Although not shown in the figure, it is preferred to form a through electrode that penetrates the second sealing layer (or the first sealing layer) in the thickness direction, and connect the anode plate and the anode external electrode, and connect the cathode layer and the cathode external electrode via the through electrode. The method of forming the through electrode is not particularly limited, and for example, a method of performing laser via processing after forming the anode external electrode and the cathode external electrode can be cited. In addition, the through electrode can be formed before configuring the first sealing layer or the second sealing layer, or after configuring the first sealing layer or the second sealing layer and before forming the anode external electrode and the cathode external electrode.

[0176] Fig.17 It is used to explain the function of the through hole. Fig.15 perspective view. Fig.18 It is used to explain the function of the through hole. Fig.16 perspective view.

[0177] exist Fig.17 as well as Fig.18 In the embodiment, the through hole 31X is used for connection between the anode plate and the external electrode, and the through hole 31Y is used for connection between the cathode layer and the external electrode. In addition, the through hole 31Z is used for connection other than the capacitor.

[0178] In addition, the anode external electrode and the cathode external electrode may be formed simultaneously or separately.

[0179] Hereinafter, modified examples of the structure of the anode and the cathode will be described with reference to the drawings. In the following drawings, only characteristic structures are shown, and structures such as the dielectric layer, the solid electrolyte layer, and the insulating layer are omitted.

[0180] Fig.19A is a projected plan view of a first variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig.19B It is along Fig.19A Projected cross-sectional view of line bb.

[0181] Fig.19A as well as Fig.19B The capacitor array 1A shown in the figure comprises: a line conductor 50; an anode through-electrode 51 penetrating the first sealing layer 11 and the second sealing layer 12 in the thickness direction; an anode via-conductor 52 penetrating the second sealing layer 12 in the thickness direction; an anode wiring pattern 53 provided on the outside of the second sealing layer 12; and an anode wiring pattern 54 provided on the outside of the first sealing layer 11. Fig.19A as well as Fig.19BIn the capacitor array 1A shown, a part of the porous layer 22 is removed in a linear shape, and a wire conductor 50 is provided in the removed part. Furthermore, an anode via conductor 52 is provided just above the wire conductor 50, and an anode wiring pattern 53 is provided just above the anode via conductor 52. The anode plate 21 is electrically connected to the anode through-electrode 51 via the wire conductor 50, the anode via conductor 52, and the anode wiring pattern 53.

[0182] Fig.19A as well as Fig.19B The capacitor array 1A shown further includes: a cathode through-electrode 61 penetrating the first sealing layer 11 and the second sealing layer 12 in the thickness direction; a cathode via-hole conductor 62 penetrating the second sealing layer 12 in the thickness direction; a cathode wiring pattern 63 provided on the outside of the second sealing layer 12; and a cathode wiring pattern 64 provided on the outside of the first sealing layer 11. The cathode via-hole conductor 62 is provided directly above the cathode layer 24, and the cathode wiring pattern 63 is provided directly above the cathode via-hole conductor 62. The cathode layer 24 is electrically connected to the cathode through-electrode 61 via the cathode via-hole conductor 62 and the cathode wiring pattern 63.

[0183] like Fig.19A As shown, the anodes X and the cathodes Y are preferably arranged alternately in a line.

[0184] Fig. 20A is a projected plan view of a second variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 20B It is along Fig. 20A Projected cross-sectional view of line bb.

[0185] Fig. 20A as well as Fig. 20B The capacitor array 1B shown has the same structure as that of the anode through-electrode 51 except that the line conductor 50 is located on the same line as the anode through-electrode 51. Fig.19A as well as Fig.19B The capacitor array 1A shown has the same structure. Fig. 20A The anode wiring pattern 53 is omitted. Fig. 20B The anode via conductor 52 is omitted.

[0186] like Fig. 20A As shown, the anodes X and the cathodes Y are preferably arranged alternately in a line.

[0187] Fig.21A is a projected plan view of a third variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 21B It is along Fig.21A Projected cross-sectional view of line bb.

[0188] Fig.21A as well as Fig. 21BThe capacitor array 1C shown has the same structure as that shown in FIG. 1 except that a via-hole conductor 50A is provided in place of the line conductor 50. Fig.19A as well as Fig.19B The capacitor array 1A shown has the same structure. Fig.21A as well as Fig. 21B In the capacitor array 1C shown in FIG. 1 , an opening is formed in a portion of the porous layer 22, and a via conductor 50A is provided in the opening. Fig.21A as well as Fig. 21B The capacitor array 1C shown, with Fig.19A as well as Fig.19B Compared with the capacitor array 1A shown, space can be saved.

[0189] like Fig.21A As shown, the anodes X and the cathodes Y are preferably arranged alternately in a line.

[0190] Fig.22A is a projected plan view of a fourth variation of the structure of the anode and the cathode observed from the second sealing layer side. Fig. 22B It is along Fig.22A Projected cross-sectional view of line bb.

[0191] exist Fig.22A as well as Fig. 22B In the capacitor array 1D shown in FIG. 1 , the anode plate 21 is directly connected via the wall surface of the anode through-electrode 51. Fig.22A as well as Fig. 22B In the capacitor array 1D shown, space can be saved.

[0192] like Fig.22A As shown, the anode X and the cathode Y are preferably arranged in a zigzag grid.

[0193] As described above, in the capacitor array of the present invention, when viewed from the first sealing layer side or the second sealing layer side, the anodes and the cathodes can be arranged alternately in a line or in a zigzag grid.

[0194] In the capacitor array of the present invention, the anode can be led out and connected to the anode through-electrode in either the main surface direction or the end surface direction.

[0195] As described above, when manufacturing the capacitor array of the present invention, as a method of cutting the solid electrolytic capacitor sheet, laser processing, dicing processing, etc. can be listed. Among them, in particular, by using laser processing to cut the solid electrolytic capacitor sheet, the solid electrolytic capacitor element can be formed into a free shape. Therefore, it is possible to configure two or more solid electrolytic capacitor elements with different areas of the capacitor part in a capacitor array; configure the sheet removal part so that it is not provided in the entire capacitor array; configure a solid electrolytic capacitor element whose plane shape of the capacitor part is not rectangular; etc.

[0196] Fig.23 This is a perspective view schematically showing another example of the process of cutting the solid electrolytic capacitor sheet.

[0197] exist Fig.23 The shape of the divided solid electrolytic capacitor element is Fig. 10A Different. Fig.23 In the example shown, the sheet-removed portion 25 is used to divide the solid electrolytic capacitor elements 10A, 10B, and 10C into three types having different capacitance portions. Fig.23 In the embodiment, solid electrolytic capacitor element 10C is arranged on the extension of sheet removed portion 25 that separates solid electrolytic capacitor elements 10A and 10B.

[0198] As described above, in the capacitor array of the present invention, at least a part of the sheet removed portion may be arranged so as not to be provided in the entire capacitor array.

[0199] In the capacitor array of the present invention, at least one solid electrolytic capacitor element may be arranged on an extension of the sheet removed portion.

[0200] The capacitor array of the present invention may include two or more types of solid electrolytic capacitor elements having capacitance portions having different areas.

[0201] In the capacitor array of the present invention, it is also possible to include a solid electrolytic capacitor element whose plane shape of the capacitor portion is not a rectangle. In this specification, the so-called "rectangle" means a square or a rectangle. Therefore, in the capacitor array of the present invention, for example, it is also possible to include a solid electrolytic capacitor element whose plane shape of the capacitor portion is a quadrilateral, triangle, pentagon, hexagon or other polygon other than a rectangle, a shape including a curved portion, a circle, an ellipse, etc. In this case, it is also possible to include two or more solid electrolytic capacitor elements whose plane shapes of the capacitor portion are different. In addition, in addition to the solid electrolytic capacitor element whose plane shape of the capacitor portion is not a rectangle, it is also possible to include a solid electrolytic capacitor element whose plane shape of the capacitor portion is a rectangle, or it is also possible not to include.

[0202] Fig.24FIG. 1 is a plan view schematically showing an example of a capacitor portion whose planar shape is not a rectangle.

[0203] Fig.24 The capacitor portion 70 shown in the figure has a non-rectangular shape and has a through hole 71 formed inside. The through electrode described above can be formed inside the through hole 71. Fig.24 In the embodiment, an insulating portion 72 is provided on the outer wall surface and the inner wall surface of the capacitor portion 70 .

[0204] As described above, the capacitor array of the present invention may further include a stress relief layer between the solid electrolytic capacitor element and the first sealing layer or the second sealing layer. In this case, the stress relief layer is provided between the solid electrolytic capacitor element and the first sealing layer, and between the solid electrolytic capacitor element and the second sealing layer.

[0205] When the capacitor array of the present invention is provided with a stress relief layer, the stress relief layer may also be provided in the sheet removal portion. In other words, the stress relief layer may also be provided between adjacent solid electrolytic capacitor elements.

[0206] By providing a stress relief layer at the above-mentioned position, the stress generated between the inside and outside of the capacitor array can be relieved without damaging the capabilities (resistance, barrier performance, etc.) required by the outermost conductor and insulating portion of the solid electrolytic capacitor element and the capabilities required by the sealing layer (easy to be in close contact with the wiring, easy to be formed smooth, etc.). In particular, in the case of different layouts within the surface (for example, the shape of the solid electrolytic capacitor element is asymmetric within the main surface or asymmetric with another main surface), etc., by providing a stress relief layer, only a part of the thermal characteristics are different, so that the stress in the surface direction can also be relieved.

[0207] Fig.25 is a cross-sectional view schematically showing an example of a capacitor array having a stress relief layer. Fig.26 is schematically shown for making Fig.25 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown. Fig.26 For convenience, only one capacitor array is provided with a stress relief layer. Fig.25 Corresponds to Fig.26 A cross section of a solid electrolytic capacitor sheet is shown along the arrow.

[0208] Fig.25 The capacitor array 1E shown in the figure includes a stress relaxation layer 13 between the solid electrolytic capacitor elements 10A, 10B, 10C and the first sealing layer 11, and between the solid electrolytic capacitor elements 10A, 10B, 10C and the second sealing layer 12. Fig.25 In the capacitor array 1E shown, the stress relaxation layer 13 is provided so as to cover the entire insulating layer 30 . Furthermore, the stress relaxation layer 13 is filled in the sheet removal portion 25 .

[0209] Although in Fig.26 Although not shown in the figure, the stress relief layer 13 is also provided between the solid electrolytic capacitor elements 10D, 10E, 10F and the first sealing layer 11. Fig.26 The second sealing layer 12 is configured in the state shown, so that the stress relaxation layer 13 is also provided between the solid electrolytic capacitor elements 10D, 10E, 10F and the second sealing layer 12. Fig.26 The through hole 31 shown may be filled with the stress relief layer 13 or may not be filled.

[0210] Fig. 27 is a cross-sectional view schematically showing another example of a capacitor array having a stress relief layer. Fig.28 is a schematic diagram showing the method for making Fig. 27 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown. Fig.28 For convenience, only one capacitor array is provided with a stress relief layer. Fig. 27 Corresponds to Fig.28 A cross section of a solid electrolytic capacitor sheet is shown along the arrow.

[0211] Fig. 27 The capacitor array 1F shown in the figure includes a stress relaxation layer 13 between the solid electrolytic capacitor elements 10A, 10B, 10C and the first sealing layer 11, and between the solid electrolytic capacitor elements 10A, 10B, 10C and the second sealing layer 12. Fig. 27 In the capacitor array 1F shown, the stress relaxation layer 13 is provided so as to cover not only the entire insulating layer 30 but also the entire solid electrolytic capacitor elements 10A, 10B, and 10C. Furthermore, the stress relaxation layer 13 is filled into the sheet removal portion 25 .

[0212] Although in Fig.28 Although not shown in the figure, the stress relief layer 13 is also provided between the solid electrolytic capacitor elements 10D, 10E, 10F and the first sealing layer 11. Fig.28 The second sealing layer 12 is configured in the state shown, so that the stress relaxation layer 13 is also provided between the solid electrolytic capacitor elements 10D, 10E, 10F and the second sealing layer 12. Fig.28 The through hole 31 shown may be filled with the stress relief layer 13 or may not be filled.

[0213] Fig.29is a cross-sectional view schematically showing another example of a capacitor array having a stress relief layer. Fig.30 is a schematic diagram showing the method for making Fig.29 A perspective view of an example of a solid electrolytic capacitor sheet of a capacitor array is shown. Fig.30 For convenience, only one capacitor array is provided with a stress relief layer. Fig.29 Corresponds to Fig.30 A cross section of a solid electrolytic capacitor sheet is shown along the arrow.

[0214] exist Fig.29 In the embodiment, the stress relief layer 13 is provided only on a part of the capacitor array 1G. Fig.29 The capacitor array 1G shown includes stress relaxation layers 13 between the solid electrolytic capacitor elements 10B and 10C and the first sealing layer 11 , and between the solid electrolytic capacitor elements 10A and 10C and the second sealing layer 12 . Furthermore, the stress relaxation layers 13 are filled in the sheet removed portion 25 .

[0215] Although in Fig.30 Although not shown, a stress relief layer 13 may or may not be provided between at least one of the solid electrolytic capacitor elements 10D, 10E, and 10F and the first sealing layer 11. In addition, a stress relief layer 13 may or may not be provided between at least one of the solid electrolytic capacitor elements 10D, 10E, and 10F and the second sealing layer 12. Fig.30 The through hole 31 shown may be filled with the stress relief layer 13 or may not be filled.

[0216] For example, when the shape of the solid electrolytic capacitor element is asymmetric within a main surface or asymmetric with respect to another main surface, it is possible to Fig.29 As in the capacitor array 1G shown in the figure, by providing the stress relaxation layer 13 only in a part of the capacitor array, the thermal stress of the entire capacitor array is balanced.

[0217] In the capacitor array of the present invention, the stress relief layer is preferably composed of an insulating resin. As an insulating resin constituting the stress relief layer, for example, epoxy resin, phenolic resin, silicone resin, etc. can be cited. Furthermore, it is preferred that the stress relief layer comprises a filler. As a filler included in the stress relief layer, for example, inorganic fillers such as silica particles, alumina particles, and metal particles can be cited. The insulating resin that preferably constitutes the stress relief layer is different from the resin that constitutes the first sealing layer and the second sealing layer.

[0218] As for the first sealing layer and the second sealing layer, as an outer casing, they are required to have properties such as close contact with the external electrode, so it is difficult to generally match the linear expansion coefficient with the solid electrolytic capacitor element and select a resin with an arbitrary elastic modulus. In contrast, by providing a stress relief layer, it is possible to adjust the thermal stress design without damaging the functions of the solid electrolytic capacitor element, the first sealing layer, and the second sealing layer.

[0219] Preferably, the moisture permeability of the stress relief layer is lower than at least one of the first sealing layer and the second sealing layer. In this case, in addition to the adjustment of stress, the infiltration of water into the solid electrolytic capacitor element can be reduced. The moisture permeability of the stress relief layer can be adjusted according to the type of insulating resin constituting the stress relief layer, the amount of filler contained in the stress relief layer, etc.

[0220] In the capacitor array of the present invention, when a stress relief layer is provided between the solid electrolytic capacitor element and the first sealing layer, it is sufficient that a stress relief layer is provided between at least one solid electrolytic capacitor element and the first sealing layer. The stress relief layer may not be provided in the entirety between the solid electrolytic capacitor element and the first sealing layer, or there may be a portion between the solid electrolytic capacitor element and the first sealing layer where no stress relief layer is provided.

[0221] In the capacitor array of the present invention, when a stress relief layer is provided between the solid electrolytic capacitor element and the second sealing layer, it is sufficient as long as a stress relief layer is provided between at least one solid electrolytic capacitor element and the second sealing layer. The stress relief layer may not be provided in the entirety between the solid electrolytic capacitor element and the second sealing layer, or there may be a portion between the solid electrolytic capacitor element and the second sealing layer where no stress relief layer is provided.

[0222] In the capacitor array of the present invention, when a stress relief layer is provided between the solid electrolytic capacitor element and the first sealing layer, and between the solid electrolytic capacitor element and the second sealing layer, it is sufficient as long as a stress relief layer is provided between at least one solid electrolytic capacitor element and the first sealing layer, and between at least one solid electrolytic capacitor element and the second sealing layer. There may be a solid electrolytic capacitor element having a stress relief layer provided only on the first sealing layer side, there may be a solid electrolytic capacitor element having a stress relief layer provided only on the second sealing layer side, and there may be a solid electrolytic capacitor element having a stress relief layer provided on both the first sealing layer side and the second sealing layer side. The stress relief layer may not be provided on the entirety between the solid electrolytic capacitor element and the first sealing layer or the second sealing layer, and there may be a portion between the solid electrolytic capacitor element and the first sealing layer or the second sealing layer where a stress relief layer is not provided.

[0223] In the capacitor array of the present invention, when a stress relief layer is provided in the sheet removal portion, it is sufficient as long as a stress relief layer is provided in at least one sheet removal portion. Preferably, the stress relief layer is filled in the sheet removal portion. Furthermore, preferably, the stress relief layer enters a portion of the first sealing layer.

[0224] [Composite electronic components]

[0225] The composite electronic component of the present invention comprises: the capacitor array of the present invention; an external electrode arranged outside the first sealing layer or the second sealing layer of the above-mentioned capacitor array and connected to the anode plate and the cathode layer of the above-mentioned capacitor array respectively; and an electronic component connected to the above-mentioned external electrode.

[0226] In the composite electronic component of the present invention, the electronic component connected to the external electrode may be either a passive component or an active component. Both the passive component and the active component may be connected to the external electrode, or either the passive component or the active component may be connected to the external electrode. In addition, a composite of a passive component and an active component may be connected to the external electrode.

[0227] Passive components include, for example, inductors, etc. Active components include memories, GPUs (Graphical Processing Units), CPUs (Central Processing Units), MPUs (Micro Processing Units), PMICs (Power Management ICs), etc.

[0228] As described so far, the capacitor array of the present invention has a sheet-like shape as a whole. Therefore, in the composite electronic component of the present invention, the capacitor array can be treated like a mounting substrate, and the electronic components can be mounted on the capacitor array. Furthermore, by making the shape of the electronic components mounted on the capacitor array into a sheet, the capacitor array and the electronic components can be connected in the thickness direction via through electrodes that penetrate each electronic component in the thickness direction. As a result, active components and passive components can be configured as a unified module.

[0229] For example, the capacitor array of the present invention can be electrically connected between a voltage regulator including a semiconductor active element and a load to which a converted DC voltage is supplied, thereby forming a switching regulator.

[0230] In the composite electronic component of the present invention, after forming a circuit layer on any one surface of the capacitor matrix sheet on which a plurality of capacitor arrays of the present invention are laid out, passive elements or active elements may be connected.

[0231] In addition, the capacitor array of the present invention may be arranged in a cavity pre-set in the substrate, and potted with resin, and then a circuit layer may be formed on the resin. Another passive component or active component may also be mounted in another cavity of the substrate.

[0232] Alternatively, the capacitor array of the present invention may be mounted on a smooth carrier such as a wafer or glass, and an outer layer portion made of resin may be formed, and then a circuit layer may be formed, and then connected to passive elements or active elements.

Claims

1. A capacitor array, comprising: A plurality of solid electrolytic capacitor elements, formed by dividing a solid electrolytic capacitor sheet; and Sealing layer, The solid electrolytic capacitor sheet comprises: an anode plate made of a valve-acting metal; a porous layer provided on at least one main surface of the anode plate; a dielectric layer provided on a surface of the porous layer; and a cathode layer including a solid electrolyte layer provided on a surface of the dielectric layer, wherein the solid electrolytic capacitor sheet has a first main surface and a second main surface facing each other in a thickness direction. The first main surface side and the second main surface side of each of the plurality of solid electrolytic capacitor elements are covered by the sealing layer, The solid electrolytic capacitor elements are divided by slit-shaped sheet removal portions. The sheet-removed portion has a tapered shape in which the width decreases from one main surface toward the other main surface of the solid electrolytic capacitor element.

2. The capacitor array according to claim 1, wherein: The distance from the surface of the sealing layer to the anode plate of each of the solid electrolytic capacitor elements is constant.

3. The capacitor array according to claim 1 or 2, wherein: The width of the sheet removed portion is 15 μm or more and 500 μm or less.

4. The capacitor array according to claim 3, wherein: The width of the sheet removed portion is 200 μm or less.

5. The capacitor array according to claim 1 or 2, wherein: The sheet removed portion has an aspect ratio of 10 or more, the aspect ratio being a ratio of length to width.

6. The capacitor array according to claim 1 or 2, wherein: At least a portion of the sheet removed portion is configured not to be provided in the entire capacitor array.

7. The capacitor array according to claim 1 or 2, wherein: At least one solid electrolytic capacitor element is arranged in a region along a direction in which the sheet removed portion extends.

8. The capacitor array according to claim 1 or 2, wherein: The porous layer is provided on the two main surfaces of the anode plate. The taper does not reach the porous layer on the other main surface side of the solid electrolytic capacitor element.

9. The capacitor array according to claim 1 or 2, wherein: The plurality of solid electrolytic capacitor elements include two or more types of solid electrolytic capacitor elements having different capacitance portions in area.

10. The capacitor array according to claim 1 or 2, wherein: The plurality of solid electrolytic capacitor elements include solid electrolytic capacitor elements whose capacitance portions are not rectangular in plan view.

11. The capacitor array according to claim 1 or 2, wherein: A stress relief layer is further provided between the solid electrolytic capacitor element and the sealing layer.

12. The capacitor array according to claim 11, wherein: The stress relief layer is also disposed in the sheet removal portion.

13. The capacitor array according to claim 11, wherein: The stress relief layer is made of insulating resin.

14. The capacitor array according to claim 11, wherein: The stress relief layer has lower moisture permeability than the sealing layer.

15. The capacitor array according to claim 1 or 2, wherein: The porous layer is an etching layer formed on the surface of the anode plate.

16. The capacitor array according to claim 1 or 2, wherein: In the solid electrolytic capacitor elements adjacent to each other with the sheet removed portion interposed therebetween, the anode plates face each other with an insulating material interposed therebetween.

17. The capacitor array according to claim 1 or 2, wherein: In the solid electrolytic capacitor elements adjacent to each other across the sheet removed portion, the anode plates face each other without sandwiching the cathode layer.

18. The capacitor array according to claim 1 or 2, wherein: The cathode layer provided on the main surface side of the anode plate does not reach the sheet removed portion.

19. A composite electronic component comprising: The capacitor array according to any one of claims 1 to 18; an external electrode, disposed outside the sealing layer of the capacitor array and connected to the anode plate and the cathode layer of the capacitor array respectively; and The electronic component is connected to the external electrode.

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