Limiting device, laminating method and device

Abstract

The present application provides a limiting device, a bonding method and a device, which relate to the field of display panels. The limiting device includes: a connecting piece, which is used to connect with a first flat plate; the first flat plate is a vertically arranged flat plate; a substrate, which is connected to the connecting piece, the width of the substrate is greater than the width of the second flat plate, and the height of the substrate is lower than the height of the second flat plate; the second flat plate is a flat plate bonded with the first flat plate; the first surface of the substrate abuts against the surface of the second flat plate on the side away from the first flat plate. The above-mentioned limiting device can improve the structural stability of the bonding between the first flat plate and the second flat plate in a vertical state, thereby improving the bonding effect.

Description

Technical Field

[0001] The present application relates to the field of display panels, and more specifically, to a limiting device, a bonding method and a device. Background Art

[0002] At present, when a display panel is wet-bonded to a protective cover plate or a substrate plane, an adhesive is usually applied on the surface where the display panel and the substrate plane (or protective cover plate) are bonded. After curing, the adhesive can bond the display panel and the protective cover plate (or substrate plane). After applying the adhesive, the display panel and the substrate plane (or protective cover plate) are usually placed on a horizontal workbench for leveling, bubble removal, and lamination to eliminate defects such as uneven glue coating, bubbles, and bulging.

[0003] However, when bonding the display panel to the substrate flat panel, it is often necessary to bond the display panel to the substrate plane in an upright state, for example, bonding the display panel to the installed protective glass or building curtain wall. At this time, after applying the adhesive on the display panel or the substrate plane, the liquid adhesive will flow downward under the action of gravity, resulting in uneven adhesive distribution or lack of adhesive on the bonding surface, for example, there is less adhesive at the top of the display panel and more adhesive at the bottom. At the same time, the accumulation of adhesive at the bottom of the display panel will generate pressure, thereby generating a thrust on the display panel and the substrate plane, affecting the tightness of the bonding between the two flat panels, resulting in gaps, and the gaps will cause glue leakage. Therefore, the current bonding process is not good for the bonding effect between different flat panels in a vertical state. Summary of the invention

[0004] In view of this, the present application aims to provide a limiting device, a bonding method and a device to improve the bonding effect of the display panel in a vertical state.

[0005] In a first aspect, an embodiment of the present application provides a limiting device, comprising: a connecting piece, used to connect to a first flat plate; the first flat plate is a vertically arranged flat plate; a substrate, connected to the connecting piece, the width of the substrate is greater than the width of the second flat plate, and the height of the substrate is lower than the height of the second flat plate; the second flat plate is a flat plate that is bonded to the first flat plate; the first surface of the substrate abuts against the surface of the second flat plate on a side away from the first flat plate.

[0006] In the embodiment of the present application, in the limiting device, the substrate is connected to the connecting piece. When the first flat plate and the second flat plate are bonded together, the connecting piece can be used to connect the first flat plate in a vertical state, and the substrate abuts against the second flat plate. As a result, the thrust generated by the adhesive on the second flat plate during glue injection will be transmitted to the substrate. The substrate is connected to the first flat plate through the connecting piece, so that the substrate can transmit the thrust to the first flat plate through the connecting piece, and the thrust of the adhesive on the first flat plate offsets the thrust of the adhesive on the second flat plate and the stability of the first flat plate itself, thereby improving the stability of the structure when the first flat plate and the second flat plate are bonded together in a vertical state, thereby improving the bonding effect on the display panel.

[0007] In one embodiment, the limiting device further includes: a locking member; the connecting member is connected to the second surface of the substrate through the locking member, and the locking member extends on the second surface; the second surface is a surface on the substrate opposite to the first surface.

[0008] In the embodiment of the present application, the positioning member extends on the second surface, so that the thrust of the second plate on the substrate can be transmitted to the connecting member, thereby improving the stability of the structure when the first plate and the second plate are attached to each other through the connecting member, thereby realizing the function of the limiting device. At this time, the positioning member can realize the detachable installation of the connecting member and the substrate through the positioning member. Compared with the fixed connection between the connecting member and the substrate, the detachable installation can avoid the cost of replacing the limiting device, and only some parts of the limiting device need to be replaced.

[0009] In one embodiment, the connecting member includes a plurality of suction cups, and different suction cups among the plurality of suction cups are respectively disposed at at least two ends of the substrate.

[0010] In the embodiment of the present application, different suction cups are respectively arranged at at least two ends of the substrate, so that after the suction cups are adsorbed on the smooth surface of the first flat plate, sufficient static friction can be generated, thereby generating sufficient supporting force to bear the weight of the substrate. At the same time, when the substrate is subjected to an outward force from the second flat plate, the static friction can be used to stabilize the substrate and resist the outward force from the second flat plate. In addition, using the suction cup as a connecting piece, on the one hand, the suction cup can be used to adsorb any smooth surface, thereby increasing the use range of the limit device. On the other hand, the suction cup is usually made of flexible materials such as rubber and resin, which can avoid scratches or extrusion injuries to the first flat plate.

[0011] In one embodiment, the limiting device further includes: a pad covering the first surface; the pad is made of a flexible material.

[0012] In the embodiment of the present application, a gasket made of a flexible material is used to cover the first surface to prevent the substrate from directly contacting the second flat plate and causing crushing or scratching of the second flat plate, thereby avoiding defects caused during bonding.

[0013] In one embodiment, a reinforcement structure is provided on the second surface of the substrate, and the reinforcement structure is used to improve the substrate's ability to withstand external pressure.

[0014] In the embodiment of the present application, the reinforcement structure improves the substrate's ability to withstand external pressure, thereby improving the substrate's ability to withstand the thrust of the second plate, reducing deformation, thereby improving the stability between the first plate and the second plate, and further improving the bonding effect when the first plate and the second plate are bonded.

[0015] In one embodiment, the reinforcement structure and the second surface form a groove, and a heating element is disposed in the groove.

[0016] In some practical scenarios, a thermosetting adhesive is used as an adhesive. In the embodiment of the present application, a heating element is arranged in the groove formed by the reinforcing structure and the second surface. The heating element can heat the substrate, thereby transferring the heat to the adhesive between the first flat plate and the second flat plate through heat conduction, thereby achieving the curing of the thermosetting adhesive and improving the bonding efficiency.

[0017] In one embodiment, the limiting device further includes: a fastening module; the fastening module abuts against the second surface, and the fastening module is used to apply pressure to the substrate.

[0018] In the embodiment of the present application, after the substrate abuts against the second flat plate, pressure is applied to the substrate by the fastening module, which can further offset the outward pushing force applied by the adhesive on the second flat plate, thereby improving the stability of the first flat plate and the second flat plate during the bonding process, thereby reducing the occurrence of bonding defects and improving the bonding effect.

[0019] In one embodiment, the fastening module includes: a plurality of fastening bolts, each of the fastening bolts abuts against a different position on the second surface.

[0020] In the embodiment of the present application, a plurality of fastening bolts are provided to respectively abut different positions on the second surface, so that pressure can be applied to the different positions, so that the pressure applied by the fastening bolts is affected around each abutting position on the substrate, thereby offsetting the thrust of the second plate on the substrate, thereby improving the structural stability of the first plate and the second plate when they are bonded in a vertical state.

[0021] In a second aspect, an embodiment of the present application provides a bonding device, comprising: a limiting device as described in any one of the first aspect; and a glue injection device for injecting adhesive between a cavity formed by a first flat plate and a second flat plate to be bonded.

[0022] In a third aspect, a bonding method is provided in an embodiment of the present application, which is applied to the bonding device as described in the second aspect, and the bonding method includes: bonding a vertically placed first flat plate and a second flat plate based on a spacer layer, the spacer layer having a preset thickness and being sticky, and the spacer layer being used to form a cavity having at least one opening between the first flat plate and the second flat plate; connecting a connecting piece of a limiting device to the first flat plate, and making the substrate of the limiting device abut against the second flat plate; and injecting adhesive into the cavity based on the glue injection device to bond the first flat plate to the second flat plate.

[0023] Other features and advantages of the present application will be described in the following description, or some features and advantages can be inferred or unambiguously determined from the description, or can be learned by implementing the above-mentioned technology of the present disclosure.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the preferred embodiments of the present invention are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a flat plate to be bonded provided in an embodiment of the present application;

[0027] Figure 2 A top view of a flat plate bonding provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of a limit device provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the use of a limiting device provided in an embodiment of the present application;

[0030] Figure 5 A top view of a limiting device provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of a bonding device provided in an embodiment of the present application;

[0032] Figure 7 A flowchart of a bonding method provided in an embodiment of the present application.

[0033] Icons: first plate 110; second plate 120; spacer layer 130; connector 210; substrate 220; gasket 221; reinforcement structure 230; fastening module 240; positioning member 250; glue injection device 300. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] Before introducing the solution of this application in detail, the scenario targeted by this application is described first. Figure 1 , Figure 1 A schematic diagram of the flat plates to be bonded according to an embodiment of the present application.

[0036] The two flat plates to be bonded are a first flat plate 110 and a second flat plate 120 , and the first flat plate 110 and the second flat plate 120 are arranged in parallel in a vertical direction.

[0037] The first flat panel 110 may be a flat panel in the form of a metal decorative panel, thick glass, a thick composite panel with a smooth surface, an electroplated panel, a color steel plate wall, a thin glass, etc. The second flat panel 120 may be a display panel such as a reflective LCD, a non-transparent OLED display panel, a transparent display screen, etc. The above are only examples and should not be a limitation to the present application.

[0038] The first plate 110 and the second plate 120 may be bonded together by an adhesive, which may be a liquid optical adhesive. One of the first plate 110 and the second plate 120 is light-transmissive, and the bonding state can be observed, for example, whether the first plate 110 and the second plate 120 are completely bonded together, whether there are bubbles, etc.

[0039] See also Figure 2 , Figure 2 A top view of the flat plate bonding provided in an embodiment of the present application.

[0040] When the first plate 110 and the second plate 120 are arranged vertically for bonding, a gap is provided between the first plate 110 and the second plate 120, and the gap is used to inject adhesive to fix the first plate 110 and the second plate 120. In order to avoid glue leakage during the glue injection process, a spacer layer 130 is provided between the surfaces where the second plate 120 and the first plate 110 are connected. The spacer layer 130 is adhesive and can connect the first plate 110 and the second plate 120. The spacer layer 130 has a certain thickness and width, for example, the thickness range can be 0.2 mm to 2.5 mm, and the width of the spacer layer 130 is much smaller than the width of the second plate 120, that is, the spacer layer 130 can cover the edge of the second plate 120.

[0041] The spacer layer 130 is at least disposed on the bottom edge and both side edges of the second plate 120 , so that a cavity can be formed between the first plate 110 and the second plate 120 through the spacer layer 130 , and the cavity can be used to inject adhesive.

[0042] During the process of injecting glue into the cavity, the liquid adhesive will flow to the bottom of the cavity. Since the liquid pressure is proportional to the injection depth, after the adhesive in the cavity has a certain height, the adhesive will generate a sufficiently large pressure, thereby generating a thrust on the first plate 110 and the second plate 120. At this time, if the viscosity of the spacer layer 130 is not enough to withstand the thrust, bulging will occur, and even the spacer layer 130 will collapse, resulting in a series of defects such as glue leakage, glue shortage, bulging, etc., which will affect the bonding effect of the first plate 110 and the second plate 120.

[0043] In view of the above problems, the present application provides a limiting device, a bonding device and a bonding method to bond flat plates in a vertical state to improve the bonding effect.

[0044] See also Figure 3 , Figure 3 The schematic diagram of the structure of a position limiting device provided in an embodiment of the present application is as follows. The position limiting device comprises: a connecting member 210 and a base plate 220, wherein the connecting member 210 is connected to the base plate 220.

[0045] The connecting member 210 is used to connect with the first plate 110 .

[0046] The first flat plate 110 may be a fixed flat plate, such as a protective glass, a building curtain wall, etc., and the second flat plate 120 may be a display panel, etc. The above is only an example and should not be a limitation of the present application. In the actual bonding process, the first flat plate 110 and the second flat plate 120 may be any flat plates to be bonded. When the adhesive is injected into the cavity between the first flat plate 110 and the second flat plate 120, the adhesive will simultaneously generate an outward thrust on the first flat plate 110 and the second flat plate 120.

[0047] In this embodiment, during the bonding process, the limiting device can be fixedly connected to the first flat plate 110 using a connector 210. Thus, when the second flat plate 120 exerts a thrust on the limiting device, the limiting device can transmit the thrust to the first flat plate 110 through the connector 210. The first flat plate 110 is fixed, which can reduce the impact of the thrust to a certain extent. At the same time, the thrust can also offset the thrust of the adhesive on the first flat plate, reducing the impact of the adhesive on the first flat plate and the second flat plate, thereby maintaining the stability between the first flat plate 110, the second flat plate 120 and the spacer layer 130.

[0048] In this embodiment, the connection between the connecting member 210 and the first flat plate 110 is a detachable connection, that is, when laminating, the limiting device can be fixed on the first flat plate 110 through the connecting member 210, and before or after laminating, the limiting device and the first flat plate 110 are in a separated state.

[0049] Exemplarily, the connector 210 may be a clamping, magnetic, or other structure. The clamping device is disposed at both ends of the limiting device, and the clamping device may clamp both ends of the first flat plate 110, thereby achieving fixation of the limiting device on the first flat plate 110. The clamping device may be applicable to the case where the width of the first flat plate 110 is less than the width of the limiting device, and the thickness of the first flat plate 110 is less than the maximum clamping degree of the clamping device. The magnetic device may be a magnetic object, and the magnetic device may be magnetically connected to the first flat plate 110, or the magnetic device may include a first magnet fixedly connected to the substrate 220 and a separated second magnet. When in use, the first flat plate 110 may be disposed between the first magnet and the second magnet, thereby achieving fixed connection of the limiting device on the first flat plate 110 through the first magnet and the second magnet. The magnetic device may be applicable to the case where the first flat plate 110 is made of metal material, or the thickness of the first flat plate 110 is small, and the limiting device may be fixed by the first magnet and the second magnet.

[0050] In an optional embodiment, the connecting member 210 may include a plurality of suction cups, and different suction cups of the plurality of suction cups are respectively disposed at at least two ends of the substrate 220 .

[0051] When the surface to be bonded on the first flat plate 110 is a smooth surface, a suction cup can be used as a connecting member 210. There are at least two suction cups, which are respectively arranged at both ends of the substrate 220. After the suction cups abut against the smooth surface on the first flat plate 110 and the air in the suction cups is expelled, the suction cups generate suction on the first flat plate 110, thereby generating static friction on the first flat plate 110. The static friction can support the weight of the substrate 220. At the same time, when the substrate 220 is subjected to an outward force from the second flat plate 120, the outward force on the substrate 220 from the second flat plate 120 can be offset by the static friction.

[0052] Among them, the suction cup can be applied to any first flat plate 110 based on a smooth plane. Compared with magnetic attraction, there is no need to consider the material and thickness of the first flat plate 110. At the same time, compared with the clamping device, there is no need to consider the width of the first flat plate 110. The surface to be attached is usually a smooth plane. Therefore, the use of the suction cup as the connecting member 210 has a large application range. In addition, since the suction cup is usually made of flexible materials, such as rubber, resin, etc., it can effectively avoid defects such as scratches or extrusion injuries caused by the connecting member 210 to the first flat plate 110.

[0053] It can be understood that the above is only an example and should not be construed as a limitation to the present application. The connector 210 may also be in other forms, which will not be described in detail here.

[0054] The substrate 220 has a width greater than that of the second flat plate 120 and a height less than that of the second flat plate 120 ; the second flat plate 120 is a flat plate bonded to the first flat plate 110 ; the first surface of the substrate 220 abuts against a surface of the second flat plate 120 away from the first flat plate 110 .

[0055] In this embodiment, the substrate 220 is made of a material that is not easily deformed to avoid deformation due to external forces. For example, the substrate 220 can be made of high-strength hard aluminum, aluminum-magnesium alloy, etc. In some embodiments, since the gravity on the substrate 220 needs to be offset by the connector 210, it is also possible to consider using a material with a lighter density, or the substrate 220 can be a hollow structure made of a higher-strength material.

[0056] See also Figure 4 and Figure 5 , Figure 4 A schematic diagram of the use of a limiting device provided in an embodiment of the present application, Figure 5 A top view of a positioning device provided in an embodiment of the present application.

[0057] In this embodiment, the width of the substrate 220 is greater than the width of the second flat plate 120, and the substrate 220 can abut against all positions of the second flat plate 120 on the same horizontal plane, thereby better bearing the force of the second flat plate 120 pushing outward. The height of the substrate 220 is lower than the height of the second flat plate 120, so that the liquid level change of the liquid adhesive during the injection can be better observed, so that the injection process can be regulated according to the liquid level change.

[0058] In this embodiment, the substrate 220 can withstand the outward force of the second flat plate 120, and offset the force through the connecting member 210 with the substrate 220. The substrate 220 is a plate-like structure, and the substrate 220 has a first surface and a second surface. The first surface is used to abut against the second flat plate 120, and the second plane is a surface on the substrate 220 opposite to the first surface. By abutting the second flat plate 120 with the first surface, the outward force on the second flat plate 120 can be transmitted to the substrate 220, and the substrate 220 offsets the force through the connecting member 210, thereby maintaining the stability between the first flat plate 110 and the second flat plate 120.

[0059] In some embodiments, the first surface may be a flat surface to prevent defects on the first surface from causing scratches, crushing, and other defects to the second flat panel 120 .

[0060] In some embodiments, the limiting device may further include: a pad 221 covering the first surface; the pad 221 is made of a flexible material.

[0061] In this embodiment, the pad 221 covers the first surface, so that the pad 221 can abut against the second flat plate 120, thereby achieving indirect abutment between the first plane and the second flat plate 120. Since the pad 221 can be made of flexible materials such as silicone, rubber, and resin, and the substrate 220 is made of a relatively strong material, the pad 221 abuts against the second flat plate 120, which can effectively prevent the first plane from causing scratches, squeezing injuries, and other defects.

[0062] In one embodiment, a reinforcement structure 230 is disposed on the second surface of the substrate 220 , and the reinforcement structure 230 is used to improve the ability of the substrate 220 to withstand external pressure.

[0063] In this embodiment, the reinforcing structure 230 may be a reinforcing rib formed by milling and turning with the base plate 220, or a metal tube, a metal strip, etc. that is separately welded, riveted, or nailed to the base plate 220. The reinforcing structure 230 can improve the base plate 220's ability to withstand external pressure, thereby improving the base plate 220's ability to withstand the force of the second plate 120 pushing outward, reducing deformation, and further improving the stability between the first plate 110 and the second plate 120.

[0064] In one embodiment, the reinforcement structure 230 and the second surface form a groove, and a heating element is disposed in the groove.

[0065] The reinforcing structure such as reinforcing ribs, metal tubes, metal strips has a certain height. When the reinforcing structure is arranged on the substrate 220, the reinforcing structure 230 forms a groove with the second surface. In this embodiment, a heating element can be arranged in the groove, and the heating element can be a heating belt, a heating tube or a heating wire.

[0066] In some bonding scenarios, the adhesive used for the first plate 110 and the second plate 120 is a thermosetting adhesive. By providing a heating element, the adhesive in the cavity of the first plate 110 and the second plate 120 can be heated to reduce the curing time and improve the bonding efficiency.

[0067] In one embodiment, the limiting device further includes a fastening module 240 . The fastening module 240 is in contact with the second surface and is used to apply pressure to the substrate 220 .

[0068] like Figure 5 As shown, in this embodiment, the fastening module 240 includes a fixing member, a strip structure, and a pressure member for applying pressure to the substrate 220. The fixing member is fixedly connected to the substrate 220, and the strip structure is arranged parallel to the substrate 220, and the fixing member is fixedly connected to the strip structure. The pressure member is inserted into the strip structure, and the pressure member can control the pressure applied to the substrate 220 by inserting the length of the strip structure. The pressure member can be a strip structure that applies pressure to the sheet area on the substrate 220, or a conical structure that applies pressure to a point position on the substrate 220.

[0069] In this embodiment, after the fastening module 240 abuts against the second surface, it can apply pressure to the substrate 220. After the second surface is subjected to the pressure applied by the fastening module 240, it will apply pressure to the second flat plate 120, thereby making the structure between the first flat plate 110, the second flat plate 120, and the spacer layer 130 more stable, thereby reducing the influence of the adhesive and improving the bonding effect.

[0070] In one embodiment, the fastening module 240 may include: a plurality of fastening bolts, each fastening bolt abutting against a different position on the second surface.

[0071] In this embodiment, the pressure member that applies pressure may be a fastening bolt, which may abut against a certain position of the substrate 220, and then the pressure applied by the fastening bolt to the position on the substrate 220 may be controlled by tightening the fastening bolt. With multiple fastening bolts, each fastening bolt may apply pressure to a position on the substrate 220, thereby affecting the area around the position, and thus achieving the tightening of the substrate 220 as a whole. Using bolts as pressure members has a simple structure and low cost.

[0072] In this embodiment, when a plurality of fastening bolts are used to fasten the base, the liquid level of the adhesive can be observed. When the liquid level is about to change, it indicates that the fastening of the bolts to the base is complete.

[0073] In one embodiment, the limiting device further includes: a locking member 250; the connecting member 210 is connected to the second surface of the substrate 220 via the locking member 250, and the locking member 250 extends on the second surface.

[0074] like Figure 5 As shown, in this embodiment, the substrate 220 and the connecting member 210 are detachably mounted and connected via a retaining member 250. The retaining member 250 extends on the second surface of the substrate 220, so when the second flat plate 120 exerts a thrust on the substrate 220, the substrate 220 can transmit the thrust to the extension portion, and the extension portion transmits the thrust to the connecting member 210, thereby offsetting the thrust.

[0075] The retaining member 250 can prevent the substrate 220 from being deformed by the thrust of the second plate 120 after long-term use of the limiting device. The force exerted on the substrate 220 is fully transmitted to the retaining member 250. After long-term use, only the retaining member 250 can be replaced, thereby increasing the service life of the limiting device and reducing the cost.

[0076] In the embodiment of the present application, in the limiting device, the substrate 220 is connected to the connecting member 210. When the first flat plate 110 and the second flat plate 120 are bonded together, the connecting member 210 can be used to connect to the first flat plate 110 in a vertical state, and the substrate 220 abuts against the second flat plate 120. As a result, the thrust generated by the adhesive on the second flat plate 120 during glue injection will be transmitted to the substrate 220. The substrate transmits the thrust to the first flat plate 110 through the connection between the connecting member 210 and the first flat plate 110, and the thrust of the adhesive on the first flat plate 110 offsets the thrust of the adhesive on the second flat plate 120, thereby improving the stability of the structure when the first flat plate 110 and the second flat plate 120 are bonded together, thereby improving the bonding effect on the display panel.

[0077] Based on the same inventive concept, the embodiment of the present application further provides a bonding device, which includes: a limiting device and a glue injection device 300. The limiting device can be the limiting device provided in any of the above embodiments.

[0078] The glue injection device 300 is used to inject adhesive into the cavity formed between the first flat plate 110 and the second flat plate 120 to be bonded.

[0079] For example, the glue injection device 300 may include a glue storage barrel, a glue valve, and a needle, wherein the glue storage barrel is used to store the adhesive, the glue valve is used to control the output of the adhesive, and the needle is used to extend into the opening of the cavity so that the adhesive is output through the needle. It is understood that the above-mentioned glue injection device 300 is only an example and should not be a limitation of the present application.

[0080] Based on the same inventive concept, the embodiment of the present application also provides a bonding method, which is applied to the glue injection device 300 provided in the above embodiment.

[0081] See also Figure 7 , Figure 7 A flowchart of a bonding method provided in an embodiment of the present application, the bonding method comprising:

[0082] S110 , bonding the vertically placed first plate and the second plate 120 based on the spacer layer.

[0083] In this embodiment, the spacer layer 130 can be bonded to the side and bottom of the second flat plate 120 in a vertical state, so that a cavity is formed between the first flat plate 110 and the second flat plate 120. Alternatively, the spacer layer 130 material can be bonded to the four sides of the second flat plate 120 at the same time, and at least one opening is opened on the top side of the spacer layer 130. The spacer layer 130 has adhesiveness on both sides bonded to the first flat plate 110 and the second flat plate 120, so that the first flat plate 110 and the second flat plate 120 can be bonded.

[0084] S120, connecting the connecting piece of the limiting device to the first flat plate, and making the base plate of the limiting device abut against the second flat plate.

[0085] In this embodiment, a limiting device may be used to limit the glue injection process when the first flat plate 110 and the second flat plate 120 are attached.

[0086] by Figure 6 Taking the bonding device shown as an example, first, the second plate 120 is covered with a substrate, then the limiting device is fixed on the first plate 110 using a connector, and finally, pressure can be applied to the substrate by adjusting the fastening module so that the substrate and the second plate 120 are abutted.

[0087] The use of the above-mentioned limit device is only an example. For specific content, please refer to the content of the above-mentioned limit device, and no further details will be given here.

[0088] S130, injecting adhesive into the cavity using a glue injection device to bond the first flat plate to the second flat plate.

[0089] In this embodiment, after the limiting device limits the position of the second flat plate 120 , the cavity can be filled with adhesive by means of an adhesive injection device, and after the adhesive is cured, the first flat plate 110 and the second flat plate 120 are bonded together.

[0090] When injecting the adhesive, the fastening module of the limiting device can be adjusted to apply pressure to the second flat plate 120 to improve the stability between the second flat plate 120, the first flat plate 110 and the spacer layer 130. When adjusting the fastening module, the first surface and the gasket 221 can be adjusted to apply extrusion force to the second flat plate 120 by tightening the fastening bolts until the gaps at the front and rear walls of the cavity are roughly uniform and close to the thickness of the edge spacer layer 130.

[0091] In some embodiments, when injecting the adhesive, the injection can be performed in multiple times, and the multiple injection processes include: injecting a preset height of adhesive into the cavity; after the adhesive in the cavity is cured, moving the limit device upward to the next injection position, and injecting a preset height of adhesive again, repeating the above process until the cavity is filled with adhesive and the adhesive is cured, thereby completing the bonding of the first flat plate 110 and the second flat plate 120. At this time, the bonding equipment can be removed.

[0092] It can be understood that the bonding method provided in the present application corresponds to the use of the above-mentioned limiting device and bonding equipment, and will not be repeated here.

[0093] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0094] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

Claims

1. A limiting device, characterized in that: include: A connecting member, used to connect with a first plate; the first plate is a vertically arranged plate; a substrate connected to the connecting member, wherein the width of the substrate is greater than the width of the second flat plate, and the height of the substrate is lower than the height of the second flat plate; the second flat plate is a flat plate that is bonded to the first flat plate; the first surface of the substrate is in contact with the surface of the second flat plate on a side away from the first flat plate; There is a gap between the first flat plate and the second flat plate, and the gap is used to inject adhesive to make the first flat plate and the second flat plate fit together; The connecting member comprises a plurality of suction cups, and different suction cups among the plurality of suction cups are respectively arranged at at least two ends of the substrate; A reinforcement structure is provided on the second surface of the substrate, and the reinforcement structure is used to improve the substrate's ability to withstand external pressure; The limiting device further comprises: a fastening module; The fastening module abuts against the second surface, and the fastening module is used to apply pressure to the substrate.

2. The limiting device according to claim 1, characterized in that: The limiting device further comprises: a positioning member; The connecting member is connected to the second surface of the substrate through the locking member, and the locking member extends on the second surface; the second surface is a surface on the substrate opposite to the first surface.

3. The limiting device according to claim 1, characterized in that: The limiting device also includes: a pad covering the first surface; the pad is made of a flexible material.

4. The limiting device according to claim 1, characterized in that: The reinforcement structure and the second surface form a groove, and a heating element is arranged in the groove.

5. The limiting device according to claim 1, characterized in that: The fastening module includes: a plurality of fastening bolts, each of which abuts against a different position on the second surface.

6. A laminating device, characterized in that: include: The limiting device according to any one of claims 1 to 5; The glue injection device is used to inject adhesive between the cavity formed by the first flat plate and the second flat plate to be bonded.

7. A bonding method, characterized in that: Applied to the bonding device according to claim 6, the bonding method comprises: Bonding a first flat plate and a second flat plate placed vertically based on a spacer layer, wherein the spacer layer has a preset thickness and is adhesive, and the spacer layer is used to form a cavity having at least one opening between the first flat plate and the second flat plate; Connecting the connecting piece of the limiting device to the first flat plate, and making the base plate of the limiting device abut against the second flat plate; Adhesive is injected into the cavity based on the glue injection device to make the first flat plate and the second flat plate fit together.

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