Electronic devices and photovoltaic power optimizers

Abstract

The present application provides an electronic device and a photovoltaic power optimizer. The electronic device includes a circuit board, a heat dissipation housing and an insulating member. The circuit board has a first surface and a second surface relative to each other, a first heat dissipation area is formed on the first surface, and a second heat dissipation area is formed on the second surface. The heat dissipation housing includes a first heat dissipation member and a second heat dissipation member. The insulating member wraps the heat dissipation housing. The first heat dissipation member has a first heat dissipation surface that directly contacts the first heat dissipation area. The second heat dissipation member is connected to the first heat dissipation member along a first direction, and has a second heat dissipation surface that directly contacts the second heat dissipation area. The first heat dissipation member and the second heat dissipation member seal the first heat dissipation area and the second heat dissipation area. The first heat dissipation member and the second heat dissipation member dissipate heat from the circuit board by directly contacting the heat dissipation area of ​​the circuit board, thereby improving the heat dissipation performance of the circuit board. On the basis of ensuring the heat dissipation performance of the circuit board, the heat dissipation housing is wrapped with an insulating member to ensure the insulation performance of the electronic device.

Description

Technical Field

[0001] The present application relates to an electronic device and a photovoltaic power optimizer. Background Art

[0002] The heat dissipation solutions for traditional electronic devices all consider the heat dissipation problem after solving the insulation problem. For example, the power switch device is covered with an insulating film and then bonded to the heat sink to solve the heat conduction problem, or the power device is first bonded to the ceramic substrate to solve the insulation problem and then bonded to the heat sink to solve the heat conduction problem. For insulating structures such as insulating films and ceramic substrates, it is difficult to take into account the thermal conductivity efficiency while ensuring insulation, resulting in poor heat dissipation effect of electronic devices. Summary of the invention

[0003] The present application provides an electronic device and a photovoltaic power optimizer, which are convenient for improving the heat dissipation performance of the electronic device.

[0004] A first aspect of an embodiment of the present application provides an electronic device, comprising a circuit board, a heat dissipation housing, and an insulating member. The circuit board has a first surface and a second surface relative to each other, a first heat dissipation area is formed on the first surface, and a second heat dissipation area is formed on the second surface. The heat dissipation housing includes a first heat dissipation member and a second heat dissipation member. The insulating member wraps the heat dissipation housing. The first heat dissipation member has a first heat dissipation surface that directly contacts the first heat dissipation area. The second heat dissipation member is connected to the first heat dissipation member along a first direction, and has a second heat dissipation surface that directly contacts the second heat dissipation area. The first heat dissipation member and the second heat dissipation member seal the first heat dissipation area and the second heat dissipation area.

[0005] The first heat sink and the second heat sink of this electronic device are both solid heat sinks, which maintain a fixed shape when dissipating heat from the circuit board, ensuring the stability of heat dissipation. The first heat sink and the second heat sink dissipate heat from the circuit board by directly contacting the heat dissipation area of ​​the circuit board, thereby improving the heat dissipation performance of the circuit board. On the basis of ensuring the heat dissipation performance of the circuit board, the insulation performance of the electronic device is improved by wrapping the heat dissipation shell with an insulating member. The form of the insulating member wrapping the heat dissipation shell may not be a sealed wrapping, and different wrapping forms can be selected according to the actual use of the heat dissipation shell. For example, if the diameter of conductive debris that may appear in the use environment is not less than 3mm, the entire insulating shell wraps the heat dissipation shell as a whole, and holes less than 3mm can be set on the insulating shell at local locations. This can further improve the heat dissipation performance of the electronic device and prevent conductive debris from extending into the insulating shell and affecting the insulation performance of the electronic device.

[0006] Based on the first aspect, in a possible implementation manner, the insulating member includes an insulating shell, the insulating shell has a mounting cavity, and the heat dissipation shell is accommodated in the mounting cavity.

[0007] In this possible implementation, the electronic device can be insulated based on the insulating housing, and the insulating housing and the heat dissipation housing can be manufactured separately for assembly.

[0008] Based on the first aspect, in a possible implementation manner, the insulating shell and the heat dissipation shell are detachably connected.

[0009] In this possible implementation, the insulating shell may include a first sub-shell and a second sub-shell. The heat dissipation shell and the second sub-shell are first installed and then the first sub-shell and the second sub-shell are assembled, so that the insulating shell wraps the heat dissipation shell.

[0010] Based on the first aspect, in a possible implementation manner, the insulating shell further has a heat dissipation channel connected to the installation cavity.

[0011] In this possible implementation, the installation cavity of the insulating housing has more gas exchange with the environment outside the insulating housing, thereby improving the heat dissipation in the installation cavity.

[0012] Based on the first aspect, in a possible implementation, the electronic device further includes a gas driving component, the gas driving component is connected to the insulating housing, and the gas driving component is used to drive the gas to flow in the heat dissipation channel.

[0013] In this possible implementation, the gas driving member is used to actively drive the gas flow, thereby further enhancing the heat dissipation in the installation cavity.

[0014] Based on the first aspect, in a possible implementation manner, a ventilation gap is provided between an inner wall of the installation cavity and the heat dissipation housing.

[0015] In this possible implementation, the ventilation gap takes away the heat of the heat dissipation housing through the flowing gas, thereby increasing the heat dissipation efficiency of the heat dissipation housing.

[0016] Based on the first aspect, in a possible implementation, the insulating shell is provided with a first clamping portion in the installation cavity, and the heat dissipation shell is provided with a second clamping portion, and the first clamping portion is clamped with the second clamping portion to limit the relative displacement of the insulating shell and the heat dissipation shell.

[0017] In this possible implementation, the heat dissipation housing and the insulating housing are fixed by the first clamping portion and the second clamping portion, thereby reducing the risk of the heat dissipation housing shaking inside the insulating housing.

[0018] Based on the first aspect, in a possible implementation, the first clamping portion includes an annular groove disposed in the mounting cavity, and the second clamping portion includes an annular protrusion disposed on the outer periphery of the heat dissipation housing, and the annular protrusion is accommodated in the annular groove.

[0019] In this possible implementation, the first clamping portion and the second clamping portion are not arranged on the first outer surface and the second outer surface, and do not occupy the heat dissipation area of ​​the first outer surface and the second outer surface, which can improve the heat dissipation effect of the heat dissipation housing.

[0020] Based on the first aspect, in a possible implementation, the first heat sink has a first outer surface opposite to the first heat dissipation surface, the second heat sink has a second outer surface opposite to the second heat dissipation surface, the first outer surface and / or the second outer surface is covered with an insulating layer, and the insulating layer forms an insulating member.

[0021] In this possible implementation, the first heat sink and the second heat sink may not be insulated by an insulating housing, but may be directly insulated by covering the surfaces of the first heat sink and the second heat sink with an insulating layer. Covering the insulating film may be achieved by pasting a layer of insulating film, coating a layer of insulating film, etc.

[0022] Based on the first aspect, in a possible implementation, the circuit board includes an electronic component, and the electronic component is located in the first heat dissipation area. The first heat dissipation surface has a clearance groove, and the electronic component is accommodated in the clearance groove.

[0023] In this possible implementation, for the uneven electronic component surface where the electronic component is arranged, a clearance groove is arranged on the first heat dissipation surface to bypass the electronic component, so that the first heat dissipation surface can still contact the first heat dissipation area on the first surface.

[0024] Based on the first aspect, in a possible implementation manner, it further includes a heat dissipation filling piece, which fills the gap between the inner wall of the clearance groove and the electronic component.

[0025] In this possible implementation, the heat dissipation filler can reduce the thermal resistance between the electronic component and the first heat dissipation member. In addition, the clearance groove enlarged to avoid the electronic component causes a local area of ​​the first heat dissipation surface to be unable to directly contact the first heat dissipation area, and the heat dissipation filler can also reduce the thermal resistance of this part of the first heat dissipation area to the first heat dissipation member.

[0026] Based on the first aspect, in a possible implementation, the first heat sink has a first outer surface opposite to the first heat dissipation surface, the second heat sink has a second outer surface opposite to the second heat dissipation surface, and the first outer surface and / or the second outer surface are provided with a plurality of heat dissipation fins.

[0027] In this possible implementation, the surface area of ​​the heat dissipation housing is increased by the heat dissipation fins, thereby improving the heat dissipation efficiency of the heat dissipation housing.

[0028] Based on the first aspect, in a possible implementation manner, the first surface and the second surface have metal areas at their peripheries, and the metal areas are covered with a metal layer.

[0029] In this possible implementation, the metal layer can play the role of electromagnetic shielding. Moreover, when the metal layer contacts the first heat sink and the second heat sink at the same time, the metal layer can accelerate the heat conduction between the first heat sink and the second heat sink, reducing the risk of local heat accumulation in the first heat sink and the second heat sink.

[0030] Based on the first aspect, in a possible implementation manner, the metal area has a via hole that penetrates the first surface and the second surface.

[0031] In this possible implementation, the via hole can also realize the connection between the first surface and the second surface, and the metal layer in the via hole can further enhance the heat conduction efficiency between the first surface and the second surface.

[0032] Based on the first aspect, in a possible implementation manner, the heat dissipation housing further includes bolts, and the first heat dissipation element and the second heat dissipation element are connected by the bolts.

[0033] In this possible implementation, the first heat sink and the second heat sink are detachably connected, and the first heat sink or the second heat sink can be replaced separately in later maintenance. There can be many forms of bolting the first heat sink and the second heat sink, such as: through holes are set on both the first heat sink and the second heat sink, and the bolts are connected to nuts after passing through the first heat sink and the second heat sink. For another example, a threaded hole is set on the first heat sink, and a through hole is set on the second heat sink, and the bolts are threadedly connected to the threaded hole of the first heat sink after passing through the second heat sink.

[0034] Based on the first aspect, in a possible implementation manner, the circuit board is provided with a mounting through hole, and the bolt passes through the mounting through hole.

[0035] In this possible implementation, the bolts also pass through the circuit board, and the relative positions of the circuit board and the heat dissipation housing can also be fixed by the bolts in a direction perpendicular to the extension of the bolts.

[0036] Based on the first aspect, in a possible implementation, the heat dissipation housing further includes a sealing ring, which is sandwiched between the first heat dissipation element and the second heat dissipation element, and the circuit board is located inside the sealing ring.

[0037] In this possible implementation, the sealing ring makes up for the tolerance of the first heat sink and the second heat sink, and the outer periphery of the circuit board is sealed by the sealing ring to achieve waterproof and moisture-proof properties of the circuit board.

[0038] Based on the first aspect, in a possible implementation manner, the first heat sink and the second heat sink are fixed by welding.

[0039] In this possible implementation, the first heat sink and the second heat sink have a relatively high connection strength, and the circumferential welding around the first heat sink and the second heat sink can also enhance the waterproofness and moisture resistance of the circuit board.

[0040] Based on the first aspect, in a possible implementation manner, the first heat sink and / or the second heat sink is a metal heat sink.

[0041] In this possible implementation, the first heat sink and the second heat sink utilize the high thermal conductivity of metal to improve the heat dissipation effect of the first heat sink and the second heat sink, and the metal heat sink is easy to process, which helps to reduce the processing cost.

[0042] Based on the first aspect, in a possible implementation manner, a clamping flange is disposed in the heat dissipation housing, and the clamping flange contacts an outer periphery of the circuit board to limit movement of the circuit board relative to the heat dissipation housing.

[0043] In this possible implementation, the positions of the circuit board and the first heat sink or the second heat sink may be pre-fixed by a clamping flange, and then the first heat sink and the second heat sink may be fixed.

[0044] A second aspect of the embodiments of the present application provides a photovoltaic power optimizer, which includes a connecting cable and an electronic device in any one of the implementations of the first aspect. One end of the connecting cable is electrically connected to the circuit board, and the other end extends out of the insulating member to form a connector. The connector is used to connect the photovoltaic module.

[0045] This photovoltaic power optimizer is used to connect to a photovoltaic module to track the maximum power point of the photovoltaic module in real time. The photovoltaic module power optimizer uses the first heat sink and the second heat sink in the electronic device to ensure the stability of heat dissipation. The first heat sink and the second heat sink dissipate heat to the circuit board by directly contacting the heat dissipation area of ​​the circuit board, thereby improving the heat dissipation performance of the circuit board. On the basis of ensuring the heat dissipation performance of the circuit board, the insulation performance of the electronic device is improved by wrapping the heat dissipation housing with an insulating member. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a structural schematic diagram of a photovoltaic power optimizer provided in one embodiment of the present application.

[0047] Figure 2 It is a structural schematic diagram of a photovoltaic power optimizer provided by an embodiment of the present application when connected to a photovoltaic module.

[0048] Figure 3 is a cross-sectional view of an electronic device provided by an embodiment of the present application.

[0049] Figure 4 is a cross-sectional view of an electronic device provided by an embodiment of the present application.

[0050] Figure 5 is a cross-sectional view of an electronic device provided by an embodiment of the present application.

[0051] Figure 6 It is a schematic diagram of the structure of a circuit board provided in one embodiment of the present application.

[0052] Figure 7 It is a schematic diagram of the structure of a circuit board provided in one embodiment of the present application.

[0053] Main component symbols

[0054] Photovoltaic Power Optimizer 001

[0055] Photovoltaic module 002

[0056] Electronic device 010

[0057] Connecting cable 030

[0058] Connector 031

[0059] Circuit board 100

[0060] First heat dissipation area 101

[0061] Second heat dissipation area 103

[0062] Board body 110

[0063] Electronic components 130

[0064] Metal layer 150

[0065] Via 170

[0066] Heat dissipation housing 200

[0067] Second card part 201

[0068] First heat sink 210

[0069] First heat dissipation surface 210a

[0070] First outer surface 210b

[0071] Slot 211

[0072] Weld 220

[0073] Second heat sink 230

[0074] Second heat dissipation surface 230a

[0075] Second outer surface 230b

[0076] Seal 240

[0077] Cooling fin 250

[0078] Bolt 270

[0079] Snap-on flange 290

[0080] Insulation 300

[0081] Insulation housing 310

[0082] First clamping part 311

[0083] Mounting cavity 330

[0084] Ventilation gap 331

[0085] Heat dissipation filler 400

[0086] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0087] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0088] Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Positional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to the components, and may change accordingly according to changes in the orientation of the components placed in the accompanying drawings.

[0089] In this application, if used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integrated; can be directly connected or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0090] When the following embodiments are described in detail in conjunction with schematic diagrams, for ease of explanation, the diagrams showing the local structures of the devices will not be partially enlarged according to the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of this application.

[0091] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0092] Figure 1 A schematic structural diagram of a photovoltaic power optimizer 001 in one embodiment of the present application is shown. Figure 2 A schematic structural diagram of a photovoltaic power optimizer 001 connected to a photovoltaic component 002 in one embodiment of the present application is shown.

[0093] like Figure 1 As shown, the photovoltaic power optimizer 001 includes an electronic device 010 and a cable. One end of the cable is connected to the electronic device 010, and the other end forms a connector 031. Figure 2 Based on the soft characteristics of the cable, after the electronic device 010 is fixed, the connector 031 of the cable can be pulled to the position of the photovoltaic assembly 002, thereby connecting the photovoltaic assembly 002. After the connector 031 of the cable is connected to the photovoltaic assembly 002, the electronic device 010 and the photovoltaic assembly 002 are electrically connected. After the electronic device 010 is electrically connected to the photovoltaic assembly 002, the electronic device 010 can track the maximum power point of the photovoltaic assembly 002, thereby optimizing the power of the photovoltaic assembly 002. The photovoltaic power optimizer 001 can have multiple cables, so that multiple photovoltaic assemblies 002 can be connected at the same time through one electronic device 010, thereby simultaneously tracking the maximum power points of multiple photovoltaic assemblies 002.

[0094] Figure 3 A cross-sectional view of an electronic device 010 in one embodiment of the present application is shown.

[0095] like Figure 3As shown, the electronic device 010 includes a circuit board 100 and a heat dissipation housing 200. The circuit board 100 includes a board body 110, and the board body 110 has a first surface and a second surface opposite to each other along a first direction. There is a first heat dissipation area 101 on the first surface, and the first heat dissipation area 101 is located in the central part of the first surface. There is a second heat dissipation area 103 on the second surface, and the second heat dissipation area 103 is located in the central part of the second surface. The heat dissipation housing 200 includes a first heat dissipation member 210 and a second heat dissipation member 230, and the first heat dissipation member 210 and the second heat dissipation member 230 clamp the circuit board 100 in the first direction. Optionally, the first heat dissipation member 210 is integrally formed and has uniform thermal conductivity. Similarly, the second heat dissipation member 230 is integrally formed and has uniform thermal conductivity.

[0096] The first heat sink 210 has a first heat sink surface 210a facing the second heat sink 230, and the first heat sink surface 210a directly contacts the first heat sink region 101. Heat from the first heat sink region 101 can be directly transferred to the first heat sink 210 and discharged through the first heat sink 210. The second heat sink 230 has a second heat sink surface 230a facing the first heat sink 210, and the second heat sink surface 230a directly contacts the second heat sink region 103. Heat from the first heat sink region 101 can be directly transferred to the second heat sink 230 and discharged through the second heat sink 230.

[0097] The first heat sink 210 and the second heat sink 230 are connected along the first direction. Specifically, the first heat sink 210 and the second heat sink 230 are respectively arranged on both sides of the circuit board 100 in the first direction. After the first heat sink 210 and the second heat sink 230 are connected, they clamp the circuit board 100 in the first direction.

[0098] Optionally, the heat dissipation housing 200 further includes a bolt 270, the first heat dissipation member 210 is provided with a threaded hole, the second heat dissipation member 230 is provided with a through hole, the bolt 270 passes through the through hole of the second heat dissipation member 230 and is threadedly connected with the threaded hole of the first heat dissipation member 210, thereby realizing the connection between the first heat dissipation member 210 and the second heat dissipation member 230. The number of the bolts 270 is at least two, and at least two bolts 270 connecting the first heat dissipation member 210 and the second heat dissipation member 230 can also limit the first heat dissipation member 210 from rotating relative to the second heat dissipation member 230 around any bolt 270. It is understandable that through holes can also be provided on both the first heat dissipation member 210 and the second heat dissipation member 230, and the bolts 270 pass through the through holes of the first heat dissipation member 210 and the second heat dissipation member 230 and are connected with nuts, thereby realizing the fixation of the first heat dissipation member 210 and the second heat dissipation member 230.

[0099] Figure 4 A cross-sectional view of an electronic device 010 in one embodiment of the present application is shown.

[0100] See also Figure 4 Alternatively, in addition to connecting the first heat sink 210 and the second heat sink 230 by bolts 270, the first heat sink 210 and the second heat sink 230 may also be connected by welding. After the first heat sink 210 and the second heat sink 230 press the circuit board 100 in the first direction, the first heat sink 210 and the second heat sink 230 are fixed by welding. The weld 220 may surround the entire first heat sink 210 and the second heat sink 230, and the sealing of the first heat dissipation area 101 and the second heat dissipation area 103 is strengthened by the annular weld 220.

[0101] In this form, the first heat sink 210 is provided with an annular clamping flange 290 on the periphery, and the clamping flange 290 contacts the periphery of the circuit board 100. The clamping flange 290 has a wall surface substantially parallel to the first direction, and the wall surface matches the periphery contour of the circuit board 100. When the periphery of the circuit board 100 contacts the wall surface of the clamping flange 290, the clamping flange 290 can limit the relative position of the circuit board 100 and the first heat sink 210 in a direction perpendicular to the first direction. After the circuit board 100 is clamped in the clamping flange 290, the first heat sink 210 and the second heat sink 230 are welded. It can be understood that the clamping flange 290 can also be provided on the second heat sink 230.

[0102] Figure 5 A cross-sectional view of an electronic device 010 in one embodiment of the present application is shown.

[0103] See also Figure 5 Optionally, a sealing ring 240 may be provided between the first heat sink 210 and the second heat sink 230. The sealing ring 240 is sandwiched between the first heat sink 210 and the second heat sink 230, and the circuit board 100 is located inside the sealing ring 240. The sealing ring 240 may further enhance the sealing performance of the first heat sink area 101 and the second heat sink area 103.

[0104] Optionally, when a sealing ring 240 is sandwiched between the first heat sink 210 and the second heat sink 230, an external force can be applied to the first heat sink 210 and the second heat sink 230 through the insulating shell 310, so that the first heat sink 210 and the second heat sink 230 are close to each other and squeeze the sealing ring 240, so as to achieve the fixation of the relative positions of the first heat sink 210 and the second heat sink 230, and achieve the sealing of the first heat sink area 101 and the second heat sink area 103. It can be understood that a sealing ring 240 can also be set between the first heat sink 210 and the second heat sink 230 connected by bolts 270, so as to strengthen the sealing of the first heat sink area 101 and the second heat sink area 103. Of course, before the first heat sink 210 and the second heat sink 230 are welded, the sealing ring 240 can also be placed first to strengthen the sealing performance of the first heat sink 210 and the second heat sink 230.

[0105] Please return to Figure 3 The first heat sink 210 has a first outer surface 210b opposite to the first heat sink surface 210a, and the second heat sink 230 has a second outer surface 230b opposite to the second heat sink surface 230a. The first outer surface 210b is a plane, and the second outer surface 230b is provided with a plurality of heat dissipation fins 250. The heat dissipation fins 250 can increase the surface area of ​​the second heat sink 230, thereby accelerating the heat dissipation of the second heat sink 230. It can be understood that the first outer surface 210b can also be provided with a plurality of heat dissipation fins 250, thereby accelerating the heat dissipation of the first heat sink 210. The heat dissipation fins 250 can be integrally formed with the first heat sink 210 or the second heat sink 230.

[0106] The circuit board 100 also includes an electronic component 130, which is fixedly connected to the board body 110. The electronic component 130 is located on the first surface, and the electronic component 130 can be a resistor, a capacitor or other components. The expected function is achieved by connecting the electronic component 130 to the board body 110. The first heat sink 210 has a clearance groove 211 on the first heat dissipation surface 210a, and the clearance groove 211 is arranged corresponding to the electronic component 130. When the first heat sink 210 directly contacts the first heat dissipation area 101, the electronic component 130 is accommodated in the clearance groove 211. There is a certain gap between the clearance groove 211 and the electronic component 130, and the gap causes the heat transfer efficiency to be reduced. The electronic device 010 also includes a heat dissipation filler 400, which is filled in the gap to play a role in heat transfer, converting the gas heat conduction in the gap part into solid heat conduction, thereby improving the heat transfer efficiency. It should be noted that the solid heat conduction here does not define the heat dissipation filler 400 as a hard solid structure. The heat dissipation filler 400 may be deformable silicone grease.

[0107] It is understandable that the number of electronic components 130 on the circuit board 100 is not fixed, and the correspondence between the recesses 211 and the electronic components 130 can be one-to-one, or one recess 211 can correspond to multiple electronic components 130 .

[0108] Figure 6 A schematic structural diagram of a circuit board 100 in one embodiment of the present application is shown. Figure 7 A schematic structural diagram of a circuit board 100 in another embodiment of the present application is shown.

[0109] like Figure 3 and Figure 6 As shown, the plate body 110 further has a metal area on the periphery of the first surface and the second surface. The metal area is located outside the first heat dissipation area 101 and the second heat dissipation area 103. The metal area is annular, and the first heat dissipation area 101 and the second heat dissipation area 103 are located inside the metal area. The specific shape of the metal area can be determined according to the shape of the plate body 110. Figure 6 As shown, the board body 110 of the circuit board 100 is in a square shape, and the metal area on the periphery of the board body 110 is in a square ring shape. The metal area is covered with a metal layer 150, and the metal layer 150 located on the first surface is sealed and connected to the first heat sink 210, and the metal layer 150 located on the second surface is sealed and connected to the second heat sink 230. Thus, the sealing of the first heat dissipation area 101 and the second heat dissipation area 103 is strengthened, and the waterproof and moisture-proof performance of the first heat dissipation area 101 and the second heat dissipation area 103 is improved.

[0110] The metal area includes the edge portion of the board body 110. When the metal area covers the metal layer 150, the metal layer 150 on the first surface and the metal layer 150 on the second surface are integrally formed. Such a metal layer 150 can achieve electromagnetic shielding of the side of the circuit board 100. Moreover, the metal layer 150 on the first surface can achieve rapid heat conduction with the metal layer 150 on the second surface, thereby achieving rapid heat transfer between the first heat sink 210 and the second heat sink 230, reducing the risk of local heat accumulation of the first heat sink 210 and the second heat sink 230.

[0111] like Figure 7 As shown, the circuit board 100 also has a via hole 170 penetrating the first surface and the second surface in the metal area. A metal layer 150 can also be arranged in the via hole 170. The metal layer 150 in the via hole 170 can realize the electrical connection of the interlayer of the circuit board 100 on the one hand, and can also enhance the heat conduction efficiency between the first surface and the second surface on the other hand.

[0112] Optionally, the metal layer 150 is a copper layer, which is deposited on the metal area in the form of copper. The copper layer has the advantages of high thermal conductivity and easy formation.

[0113] It is understandable that the specific shape of the metal area can also be determined according to the shapes of the first heat sink 210 and the second heat sink 230. For example, if the board body 110 of the circuit board 100 is square, but the first heat sink 210 and the second heat sink 230 are circular, and the first heat sink 210 and the second heat sink 230 can cover the first heat dissipation area 101 and the second heat dissipation area 103, the metal area can also be set to a ring shape. By covering the metal layer 150 with the metal area, the first heat sink 210 and the second heat sink 230 can be attached to the metal layer 150, which can further strengthen the sealing of the first heat dissipation area 101 and the second heat dissipation area 103.

[0114] See also Figure 3 , when the first heat sink 210 and the second heat sink 230 are connected by bolts 270. A mounting through hole is also provided on the circuit board 100, and the mounting through hole is used for the bolt 270 to pass through. After the bolt 270 passes through the through hole of the second heat sink 230 and the mounting through hole of the circuit board 100, it is threadedly connected with the threaded hole of the first heat sink 210, thereby realizing the connection between the first heat sink 210, the circuit board 100 and the second heat sink 230. The bolt 270 passes through the circuit board 100 along the first direction, and the relative position of the circuit board 100 and the heat dissipation housing 200 in the plane direction perpendicular to the first direction can also be fixed by the bolt 270. The relative position of the first heat sink 210, the circuit board 100 and the second heat sink 230 is stabilized.

[0115] The electronic device 010 further includes an insulating member 300 , which wraps the heat dissipation housing 200 to achieve insulation between the heat dissipation housing 200 and the environment outside the insulating member 300 . The insulating member 300 includes an insulating housing 310 .

[0116] The insulating shell 310 has an installation cavity 330, and the heat dissipation shell 200 is accommodated in the installation cavity 330, and the heat dissipation shell 200 is wrapped by the insulating shell 310. The form of the insulating member 300 wrapping the heat dissipation shell 200 may not be a sealed wrapping, and different wrapping forms may be selected according to the actual use of the heat dissipation shell 200. For example, if the diameter of the conductive debris that may appear in the use environment is not less than 3mm, the entire insulating shell 310 wraps the heat dissipation shell 200 as a whole, and holes less than 3mm can be set on the insulating shell 310 at local positions. In this way, the heat dissipation performance of the heat dissipation shell 200 can be improved through gas exchange inside and outside the installation cavity 330, and the conductive debris can be prevented from extending into the insulating shell 310 to affect the insulation performance of the electronic device 010.

[0117] Optionally, the insulating housing 310 further includes a heat dissipation channel (not shown in the figure). The heat dissipation channel may be a serpentine channel. When a fluid is injected into the heat dissipation channel, the fluid flows through the heat dissipation channel to take away the heat of the insulating housing 310 .

[0118] It is understandable that the electronic device 010 may further include a gas driving member (not shown in the figure), which is connected to the insulating housing 310. The gas driving member is used to inject flowing gas into the heat dissipation channel. The electronic device 010 may also include a liquid cooling pump, which circulates cooling liquid into the heat dissipation channel through the liquid cooling pump, thereby achieving rapid heat dissipation of the insulating housing 310.

[0119] Please continue reading Figure 3 There is a ventilation gap 331 between the inner wall of the installation cavity 330 of the insulating housing 310 and the heat dissipation housing 200. Specifically, there is a portion of the ventilation gap 331 between the inner wall of the installation cavity 330 and the first heat dissipation element 210, and there is also a portion of the ventilation gap 331 between the inner wall of the installation cavity 330 and the second heat dissipation element 230. By circulating gas in the ventilation gap 331, the heat dissipation of the first heat dissipation element 210 and the second heat dissipation element 230 can be accelerated.

[0120] The insulating housing 310 is provided with a first clamping portion 311 in the mounting cavity 330, and the heat dissipation housing 200 is provided with a second clamping portion 201. The insulating housing 310 and the heat dissipation housing 200 are fixed in relative position by clamping the first clamping portion 311 and the second clamping portion 201. Optionally, the first clamping portion 311 includes an annular groove provided in the mounting cavity 330, and the second clamping portion 201 includes an annular protrusion provided on the outer periphery of the second heat dissipation member 230. The annular protrusion is accommodated in the annular groove, thereby limiting the relative movement of the heat dissipation housing 200 and the insulating housing 310 in the first direction. When the annular protrusion and the annular groove are non-circular rings, the heat dissipation housing 200 can also be limited from rotating around an axis parallel to the first direction in the insulating housing 310.

[0121] It can be understood that the insulating housing 310 may include a first sub-shell and a second sub-shell. The first sub-shell and the second sub-shell are connected along a first direction, and the first sub-shell and the second sub-shell are combined to form an annular groove. When assembling the heat dissipation housing 200 and the insulating housing 310, the heat dissipation housing 200 and the second sub-shell can be assembled first, and then the first sub-shell and the second sub-shell are connected to form the insulating housing 310. The second clamping portion 201 extends along the periphery of the second heat dissipation element 230, and occupies the heat dissipation area of ​​the second outer surface 230b, thereby reducing the influence of the second clamping portion 201 on the heat dissipation performance of the second heat dissipation element 230.

[0122] It is understandable that the connection between the insulating housing 310 and the heat dissipation housing 200 can also be set as follows: the first clamping portion 311 is an annular protrusion arranged on the inner wall of the installation cavity 330, and the second clamping portion 201 is an annular groove arranged on the outer periphery of the second heat dissipation element 230. The first clamping portion 311 is inserted into the second clamping portion 201.

[0123] In some other embodiments, the insulating member 300 may also be an insulating film covering the first outer surface 210b and the second outer surface 230b. The insulating film may be formed on the first outer surface 210b and the second outer surface 230b by pasting or coating.

[0124] It is understandable that in this electronic device 010, the first heat sink 210 and the second heat sink 230 can be metal heat sinks, which are made of metal materials, and the high thermal conductivity of metal is used to achieve rapid heat dissipation of the circuit board 100. The first heat sink 210 and the second heat sink 230 can also be made of other materials with high thermal conductivity, such as aluminum nitride, boron nitride and other non-metallic materials with high thermal conductivity.

[0125] When this electronic device 010 is in use, the circuit board 100 will emit heat in the first heat dissipation area 101 and the second heat dissipation area 103, and the heat is directly conducted to the first heat sink 210 and the second heat sink 230. Since the first heat sink 210 and the second heat sink 230 are integrally formed, the thermal resistance is low. The first heat sink 210 and the second heat sink 230 can quickly transfer the heat of the first heat dissipation area 101 and the second heat dissipation area 103 to the first outer surface 210b and the second outer surface 230b. Heat dissipation is then achieved through the heat dissipation of the first outer surface 210b and the second outer surface 230b. Here, the heat dissipation of the first outer surface 210b and the second outer surface 230b can be achieved based on the air flow in the ventilation gap 331. Moreover, the first heat dissipation area 101 and the second heat dissipation area 103 of the circuit board 100 that generate heat are the concentrated locations of the electronic components 130 and the printed circuit. Based on the sealing of the first heat dissipation area 101 and the second heat dissipation area 103 by the first heat dissipation member 210 and the second heat dissipation member 230, the electronic components 130 and the printed circuit of the circuit board 100 can also be protected, and the risk of short circuit of the circuit board 100 can be reduced. Here, the sealing of the first heat dissipation area 101 and the second heat dissipation area 103 can be Figure 3 In the embodiment shown, the sealing is achieved by extruding the outer periphery of the circuit board 100 and the first heat sink 210 and the second heat sink 230. Figure 4 and Figure 5 In the illustrated embodiment, the circuit board 100 is completely wrapped by the first heat sink 210 and the second heat sink 230 to achieve sealing. On the basis of the first heat sink 210 and the second heat sink 230 achieving heat dissipation and sealing for the circuit board 100, the insulation housing 310 is wrapped outside the heat dissipation housing 200 to improve the insulation performance of the electronic device 010, thereby ensuring the normal operation of the electronic device 010.

[0126] By selecting the materials of the first heat sink 210 and the second heat sink 230 , the heat dissipation effect of the electronic device 010 can also be adjusted. Since different materials have different thermal conductivities, the heat transfer efficiency of the first heat sink 210 and the second heat sink 230 can be adjusted.

[0127] In this photovoltaic power optimizer 001, the first heat sink 210 and the second heat sink 230 are both solid heat sinks, which maintain a fixed shape when dissipating heat from the circuit board 100, ensuring the stability of heat dissipation. The first heat sink 210 and the second heat sink 230 dissipate heat from the circuit board 100 by directly contacting the heat dissipation area of ​​the circuit board 100, thereby improving the heat dissipation performance of the circuit board 100. On the basis of ensuring the heat dissipation performance of the circuit board 100, the insulation performance of the electronic device 010 is improved by wrapping the heat dissipation housing 200 with the insulation member 300.

[0128] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the disclosure scope of the present application.

Claims

1. An electronic device, characterized in that: include: A circuit board having a first surface and a second surface opposite to each other, a first heat dissipation area at a central portion of the first surface, and a second heat dissipation area at a central portion of the second surface; the circuit board includes an electronic component, and the electronic component is located in the first heat dissipation area; The heat dissipation housing comprises a first heat dissipation element and a second heat dissipation element; An insulating member, wrapping the heat dissipation housing; The first heat sink has a first heat dissipation surface, the first heat dissipation surface has at least two clearance grooves, adjacent clearance grooves are separated by groove walls, each electronic component is accommodated in the corresponding clearance groove, and the groove walls between adjacent clearance grooves directly contact the first heat dissipation area; The second heat sink is connected to the first heat sink, the second heat sink has a second heat sink surface, and the second heat sink surface directly contacts the second heat sink area; The first heat dissipation member and the second heat dissipation member seal the first heat dissipation area and the second heat dissipation area.

2. The electronic device according to claim 1, wherein: The insulating member comprises an insulating shell having an installation cavity, and the heat dissipation shell is accommodated in the installation cavity.

3. The electronic device according to claim 2, wherein: The insulating shell also has a heat dissipation channel connected to the installation cavity.

4. The electronic device as claimed in claim 2, characterized in that: A ventilation gap is provided between the inner wall of the installation cavity and the heat dissipation housing.

5. The electronic device as claimed in claim 2, characterized in that: The insulating housing is provided with a first clamping portion in the installation cavity, and the heat dissipation housing is provided with a second clamping portion, and the first clamping portion is clamped with the second clamping portion to limit the relative displacement of the insulating housing and the heat dissipation housing.

6. The electronic device as claimed in claim 1, wherein: The first heat sink has a first outer surface opposite to the first heat sink surface, the second heat sink has a second outer surface opposite to the second heat sink surface, the first outer surface and / or the second outer surface is covered with an insulating layer, and the insulating layer forms the insulating element.

7. The electronic device as claimed in claim 1, characterized in that: It also includes a heat dissipation filling piece, which fills the gap between the inner wall of the clearance groove and the electronic component.

8. The electronic device as claimed in claim 1, wherein: The first heat sink has a first outer surface opposite to the first heat sink surface, the second heat sink has a second outer surface opposite to the second heat sink surface, and the first outer surface and / or the second outer surface are provided with a plurality of heat dissipation fins.

9. The electronic device as claimed in claim 1, wherein: The first surface and the second surface have metal areas at their peripheries, and the metal areas are covered with a metal layer.

10. The electronic device according to claim 1, wherein: The heat dissipation housing further includes bolts, and the first heat dissipation element and the second heat dissipation element are connected by the bolts.

11. The electronic device according to claim 10, wherein: The circuit board is provided with a mounting through hole, and the bolt passes through the mounting through hole.

12. The electronic device as claimed in claim 1, wherein: The heat dissipation housing further includes a sealing ring, which is sandwiched between the first heat dissipation element and the second heat dissipation element, and the circuit board is located inside the sealing ring.

13. The electronic device as claimed in claim 1, wherein: A clamping flange is arranged in the heat dissipation housing, and the clamping flange contacts the outer periphery of the circuit board to limit the movement of the circuit board relative to the heat dissipation housing.

14. A photovoltaic power optimizer, characterized in that: comprising a connecting cable and an electronic device as claimed in any one of claims 1 to 13; One end of the connecting cable is electrically connected to the circuit board, and the other end extends out of the insulating member to form a connector; The connector is used to connect photovoltaic modules.

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