LED display panel and manufacturing method thereof, LED display screen

Abstract

The present invention discloses an LED display panel and a manufacturing method thereof, and an LED display screen, wherein the LED display panel includes a substrate, a chipset of the substrate includes a first chip, a second chip, and a third chip arranged in sequence along a first direction, the first chip is connected to the substrate, at least the second chip and the third chip are arranged obliquely, the second chip and the first chip partially overlap, one end of the second chip is connected to a side of the first chip away from the substrate, the other end of the second chip is connected to the substrate, the third chip partially overlaps the second chip, one end of the third chip is connected to a side of the second chip away from the first chip, and the other end of the third chip is connected to the substrate. The first chip, the second chip, and the third chip are partially overlapped, so that the pixel density of the LED display panel can be improved, and the second chip and the third chip are arranged obliquely, so that the LED display panel can emit light obliquely, and the LED display panel can be applied to an LED display screen arranged at a high place.

Description

Technical Field

[0001] The present invention relates to the field of LED display technology, and in particular to an LED display panel, a method for manufacturing the LED display panel, and an LED display screen comprising the LED display panel. Background Art

[0002] With the advancement and development of display technology, LED display screens have the characteristics of higher resolution, smaller size and more precision. In order to obtain a higher resolution LED display screen, it is necessary to make the pixel density of the LED display screen as large as possible, but the pixel density of LED display screens manufactured under the existing production method has reached the limit. If a higher resolution display screen is required, a new structure is required.

[0003] In addition, when LED display screens are installed outdoors, they are mostly installed at high places, and people look up to watch them. The light-emitting surface of the LED chip in the existing LED display screen (that is, the normal plane is the direction of the maximum light intensity of the LED chip) is generally set horizontally. When people look up to watch, the light above the normal plane is in an unused state, and the larger the upward viewing angle, the darker the perceived brightness, and the worse people's viewing experience. Summary of the invention

[0004] An object of an embodiment of the present invention is to provide an LED display panel whose chipset occupies a small area and has a high pixel density.

[0005] Another object of an embodiment of the present invention is to provide a method for manufacturing an LED display panel, which has low production difficulty and high production efficiency.

[0006] Another object of the embodiments of the present invention is to provide an LED display screen with high resolution.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] In a first aspect, an LED display panel is provided, comprising a substrate, on which a plurality of chipsets are arranged, the chipsets comprising a first chip, a second chip and a third chip arranged in sequence along a first direction, the first chip being connected to the substrate, at least the second chip and the third chip being arranged at an angle, the second chip and the first chip partially overlapping, one end of the second chip being connected to a side of the first chip away from the substrate, the other end of the second chip being connected to the substrate, the third chip partially overlapping with the second chip, one end of the third chip being connected to a side of the second chip away from the first chip, and the other end of the third chip being connected to the substrate.

[0009] As a preferred solution for the LED display panel, the first chip is arranged obliquely, a bump is arranged on the substrate, one end of the first chip is connected to the bump, and the other end of the first chip is connected to the substrate.

[0010] As a preferred solution for the LED display panel, the first chip, the second chip and the third chip have the same inclination angle.

[0011] As a preferred solution of the LED display panel, the inclination angles of the first chip, the second chip and the third chip are 10° to 20°.

[0012] As a preferred solution of the LED display panel, the overlapping portion of the second chip and the first chip is a first overlapping portion, the size of the first overlapping portion along the first direction is L1, the size of the first chip along the first direction is L2, (1 / 3)L2≤L1≤(1 / 2)L2; and / or,

[0013] The overlapping portion of the third chip and the second chip is a second overlapping portion, a size of the second overlapping portion along the first direction is L3, a size of the second chip along the first direction is L4, and (1 / 3)L4≤L3≤(1 / 2)L4.

[0014] As a preferred solution of the LED display panel, the first chip is connected to the substrate via an adhesive layer; and / or,

[0015] The second chip is connected to the substrate and the first chip via an adhesive layer; and / or,

[0016] The third chip is connected to the substrate and the second chip through an adhesive layer.

[0017] As a preferred solution of the LED display panel, the substrate has a circuit structure, and the pads of the first chip, the second chip and the third chip are all electrically connected to the circuit structure;

[0018] As a preferred solution of the LED display panel, the pad of the second chip is arranged on a side of the second chip close to the substrate, and the pad on the second chip is located at an end of the second chip away from the first chip; and / or,

[0019] The pad of the third chip is arranged on a side of the third chip close to the substrate, and the pad on the third chip is located at an end of the third chip away from the second chip.

[0020] As a preferred solution of the LED display panel, the pads of the second chip and the third chip are electrically connected to the circuit structure through a connecting structure.

[0021] As a preferred solution of the LED display panel, a packaging layer is provided on the substrate, and the first chip, the second chip and the third chip are provided in the packaging layer.

[0022] As a preferred solution of the LED display panel, all the chip groups are arranged in a matrix on the substrate.

[0023] In a second aspect, a method for manufacturing an LED display panel is provided, which is used to manufacture the above-mentioned LED display panel, comprising the following steps:

[0024] Providing a plurality of first chips, second chips and third chips having an adhesive layer on one side thereof;

[0025] transferring the first chip, the second chip and the third chip to a carrier in sequence;

[0026] The bonding layer is subjected to a heating treatment so that the first chip, the second chip and the third chip are bonded together to form a chipset, wherein a plurality of the chipsets are arranged on the carrier at intervals;

[0027] Using packaging glue to package all the chipsets on the carrier to form a component;

[0028] separating the component from the carrier;

[0029] Etching the adhesive layer to expose the pads of the first chip, the second chip and the third chip in the component;

[0030] A substrate is formed on the component so that the pads of the first chip, the second chip and the third chip in the component are electrically connected to the circuit structure of the substrate.

[0031] As a preferred solution of the manufacturing method of the LED display panel, before the first chip is transferred to the carrier, a bump is first formed on the carrier, and then the first chip is transferred so that one end of the first chip is connected to the bump.

[0032] As a preferred solution of the method for manufacturing an LED display panel, before the first chip is transferred to the carrier, an anti-sticking film is provided on the side of the carrier on which the chip is mounted.

[0033] In a third aspect, an LED display screen is provided, comprising the above-mentioned LED display panel.

[0034] The beneficial effects of the present invention are as follows: partially overlapping the first chip, the second chip and the third chip can save the occupied area of ​​the chipset, which can improve the pixel density of the LED display panel, thereby improving the resolution of the LED display screen; stacking the second chip and the third chip at an angle can make the LED display panel emit light at an angle. When the LED display panel is applied to an LED display screen set at a high place, the brightest light-emitting surface of the LED display screen is fully utilized, thereby improving the visual brightness of the LED display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0036] Figure 1 A partial cross-sectional schematic diagram of an LED display panel according to an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of an LED display panel according to an embodiment of the present invention (the packaging layer is not shown);

[0038] Figure 3 is a schematic diagram of the first chip according to an embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram of an LED display panel according to another embodiment of the present invention (the packaging layer is not shown);

[0040] Figure 5 is a schematic diagram of the first chip and the carrier board according to an embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of the second chip and the third chip stacked on a carrier according to an embodiment of the present invention;

[0042] Figure 7 This is a schematic diagram of the adhesive layer after being heated and melted according to the embodiment of the present invention;

[0043] Figure 8 This is a schematic diagram of a chip set encapsulated by an encapsulation layer according to an embodiment of the present invention;

[0044] Fig. 9 This is a schematic diagram of forming a first channel on a component after removing the carrier according to an embodiment of the present invention;

[0045] Fig.10 This is a schematic diagram of a connection structure formed on a component according to an embodiment of the present invention;

[0046] Fig.11 A schematic diagram of forming a photoresist layer on a component according to an embodiment of the present invention;

[0047] Fig.12A schematic diagram of a circuit structure formed in a photoresist layer according to an embodiment of the present invention;

[0048] Fig.13 It is a schematic diagram of removing the photoresist layer and molding the substrate according to an embodiment of the present invention.

[0049] In the figure:

[0050] 100, substrate; 200, chipset;

[0051] 1. First chip; 101. Electrode; 102. Electrode; 2. Second chip; 3. Third chip; 4. Pad; 5. Carrier; 6. Anti-sticking film; 7. Bump; 8. Adhesive layer; 801. First channel; 9. Packaging layer; 10. Connection structure; 11. Photoresist layer; 12. Circuit structure; 13. Solder ball. DETAILED DESCRIPTION

[0052] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0053] like Figure 1 and Figure 2 As shown, an LED display panel provided by the present invention includes a substrate 100, on which a plurality of chipsets 200 are arranged. In this embodiment, the chipset 200 is an RGB chipset, and the chipset 200 includes a first chip 1, a second chip 2, and a third chip 3 arranged along a first direction. In this embodiment, the first direction is Figure 2 In the X direction, the first chip 1 is connected to the substrate 100, at least the second chip 2 and the third chip 3 are arranged obliquely, the second chip 2 and the first chip 1 are partially overlapped, one end of the second chip 2 is connected to a side of the first chip 1 away from the substrate 100, and the other end of the second chip 2 is connected to the substrate 100, the third chip 3 is partially overlapped with the second chip 2, one end of the third chip 3 is bonded to a side of the second chip 2 away from the first chip 1, and the other end of the third chip 3 is connected to the substrate 100.

[0054] The present invention also provides an LED display screen, which includes the above-mentioned LED display panel. Figure 2 , the chipsets 200 on the LED display panel are arranged in a matrix.

[0055] Partially overlapping the first chip 1, the second chip 2 and the third chip 3 can save the area occupied by the chipset 200, thereby increasing the pixel density of the LED display panel and thus increasing the resolution of the LED display screen; stacking the second chip 2 and the third chip 3 obliquely can make the LED display panel emit light at an angle. When the LED display panel is applied to an LED display screen set at a high place, the light-emitting surface of the LED display screen is fully utilized, thereby increasing the perceived brightness of the LED display screen.

[0056] Specifically, the first chip 1 is tilted, and a bump 7 is provided on the substrate 100. One end of the first chip 1 is connected to the bump 7, and the other end of the first chip 1 is connected to the substrate 100. At this time, the first chip 1, the second chip 2, and the third chip 3 are all tilted on the substrate 100, which further reduces the occupied area of ​​the chipset 200, improves the pixel density of the LED display panel, and thus improves the resolution of the LED display. In this embodiment, the material of the bump 7 is silicone. In other embodiments, other thermosetting viscous colloids can also be used. The bump 7 can be directly dispensed on the substrate 100, or it can be prefabricated and bonded to the substrate 100.

[0057] Specifically, the first chip 1, the second chip 2 and the third chip 3 have the same inclination angle, which can ensure the display effect of the LED display screen. Figure 1 , further, the tilt angle θ of the first chip 1, the second chip 2 and the third chip 3 is 10°~20°. When the tilt angles of the first chip 1, the second chip 2 and the third chip 3 are set to 10°~20°, the brightness standard of the LED display screen when people look up can be met. It should be noted that the tilt angles of the first chip 1, the second chip 2 and the third chip 3 can also be adaptively adjusted according to actual usage. When the LED display panel is applied to an LED display screen with a high installation height and a close viewing position, a larger tilt angle can be set, otherwise a smaller tilt angle can be set.

[0058] Specifically, the overlapping portion of the second chip 2 and the first chip 1 is the first overlapping portion, and the size of the first overlapping portion along the first direction is L1 (that is, the projection size of the first overlapping portion on the substrate 100 is L1), the size of the first chip 1 along the first direction is L2 (that is, the projection size of the first chip 1 on the substrate 100 is L2), (1 / 3)L2≤L1≤(1 / 2)L2, similarly, the overlapping portion of the third chip 3 and the second chip 2 is the second overlapping portion, the size of the second overlapping portion along the first direction is L3 (that is, the projection size of the second overlapping portion on the substrate 100 is L3), the size of the second chip 2 along the first direction is L4 (that is, the projection size of the second chip 2 on the substrate 100 is L4), (1 / 3)L4≤L3≤(1 / 2)L4, so that not only the stacking effect between the first chip 1, the second chip 2 and the third chip 3 can be guaranteed, but also the light-emitting surface of the first chip 1 will not be blocked by the second chip 2, and the light-emitting surface of the second chip 2 will not be blocked by the third chip 3.

[0059] Specifically, the first chip 1 is connected to the substrate 100 through the adhesive layer 8, the second chip 2 is connected to the substrate 100 and the first chip 1 through the adhesive layer 8, and the third chip 3 is connected to the substrate 100 and the second chip 2 through the adhesive layer 8. In the specific implementation, the adhesive layer 8 can be first set on one side of the first chip 1, the second chip 2, and the third chip 3. After the first chip 1, the second chip 2, and the third chip 3 are installed in place, they can be directly heated and fixed, thereby reducing the difficulty of connecting between the chips, thereby reducing the difficulty of making the LED display panel and improving the production efficiency of the LED display. In this embodiment, the material of the adhesive layer 8 can be a material that is easily dissolved by heating, such as paraffin, polyamide, polyester, polyurethane, or co-polyolefin.

[0060] Specifically, the substrate 100 has a circuit structure 12, and the pads 4 of the first chip 1, the second chip 2 and the third chip 3 are electrically connected to the circuit structure 12, so that the first chip 1, the second chip 2 and the third chip 3 can work normally.

[0061] Specifically, since the first chip 1, the second chip 2 and the third chip 3 are stacked, and the second chip 2 and the third chip 3 are tilted, in order to reduce the difficulty of connecting the pads 4 of the second chip 2 and the third chip 3 with the substrate 100, the pads 4 on the second chip 2 and the third chip 3 need to be set at specific positions. Figure 1, the pads 4 on the second chip 2 are arranged on the side of the second chip 2 close to the substrate 100, and the pads 4 on the second chip 2 are located at the end of the second chip 2 away from the first chip 1, that is, the pads 4 on the second chip 2 are spaced apart from the first chip 1, and the pads 4 on the third chip 3 are arranged on the side of the third chip 3 close to the substrate 100, and the pads 4 of the third chip 3 are located at the end of the third chip 3 away from the second chip 2, that is, the pads 4 on the third chip 3 are spaced apart from the second chip 2. Specifically, since the first chip 1 is also arranged at an angle, the pads 4 of the first chip 1 also need to be arranged at a specific position. In this embodiment, the pads 4 of the first chip 1 are arranged on the side of the first chip 1 close to the substrate 100, and the pads 4 on the first chip 1 are located at the end of the first chip 1 away from the bump 7, that is, the pads 4 on the first chip 1 are spaced apart from the bump 7. It should be noted that since the pads 4 of the first chip 1, the second chip 2 and the third chip 3 need to be arranged at specific positions, in specific implementation, the pads 4 of the first chip 1, the second chip 2 and the third chip 3 can be formed by the redistribution layer technology, refer to Figure 3 Taking the first chip 1 as an example, the first chip 1 can use the redistribution layer technology to electrically connect the electrodes 101 and 102 of the first chip 1 with the pad 4.

[0062] Specifically, due to the particularity of the setting positions of the pads 4 of the first chip 1, the second chip 2 and the third chip 3, in the specific implementation, the pads 4 of the first chip 1, the second chip 2 and the third chip 3 are not close to the substrate 100, so the pads 4 of the first chip 1, the second chip 2 and the third chip 3 need to be electrically connected to the circuit structure 12 of the substrate 100 through the connecting structure 10. In this embodiment, in order to improve the stability of the connection between the pads 4 of the chipset 200 and the circuit structure 12 of the substrate 100, the connecting structure 10 can be formed by sequentially depositing titanium, copper, or titanium tungsten and copper. Titanium or titanium tungsten can block the diffusion of copper ions into the chip while increasing the adhesion of copper.

[0063] Specifically, a packaging layer 9 is also disposed on the substrate 100, and the first chip 1, the second chip 2 and the third chip 3 are disposed in the packaging layer 9, and the packaging layer 9 is used to seal and protect the chips. In this embodiment, the material of the packaging layer 9 can be silica gel, epoxy resin or silicone resin.

[0064] It should be noted that in order to reduce the difficulty of connecting the substrate 100 with the external circuit, a solder ball 13 can also be provided on the side of the substrate 100 away from the chipset 200. The circuit structure 12 of the substrate 100 is electrically connected to the external circuit through the solder ball 13, thereby providing a driving signal for the LED display panel.

[0065] Reference Figure 4In another embodiment, the chipset 200 in the LED display panel further includes a first chip 1, a second chip 2 and a third chip 3 arranged in sequence along the second direction, and the first direction and the second direction are symmetrically arranged, that is, the second direction is Figure 4 In the opposite direction of the X direction, at this time, the LED display panel has a symmetry axis perpendicular to the X direction, and the first chip 1, the second chip 2 and the third chip 3 in the chipset 200 located on both sides of the symmetry axis have different inclination directions. Figure 4 , the chip on the left side of the symmetry axis is tilted toward the first direction, and the chip on the right side of the symmetry axis is tilted toward the second direction. In actual use, the audience is generally facing the LED display screen, and the chipsets 200 on both sides of the symmetry axis of the LED display panel are symmetrically arranged. The chipsets 200 tilted toward the second direction can compensate for the light emitted by the chipsets 200 tilted in the first direction, thereby achieving uniform distribution of light, so that the audience can see the same effect on the left and right pictures of the LED display screen. Of course, in this embodiment, the tilt directions of all the chips in the chipsets 200 can be consistent, refer to Figure 2 That is to say, the chipset 200 is arranged in a matrix on the substrate 100, and the tilt direction of the chips in the chipset 200 can be designed according to actual needs.

[0066] Reference Figures 5 to 13 as well as Figure 1 and Figure 2 This embodiment also provides a method for manufacturing an LED display panel, providing a plurality of first chips 1, second chips 2 and third chips 3 each having an adhesive layer 8 on one side thereof, for manufacturing the above-mentioned LED display panel, comprising the following steps:

[0067] Step 100, sequentially transferring the first chip 1, the second chip 2 and the third chip 3 to a carrier board 5;

[0068] Step 200, heating the bonding layer 8 to bond the first chip 1, the second chip 2 and the third chip 3 to form a chipset 200, wherein a plurality of chipsets 200 are arranged at intervals on the carrier 5;

[0069] Step 300: Use packaging glue to package all the chipsets 200 on the carrier board 5 to form a component;

[0070] Step 400, separating the component and the carrier board 5;

[0071] Step 500, etching the adhesive layer 8 to expose the pads 4 of the first chip 1, the second chip 2 and the third chip 3 in the assembly;

[0072] Step 600 , forming a substrate 100 on the assembly so that the pads 4 of the first chip 1 , the second chip 2 and the third chip 3 in the assembly are electrically connected to the circuit structure 12 of the substrate 100 .

[0073] Since the chipset 200 is relatively small, that is, the area and weight of the first chip 1, the second chip 2 and the third chip 3 are relatively small, only a relatively small bonding strength is required to fix the first chip 1, the second chip 2 and the third chip 3. Therefore, the thickness of the bonding layer 8 can be made thin. At this time, heating and melting the bonding layer 8 will not affect the positional relationship between the first chip 1, the second chip 2 and the third chip 3.

[0074] Specifically, in order to tilt the first chip 1, step 100 includes:

[0075] Step 101, forming a bump 7 on one side of a carrier board 5;

[0076] Step 102, transfer the first chip 1, the second chip 2 and the third chip 3 to a carrier board 5 in sequence, so that one end of the first chip 1 is connected to the bump 7, and the other end of the first chip 1 is connected to the carrier board 5, so that one end of the second chip 2 is connected to the first chip 1, and the other end of the second chip 2 is connected to the carrier board 5, so that one end of the third chip 3 is connected to the second chip 2, and the other end of the third chip 3 is connected to the carrier board 5.

[0077] Specifically, in order to facilitate the separation of the component and the carrier 5, an anti-adhesion film 6 is further provided on the side of the carrier 5 for mounting the chip, which can reduce the difficulty of separation between the component and the carrier 5 and avoid damage to the chip caused by the separation operation. In a specific implementation, the anti-adhesion film 6 can be provided on the side of the carrier 5 for mounting the chip before the bumps 7 are formed on the carrier 5. In this embodiment, the anti-adhesion film 6 is a PET (polyester resin) film.

[0078] Accordingly, step 400 includes:

[0079] Step 401 : Use external mechanical force to separate the component from the carrier 5 and the release film 6 .

[0080] Specifically, since the pads 4 of the first chip 1, the second chip 2, and the third chip 3 are electrically connected to the circuit structure 12 of the substrate 100, in order to reduce the difficulty of connecting the pads 4 to the circuit structure 12 of the substrate 100, in this embodiment, the pads 4 of the first chip 1, the second chip 2, and the third chip 3 are electrically connected to the circuit structure 12 of the substrate 100 through the connection structure 10. In this embodiment, step 500 includes:

[0081] Step 501, etching the corresponding adhesive layer 8 on the pads 4 of the first chip 1, the second chip 2 and the third chip 3 in the component to form a first channel 801 to expose the positions of the pads 4 of the first chip 1, the second chip 2 and the third chip 3, and filling the first channel 801 with conductive material to form a connection structure 10.

[0082] Specifically, in order to improve the stability of the connection between the pad 4 of the chipset 200 and the circuit structure 12 of the substrate 100, the connection structure 10 can be formed by sequentially depositing titanium, copper, or titanium tungsten and copper into the first channel 801. Titanium or titanium tungsten can block the diffusion of copper ions into the chip while increasing the adhesion of copper.

[0083] Specifically, this embodiment uses the redistribution layer technology to form the substrate 100, which can reduce the difficulty of connecting the chipset 200 with the circuit structure 12 of the substrate 100. In this embodiment, step 600 includes:

[0084] Step 601, placing the component into a mold, injecting negative photoresist into the mold, and forming a photoresist layer 11 on a side of the component away from the chipset;

[0085] Step 602, forming a second channel by etching the photoresist layer 11 through exposure, development and filling the second channel with metal to form a circuit structure 12, so that the circuit structure 12 and the connection structure 10 are connected;

[0086] Step 603, removing the remaining photoresist layer 11;

[0087] Step 604 : Add filler into the mold to form the substrate 100 .

[0088] In this embodiment, the filler is silicon dioxide.

[0089] Specifically, in order to reduce the difficulty of connecting the substrate 100 with the external circuit and provide a driving signal for the LED display panel, in this embodiment, after step 600, the following steps are further provided:

[0090] Step 700: soldering a solder ball 13 on a side of the substrate 100 away from the chipset 200. The solder ball 13 is electrically connected to the circuit structure 12 of the substrate 100. The solder ball 13 is used to connect to an external circuit to provide a driving signal for the LED display panel.

Claims

1. An LED display panel, comprising a substrate, on which a plurality of chipsets are arranged, wherein the chipsets include a first chip, a second chip and a third chip arranged in sequence along a first direction, wherein: The first chip is connected to the substrate, at least the second chip and the third chip are arranged at an angle, the second chip and the first chip partially overlap, one end of the second chip is connected to a side of the first chip away from the substrate, and the other end of the second chip is connected to the substrate, the third chip partially overlaps with the second chip, one end of the third chip is connected to a side of the second chip away from the first chip, and the other end of the third chip is connected to the substrate.

2. The LED display panel according to claim 1, characterized in that: The first chip is arranged obliquely, a bump is arranged on the substrate, one end of the first chip is connected to the bump, and the other end of the first chip is connected to the substrate.

3. The LED display panel according to claim 2, characterized in that: The first chip, the second chip and the third chip have the same inclination angle.

4. The LED display panel according to claim 3, characterized in that: The inclination angles of the first chip, the second chip and the third chip are 10° to 20°.

5. The LED display panel according to claim 1, characterized in that: The overlapping portion of the second chip and the first chip is a first overlapping portion, the size of the first overlapping portion along the first direction is L1, the size of the first chip along the first direction is L2, (1 / 3)L2≤L1≤(1 / 2)L2; and / or, The overlapping portion of the third chip and the second chip is a second overlapping portion, a size of the second overlapping portion along the first direction is L3, a size of the second chip along the first direction is L4, and (1 / 3)L4≤L3≤(1 / 2)L4.

6. The LED display panel according to claim 1, characterized in that: The first chip is connected to the substrate via an adhesive layer; and / or, The second chip is connected to the substrate and the first chip via an adhesive layer; and / or, The third chip is connected to the substrate and the second chip through an adhesive layer.

7. The LED display panel according to claim 1, characterized in that: The substrate has a circuit structure, and the pads of the first chip, the second chip and the third chip are all electrically connected to the circuit structure.

8. The LED display panel according to claim 7, characterized in that: The pad of the second chip is arranged on a side of the second chip close to the substrate, and the pad on the second chip is located at an end of the second chip away from the first chip; and / or, The pad of the third chip is arranged on a side of the third chip close to the substrate, and the pad on the third chip is located at an end of the third chip away from the second chip.

9. The LED display panel according to claim 7, characterized in that: The pads of the second chip and the third chip are electrically connected to the circuit structure through a connection structure.

10. The LED display panel according to claim 1, characterized in that: A packaging layer is disposed on the substrate, and the first chip, the second chip and the third chip are disposed in the packaging layer.

11. The LED display panel according to any one of claims 1 to 10, characterized in that: All the chip groups are arranged in a matrix on the substrate.

12. A method for manufacturing an LED display panel, characterized in that: The method for manufacturing the LED display panel according to any one of claims 1 to 11 comprises the following steps: Providing a plurality of first chips, second chips and third chips having an adhesive layer on one side thereof; transferring the first chip, the second chip and the third chip to a carrier in sequence; The bonding layer is subjected to a heating treatment so that the first chip, the second chip and the third chip are bonded together to form a chipset, wherein a plurality of the chipsets are arranged on the carrier at intervals; Using packaging glue to package all the chipsets on the carrier to form a component; separating the component from the carrier; Etching the adhesive layer to expose the pads of the first chip, the second chip and the third chip in the component; A substrate is formed on the component so that the pads of the first chip, the second chip and the third chip in the component are electrically connected to the circuit structure of the substrate.

13. The method for manufacturing an LED display panel according to claim 12, characterized in that: Before the first chip is transferred to the carrier, a bump is formed on the carrier, and then the first chip is transferred so that one end of the first chip is connected to the bump.

14. The method for manufacturing an LED display panel according to claim 12, characterized in that: Before the first chip is transferred to the carrier, an anti-sticking film is provided on a side of the carrier on which the chip is mounted.

15. An LED display screen, characterized in that: Comprising the LED display panel as claimed in any one of claims 1 to 11.

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