A sequential discharge type resistor chip loading system

Abstract

The present invention provides a sequential discharge type resistor chip loading system, which includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; the first conveying component is used to convey resistor chips; the second conveying component is used to convey a sagger equipped with gaskets and surrounding edges; the discharge component is arranged at the output end of the first conveying component and the output end of the second conveying component to receive and convey the sagger, and to send the resistor chip on the first conveying component into the sagger to form a semi-assembled sagger; the third conveying component is arranged at the output end of the discharge component to receive the semi-assembled sagger, place a surrounding plate in the semi-assembled sagger, and take out the surrounding edges in the semi-assembled sagger. Compared with the prior art, the sequential discharge type resistor chip loading system of the present invention has a high degree of automation, can reduce the intensity of manual labor, and improve the efficiency and quality of resistor chip loading.

Description

Technical Field

[0001] The invention relates to the technical field of resistor chip production, and in particular to a sequential discharge type resistor chip packaging system. Background Art

[0002] During the production process of resistors, multiple resistors need to be stacked in a sagger, and enclosures and gaskets need to be installed in the gap between the resistors and the sagger. On the one hand, this can play a buffering role, and on the other hand, it can reduce the gap between the resistors and the sagger and reduce shaking during transportation.

[0003] However, currently, the packaging of resistors is usually done manually or by semi-automatic + manual methods, which is labor-intensive and inefficient. At the same time, it is greatly affected by human factors, and errors are easy to occur during the packaging process, which affects the quality of resistor packaging. Summary of the invention

[0004] Aiming at the technical problem that the packing of resistors in the prior art is usually carried out manually or semi-automatically + manually, with high labor intensity, low packing efficiency and inability to ensure the packing quality, the present invention provides a sequential discharge type resistor packing system, which can stack the resistors in a sagger through the cooperation between mechanical structures, and add a panel and a gasket between the sagger and the resistors, thereby reducing the labor intensity and improving the packing efficiency, while also avoiding the influence of human factors as much as possible and improving the packing quality.

[0005] A sequential discharge type resistor chip loading system, comprising a first conveying component, a second conveying component, a discharge component, and a third conveying component;

[0006] The first conveying component is used to convey the resistor sheet;

[0007] The second conveying assembly is used to convey the sagger equipped with the gasket and the surrounding edge;

[0008] The discharge assembly is arranged at the output end of the first conveying assembly and the output end of the second conveying assembly to receive and convey the sagger, and is used to convey the resistor sheet on the first conveying assembly into the sagger to form a semi-assembled sagger;

[0009] The third conveying assembly is arranged at the output end of the discharge assembly to receive the semi-assembled sagger, place the enclosure plate into the semi-assembled sagger, and take out the enclosure edge in the semi-assembled sagger.

[0010] Preferably, the first conveying assembly includes a first conveying member and a resistor sheet stacking assembly;

[0011] The first conveying member is used to convey the temporary placement box;

[0012] The resistor sheet stacking assembly is arranged corresponding to the first conveying member, and is used to stack the resistor sheets into a stack, and push the stack of resistor sheets into the temporary placement box, so as to convey the stack of resistor sheets with the temporary placement box through the first conveying member;

[0013] The discharge assembly is arranged at the output end of the first conveying member.

[0014] Preferably, the resistor stack assembly includes a first stacking mechanism, a first pushing mechanism, a second stacking mechanism, and a second pushing mechanism;

[0015] The first stacking mechanism is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets;

[0016] The first pushing mechanism is arranged corresponding to the first stacking mechanism, and is used to push a stack of the resistor sheets out of the first stacking mechanism;

[0017] The input end of the second stacking mechanism is arranged corresponding to the first stacking mechanism to sequentially receive a stack of the resistor sheets and stack multiple stacks of the resistor sheets into the stacked resistor sheets; and the output end of the second stacking mechanism is arranged corresponding to the first conveying member;

[0018] The second pushing mechanism is arranged corresponding to the second stacking mechanism, and is used for pushing the stacked resistor sheets from the second stacking mechanism into the first conveying member.

[0019] Preferably, the second stacking mechanism comprises a containing box, a first baffle, a second baffle, a rotating shaft, and a rotating driving mechanism;

[0020] The containing box is provided with a first containing cavity with two sides open;

[0021] The first baffle plate and the second baffle plate are disposed on opposite sides of the containing box, and the second baffle plate is located on a side close to the first conveying member;

[0022] The rotating shaft is connected to the containing box to drive the containing box to rotate;

[0023] The rotary drive mechanism is connected to the rotating shaft to drive the rotating shaft to rotate;

[0024] The containing box has a receiving position for receiving the resistor sheet conveyed by the first pushing mechanism, and a feeding position after being rotated by the rotating shaft;

[0025] The first baffle is provided with a first channel at the material receiving position for connecting the first accommodating cavity with the first stacking mechanism;

[0026] The first baffle is also provided with a second channel at the feeding position for communicating with the first accommodating cavity;

[0027] The second baffle is provided with a third channel corresponding to the second channel at the feeding position, for connecting the first accommodating cavity with the first conveying member;

[0028] The second pushing mechanism is arranged corresponding to the second channel.

[0029] Preferably, the second pushing mechanism comprises a first pushing cylinder, a second pushing cylinder, a first flat-head pushing block, and a second pushing plate;

[0030] The first pushing cylinder and the second pushing cylinder are arranged on opposite sides of the first conveying member; and the first pushing cylinder is arranged on a side of the first baffle away from the first conveying member and facing the second channel; the second pushing cylinder is arranged facing the third channel;

[0031] The first flat-head push block is arranged on the push rod of the first push cylinder, so as to push the stacked resistor sheets in the storage box into the first conveying member when the storage box is in the feeding position;

[0032] The second push plate is disposed on the push rod of the second push cylinder to cooperate with and abut against the stacked resistor sheets.

[0033] Preferably, the first stacking mechanism includes a stacking piston, a feeding funnel, a vibration mechanism, a support rod, a first lifting mechanism, and a blocking mechanism;

[0034] The stacking piston is arranged on a side of the first baffle away from the first conveying member, and a second accommodating chamber for accommodating a stack of the resistor sheets is arranged in the stacking piston, and a side of the second accommodating chamber close to the first baffle is open and communicated with the first channel;

[0035] The feeding hopper is in communication with the second accommodating chamber to transport the single resistor sheet into the second accommodating chamber;

[0036] The vibration mechanism is connected to the feeding funnel;

[0037] The support rod is disposed in the second accommodating cavity to support the resistor sheet;

[0038] The first lifting mechanism is connected to the support rod to drive the support rod to rise and fall;

[0039] The blocking mechanism is arranged corresponding to the stacking piston and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism blocks the first channel and the second accommodating chamber; in the second blocking state, the blocking mechanism blocks the feeding funnel and the second accommodating chamber.

[0040] Preferably, the first pushing mechanism includes a third pushing cylinder, a fourth pushing cylinder, a first pushing plate, and a second pushing plate;

[0041] The third pushing cylinder is arranged on a side of the stacking piston away from the first baffle;

[0042] The fourth pushing cylinder is arranged on a side of the second baffle plate away from the first baffle plate;

[0043] The first push plate is arranged on the push rod of the third push cylinder, so as to push a stack of the resistor sheets into the first receiving cavity through the first channel when the receiving box is in the material receiving position;

[0044] The second pushing plate is arranged on the pushing rod of the fourth pushing cylinder, so as to extend into the first accommodating cavity and abut against the resistor sheet pushed in by the first pushing plate when the accommodating box is in the material receiving position.

[0045] Preferably, along the conveying direction of the first conveying member, a plurality of the resistor chip stacking assemblies are provided, and each of the resistor chip stacking assemblies is correspondingly provided with the temporary placement box.

[0046] Preferably, the second conveying assembly includes a second conveying member and an assembly assembly;

[0047] The second conveying member is used to convey the sagger;

[0048] The assembling component is arranged corresponding to the second conveying member, and is used for loading the gasket and the surrounding edge into the sagger, so as to transport the sagger loaded with the gasket and the surrounding edge through the second conveying member;

[0049] The discharge assembly is arranged at the output end of the second conveying member.

[0050] Preferably, the assembly assembly includes a first frame, a first translation mechanism, a second lifting mechanism, a third lifting mechanism, a first adsorption mechanism, and a grabbing mechanism;

[0051] The first frame is arranged corresponding to the second conveying member;

[0052] The first translation mechanism is disposed on the first frame to reciprocate between the first material supply area and the second conveying member;

[0053] The second lifting mechanism and the third lifting mechanism are respectively arranged at the moving ends of the first translation mechanism;

[0054] The first adsorption mechanism is arranged at the lifting end of the second lifting mechanism to adsorb the gasket in the first material supply area and to place the gasket in the sagger transported by the second conveying member;

[0055] The grabbing mechanism is arranged at the lifting end of the third lifting mechanism to clamp the surrounding edge in the first material providing area and to place the surrounding edge in the sagger transported by the second conveying member.

[0056] Preferably, the grabbing mechanism comprises a fifth pushing cylinder and a grabbing plate;

[0057] The fifth push cylinder is arranged at the bottom of the lifting end of the third lifting mechanism, and two fifth push cylinders are arranged, and the two fifth push cylinders are symmetrical to each other and arranged horizontally;

[0058] The push rod of each of the fifth push cylinders is provided with the grab plate so as to grab or release the surrounding edge through the grab plate.

[0059] Preferably, the discharge assembly includes a push-out mechanism, a fourth conveying member, and a fourth lifting mechanism;

[0060] The ejection mechanism is arranged at the output end of the first conveying assembly to eject the resistor sheet conveyed by the first conveying assembly;

[0061] The fourth conveying member is disposed at the lifting end of the fourth lifting mechanism and is located below the output end of the first conveying assembly;

[0062] The fourth conveying member has a first state and a second state lifted by the fourth lifting mechanism; in the first state, the input end of the fourth conveying member is arranged corresponding to the output end of the second conveying component, and the output end of the fourth conveying member is arranged corresponding to the input end of the third conveying component, so as to receive the sagger conveyed by the second conveying component and to convey the semi-assembled sagger; in the second state, the fourth conveying member is arranged corresponding to the output end of the ejection mechanism, so as to connect the resistor pushed out by the ejection mechanism into the sagger.

[0063] Preferably, the third conveying assembly includes a third conveying member, a panel assembly, and a disassembly assembly;

[0064] The third conveying member is arranged at the output end of the discharge assembly to receive and convey the semi-assembled sagger;

[0065] The enclosure assembly is arranged corresponding to the third conveying member to place the enclosure into the semi-assembled sagger;

[0066] The disassembly assembly is arranged corresponding to the third conveying member to take out the surrounding edge in the semi-assembled sagger;

[0067] Along the conveying direction of the third conveying member, the disassembly assembly is located at the rear side of the enclosure assembly.

[0068] Preferably, the enclosure assembly includes a second frame, a rotating mechanism, a fifth lifting mechanism, a flipping mechanism, and a second adsorption mechanism;

[0069] The second frame is arranged corresponding to the third conveying member;

[0070] The rotating mechanism is arranged on the second frame;

[0071] The fifth lifting mechanism is arranged at the bottom of the rotating end of the rotating mechanism, and the flipping mechanism is arranged on both sides of the lifting end of the fifth lifting mechanism;

[0072] The second adsorption mechanism is arranged at the bottom of the turning mechanism to adsorb the enclosure in the second material providing area and to place the enclosure between the sagger and the resistor in the semi-assembled sagger.

[0073] Preferably, the flipping mechanism includes a flipping frame and a sixth pushing cylinder;

[0074] The middle part of the overturn frame is hinged to the bottom of the lifting end side of the fifth lifting mechanism;

[0075] The top end of the sixth push cylinder is hinged to the top of the lifting end of the fifth lifting mechanism, and the push rod of the sixth push cylinder is hinged to the top of the flip frame;

[0076] The second adsorption mechanism is vertically arranged at the bottom of the flip frame.

[0077] Preferably, the disassembly assembly includes a second translation mechanism, a sixth lifting mechanism, and a clamping cylinder;

[0078] The second translation mechanism is disposed on the second frame to reciprocate between the material placement area and the third conveying member;

[0079] The sixth lifting mechanism is arranged at the moving end of the second translation mechanism;

[0080] The clamping cylinder is arranged at the lifting end of the sixth lifting mechanism to clamp the surrounding edge in the semi-assembled sagger and to place the surrounding edge in the material placement area.

[0081] Compared with the prior art, the present invention provides a sequential discharge type resistor strip loading system, which includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; the first conveying component is used to convey resistor strips; the second conveying component is used to convey a sagger equipped with gaskets and surrounding edges; the discharge component is arranged at the output end of the first conveying component and the output end of the second conveying component to receive and convey the sagger, and to send the resistor strips on the first conveying component into the sagger to form a semi-assembled sagger; the third conveying component is arranged at the output end of the discharge component to receive the semi-assembled sagger, place a surrounding plate in the semi-assembled sagger, and take out the surrounding edges in the semi-assembled sagger. The sequential discharge type resistor chip loading system can deliver the resistor chip into the sagger equipped with gaskets and surrounding edges through the first conveying component, the second conveying component, the discharge component and the third conveying component, and can also install and place the surrounding plate between the resistor chip and the sagger, and can take out the surrounding edges of the pre-fixed resistor chip. It has a high degree of automation, reduces the intensity of manual labor, improves the loading efficiency, and also avoids the influence of human factors as much as possible, thereby improving the loading quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0083] Figure 1 A schematic diagram of the three-dimensional structure of a sequential discharge resistor packing system provided by an embodiment from a first viewing angle;

[0084] Figure 2 A schematic diagram of the three-dimensional structure of a sequential discharge type resistor packing system provided by an embodiment from a second viewing angle;

[0085] Figure 3 A schematic diagram of the three-dimensional structure of a sequential discharge type resistor packing system provided by an embodiment from a third viewing angle;

[0086] Figure 4 for Figure 1 A partial enlarged view of area A shown;

[0087] Figure 5 for Figure 2 A local enlarged view of the C region is shown;

[0088] Figure 6 A schematic cross-sectional structure diagram of a resistor stacking assembly in a sequential discharge resistor packing system provided by an embodiment;

[0089] Figure 7 for Figure 6 A local enlarged view of the E region is shown;

[0090] Figure 8 for Figure 3 A partial enlarged view of the H region is shown;

[0091] Fig. 9 for Figure 3 A partial enlarged view of the F region shown;

[0092] Fig.10 for Fig. 9 A local enlarged view of region I is shown;

[0093] Fig.11 This is a top view of the sagger and the surrounding edge after assembly;

[0094] Fig.12 for Figure 2 A local enlarged view of the D region shown;

[0095] Fig.13 for Figure 3 A local enlarged view of the G region shown;

[0096] Fig.14 for Figure 1 A partial enlarged view of area B is shown. DETAILED DESCRIPTION

[0097] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0098] It should be noted that when a component is referred to as being "fixed on", "installed on" or "set on" another component, it can be directly on the other component or indirectly set on the other component; when a component is "connected" to another component, or a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0099] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0100] The present invention provides a sequential discharge type resistor chip loading system, which comprises a first conveying component, a second conveying component, a discharge component and a third conveying component; the first conveying component is used for conveying resistor chips; the second conveying component is used for conveying a sagger equipped with gaskets and surrounding edges; the discharge component is arranged at the output end of the first conveying component and the output end of the second conveying component to receive and convey the sagger, and to convey the resistor chips on the first conveying component into the sagger to form a semi-assembled sagger; the third conveying component is arranged at the output end of the discharge component to receive the semi-assembled sagger, place a surrounding plate in the semi-assembled sagger, and take out the surrounding edges in the semi-assembled sagger. The sequential discharge type resistor chip loading system can deliver the resistor chip into the sagger equipped with gaskets and surrounding edges through the first conveying component, the second conveying component, the discharge component and the third conveying component, and can also install and place the surrounding plate between the resistor chip and the sagger, and can take out the surrounding edges of the pre-fixed resistor chip. It has a high degree of automation, reduces the intensity of manual labor, improves the loading efficiency, and also avoids the influence of human factors as much as possible, thereby improving the loading quality.

[0101] Please refer to Figures 1 to 3 The present embodiment provides a sequential discharge type resistor chip loading system, which includes a first conveying assembly 10 , a second conveying assembly 40 , a discharge assembly 70 , and a third conveying assembly 80 .

[0102] The first conveying assembly 10 is used to convey the resistor sheet, and the second conveying assembly is used to convey the sagger 400 equipped with the gasket 200 and the surrounding edge 300. The discharge assembly 70 is arranged at the output end of the first conveying assembly 10 and the output end of the second conveying assembly 40 to receive the sagger 400 and to convey the resistor sheet on the first conveying assembly 10 into the sagger 400 to form a semi-assembled sagger. That is, the semi-assembled sagger is a sagger that contains the gasket 200, the surrounding edge 300 and the resistor sheet.

[0103] It is understandable that before the resistor is sent into the sagger 400, the gasket 200 and the surrounding edge 300 are pre-installed and placed in the sagger 400, so that the gasket 200 plays a buffering role between the resistor and the bottom wall of the sagger 400, and can also reduce the gap between the resistor and the sagger 400. In addition, the surrounding edge 300 can better limit the position of the resistor in the sagger 400, realize the pre-fixation of the resistor, better guarantee the quality of the sagger, and also better guarantee that other components can be smoothly loaded into the sagger 400 in the subsequent steps.

[0104] Specifically, in this embodiment, the gasket 200 is a square gasket.

[0105] The third conveying assembly 80 is disposed at the output end of the discharge assembly 70 to receive the semi-assembled sagger, place the enclosure 500 in the semi-assembled sagger, and take out the enclosure 300 in the semi-assembled sagger. After the enclosure 500 is placed into the sagger 400 by the third conveying assembly 80 and the enclosure 300 is taken out, the packing of the resistor is finally completed.

[0106] The sequential discharge resistor packing system provided in the present embodiment can automatically load the resistor into the sagger 400 through the cooperation between various components. At the same time, during the assembly process, the gasket 200 and the enclosure 500 can be placed between the sagger 400 and the resistor, thereby realizing overall automated assembly, effectively reducing labor intensity, and improving packing efficiency and packing quality.

[0107] Preferably, the first conveying assembly 10 includes a first conveying member 30 and a resistor sheet stacking assembly 20. The first conveying member 30 is used to convey the temporary placement box 600. The resistor sheet stacking assembly 20 is arranged corresponding to the first conveying member 30, and is used to stack the resistor sheets to form a stack of stacked resistor sheets, and push the stack of stacked resistor sheets into the temporary placement box 600, so as to convey the stack of stacked resistor sheets with the temporary placement box 600 through the first conveying member 30. The discharge assembly 70 is arranged at the output end of the first conveying member 30.

[0108] That is to say, in this embodiment, the resistor sheets sent into the sagger 400 by the discharge assembly 70 are the stacked resistor sheets that have been stacked, thereby further accelerating the efficiency of the sagger.

[0109] Specifically, the stack of stacked resistor sheets with the temporary placement box 600 is conveyed by the first conveying component 10. The temporary placement box 600 can temporarily fix the stack of stacked resistor sheets, ensuring that the subsequent discharge component 70 can smoothly push the entire stack of stacked resistor sheets, further ensuring the quality of the box loading.

[0110] It can be understood that, in this embodiment, the stacked resistor sheets with the temporary placement box 600 are assembled from the components in the first conveying component 10, which further improves the automation of the sequential discharge resistor sheet loading system and reduces labor intensity.

[0111] In this embodiment, in the horizontal direction, along a conveying direction perpendicular to the first conveying member 30 , both sides of the temporary placement box 600 are open.

[0112] Specifically, the first conveying member 30 is used to sequentially convey the temporary placement box 600 containing the resistor sheet to the discharge assembly 70 , and stops conveying after the temporary placement box 600 containing the resistor sheet reaches the discharge position of the discharge assembly 70 .

[0113] Please refer to Figures 4 to 8 Preferably, the resistor stack assembly 20 includes a first stacking mechanism 21 , a first pushing mechanism 22 , a second stacking mechanism 23 , and a second pushing mechanism 24 .

[0114] The first stacking mechanism 21 is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets.

[0115] The first pushing mechanism 22 is provided corresponding to the first stacking mechanism 21, and is used to push a stack of the resistor sheets out of the first stacking mechanism 21. That is, when the number of resistor sheets stacked in the first stacking mechanism 21 is completed, the first pushing mechanism 22 pushes out the stack of resistor sheets stacked in the first stacking mechanism 21.

[0116] The input end of the second stacking mechanism 23 is arranged corresponding to the first stacking mechanism 21, so as to sequentially receive a stack of the resistor sheets, and stack multiple stacks of the resistor sheets into the stack of stacked resistor sheets. And the output end of the second stacking mechanism 23 is arranged corresponding to the first conveying member 30. That is, the second stacking mechanism 23 is used to receive a stack of the resistor sheets pushed out from the first stacking mechanism 21, and gradually stack multiple stacks of the resistor sheets, and finally stack them into the stack of stacked resistor sheets.

[0117] The second pushing mechanism 24 is provided corresponding to the second stacking mechanism 23, and is used to push the stacked resistor sheets from the second stacking mechanism 23 into the first conveying member 30. That is, the second pushing mechanism 24 is used to push the stacked resistor sheets stacked by the second stacking mechanism 23 into the first conveying member 30, so that the stacked resistor sheets can enter the temporary placement box 600 accordingly.

[0118] Specifically, in this embodiment, the second stacking mechanism 23 is arranged beside the first conveying member 30, and the first stacking mechanism 23 is used to sequentially receive the single-chip resistor sheets and stack them into a vertical stack of the resistor sheets. The first pushing mechanism 22 is used to translate a stack of the resistor sheets into the second stacking mechanism 23. The second stacking mechanism 23 is used to sequentially receive multiple stacks of the resistor sheets, and after receiving a preset number of rows of the resistor sheets, the stack of stacked resistor sheets is obtained, and the stack of stacked resistor sheets in the vertical state is driven to rotate 90° in the vertical plane to obtain the stack of stacked resistor sheets in the horizontal state. The second pushing mechanism 24 is used to translate the stack of stacked resistor sheets in the horizontal state into the temporary placement box 600 on the first conveying member 30.

[0119] Preferably, the second stacking mechanism 23 includes a accommodating box 231, a first baffle 232, a second baffle 233, a rotating shaft 234, and a rotating driving mechanism 235. A first accommodating cavity 2311 with two sides open is provided in the accommodating box 231. The first baffle 232 and the second baffle 233 are arranged on opposite sides of the accommodating box 231, and the second baffle 233 is located on a side close to the first conveying member 30. The rotating shaft 234 is connected to the accommodating box 231 to drive the accommodating box 231 to rotate. The rotating driving mechanism 235 is connected to the rotating shaft 234 to drive the rotating shaft 234 to rotate.

[0120] The receiving box 231 has a receiving position for receiving the resistor sheet delivered by the first pushing mechanism 22, and a feeding position after being rotated by the rotating shaft 234. In this embodiment, the receiving position of the receiving box 231 is specifically the position of the receiving box 231 when the receiving box 231 is in a vertical state, and the feeding position of the receiving box 231 is specifically the position of the receiving box 231 when the receiving box 231 is in a horizontal state.

[0121] The first baffle 232 has a first channel 2321 at the receiving position, and the first channel 2321 is used to connect the first accommodating cavity 2311 and the first stacking mechanism 21. The first baffle 232 also has a second channel 2322 at the feeding position, and the second channel 2322 is used to connect the first accommodating cavity 2311.

[0122] The second baffle 233 is provided with a third channel 2331 corresponding to the second channel 2322 at the feeding position, and the third channel 2331 is used to connect the first accommodating cavity 2311 with the first conveying member 30. The second pushing mechanism 24 is provided corresponding to the second channel 2322.

[0123] Specifically, in this embodiment, the rotating shaft 234 is horizontally arranged beside the first conveying member 30, and the arrangement direction of the rotating shaft 234 is perpendicular to the conveying direction of the first conveying member 30. The first baffle 232 and the second baffle 233 are both perpendicular to the axis of the rotating shaft 234. The containing box 231 is arranged on the outer peripheral surface of the rotating shaft 234, and the rotating driving mechanism 235 is used to drive the rotating shaft 234 to rotate so that the containing box 231 rotates around the rotating shaft 234 in a vertical plane.

[0124] Preferably, the second pushing mechanism 24 includes a first pushing cylinder 241, a second pushing cylinder 242, a first flat-head pushing block 243, and a second pushing plate 244. The first pushing cylinder 241 and the second pushing cylinder 242 are disposed on opposite sides of the first conveying member 30, and the first pushing cylinder 241 is disposed on a side of the first baffle 232 away from the first conveying member 30, the first pushing cylinder 241 is disposed opposite to the second channel 2322, and the second pushing cylinder 242 is disposed opposite to the third channel 2331.

[0125] The first flat-head push block 243 is disposed on the push rod of the first push cylinder 241, so as to push the stacked resistor sheets in the storage box 231 into the first conveying member 30 when the storage box 231 is in the feeding position. The second push plate 244 is disposed on the push rod of the second push cylinder 242, so as to cooperate with and abut against the stacked resistor sheets.

[0126] Specifically, in this embodiment, the first flat-head pushing block 243 can move along the second channel 2322 and the third channel 2331 , so as to push the stacked resistor sheets into the first conveying member 30 .

[0127] When the number of resistor sheets in the first accommodating chamber 2311 reaches the maximum, the rotating shaft 234 drives the accommodating box 231 to rotate to the receiving position, the second pushing cylinder 242 pushes the second push plate 244 to move into the third channel 2331, and the first pushing cylinder 241 pushes the first flat-head push block 243 to pass through the second channel 2322 and the second push plate 244 to jointly push the stacked resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement box 600 on the first conveying member 30. In this process, the first flat-head push plate 243 and the second push plate 244 are respectively located on both sides of the stacked resistor sheets. When the stacked resistor sheets are moved into the temporary placement box 600, the second pushing cylinder 242 pushes the second push plate 244 to reset, and the first pushing cylinder 241 pushes the first flat-head push block 243 to reset. In this way, the stacked resistor sheets are better prevented from being scattered.

[0128] Preferably, the first stacking mechanism 21 includes a stacking piston 211 , a feeding funnel 212 , a vibration mechanism 213 , a support rod 214 , a first lifting mechanism 215 , and a blocking mechanism 216 .

[0129] The stacking piston 211 is arranged on the side of the first baffle 232 away from the first conveying member 30, and a second accommodating chamber 2111 for accommodating a stack of the resistor sheets is arranged in the stacking piston 211. The second accommodating chamber 2111 is open on the side close to the first baffle 232 and communicates with the first channel 2321.

[0130] The feeding hopper 212 is connected to the second accommodating chamber 2111 to transport the single resistor into the second accommodating chamber 2111. The vibration mechanism 213 is connected to the feeding hopper 212. The support rod 214 is disposed in the second accommodating chamber 2111 to support the resistor. The first lifting mechanism 215 is connected to the support rod 214 to drive the support rod 214 to rise and fall.

[0131] The blocking mechanism 216 is arranged corresponding to the stacking piston 211 and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism 214 blocks the first channel 2321 from the second accommodating chamber 2111. In the second blocking state, the blocking mechanism 214 blocks the feeding funnel 212 from the second accommodating chamber 2111.

[0132] Specifically, in this embodiment, the stacking piston 211 is vertically arranged on the side of the first baffle 232 away from the first conveying member 30. The feeding funnel 212 is vertically arranged on the top of the stacking piston 211, and the bottom end of the feeding funnel 212 is connected to the top end of the second accommodating chamber 2111. The vibration mechanism 213 is used to drive the feeding funnel 212 to vibrate, so that the resistor sheets fall from the feeding funnel 212 into the second accommodating chamber 2111 in sequence. The support rod 214 is vertically arranged in the second accommodating chamber 2111, and a support plate 2141 is horizontally arranged on the top of the support rod 214, and the first lifting mechanism 215 is connected to the bottom of the support rod 214. The blocking mechanism 216 is used to close the open side of the second accommodating chamber 2111 and open the top of the second accommodating chamber 2111 when the stacking piston 211 is not full of a stack of the resistor sheets. The blocking mechanism 216 is also used to open the open side of the second accommodating cavity 2111 and close the top of the second accommodating cavity 2111 when the feed funnel 212 is full of the resistor sheets.

[0133] When the stack of resistor sheets in the second accommodating chamber 2111 is full, the blocking mechanism 216 opens the open side of the second accommodating chamber 2111 and closes the top of the second cavity 2111. The accommodating box 231 rotates to a vertical state and one side of the first accommodating chamber 2311 is connected to the first channel 2321, and the other side of the first accommodating chamber 2311 is closed by the second baffle 233. The first pushing mechanism 22 pushes the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. When the number of resistor sheets in the first accommodating chamber 2311 reaches the full value, the accommodating box 231 rotates to a horizontal state and one side is connected to the second channel 2322 and the other side is connected to the third channel 2331. The second pushing mechanism 24 pushes the resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement box 600 on the first conveying member 30.

[0134] The resistor sheets are stacked in sequence into a stack of resistor sheets through the cooperation of the feeding funnel 212 and the stacking piston 211, and then multiple stacks of resistor sheets are input into the first accommodating chamber 2311 to form the stacked resistor sheets, and finally moved into the temporary placement box 600. The whole process is automated and no manual stacking is required, thus reducing the amount of labor.

[0135] Preferably, the first pushing mechanism 22 includes a third pushing cylinder 221, a fourth pushing cylinder 222, a first pushing plate 223, and a second pushing plate 224. The third pushing cylinder 221 is disposed on a side of the stacking piston 211 away from the first baffle 232, and the fourth pushing cylinder 222 is disposed on a side of the second baffle 233 away from the first baffle 232. The first pushing plate 223 is disposed on a push rod of the third pushing cylinder 221, so as to push a stack of the resistor sheets into the first accommodating cavity 2311 through the first channel 2321 when the accommodating box 231 is in the material receiving position. The second pushing plate 224 is disposed on the fourth pushing cylinder 222, so as to extend into the first accommodating cavity 2311 and abut against the resistor sheets pushed in by the first pushing plate 223 when the accommodating box 231 is in the material receiving position.

[0136] Specifically, in this embodiment, the first push plate 223 is vertically disposed in the second accommodating cavity 2111 , the second push plate 224 is vertically disposed in the first accommodating cavity 2311 , and the fourth push cylinder 222 is disposed on the second baffle plate 233 .

[0137] When the stack of resistor sheets in the second accommodating chamber 2111 is full, the third pushing cylinder 221 pushes the first pushing plate 223 to move so as to push the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. The fourth pushing cylinder 222 is used to push the second pushing plate 224 against the side of the stack of resistor sheets away from the first pushing plate 223.

[0138] The first pushing mechanism 22 can completely push a stack of resistor sheets in the second accommodating cavity 2111 into the first accommodating cavity 2311. During the pushing process, the first pushing plate 223 and the second pushing plate 224 are pressed against both ends of the stacked resistor sheets to prevent the stacked resistor sheets from tilting or falling.

[0139] Preferably, along the conveying direction of the first conveying member 30, the resistor stacking assembly 20 is provided with a plurality (at least two), and each resistor stacking assembly 20 is provided with a corresponding temporary placement box 600, thereby further improving the efficiency of resistor loading.

[0140] Preferably, the second conveying assembly 40 includes a second conveying member 50 and an assembly assembly 60, wherein the second conveying member 50 is used to convey the sagger 400. The assembly assembly 60 is arranged corresponding to the second conveying member 50, and is used to load the gasket 200 and the surrounding edge 300 into the sagger 400, so as to transport the sagger 400 equipped with the gasket 200 and the surrounding edge 300 through the second conveying member 50. The discharge assembly 70 is arranged at the output end of the second conveying member 50.

[0141] That is to say, in this embodiment, the gasket 200 and the surrounding edge 300 are automatically loaded into the sagger 400 by the components in the second conveying assembly 40, which further improves the automation of the sequential discharge resistor strip loading system, reduces labor intensity, and facilitates subsequent operations.

[0142] Please refer to Figures 9 to 11 Preferably, the assembly component 60 includes a first frame 61, a first translation mechanism 62, a second lifting mechanism 63, a third lifting mechanism 64, a first adsorption mechanism 65, and a grabbing mechanism 66. The first frame 61 is arranged corresponding to the second conveying member 50, and the first translation mechanism 62 is arranged on the first frame 61 to reciprocate between the first material supply area and the second conveying member 50. The second lifting mechanism 63 and the third lifting mechanism 64 are respectively arranged at the moving end of the first translation mechanism 62. The first adsorption mechanism 65 is arranged at the lifting end of the second lifting mechanism 63 to adsorb the gasket 200 in the first material supply area, and to place the gasket 200 in the sagger 400 transported on the second conveying member 50. The grabbing mechanism 66 is arranged at the lifting end of the third lifting mechanism 64 to clamp the surrounding edge 300 in the first material supply area, and to place the surrounding edge 300 in the sagger 500 transported on the second conveying member 50.

[0143] Specifically, in this embodiment, the first material supply area is provided with a first placement platform, the first placement platform is used to stack the gasket 200 and the surrounding edge 300, and the placement position of the gasket 200 is aligned with the gasket installation position of the second conveying member 50, and the placement position of the surrounding edge 300 is aligned with the surrounding edge installation position of the second conveying member 50. The first translation mechanism 62 is arranged directly above the gasket installation position, the surrounding edge installation position and the first placement platform.

[0144] During operation, the first adsorption mechanism 65 first adsorbs the gasket 200, and the grabbing mechanism 66 first grabs the surrounding edge 300. When the second conveying member 50 drives the sagger 400 to move to the gasket installation position, the first translation mechanism 62 drives the first adsorption mechanism 65 and the grabbing mechanism 66 to move to the top of the gasket installation position and the surrounding edge installation position. When the second lifting mechanism 62 drives the first adsorption mechanism 65 to descend above the gasket installation position, the first adsorption mechanism 65 releases the gasket 200. After the gasket 200 is assembled in the sagger 400, the second conveying member 50 drives the sagger 400 to move to the surrounding edge installation position. When the sagger 400 moves to the edge installation position, the third lifting mechanism 64 drives the grasping mechanism 66 to descend just above the edge installation position, and the grasping mechanism 66 releases the edge 300, so that the edge 300 is assembled in the sagger 400, so that four gaps for placing the enclosure 500 are formed between the edge 300 and the inner wall of the sagger 400.

[0145] Preferably, the grabbing mechanism 66 includes a fifth pushing cylinder 661 and a grabbing plate 662. The fifth pushing cylinder 661 is disposed at the bottom of the lifting end of the third lifting mechanism 64, and two fifth pushing cylinders 661 are provided, and the two fifth pushing cylinders 661 are symmetrical to each other and arranged horizontally. The grabbing plate 662 is provided on the push rod of each fifth pushing cylinder 661, so as to grab or release the surrounding edge 300 through the grabbing plate 622. Therefore, through this structure, the surrounding edge 300 can be grabbed and released more stably.

[0146] Specifically, a plurality of rubber pads 663 are evenly arranged on one side of the grab plate 662 away from the fifth pushing cylinder 661, and the two fifth pushing cylinders 661 are used to push the two grab plates 662 away from or close to each other to grab the surrounding edge 300 or release the surrounding edge 300. The two grab plates 662 are used to press against the inner side wall of the surrounding edge 300 to grab the surrounding edge, which will not affect the placement of the surrounding edge 300 into the sagger 400, and the rubber pads 633 on the outer side of the grab plate 662 can increase the friction between the grab plate 662 and the surrounding edge 300, so that the grabbing is firm.

[0147] Please refer to Fig.12Preferably, the discharge assembly 70 includes a push-out mechanism 71, a fourth conveying member 72, and a fourth lifting mechanism 73. The push-out mechanism 71 is arranged at the output end of the first conveying assembly 10 to push out the resistor sheet conveyed on the first conveying assembly 10. The fourth conveying member 72 is arranged at the lifting end of the fourth lifting mechanism 73 and is located below the output end of the first conveying assembly 10. The fourth conveying member 72 has a first state and a second state lifted by the fourth lifting mechanism 73. In the first state, the input end of the fourth conveying member 72 is arranged corresponding to the output end of the second conveying assembly 40, and the output end of the fourth conveying member 72 is arranged corresponding to the input end of the third conveying assembly 80, so as to receive and transport the sagger 400 conveyed by the second conveying assembly 40, and to transport the semi-assembled sagger. In the second state, the fourth conveying member 72 is arranged corresponding to the output end of the push-out mechanism 71 to connect the resistor sheet pushed out by the push-out mechanism 71 into the sagger 400. Therefore, this structure can better ensure that the resistor strip is fed into the sagger 400, and the sagger loading quality is better ensured.

[0148] Specifically, the ejection mechanism 71 is arranged beside the output end of the first conveying member 30, and an ejection plate 74 is arranged on the side of the output end of the first conveying member 30 away from the ejection mechanism 71. The fourth conveying member 72 is arranged obliquely below the discharge position of the first conveying line 30. The conveying directions of the second conveying member 50, the third conveying assembly 80 and the fourth conveying member 72 are all on the same straight line and perpendicular to the conveying direction of the output end of the first conveying member 20, so as to better ensure the conveying and installation of materials. The top end of the fourth conveying member 72 corresponds to the output end of the second conveying member 50, the bottom end of the fourth conveying line 72 corresponds to the input end of the third conveying assembly 80, and the fourth lifting mechanism 73 is arranged at the bottom of the fourth conveying line 72.

[0149] The fourth conveying member 72 is used to drive the sagger 400 after the gasket 200 and the surrounding edge 300 are installed to move, so that the bottom end of the sagger 400 is located directly below the end of the push-out plate 74 away from the first conveying member 30. When the bottom end of the sagger 400 is located directly below the end of the push-out plate 74 away from the first conveying member 30, the fourth lifting mechanism 73 drives the fourth conveying line 72 to rise to a preset height to the second state, and the push-out mechanism 71 pushes the stacked resistor sheets in the temporary placement box 600 from the end of the push-out plate 74 away from the first conveying member 30, so that multiple rows of resistor sheets fall into the sagger 400 in sequence and are located on the inner side of the surrounding edge 300. In this process, the fourth conveying member 72 drives the sagger 400 to move toward the bottom end of the fourth conveying member 72 so that the resistor sheets are sequentially discharged in the sagger 400. When all the resistors have fallen into the sagger 400, the fourth lifting mechanism 73 drives the fourth conveyor line 72 to descend to the first state, and the fourth conveyor 72 conveys the sagger 400 to the third conveyor assembly 80. The resistors in the temporary placement box 600 are pushed into the sagger 400 below the ejection plate 74 in stacks through the discharge assembly 70, and during the ejection process, the fourth conveyor 72 drives the sagger 400 to move so that the resistors can fall into the area in the sagger 400 where there are no resistors, so as to discharge the resistors in sequence and complete the transfer and stacking of the resistors.

[0150] Preferably, the third conveying assembly 80 includes a third conveying member 81, a panel assembly 82, and a disassembly assembly 83. The third conveying member 81 is arranged at the output end of the discharge assembly 70 to receive and convey the semi-assembled sagger. The panel assembly 82 is arranged corresponding to the third conveying member 81 to place the panel 500 in the semi-assembled sagger. The disassembly assembly 83 is arranged corresponding to the third conveying member 81 to take out the surrounding edge 300 in the semi-assembled sagger. Along the conveying direction of the third conveying member 81, the disassembly assembly 83 is located at the rear side of the panel assembly 82. Through this structure, the installation of the panel 500 and the removal of the surrounding edge 300 are better guaranteed.

[0151] Please refer to Fig.13 and Fig.14. Preferably, the enclosure assembly 82 includes a second frame 821, a rotating mechanism 822, a fifth lifting mechanism 823, a flipping mechanism 824, and a second adsorption mechanism 825. The second frame 821 is arranged corresponding to the third conveying member 81, the rotating mechanism 822 is arranged on the second frame 821, the fifth lifting mechanism 823 is arranged at the bottom of the rotating end of the rotating mechanism 822, and the flipping mechanism 824 is arranged on both sides of the lifting end of the fifth lifting mechanism 823. The second adsorption mechanism 825 is arranged at the bottom of the flipping mechanism 824 to adsorb the enclosure 500 in the second material supply area, and to place the enclosure 500 between the sagger 400 and the resistor in the semi-assembled sagger.

[0152] Specifically, in this embodiment, a second placement platform is provided in the second material supply area, and the second placement platforms are provided on both sides of the enclosure installation position of the third conveying member 81, and the upper surface of the second placement platform is used to place the enclosure 500. The rotating mechanism 822 is provided directly above the enclosure installation position.

[0153] The fifth lifting mechanism 823 is used to drive the flipping mechanism 824 and the second adsorption mechanism 825 to rise or fall. When the fifth lifting mechanism 823 drives the second adsorption mechanism 825 to fall, the second adsorption mechanism 825 is used to adsorb the enclosure 500 on the second placement platform. The flipping mechanism 824 is used to drive the second adsorption mechanism 825 to rotate 90° in a vertical plane after the second adsorption mechanism 825 adsorbs the enclosure 500, so that the enclosure 500 changes from a horizontal state to a vertical state. The second adsorption mechanism 825 is also used to release the enclosure 500 after the enclosure 500 is in a vertical state, so that the two enclosures 500 fall into the gaps between the inner walls of the enclosure 300 and the opposite sides of the sagger 400. The rotating mechanism 822 is used to drive the fifth lifting mechanism 823 to rotate 90° in the horizontal plane after the enclosure 500 is placed. The fifth lifting mechanism 823, the flipping mechanism 824 and the second adsorption mechanism 825 are used to repeatedly adsorb, flip and place the enclosure 500 again after horizontal rotation, and place the enclosure 500 in the gap between the inner walls of the other two sides of the sagger 400 and the enclosure 300. Therefore, the enclosure 500 can be automatically installed in the gap between the four side edges of the enclosure 300 and the inner wall of the sagger 400 through the enclosure assembly 82.

[0154] Preferably, the flipping mechanism 824 includes a flipping frame 8241 and a sixth pushing cylinder 8242. The middle part of the flipping frame 8241 is hinged to the bottom of the lifting end of the fifth lifting mechanism 823. The top of the sixth pushing cylinder 8242 is hinged to the top of the lifting end of the fifth lifting mechanism 823, and the push rod of the sixth pushing cylinder 8242 is hinged to the top of the flipping frame 8241. The second adsorption mechanism 825 is vertically arranged at the bottom of the flipping frame 8241, and the sixth pushing cylinder 8242 is used to push the flipping frame 8241 to rotate in a vertical plane. Therefore, through this structure, the reliability of the operation of the flipping mechanism 824 is better guaranteed.

[0155] Preferably, the disassembly assembly 83 includes a second translation mechanism 831, a sixth lifting mechanism 832, and a clamping cylinder 833. The second translation mechanism 831 is disposed on the second frame 821 to reciprocate between the material placement area and the third conveying member. The sixth lifting mechanism 832 is disposed at the moving end of the second translation mechanism 831. The clamping cylinder 833 is disposed at the lifting end of the sixth lifting mechanism 832 to clamp the surrounding edge 300 in the semi-assembled sagger and to place the surrounding edge 300 in the material placement area.

[0156] Specifically, in this embodiment, a third placement platform is provided in the material placement area, and the upper surface of the third placement platform is used to place the edge 300. The second translation mechanism 831 is provided at the disassembly position of the third conveying member 81 and directly above the third placement platform. The clamping cylinder 833 is provided on both sides of the bottom of the lifting end of the sixth lifting mechanism 832, and the second translation mechanism 831 is used to drive the sixth lifting mechanism 832 to move between the disassembly position and directly above the position on the third placement platform where the edge 300 is placed, and the sixth lifting mechanism 832 is used to drive the clamping cylinder 833 to rise or fall between the disassembly position and directly above the position on the third placement platform where the edge 300 is placed. When the sixth lifting mechanism 832 drives the clamping cylinder 833 to descend just above the disassembly position, the two clamping cylinders 833 clamp the top of the two sides of the edge 300; when the sixth lifting mechanism 832 drives the clamping cylinder 833 to descend just above the position where the edge 300 is placed on the third placement platform, the two clamping cylinders 833 release the edge 300. This structure ensures more stable removal and placement of the edge 300. The edge 500 is removed from the sagger 400 through the disassembly assembly 33, which is convenient for subsequent operations.

[0157] Specifically, in this embodiment, the first conveying member 30 , the second conveying member 50 , the third conveying member 81 , and the fourth conveying member 72 are all conveyor belts.

[0158] In this embodiment, the translation mechanism can be composed of a horizontal guide rail slider mechanism and a screw mechanism, and the screw mechanism is used to drive the slider to translate along the guide rail to achieve the translation effect; the lifting mechanism can be composed of a vertical guide rail slider mechanism and a screw mechanism, and the screw mechanism is used to drive the slider to move up and down along the vertical guide rail to achieve the effect of rising or falling; the adsorption mechanism is composed of a suction cup and a conduit, and the conduit is connected to an air pipeline. When adsorption is performed, negative pressure is formed at the suction cup to suck up the workpiece.

[0159] The working process of the sequential discharge resistor packing system provided in this embodiment is as follows:

[0160] The single-chip resistors are sequentially fed into the feeding hopper 212, and the vibration mechanism 213 drives the feeding hopper 212 to vibrate, so that the resistors are sequentially fed from the bottom end of the feeding hopper 212 into the second accommodating chamber 2111 of the stacking piston 211 under the action of the vibration. The support rod 214 is located at the top of the second accommodating chamber 2111 in the initial state, and the resistors are supported upward by the support rod 214. As the number of resistors entering the stacking piston 211 increases, the first lifting mechanism 215 drives the support rod 214 to descend in the second accommodating chamber 2111, so that more resistors enter the second accommodating chamber 2111.

[0161] When a preset number of resistor sheets are stacked in the second accommodating chamber 2111, the blocking mechanism 216 opens the open side of the second accommodating chamber 2111 and closes the top of the second accommodating chamber 2111. The rotating drive mechanism 235 drives the rotating shaft 234 to rotate, so that the accommodating box 231 rotates in a vertical plane until the accommodating box 231 is in a vertical state. At this time, the first accommodating chamber 2311 is in a vertical state, one side of which is connected to the first channel 2321, and the other side is closed by the second baffle 233. The third pushing cylinder 221 pushes the first pushing plate 223 in the second accommodating chamber 2111 to move toward the first channel 2321, so as to push the stack of resistor sheets in the second accommodating chamber 2111 from the first channel 2321 into the first accommodating chamber 2311. After the stack of resistor sheets enters the first accommodating chamber 2311, the fourth pushing cylinder 222 pushes the second pushing plate 224 to press against the side of the resistor sheets away from the first pushing plate 223.

[0162] When the first accommodating chamber 2311 receives a preset number of rows of resistor sheets, a stack of resistor sheets is obtained. The rotating drive mechanism 235 drives the rotating shaft 234 to rotate, so that the accommodating box 231 containing the stack of resistor sheets rotates in a vertical plane until the accommodating box 231 is in a horizontal state. At this time, the first accommodating chamber 2311 is in a horizontal state and one side is connected to the second channel 2322, and the other side is connected to the third channel 2331. The second pushing cylinder 242 pushes the second push plate 244 to move in a horizontal plane into the third channel 2331 and against one side of the stack of resistor sheets. Then, the first pushing cylinder 241 and the second pushing cylinder 242 push the first flat-head push block 243 and the second push plate 244 respectively to move toward the first conveying member 30, so as to push the stack of resistor sheets in the first accommodating chamber 2311 from the third channel 2331 to the temporary placement box 600 on the first conveying member 30.

[0163] The first conveying member 30 drives the temporary placement box 600 containing the resistor sheet to move toward the discharge assembly 70 until the temporary placement box 600 containing the resistor sheet moves to the assembly position at the output end of the first conveying member 30 and stops.

[0164] The second conveyor line 50 conveys the sagger 400 to the assembly component 60, and stops conveying when the sagger 400 moves to the pad installation position. The first translation mechanism 62 drives the first adsorption mechanism 65 and the grabbing mechanism 66 to move respectively to directly above the gasket 200 and the surrounding edge 300 placed on the first placement platform. The second lifting mechanism 63 drives the first adsorption mechanism 65 to descend until the first adsorption mechanism 65 contacts the uppermost gasket 200, and the first adsorption mechanism 65 adsorbs the gasket 200. The third lifting mechanism 64 drives the grabbing mechanism 66 to descend until the grabbing plate 662 is located on the inner side of the surrounding edge 300. The two fifth pushing cylinders 661 push the two grabbing plates 662 away from each other so that the two grabbing plates 662 are against the inner walls of the surrounding edge 300. Then, the second lifting mechanism 63 and the third lifting mechanism 64 respectively drive the first adsorption mechanism 65 and the grabbing mechanism 66 to rise to a preset height, the first translation mechanism 62 drives the first adsorption mechanism 65 and the grabbing mechanism 66 to move to directly above the pad installation position and the edge installation position respectively, and the second lifting mechanism 63 drives the first adsorption mechanism 65 to descend until the gasket 200 adsorbed by the first adsorption mechanism 65 is placed in the sagger 400, and the first adsorption mechanism 65 releases the gasket 200, so that the gasket 200 is placed horizontally on the inner bottom surface of the sagger 400, and then the second conveying member 50 drives the sagger 400 to move to the edge installation position. The third lifting mechanism 64 drives the grabbing mechanism 66 to descend until the edge 300 grabbed by the grabbing mechanism 66 is placed inside the sagger 400, and the two fifth pushing cylinders 661 push the two grabbing plates 662 to approach each other, so that the two grabbing plates 662 are away from the inner wall sides of the edge 300, so that the edge 300 is placed inside the sagger 400. After assembly, the second conveying member 50 conveys the sagger 400 to the fourth conveying member 72.

[0165] The fourth conveying member 72 drives the sagger 400 to move to the bottom of the ejection plate 74, and makes the bottom end of the sagger 400 be located directly below the side of the ejection plate 74 away from the first conveying member 30. The fourth lifting mechanism 73 drives the fourth conveying member 72 to rise to a preset height to shorten the distance between the sagger 400 and the ejection plate 74. The ejection mechanism 71 ejects the resistors in the temporary placement box 600 from the side of the ejection plate 74 away from the first conveying member 30, so that the resistors fall into the sagger 400 below in rows and are located on the inner side of the surrounding edge 300. In the process of the ejection mechanism 71 ejecting the resistor group, the fourth conveying member 72 drives the sagger 400 to move toward the bottom end of the fourth conveying member 72, so that each row of resistors is sequentially discharged in the sagger 400. After the discharge is completed, the fourth conveying member 72 transports the sagger 400 to the third conveying member 81.

[0166] The third conveying member 81 drives the sagger 400 to move to the enclosure installation position, and the fifth lifting mechanism 823 drives the second adsorption mechanism 825 to descend until the second adsorption mechanism 825 contacts and adsorbs the enclosure 500 placed on the second placement platform. The fifth lifting mechanism 823 drives the second adsorption mechanism 825 to rise to a preset height, and the sixth pushing cylinder 8242 pushes the flip frame 8241 to rotate 90° in the vertical plane, so that the enclosure 500 in the horizontal state is transformed into a vertical state and is located directly above the gap between the inner wall of the sagger 400 and the side of the enclosure 300. The fifth lifting mechanism 823 drives the second adsorption mechanism 825 to descend to a preset height, so that the enclosure 500 is close to the sagger 400, and the second adsorption mechanism 825 releases the enclosure 500, so that the enclosure 500 falls into the gap between the inner wall of the sagger 400 and the side of the enclosure 300. Then, the fifth lifting mechanism 823 drives the second adsorption mechanism 825 to rise to a preset height, and the sixth pushing cylinder 8242 pushes the flip frame 8241 to rotate in a vertical plane to reset the second adsorption mechanism 825. The fifth lifting mechanism 823 drives the second adsorption mechanism 825 to descend until the second adsorption mechanism 825 contacts and adsorbs the enclosure 500 placed on the second placement platform, and the fifth lifting mechanism 823 drives the second adsorption mechanism 825 to rise to a preset height, and the rotating mechanism 822 drives the fifth lifting mechanism 823 to rotate 90° in a horizontal plane, and the sixth pushing cylinder 8242 pushes the flip frame 8241 to rotate 90° in a vertical plane, so that the enclosure 500 in a horizontal state is transformed into a vertical state and is located directly above the gap between the inner wall of the sagger 400 and the other two side edges of the enclosure 300. The fifth lifting mechanism 823 drives the second adsorption mechanism 825 to descend to a preset height, so that the enclosure 500 is close to the sagger 400, and then the second adsorption mechanism 825 releases the enclosure 500 to make the enclosure 500 fall into the gap between the inner wall of the sagger 400 and the other two side edges of the enclosure 300. Then, the fifth lifting mechanism 823 drives the second adsorption mechanism 825 to rise to a preset height, and the sixth pushing cylinder 8242 pushes the flip frame 8241 to rotate in a vertical plane to reset the second adsorption mechanism 825, and the rotating mechanism 822 drives the fifth lifting mechanism 823 to rotate and reset in a horizontal plane.

[0167] After assembling the enclosure 500, the third conveying member 81 drives the sagger 400 to move to the disassembly position, the second translation mechanism 831 drives the sixth lifting mechanism 832 to move to the top of the disassembly position, and the sixth lifting mechanism 832 drives the clamping cylinder 833 to descend until the clamps of the clamping cylinder 833 move to the sides of the side edge 300, and the two clamping cylinders 833 push the clamps to approach each other to clamp the top of the two sides of the side edge 300. The sixth lifting mechanism 832 drives the clamping cylinder 833 to rise to a preset height, and the second translation mechanism 831 drives the sixth lifting mechanism 832 to move to the top of the side edge placement position on the third placement platform. The sixth lifting mechanism 832 drives the clamped surround 300 to descend until the bottom of the surround 300 contacts the upper surface of the third placement platform or the upper surface of the top surround 300 stacked on the third placement platform, and the two clamping cylinders 833 push the clamps away from each other to release the surround 300, so that the surround 300 is placed on the third placement platform or on the surround 300 stacked on the third placement platform.

[0168] Then, the third conveying member 81 conveys the sagger 400 to an output end of the third conveying member 81 to enter the next process.

[0169] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. A sequential discharge type resistor chip loading system, characterized in that: It includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; The first conveying component is used to convey the resistor sheet; The second conveying assembly is used to convey the sagger equipped with the gasket and the surrounding edge; The discharge assembly is arranged at the output end of the first conveying assembly and the output end of the second conveying assembly to receive and convey the sagger, and is used to convey the resistor sheet on the first conveying assembly into the sagger to form a semi-assembled sagger; The third conveying assembly is arranged at the output end of the discharge assembly to receive the semi-assembled sagger, place the enclosure plate into the semi-assembled sagger, and take out the enclosure edge in the semi-assembled sagger; The first conveying assembly includes a first conveying member and a resistor sheet stacking assembly; The first conveying member is used to convey the temporary placement box; The resistor sheet stacking assembly is arranged corresponding to the first conveying member, and is used to stack the resistor sheets into a stack, and push the stack of resistor sheets into the temporary placement box, so as to convey the stack of resistor sheets with the temporary placement box through the first conveying member; The discharge assembly is arranged at the output end of the first conveying member.

2. The sequential discharge resistor packing system according to claim 1, characterized in that: The resistor stacking assembly comprises a first stacking mechanism, a first pushing mechanism, a second stacking mechanism, and a second pushing mechanism; The first stacking mechanism is used to sequentially receive single resistor sheets and stack multiple resistor sheets into a stack of resistor sheets; The first pushing mechanism is arranged corresponding to the first stacking mechanism, and is used to push a stack of the resistor sheets out of the first stacking mechanism; The input end of the second stacking mechanism is arranged corresponding to the first stacking mechanism to sequentially receive a stack of the resistor sheets and stack multiple stacks of the resistor sheets into the stacked resistor sheets; and the output end of the second stacking mechanism is arranged corresponding to the first conveying member; The second pushing mechanism is arranged corresponding to the second stacking mechanism, and is used for pushing the stacked resistor sheets from the second stacking mechanism into the first conveying member.

3. The sequential discharge type resistor chip loading system according to claim 2, characterized in that: The second stacking mechanism includes a accommodating box, a first baffle, a second baffle, a rotating shaft, and a rotating driving mechanism; The containing box is provided with a first containing cavity with two sides open; The first baffle plate and the second baffle plate are disposed on opposite sides of the containing box, and the second baffle plate is located on a side close to the first conveying member; The rotating shaft is connected to the containing box to drive the containing box to rotate; The rotary drive mechanism is connected to the rotating shaft to drive the rotating shaft to rotate; The containing box has a receiving position for receiving the resistor sheet conveyed by the first pushing mechanism, and a feeding position after being rotated by the rotating shaft; The first baffle is provided with a first channel at the material receiving position for connecting the first accommodating cavity with the first stacking mechanism; The first baffle is also provided with a second channel at the feeding position for communicating with the first accommodating cavity; The second baffle is provided with a third channel corresponding to the second channel at the feeding position, for connecting the first accommodating cavity with the first conveying member; The second pushing mechanism is arranged corresponding to the second channel.

4. The sequential discharge type resistor chip loading system according to claim 3, characterized in that: The second pushing mechanism includes a first pushing cylinder, a second pushing cylinder, a first flat-head pushing block, and a second pushing plate; The first pushing cylinder and the second pushing cylinder are arranged on opposite sides of the first conveying member; and the first pushing cylinder is arranged on a side of the first baffle away from the first conveying member and facing the second channel; the second pushing cylinder is arranged facing the third channel; The first flat-head push block is arranged on the push rod of the first push cylinder, so as to push the stacked resistor sheets in the storage box into the first conveying member when the storage box is in the feeding position; The second push plate is disposed on the push rod of the second push cylinder to cooperate with and abut against the stacked resistor sheets.

5. The sequential discharge resistor chip loading system according to claim 3 or 4, characterized in that: The first stacking mechanism includes a stacking piston, a feeding funnel, a vibration mechanism, a support rod, a first lifting mechanism, and a blocking mechanism; The stacking piston is arranged on a side of the first baffle away from the first conveying member, and a second accommodating chamber for accommodating a stack of the resistor sheets is arranged in the stacking piston, and a side of the second accommodating chamber close to the first baffle is open and communicated with the first channel; The feeding hopper is in communication with the second accommodating chamber to transport the single resistor sheet into the second accommodating chamber; The vibration mechanism is connected to the feeding funnel; The support rod is disposed in the second accommodating cavity to support the resistor sheet; The first lifting mechanism is connected to the support rod to drive the support rod to rise and fall; The blocking mechanism is arranged corresponding to the stacking piston and has a first blocking state and a second blocking state. In the first blocking state, the blocking mechanism blocks the first channel and the second accommodating chamber. In the second blocking state, the blocking mechanism blocks the feeding funnel from the second containing chamber.

6. The sequential discharge type resistor chip loading system according to claim 5, characterized in that: The first pushing mechanism includes a third pushing cylinder, a fourth pushing cylinder, a first pushing plate, and a second pushing plate; The third pushing cylinder is arranged on a side of the stacking piston away from the first baffle; The fourth pushing cylinder is arranged on a side of the second baffle plate away from the first baffle plate; The first push plate is arranged on the push rod of the third push cylinder, so as to push a stack of the resistor sheets into the first receiving cavity through the first channel when the receiving box is in the material receiving position; The second pushing plate is arranged on the pushing rod of the fourth pushing cylinder, so as to extend into the first accommodating cavity and abut against the resistor sheet pushed in by the first pushing plate when the accommodating box is in the material receiving position.

7. The sequential discharge resistor chip loading system according to any one of claims 2, 3, 4, and 6, characterized in that: Along the conveying direction of the first conveying member, a plurality of the resistor chip stacking assemblies are provided, and each of the resistor chip stacking assemblies is correspondingly provided with the temporary placement box.

8. A sequential discharge type resistor chip loading system, characterized in that: It includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; The first conveying component is used to convey the resistor sheet; The second conveying assembly is used to convey the sagger equipped with the gasket and the surrounding edge; The discharge assembly is arranged at the output end of the first conveying assembly and the output end of the second conveying assembly to receive and convey the sagger, and is used to convey the resistor sheet on the first conveying assembly into the sagger to form a semi-assembled sagger; The third conveying assembly is arranged at the output end of the discharge assembly to receive the semi-assembled sagger, place the enclosure plate into the semi-assembled sagger, and take out the enclosure edge in the semi-assembled sagger; The second conveying assembly includes a second conveying member and an assembly assembly; The second conveying member is used to convey the sagger; The assembling component is arranged corresponding to the second conveying member, and is used for loading the gasket and the surrounding edge into the sagger, so as to transport the sagger loaded with the gasket and the surrounding edge through the second conveying member; The discharge assembly is arranged at the output end of the second conveying member.

9. The sequential discharge resistor chip loading system according to claim 8, characterized in that: The assembly assembly includes a first frame, a first translation mechanism, a second lifting mechanism, a third lifting mechanism, a first adsorption mechanism, and a grabbing mechanism; The first frame is arranged corresponding to the second conveying member; The first translation mechanism is disposed on the first frame to reciprocate between the first material supply area and the second conveying member; The second lifting mechanism and the third lifting mechanism are respectively arranged at the moving ends of the first translation mechanism; The first adsorption mechanism is arranged at the lifting end of the second lifting mechanism to adsorb the gasket in the first material supply area and to place the gasket in the sagger transported by the second conveying member; The grabbing mechanism is arranged at the lifting end of the third lifting mechanism to clamp the surrounding edge in the first material providing area and to place the surrounding edge in the sagger transported by the second conveying member.

10. The sequential discharge resistor chip loading system according to claim 9, characterized in that: The grabbing mechanism includes a fifth pushing cylinder and a grabbing plate; The fifth push cylinder is arranged at the bottom of the lifting end of the third lifting mechanism, and two fifth push cylinders are arranged, and the two fifth push cylinders are symmetrical to each other and arranged horizontally; The push rod of each of the fifth push cylinders is provided with the grab plate so as to grab or release the surrounding edge through the grab plate.

11. A sequential discharge type resistor chip loading system, characterized in that: It includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; The first conveying component is used to convey the resistor sheet; The second conveying assembly is used to convey the sagger equipped with the gasket and the surrounding edge; The discharge assembly is arranged at the output end of the first conveying assembly and the output end of the second conveying assembly to receive and convey the sagger, and is used to convey the resistor sheet on the first conveying assembly into the sagger to form a semi-assembled sagger; The third conveying assembly is arranged at the output end of the discharge assembly to receive the semi-assembled sagger, place the enclosure plate into the semi-assembled sagger, and take out the enclosure edge in the semi-assembled sagger; The discharge assembly includes a push-out mechanism, a fourth conveying member, and a fourth lifting mechanism; The ejection mechanism is arranged at the output end of the first conveying assembly to eject the resistor sheet conveyed by the first conveying assembly; The fourth conveying member is disposed at the lifting end of the fourth lifting mechanism and is located below the output end of the first conveying assembly; The fourth conveying member has a first state and a second state lifted by the fourth lifting mechanism; in the first state, the input end of the fourth conveying member is arranged corresponding to the output end of the second conveying component, and the output end of the fourth conveying member is arranged corresponding to the input end of the third conveying component, so as to receive the sagger conveyed by the second conveying component and to convey the semi-assembled sagger; in the second state, the fourth conveying member is arranged corresponding to the output end of the ejection mechanism, so as to connect the resistor pushed out by the ejection mechanism into the sagger.

12. A sequential discharge type resistor chip loading system, characterized in that: It includes a first conveying component, a second conveying component, a discharge component, and a third conveying component; The first conveying component is used to convey the resistor sheet; The second conveying assembly is used to convey the sagger equipped with the gasket and the surrounding edge; The discharge assembly is arranged at the output end of the first conveying assembly and the output end of the second conveying assembly to receive and convey the sagger, and is used to convey the resistor sheet on the first conveying assembly into the sagger to form a semi-assembled sagger; The third conveying assembly is arranged at the output end of the discharge assembly to receive the semi-assembled sagger, place the enclosure plate into the semi-assembled sagger, and take out the enclosure edge in the semi-assembled sagger; The third conveying assembly includes a third conveying member, a panel assembly, and a disassembly assembly; The third conveying member is arranged at the output end of the discharge assembly to receive and convey the semi-assembled sagger; The enclosure assembly is arranged corresponding to the third conveying member to place the enclosure into the semi-assembled sagger; The disassembly assembly is arranged corresponding to the third conveying member to take out the surrounding edge in the semi-assembled sagger; Along the conveying direction of the third conveying member, the disassembly assembly is located at the rear side of the enclosure assembly.

13. The sequential discharge resistor chip loading system according to claim 12, characterized in that: The enclosure assembly includes a second frame, a rotating mechanism, a fifth lifting mechanism, a flipping mechanism, and a second adsorption mechanism; The second frame is arranged corresponding to the third conveying member; The rotating mechanism is arranged on the second frame; The fifth lifting mechanism is arranged at the bottom of the rotating end of the rotating mechanism, and the flipping mechanism is arranged on both sides of the lifting end of the fifth lifting mechanism; The second adsorption mechanism is arranged at the bottom of the turning mechanism to adsorb the enclosure in the second material providing area and to place the enclosure between the sagger and the resistor in the semi-assembled sagger.

14. The sequential discharge resistor chip loading system according to claim 13, characterized in that: The turning mechanism comprises a turning frame and a sixth pushing cylinder; The middle part of the overturn frame is hinged to the bottom of the lifting end side of the fifth lifting mechanism; The top end of the sixth push cylinder is hinged to the top of the lifting end of the fifth lifting mechanism, and the push rod of the sixth push cylinder is hinged to the top of the flip frame; The second adsorption mechanism is vertically arranged at the bottom of the flip frame.

15. The sequential discharge resistor chip loading system according to claim 13 or 14, characterized in that: The disassembly assembly includes a second translation mechanism, a sixth lifting mechanism, and a clamping cylinder; The second translation mechanism is disposed on the second frame to reciprocate between the material placement area and the third conveying member; The sixth lifting mechanism is arranged at the moving end of the second translation mechanism; The clamping cylinder is arranged at the lifting end of the sixth lifting mechanism to clamp the surrounding edge in the semi-assembled sagger and to place the surrounding edge in the material placement area.

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