Display device and display equipment

Abstract

A display device and a display apparatus are disclosed. The display device comprises: a cover member; a display panel disposed on one surface of the cover member; and a buffer plate disposed on one surface of the display panel, wherein the buffer plate comprises a buffer layer, a conductor, and a heat dissipation layer, wherein the buffer layer and the conductor are disposed between the display panel and the heat dissipation layer, and wherein the conductor is disposed in an edge region of the buffer plate.

Description

Technical Field

[0001] The present invention relates to a display device and a display apparatus, and more particularly, to a display device and a display apparatus capable of reducing the occurrence rate of a brightening phenomenon and a greening phenomenon at the end of a display panel. Background Art

[0002] The display apparatus is implemented in various forms such as TVs, monitors, smart phones, tablet PCs, laptops, and wearable devices.

[0003] Generally, a display device includes a display area for displaying a screen and a non-display area formed along an outer edge of the display area.

[0004] In a display device, the non-display area is also called the frame area. When the frame area is thick, the user's gaze is dispersed. When the frame area is thin, the user's gaze can be fixed on the screen of the display area, thereby increasing immersion.

[0005] In other words, as the bezel area becomes thinner, the overall size of the display device can be reduced while increasing user immersion. Therefore, consumers are increasingly demanding display devices with bezel areas that are as small as possible. Summary of the invention

[0006] Electric charges may be generated on the surface of the display device due to physical friction or the like.

[0007] When the charges generated in this manner are not discharged to the outside through the ground path, the charges may be concentratedly accumulated on the side surface of the end of the display panel located in the bezel region of the display panel.

[0008] When charges are accumulated in a specific area, an electric field may be generated in proportion to the amount of accumulation electrodes.

[0009] Therefore, when charges generated on the surface of the display device are not effectively discharged to the outside, a strong electric field may be generated on the side surface of the end of the display panel.

[0010] When a stronger electric field is generated on the side surface of the end of the display panel, a brighter phenomenon (in which the side area of ​​the end becomes brighter than the display area of ​​the display panel) and a greenish phenomenon (in which a local area becomes green) may occur.

[0011] When the brightening phenomenon and the greening phenomenon occur at the end of the display panel, it may cause quality defects of the display panel.

[0012] In one example, a charging solution may be applied to form a charge moving path, thereby releasing the charge of the display device to the outside.

[0013] However, since a charge moving path formed by coating the charging solution contacts the side surface of the display panel, some charges cannot be discharged to the outside but may flow into the display panel.

[0014] Furthermore, since a separate process of coating a charging solution is required to form a charge moving path, the efficiency of a manufacturing process of a display device may be reduced.

[0015] In addition, the charging solution is applied to be exposed outside the display device, and thus the applied charging solution may be damaged during a handling process during a manufacturing process of the display device, thereby deteriorating the charging function.

[0016] Therefore, the inventors of the present invention have invented a display device and a display apparatus which can reduce the occurrence rate of the brightening phenomenon and the greening phenomenon at the end of the display panel, and can improve the process efficiency and reduce the loss of the charging function.

[0017] An object of an embodiment of the present invention is to provide a display device and a display apparatus capable of reducing the occurrence rate of a brightening phenomenon and a greening phenomenon at the end of a display panel.

[0018] Another object according to an embodiment of the present invention is to provide a display device and a display apparatus in which the amount of charge of a cover member flowing to the inside of a display panel can be reduced and a considerable amount of charge thereof can be effectively discharged to the outside.

[0019] Still another object according to an embodiment of the present invention is to provide a display device and a display apparatus capable of improving the efficiency of a process of forming a charge moving path.

[0020] Still another object according to an embodiment of the present invention is to provide a display device and a display apparatus capable of reducing loss of a charging function due to damage to a charge moving path caused by an external factor such as physical contact.

[0021] The purpose of the present invention is not limited to the above purpose. Other purposes and advantages of the present invention that are not mentioned can be understood based on the following description, and can be more clearly understood based on the embodiments of the present invention. In addition, it will be easy to understand that the purposes and advantages of the present invention can be achieved using the methods and combinations thereof shown in the claims.

[0022] A display device according to an embodiment of the present invention includes: a cover member; a display panel arranged on one surface of the cover member; and a buffer plate arranged on one surface of the display panel, wherein the buffer plate includes a buffer layer, a conductor and a heat dissipation layer, wherein the buffer layer and the conductor are arranged between the display panel and the heat dissipation layer, and wherein the conductor is arranged in an edge area of ​​the buffer plate.

[0023] A display device according to an embodiment of the present invention includes: a cover member; a display panel disposed on the cover member; and a buffer plate including at least one conductor disposed in an edge region thereof, the at least one conductor having a lower resistance than that of the display panel.

[0024] A display device according to an embodiment of the present invention includes: a display device; and a housing, which is arranged on the rear surface of the display device and supports a cover member, wherein the display device includes: the cover member; a display panel arranged on the cover member; and a buffer plate arranged on the display panel, wherein the buffer plate includes a buffer layer, a conductor and a heat dissipation layer, wherein the buffer layer and the conductor are arranged between the display panel and the heat dissipation layer, and wherein the conductor is arranged in an edge area of ​​the buffer plate.

[0025] According to an embodiment of the present invention, a conductor is disposed in an edge region of a buffer plate on a rear surface of a display panel so that an electric field may be induced so that charges of a cover member may move to the conductor, thereby forming a charge moving path.

[0026] Therefore, charge concentration on the side surface of the display panel may be reduced, thereby reducing a brightening phenomenon and a greening phenomenon that may be concentratedly present in a local area of ​​the side of the display panel according to the related art.

[0027] In addition, the conductor forms a charge transfer path in an air contact manner, so that the charge of the cover member moves to the conductor without directly contacting the side surfaces of the cover member and each of the display panel, thereby reducing the amount of charge of the cover member entering the interior of the display panel through the side surface of the display panel and allowing a considerable amount of charge to be effectively released to the outside.

[0028] In addition, the conductor constituting the charge moving path is included in the buffer plate. Thus, a separate additional process of forming the charge moving path after forming the buffer plate is not required, thereby improving process efficiency.

[0029] Furthermore, the conductor constituting the charge moving path is accommodated in the buffer plate, thereby reducing the loss of the charging function due to damage to the charge moving path caused by external factors such as physical contact.

[0030] The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1A and Figure 1C 1 and 2 respectively show the front surface and the rear surface of a display device according to an embodiment of the present invention, Figure 1BThe rear surface of the display device is shown in a state where the housing is removed.

[0032] Figure 2 is a cross-sectional view of a display device along the II' direction according to an embodiment of the present invention.

[0033] Figure 3 is a cross-sectional view of a display device according to an embodiment of the present invention along the II-II' direction.

[0034] Figure 4 FIG. 4 is a cross-sectional view of a display device according to another embodiment of the present invention along the II-II′ direction.

[0035] Figure 5A and Figure 5B They are plan views of the rear surface of the buffer plate according to the respective embodiments of the present invention.

[0036] FIG. 6A to FIG. 6E 2 is a cross-sectional view of a display device according to various embodiments of the present invention along the III-III' direction. DETAILED DESCRIPTION

[0037] The advantages and features of the present invention and methods for implementing the same will become apparent with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are only set forth to complete the disclosure of the present invention and fully convey the scope of the present invention to those skilled in the art to which the present invention belongs, and the present invention is limited only by the scope of the claims.

[0038] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the accompanying drawings for describing embodiments of the present invention are exemplary, and the present invention is not limited thereto. The same reference numerals herein refer to the same elements. In addition, in order to simplify the description, the description and details of known steps and elements are omitted. In addition, in the following detailed description of the present invention, many specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood that the present invention can be practiced without these specific details. In other cases, known methods, processes, components and circuits are not described in detail to avoid unnecessary blurring of aspects of the present invention.

[0039] The technical terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. It will be further understood that, when used in the present application, the terms "include", "have" and "comprise" specify the existence of the described features, wholes, operations, elements and / or components, but do not exclude the existence or addition of one or more other features, wholes, operations, elements, components and / or parts thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items associated with one or more. Expressions such as "at least one" before the list of elements can modify the entire list of elements, rather than the individual elements of the list. When explaining numerical values, even if there is no clear description, there may be errors or tolerances.

[0040] In addition, it will be understood that when a first element or layer is referred to as being present "on" a second element or layer, the first element may be directly disposed on the second element, or may be indirectly disposed on the second element, wherein a third element or layer is disposed between the first and second elements or layers. It will be understood that when an element or layer is referred to as being "connected to" or "engaged to" another element or layer, it may be directly disposed on the other element or layer, or directly connected to or engaged to the other element or layer, or one or more intermediate elements or layers may be present. In addition, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may also be present.

[0041] In addition, as used herein, when a layer, film, region, plate, etc. may be disposed "on" or "on top of" another layer, film, region, plate, etc., the former may directly contact the latter, or other layers, films, regions, plates, etc. may also be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is directly disposed "on" or "on top of" another layer, film, region, plate, etc., the former directly contacts the latter, and no other layers, films, regions, plates, etc. are disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, etc. may be disposed "under" or "below" another layer, film, region, plate, etc., the former may directly contact the latter, or other layers, films, regions, plates, etc. may also be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is directly disposed "under" or "below" another layer, film, region, plate, etc., the former directly contacts the latter, and no other layers, films, regions, plates, etc. are disposed between the former and the latter.

[0042] When describing a time relationship, such as the temporal relationship between two events, such as "after", "afterwards", "before", etc., another event may occur between them, unless it is indicated as "immediately after", "immediately after" or "immediately before".

[0043] It will be understood that, although the terms "first", "second", "third", etc., may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present invention, the first element, component, region, layer or part described below may be referred to as a second element, component, region, layer or part.

[0044] The features of the various embodiments of the present invention may be combined with each other in part or in whole, may be technically related to each other or operate with each other. The embodiments may be implemented independently of each other, and may be implemented together in a related relationship.

[0045] When interpreting numerical values, unless explicitly stated otherwise, the numerical values ​​are interpreted as including the error range.

[0046] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as those commonly understood by those skilled in the art to which the inventive concept belongs. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal manner unless explicitly defined in this article.

[0047] The display device according to the present invention can be applied to an organic light emitting display device. The present invention is not limited thereto. The display device according to the present invention can be applied to various display devices, such as a micro LED display device or a quantum dot display device.

[0048] Hereinafter, a display device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0049] Figure 1A and Figure 1C 1 and 2 respectively show the front surface and the rear surface of a display device according to an embodiment of the present invention, Figure 1B The rear surface of the display device is shown in a state where the housing is removed.

[0050] As used herein, each of the forward and upward directions may be referred to as the Z-axis direction, and each of the rearward and downward directions may be referred to as the −Z-axis direction.

[0051] The display apparatus 1 may include a display device 10 including a cover member 20 and a display panel 100 attached to the bottom of the cover member 20. A direction from the top to the bottom of the cover member may be referred to as a downward direction (-Z axis direction).

[0052] The cover member 20 may be provided to constitute the front of the display apparatus 1 to protect the display apparatus 1 from external impact.

[0053] The edge portion of the cover member 20 may have a curved portion or a bent portion that is curved or bent toward the rear surface of the display device 10 .

[0054] Since the cover member 20 may be disposed to cover the side surface of the display device 10 of the display apparatus 1 , the cover member 20 may protect the display panel 100 from external impact not only on the front surface of the display device 10 but also on the side surface thereof.

[0055] The cover member 20 may overlap the display area AA of the display panel displaying an image. For example, the cover member 20 may be made of a transparent plastic material that can transmit an image through the cover member, or may be made of a glass cover of a transparent glass material. The present invention is not limited thereto.

[0056] The housing 30 for supporting the cover member 20 may be disposed on the rear surface of the display device 10 .

[0057] A casing 30 may function as a housing that protects the rear surface of the display apparatus 1 , and may function as a casing constituting an outermost shell of the display apparatus 1 .

[0058] Housing 30 may be made of a variety of materials such as plastic, metal, or glass.

[0059] A middle frame (not shown) may be additionally provided between the cover member 20 and the housing 30 .

[0060] The middle frame may be disposed on the rear surface of the display device 10 and may accommodate the display device 10 therein. The middle frame may contact the cover member 20 such that the middle frame supports the cover member 20.

[0061] The middle frame may function as a cover to protect the rear surface of the display device 10 .

[0062] The middle frame may have a structure in which the display device 10 is provided on one surface of the middle frame, and additional components such as a battery for applying power to the display apparatus 1 are provided on the other surface of the middle frame.

[0063] The front FP of the display panel 100 may be disposed on the bottom surface of the cover member 20 .

[0064] The front FP may include a pixel array having a plurality of pixels having a plurality of light emitting elements and a driving transistor and signal lines for transmitting driving signals to the pixels so that an image can be displayed from the front.

[0065] The front FP may include a display area AA (active area) in which an image is displayed and a non-display area NA (non-active area) except the display area AA. The non-display area NA may be formed as an edge area surrounding the display area AA.

[0066] The display area AA and the non-display area NA may be equally applied to the cover member 20 .

[0067] The area of ​​the cover member 20 for transmitting an image may be a display area AA thereof.

[0068] A region of the cover member 20 that surrounds the display area AA and does not transmit an image may be a non-display area NA thereof.

[0069] The non-display area NA may be defined as a bezel area.

[0070] The display panel 100 disposed under the cover member 20 may include a bent portion extending from one side of the front portion FP thereof and bent downward.

[0071] The bent portion may be disposed at the outermost portion of the display panel 100 and thus may be easily exposed to external impact. The bent portion may be easily deformed or broken when an impact is applied. Therefore, a support member or a reinforcement member for protecting the bent portion may be added to absorb the impact.

[0072] Hereinafter, the structure of the display device 10 according to the embodiment of the present invention will be described.

[0073] Figure 2 is a cross-sectional view of the display device 10 according to the embodiment of the present invention taken along line II′.

[0074] The display device 10 may include a cover member 20 as an uppermost portion and a display panel 100 disposed under the cover member 20 .

[0075] The display device 10 may include: a display panel 100, the display panel 100 having a front FP, a bending portion BND, and a pad portion PAD bent from the bending portion BND so as to be disposed on a rear surface of the front FP; a cushion plate 300, the cushion plate 300 is disposed between the front FP and the pad portion PAD and is disposed below the front FP; and a second connecting member 400 for fixing the pad portion PAD to the cushion plate 300.

[0076] The first rear plate 210 , the buffer plate 300 , the second connection member 400 , the second rear plate 220 , and the pad portion PAD may be sequentially disposed under the front portion FP of the display panel 100 .

[0077] The first connection member 150 may be disposed between the cover member 20 and the display panel 100 .

[0078] The first connection member 150 may connect or combine the cover member 20 and the display panel 100 to each other.

[0079] For example, the first connection member 150 may be a fixing member. The present invention is not limited to this term.

[0080] Since the first connection member 150 may be disposed to vertically overlap the display area AA, the first connection member 150 may be made of a material that may transmit an image of the display panel 100 .

[0081] For example, the first connection member 150 may be made of or include a material such as OCA (optically clear adhesive), OCR (optically clear resin), or PSA (pressure sensitive adhesive). However, the present invention is not limited thereto.

[0082] The display panel 100 disposed under the cover member 20 may include a front portion FP, a bending portion BND, and a pad portion PAD constituting a display substrate 110 .

[0083] The front FP of the display panel 100 may be disposed under the first connection member 150. For example, the front FP may be a portion displaying an image. The front portion may include a display substrate 110, a pixel array 120, an encapsulation portion 130, and a polarization plate 140.

[0084] The bent portion BND of the display panel 100 may extend from one side of the front portion FP and bend downward (in the -Z axis direction) and then bend horizontally (in the Y axis direction). The bent portion BND may include the display substrate 110 and the signal line.

[0085] The pad portion PAD of the display panel 100 may extend from the bent portion BND and be disposed under the front portion FP.

[0086] The pad portion PAD may include a display substrate 110, a signal line, and a pad electrode connected to the signal line. A driver circuit 160 or a flexible circuit board 500 for driving a pixel may be mounted on the pad electrode.

[0087] The polarizing plate 140 may be disposed on the top surface of the front FP, and thus may be disposed on the top surface of the display panel 100. In addition, a functional layer for improving display performance of the display device may be further disposed between the first connection member 150 and the polarizing plate 140.

[0088] The polarizing plate 140 prevents external light reflection and improves outdoor visibility and contrast of an image displayed on the display panel 100 .

[0089] The display panel 100 may include a display substrate 110 , a pixel array 120 disposed on the display substrate 110 , and an encapsulation part 130 disposed to cover the pixel array 120 .

[0090] A portion of the display substrate 110 may constitute a bottom of the display panel 100 .

[0091] The display substrate 110 may constitute each of the front portion FP, the bending portion BND, and the pad portion PAD.

[0092] The display substrate 110 may be made of a flexible plastic material and may have a flexible property.

[0093] The display substrate 110 may include polyimide, or may be made of a thin glass material having flexibility.

[0094] The pixel array 120 may be disposed on the display substrate 110. The pixel array 120 may display an image. An area where the pixel array 120 may be disposed may be a display area AA.

[0095] Therefore, a region of the cover member 20 corresponding to the pixel array 120 may be a display area AA of the cover member 20 , and a region of the cover member 20 other than the display area AA may be a non-display area NA of the cover member 20 .

[0096] The pixel array 120 may include light emitting elements on the display substrate 110 , thin film transistors for driving the light emitting elements, and signal lines such as gate lines, data lines, and pixel driving power lines.

[0097] The pixel array 120 may include pixels that display an image based on signals supplied to signal lines. The pixels may include a light emitting element and a thin film transistor.

[0098] The light emitting element may include an anode electrically connected to the thin film transistor, a light emitting layer formed on the anode, and a cathode for supplying a common voltage.

[0099] The thin film transistor may include a gate, a semiconductor layer, a source and a drain. The semiconductor layer of the thin film transistor may include silicon such as amorphous silicon (a-Si), polycrystalline silicon (poly-Si) or low temperature polycrystalline silicon, or may include an oxide such as IGZO (indium zinc oxide). The present invention is not limited thereto.

[0100] The anode may be disposed in each pixel region and disposed to correspond to an opening region defined according to a pattern shape of the pixel, and the anode may be electrically connected to the thin film transistor.

[0101] The light emitting element may include a light emitting layer formed between an anode and a cathode. The light emitting element may be implemented to emit the same color light such as white light for each pixel, or to emit different color light such as red light, green light or blue light for each pixel.

[0102] The encapsulation part 130 may be disposed on the display substrate 110 to cover the pixel array 120 .

[0103] The encapsulation part 130 may prevent oxygen, moisture, or impurities from invading the light emitting layer of the pixel array 120. For example, the encapsulation part 130 may be formed in a multi-layer structure in which organic material layers and inorganic material layers are alternately stacked. The present invention is not limited thereto.

[0104] The front portion FP of the display panel 100 may include a display substrate 110, a pixel array 120, and an encapsulation part 130. The front portion may be formed in a flat manner except for an edge portion thereof.

[0105] A first rear plate 210 to be described below may be connected or joined to a rear surface of the front FP to maintain a flat state of the front FP.

[0106] The bending portion BND of the display panel 100 may not include the pixel array 120, the encapsulation portion 130, and the first rear plate 210 to be described below, and may include the display substrate 110. The bending portion BND may be a portion that may be easily bent in a direction desired by a user.

[0107] The pad portion PAD of the display panel 100 may not include the pixel array 120 and the encapsulation portion 130 .

[0108] The second rear plate 220 may be connected or bonded to the rear surface of the pad portion PAD so that the pad portion PAD may be maintained in a flat state.

[0109] Therefore, the front FP of the display panel 100 may be disposed in the area of ​​the display screen, and the pad portion PAD may be bent horizontally and inwardly from the bending portion BND and may be disposed below the front FP, that is, on the rear surface of the front FP.

[0110] A first rear plate 210 disposed under the front FP of the display panel 100 and a second rear plate 220 disposed under the pad portion PAD may be disposed under the display substrate 110 to supplement the rigidity of the display substrate 110 and maintain the front FP in a flat state.

[0111] Each of the first rear cover 210 and the second rear plate 220 may be formed to have a specific strength and thickness that complements the rigidity of the display substrate 110 , and may not be formed in a bending portion region where the bending portion BND is provided.

[0112] Based on the shape of the display panel 100 before being bent, the first rear plate 210 and the second rear plate 220 may be disposed under the display substrate 110 and spaced apart from each other.

[0113] Based on the shape of the display panel 100 after being bent, the first rear plate 210 may be disposed under the front portion FP, and the second rear plate 220 may be disposed on the top surface of the pad portion PAD.

[0114] Each of the first rear plate 210 and the second rear plate 220 may be a rear plate disposed on a rear surface of the display substrate 110 .

[0115] Each of the first rear plate 210 and the second rear plate 220 may be formed of a plastic film having rigidity.

[0116] For example, each of the first rear plate 210 and the second rear plate 220 may be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PET), etc. The present invention is not limited thereto.

[0117] The first rear plate 210 and the second rear plate 220 may be made of the same material and may have the same thickness. The present invention is not limited thereto.

[0118] The buffer plate 300 may be disposed between the first rear plate 210 and the second rear plate 220 based on the shape of the display panel 100 after being bent.

[0119] The buffer plate 300 may be disposed under the first rear plate 210 .

[0120] The buffer plate 300 may include a heat dissipation layer 310, a lift-off prevention layer 320, a buffer layer 330, and an adhesive layer 340. For example, the buffer plate 300 may have a structure in which the adhesive layer 340, the buffer layer 330, the lift-off prevention layer 320, and the heat dissipation layer 310 are sequentially stacked downward.

[0121] The heat dissipation layer 310 may be provided in a manner corresponding to a component generating high temperature, and may include a material having high thermal conductivity. Therefore, the heat dissipation effect of the display panel 100 may be improved.

[0122] The heat dissipation layer 310 may be a conductive layer having conductivity. Therefore, the heat dissipation layer 310 may have a grounding function and a function of protecting the rear surface of the display substrate 110 in addition to the heat dissipation function.

[0123] When the heat dissipation layer 310 is made of a metal layer, the heat dissipation layer 310 can effectively protect a distal end region of the display panel 100 that is susceptible to cracking.

[0124] For example, the heat dissipation layer 310 may include a metal having thermal conductivity such as copper (Cu) and aluminum (Al), or graphite, etc. The present invention is not limited thereto.

[0125] In addition, the heat dissipation layer 310 may include SUS (stainless steel), and may be implemented as a SUB board.

[0126] When the heat dissipation layer 310 includes SUB, the heat dissipation layer 310 may have higher thermal conductivity and strength while having a smaller thickness, compared to a case where the heat dissipation layer 310 includes other metals.

[0127] The peeling preventing layer 320 may be disposed on the heat dissipation layer 310 .

[0128] The peeling preventing layer 320 may be made of a flexible material such as polyimide. The present invention is not limited thereto.

[0129] When the side surface of the cover member 20 is bent, the buffer plate 300 may have a lifting phenomenon. For this reason, the peeling preventing layer 320 may be provided to prevent the lifting phenomenon.

[0130] Since the peeling preventing layer 320 has flexibility, the peeling preventing layer 320 may minimize a lifting phenomenon that may occur when the cover member 20 is bent.

[0131] The buffer layer 330 may be disposed on the peeling preventing layer 320 and may include a foam tape or a foam pad.

[0132] The buffer layer 330 may reduce impact on various components that may come into contact with the buffer plate 300 .

[0133] The buffer layer 330 having an impact reduction function may enhance the rigidity of the buffer plate 300 .

[0134] The adhesive layer 340 may be disposed on the buffer layer 330 , and may include an uneven structure formed on a surface of the adhesive layer 340 .

[0135] The uneven structure of the adhesive layer 340 can prevent bubbles from being generated between the first rear plate 210 and the buffer plate 300 when the buffer plate 300 is attached to the first rear plate 210. Thus, a degassing or debubbling process for removing bubbles between the first rear plate 210 and the buffer plate 300 can be omitted.

[0136] The adhesive layer 340 includes an adhesive component and directly contacts the first rear plate 210 to fix the buffer plate 300 to the first rear plate 210 .

[0137] The adhesive layer 340 may be made of a material such as at least one of OCA (optically clear adhesive), OCR (optically clear resin) and PSA (pressure sensitive adhesive), or may include a material such as at least one of OCA (optically clear adhesive), OCR (optically clear resin) and PSA (pressure sensitive adhesive).

[0138] The second connection member 400 and the second rear plate 220 may be disposed under the buffer plate 300 .

[0139] The second connection member 400 may be disposed between the buffer plate 300 and the pad portion PAD.

[0140] When the pad portion PAD of the display panel 100 is bent from the bending portion BND to be disposed under the front portion FP of the display panel 100 , a restoring force that restores the display panel 100 to a state before being bent may be strong.

[0141] When a strong restoring force is applied, a lifting phenomenon in which the bent pad portion PAD of the display panel 100 is not fixed and is peeled off may occur.

[0142] The second connection member 400 may serve as a fixing member for fixing the curved display panel 100 so that the display panel may maintain its curved shape.

[0143] The second connection member 400 may be formed to have a constant thickness in a thickness direction, thereby maintaining a constant curvature of the bent portion BND.

[0144] The second connection member 400 may be implemented as a double-sided tape having adhesive strength, and the second connection member 400 may fix the second rear plate 220 and the heat dissipation layer 310 to each other through the double-sided tape. The present invention is not limited thereto.

[0145] Optionally, the second connection member 400 may be made of a foam tape or a foam pad having adhesive force to further have the effect of alleviating impact.

[0146] The second rear plate 220 may be disposed under the second connection member 400 .

[0147] In order to place the second rear plate 220 , the second rear plate 220 may be attached to the bottom surface of the pad portion PAD, and then the bent portion BND may be bent, and the second rear plate 220 may be attached and fixed to the bottom surface of the second connection member 400 .

[0148] In a state in which the second rear plate 220 is fixed to the second connection member 400 , the second rear plate 220 may be disposed on the top surface of the pad portion PAD.

[0149] For example, the second connection member 400 and the second back plate 220 may be disposed between the heat dissipation layer 310 of the buffer plate 300 and the pad portion PAD.

[0150] While the second rear plate 220 is fixed to the second connecting member 400 , an outer portion of the top surface as the bending portion BND may be exposed to the outside, and a bottom surface as the inner portion of the bending portion BND may face the side surfaces of the buffer plate 300 and the second connecting member 400 .

[0151] A reinforcing member 600 may be disposed on a top surface of the bending portion BND of the display panel 100 .

[0152] The reinforcement member 600 may extend to cover the bent portion BND, and cover at least a partial area of ​​each of the front portion FP and the pad portion PAD.

[0153] The reinforcing member 600 may include resin. For example, the reinforcing member 600 may include VU-curable acrylic resin. The present invention is not limited thereto.

[0154] Since the reinforcement member 600 may cover each signal line disposed between the pad part PAD of the display panel 100 and the encapsulation part 130 , the reinforcement member 600 may prevent moisture from intruding into the signal line while protecting the signal line from external impact.

[0155] In order to increase the flexibility of the display panel 100, the bending portion BND may not include other components except the display substrate 110 and the signal line. Therefore, the reinforcement member 600 may supplement the rigidity of the bending portion BND lacking other components.

[0156] In one example, the driver circuit 160 may be disposed on the other surface of the pad portion PAD opposite to one surface of the pad portion PAD of the display panel 100 on which the second rear plate 220 is disposed.

[0157] The driver circuit 160 may be provided in the form of a chip on plastic (COP) mounted on the display substrate 110. However, the present invention is not limited thereto.

[0158] The driver circuit 160 may generate a data signal and a gate control signal based on image data and a timing synchronization signal provided from an external host driving system.

[0159] The driver circuit 160 may provide a data signal to a data line of each pixel via a display pad, and may provide a gate control signal to a gate driver circuit via a display pad.

[0160] The driver circuit 160 may be mounted in a chip mounting area defined in the display substrate 110 , may be electrically connected to a display pad, and may be connected to the pixel array 120 and a signal line of a gate driver circuit provided on the display substrate 110 .

[0161] The display pad may be disposed at an end of the display substrate 110 on which the driver circuit 160 is mounted.

[0162] The display pad may be disposed on one surface of the display substrate 110 and electrically connected to the flexible circuit board 500 on which the circuit board is mounted.

[0163] The flexible circuit board 500 may be electrically connected to a display pad disposed on an end of the display substrate 110 via a film attachment process using a conductive adhesive layer, and may be located on a rear surface of the display panel 100 .

[0164] One example of the material of the conductive adhesive layer may include an anisotropic conductive film (ACF).

[0165] The circuit board may provide the driver circuit 160 with image data and a timing synchronization signal supplied from a host driving system, and may provide voltages required to drive each of the pixel array 120 , the gate driver circuit, and the driver circuit 160 .

[0166] Figure 3 FIG. 2 shows an embodiment of the present invention in which an anti-static liquid is used to form a charge moving path, and is a cross-sectional view of a display device according to an embodiment of the present invention along a II-II′ direction.

[0167] The display device 10 may include an antistatic layer 700 electrically connecting the cover member 20 and the buffer plate 300 to each other.

[0168] The antistatic layer 700 may electrically connect the cover member 20 to the heat dissipation layer 310 which is a conductive layer of the buffer sheet 300 .

[0169] Therefore, charges generated on the cover member 20 may migrate and may diffuse along the antistatic layer 700 .

[0170] In addition, when the antistatic layer 700 is electrically grounded via a ground path, the charges of the cover member 20 may be discharged to the outside via the ground.

[0171] The anti-static layer 700 may be formed by coating an anti-static solution, that is, in AS coating (anti-static coating mechanism). The type of the anti-static solution is not limited to a specific type.

[0172] The antistatic layer 700 may extend from the cover member 20 along side surfaces of the first connection member 150 , the polarizing plate 140 , the display panel 100 , and the first rear plate 210 to the heat dissipation layer 310 of the buffer plate 300 .

[0173] The antistatic layer 700 may constitute a charge moving path along which charges generated from the cover member 20 move to the heat dissipation layer 310 of the buffer plate 300 .

[0174] Therefore, according to the embodiment of the present invention, the concentration of the charge density on the side surface of the display panel may be reduced, thereby reducing the brightening phenomenon and the greening phenomenon that may intensively occur in a local area of ​​the side surface of the display panel.

[0175] However, when an antistatic solution is used to form a charge moving path, a separate process for applying a charging solution is required, which may reduce the efficiency of the manufacturing process.

[0176] In addition, the antistatic liquid may be applied to be exposed outside the display device, and thus, the applied charging solution may be damaged during the loading and unloading process of the display device, and thus the charging function may be lost.

[0177] In addition, when the antistatic solution is used to form a charge moving path for electrically connecting the cover member and the buffer plate to each other, the charge moving path comes into contact with the side surface of the display panel, and thus some charges may flow into the inside of the display panel through the side surface of the display panel.

[0178] Below, we will refer to Figure 4 A display device according to another embodiment of the present invention is described.

[0179] Figure 4 FIG. 4 is a cross-sectional view of a display device according to another embodiment of the present invention along the II-II′ direction.

[0180] For the sake of illustration, Figure 4 Each layer of the display device shown is shown as constituting Figure 2 Each layer of the display device shown has different thickness or size. Some layers thereof may be omitted.

[0181] The display device 10 according to the embodiment of the present invention may include a cover member 20 , a display panel 100 disposed on one surface of the cover member 20 , and a buffer plate 300 disposed on one surface of the display panel 100 .

[0182] The buffer plate 300 may include an adhesive layer 340 , a buffer layer 330 , a conductor 350 , and a heat dissipation layer 310 .

[0183] The buffer layer 330 and the conductor 350 may be disposed between the display panel 100 and the heat dissipation layer 310. The conductor 350 may be disposed in an edge region of the buffer plate 300.

[0184] The edge region of the buffer plate 300 may be a region having a predetermined width (including a side end of the buffer plate 300 ) in an inward direction of the buffer plate 300 .

[0185] An edge area of ​​the buffer plate 300 may correspond to the non-display area NA of the display panel 100 .

[0186] The conductor 350 may be disposed along at least one side surface of the buffer plate 300 .

[0187] In one example, the buffer plate 300 may be formed in a flat plate shape.

[0188] When the buffer plate 300 is formed in a flat plate shape, the buffer plate 300 may have four side surfaces, and may have four edge areas respectively formed along the four surfaces.

[0189] The conductor 350 may be disposed along at least one edge region of the buffer plate 300 .

[0190] For example, refer to Figure 5A and Figure 5B , the conductor 350 may be disposed in each of two opposite side edge regions of the buffer plate 300 .

[0191] The conductor 350 may also be disposed in the upper edge region of the buffer plate 300. The conductor 350 may further be disposed in the lower edge region thereof.

[0192] Reference Figure 5A , a plurality of conductors 350 may be disposed in each side edge region of the buffer plate 300 .

[0193] In this case, the conductor 350 may be configured such that a plurality of conductors 350 are disposed along one side surface of the buffer plate 300 .

[0194] The plurality of conductors 350 may be intermittently arranged along one side surface of the buffer plate 300 .

[0195] In addition, the plurality of conductors 350 may be intermittently arranged along at least one side surface of the buffer plate 300 , for example, three side surfaces except for a side surface where the bent portion BND of the display panel 100 is disposed.

[0196] In addition, refer to Figure 5B , in each edge region of the buffer plate 300 , the conductor 350 may be provided in the form of a line extending along one side surface.

[0197] For example, the conductor 350 may be formed in a line shape extending along each of three side surfaces except for a side surface where the bent portion BND is provided.

[0198] In this case, the linear conductor 350 extending along all three side surfaces of the buffer plate 300 may be intermittently formed. However, the present invention is not limited thereto. In another example, the linear conductor 350 extending along all three side surfaces of the buffer plate 300 may be continuously formed.

[0199] Reference Figure 4 , the buffer layer 330 and the conductor 350 of the buffer plate 300 may be disposed in the same layer based on the heat dissipation layer 310 .

[0200] In the edge region of the buffer layer 330 , there may be one or more receiving grooves 330 h in which the conductor 350 is disposed.

[0201] The receiving groove 330 h of the buffer layer 330 may be formed by removing a portion of the buffer layer 330 .

[0202] For example, the receiving groove 330 h may vertically extend through the buffer layer 330 of the buffer plate 300 .

[0203] Since the conductor 350 is inserted into the accommodation groove 330 h formed by partially removing the buffer layer 330 , the buffer layer 330 and the conductor 350 may be disposed in the same layer based on the heat dissipation layer 310 or may constitute the same layer.

[0204] Therefore, the receiving groove 330 h may be formed to correspond to the shape of the conductor 350 .

[0205] For example, when the plurality of conductors 350 are disposed along one side surface of the buffer plate 300 , a plurality of receiving grooves 330 h corresponding to the plurality of conductors 350 may be formed along one side surface of the buffer plate 300 .

[0206] Referring to one embodiment Figure 5A , a length a from one end of the buffer plate 300 to the receiving groove 330h may be 30 μm, a length c of the receiving groove 330h may be 5 μm, and a spacing b between the receiving grooves 330h adjacent to each other may be 25 μm.

[0207] In this manner, when a plurality of receiving grooves 330h having a relatively short length are arranged along one side surface of the buffer plate 300, charges of the cover member may be guided to the conductor 350 while minimizing the area where the buffer layer 330 is removed.

[0208] In addition, when the conductor 350 extends in a line shape along one side surface of the buffer plate 300 , the receiving groove 330 h may be formed in a line shape along one side surface of the buffer plate 300 .

[0209] Referring to one embodiment Figure 5B, the length from one end of the buffer plate 300 to the receiving groove 330h may be 30 μm, and the length d of the linear receiving groove may be 65 μm.

[0210] In this manner, when the receiving groove 330 h extending in a line shape and having a relatively long length is provided along one side surface of the buffer plate 300 , the charges of the cover member may be more strongly guided to the conductor 350 .

[0211] The conductor 350 may have lower resistance than each of the display panel 100 , the polarizing plate 140 , and the first rear plate 210 disposed between the cover member 20 and the buffer plate 300 .

[0212] For example, conductor 350 may include a 3 Conductive materials with a resistance of Ω or less.

[0213] When the conductor 350 includes a 10 3 When a conductive material having a resistance of Ω or less is used, charges generated on the cover member 20 can be directly transferred to the conductor 350 having very low resistance without passing through the display panel 100, the polarizing plate 140, and the first rear plate 210.

[0214] The heat dissipation layer 310 of the buffer plate 300 may be electrically connected to the low resistance conductor 350 .

[0215] According to an embodiment of the present invention, by disposing the conductor 350 in the edge region of the buffer plate 300 located on the rear surface of the display panel 100, an induced electric field may be allowed so that charges of the cover member 20 may move to the conductor 350. Thus, a charge moving path through which charges may travel extends from the cover member 20 to the conductor 350.

[0216] Since the conductor 350 has a relatively low resistance compared to each of the display panel 100, the polarizing plate 140 and the first rear plate 210 disposed between the cover member 20 and the buffer plate 300, the charge of the cover member 20 does not flow into other structures such as the display panel 100, the polarizing plate 140 and the first rear plate 210, but may flow into the conductor 350 having a very low resistance.

[0217] Therefore, according to an embodiment of the present invention, a charge moving path can be formed in an air contact manner, in which the charge of the cover member 20 can move to the conductor 350 while the conductor 350 is not in direct contact with the cover member 20 and the side surfaces of the display panel 100. This can reduce the charge of the cover member 20 from entering the inside of the display panel 100 via the side surface of the display panel 100, and allow a large amount of charge to be effectively discharged to the outside.

[0218] Therefore, the concentration of the charge density on the side surface of the display panel 100 may be reduced, thereby reducing the brightening phenomenon and the greening phenomenon that may intensively occur in a local area of ​​the side surface of the display panel 100 according to the related art.

[0219] Furthermore, since the conductor 350 constituting the charge moving path is accommodated inside the buffer plate 300 , loss of a charging function caused by damage to the charge moving path due to an external factor such as physical contact may be reduced.

[0220] Therefore, loss of charging function due to damage of charge moving paths that may occur when forming separate charge moving paths along the side surface of the display panel using antistatic fluid may be reduced.

[0221] Furthermore, according to an embodiment of the present invention, since the conductor 350 constituting the charge moving path is accommodated in the buffer plate 300 , a separate additional process for forming the charge moving path after forming the buffer plate 300 is not required, thereby improving the efficiency of the manufacturing process of the display device.

[0222] FIG. 6A to FIG. 6E is a cross-sectional view of a display device according to various embodiments of the present invention along the III-III' direction. FIG. 6A to FIG. 6E Various implementations are described.

[0223] Reference Fig. 6A , the rear plate 210 may be disposed between the display panel 100 and the buffer plate 300. The conductor 350 may contact the rear plate 210 and the heat dissipation layer 310.

[0224] The conductor 350 disposed in the edge region of the buffer plate 300 and inducing an electric field may allow charges of the cover member 20 to move to the conductor 350 in an air contact manner. Thus, the charges may be discharged to the outside via the heat dissipation layer 310 electrically connected to the conductor 350.

[0225] The conductor 350 also makes contact with one surface of the rear plate 210 , so that charges that may be generated on the rear plate 210 may also be discharged to the outside via the heat dissipation layer 310 .

[0226] The conductor 350 disposed or received in the receiving groove 330 h of the buffer layer 330 may be disposed to be spaced apart from side surfaces of the buffer layer 330 and the adhesive layer 340 by a predetermined distance.

[0227] Since the conductor 350 is disposed to be spaced apart from the side surfaces of the buffer layer 330 and the adhesive layer 340 by a predetermined distance without contacting the side surfaces of the buffer layer 330 and the adhesive layer 340, the amount of charge induced on the conductor 350 that is not released to the heat dissipation layer 310 and is thereby guided to the display panel 100 via the buffer layer 330 and the adhesive layer 340 of the buffer plate 300 can be reduced.

[0228] The end of the buffer plate 300 may be disposed inwardly relative to the end of the display panel 100. Therefore, the conductor 350 of the buffer plate 300 may be disposed inwardly relative to the end of the display panel 100.

[0229] Since the conductor 350 that is disposed in the edge region of the buffer plate 300 and induces an electric field can guide the charges of the cover member 20 to the conductor 350 in an air contact manner, the charges of the cover member 20 can be guided to the conductor 350 even if the end of the conductor 350 is disposed inwardly relative to the end of the display panel 100.

[0230] Therefore, the distance between the conductor 350 and the side surface of the display panel 100 may be further increased. Thus, the distance between the charge moving path extending from the cover member 20 to the conductor 350 and the side surface of the display panel 100 may be further increased.

[0231] Therefore, the amount of charges moving through the charge moving path that are not guided to the conductor 350 but deviate from the charge moving path and are guided to the display panel 100 may be reduced.

[0232] In order to increase the connection conductivity between the heat dissipation layer 310 and the conductor 350 , a separate adhesive layer may not be formed so that the heat dissipation layer 310 and the conductor 350 are in direct contact with each other.

[0233] In this case, the conductor 350 itself may include a material having an adhesive component while having electrical conductivity, so that the conductor 350 may be fixedly contacted with the heat dissipation layer 310 without a separate adhesive layer.

[0234] Referring to the embodiment Fig. 6A , the vertical dimension e of the conductor 350 may be 90 μm. In this case, the thickness of the adhesive layer 340 of the buffer plate 300 may be 30 μm, the thickness of the buffer layer 330 may be 60 μm, and the thickness of the heat dissipation layer 310 may be 90 μm.

[0235] The vertical dimension of the conductor 350 may be equal to the distance between the heat dissipation layer 310 and the rear plate 210 , so that the conductor 350 may contact both the heat dissipation layer 310 and the rear plate 210 .

[0236] In addition, when the end of the buffer plate 300 is disposed inwardly with respect to the end of the display panel 100 , a distance f from one end of the rear plate 210 to one end of the heat dissipation layer 310 may be less than or equal to 400 μm.

[0237] According to an embodiment of the present invention, the charges of the cover member can be guided to the conductor 350 of the buffer plate 300 in an air contact manner. Thus, even if the end of the buffer plate 300 is disposed inwardly relative to the end of the display panel 100, the charges of the cover member can be effectively guided to the conductor 350.

[0238] When the distance f from one end of the rear plate 210 to one end of the heat dissipation layer 310 exceeds 400 μm, the charges of the cover member 20 may not be guided to the conductor 350 in an air contact manner.

[0239] In one example, referring to Figure 6B , an end of the buffer plate 300 may be aligned with an end of the display panel 100 .

[0240] Therefore, an end of the heat dissipation layer 310 is aligned with an end of the display panel 100 , and an end of the buffer layer 330 may be disposed inwardly with respect to the end of the display panel 100 .

[0241] Since the end of the heat dissipation layer 310 is aligned with the end of the display panel 100 , the conductor 350 may be positioned closer to the end of the display panel 100 .

[0242] Therefore, compared with Fig. 6A The implementation method is based on Figure 6B In the embodiment of the present invention, the distance between the conductor 350 and the cover member 20 may be smaller. Therefore, the size of the conductor 350 for maintaining the charge moving path via air contact between the cover member 20 and the conductor 350 may be relatively reduced.

[0243] When the size of the conductor 350 is reduced, the size of the buffer layer 330 may be increased by the reduced area. Thus, the buffer function of the buffer plate 300 may be enhanced.

[0244] Reference Figure 6C and Fig.6D , the conductor 350 may be disposed to be spaced apart from the rear plate 210 by a predetermined vertical distance in the vertical direction.

[0245] Therefore, the conductor 350 may contact the heat dissipation layer 310 without contacting the rear plate 210 .

[0246] According to an embodiment of the present invention, the conductor 350 that is disposed in the edge region of the buffer plate 300 and induces an electric field can guide the charges of the cover member 20 to the conductor 350 in an air contact manner. Thus, even if the conductor 350 does not contact the rear plate 210 and is spaced apart from the rear plate 210 by a predetermined distance, a charge moving path can be formed.

[0247] When the conductor 350 comes into contact with the rear plate 210 , some of the charges induced on the conductor 350 may flow to the rear plate 210 and then to the display panel 100 .

[0248] However, referring to the embodiment of the present invention, the conductor 350 contacts the heat dissipation layer 310 but not the rear plate 210, and the charges induced on the conductor 350 can be guided to the heat dissipation layer 310 without flowing to the rear plate 210, and can then be effectively released to the outside.

[0249] Reference Fig.6D In one embodiment, the vertical dimension g of the conductor 350 may be 60 μm or less. In this case, the thickness of the adhesive layer 340 of the buffer plate 300 may be 30 μm, the thickness of the buffer layer 330 may be 60 μm, and the thickness of the heat dissipation layer 310 may be 90 μm.

[0250] The vertical dimension of the conductor 350 may be smaller than the distance between the heat dissipation layer 310 and the rear plate 210 and may be smaller than the thickness of the buffer layer 330 , so that the conductor 350 may contact the heat dissipation layer 310 while not contacting the rear plate 210 .

[0251] In addition, when the end of the buffer plate 300 is disposed inwardly with respect to the end of the display panel 100 , a distance f from one end of the rear plate 210 to one end of the heat dissipation layer 310 may be 400 μm or less.

[0252] According to an embodiment of the present invention, the charges of the cover member can be guided to the conductor 350 of the buffer plate 300 in an air contact manner. Thus, even if the end of the buffer plate 300 is disposed inwardly relative to the end of the display panel 100, the charges of the cover member can be effectively guided to the conductor 350.

[0253] When the distance f from one end of the rear plate 210 to one end of the heat dissipation layer 310 exceeds 400 μm, the charges of the cover member 20 are not guided to the conductor 350 in an air contact manner.

[0254] Reference Fig. 6E The buffer layer 330 may include a first buffer layer 330 a and a second buffer layer 330 b. The second buffer layer 330 b may be disposed between the first buffer layer 330 a and the heat dissipation layer 310 .

[0255] An end of the second buffer layer 330 b may be disposed inwardly relative to an end of the first buffer layer 330 a , and the conductor 350 may be disposed between the first buffer layer 330 a and the heat dissipation layer 310 .

[0256] For example, the receiving groove 330 h of the buffer layer 330 in which the conductor 350 is inserted may not extend through the entirety of the region of the buffer layer 330 corresponding to the receiving groove 330 h but may be formed by removing only a portion of the buffer layer 330 .

[0257] As reference Figure 6C and 6D As described, according to an embodiment of the present invention, the conductor 350 that is disposed in the edge region of the buffer plate 300 and induces an electric field can allow the charges of the cover member 20 to move to the conductor 350 in an air contact manner. Thus, even if the conductor 350 is not in contact with the rear cover 210 and is spaced apart from the rear cover 210 by a predetermined distance, a charge movement path can be formed.

[0258] Therefore, although the thickness of the conductor 350 is not large enough to contact the rear plate 210, a charge movement path can be formed.

[0259] Therefore, the receiving groove 330h may extend vertically through only a portion of the buffer layer 330, but may not extend vertically through the rest of the buffer layer 330. In other words, the receiving groove 330h may extend through an edge region of the second buffer layer 330b disposed on the rear surface of the first buffer layer 330a, but may not extend through the first buffer layer 330a. The conductor 350 may be received in the receiving groove 330h. Thus, the amount of the buffer layer 330 removed may be reduced.

[0260] In this manner, the amount of the buffer layer 330 removed may be reduced while maintaining a charge movement path, thereby not deteriorating the buffer function of the buffer layer 330 .

[0261] An additional conductive layer 360 may be disposed between the buffer layer 330 and the heat dissipation layer 310 .

[0262] The conductive layer 360 may include a conductive pressure sensitive adhesive (PSA) having an adhesive component.

[0263] For example, the conductive layer 360 may be disposed on a surface of the heat dissipation layer 310 facing the conductor 350 , and the conductor 350 may contact the conductive layer 360 .

[0264] Therefore, although the conductor 350 is fixed to the heat dissipation layer 310 via the conductive layer 360, the electrical connection between the conductor 350 and the heat dissipation layer 310 is not weakened, and the charge movement path can be maintained.

[0265] A first aspect of the present invention provides a display device, comprising: a cover member; a display panel arranged on one surface of the cover member; and a buffer plate arranged on one surface of the display panel, wherein the buffer plate comprises a buffer layer, a conductor and a heat dissipation layer, wherein the buffer layer and the conductor are arranged between the display panel and the heat dissipation layer, and wherein the conductor is arranged in an edge area of ​​the buffer plate.

[0266] In one embodiment of the first aspect, the buffer layer and the conductor are arranged in the same layer based on the heat dissipation layer.

[0267] In one embodiment of the first aspect, the conductor is disposed along at least one edge region of the buffer plate, wherein the conductor comprises a plurality of conductors arranged along each edge region of the buffer plate.

[0268] In one embodiment of the first aspect, the conductor is disposed along at least one edge region of the buffer plate, wherein the conductor disposed in each edge region of the buffer plate extends in a line shape.

[0269] In one implementation of the first aspect, at least one receiving groove is defined in an edge region of the buffer layer, wherein the conductor is received in the receiving groove.

[0270] In one embodiment of the first aspect, the receiving groove is formed by removing a portion of the buffer layer.

[0271] In an implementation of the first aspect, a back plate is disposed between the display panel and the buffer plate, wherein the conductor is in contact with the back plate and the heat dissipation layer.

[0272] In an embodiment of the first aspect, the conductor is in contact with the heat dissipation layer.

[0273] In an implementation of the first aspect, an end of the buffer plate is disposed inwardly relative to an end of the display panel.

[0274] In an implementation of the first aspect, an end of the buffer plate is aligned with an end of the display panel.

[0275] In an implementation of the first aspect, an end of the heat dissipation layer is aligned with an end of the display panel, and an end of the buffer layer is disposed inwardly relative to an end of the display panel.

[0276] In one embodiment of the first aspect, the buffer layer includes a first buffer layer and a second buffer layer, wherein the second buffer layer is arranged between the first buffer layer and the heat dissipation layer, wherein an end of the second buffer layer is arranged inward relative to an end of the first buffer layer, and wherein the conductor is arranged between the first buffer layer and the heat dissipation layer.

[0277] In one embodiment of the first aspect, a conductive layer is provided on a surface of the heat dissipation layer facing the conductor, wherein the conductor is in contact with the conductive layer.

[0278] In one embodiment of the first aspect, the conductor is disposed to be spaced apart from the buffer layer by a predetermined distance.

[0279] A second aspect of the present invention provides a display device comprising: a cover member; a display panel arranged on one surface of the cover member; and a buffer plate arranged on one surface of the display panel, wherein the buffer plate comprises at least one conductor having a resistance lower than that of the display panel, wherein the at least one conductor is arranged in an edge region of the buffer plate.

[0280] In one embodiment of the second aspect, the resistance of the conductor is less than or equal to 10 3 Ω.

[0281] In an embodiment of the second aspect, the conductor is disposed inwardly relative to an end of the display panel.

[0282] In one embodiment of the second aspect, the buffer plate includes a heat dissipation layer and a buffer layer disposed between the heat dissipation layer and the display panel, wherein the heat dissipation layer and the conductor are electrically connected to each other.

[0283] In one embodiment of the second aspect, a back plate is disposed between the display panel and the buffer plate, wherein the conductor is vertically spaced apart from the back plate by a predetermined vertical distance.

[0284] A third aspect of the present invention provides a display apparatus including: the above-mentioned display device; and a casing provided on a rear surface of the display device to support the above-mentioned cover member.

[0285] Although the embodiments of the present invention are described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments. The present invention may be modified in various ways without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical concept of the present invention, but to illustrate the present invention. The scope of the technical concept of the present invention is not limited by the embodiments. Therefore, it should be understood that the above-mentioned embodiments are illustrative in all aspects and are not restrictive. The scope of protection of the present invention should be interpreted based on the claims, and all technical concepts within their equivalent scope should be interpreted as included within the scope of the present invention.

Claims

1. A display device, comprising: a cover member; a display panel disposed on one surface of the cover member; as well as A buffer plate disposed on one surface of the display panel, The buffer plate comprises a buffer layer, a conductor and a heat dissipation layer. The buffer layer and the conductor are arranged between the display panel and the heat dissipation layer. The conductor is arranged in an edge area of ​​the buffer plate, and the conductor has a resistance lower than that of the display panel, so that the charges generated on the cover member are directly transferred to the conductor through a charge movement path formed in contact with the air without passing through the display panel. 2 . The display device according to claim 1 , wherein the buffer layer and the conductor are provided in the same layer based on the heat dissipation layer.

3. The display device according to claim 1, wherein the conductor is disposed along at least one edge region of the buffer plate, The conductor includes a plurality of conductors arranged along each edge region of the buffer plate.

4. The display device according to claim 1, wherein the conductor is disposed along at least one edge region of the buffer plate, The conductor provided in each edge region of the buffer plate extends in a line shape. 5 . The display device according to claim 1 , wherein at least one accommodation groove is defined in an edge region of the buffer layer, wherein the conductor is accommodated in the accommodation groove. The display device according to claim 5 , wherein the receiving groove is formed by removing a portion of the buffer layer.

7. The display device according to claim 1, further comprising a rear plate disposed between the display panel and the buffer plate, The conductor is in contact with the rear plate and the heat dissipation layer. The display device according to claim 1 , wherein the conductor is in contact with the heat dissipation layer. 9 . The display device according to claim 1 , wherein an end of the buffer plate is disposed inwardly relative to an end of the display panel. 10 . The display device according to claim 1 , wherein an end of the buffer plate is aligned with an end of the display panel. 11 . The display device according to claim 10 , wherein an end of the heat dissipation layer is aligned with an end of the display panel, and an end of the buffer layer is disposed inwardly relative to an end of the display panel.

12. The display device according to claim 1, wherein the buffer layer comprises a first buffer layer and a second buffer layer, The second buffer layer is disposed between the first buffer layer and the heat dissipation layer, wherein an end of the second buffer layer is arranged inwardly relative to an end of the first buffer layer, The conductor is arranged between the first buffer layer and the heat dissipation layer.

13. The display device according to claim 12, further comprising a conductive layer provided on a surface of the heat dissipation layer facing the conductor, wherein the conductor is in contact with the conductive layer. 14 . The display device according to claim 1 , wherein the conductor is disposed to be spaced apart from the buffer layer by a predetermined distance. 15 . The display device according to claim 5 , wherein the at least one receiving groove is formed in a line shape along a side surface of the buffer plate.

16. The display device according to claim 1, wherein the conductor comprises a material having an adhesive component. 17 . The display device of claim 1 , wherein the buffer plate further comprises an adhesive layer, and the conductor is disposed to be spaced apart from side surfaces of the buffer layer and the adhesive layer by a predetermined distance.

18. The display device according to claim 1, wherein a rear plate is provided between the display panel and the buffer plate, The conductor contacts the heat dissipation layer without contacting the rear plate.

19. The display device according to claim 7 or 18, wherein a distance from one end of the rear plate to one end of the heat dissipation layer is less than or equal to 400 μm.

20. The display device of claim 1, wherein a vertical dimension of the conductor is smaller than a thickness of the buffer layer.

21. The display device according to claim 12, further comprising at least one receiving groove in which the conductor is disposed, The receiving groove extends through an edge region of the second buffer layer disposed on the rear surface of the first buffer layer, but does not extend through the first buffer layer.

22. A display device, comprising: a cover member; a display panel disposed on the cover member; as well as A buffer plate disposed on the display panel, wherein the buffer plate includes at least one conductor having a resistance lower than that of the display panel, The at least one conductor is disposed in an edge region of the buffer plate so that charges generated on the cover member are directly transferred to the conductor through a charge moving path formed in contact with air without passing through the display panel.

23. The display device according to claim 22, wherein the resistance of the conductor is less than or equal to 10 3 Ω.

24. The display device according to claim 22, wherein the conductor is disposed inwardly relative to an end of the display panel.

25. The display device according to claim 22, wherein the buffer plate comprises a heat dissipation layer and a buffer layer disposed between the heat dissipation layer and the display panel, The heat dissipation layer and the conductor are electrically connected to each other.

26. The display device according to claim 22, further comprising a rear plate disposed between the display panel and the buffer plate, wherein the conductor is vertically spaced apart from the rear plate by a predetermined vertical distance.

27. The display device according to claim 25, wherein a rear plate is provided between the display panel and the buffer plate, The distance from one end of the rear plate to one end of the heat dissipation layer is less than or equal to 400 μm.

28. A display device comprising: Display device; as well as a housing provided on a rear surface of the display device to support a cover member, The display device comprises: the cover member; a display panel disposed on the cover member; and A buffer plate disposed on the display panel, The buffer plate comprises a buffer layer, a conductor and a heat dissipation layer. The buffer layer and the conductor are arranged between the display panel and the heat dissipation layer. The conductor is arranged in an edge area of ​​the buffer plate, and the conductor has a resistance lower than that of the display panel, so that the charges generated on the cover member are directly transferred to the conductor through a charge movement path formed in contact with the air without passing through the display panel.

29. A display device comprising: The display device according to any one of claims 2 to 27; as well as A housing is provided on a rear surface of the display device to support the cover member.

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