A method for processing a copper-based circuit board having a boss

Abstract

The invention discloses a processing method of a copper-based circuit board with a boss, which belongs to the technical field of circuit board processing, and comprises: drilling once to drill an alignment hole on a copper plate; making a protective boss in the alignment hole area; making a copper plate boss, etching the copper plate boss on one side of the copper plate; hollowing out a substrate and a PP layer, and drilling a plurality of small holes at positions of the substrate and the PP layer corresponding to the boss; drilling twice to drill rivet holes on the copper plate; stacking the PP layer and the substrate on the copper plate in sequence and pressing them together; obtaining a finished circuit board through subsequent processes; drilling an alignment hole on the copper plate first, making a protective boss in the alignment hole area, and then etching the copper plate boss on the copper plate, and making the rivet holes required for pressing through secondary punching, so as to avoid additional increase in the thickness of the rivet hole area.

Description

Technical Field

[0001] The invention relates to a method for processing a copper-based circuit board with a boss, and belongs to the technical field of circuit board processing. Background Art

[0002] When metal-based circuit boards are used to produce power boards, high-power lighting boards or automotive boards, it is necessary to etch bosses on the copper substrate to improve the thermal conductivity of the substrate. In the current production process, alignment holes and rivet holes are first made by drilling, and then bosses are made in the drilled areas to avoid enlarging the hole diameter when etching the copper substrate bosses. However, the bosses increase the thickness of the rivet hole area. During pressing, the thickness of the rivet hole area plus the thickness of the rivet arm has a height difference of more than 15 mils from the surrounding area, which is prone to pressure loss during pressing.

[0003] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgement or any form of suggestion that the information constitutes the prior art already known to ordinary technicians in this field. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for processing a copper-based circuit board with a boss, which solves the problem that alignment holes and rivet holes are drilled before etching the copper substrate boss, and bosses are made in the alignment holes and rivet hole areas, which easily leads to pressure loss during pressing.

[0005] A method for processing a copper-based circuit board having a boss, comprising:

[0006] Drill the alignment holes on the copper plate in one go;

[0007] A protective boss is made in the alignment hole area;

[0008] Making a copper plate boss, etching a copper plate boss on one side of the copper plate;

[0009] Hollow out the substrate and PP layer, and drill several small holes at the positions of the substrate and PP layer corresponding to the bosses;

[0010] Secondary drilling, drilling rivet holes in the copper plate;

[0011] The PP layer and the substrate are stacked on the copper plate in sequence and pressed together;

[0012] The finished circuit board is obtained through subsequent processes.

[0013] Furthermore, after etching the copper plate boss on one side of the copper plate, a first adhesive layer needs to be coated on both sides of the copper plate to avoid voids during lamination.

[0014] Furthermore, the adhesive content of the first adhesive layer is ≥65%.

[0015] Furthermore, a second adhesive layer is coated on the upper and lower sides of the substrate to avoid voids during lamination.

[0016] Furthermore, the second adhesive layer has an adhesive content of ≥65%.

[0017] Furthermore, the step of making a protective boss in the alignment hole area specifically includes:

[0018] A negative film is attached to one side of the copper plate, and the negative film completely covers the copper plate;

[0019] Expose the side of the copper plate covering the film. After exposure, a square PAD appears in the alignment hole area, and the alignment hole area is 100% covered by the PAD.

[0020] The exposed side of the copper plate is etched, and a protective boss appears in the alignment hole area after etching.

[0021] Furthermore, the height of the protection boss is 200um, and the tolerance is + / -20um.

[0022] Furthermore, the lamination uses a release film and an aluminum plate, the copper plate is located in the middle, both sides of the copper plate are padded with release films, and an aluminum plate is provided on the back side of the release film and the copper plate.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention first drills an alignment hole on the copper plate, makes a protective boss in the alignment hole area, etches the copper plate boss on the copper plate, and makes the rivet hole required for pressing through secondary punching, thereby avoiding additional increase in the thickness of the rivet hole area. This solves the problem that the current method of drilling alignment holes and rivet holes before etching the copper substrate boss and making bosses in the alignment holes and rivet hole areas easily leads to pressure loss during pressing.

[0025] 2. The present invention hollows out the positions of the substrate and the PP layer corresponding to the copper plate bosses before lamination, so that the positions of the substrate and the PP layer corresponding to the copper plate bosses have a plurality of small holes. During lamination, the copper plate bosses can easily pass through the substrate and the PP layer, thereby preventing the substrate from being sleeved on the copper plate bosses and causing damage to the etched patterns, and preventing the copper substrate from bursting and delamination during lamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of a copper plate, a PP layer and a substrate in a method for processing a copper-based circuit board with a boss according to an embodiment of the present invention;

[0027] Figure 2It is a schematic diagram of the pressed and stacked positions of a copper plate, a PP layer and a substrate in a method for processing a copper-based circuit board with a boss according to an embodiment of the present invention;

[0028] Figure 3 It is a schematic diagram of the pressed structure of a copper plate, a PP layer and a substrate in a method for processing a copper-based circuit board with a boss according to an embodiment of the present invention;

[0029] Figure 4 The present invention is a schematic diagram of the positions of alignment holes and rivet holes in a method for processing a copper-based circuit board with a boss according to an embodiment of the present invention.

[0030] In the figure: 1. copper plate; 2. copper plate boss; 3. substrate; 4. PP layer; 5. alignment hole; 6. rivet hole; 7. protective boss. DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0032] In the description of the present invention, it should be understood that the terms, "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Example

[0033] A method for processing a copper-based circuit board having a boss, comprising:

[0034] like Figure 1 and Figure 4 As shown, the alignment hole 5 is drilled on the copper plate 1 in one drilling. Specifically, after the alignment hole 5 is drilled, exposure is performed and a protective boss 7 is made in the drilled area. Specifically, a negative film is attached to one side of the copper plate 1, and the negative film completely covers the copper plate 1.

[0035] The side of the copper plate 1 covering the film is exposed. After exposure, a square PAD appears in the alignment hole 5 area, and the alignment hole 5 area is 100% covered by the PAD;

[0036] The exposed side of the copper plate 1 is etched, and a protective boss 7 appears in the alignment hole 5 area after etching; the protective boss 7 can prevent the hole diameter from being etched larger, and the height of the protective boss 7 is 200um, with a tolerance of + / -20um;

[0037] like Figure 2 As shown, a copper plate boss 2 is made, and the copper plate boss 2 is etched on the upper side of the copper plate 1, and then a first adhesive layer is coated on the upper and lower sides of the copper plate 1, and the adhesive content of the first adhesive layer is ≥65%. The high and uniform adhesive flow of the first adhesive layer can stably fill the gap between the copper plate 1 boss and the substrate 3;

[0038] like Figure 2 As shown, the substrate 3 and the PP layer 4 are hollowed out, and a number of small holes are drilled at positions of the substrate 3 and the PP layer 4 corresponding to the copper plate boss 2; a second adhesive layer is coated on the upper and lower sides of the substrate 3, and the adhesive content of the second adhesive layer is ≥65%, which can avoid voids during lamination;

[0039] like Figure 4 As shown, secondary drilling is performed to drill a rivet hole 6 on the copper plate 1. Since the protective boss 7 has been made by the primary drilling, if the rivet hole 6 is also drilled by the primary drilling, the protective boss 7 needs to be made to prevent etching damage, which will increase the height again and easily cause pressure loss during pressing. Therefore, the rivet hole 6 is made by secondary drilling;

[0040] like Figure 2 and Figure 3 As shown, the PP layer 4 is stacked on the upper side of the copper plate 1, and the small hole on the PP layer 4 is aligned with the copper plate boss 2; then the substrate 3 is stacked on the upper side of the PP layer 4, and the small hole on the substrate 3 is aligned with the copper plate boss 2; the substrate 3, the PP layer 4, and the copper plate 1 are pressed together; during the pressing, the copper plate boss 2 can easily pass through the substrate 3 and the PP layer 4, so as to avoid the substrate 3 being sleeved on the copper plate boss 2 to cause damage to the etched pattern;

[0041] After subsequent processes, the finished circuit board is obtained;

[0042] The release film and the aluminum plate are used for lamination, the copper plate is located in the middle, the release film is padded on both sides of the copper plate, and the aluminum plate is arranged on the back side of the release film and the copper plate.

[0043] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for processing a copper-based circuit board having a boss, characterized in that: include: Drill the alignment holes on the copper plate in one go; A protective boss is made in the alignment hole area, including: A negative film is attached to one side of the copper plate, and the negative film completely covers the copper plate; Expose the side of the copper plate covering the film. After exposure, a square PAD appears in the alignment hole area, and the alignment hole area is 100% covered by the PAD. The exposed side of the copper plate is etched, and a protective boss appears in the alignment hole area after etching; Making a copper plate boss, etching a copper plate boss on one side of the copper plate; Hollow out the substrate and PP layer, and drill several small holes at the positions of the substrate and PP layer corresponding to the bosses; Secondary drilling, drilling rivet holes in the copper plate; The PP layer and the substrate are stacked on the copper plate in sequence and pressed together; The finished circuit board is obtained through subsequent processes.

2. The method for processing a copper-based circuit board with a boss according to claim 1, characterized in that: After etching the copper plate boss on one side of the copper plate, a first adhesive layer needs to be coated on both sides of the copper plate.

3. The method for processing a copper-based circuit board with a boss according to claim 2, characterized in that: The glue content of the first glue layer is ≥65%.

4. The method for processing a copper-based circuit board with a boss according to claim 1, characterized in that: The upper and lower sides of the substrate are coated with a second adhesive layer.

5. The method for processing a copper-based circuit board with a boss according to claim 4, characterized in that: The second adhesive layer has an adhesive content of ≥65%.

6. The method for processing a copper-based circuit board with a boss according to claim 1, characterized in that: The height of the protective boss is 200um, and the tolerance is + / -20um.

7. The method for processing a copper-based circuit board with a boss according to claim 1, characterized in that: The lamination uses a release film and an aluminum plate, the copper plate is located in the middle, both sides of the copper plate are padded with release films, and an aluminum plate is provided on the back side of the release film and the copper plate.

Images