A method for manufacturing an LED module and an LED module

Abstract

The present application provides a method for manufacturing an LED module, comprising the following steps: material preparation: preparing a light board and a bottom shell with a surrounding edge; assembly: installing the light board on the bottom shell at a position within the surrounding edge; glue pouring: pouring glue into the light board so that the glue is filled between the LED chips on the light board; solid glue: solidifying the glue into solid glue; material cutting: cutting off the surrounding edge and part of the solid glue within the surrounding edge together, so that the spacing between adjacent LED chips is less than 2mm when two adjacent LED modules are spliced. The present application also provides an LED module, which is manufactured by the above-mentioned method for manufacturing an LED module. The present application forms a surrounding edge on the bottom shell, thereby facilitating the glue pouring process on the light board, thereby meeting the protection requirements of the light board for outdoor use; cutting off the surrounding edge and part of the solid glue meets the requirement that the pixel spacing of the LED display screen is less than 2mm, thereby avoiding the appearance of dark lines at the splicing position of the LED module.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a method for manufacturing an LED module and an LED module. Background Art

[0002] With the rapid development of the LED display industry, the pixel pitch of LED displays is getting smaller and smaller. When LED displays are used outdoors, they must also meet requirements such as UV resistance, waterproofness, high and low temperature resistance, and high humidity resistance. The existing technology achieves the above requirements by filling the light board with glue. In order to meet the glue filling requirements, a glue filling edge will be set on the edge of the bottom shell of the LED module to prevent glue from overflowing.

[0003] As part of the bottom shell, the glue-filled edge is assembled with the LED module. In order to avoid black lines at the joints of adjacent LED modules, the thickness of the glue-filled edge is required to match the pixel pitch. For example, when the pixel pitch needs to be less than 2mm, the thickness of the glue-filled edge is required to be less than 0.3mm. However, the existing bottom shell is generally made by injection molding, die casting or machining. 0.3mm has exceeded the limit of the existing bottom shell processing technology. Therefore, there is an urgent need for a production process or method for glue-filled small-pitch modules that can break through the limitations of the bottom shell processing technology. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a method for manufacturing an LED module to solve the technical problem in the prior art that the glue-filled LED display screen cannot achieve a smaller pixel pitch due to the limitation of the bottom shell processing technology.

[0005] To achieve the above purpose, the technical solution adopted in this application is: to provide a method for manufacturing an LED module, comprising the following steps:

[0006] Material preparation: prepare the light board and the bottom shell with the surrounding edge;

[0007] Assembling: installing the light panel on the bottom shell at a position inside the surrounding edge;

[0008] Glue pouring: pouring glue into the light board so that the glue is filled between the LED chips on the light board;

[0009] Solid glue: solidify the glue into solid glue;

[0010] Cutting: Cutting off the surrounding edge and part of the solid glue within the surrounding edge together, so that the distance between adjacent LED chips is less than 2mm when two adjacent LED modules are spliced.

[0011] In a possible design, the bottom shell further includes a main body and a connecting edge, the surrounding edge is arranged around the main body, the connecting edge is connected between the main body and the surrounding edge, and the surrounding edge, the connecting edge and the main body are combined to form a glue groove;

[0012] During assembly, the light panel is mounted on the main body;

[0013] When pouring glue, the glue flows from the light board to the glue groove;

[0014] When cutting the material, the surrounding edge, part of the connecting edge and the solid glue on the connecting edge are cut off together.

[0015] In a possible design, the light board includes a printed circuit board and an LED chip attached to the printed circuit board;

[0016] When pouring glue, the thickness of the glue on the printed circuit board is at least higher than the soldering feet of the LED chip, and the thickness of the glue is lower than the height of the LED chip.

[0017] In a possible design, the thickness of the glue potting on the printed circuit board ranges from 0.4 mm to 0.6 mm.

[0018] In one possible design, the glue is poured at a speed of 20 mm to 26 mm per second;

[0019] And / or, when pouring glue, pouring glue at a speed of 1.8g-2.2g per second.

[0020] In a possible design, during glue pouring, glue is poured into different positions of the light board and the edge of the light board at the same time through multiple glue heads.

[0021] In a possible design, the material preparation step further includes preparing a sealing ring;

[0022] The assembly comprises the following steps:

[0023] Installing the sealing ring on the bottom shell in the area inside the surrounding edge;

[0024] The periphery of the lamp board is pressed against the sealing ring to fix the lamp board to the bottom shell.

[0025] In a possible design, the outer edge of the lamp board extends beyond the outer edge of the sealing ring, and glue is poured between the outer edge of the lamp board and the bottom shell.

[0026] In a possible design, the method for manufacturing the LED module further includes the following steps:

[0027] Glue is poured between the peripheral edge of the back side of the lamp board and the bottom shell.

[0028] In a possible design, the bottom shell includes a bottom plate, a side plate and a rubber edge, the side plate vertically extends from a peripheral edge of the bottom plate, the rubber edge is arranged on the inner side of the side plate, the rubber edge, the side plate and the bottom plate are surrounded to form a rubber cavity, and a glue filling port communicating with the rubber cavity is opened on the bottom plate;

[0029] During installation, the sealing ring is abutted against the top end of the side plate, the peripheral edge of the lamp panel is abutted against the sealing ring, and the back side of the lamp panel is abutted against the rubber edge.

[0030] The beneficial effect of the manufacturing method of the LED module provided by the present application is that: the manufacturing method of the LED module provided by the embodiment of the present application, by first forming a surrounding edge on the bottom shell, the surrounding edge can prevent the glue from overflowing, thereby facilitating the glue filling process of the lamp board, and the lamp board after glue filling can meet the requirements of UV resistance, waterproofness, high and low temperature resistance and high humidity resistance, that is, meet the needs of outdoor use, so that the LED module and LED display screen made by this process can be applied to outdoor; at the same time, after the glue is cured, the surrounding edge is cut off, and the part of the solid glue within the surrounding edge and outside the lamp board is cut off, so that the edge thickness of the lamp board can meet the requirement of less than 0.3mm, then when two adjacent LED modules are spliced ​​with each other, the edge thickness of the lamp board can match the pixel pitch, so that the pixel pitch of the spliced ​​LED display screen can be less than 2mm, which effectively solves the technical problem that the surrounding edge cannot be made thinner due to the limitations of the existing process, resulting in dark lines between adjacent modules after assembly, and also greatly reduces the cost and technical difficulty of components such as the bottom shell. In addition, it also avoids the appearance of dark lines at the splicing position of the LED module, ensuring the display effect of the LED display screen and uniform light.

[0031] On the other hand, the present application also provides an LED module manufactured by the above-mentioned LED module manufacturing method.

[0032] The beneficial effects of the LED module provided by the present application are as follows: the LED module provided by the embodiment of the present application is manufactured by the production of the above-mentioned LED module, which can not only achieve the requirement that the pixel pitch of the LED display screen is less than 2 mm, but also no dark lines will appear at the splicing position of the LED module, thereby ensuring the display effect of the LED display screen and uniform light; in addition, it can also meet the requirements of UV resistance, waterproofness, high and low temperature resistance and high humidity resistance, and can withstand long-term direct sunlight, high temperature and high humidity weather, etc., and is not prone to yellowing and waterproof failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0034] Figure 1 A schematic diagram of a process for manufacturing an LED module provided in an embodiment of the present application;

[0035] Figure 2 A three-dimensional schematic diagram of an LED module before cutting provided in an embodiment of the present application;

[0036] Figure 3 for Figure 2 Schematic diagram of the LED module in the figure;

[0037] Figure 4 for Figure 2 A longitudinal cross-sectional view of the LED module;

[0038] Figure 5 for Figure 4 A is a magnified schematic diagram of the part in the middle;

[0039] Figure 6 for Figure 2 Schematic diagram of the structure before the midsole shell is cut;

[0040] Figure 7 This is a front view schematic diagram of the LED module after cutting provided in an embodiment of the present application;

[0041] Figure 8 A schematic diagram of the back side of the LED module after cutting provided in an embodiment of the present application;

[0042] Fig. 9 for Figure 8 A longitudinal cross-sectional view of the LED module;

[0043] Fig.10 for Fig. 9 A magnified schematic diagram of the part B in the middle;

[0044] Fig.11 for Fig. 9 Schematic diagram of the structure after the midsole shell is cut.

[0045] Among them, the reference numerals in the figure are:

[0046] 1. Bottom shell; 11. Main body; 111. Bottom plate; 1111. Glue filling port; 112. Side plate; 113. Glue edge; 114. Connecting rib; 115. Glue cavity; 12. Surrounding edge; 13. Connecting edge; 14. Glue groove; 2. Light board; 21. Printed circuit board; 22. LED chip; 3. Sealing ring; 31. Abutting edge; 32. Limiting edge; 4. Solid glue. DETAILED DESCRIPTION

[0047] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0048] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0049] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0051] See also Figure 1 Now, the manufacturing method of the LED module provided in the embodiment of the present application is described. The manufacturing method of the LED module is used to manufacture the LED module.

[0052] The method for manufacturing an LED module comprises the following steps:

[0053] S10 , material preparation: preparing the lamp board 2 and the bottom shell 1 , wherein the bottom shell 1 has a peripheral edge 12 .

[0054] For details, please refer to Figures 2 to 5The light board 2 includes a printed circuit board 21 and a plurality of LED chips 22. The LED chips 22 are arranged in a matrix on the printed circuit board 21. The LED chips 22 are attached to the printed circuit board 21 and are electrically connected to the printed circuit board 21. The LED chips 22 can be a normal-mounted red chip, a normal-mounted blue chip, a normal-mounted green chip, a fully flip-chip red chip, a fully flip-chip blue chip, and a fully flip-chip green chip.

[0055] The bottom shell 1 has a peripheral edge 12, which is Figure 5 and Figure 6 As shown, a peripheral edge of the bottom shell 1 is enclosed by a peripheral edge 12 , so that when glue is poured into the area within the peripheral edge 12 , the peripheral edge 12 will block the glue and prevent the glue from overflowing.

[0056] S20, assembling: installing the lamp panel 2 on the bottom shell 1 at a position within the surrounding edge 12;

[0057] Specifically, the functions of the LED chip 22 and the lamp board 2 are tested first, and then the tested lamp board 2 is installed on the bottom shell 1 .

[0058] The lamp board 2 is installed on the bottom shell 1 in the area within the surrounding edge 12 . When the lamp board 2 is protected by glue filling, the surrounding edge 12 can block the glue and prevent the glue from flowing out before solidification.

[0059] S30, glue pouring: pouring glue into the light board 2 so that the glue fills between the LED chips 22 on the light board 2;

[0060] Specifically, the purpose of the glue potting is to seal the printed circuit board 21 to protect the printed circuit board 21, and at the same time seal the soldering feet of the LED chip 22 to protect the circuit part of the LED chip 22. The role of the sealing glue is anti-ultraviolet, waterproof, high and low temperature resistant and high humidity resistant.

[0061] When performing glue pouring, glue is mainly poured into the gaps between the LED chips 22 on the printed circuit board 21, and then the glue flows to the edge of the printed circuit board 21 and the area between the edge of the printed circuit board 21 and the surrounding edge 12, so as to ensure uniform sealing.

[0062] S40, glue solidification: solidifying the glue into solid glue 4;

[0063] By solidifying the glue under certain conditions, the stability after sealing is ensured, and the glue is prevented from flowing and affecting the effect of the sealing. Specifically, the LED module is placed horizontally at room temperature for about an hour to solidify, thereby ensuring the stable solidification of the glue, ensuring the anti-ultraviolet, waterproof, high and low temperature and high humidity functions of the solid glue 4, and thus ensuring the service life of the LED display module.

[0064] S50, cutting: cutting off the surrounding edge 12 and part of the solid glue inside the surrounding edge 12 together, so that the distance between adjacent LED chips 22 is less than 2 mm when two adjacent LED modules are spliced.

[0065] Specifically, since the border 12 is assembled with the LED module as a part of the bottom shell 1, in order to avoid the appearance of black lines at the splicing position of the two LED modules, the thickness of the border 12 is required to match the pixel pitch. For example, when the pixel pitch needs to be less than 2 mm, the thickness of the border 12 is required to be reduced to less than 0.3 mm. Regardless of whether the bottom shell 1 is formed by injection molding, die casting or machining, it is difficult to reduce the thickness of the border 12 to less than 0.3 mm. Therefore, as long as the border 12 exists, it is impossible to achieve the pixel pitch requirement of less than 2 mm after adjacent LED modules are spliced.

[0066] In response to this, the applicant of the present application changed his thinking and provided a surrounding edge 12 on the bottom shell 1 to meet the glue filling requirements of the lamp board 2, and then cut the surrounding edge 12 after the glue was cured, thereby solving the problem that the bottom shell 1 could not be made less than 0.3mm due to the surrounding edge 12.

[0067] Specifically, after curing, the surrounding edge 12 and part of the solid glue within the surrounding edge 12 are cut off together. After the cutting, there is only solid glue 4 on the periphery of the light board 2 without the surrounding edge 12. The width of the solid glue 4 reserved on the periphery of the light board 2 can be set according to the spacing between two adjacent LED chips 22 of two adjacent LED modules, as long as the spacing between each two adjacent LED chips 22 of the spliced ​​LED display module is less than 2mm. For example, when the LED chip 22 at the edge of the light board 2 is closer to the edge, the reserved width of the edge solid glue 4 can be larger; when the LED chip 22 at the edge of the light board 2 is farther from the edge, the reserved width of the edge solid glue 4 can be smaller.

[0068] In summary, the present application forms a surrounding edge 12 on the bottom shell 1 first, and the surrounding edge 12 can prevent glue from overflowing, thereby facilitating the glue filling process for the light board 2. The light board 2 after glue filling can meet the requirements of UV resistance, waterproofness, high and low temperature resistance, and high humidity resistance, that is, it meets the needs of outdoor use. Therefore, the LED modules and LED display screens made by this process can be applied to outdoor use, breaking through the bottleneck of outdoor naked products with a pixel pitch greater than 2.0 mm, and realizing the leading development and mass production of outdoor naked products with a pixel pitch of less than 2.0 mm, occupying the market and opportunities. After the pixel pitch is reduced, the pixel resolution is increased by more than 60%, which better meets the market demand and will prompt the relevant market segments to quickly release their scale. At the same time, After the glue is cured, the surrounding edge 12 is cut off, and the excess solid glue 4 within the surrounding edge 12 and outside the light board 2 is cut off, so that the edge thickness of the light board 2 can reach the requirement of less than 0.3mm. Then, when two adjacent LED modules are spliced ​​together, the edge thickness of the light board 2 matches the pixel pitch, so that the pixel pitch of the spliced ​​LED display screen can be less than 2mm, which effectively solves the technical problem that the surrounding edge 12 cannot be made thinner due to the limitations of the existing process, resulting in the appearance of dark lines between adjacent modules after assembly. At the same time, it also greatly reduces the cost and technical difficulty of components such as the bottom shell 1; in addition, it also avoids the appearance of dark lines at the splicing position of the LED module, ensuring the display effect of the LED display screen and uniform light. The LED module of the present application is mainly used in outdoor environments, and in environments where it is fixedly installed for a long time or installed at a fixed time, it can withstand long-term direct sunlight, high temperature and high humidity weather, etc., and is not prone to yellowing and waterproof failure.

[0069] In one embodiment, see Figure 5 and Figure 6 The bottom shell 1 also includes a main body 11 and a connecting edge 13, the surrounding edge 12 is arranged around the main body 11, the connecting edge 13 is connected between the main body 11 and the surrounding edge 12, and the surrounding edge 12, the connecting edge 13 and the main body 11 are combined to form a glue groove 14; when assembling, the lamp board 2 is installed on the main body 11; when pouring glue, the glue flows from the lamp board 2 to the glue groove 14; when cutting, the surrounding edge 12, part of the connecting edge 13 and the solid glue on the connecting edge 13 are cut off together.

[0070] Among them, the main body 11 is mainly used for installing the light board 2. The setting of the surrounding edge 12 can facilitate the glue pouring of the light board 2. The setting of the connecting edge 13 allows the surrounding edge 12 and the main body 11 to be spaced apart. On the one hand, it is convenient for glue pouring. On the other hand, it also makes it necessary to only cut off the connecting edge 13 during cutting, which will not affect the main body 11. In addition, the connecting edge 13 can be set thinner to facilitate quick cutting of the connecting edge 13 and the surrounding edge 12.

[0071] In actual design, the bottom shell 1 can be made by plastic molding. Under the condition of satisfying the molding conditions, the thickness of the connecting edge 13 and the surrounding edge 12 can be reduced as much as possible, thereby reducing the processing cost and material cost, and facilitating cutting.

[0072] In one embodiment, see Figure 5 The bottom end surface of the surrounding edge 12 is flush with the bottom end surface of the main body 11, so that it is convenient to place the bottom shell 1 as a whole on a horizontal plane, and it is also convenient for the installation and glue filling process of the light board 2.

[0073] See also Figure 5 , the connection point of the connecting edge 13 on the main body 11 is lower than the top surface of the main body 11, so that the surrounding edge 12, the connecting edge 13 and the main body 11 can form a glue groove 14, which is conducive to glue pouring. At the same time, the connection point of the connecting edge 13 on the main body 11 cannot be too low, otherwise it will result in a large amount of glue being poured, which will waste glue. Specifically, the formation position of the connecting edge 13 on the main body 11 can be set according to actual needs, and is not limited here.

[0074] Among them, when the size of the main body 11 is within 250 mm, a single light board 2 can be installed. If the size of the main body 11 is larger, multiple light boards 2 can be installed. After installation, each light board 2 is required to be as flush as possible.

[0075] In one embodiment, see Figure 5 and Fig.10 The lamp board 2 includes a printed circuit board 21 and an LED chip 22. When the glue is poured, the thickness of the glue on the printed circuit board 21 is at least higher than the soldering feet of the LED chip 22, and the thickness of the glue is lower than the height of the LED chip 22.

[0076] Among them, by setting the height of the solid glue 4 higher than the soldering feet of the LED chip 22, the soldering feet of the LED chip 22 can be protected, ensuring a good connection between the LED chip 22 and the printed circuit board 21, thereby ensuring the light emission of the LED chip 22; and setting the height of the solid glue 4 to be lower than the height of the LED chip 22, it is possible to avoid the solid glue 4 covering the LED chip 22 and affecting the light emitting effect of the LED chip 22.

[0077] Optionally, the LED chip 22 of the present application is a low-power chip, and the height of the LED chip 22 is approximately 1 mm. In order to ensure the protective effect of the glue potting on the printed circuit board 21 and the soldering feet, and to prevent the glue potting from affecting the light-emitting effect of the LED chip 22, the present application sets the glue potting thickness range on the printed circuit board 21 to 0.4mm-0.6mm. In this way, it can be ensured that the glue potting can completely cover the soldering feet of each LED chip 22 to ensure the protective effect on the soldering feet, and the glue potting thickness is much lower than the height of the LED chip 22, that is, the upper half of the LED chip 22 is exposed to the outside, so that the side of the LED chip 22 will not be blocked, thereby avoiding the blocking effect of the glue potting on the LED chip 22.

[0078] Specifically, the thickness of the glue potting on the printed circuit board 21 can be 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm, 0.50 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, 0.6 mm, etc.

[0079] In one embodiment, when glue is poured, it is necessary to ensure that the entire lamp board 2 is evenly poured, and at the same time, it is necessary to ensure that the amount of glue poured only covers the solder pins of the LED chip 22, and the amount of glue poured cannot be too large, so the glue pouring speed is slower than the conventional glue pouring speed. In addition, when glue is poured, a glue head is generally used for glue pouring.

[0080] Optionally, when pouring glue, it is necessary to do it at room temperature and at a speed of 20mm-26mm per second. In this way, the pouring can be stopped immediately when it is ensured that the amount of glue covers the LED chip 22 to avoid the glue being too thick. At the same time, it can also ensure that the entire lamp board 2 is evenly poured with glue.

[0081] Specifically, the glue pouring can be carried out at speeds of 20mm, 20.5mm, 21mm, 21.5mm, 22mm, 22.5mm, 23mm, 23.5mm, 24mm, 24.5mm, 25mm, 25.5mm and 26mm per second.

[0082] In addition, when pouring glue, it can also be poured at a speed of 1.8g-2.2g per second, while ensuring the amount of glue discharged per second to control the glue discharge speed and avoid discharging glue too quickly.

[0083] Specifically, the glue can be poured at speeds of 1.8 g, 1.85 g, 1.9 g, 1.95 g, 2.0 g, 2.05 g, 2.1 g, 2.15 g and 2.2 g per second.

[0084] In one embodiment, when pouring glue, glue can be poured into different positions of the light board 2 and the edge of the light board 2 at the same time through multiple glue heads. Then, when pouring glue, the amount of glue at different positions on the light board 2 can rise at the same time, and the rising height is uniform, which can not only reduce the probability of glue flowing everywhere on the light board 2, but also make the amount of glue poured everywhere on the light board 2 uniform, and the glue pouring effect is good.

[0085] In one embodiment, see Figure 3 , Figure 5 and Fig.10 In the material preparation step, it also includes preparing the sealing ring 3, that is, when preparing the materials, the bottom shell 1, the lamp board 2 and the sealing ring 3 are prepared.

[0086] The assembly includes the following steps: installing the sealing ring 3 on the area within the peripheral edge 12 of the bottom shell 1, specifically installing the sealing ring 3 on the main body 11; abutting the periphery of the light board 2 against the sealing ring 3, and fixing the light board 2 to the bottom shell 1, for example, locking or snapping the light board 2 to the bottom shell 1, so as to ensure good consistency in the subsequent LED module splicing. The above assembly method enables the sealing ring 3 to be pressed tightly between the light board 2 and the bottom shell 1, achieving the sealing of the connection between the light board 2 and the bottom shell 1, and preventing glue or other liquids from flowing to the back of the light board 2 through the gap between the light board 2 and the bottom shell 1 to corrode the back of the light board 2 and affect the circuit function of the light board 2.

[0087] In addition, when pouring glue, the glue is poured between the surrounding edge 12 and the sealing ring 3. Specifically, after the sealing ring 3 is installed, the glue groove 14 is formed by the surrounding edge 12, the connecting edge 13 and the sealing ring 3.

[0088] The sealing ring 3 plays a conventional waterproof and dustproof role. After the peripheral edge 12 of the bottom shell 1 is cut, it can also serve as the peripheral edge 12 and effectively prevent glue from overflowing when glue is poured on the back.

[0089] See also Figure 5 and Fig.10 The longitudinal section of the sealing ring 3 is L-shaped. The sealing ring 3 includes a contact edge 31 and a limiting edge 32. The contact edge 31 is vertically connected to the limiting edge 32. The contact edge 31 is in contact between the main body 11 and the lamp board 2. The limiting edge 32 is attached to the outer wall of the main body 11. The installation of the sealing ring 3 on the main body 11 is limited by the limiting edge 32 to ensure that the sealing ring 3 is installed in place, thereby achieving the purpose of anti-glue.

[0090] In one embodiment, the outer edge of the light board 2 extends beyond the outer edge of the sealing ring 3, and glue is poured between the outer edge of the light board 2 and the bottom shell 1. Specifically, when the outer edge of the light board 2 extends beyond the outer edge of the sealing ring 3, glue can be poured between the outer edge of the light board 2 and the connecting edge 13. After the glue is cured, the light board 2 and the connecting edge 13 can be connected by the solid glue 4, thereby ensuring reliable waterproofing.

[0091] In one embodiment, the cutting can be performed by CNC machine tool cutting, the bottom shell 1 is fixed by a clamp, and then the surrounding edge 12, the connecting edge 13 and the excess solid glue 4 are cut off by a cutter. According to multiple experimental measurements, the time required for cutting a single LED module is 3 minutes. Figure 7 and Figure 8 , which are the front and back of the LED module after cutting.

[0092] The size to be cut can be calculated based on the theoretical size of the module. For example, the first distance from the edge LED chip 22 to the outer edge of the surrounding edge 12 is measured first, and then the second distance from the LED chip 22 to the edge of the bottom shell 1 is calculated based on the spacing between two adjacent LED chips 22. The first distance minus the second distance is the size to be cut.

[0093] Generally, the cutting accuracy can be ensured in the following ways: 1. First, improve the processing accuracy of the bottom shell 1, then perform precise positioning, and finally ensure the cutting accuracy by accurately positioning the cutter in the middle of the machine tool and moving it forward, backward, left and right respectively, and this moving amount is the difference between the first distance and the second distance. 2. You can also mark the line on the installation fixture of the machine tool, and align the cutter with the mark line when cutting, so as to achieve precise cutting.

[0094] In addition, after the LED module is trimmed, if there is burrs caused by the amount of glue, it can be improved by manual trimming, grinding wheel trimming, frozen trimming and other methods.

[0095] In one embodiment, the manufacturing method of the above-mentioned LED module also includes the following steps: pouring glue between the edge of the back side of the lamp board 2 and the bottom shell 1, so as to ensure the sealing between the back side of the lamp board 2 and the bottom shell 1, and prevent external glue or other liquids from penetrating from between the lamp board 2 and the bottom shell 1 to the back side of the lamp board 2 to corrode the light board 2.

[0096] In one embodiment, not only is there a sealing ring 3 between the lamp board 2 and the bottom shell 1, but glue is also injected between the edge of the back side of the lamp board 2 and the bottom shell 1, thereby achieving double protection between the lamp board 2 and the bottom shell 1 and preventing glue or other liquids from penetrating from between the lamp board 2 and the bottom shell 1 to the back side of the lamp board 2 to corrode the light board 2.

[0097] See also Figure 5 , Figure 6 , Fig.10 and Fig.11 The bottom shell 1 includes a bottom plate 111, a side plate 112 and a glue edge 113. The side plate 112 extends vertically from the edge of the bottom plate 111. The glue edge 113 and the side plate 112 are arranged on the same side of the bottom plate 111. The glue edge 113 is arranged on the inner side of the side plate 112. The glue edge 113, the side plate 112 and the bottom plate 111 enclose a glue cavity 115. The bottom plate 111 is provided with a glue injection port 1111 connected to the glue cavity 115. During installation, the sealing ring 3 is set against the top of the side plate 112, the edge of the lamp board 2 is set against the sealing ring 3, and the back of the lamp board 2 is set against the glue edge 113. During glue injection, glue is injected into the glue injection cavity 115 from the glue injection port 1111, so that the edge of the back of the lamp board 2 is sealed with the side plate 112 and the glue edge 113, thereby achieving sealing.

[0098] See also Fig.11 , four glue injection ports 1111 are provided on the bottom plate 111 corresponding to each side of the light board 2, so that glue injection can be performed through four glue heads at the same time on each side of the light board 2, and the glue injection is uniform. It can be understood that in other embodiments, the number of the glue injection ports 1111 can be one, two, three, five or more than five according to the actual length of the light board 2.

[0099] The thickness of the glue filling can be 1.5mm, 1.7mm, 1.85mm, 2mm, 2.15mm, 2.3mm, etc., as long as it can play a protective role.

[0100] The back side glue filling can also be carried out at room temperature, and the glue filling speed can be the same as the front side glue filling speed.

[0101] In addition, after the glue is poured, it needs to be cured at room temperature for about 1 hour.

[0102] See also Figure 6 and Fig.11 Connecting ribs 114 are connected between the side panels 112. The setting of the connecting ribs 114 can increase the structural strength of the entire bottom shell 1 on the one hand, and can also support the lamp board 2 through the connecting ribs 114 and lock the lamp board 2 by using the connecting ribs 114 on the other hand.

[0103] On the other hand, the present application also provides an LED module, which is manufactured by the manufacturing method of the above LED module. The LED module includes a bottom shell 1, a lamp board 2, a sealing ring 3 and a solid glue 4, wherein the bottom shell 1 includes a main body 11, and the main body 11 includes a bottom plate 111, a side plate 112, a glue edge 113 and a connecting rib 114.

[0104] The specific structures of the main body 11, the lamp panel 2, the sealing ring 3 and the solid glue 4 have been described above and will not be repeated here.

[0105] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing an LED module, characterized in that: The following steps are involved: Material preparation: prepare the light board and the bottom shell with the surrounding edge; Assembling: installing the light panel on the bottom shell at a position inside the surrounding edge; Glue pouring: pouring glue into the light board so that the glue is filled between the LED chips on the light board; Solid glue: solidify the glue into solid glue; Cutting: cutting off the surrounding edge and part of the solid glue inside the surrounding edge together, so that the spacing between adjacent LED chips is less than 2 mm when two adjacent LED modules are spliced; The material preparation step also includes preparing a sealing ring; The assembly comprises the following steps: Installing the sealing ring on the bottom shell in the area inside the surrounding edge; Press the periphery of the lamp board against the sealing ring to fix the lamp board to the bottom shell; The method for manufacturing the LED module further comprises the following steps: Filling glue between the edge of the back side of the light board and the bottom shell; The bottom shell includes a bottom plate, a side plate and a rubber edge, wherein the side plate extends vertically from a peripheral edge of the bottom plate, the rubber edge is arranged on the inner side of the side plate, the rubber edge, the side plate and the bottom plate are surrounded to form a rubber cavity, and a glue filling port communicating with the rubber cavity is opened on the bottom plate; During installation, the sealing ring is abutted against the top end of the side plate, the peripheral edge of the lamp panel is abutted against the sealing ring, and the back side of the lamp panel is abutted against the rubber edge.

2. The method for manufacturing an LED module according to claim 1, wherein: The bottom shell further comprises a main body and a connecting edge, wherein the surrounding edge is arranged around the main body, the connecting edge is connected between the main body and the surrounding edge, and the surrounding edge, the connecting edge and the main body are combined to form a glue groove; During assembly, the light panel is mounted on the main body; When pouring glue, the glue flows from the light board to the glue groove; When cutting the material, the surrounding edge, part of the connecting edge and the solid glue on the connecting edge are cut off together.

3. The method for manufacturing an LED module according to claim 1, wherein: The light board includes a printed circuit board and an LED chip attached to the printed circuit board; When pouring glue, the thickness of the glue on the printed circuit board is at least higher than the soldering feet of the LED chip, and the thickness of the glue is lower than the height of the LED chip.

4. The method for manufacturing an LED module according to claim 3, wherein: The thickness of the glue potting on the printed circuit board ranges from 0.4 mm to 0.6 mm.

5. The method for manufacturing an LED module according to claim 1, wherein: When pouring glue, pour glue at a speed of 20mm-26mm per second; And / or, when pouring glue, pouring glue at a speed of 1.8g-2.2g per second.

6. The method for manufacturing an LED module according to claim 1, wherein: When glue is poured, glue is poured into different positions of the light board and the edge of the light board at the same time through multiple glue heads.

7. The method for manufacturing an LED module according to claim 1, wherein: The outer edge of the lamp board extends beyond the outer edge of the sealing ring, and glue is poured between the outer edge of the lamp board and the bottom shell.

8. An LED module, characterized in that: The LED module is manufactured by the method for manufacturing the LED module according to any one of claims 1 to 7.

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