Magnetron sputtering magnetic generating device and semiconductor process equipment

Abstract

The present invention provides a magnetron sputtering magnetic generating device and semiconductor process equipment, wherein the magnetron sputtering magnetic generating device is used to be arranged above a target material in the semiconductor process equipment, wherein a first rotating member of the magnetron sputtering magnetic generating device rotates around the axis of the target material, a second rotating member is rotatably arranged at one end of the first rotating member, and a magnetic generating component is arranged at one end of the second rotating member, a limiting assembly comprises a limiting component and a position adjusting component, one of the limiting component and the position adjusting component is arranged on the first rotating member, and the other is arranged on the second rotating member; the position adjusting component comprises a position-adjustable position adjusting component, the position adjusting component is used to abut against the limiting component when the first rotating member and the second rotating member rotate relative to each other, and the radius of rotation of the magnetic generating component around the axis of the first rotating member is adjusted by changing the position where the position adjusting component abuts against the limiting component. The present invention can improve the convenience of debugging the magnetron sputtering process and improve the flexibility of equipment use.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a magnetron sputtering magnetic generating device and semiconductor process equipment. Background Art

[0002] Magnetron sputtering is a type of physical vapor deposition (PVD) process that applies an electromagnetic field generated by a magnetic generator to a target material, attracting plasma to bombard the target material, increasing the speed and energy of the plasma bombarding the target material, causing the target material to sputter, and then using the particles sputtered from the target material to deposit on a wafer to form a thin film.

[0003] In order to enable a magnetic generating device to apply the electromagnetic field it generates to different areas on a target material according to different types of semiconductor processes, an existing magnetic generating device includes a first rotating arm, a second rotating arm, a limiting assembly and a magnetron for generating an electromagnetic field, wherein the first rotating arm is rotatably connected to the second rotating arm, the first rotating arm is used to drive the second rotating arm to rotate, and the second rotating arm is connected to the magnetron. When performing different types of semiconductor processes, the rotation direction of the first rotating arm is different, thereby driving the second rotating arm to rotate in different directions. Since the first rotating arm and the second rotating arm are rotatably connected, when the first rotating arm drives the second rotating arm to rotate in different directions, the second rotating arm will rotate in different directions relative to the first rotating arm under the action of its own inertia. The limit assembly is used to limit the second rotating arm to different positions when the second rotating arm rotates relative to the first rotating arm, so that when the first rotating arm drives the second rotating arm to rotate in different directions, the second rotating arm can rotate to different positions relative to the first rotating arm, so that the magnetron connected to the second rotating arm can rotate on a circle with different radii, so that the electromagnetic field generated by the magnetron can be applied to the circumference of a target material with different radii.

[0004] However, the limiting assembly in the existing magnetic generating device can only limit the second rotating arm to two different fixed positions, which makes the magnetron only able to rotate on two fixed circles of different radii, and the electromagnetic field generated by the magnetron can only be applied to the two fixed circles of different radii of the target material. The position where the electromagnetic field is applied on the target material has a great influence on the deposition rate and uniformity of the particles. When it is necessary to adjust the rotation radius of the magnetron, the magnetic generating device can only be redesigned as a whole, which makes the debugging of the magnetron sputtering process very inconvenient. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a magnetron sputtering magnetic generating device and semiconductor process equipment, which can improve the convenience of magnetron sputtering process debugging and improve the flexibility of equipment use.

[0006] To achieve the purpose of the present invention, a magnetron sputtering magnetic generating device is provided, which is used to be arranged above a target material in a semiconductor process equipment, and comprises a first rotating member, a second rotating member, a limiting assembly and a magnetic generating component for generating an electromagnetic field, wherein the first rotating member rotates around the axis of the target material, the second rotating member is rotatably arranged at one end of the first rotating member, and the magnetic generating component is arranged at one end of the second rotating member, the limiting assembly comprises a limiting component and a position adjusting component, one of the limiting component and the position adjusting component is arranged on the first rotating member, and the other is arranged on the second rotating member;

[0007] The position adjustment component includes an adjustable position adjustment component, which is used to abut against the limiting component when the first rotating component and the second rotating component rotate relative to each other. By changing the position where the position adjustment component abuts against the limiting component, the radius of rotation of the magnetic generating component around the axis of the first rotating component is adjusted.

[0008] Optionally, the limiting component includes a first limiting component and a second limiting component, the first limiting component and the second limiting component are arranged at an interval and are both fixedly arranged on the first rotating component;

[0009] The position adjusting member comprises a first position adjusting member and a second position adjusting member, wherein the first position adjusting member and the second position adjusting member are both movably arranged on the second rotating member;

[0010] When the second rotating member rotates counterclockwise relative to the first rotating member, the first limiting member and the first position adjusting member abut against each other; when the second rotating member rotates clockwise relative to the first rotating member, the second limiting member and the second position adjusting member abut against each other.

[0011] Optionally, the first position adjusting member can adjust the position along a first direction, and the first direction is not the direction in which the axis connecting the first limiting member and the second rotating member extends;

[0012] The second position adjusting member can adjust the position along a second direction, and the second direction is not the direction in which the axis connecting the second limiting member and the second rotating member extends.

[0013] Optionally, the first direction is a vertical direction of a line connecting the axes of the first limiting member and the second rotating member; and / or

[0014] The second direction is a direction perpendicular to a line connecting the axes of the second limiting member and the second rotating member.

[0015] Optionally, the position adjustment component further includes a connecting structure, wherein the connecting structure is connected to the second rotating member, and the first position adjustment member and the second position adjustment member are both connected to the second rotating member via the connecting structure.

[0016] Optionally, the position adjustment component also includes an adjustment structure and a matching structure, wherein the adjustment structure is arranged on the connecting structure, and the matching structure is connected to the first position adjustment member and the second position adjustment member, and the adjustment structure changes the relative positions of the first position adjustment member and the second position adjustment member relative to the connecting structure by driving the matching structure to move.

[0017] Optionally, the adjustment structure and the matching structure are two groups, which are respectively used to independently drive the first position adjustment member and the second position adjustment member to move.

[0018] Optionally, the adjustment structure includes a worm, the matching structure includes a rack, the worm is rotatably connected to the connecting structure, and the rack is movably arranged on the connecting structure and meshes with the worm.

[0019] Optionally, a first accommodating groove and a second accommodating groove are provided on the connecting structure, the worm is rotatably arranged in the first accommodating groove, and the first accommodating groove is provided with a first opening for the worm to pass through; the second accommodating groove is connected with the first accommodating groove through the first opening, the rack is movably arranged in the second accommodating groove and meshes with the worm, and the second accommodating groove is provided with a second opening for the first position adjustment member and the second position adjustment member to pass through.

[0020] The present invention also provides a semiconductor process equipment, including a chamber body, a target material, a carrying component and a magnetron sputtering magnetic generating device, wherein the target material is arranged on the top of the chamber body, the carrying component is arranged in the chamber body and located below the target material, and is used to carry a wafer, and the magnetron sputtering magnetic generating device is arranged outside the chamber body and located above the target material, and the magnetron sputtering magnetic generating device adopts the magnetron sputtering magnetic generating device provided by the present invention.

[0021] The present invention has the following beneficial effects:

[0022] The magnetron sputtering magnetic generating device provided by the present invention uses a position-adjustable position adjusting member to change the position at which the position adjusting member abuts against the limiting member, so that the angle at which the first rotating member and the second rotating member can rotate relative to each other can be changed. In this way, when the first rotating member and the second rotating member rotate relative to each other and the position adjusting member abuts against the limiting member, the relative position of the first rotating member and the second rotating member will change. Since the second rotating member is rotatably arranged at one end of the first rotating member and the magnetic generating member is arranged at one end of the second rotating member, the radius of rotation of the magnetic generating member around the axis of the first rotating member changes. Change, that is, by changing the position in which the position adjusting member abuts against the limiting member, the radius of rotation of the magnetic generating member around the axis of the first rotating member is adjusted. Since the first rotating member rotates around the axis of the target material, the radius of rotation of the magnetic generating member around the axis of the target material is changed, thereby changing the radius of the circumference of the circle applied to the target by the electromagnetic field generated by the magnetic generating member, that is, by changing the position in which the position adjusting member abuts against the limiting member, the radius of the circumference of the circle applied to the target by the electromagnetic field generated by the magnetic generating member is adjusted, thereby improving the convenience of debugging the magnetron sputtering process and improving the flexibility of equipment use.

[0023] The semiconductor process equipment provided by the present invention, with the help of the magnetron sputtering chamber provided by the present invention, can improve the convenience of magnetron sputtering process debugging and improve the flexibility of equipment use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a structure in which a second rotating member of a magnetron sputtering magnetic generating device according to an embodiment of the present invention rotates counterclockwise relative to a first rotating member;

[0025] Figure 2 A schematic diagram of a structure in which a second rotating member of a magnetron sputtering magnetic generating device according to an embodiment of the present invention rotates clockwise relative to a first rotating member;

[0026] Figure 3 A schematic structural diagram of a first position adjusting member and a second position adjusting member of a magnetron sputtering magnetic generating device provided in an embodiment of the present invention, in which the first position adjusting member and the second position adjusting member are respectively away from the first limiting member and the second limiting member;

[0027] Figure 4 A schematic structural diagram of a first position adjusting member and a second position adjusting member of a magnetron sputtering magnetic generating device provided in an embodiment of the present invention, respectively being close to a first limiting member and a second limiting member;

[0028] Figure 5 A schematic structural diagram of a fixed shaft, a worm, a rack and a first position adjustment member of a magnetron sputtering magnetic generating device provided in an embodiment of the present invention;

[0029] Figure 6The magnetron sputtering magnetic generating device provided in the embodiment of the present invention is in Figure 1 A schematic diagram of the structure of a magnetron sputtering magnetic generating device and a semiconductor process equipment in the state;

[0030] Figure 7 The magnetron sputtering magnetic generating device provided in the embodiment of the present invention is in Figure 2 A schematic diagram of the structure of a magnetron sputtering magnetic generating device and a semiconductor process equipment in the state;

[0031] Description of reference numerals:

[0032] 11-first rotating member; 111-first balancing member; 112-first rotating shaft; 12-second rotating member; 121-second balancing member; 122-second rotating shaft; 13-magnetic generating member; 14-limiting member; 141-first limiting member; 142-second limiting member; 15-position adjusting member; 151-position adjusting member; 1511-first position adjusting member; 1512-second position adjusting member; 1521-fixed shaft; 1522-worm; 1523-rack; 153-connecting structure; 1531-second containing groove;

[0033] 1532-through hole; 16-rotation drive mechanism; 21-chamber body; 22-target material; 23-carrying component;

[0034] 24- Lower RF device. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the magnetron sputtering magnetic generating device and semiconductor process equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0036] like Figure 1 , Figure 2 , Figure 6 and Figure 7As shown, an embodiment of the present invention provides a magnetron sputtering magnetic generating device, which is used to be arranged above a target material 22 in a semiconductor process equipment, and includes a first rotating member 11, a second rotating member 12, a limiting assembly and a magnetic generating component 13 for generating an electromagnetic field, wherein the first rotating member 11 rotates around the axis of the target material 22, the second rotating member 12 is rotatably arranged at one end of the first rotating member 11, and the magnetic generating component 13 is arranged at one end of the second rotating member 12, the limiting assembly includes a limiting component 14 and a position adjustment component 15, one of the limiting component 14 and the position adjustment component 15 is arranged on the first rotating member 11, and the other is arranged on the second rotating member 12, the position adjustment component 15 includes an adjustable position adjustment component 151, the position adjustment component 151 is used to abut against the limiting component 14 when the first rotating member 11 and the second rotating member 12 rotate relative to each other, and the radius of rotation of the magnetic generating component 13 around the axis of the first rotating member 11 is adjusted by changing the position where the position adjustment component 151 abuts against the limiting component 14.

[0037] The magnetron sputtering magnetic generating device provided in the embodiment of the present invention uses a position adjusting member 151 with adjustable position to change the position where the position adjusting member 151 abuts against the limiting member 14, so that the relative rotation angle of the first rotating member 11 and the second rotating member 12 can be changed. In this way, when the first rotating member 11 and the second rotating member 12 rotate relative to each other and the position adjusting member 151 abuts against the limiting member 14, the relative position of the first rotating member 11 and the second rotating member 12 will change. Since the second rotating member 12 is rotatably arranged at one end of the first rotating member 11, and the magnetic generating member 13 is arranged at one end of the second rotating member 12, the magnetic generating member 13 rotates around the axis of the first rotating member 11. The radius of the magnetic generating component 13 is changed, that is, by changing the position in which the position adjusting component 151 abuts against the limiting component 14, the radius of the rotation of the magnetic generating component 13 around the axis of the first rotating component 11 is adjusted. Since the first rotating component 11 rotates around the axis of the target material 22, the radius of the rotation of the magnetic generating component 13 around the axis of the target material 22 is changed, thereby changing the radius of the circumference of the electromagnetic field generated by the magnetic generating component 13 applied to the target material 22. That is, by changing the position in which the position adjusting component 151 abuts against the limiting component 14, the radius of the circumference of the electromagnetic field generated by the magnetic generating component 13 applied to the target material 22 is adjusted, thereby improving the convenience of debugging the magnetron sputtering process and improving the flexibility of equipment use.

[0038] That is to say, when the first rotating member 11 rotates around the axis of the target material 22, since the second rotating member 12 is rotatably arranged at one end of the first rotating member 11, the second rotating member 12 will rotate relative to the first rotating member 11 under the action of its own inertia, and in the process of relative rotation of the first rotating member 11 and the second rotating member 12, since one of the limiting component 14 and the position adjusting component 151 is arranged on the first rotating member 11 and the other is arranged on the second rotating member 12, the position adjusting component 151 and the limiting component 14 will also rotate relatively, and finally the position adjusting component 151 and the limiting component 14 will abut against each other. After the adjusting member 151 abuts against the limiting member 14, the second rotating member 12 can no longer rotate relative to the first rotating member 11, and the relative positions of the second rotating member 12 and the first rotating member 11 will be fixed. After that, the second rotating member 12 will rotate synchronously with the first rotating member 11 around the axis of the target material 22, and the magnetic generating member 13 arranged at one end of the second rotating member 12 will rotate around the axis of the first rotating member 11 at a fixed radius with the second rotating member 12, and rotate around the axis of the target material 22 on a circle with a fixed radius. The electromagnetic field generated by the magnetic generating member 13 will be applied to a circle with a fixed radius of the target material 22.

[0039] Since the position of the position adjusting member 151 is adjustable, by adjusting the position of the position adjusting member 151, the position at which the position adjusting member 151 and the limiting member 14 abut against each other during the relative rotation of the first rotating member 11 and the second rotating member 12 can be changed, so that the relative rotation angle of the first rotating member 11 and the second rotating member 12 can be changed. In this way, when the first rotating member 11 and the second rotating member 12 rotate relative to each other and the position adjusting member 151 abuts against the limiting member 14, the relative position of the first rotating member 11 and the second rotating member 12 will change, thereby changing the radius of the magnetic generating member 13 rotating with the second rotating member 12 around the axis of the first rotating member 11, and then changing the radius of the magnetic generating member 13 rotating around the axis of the target material 22, and further changing the radius of the circle of the electromagnetic field generated by the magnetic generating member 13 applied to the target material 22.

[0040] like Figure 1 and Figure 2 As shown, optionally, the first rotating member 11 and the second rotating member 12 may both be in the shape of long rods. However, the shapes of the first rotating member 11 and the second rotating member 12 are not limited thereto.

[0041] like Figure 1 , Figure 2 , Figure 6 and Figure 7As shown, optionally, the limiting component 14 can be fixedly arranged on a surface of the first rotating member 11 facing the second rotating member 12, and the position adjustment component 151 can be arranged on a surface of the second rotating member 12 facing the first rotating member 11, so that the position adjustment component 151 and the limiting component 14 can counteract each other when the first rotating member 11 and the second rotating member 12 rotate relative to each other.

[0042] like Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown, optionally, a first balancing member 111 may be provided at the other end of the first rotating member 11. The first balancing member 111 is used to balance the weight of the other end of the first rotating member 11 with the weight of one end where the second rotating member 12 is provided, so as to balance the two ends of the first rotating member 11 and avoid the first rotating member 11 from tilting toward one end, thereby improving the rotation stability of the first rotating member 11 and the second rotating member 12, improving the stability of the rotation radius of the magnetic generating component 13, and further improving the stability of the magnetron sputtering process.

[0043] Optionally, the first balancing member 111 may include a first counterweight.

[0044] like Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown, optionally, a second balancing member 121 may be provided at the other end of the second rotating member 12. The second balancing member 121 is used to balance the weight of the other end of the second rotating member 12 with the weight of one end where the magnetic generating component 13 is provided, so as to balance the two ends of the second rotating member 12 and prevent the second rotating member 12 from tilting toward one end, thereby improving the stability of the rotation of the second rotating member 12 and the stability of the rotation radius of the magnetic generating component 13, thereby improving the stability of the magnetron sputtering process.

[0045] Optionally, the second balancing member 121 may include a second counterweight.

[0046] like Figure 6 and Figure 7 As shown, optionally, the first rotating member 11 can be connected to the rotation driving mechanism 16 via the first rotating shaft 112 , so as to drive the first rotating member 11 to rotate via the rotation driving mechanism 16 .

[0047] like Figure 1 , Figure 2 , Figure 6 and Figure 7 As shown, optionally, the second rotating member 12 can be connected to one end of the first rotating member 11 through a second rotating shaft 122 , so that the second rotating member 12 can be rotatably disposed on one end of the first rotating member 11 .

[0048] Optionally, the magnetic generating component 13 may include a magnetron.

[0049] As shown in Figure 1, Figure 2 , Figure 6 and Figure 7 As shown, in a preferred embodiment of the present invention, the limiting component 14 may include a first limiting component 141 and a second limiting component 142, the first limiting component 141 and the second limiting component 142 are arranged at intervals and are both fixedly arranged on the first rotating component 11; the position adjusting component 151 may include a first position adjusting component 1511 and a second position adjusting component 1512, the first position adjusting component 1511 and the second position adjusting component 1512 are both movably arranged on the second rotating component 12; when the second rotating component 12 rotates counterclockwise relative to the first rotating component 11, the first limiting component 141 and the first position adjusting component 1511 are against each other; when the second rotating component 12 rotates clockwise relative to the first rotating component 11, the second limiting component 142 and the second position adjusting component 1512 are against each other.

[0050] like Figure 1 and Figure 6 As shown, when the first rotating member 11 rotates clockwise around the axis of the target material 22, since the second rotating member 12 is rotatably arranged at one end of the first rotating member 11, the second rotating member 12 will rotate counterclockwise relative to the first rotating member 11 under the action of its own inertia. During the counterclockwise rotation of the second rotating member 12 relative to the first rotating member 11, the first position adjustment member 1511 arranged on the second rotating member 12 will gradually approach the first limit member 141 arranged on the first rotating member 11, and finally abut against the first limit member 141. When the first position adjustment member 1511 abuts against the first limit member 141 After that, the second rotating member 12 can no longer rotate counterclockwise relative to the first rotating member 11, and the relative positions of the second rotating member 12 and the first rotating member 11 are fixed. At this time, the second rotating member 12 will rotate clockwise around the axis of the target material 22 synchronously with the first rotating member 11, and the magnetic generating component 13 arranged at one end of the second rotating member 12 will rotate clockwise around the axis of the first rotating member 11 at a fixed radius with the second rotating member 12, and rotate clockwise around the axis of the target material 22 on a circle with a fixed radius, and the electromagnetic field generated by the magnetic generating component 13 will be applied to a circle with a fixed radius of the target material 22.

[0051] Since the first position adjustment member 1511 is movably arranged on the second rotating member 12, by adjusting the position of the first position adjustment member 1511 on the second rotating member 12, the position where the first position adjustment member 1511 and the first limit member 141 abut against each other during the counterclockwise rotation of the second rotating member 12 relative to the first rotating member 11 can be changed, so that the angle of rotation of the second rotating member 12 relative to the first rotating member 11 can be changed, so that when the first position adjustment member 1511 abuts against the first limit member 141 during the counterclockwise rotation of the second rotating member 12 relative to the first rotating member 11, the relative position of the first rotating member 11 and the second rotating member 12 will change, thereby changing the radius of the magnetic generating component 13 rotating with the second rotating member 12 around the axis of the first rotating member 11, and then changing the radius of the magnetic generating component 13 rotating around the axis of the target material 22, and then changing the radius of the circle of the electromagnetic field generated by the magnetic generating component 13 applied to the target material 22.

[0052] like Figure 2 and Figure 7 As shown, when the first rotating member 11 rotates counterclockwise around the axis of the target material 22, since the second rotating member 12 is rotatably arranged at one end of the first rotating member 11, the second rotating member 12 will rotate clockwise relative to the first rotating member 11 under the action of its own inertia. During the clockwise rotation of the second rotating member 12 relative to the first rotating member 11, the second position adjusting member 1512 arranged on the second rotating member 12 will gradually approach the second limiting member 142 arranged on the first rotating member 11, and finally abut against the second limiting member 142. When the second position adjusting member 1512 abuts against the second limiting member 142 After that, the second rotating member 12 can no longer rotate clockwise relative to the first rotating member 11, and the relative positions of the second rotating member 12 and the first rotating member 11 are fixed. At this time, the second rotating member 12 will rotate counterclockwise around the axis of the target material 22 synchronously with the first rotating member 11, and the magnetic generating component 13 arranged at one end of the second rotating member 12 will rotate counterclockwise around the axis of the first rotating member 11 at a fixed radius with the second rotating member 12, and rotate counterclockwise around the axis of the target material 22 on a circle with a fixed radius, and the electromagnetic field generated by the magnetic generating component 13 will be applied to a circle with a fixed radius of the target material 22.

[0053] Since the second position adjusting member 1512 is movably arranged on the second rotating member 12, by adjusting the position of the second position adjusting member 1512 on the second rotating member 12, the position at which the second position adjusting member 1512 and the second limiting member 142 abut against each other during the clockwise rotation of the second rotating member 12 relative to the first rotating member 11 can be changed, so that the angle of rotation of the second rotating member 12 relative to the first rotating member 11 can be changed, and thus the position at which the second position adjusting member 1512 and the second limiting member 142 abut against each other will be changed, so that when the second rotating member 12 rotates clockwise relative to the first rotating member 11 and the second position adjusting member 1512 abuts against the second limiting member 142, the relative position of the first rotating member 11 and the second rotating member 12 will be changed, thereby changing the radius of the magnetic generating component 13 rotating around the axis of the first rotating member 11 with the second rotating member 12, and then changing the radius of the magnetic generating component 13 rotating around the axis of the target material 22, and further changing the radius of the circle of the electromagnetic field generated by the magnetic generating component 13 applied to the target material 22.

[0054] However, the limiting component 14 is not limited to including the first limiting component 141 and the second limiting component 142 that are spaced apart, and the position adjusting component 15 is not limited to including the first position adjusting component 1511 and the second position adjusting component 1512. For example, the limiting component 14 can be in the shape of an elongated strip, and the position adjusting component only includes the first position adjusting component 1511 or the second position adjusting component 1512. By making the first position adjusting component 1511 or the second position adjusting component 1512 respectively abut against the two ends of the limiting component 14 in the shape of an elongated strip, and by adjusting the first position adjusting component 1511 or the second position adjusting component 1512, the abutting position of the first position adjusting component 1511 or the second position adjusting component 1512 and the two ends of the limiting component 14 can be changed during the process of the second rotating component 12 rotating clockwise or counterclockwise relative to the first rotating component 11, so that the second rotating component 12 can rotate clockwise or counterclockwise relative to the first rotating component 11. The angle of clockwise or counterclockwise rotation changes, so that when the second rotating member 12 rotates clockwise or counterclockwise relative to the first rotating member 11, and the first position adjusting member 1511 or the second position adjusting member 1512 abuts against the two ends of the elongated limiting member 14, the relative position of the first rotating member 11 and the second rotating member 12 will change, thereby changing the radius of the magnetic generating member 13 rotating around the axis of the first rotating member 11 with the second rotating member 12, and then changing the radius of the magnetic generating member 13 rotating around the axis of the target material 22, thereby changing the radius of the circle of the electromagnetic field generated by the magnetic generating member 13 applied to the target material 22.

[0055] like Figure 1 and Figure 2As shown, in a preferred embodiment of the present invention, the first position adjusting member 1511 can adjust the position along a first direction, and the first direction is the direction in which the axis line connecting the non-first limiting member 141 and the second rotating member 12 extends; the second position adjusting member 1512 can adjust the position along a second direction, and the second direction is the direction in which the axis line connecting the non-second limiting member 142 and the second rotating member 12 extends.

[0056] like Figure 1 As shown, by adjusting the position of the first position adjusting member 1511 along the direction extending from the axial line connecting the non-first limiting member 141 and the second rotating member 12, the first position adjusting member 1511 can be made close to or away from the first limiting member 141, thereby reducing or increasing the distance between the first position adjusting member 1511 and the first limiting member 141, thereby reducing or increasing the angle at which the second rotating member 12 can rotate relative to the first rotating member 11, thereby changing the position at which the first position adjusting member 1511 and the first limiting member 141 abut against each other, so that when the second rotating member 12 rotates counterclockwise relative to the first rotating member 11 and the first position adjusting member 1511 abuts against the first limiting member 141, the relative position of the first rotating member 11 and the second rotating member 12 changes.

[0057] like Figure 2 As shown, by adjusting the position of the second position adjusting member 1512 along the direction extending from the axial line connecting the non-second limiting member 142 and the second rotating member 12, the second position adjusting member 1512 can be made close to or away from the second limiting member 142, thereby reducing or increasing the distance between the second position adjusting member 1512 and the second limiting member 142, thereby reducing or increasing the angle at which the second rotating member 12 can rotate relative to the first rotating member 11, thereby changing the position at which the second position adjusting member 1512 and the second limiting member 142 abut against each other, so that when the second rotating member 12 rotates counterclockwise relative to the first rotating member 11 and the second position adjusting member 1512 abuts against the second limiting member 142, the relative position of the first rotating member 11 and the second rotating member 12 changes.

[0058] In a preferred embodiment of the present invention, the first direction may be a perpendicular direction of a line connecting the axes of the first limit member 141 and the second rotating member 12; and / or the second direction may be a perpendicular direction of a line connecting the axes of the second limit member 142 and the second rotating member 12.

[0059] When the position of the first position adjusting member 1511 is adjusted along the vertical direction of the axis connecting the first position limiting member 141 and the second rotating member 12, compared with adjusting the position of the first position adjusting member 1511 along other directions, when adjusting the first position adjusting member 1511 by the same distance, the change in the distance between the first position adjusting member 1511 and the first position limiting member 141 is greater, thereby improving the efficiency of adjusting the first position adjusting member 1511. When the position of the second position adjusting member 1512 is adjusted along the vertical direction of the axis connecting the second position limiting member 142 and the second rotating member 12, compared with adjusting the position of the second position adjusting member 1512 along other directions, when adjusting the second position adjusting member 1512 by the same distance, the change in the distance between the second position adjusting member 1512 and the second position limiting member 142 is greater, thereby improving the efficiency of adjusting the second position adjusting member 1512.

[0060] like Figure 1-Figure 4 As shown, in a preferred embodiment of the present invention, the position adjustment component 15 may also include a connecting structure 153, which is connected to the second rotating member 12, and the first position adjustment member 1511 and the second position adjustment member 1512 are both connected to the second rotating member 12 via the connecting structure 153.

[0061] That is, the first position adjusting member 1511 and the second position adjusting member 1512 are not directly arranged on the second rotating member 12, but are connected to the second rotating member 12 through the connecting structure 153. This makes it easy to process the first position adjusting member 1511 and the second position adjusting member 1512, avoiding the need to directly process the first position adjusting member 1511 and the second position adjusting member 1512 on the second rotating member 12.

[0062] Optionally, the connection structure 153 may be detachably connected to the second rotating member 12. This makes it easy to disassemble and replace the connection structure 153, the first position adjusting member 1511, and the second position adjusting member 1512.

[0063] like Figure 1-Figure 4 As shown, optionally, the connection structure 153 can be a fixed plate, a through hole 1532 can be opened on the fixed plate, and a threaded hole (not shown in the figure) can be opened on the second rotating member 12 to enable the fixed plate to be detachably connected to the second rotating member 12 through a threaded connector (not shown in the figure).

[0064] In a preferred embodiment of the present invention, the position adjustment component 15 may also include an adjustment structure and a matching structure. The adjustment structure is arranged on the connecting structure 153. The matching structure is connected to the first position adjustment member 1511 and the second position adjustment member 1512. The adjustment structure changes the relative positions of the first position adjustment member 1511 and the second position adjustment member 1512 relative to the connecting structure 153 by driving the matching structure to move.

[0065] That is, the adjustment structure is arranged on the connecting structure 153 and can drive the matching structure to move. By driving the matching structure to move through the adjustment structure, the relative positions of the first position adjustment member 1511 and the second position adjustment member 1512 relative to the connecting structure 153 can be changed, so that the first position adjustment member 1511 and the second position adjustment member 1512 are movably arranged on the second rotating member 12 through the connecting structure 153.

[0066] In a preferred embodiment of the present invention, the adjustment structure and the matching structure are two groups, which are used to independently drive the first position adjustment member 1511 and the second position adjustment member 1512 to move.

[0067] That is, one of the two groups of adjustment structures and matching structures is used to drive the first position adjustment member 1511 to move, and when this group of adjustment structures and matching structures drives the first position adjustment member 1511 to move, the second position adjustment member 1512 will not move. Another group of adjustment structures and matching structures in the two groups of adjustment structures and matching structures is used to drive the second position adjustment member 1512 to move, and when this other group of adjustment structures and matching structures drives the second position adjustment member 1512 to move, the first position adjustment member 1511 will not move. By using the two groups of adjustment structures and matching structures to drive the first position adjustment member 1511 and the second position adjustment member 1512 to move separately, it is possible to avoid affecting the movement of the other one when driving one of the first position adjustment member 1511 and the second position adjustment member 1512 to move, thereby improving the use flexibility of the magnetron sputtering magnetic generating device.

[0068] like Figure 3-Figure 5 As shown, in a preferred embodiment of the present invention, the adjustment structure may include a worm 1522, and the matching structure may include a rack 1523. The worm 1522 is rotatably connected to the connecting structure 153, and the rack 1523 is movably arranged on the connecting structure 153 and meshes with the worm 1522.

[0069] By rotating the worm 1522, the rack 1523 meshing with the worm 1522 can be moved, thereby driving the first position adjustment member 1511 and the second position adjustment member 1512 connected to the rack 1523 to move, thereby realizing that the adjustment structure drives the matching structure to move and changes the relative positions of the first position adjustment member 1511 and the second position adjustment member 1512 relative to the connecting structure. Moreover, in this transmission mode, since the rack 1523 cannot drive the worm 1522 to rotate, it is possible to avoid the rack 1523 from moving when the first position adjustment member 1511 and the second position adjustment member 1512 are subjected to force, thereby enabling the first position adjustment member 1511 and the second position adjustment member 1512 to respectively resist the first limit member 141 and the second limit member 142 when the first rotating member 11 and the second rotating member 12 rotate relative to each other.

[0070] like Figure 3 As shown, in a preferred embodiment of the present invention, a first accommodating groove (not shown in the figure) and a second accommodating groove 1531 can be provided on the connecting structure 153, the worm 1522 is rotatably arranged in the first accommodating groove, and the first accommodating groove is provided with a first opening for the worm 1522 to pass through; the second accommodating groove 1531 is connected to the first accommodating groove through the first opening, the rack 1523 is movably arranged in the second accommodating groove 1531 and meshes with the worm 1522, and the second accommodating groove 1531 is provided with a second opening for the first position adjustment member 1511 and the second position adjustment member 1512 to pass through.

[0071] A portion of the first position adjusting member 1511 and the second position adjusting member 1512 extends through the second opening into the second receiving groove 1531 and is connected to the rack 1523, and another portion extends through the second opening to the outside of the second receiving groove 1531, and is used to abut against the first limiting member 141 when the first rotating member 11 and the second rotating member 12 rotate relative to each other.

[0072] like Figure 3-Figure 5 As shown, optionally, the adjustment structure may also include a fixed shaft 1521, which is inserted into the first receiving groove and fixedly connected to the first receiving groove, and the worm 1522 is rotatably sleeved on the fixed shaft 1521 to realize that the worm 1522 is rotatably set in the first receiving groove.

[0073] like Figure 6 and Figure 7As shown, as another technical solution, an embodiment of the present invention further provides a semiconductor process equipment, including a chamber body 21, a target material 22, a supporting component 23 and a magnetron sputtering magnetic generating device, wherein the target material 22 is arranged on the top of the chamber body 21, the supporting component 23 is arranged in the chamber body 21 and is located below the target material 22 for carrying the wafer, and the magnetron sputtering magnetic generating device is arranged outside the chamber body 21 and is located above the target material 22, and the magnetron sputtering magnetic generating device adopts the magnetron sputtering magnetic generating device provided in the embodiment of the present invention.

[0074] The semiconductor process equipment provided by the embodiment of the present invention can improve the convenience of magnetron sputtering process debugging and improve the flexibility of equipment use by means of the magnetron sputtering magnetic generating device provided by the present invention.

[0075] When the magnetron sputtering process is performed, a wafer is carried on the carrying member 23, and the magnetic generating member 13 of the magnetron sputtering magnetic generating device generates an electromagnetic field and applies it to the target material 22 located below it, so as to attract the plasma formed by the process gas in the chamber body 21 to bombard the target material 22, so that the target material 22 is sputtered, so that the particles sputtered from the target material 22 are deposited on the wafer to form a thin film, and the first rotating member 11 drives the second rotating member 12 to rotate, and the second rotating member 12 drives the magnetic generating member 13 to rotate, so that the electromagnetic field generated by the generating member is applied to a circumference of the target material 22. By adopting the magnetron sputtering magnetic generating device provided by the embodiment of the present invention, the radius of the rotation of the magnetic generating member 13 around the axis of the target material 22 can be changed, and then the radius of the circumference of the electromagnetic field generated by the magnetic generating member 13 applied to the target material 22 can be adjusted, so that the plasma bombards the circumference of different radii on the target material 22 to adapt to different semiconductor processes, thereby improving the convenience of magnetron sputtering process debugging and the flexibility of equipment use.

[0076] Optionally, the bearing component 23 may include a base.

[0077] like Figure 6 and Figure 7 As shown, the semiconductor process equipment provided by the embodiment of the present invention may also include a lower RF device 24, which is located outside the chamber body 21 and connected to the supporting component 23, and is used to apply RF to the supporting component 23 to attract particles sputtered from the target material 22 in the chamber body 21 to the wafer, thereby increasing the speed at which particles sputtered from the target material 22 are deposited on the wafer, and also increasing the uniformity of particles sputtered from the target material 22 being deposited on the wafer.

[0078] In summary, the magnetron sputtering magnetic generating device and semiconductor process equipment provided by the embodiments of the present invention can improve the convenience of magnetron sputtering process debugging and improve the flexibility of equipment use.

[0079] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A magnetron sputtering magnetic generating device, used to be arranged above a target material in a semiconductor process equipment, comprising a first rotating member, a second rotating member, a stopper assembly and a magnetic generating component for generating an electromagnetic field, wherein: The first rotating member rotates around the axis of the target material, the second rotating member is rotatably arranged at one end of the first rotating member, and a magnetic generating component is arranged at one end of the second rotating member, characterized in that the limiting assembly includes a limiting component and a position adjusting component, one of the limiting component and the position adjusting component is arranged on the first rotating member, and the other is arranged on the second rotating member; The position adjustment component includes a position-adjustable position adjustment component, and the position adjustment component is used to abut against the limit component when the first rotating component and the second rotating component rotate relative to each other, and the radius of rotation of the magnetic generating component around the axis of the first rotating component is adjusted by changing the position where the position adjustment component abuts against the limit component; The limiting component includes a first limiting member and a second limiting member, the first limiting member and the second limiting member are arranged at an interval and are both fixedly arranged on the first rotating member; The position adjusting member comprises a first position adjusting member and a second position adjusting member, wherein the first position adjusting member and the second position adjusting member are both movably arranged on the second rotating member; When the second rotating member rotates counterclockwise relative to the first rotating member, the first limiting member and the first position adjusting member abut against each other; when the second rotating member rotates clockwise relative to the first rotating member, the second limiting member and the second position adjusting member abut against each other; The first position adjusting member can adjust the position along a first direction, and the second position adjusting member can adjust the position along a second direction, the first direction being a direction perpendicular to a line connecting the axes of the first limiting member and the second rotating member; and / or the second direction being a direction perpendicular to a line connecting the axes of the second limiting member and the second rotating member.

2. The magnetron sputtering magnetic generating device according to claim 1, characterized in that: The position adjusting component further includes a connecting structure, wherein the connecting structure is connected to the second rotating member, and the first position adjusting member and the second position adjusting member are both connected to the second rotating member through the connecting structure.

3. The magnetron sputtering magnetic generating device according to claim 2, characterized in that: The position adjustment component also includes an adjustment structure and a matching structure. The adjustment structure is arranged on the connecting structure. The matching structure is connected to the first position adjustment member and the second position adjustment member. The adjustment structure changes the relative positions of the first position adjustment member and the second position adjustment member relative to the connecting structure by driving the matching structure to move.

4. The magnetron sputtering magnetic generating device according to claim 3, characterized in that: The adjusting structure and the matching structure are two groups, which are used to drive the first position adjusting member and the second position adjusting member to move separately.

5. The magnetron sputtering magnetic generating device according to claim 4, characterized in that: The adjusting structure comprises a worm, and the matching structure comprises a rack. The worm is rotatably connected to the connecting structure, and the rack is movably arranged on the connecting structure and meshes with the worm.

6. The magnetron sputtering magnetic generating device according to claim 5, characterized in that: The connecting structure is provided with a first accommodating groove and a second accommodating groove, the worm is rotatably arranged in the first accommodating groove, and the first accommodating groove is provided with a first opening for the worm to pass through; the second accommodating groove is connected with the first accommodating groove through the first opening, the rack is movably arranged in the second accommodating groove and meshes with the worm, and the second accommodating groove is provided with a second opening for the first position adjusting member and the second position adjusting member to pass through.

7. A semiconductor process equipment, comprising a chamber body, a target material, a bearing component and a magnetron sputtering magnetic generating device, wherein: The target material is arranged at the top of the chamber body, the supporting component is arranged in the chamber body and located below the target material, and is used to carry the wafer. The magnetron sputtering magnetic generating device is arranged outside the chamber body and located above the target material, and is characterized in that the magnetron sputtering magnetic generating device adopts the magnetron sputtering magnetic generating device as described in any one of claims 1-6.

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