Display device

Abstract

To achieve the above-mentioned object, according to one aspect of the present disclosure, a display device includes: a substrate, the substrate includes an active area and an inactive area, the inactive area extends from the active area and includes a pad area, the substrate is formed of a transparent conductive oxide or an oxide semiconductor; a plurality of inorganic insulating layers arranged on the substrate; a dam member, the dam member has one end arranged on the pad area and another end arranged outside the substrate; and a plurality of flexible films, the plurality of flexible films are arranged to cover the dam member and have one end arranged in the pad area. Therefore, a dam member covering the pad area is formed to minimize cracks in the plurality of inorganic insulating layers at the edge of the substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2021-0139772, filed on October 19, 2021, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device in which a plastic substrate is removed to improve reliability of a pad region and at the same time improve flexibility. Background Art

[0004] As display devices used for displays of computers, televisions, or mobile phones, there are organic light emitting display devices (OLEDs) that are self-luminous devices and liquid crystal display devices (LCDs) that require a separate light source.

[0005] The application range of the display device is diversified to personal digital assistants as well as monitors of computers and televisions, and display devices having a large display area and reduced volume and weight are being studied.

[0006] Furthermore, recently, a flexible display device has been attracting attention as a next-generation display device, which is manufactured by forming a display element and wiring on a flexible substrate so as to be able to display an image even if the display device is folded or rolled. Summary of the invention

[0007] An object to be achieved by the present disclosure is to provide a display device using one of a transparent conductive oxide layer and an oxide semiconductor layer as a substrate instead of a plastic substrate.

[0008] Another object to be achieved by the present disclosure is to provide a display device that minimizes cracks generated in a plurality of inorganic insulating layers in a pad region.

[0009] Still another object to be achieved by the present disclosure is to provide a display device in which an uncured portion of a sealing member in a pad region is removed.

[0010] Still another object to be achieved by the present disclosure is to provide a display device that minimizes scattering of a substrate in a pad region.

[0011] Still another object to be achieved by the present disclosure is to provide a display device in which a temporary substrate attached under a substrate and the substrate are easily separated when manufacturing the display device.

[0012] Still another object to be achieved by the present disclosure is to provide a display device that minimizes laser lift off (LLO) process failure of a temporary substrate and a substrate due to overflow of a sealing member and a conductive adhesive member to the outside of the substrate when manufacturing the display device.

[0013] Still another object to be achieved by the present disclosure is to provide a display device that removes a plastic substrate to simplify the process and reduce manufacturing costs.

[0014] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above can be clearly understood by those skilled in the art through the following description.

[0015] To achieve the above-mentioned object, according to one aspect of the present disclosure, a display device includes: a substrate, the substrate including an active area and an inactive area, the inactive area extending from the active area and including a pad area, the substrate being formed of any one of a transparent conductive oxide or an oxide semiconductor; a plurality of inorganic insulating layers disposed on the substrate; a dam member having one end disposed on the pad area and another end disposed beyond the end of the substrate; and a plurality of flexible films disposed to cover the dam member and having one end disposed in the pad area. Therefore, a dam member covering the pad area is formed to minimize cracks in the plurality of inorganic insulating layers at the edge of the substrate.

[0016] In order to achieve the above-mentioned purpose, according to another aspect of the present disclosure, a display device includes: a substrate including a plurality of first regions provided with a plurality of pads and a plurality of second regions located between the plurality of first regions, the substrate being formed of any one of a transparent conductive oxide and an oxide semiconductor; a plurality of inorganic insulating layers provided between the substrate and the plurality of pads; a dam member covering the edge of the substrate in the plurality of first regions and the plurality of second regions; a plurality of flexible films provided on the dam member and electrically connected to the plurality of pads; and a plurality of conductive adhesive members provided between the plurality of pads and the plurality of flexible films, a portion of the dam member being provided on the substrate, and the remaining portion of the dam member being provided to extend beyond one end of the substrate. Thus, a dam member covering the edge of the substrate is formed to support the plurality of inorganic insulating layers located in the pad region.

[0017] In another embodiment of the present disclosure, a display device includes: a substrate formed of a transparent conductive oxide or an oxide semiconductor, the substrate including an active area and an inactive area, the inactive area extending from the active area and including a pad area; a plurality of inorganic insulating layers arranged on the substrate; a plurality of flexible films arranged in the pad area; a plurality of pads arranged in the pad area; a plurality of conductive adhesive members arranged between the plurality of pads and the plurality of flexible films; and a dam member, the dam member including at least a first portion and a second portion, the first portion being arranged and extending in a first direction away from at least one of the inorganic insulating layers in the pad area, and the second portion extending away from the first portion and the pad in a second direction intersecting the first direction.

[0018] Additional details of example implementations are included in the detailed description and the accompanying drawings.

[0019] According to the present disclosure, in a manufacturing process of a display device, a conductive adhesive member overflows to cover a pad region, thereby supporting a plurality of inorganic insulating layers disposed on the pad region and minimizing crack defects.

[0020] According to the present disclosure, during the manufacturing process of the display device, the sealing member overflows to completely cover the region between the pads, thereby supporting the plurality of inorganic insulating layers in the region between the pads and minimizing crack defects.

[0021] According to the present disclosure, a dam is formed between the overflowed conductive member and the sealing member and the temporary substrate to easily separate the substrate from the temporary substrate.

[0022] According to the present disclosure, a dam portion protruding outward from a pad region is provided to support a plurality of flexible films provided outside of a substrate.

[0023] According to the present disclosure, a portion of the substrate exposed from the sealing member and the conductive adhesive member is removed in advance to minimize substrate flying defects.

[0024] According to the present disclosure, a sealing member that completely covers the pad region is formed to minimize bending or crack defects of the pad region.

[0025] According to the present disclosure, the conductive adhesive member overflows to the outside of the substrate more than the sealing member, and thus it is possible to minimize the defect that the sealing member penetrates into the empty space under the plurality of flexible films and is not cured.

[0026] According to the present disclosure, the belt portion is formed in the empty space between the plurality of flexible films and the dam portion to minimize the defect that the sealing member penetrates into the empty space under the plurality of flexible films and is not cured.

[0027] According to the present disclosure, a thin transparent conductive oxide layer and an oxide semiconductor layer are used as a substrate of a display device to improve the flexibility of the display device.

[0028] According to the present disclosure, a transparent conductive oxide layer and an oxide semiconductor layer are used as a substrate of a display device to simplify the structure of the display device and reduce manufacturing costs.

[0029] According to the present disclosure, a transparent conductive oxide layer and an oxide semiconductor layer are used as a substrate of a display device to reduce the generation of static electricity and improve display quality.

[0030] According to the present disclosure, a substrate of a display device is manufactured through a deposition process in a vacuum environment, thereby shortening the substrate manufacturing time and minimizing foreign matter formed on the substrate and defects generated thereby.

[0031] The effects according to the present disclosure are not limited to the above-mentioned examples, and the present application includes more various effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0033] Figure 1 is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0034] Figure 2 is a cross-sectional view of a sub-pixel of a display device according to an exemplary embodiment of the present disclosure;

[0035] Figure 3 is along Figure 1 A cross-sectional view taken along line III-III';

[0036] Figure 4 is along Figure 1 A cross-sectional view taken along line IV-IV';

[0037] FIG. 5A to FIG. 5G is a process flow chart for explaining a method for manufacturing a display device according to an exemplary embodiment of the present disclosure;

[0038] Figure 6 is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure; and

[0039] Figure 7 is a cross-sectional view of a display device according to still another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] The advantages and features of the present disclosure and the methods for achieving these advantages and features will become clear by referring to the exemplary embodiments described in detail below and the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure. Therefore, the present disclosure will be limited only by the scope of the appended claims.

[0041] The shapes, sizes, ratios, angles, quantities, etc. shown in the accompanying drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the application, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, the detailed description of known related technologies may be omitted to avoid making the subject matter of the present disclosure unnecessarily obscure. Terms such as "including", "having" and "comprising" used herein are generally intended to allow the addition of other elements unless the term is used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0042] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0043] When terms such as “on,” “above,” “below,” and “next” are used to describe the positional relationship between two elements, one or more elements may be located between the two elements unless terms with “immediately” or “directly” are used.

[0044] When an element or a layer is referred to as being “on” another element or layer, the other element or layer may be directly on the element or layer, or other layers or other elements may be interposed therebetween.

[0045] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of the present disclosure, the first component to be mentioned below may be the second component.

[0046] Throughout the application, like reference numerals generally refer to like elements.

[0047] The size and thickness of each element are shown in the drawings for convenience of description, and the present disclosure is not limited to the size and thickness of the shown components.

[0048] The features of the various embodiments of the present disclosure may be combined or coupled with each other in part or in whole, and may be related and operated with each other in technically different ways, and the embodiments may be performed independently or in association with each other.

[0049] Hereinafter, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0050] Figure 1 is a plan view of a display device according to an exemplary embodiment of the present disclosure. Figure 1 , for convenience of description, among the components of the display device 100 , only the substrate 110 , the dam member 130 , the conductive adhesive member 140 , and the plurality of flexible films 150 are illustrated.

[0051] Reference Figure 1 The substrate 110 is a supporting member that supports other components of the display device 100. The substrate 110 may be formed of any one of a transparent conductive oxide and an oxide semiconductor. For example, the substrate 110 may be formed of a transparent conductive oxide (TCO) such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO).

[0052] In addition, the substrate 110 may be formed of an oxide semiconductor material formed of indium and gallium (Ga), for example, a transparent oxide semiconductor such as indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), and indium tin zinc oxide (ITZO). However, the material types of the transparent conductive oxide and the oxide semiconductor are illustrative, so that the substrate 110 may be formed of another transparent conductive oxide and oxide semiconductor material not described in the present application, but is not limited thereto.

[0053] In addition, the substrate 110 can be formed by depositing a transparent conductive oxide or an oxide semiconductor having a very thin thickness. Therefore, when the substrate 110 is formed to have a very thin thickness, the substrate 110 has flexibility. The display device 100 including the substrate 110 having flexibility can be implemented as a flexible display device 100 that can display an image even in a folded or rolled state. For example, when the display device 100 is a foldable display device, the substrate 110 is folded or unfolded relative to the folding axis. As another example, when the display device 100 is a rollable display device, the display device 100 can be stored by rolling around the scroll. Therefore, the display device 100 according to the exemplary embodiment of the present disclosure uses a flexible substrate 110 to implement a flexible display device 100 like a foldable display device or a rollable display device.

[0054] In addition, the display device 100 according to the exemplary embodiment of the present disclosure uses the substrate 110 formed of a transparent conductive oxide or an oxide semiconductor to perform a laser lift-off (LLO) process. The LLO process refers to a process of separating a temporary substrate under the substrate 110 from the substrate 110 using a laser during the manufacturing process of the display device 100. Therefore, the substrate 110 is a layer that is easier to perform the LLO process, and is thus referred to as a functional film, a functional film layer, or a functional substrate. The LLO process will be described in more detail below.

[0055] The substrate 110 includes an active area AA and a non-active area NA.

[0056] The active area AA is an area where an image is displayed. In the active area AA, a plurality of sub-pixels SP may be arranged to display an image. For example, the active area AA is composed of a plurality of sub-pixels SP including a light emitting diode and a driving circuit to display an image.

[0057] The non-active area NA is an area where no image is displayed, and various wirings and driver ICs for driving the sub-pixels SP disposed in the active area AA are disposed. For example, various driver ICs such as a gate driver IC and a data driver IC may be disposed in the non-active area NA. Figure 1 In the description, it is described that the non-active area NA surrounds the active area AA, but the non-active area NA may extend from a portion of the active area AA, but is not limited thereto.

[0058] The non-active area NA includes a pad area PA including a plurality of first areas A1 and a plurality of second areas A2. The pad area PA is the non-active area NA in which a plurality of pads are disposed so that a plurality of flexible films 150 are bonded.

[0059] The plurality of first areas A1 of the pad area PA are areas where a plurality of pads are disposed. The plurality of first areas A1 are areas where a plurality of flexible films 150 are bonded and overlapped with the plurality of flexible films 150 .

[0060] The plurality of second areas A1 of the pad area PA are areas between the plurality of first areas A1 . The plurality of second areas A2 are areas between the plurality of pads and areas between the plurality of flexible films 150 .

[0061] In addition, even in Figure 1 , the pad area PA is the non-active area NA corresponding to one side of the active area AA, but the number of the pad areas PA and the positions thereof may be changed according to the design and are not limited thereto.

[0062] A plurality of flexible films 150 are disposed on the substrate 110. One end of the plurality of flexible films 150 is bonded to a plurality of pads disposed in the pad area PA of the substrate 110. The plurality of flexible films 150 are films in which various components are disposed on a base film having ductility to provide signals to the active area AA. One end of the plurality of flexible films 150 is disposed in the non-active area NA of the substrate 110 to provide a data voltage to the active area AA. In addition, although the plurality of flexible films 150 are shown to be two in the drawings, the number of the plurality of flexible films 150 may be changed according to the design, but is not limited thereto.

[0063] In addition, a driver IC such as a gate driver IC or a data driver IC may be provided on the plurality of flexible films 150. The driver IC is a component that processes data for displaying an image and a drive signal for processing the data. Depending on the mounting method, the driver IC may be provided by a chip on glass (COG), a chip on film (COF), or a tape carrier package (TCP) technology. In the present application, for ease of description, it is described that the driver IC is mounted on the plurality of flexible films 150 in a chip on film manner, but is not limited thereto.

[0064] A conductive adhesive member 140 is disposed between the plurality of flexible films 150 and the substrate 110. The plurality of flexible films 150 and the plurality of pads may be electrically connected to each other via the conductive adhesive member 140. The conductive adhesive member 140 may be a conductive adhesive layer, for example, an anisotropic conductive film (ACF), but is not limited thereto.

[0065] At this time, the conductive adhesive member 140 overflows outward from the substrate 110 so that a portion thereof is disposed on the dam member 130. One end of the conductive adhesive member 240 covers the plurality of first areas A1, and the other end covers a portion of the dam member 130 disposed outside the substrate 110. The conductive adhesive member 140 overflows outward from the substrate 110 to cover a portion of the dam member 130 disposed outside the substrate 110.

[0066] The dam member 130 is disposed under the plurality of flexible films 150. One end of the dam member 130 is disposed on the pad area PA of the substrate 110, and the other end is disposed outside the substrate 110 to support the plurality of flexible films 150 and portions of the conductive adhesive member 140. During the manufacturing process of the display device 100, the dam member 130 minimizes the overflowing sealing member 160 from penetrating under the plurality of flexible films 150 and not being cured, so as to suppress cracks in the plurality of inorganic insulating layers disposed on the pad area PA. FIG. 5A to FIG. 5G To describe this.

[0067] In addition, in the display device 100 according to the exemplary embodiment of the present disclosure, the insulating layer supporting the plurality of flexible films 150 and the conductive adhesive member 140 is referred to as a dam member 130. However, the dam member 130 may be referred to as a first dam portion, but is not limited thereto.

[0068] Figure 2 is a cross-sectional view of a sub-pixel of a display device according to an exemplary embodiment of the present disclosure. Figure 3 is along Figure 1 A cross-sectional view taken along line III-III'. Figure 4 is along Figure 1 For ease of description, Figure 2 The packaging unit 120 is omitted. Figures 2 to 4 A display device 100 according to an exemplary embodiment of the present disclosure includes a substrate 110, a plurality of inorganic insulating layers IL, a gate insulating layer GI, a planarization layer 114, a dam 115, a transistor TR, a light emitting diode OLED, a connection line LL, a pad PE, an encapsulation unit 120, a dam member 130, a conductive adhesive member 140, a flexible film 150, and a sealing member 160.

[0069] Reference Figure 2 and Figure 3 , a plurality of inorganic insulating layers IL are disposed on the substrate 110 . The plurality of inorganic insulating layers IL include a first inorganic insulating layer 111 , a second inorganic insulating layer 112 , and a third inorganic insulating layer 113 .

[0070] The first inorganic insulating layer 111 is disposed on the substrate 110. The first inorganic insulating layer 111 suppresses the diffusion of moisture and / or oxygen that penetrate from the outside of the substrate 110. The moisture permeation characteristics of the display device 100 can be controlled by controlling the thickness or lamination structure of the first inorganic insulating layer 111. In addition, the first inorganic insulating layer 111 can suppress the short circuit problem caused when the substrate 110 formed of a transparent conductive oxide or an oxide semiconductor contacts the transistor TR or various wirings. The first inorganic insulating layer 111 may be formed of an inorganic material, for example, the first inorganic insulating layer 111 may be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0071] The second inorganic insulating layer 112 is disposed on the first inorganic insulating layer 111. The second inorganic insulating layer 112 can reduce the penetration of moisture or impurities through the substrate 110. In this case, the second inorganic insulating layer 112 can be referred to as a buffer layer. For example, the second inorganic insulating layer 112 can be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. In addition, depending on the type of the substrate 110 or the configuration of the sub-pixel SP, the second inorganic insulating layer 112 can be omitted, but is not limited thereto.

[0072] The third inorganic insulating layer 113 is disposed on the second inorganic insulating layer 112. The third inorganic insulating layer 113 may be disposed to insulate a plurality of structures disposed in the active area AA. For example, in the active area AA, a plurality of transistors TR may be disposed, and the third inorganic insulating layer 113 may be disposed to insulate the gate electrodes GE of the plurality of transistors TR from the active layer ACT, or to insulate the gate electrodes GE from the source electrode SE and the drain electrode DE. In addition, the third inorganic insulating layer 113 is disposed to insulate a plurality of wirings from various electrodes. In this case, the third inorganic insulating layer 113 may be referred to as an interlayer insulating layer or a passivation layer. For example, the third inorganic insulating layer 113 may be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0073] In addition, in the present application, it is described that the plurality of inorganic insulating layers IL include the first inorganic insulating layer 111, the second inorganic insulating layer 112, and the third inorganic insulating layer 113. However, in addition to the first inorganic insulating layer 111, the second inorganic insulating layer 112, and the third inorganic insulating layer 113, the plurality of inorganic insulating layers IL may further include an inorganic insulating layer disposed between the transistor TR and the planarization layer 114. However, it is not limited thereto.

[0074] The light shielding layer LS is disposed on the first inorganic insulating layer 111. The light shielding layer LS is disposed to overlap with the active layer ACT of the transistor TR to block light incident on the active layer ACT. When light is irradiated onto the active layer ACT, leakage current is generated, which reduces the reliability of the transistor TR. At this time, if the light shielding layer LS composed of an opaque conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr) or an alloy thereof is disposed to overlap the active layer ACT, light incident on the active layer ACT from the lower part of the substrate 110 can be blocked. Therefore, the reliability of the transistor TR can be improved. However, depending on the type of the transistor TR, the light shielding layer LS can be omitted, but is not limited thereto. In addition, even if the light shielding layer LS is shown as a single layer, the light shielding layer LS can also be formed as a plurality of light shielding layers LS overlapping with a plurality of inorganic insulating layers IL therebetween.

[0075] The transistor TR is disposed on the second inorganic insulating layer 112. The transistor TR disposed in each of the plurality of sub-pixels SP may be used as a driving element of the display device 100. For example, the transistor TR may be a thin film transistor (TFT), an N-channel metal oxide semiconductor (NMOS) transistor, a P-channel metal oxide semiconductor (PMOS) transistor, a complementary metal oxide semiconductor (CMOS) transistor, or a field effect transistor FET, but is not limited thereto. Hereinafter, it is assumed that the plurality of transistors TR are thin film transistors, but are not limited thereto.

[0076] The transistor TR includes an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0077] First, the active layer ACT is disposed on the second inorganic insulating layer 112. The active layer ACT may be formed of a semiconductor material such as an oxide semiconductor, amorphous silicon, or polysilicon, but is not limited thereto.

[0078] The gate insulating layer GI and the gate electrode GE are disposed on the active layer ACT. The gate insulating layer GI is an insulating layer for insulating the gate electrode GE from the active layer ACT, and may be formed of an insulating material. For example, the gate insulating layer GI may be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0079] In addition, although Figure 2 2 shows that the gate insulating layer GI is disposed only under the gate electrode GE, but the gate insulating layer GI may be disposed on the entire surface of the substrate 110 like the plurality of inorganic insulating layers IL, but is not limited thereto.

[0080] The gate electrode GE is disposed on the gate insulating layer GI. The gate electrode GE may be formed of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0081] The third inorganic insulating layer 113 is disposed on the gate electrode GE and the active layer ACT. The source electrode SE and the drain electrode DE are disposed on the third inorganic insulating layer 113. The source electrode SE and the drain electrode DE are electrically connected to the active layer ACT through a contact hole formed in the third inorganic insulating layer 113. The source electrode SE and the drain electrode DE may be formed of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but are not limited thereto.

[0082] In the present application, the transistor TR is described as having a structure in which the gate electrode GE is disposed on the active layer ACT and the source electrode SE and the drain electrode DE are disposed on the gate electrode GE. However, the gate electrode GE, the source electrode SE, and the drain electrode DE may be formed of the same material, and the structure of the transistor TR is not limited thereto.

[0083] The planarization layer 114 is disposed on the transistor TR. The planarization layer 114 may planarize the upper portion of the substrate 110 including the transistor TR. The planarization layer 114 may be disposed in the entire active area AA and a portion of the non-active area NA. The planarization layer 114 may be formed of an organic material, for example, may be formed of a single layer or a double layer of an acrylic organic material, but is not limited thereto.

[0084] The light emitting diode OLED is disposed on the planarization layer 114. The light emitting diode OLED is a self-luminous element that emits light, and is disposed in a plurality of sub-pixels SP driven by the transistor TR. The light emitting diode OLED includes an anode AN, a light emitting layer EL, and a cathode CA.

[0085] The anode AN may provide holes to the light emitting layer EL, and may be formed of a conductive material having a high work function. For example, when the display device 100 is a bottom emission type in which light emitted from the light emitting diode OLED is emitted below the light emitting diode OLED, the anode AN may be formed of tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), or indium zinc tin oxide (ITZO), but is not limited thereto. In addition, when the display device 100 is a top emission type in which light emitted from the light emitting diode OLED is emitted above the light emitting diode OLED, the anode AN may further include a reflective layer.

[0086] The bank 115 is located on the anode AN. The bank 115 is provided to cover the edge of the anode AN in the active area AA. The bank 115 is provided at the boundary between the sub-pixels SP adjacent to each other to reduce the color mixing of the light emitted from the light emitting diode OLED of each of the plurality of sub-pixels SP. The bank 115 may be formed of an insulating material, such as polyimide, but is not limited thereto.

[0087] The light emitting layer EL is disposed on the anode AN exposed from the bank 115. The light emitting layer EL is provided with holes from the anode AN and electrons from the cathode CA to emit light. The light emitting layer EL emits red light, green light, blue light, or white light according to the type, and when the light emitting layer emits white light, color filters having various colors may be provided together.

[0088] The cathode CA is disposed on the light emitting layer EL. The cathode CA may be disposed at least on the entire surface of the active area AA. The cathode CA may provide electrons to the light emitting layer EL, and may be formed of a conductive material having a low work function. For example, in the case of a top emission type, the cathode CA may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or ytterbium (Yb) alloy. In addition, in the case of a bottom emission type, the cathode CA may be formed of any one or more selected from the group consisting of metals such as magnesium (Mg), silver (Ag), and aluminum (Al) and alloys thereof, but is not limited thereto.

[0089] Reference Figure 3The encapsulation unit 120 is disposed on the bank 115. The encapsulation unit 120 is disposed to cover the active area AA in which the light emitting diode OLED is disposed to protect the light emitting diode OLED from external moisture, oxygen or impact. The encapsulation unit 120 may be constructed in various ways.

[0090] For example, the encapsulation unit 120 may be formed by alternately laminating a plurality of inorganic layers and a plurality of organic layers to form a thin film encapsulation (TFE). The inorganic layer may be formed of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlOx), and the organic layer may be formed of epoxy resin or acrylic polymer, but they are not limited thereto.

[0091] In addition, the encapsulation unit 120 may be configured by a surface sealing type. For example, the encapsulation unit 120 may be formed by forming an ultraviolet or thermosetting sealant on the entire surface of the active area AA.

[0092] The packaging unit 120 may be configured in the form of a substrate formed of a metal material. For example, the packaging unit 120 may be formed of a material having a high modulus of about 200 to 900 MPa. The packaging unit may be formed of a metal material having high corrosion resistance and being easily processed in the form of a foil or a thin film, such as aluminum (Al), nickel (Ni), chromium (Cr), iron (Fe), and a nickel alloy material. Therefore, since the packaging unit 120 is formed of a metal material, the packaging unit 120 may be implemented as an extremely thin film and provide a strong resistance to external impacts and scratches.

[0093] The encapsulation unit 120 may be configured by combining a thin film encapsulation, a surface seal, and a thin film substrate, and may be formed by various methods and materials other than the above-described structure, and is not limited thereto.

[0094] Reference Figure 3 , a connection line LL is provided between the second inorganic insulating layer 112 and the third inorganic insulating layer 113 in the pad area PA of the non-active area NA. The connection line LL is a wiring connecting the plurality of pads PE and the active area AA. Various signals applied to the pads PE can be transmitted to the plurality of sub-pixels SP of the active area AA by means of the connection line LL. However, the connection line LL may be provided between the first inorganic insulating layer 111 and the second inorganic insulating layer 112 or on the third inorganic insulating layer 113, but is not limited thereto.

[0095] A plurality of pads PE are disposed on the connection line LL. The plurality of pads PE are electrodes electrically connected to the plurality of flexible films 150 to transmit signals from the plurality of flexible films 150 to the active area AA. The plurality of pads PE are connected to the connection line LL through contact holes formed in the planarization layer 114 and the third inorganic insulating layer 113.

[0096] The conductive adhesive member 140 is disposed on the plurality of pads PE. The conductive adhesive member 140 may be disposed to fill an empty space between the dam member 130 and the bank 115. The conductive adhesive member 140 is disposed to cover one end of the dam member 130 and the plurality of pads PE disposed on the pad area PA.

[0097] A plurality of flexible films 150 are disposed on the conductive adhesive member 140, and a sealing member 160 is disposed on the plurality of flexible films 150. The sealing member 160 is disposed to enclose the active area AA. The sealing member 160 is disposed along the non-active area NA to enclose the active area AA. The planar shape of the sealing member 160 is a frame shape. The sealing member 160 is disposed to cover the side of the packaging unit 120 of the active area AA to minimize moisture and oxygen penetrating into the active area AA.

[0098] Reference Figure 4 In the plurality of second regions A2 where the pads PE are not provided, the sealing member 160 is provided to cover the bank 115 , the planarization layer 114 , and the dam member 130 provided on the side and the outside of the package unit 120 .

[0099] The sealing member 160 may be formed of a non-conductive material having elasticity to encapsulate the side of the active area AA and enhance the rigidity of the side of the display device 100. In addition, the sealing member 160 may be made of a material having viscosity. The sealing member 160 may further include an absorbent that absorbs moisture and oxygen from the outside to minimize moisture penetration through the side of the display device 100. For example, the sealing member 160 may be composed of polyimide (PI), polyurethane, epoxy resin, or an acrylic material, but is not limited thereto.

[0100] The sealing member 160 may be made of a material having a modulus of about 200 MPa. If the sealing member 160 is made of a material having a modulus of 200 MPa or less, the pad area PA may be deformed, thereby being bent or wrinkled. Therefore, the sealing member 160 is formed of a material having a modulus of 200 MPa or more to support the periphery of the display device 100 without deformation.

[0101] In addition, the dam member 130 may be made of a material having a higher modulus than the sealing member 160. The dam member 130 supporting the plurality of flexible films 150 bonded to the pad area PA is made of a material having a high modulus to improve the rigidity of the pad area PA. For example, the dam member 30 may be made of the same material as the bank 115 (e.g., polyimide) and have a higher modulus than the sealing member 160.

[0102] Even though not shown in the figure, a polarizer and a blocking film may be provided below the substrate 110. The polarizer selectively transmits light to reduce the reflection of external light incident on the substrate 110. Specifically, in the display device 100, various metal materials, wirings, and light-emitting diodes OLED applied to semiconductor devices are formed on the substrate 110. Therefore, the external light incident on the substrate 110 may be reflected from the metal material, so that the visibility of the display device 100 may be reduced due to the reflection of the external light. At this time, a polarizer that suppresses the reflection of external light is provided below the substrate 110 to increase the outdoor visibility of the display device 100. However, according to an embodiment of the display device 100, the polarizer may be omitted.

[0103] The barrier film minimizes moisture and oxygen outside the substrate 110 that penetrate into the substrate 110 to protect the light emitting diode OLED of the active area AA. However, according to an embodiment of the display device 100, the barrier film may be omitted, but is not limited thereto.

[0104] The following will refer to FIG. 5A to FIG. 5G A method of manufacturing the display device 100 according to an exemplary embodiment of the present disclosure is described.

[0105] FIG. 5A to FIG. 5G is a process flow chart for explaining a method of manufacturing a display device according to an exemplary embodiment of the present disclosure. FIG. 5A to FIG. 5C is a process flow chart for explaining a process of forming the dam member 130 and the conductive adhesive member 140, and Figure 5D and Figure 5E 1 is a process flow chart for explaining a process of combining a plurality of flexible films 150 and a process of forming a sealing member 160 . Fig. 5F and Figure 5G is a process flow diagram for explaining the LLO process.

[0106] Reference Figure 5A , a temporary substrate SUB on which a sacrificial layer SL is formed is attached below the substrate 110 to perform a manufacturing process of the display device 100 .

[0107] The temporary substrate SUB is a substrate that supports the substrate 110 and components disposed on the substrate 110 during the manufacturing process of the display device 100. The temporary substrate SUB may be formed of a material having rigidity. For example, the temporary substrate SUB may be formed of glass, but is not limited thereto.

[0108] The sacrificial layer SL is a layer formed to easily separate the temporary substrate SUB and the substrate 110 from each other. Laser is irradiated onto the sacrificial layer SL from the lower portion of the temporary substrate SUB to dehydrogenate the sacrificial layer SL and separate the temporary substrate SUB and the sacrificial layer SL from the substrate 110. For example, the sacrificial layer SL may use hydrogenated amorphous silicon or hydrogenated and impurity-doped amorphous silicon.

[0109] At this time, the transparent conductive oxide and the oxide semiconductor are materials that can perform the LLO process with the sacrificial layer SL and the temporary substrate SUB. Therefore, even if the substrate 110 is formed of any one of the transparent conductive oxide or the oxide semiconductor, the substrate 110 can be easily separated from the temporary substrate SUB. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is composed of any one of the transparent conductive oxide or the oxide semiconductor that can perform the LLO process. Therefore, the display device 100 can be easily manufactured using existing processes and equipment.

[0110] Next, with the substrate 110 attached with the temporary substrate SUB, a plurality of inorganic insulating layers IL, a planarization layer 114 , a bank 115 , transistors TR, light emitting diodes OLED, an encapsulation unit 120 , connection lines LL, and a plurality of pads PE are formed on the substrate 110 .

[0111] Next, a dam member 130 is formed on the temporary substrate SUB protruding outward from the substrate 110. At this time, after forming the substrate 110 or the plurality of inorganic insulating layers IL having the same size as the temporary substrate SUB, a portion of the substrate 110 and the plurality of inorganic insulating layers IL adjacent to the plurality of pads PE is patterned. An organic insulating layer OL and a dam member 130 are formed on the patterned region of the substrate 110 and the plurality of inorganic insulating layers IL to form Figure 5A That is, in the region corresponding to the region where the organic insulating layer OL and the dam member 130 are formed, the organic insulating layer OL and the dam member 130 may be formed in a state where the substrate 110 and the plurality of inorganic insulating layers IL are patterned to expose the sacrificial layer SL. However, the temporary substrate SUB having a size larger than that of the substrate 110 is attached from the beginning to form Figure 5A The structure shown in, but not limited to this.

[0112] Next, an organic insulating layer OL and a dam member 130 are formed on the temporary substrate SUB. The organic insulating layer OL is a structure for compensating for a step between the dam member 130 and the temporary substrate SUB when manufacturing the display device 100. The organic insulating layer OL may be formed of the same material as the planarization layer 114, for example, may be formed of a single layer or double layer of an acrylic organic material, but is not limited thereto.

[0113] The dam member 130 is formed on the organic insulating layer OL. The dam member 130 may be made of the same material as the bank 115, for example, polyimide, but is not limited thereto. However, even if the dam member 130 is made of the same material as the bank 115, the thickness of the dam member 130 is formed to be greater than that of the bank 115, so that the dam member 130 may be made by a process different from that of the bank 115.

[0114] The lower surface of the dam member 130 may be disposed higher than the upper surface of the substrate 110 through the organic insulating layer OL. The substrate 110 is disposed on the sacrificial layer SL, and the dam member 130 is formed on the sacrificial layer SL and the organic insulating layer OL, so that the lower surface of a portion of the dam member 130 disposed outside the substrate 110 may be disposed higher than the substrate 110.

[0115] Next, refer to Figure 5B , the conductive adhesive member 140 is formed on the plurality of pads PE in the plurality of first areas A1 of the pad area PA. The conductive adhesive member 140 may be formed to at least completely cover the plurality of pads PE in the plurality of first areas A1. A portion of the conductive adhesive member 140 may be formed to be disposed on the dam member 130. One end of the conductive adhesive member 140 is formed to be disposed outside the sealing member 160 formed later to inhibit the sealing member 160 from penetrating below the conductive adhesive member 140, which will be described in detail below.

[0116] In addition, the conductive adhesive member 140 overflows outward from the substrate 110 to cover the multiple inorganic insulating layers IL and the upper part of the dam member 130 set in the multiple first areas A1. Therefore, the conductive adhesive member 140 overflows and overlaps all the multiple inorganic insulating layers IL in the multiple first areas A1, and supports the multiple inorganic insulating layers IL to avoid crack defects in the multiple inorganic insulating layers IL. If the conductive adhesive member 140 does not overflow, but is only set in the substrate 110, a portion of the multiple inorganic insulating layers IL in the multiple first areas A1 that do not overlap with the conductive adhesive member 140 does not have a structure that supports the portion of the multiple inorganic insulating layers IL after separating the temporary substrate SUB. Therefore, the portion of the multiple inorganic insulating layers IL is likely to be broken or torn. Therefore, the conductive adhesive member 140 overflows outward from the substrate 110 to support all the multiple inorganic insulating layers IL formed in the multiple first areas A1 and reduce cracks.

[0117] In addition, the conductive adhesive member 140 overflows in a state where the dam member 130 and the organic insulating layer OL are formed, so that the substrate 110 and the temporary substrate SUB can be easily separated after the manufacture of the display device 100 is completed. If the conductive adhesive member 140 overflows without the dam member 130 and the organic insulating layer OL, the conductive adhesive member 140 will overflow to the upper part or side of the temporary substrate SUB. In this case, the conductive adhesive member 140 is attached to both the substrate 110 and the temporary substrate SUB, so that it is difficult to separate the substrate 110 and the temporary substrate SUB. Therefore, the organic insulating layer OL and the dam member 130 are formed above the temporary substrate SUB exposed from the substrate 110 to suppress the attachment of the conductive adhesive member 140 that overflows from the substrate 110 to the temporary substrate SUB.

[0118] Next, refer to Figure 5C , laser LS is irradiated onto the organic insulating layer OL and the dam member 130 to form an opening area OA, which divides the organic insulating layer OL and the dam member 130 into two parts. The size of the dam member 130 may be adjusted according to the position of the opening area OA. For example, in order to reduce the size of the dam member 130, the opening area OA may be formed close to the substrate 110.

[0119] In addition, in the subsequent process of separating the temporary substrate SUB and the substrate 110, the opening area OA can easily separate the dam member 130 from the organic insulating layer OL and the temporary substrate SUB. If the opening area OA is not formed, the size of the dam member 130 may be excessively increased, and if the dam member 130 is formed to contact the side of the temporary substrate SUB, it is difficult to separate the dam member 130 from the temporary substrate SUB. Next, the opening area OA may be formed in the middle of the dam member 130 to adjust the size of the dam member 130 and easily separate the dam member 130 from the organic insulating layer OL and the temporary substrate SUB.

[0120] Next, refer to Figure 5D , the plurality of flexible films 150 are bonded to the plurality of pads PE. The plurality of flexible films 150 are bonded such that one end is disposed on the conductive adhesive member 140 and the other end is disposed outside the substrate 110. At this time, due to the pressure applied when bonding the plurality of flexible films 150, the conductive adhesive member 140 may overflow additionally.

[0121] Refer to Figure 5D and Figure 5E, the sealing member 160 is formed on the plurality of flexible films 150. The sealing member 160 may be formed to cover the side surfaces of the package unit 120 and the plurality of flexible films 150 in the non-active area NA. A portion of the sealing member 160 overflows outward from the substrate 110 to be disposed on the dam member 130, and overlaps with all the plurality of inorganic insulating layers IL disposed in the plurality of first areas A1 and the plurality of second areas A2. Both the sealing member 160 and the conductive adhesive member 140 overflow outward from the substrate 110 to support the inorganic insulating layers IL of all the plurality of pad areas PA, and reduce crack defects in the plurality of inorganic insulating layers IL.

[0122] At this time, the edge of the sealing member 160 extending from the packaging unit 120 is less than the edge of the conductive adhesive member 140 extending from the packaging unit 120. The edge of the conductive adhesive member 140 disposed on the dam member 130 may be disposed outside the edge of the sealing member 160. The conductive adhesive member 140 overflows more from the substrate 110 than the sealing member 160 to suppress the sealing member 160 from penetrating the space below the plurality of flexible films 150 without being cured. If the sealing member 160 overflows more than the conductive adhesive member 140, the sealing member 160 penetrates the empty space between the plurality of flexible films 150 and the dam member 130 where the conductive adhesive member 140 is not formed. The sealing member 160 penetrating the empty space below the plurality of flexible films 150 will not be cured. Therefore, the conductive adhesive member 140 may overflow more from the substrate 110 than the sealing member 160, so that the sealing member 160 does not penetrate the empty space between the plurality of flexible films 150 and the dam member 130. Therefore, the edge of the sealing member 160 may be disposed inside the edge of the conductive adhesive member 140.

[0123] Next, refer to Fig. 5F and Figure 5G , the substrate 110 and the temporary substrate SUB may be separated by the LLO process. The sacrificial layer SL may use hydrogenated amorphous silicon or hydrogenated amorphous silicon doped with impurities. When the laser is irradiated from the lower portion of the temporary substrate SUB toward the temporary substrate SUB and the sacrificial layer SL, hydrogen of the sacrificial layer SL is dehydrogenated, and the sacrificial layer SL and the temporary substrate SUB are separated from the substrate 110.

[0124] In the LLO process, the dam member 130 attached to the plurality of flexible films 150 and the substrate 110 by means of the conductive adhesive member 140 may be separated from the organic insulation layer OL on the temporary substrate SUB.

[0125] At this time, the organic insulating layer OL is formed of a material having a high transmittance in the laser wavelength band used for the LLO process, and the dam member 130 is formed of a material having a low transmittance in the laser wavelength band. For example, when the optical wavelength of the laser used in the LLO process is about 308nm to 343nm, the organic insulating layer OL transmits the light corresponding to the wavelength, and the dam member 130 absorbs the light corresponding to the wavelength. Therefore, in the LLO process, the laser is directed to the interface between the organic insulating layer OL that transmits the light and the dam member 130 that absorbs the light, and the interface of the organic insulating layer OL and the dam member 130 can be easily separated. For example, the organic insulating layer OL that transmits the light corresponding to the optical wavelength of the laser is formed of an acrylic material, and the dam member 130 that absorbs the light corresponding to the optical wavelength of the laser is formed of a polyimide-based material. Therefore, in the LLO process, the organic insulating layer OL and the dam member 130 are easily separated.

[0126] The dam member 130 is fixed to the plurality of flexible films 150 and the substrate 110 by means of the conductive adhesive member 140 and the sealing member 160, and the organic insulating layer OL is formed on the temporary substrate SUB but does not contact the conductive adhesive member 140 or the sealing member 160. Therefore, during the process of separating the temporary substrate SUB and the substrate 110, the dam member 130 fixed to the substrate 110 may be separated from the organic insulating layer OL. In this case, the dam member 130 formed outside the opening area OA is not connected to the substrate 110, so the dam member 130 may remain on the temporary substrate SUB as it is.

[0127] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is composed of any one of a transparent conductive oxide and an oxide semiconductor to reduce the thickness of the display device 100. In the related art, a plastic substrate is mainly used as a substrate of a display device. However, the plastic substrate is formed by coating and curing the substrate material at a high temperature, so the problem is that it takes a long time and it is difficult to form a thickness equal to or lower than a predetermined level. In contrast, transparent conductive oxides and oxide semiconductors can be formed to have a very thin thickness by a deposition process such as sputtering. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 supporting various components of the display device 100 is composed of a transparent conductive oxide layer or an oxide semiconductor layer to reduce the thickness of the display device 100 and achieve a thin design.

[0128] In addition, according to the related art, a flexible display device is formed by forming a light emitting diode and a driving circuit on a plastic substrate that is more flexible than a glass substrate. However, the display device is excessively deformed and the display device may be damaged due to stress generated during the deformation. Therefore, in order to improve flexibility to reduce stress of the display device, it is advantageous to reduce the thickness of the display device. However, as described above, it is difficult to make the plastic substrate have a thickness equal to or less than a predetermined thickness.

[0129] Therefore, in the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of a transparent conductive oxide or an oxide semiconductor to improve the flexibility of the display device 100 and reduce the stress generated when the display device 100 is deformed. Specifically, when the substrate 110 is composed of a transparent conductive oxide layer or an oxide semiconductor layer, the substrate 110 can be formed as a very thin film. In this case, the substrate 110 is also referred to as a transparent thin film layer. Therefore, the display device 100 including the substrate 110 can have high flexibility, and the display device 100 can be easily bent or curled. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of any one of a transparent conductive oxide layer and an oxide semiconductor layer to improve the flexibility of the display device 100. Therefore, the stress generated when the display device 100 is deformed is also alleviated, so that cracks caused in the display device 100 can be minimized.

[0130] In addition, although conventional flexible display devices are implemented using plastic substrates rather than glass substrates, plastic substrates are more likely to generate static electricity than glass substrates. Static electricity affects various wiring and driving elements on the plastic substrate, thereby damaging some components or degrading the display quality of the display device. Therefore, in conventional display devices using plastic substrates, a separate structure for blocking and releasing static electricity is further required.

[0131] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of any one of a transparent conductive oxide layer and an oxide semiconductor layer to reduce the possibility of static electricity generated in the substrate 110. When the substrate 110 is formed of plastic and thus generates static electricity, the display quality is degraded due to static electricity, and various wirings and driving elements on the substrate 110 are damaged or the driving is affected. On the contrary, when the substrate 110 is formed of a transparent conductive oxide layer or an oxide semiconductor layer, the static electricity generated in the substrate 110 is minimized, and the structure for blocking and releasing static electricity can be simplified. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of any one of a transparent conductive oxide or an oxide semiconductor having a low possibility of generating static electricity. Thus, damage or degradation of display quality due to static electricity can be minimized.

[0132] In addition, when a plastic substrate is used as a substrate of a conventional display device, foreign matter may be generated in the process of forming the plastic substrate. For example, in order to form a plastic substrate, foreign matter may be generated when the substrate material is coated and cured. Due to the foreign matter, moisture or oxygen may more easily penetrate into the display device, and thus various structures on the substrate may be formed unevenly due to the foreign matter. Therefore, due to the foreign matter in the plastic substrate formed by the coating and curing method, the light emitting diode in the display device may be degraded or the characteristics of the transistor may be degraded.

[0133] In contrast, in the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of one of a transparent conductive oxide and an oxide semiconductor, so as to minimize the possibility of external moisture or oxygen penetrating into the display device 100 with the help of the substrate 110. When the substrate 110 is formed of a transparent conductive oxide layer or an oxide semiconductor, the substrate 110 is formed in a vacuum environment, so that the possibility of generating foreign matter is significantly low. In addition, even if foreign matter is generated, the size of the foreign matter is very small, so that the moisture and oxygen penetrating into the display device 100 can be minimized. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of a transparent conductive oxide or an oxide semiconductor having a low possibility of generating foreign matter and excellent moisture permeability. As a result, the reliability of the light-emitting diode OLED including an organic material and the display device 100 can be improved.

[0134] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of any one of a transparent conductive oxide and an oxide semiconductor to attach a thin and inexpensive barrier film under the substrate 110. When the substrate 110 is formed of a material having poor moisture permeability, such as plastic, the moisture permeability can be supplemented by attaching a high-performance barrier film. However, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is formed of a transparent conductive oxide or an oxide semiconductor having excellent moisture permeability, so that a thin and inexpensive barrier film can be attached under the substrate 110. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is composed of any one of a transparent conductive oxide or an oxide semiconductor having excellent moisture permeability, thereby reducing the manufacturing cost of the display device 100.

[0135] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the substrate 110 is composed of any one of a transparent conductive oxide and an oxide semiconductor to perform a laser lift-off (LLO) process. When manufacturing the display device 100, a temporary substrate SUB formed with a sacrificial layer SL is attached below the substrate 110, and then the structure of the display device 100 is formed on the substrate 110. For example, the sacrificial layer SL can use hydrogenated amorphous silicon or hydrogenated and impurity-doped amorphous silicon. After the manufacture of the display device 100 is completed, if the laser is irradiated from the lower part of the temporary substrate SUB, the hydrogen of the sacrificial layer SL is dehydrogenated, and the sacrificial layer SL and the temporary substrate SUB are separated from the substrate 110. At this time, the transparent conductive oxide and the oxide semiconductor are materials that can perform the LLO process with the sacrificial layer SL and the temporary substrate SUB. Therefore, even if the substrate 110 is formed of any one of a transparent conductive oxide or an oxide semiconductor, the substrate 110 can be easily separated from the temporary substrate SUB. Therefore, in the display device 100 according to the exemplary embodiment of the present disclosure, the substrate 110 is composed of any one of a transparent conductive oxide layer or an oxide semiconductor layer that can perform the LLO process. Therefore, the display device 100 can be easily manufactured using existing processes and equipment.

[0136] In addition, in order to reduce crack defects of multiple inorganic insulating layers in the pad area, crack failures of multiple inorganic insulating layers in the pad area can be reduced by overflowing the conductive adhesive member and the sealing member without having a separate organic insulating layer or a dam member. However, the conductive adhesive member and the sealing member overflowing from the substrate contact the temporary substrate, resulting in LLO process defects of the substrate and the temporary substrate. In addition, the sealing member penetrates under the flexible film, resulting in uncured defects.

[0137] Therefore, the substrate can be formed to extend longer than the overflowing conductive adhesive member and the sealing member to ensure the available space for placing the conductive adhesive member and the sealing member. However, after the substrate is separated from the temporary substrate, there is no structure to support the portion of the substrate extending to the outside of the conductive adhesive member and the sealing member, so that there may be a defect that the substrate is damaged and scattered.

[0138] The organic insulating layer covering the extended portion of the substrate extends to the outside of the conductive adhesive member and the sealing member so that the portion of the substrate does not fly away. However, during the LLO process of separating the substrate and the temporary substrate, there is a problem in that the organic insulating layer and the substrate are separated and the substrate is easily affected by pressure.

[0139] Therefore, in the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the organic insulating layer OL and the dam member 130 covering the edge of the substrate 110 are formed in a state where a portion of the substrate 110 extends from the outside of the conductive adhesive member 130 and the sealing member 160 to be exposed from the conductive adhesive member 130 and the sealing member 160, and the subsequent processes are performed. Therefore, the scattering of the substrate 110 in the LLO process can be minimized. Specifically, referring to Figure 5A , the substrate 110 extending to the outside of the conductive adhesive member 130 and the sealing member 160 is removed, and the organic insulating layer OL and the dam member 130 can be formed over the temporary substrate SUB exposed by removing the substrate 110. Therefore, the conductive adhesive member 140 and the sealing member 160 or the portion of the substrate 110 exposed from the dam member 130 are removed to prevent the possibility of the substrate 110 being broken and scattered. In addition, the conductive adhesive member 130 and the sealing member 160 overflow to the outside of the substrate 110 to cover all edge portions of the substrate 110, so that the substrate 110 can be supported in a state where the temporary substrate SUB is separated. According to the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the process is performed in a state where the conductive adhesive member 140 and the sealing member 160 and the portion of the substrate 110 exposed from the dam member 130 are removed. Thus, the scattering of the substrate 110 can be suppressed.

[0140] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the conductive adhesive member 140 and the sealing member 160 overflow outward from the substrate 110 to support the plurality of inorganic insulating layers IL on the pad area PA and reduce cracks in the pad area PA. If the conductive adhesive member 140 is formed only in a partial area of ​​the plurality of first areas A1 corresponding to the plurality of pads PE, the plurality of pads PE and the plurality of flexible films 150 may be electrically connected. However, when the conductive adhesive member 140 does not overflow so that the conductive adhesive member 140 is not provided in a portion of the first area A1, there is no structure supporting a portion of the first area A1 after the temporary substrate SUB and the substrate 110 are separated. Therefore, cracks or tearing defects may be generated in the plurality of inorganic insulating layers IL. Similarly, when the sealing member 160 does not cover all of the plurality of second areas A2 of the pad area PA, there is no structure supporting a portion of the pad area PA exposed from the sealing member 160, so that defects such as cracks may be generated. Therefore, in the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the conductive adhesive member 140 and the sealing member 160 overflow to the outside of the substrate 110 to cover and support all of the plurality of inorganic insulating layers IL disposed on the pad area PA. At this time, the dam member 130 supports the conductive adhesive member 140 and the sealing member 160 overflowing outward from the substrate 110, so that the conductive adhesive member 140 and the sealing member 160 support the pad area PA after the temporary substrate SUB is separated. Specifically, cracks generated in the plurality of inorganic insulating layers IL can be reduced.

[0141] The display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure form the organic insulating layer OL and the dam member 130 from the edge of the substrate 110 to the outside of the substrate 110. Therefore, the conductive adhesive member 140 and the sealing member 160 overflowing to the outside of the substrate 110 can be supported, and the temporary substrate SUB and the substrate 110 can be easily separated. In order to reduce cracks in the plurality of inorganic insulating layers IL in the pad area PA, the conductive adhesive member 140 and the sealing member 160 may overflow outward from the substrate 110, thereby completely covering the pad area PA. At this time, the conductive adhesive member 140 and the sealing member 160 overflowing outward from the substrate 110 may contact the temporary substrate SUB, so that if the dam member 130 and the organic insulating layer OL are not formed, the LLO process of the temporary substrate SUB and the substrate 110 may be defective. Therefore, the organic insulating layer OL and the dam member 130 are formed on the temporary substrate SUB exposed from the substrate 110 to separate the conductive adhesive member 140 and the sealing member 160 overflowing from the substrate 110 and to easily separate the substrate 110 from the temporary substrate SUB.

[0142] In the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the conductive adhesive member 140 overflows more from the substrate 110 than the sealing member 160 to minimize the uncured defect of the sealing member 160 penetrating under the plurality of flexible films 150. If the sealing member 160 overflows more than the conductive adhesive member 140, the sealing member 160 may penetrate the space between the plurality of flexible films 150 and the dam member 130 that is not filled with the conductive adhesive member 140. According to the method of irradiating UV to cure the sealing member 160, it is difficult to irradiate UV light to the lower part of the plurality of flexible films 150, and the sealing member 160 penetrating the lower part of the plurality of flexible films 150 is not cured. Therefore, in the display device 100 and the manufacturing method thereof according to the exemplary embodiment of the present disclosure, the conductive adhesive member 140 overflows more from the substrate 110 than the sealing member 160 to suppress the sealing member 160 from penetrating into the empty space between the plurality of flexible films 150 and the dam member 130 and minimize the uncured defect of the sealing member 160.

[0143] Figure 6 is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure. Figure 6 The display device 600 and Figures 1 to 4 The only difference between the display devices 100 is that the dam member 630 is formed of a first dam portion 631 and a second dam portion 632 , but the other structures are substantially the same, so a redundant description will be omitted.

[0144] Reference Figure 6 The dam member 630 including the first dam portion 631 and the second dam portion 632 is disposed below the plurality of flexible films 150. One end of the first dam portion 631 and the second dam portion 632 of the dam member 630 is disposed on the pad area PA, and the other end is disposed outside the substrate 110.

[0145] The first dam portion 631 may be formed of the same material by the same process as the bank portion 115. For example, in a state where the planarization layer 114 and the organic insulating layer OL are formed on the temporary substrate SUB and the substrate 110, the first dam portion 631 and the bank portion 115 are formed by the same process. Therefore, the first dam portion 631 and the bank portion 115 are formed of the same material, and the upper surface of the first dam portion 631 may be set on the same plane as the upper surface of the bank portion 115. Therefore, the first dam portion 631 is formed by the same process as the bank portion 115, so that the formation process of the first dam portion 631 can be simplified.

[0146] The second dam 632 is disposed on the first dam 631. The second dam 632 can reduce the step between the first dam 631 and the plurality of flexible films 150. When the first dam 631 is formed by the same process as the embankment 115, it is difficult to form a large thickness. In this case, the second dam 632 is additionally formed on the first dam 631 to compensate for the step between the first dam 631 and the flexible film 150, so that the dam member 630 can easily support the plurality of flexible films 150.

[0147] At this time, the second dam portion 632 is formed of a material different from the first dam portion 631. For example, the second dam portion 632 may be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, or polysiloxane, but is not limited thereto. Depending on the type of organic material, a curing process is additionally performed to form the second dam portion 632, but is not limited thereto.

[0148] In a display device 600 according to another exemplary embodiment of the present disclosure, a dam member 630 including a first dam portion 631 and a second dam portion 632 is formed below a plurality of flexible films 150 to support the plurality of flexible films 150. The dam member 630 supports the conductive adhesive member 140 and the sealing member 160 overflowing from the substrate 110. The first dam portion 631 is formed by the same process as the dam portion 115 so that the upper surface is disposed on the same plane as the upper surface of the dam portion 115. However, when the first dam portion 631 is formed by the same process as the dam portion 115, the thickness of the first dam portion 631 is not formed to be greater than the thickness of the dam portion 115, so that the empty space between the first dam portion 631 and the plurality of flexible films 150 can be increased. Therefore, the second dam portion 632 is additionally formed on the first dam portion 631 to minimize the space between the plurality of flexible films 150 and the second dam portion 632. Therefore, in the display device 600 according to another exemplary embodiment of the present disclosure, the second dam portion 632 is additionally formed on the first dam portion 631 formed by the same process as the bank portion 115 to compensate for the step between the first dam portion 631 and the plurality of flexible films 150. In addition, the plurality of flexible films 150 and the conductive adhesive member 140 and the sealing member 160 overflowing outward from the substrate 110 can be easily supported.

[0149] Figure 7 is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure. Figure 6 Compared with the display device 100, Figure 7 The display device 700 further includes a band portion 770, but other structures are substantially the same, so redundant description will be omitted.

[0150] Reference Figure 7, a band portion 770 is formed between the second dam portion 632 of the dam member 630 and the plurality of flexible films 150. The band portion 770 is formed outside the conductive adhesive member 140 on the upper surface of the second dam portion 632. The conductive adhesive member 140 overflows into a space formed by the side of the band portion 770, the upper surface of the second dam portion 632, and the lower portion of the plurality of flexible films 150, and the edge of the conductive adhesive member 140 contacts the band portion 770. Therefore, the empty space between the plurality of flexible films 150 and the dam member 630 is filled with the band portion 770 and the conductive adhesive member 140 overflowing to contact the band portion 770.

[0151] Therefore, in the display device 700 according to another exemplary embodiment of the present disclosure, a band portion 770 is provided between the plurality of flexible films 150 and the dam member 630 to minimize the penetration of the sealing member 160 under the plurality of flexible films 150. In addition, the band portion 770 can fix and support the second dam portion 632 and the plurality of flexible films 150. If the sealing member 160 overflows outward from the conductive adhesive member 140, the sealing member 160 may penetrate into the space between the plurality of flexible films 150 and the second dam portion 632 that is not filled by the conductive adhesive member 140. In this case, the sealing member 160 that penetrates under the plurality of flexible films 150 will not be cured. However, the empty space between the plurality of flexible films 150 and the second dam portion 632 is minimized by the band portion 770 and the dam member 630 attached to the plurality of flexible films 150 and the conductive adhesive member 140 that overflows to the edge of the band portion 770. Therefore, the penetration of the sealing member 160 under the plurality of flexible films 150 can be minimized. Therefore, in the display device 700 according to another exemplary embodiment of the present disclosure, the band portion 770 is additionally formed in the empty space between the plurality of flexible films 150 and the dam member 630 to minimize the defect that the sealing member 160 penetrates under the plurality of flexible films 150 without being cured.

[0152] Exemplary embodiments of the present disclosure may also be described as follows:

[0153] According to one aspect of the present disclosure, a display device is provided. The display device includes: a substrate including an active area and an inactive area, the inactive area extending from the active area and including a pad area, the substrate being formed of any one of a transparent conductive oxide and an oxide semiconductor; a plurality of inorganic insulating layers disposed on the substrate; a dam member having one end disposed on the pad area and another end disposed outside the substrate; and a plurality of flexible films disposed to cover the dam member and having one end disposed in the pad area.

[0154] The display device may further include a plurality of pads in the pad region disposed between the dam member and the active region; and a plurality of conductive adhesive members disposed between the plurality of pads and the plurality of flexible films. The edges of the plurality of conductive adhesive members may be disposed on the dam member outside the substrate.

[0155] The display device may further include a sealing member covering the pad area on the plurality of flexible films. The plurality of conductive adhesive members and the sealing member may be partially disposed outside the substrate to cover the dam member.

[0156] An edge of the sealing member disposed on the dam member may be disposed closer to an inner portion of the substrate than edges of the plurality of conductive adhesive members.

[0157] The dam member may include a first dam portion having a first end portion disposed on the pad region and a second dam portion having a first end portion disposed on the pad region and disposed on the first dam portion, and the first dam portion may be formed of a material different from that of the second dam portion.

[0158] The plurality of conductive adhesive members may cover one end portions of the first dam portion and the second dam portion.

[0159] The display device may further include a plurality of belt portions provided between the second dam portion and each of the plurality of flexible films.

[0160] A lower surface of the dam member may be disposed higher than an upper surface of the substrate.

[0161] The display device may further include: a light emitting diode disposed on the plurality of inorganic insulating layers in the active area and including an anode, a light emitting layer, and a cathode; and a dam, the dam being disposed to cover an edge of the anode in the active area. At least a portion of the dam member may be formed of the same material as the dam.

[0162] According to another aspect of the present disclosure, a display device is provided. The display device includes: a substrate, the substrate includes a plurality of first regions provided with a plurality of pads and a plurality of second regions located between the plurality of first regions, and the substrate is formed of any one of a transparent conductive oxide and an oxide semiconductor; a plurality of inorganic insulating layers provided between the substrate and the plurality of pads; a dam member, the dam member covering the edge of the substrate in the plurality of first regions and the plurality of second regions; a plurality of flexible films, the plurality of flexible films being provided on the dam member and electrically connected to the plurality of pads; and a plurality of conductive adhesive members provided between the plurality of pads and the plurality of flexible films. A portion of the dam member is provided on the substrate, and the rest of the dam member is provided outside the substrate.

[0163] The display device may further include a sealing member covering the plurality of first regions and the plurality of second regions on the plurality of flexible films. The sealing member may cover the plurality of inorganic insulating layers in the plurality of second regions.

[0164] Edges of the plurality of conductive adhesive members may be disposed outside an edge of the sealing member.

[0165] The display device may further include a bank provided on the substrate; and a planarization layer provided between the bank and the plurality of inorganic insulating layers. A portion of a lower surface of the dam member provided outside the substrate may be provided higher than the substrate.

[0166] The dam member may be formed of the same material as the bank, and a portion of the dam member disposed outside the substrate may have a thickness greater than a thickness of the bank.

[0167] The dam member may include a first dam portion formed of the same material as the bank portion, and a second dam portion provided on the first dam portion and formed of a material different from that of the first dam portion.

[0168] A thickness of a portion of the first dam portion disposed outside the substrate may be equal to a thickness of the bank portion.

[0169] The display device may further include a plurality of belt portions attached between the second dam portion and each of the plurality of flexible films.

[0170] In another embodiment of the present disclosure, a display device includes: a substrate formed of a transparent conductive oxide or an oxide semiconductor, the substrate including an active area and an inactive area, the inactive area extending from the active area and including a pad area; a plurality of inorganic insulating layers arranged on the substrate; a plurality of flexible films arranged in the pad area; a plurality of pads arranged in the pad area; a plurality of conductive adhesive members arranged between the plurality of pads and the plurality of flexible films; and a dam member, the dam member including at least a first portion and a second portion, the first portion being arranged and extending in a first direction away from at least one of the inorganic insulating layers in the pad area, and the second portion extending away from the first portion and the pad in a second direction intersecting the first direction.

[0171] Although the exemplary embodiments of the present disclosure are described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in a variety of different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are only for illustrative purposes and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are exemplary in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the following claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: a substrate including an active region and a non-active region, the non-active region extending from the active region and including a pad region, the substrate being formed of a transparent conductive oxide or an oxide semiconductor; a plurality of inorganic insulating layers disposed on the substrate; a dam member having a first end portion disposed on the pad region and a second end portion disposed beyond an end portion of the substrate; a plurality of flexible films covering the dam member, first ends of the flexible films being disposed in the pad region; a plurality of pads in the pad region disposed between the dam member and the effective area; and a plurality of conductive adhesive members disposed between the plurality of pads and the plurality of flexible films, wherein first edges of the plurality of conductive adhesive members are disposed on ends of the dam member beyond the substrate.

2. The display device according to claim 1, further comprising: a sealing member covering the pad areas on the plurality of flexible films, The plurality of conductive adhesive members and the sealing member are partially provided beyond an end portion of the substrate to cover the dam member. 3 . The display device according to claim 2 , wherein an edge of the sealing member provided on the dam member is provided closer to an inside of the substrate than the first edges of the plurality of conductive adhesive members.

4. The display device according to claim 1, wherein the dam member comprises: a first dam portion having a first end portion disposed on the pad region; and a second dam portion having a first end portion disposed on the pad region and disposed on the first dam portion, and The first dam portion is formed of a material different from that of the second dam portion. 5 . The display device according to claim 4 , wherein the plurality of conductive adhesive members cover first end portions of the first dam portion and the second dam portion.

6. The display device according to claim 4, further comprising: A plurality of strip portions are disposed between the second dam portion and each of the plurality of flexible membranes. 7 . The display device according to claim 1 , wherein a lower surface of the dam member is disposed higher than an upper surface of the substrate.

8. The display device according to claim 1, further comprising: a light emitting diode disposed on the plurality of inorganic insulating layers in the active region and comprising an anode, a light emitting layer, and a cathode; and a bank, the bank being arranged to cover an edge of the anode in the active area, At least a portion of the weir member is formed of the same material as the bank.

9. A display device, comprising: A substrate, the substrate comprising a plurality of first regions provided with a plurality of pads and a plurality of second regions located between the plurality of first regions, the substrate being formed of a transparent conductive oxide or an oxide semiconductor; a plurality of inorganic insulating layers disposed between the substrate and the plurality of pads; a dam member covering a first edge of the substrate in the plurality of first regions and the plurality of second regions; a plurality of flexible films disposed on the dam member and electrically connected to the plurality of pads; as well as a plurality of conductive adhesive members disposed between the plurality of pads and the plurality of flexible films, wherein a portion of the dam member is disposed on the substrate, and a remaining portion of the dam member is disposed beyond the first end portion of the substrate, and wherein first edges of the plurality of conductive adhesive members are disposed on ends of the dam member beyond the substrate.

10. The display device according to claim 9, further comprising: a sealing member on the plurality of flexible films in the plurality of first regions and the plurality of second regions, wherein the sealing member covers the plurality of inorganic insulating layers in the plurality of second regions. 11 . The display device according to claim 10 , wherein the first edges of the plurality of conductive adhesive members are disposed beyond a first edge of the sealing member that is away from the first end portion of the substrate.

12. The display device according to claim 9, further comprising: a bank disposed on the substrate; and A planarization layer provided between the bank and the plurality of inorganic insulating layers, A portion of the lower surface of the dam member disposed beyond the first end portion of the substrate is disposed higher than the substrate. 13 . The display device according to claim 12 , wherein the dam member is formed of the same material as the bank portion, and a portion of the dam member disposed beyond the first end portion of the substrate has a thickness greater than a thickness of the bank portion.

14. The display device according to claim 12, wherein the dam member comprises: a first weir portion, the first weir portion being formed of the same material as the bank portion; and A second weir portion is provided on the first weir portion and is formed of a material different from that of the first weir portion. 15 . The display device according to claim 14 , wherein a thickness of a portion of the first dam portion extending beyond the first end portion of the substrate is equal to a thickness of the bank portion.

16. The display device according to claim 14, further comprising: A plurality of strap portions are attached between the second dam portion and each of the plurality of flexible membranes.

17. A display device, comprising: a substrate formed of a transparent conductive oxide or an oxide semiconductor, the substrate including an active region and a non-active region, the non-active region extending from the active region and including a pad region; a plurality of inorganic insulating layers disposed on the substrate; a plurality of flexible films disposed in the pad region; a plurality of pads disposed in the pad region; a plurality of conductive adhesive members disposed between the plurality of pads and the plurality of flexible films; as well as a dam member including at least a first portion and a second portion, the first portion being arranged and extending in a first direction away from at least one of the inorganic insulating layers in the pad region, and the second portion extending away from the first portion and the pad in a second direction intersecting the first direction, wherein first edges of the plurality of conductive adhesive members are disposed on ends of the dam member beyond the substrate.

18. The display device according to claim 17, wherein the dam member comprises: First weir part; and a second weir portion disposed on the first weir portion, The first dam portion is formed of a material different from that of the second dam portion.

19. The display device according to claim 17, further comprising: A belt portion is disposed between the dam member and a corresponding one of the plurality of flexible membranes. 20 . The display device according to claim 17 , wherein a lower surface of the second portion of the dam member is disposed higher than an upper surface of the substrate.

21. The display device according to claim 17, further comprising: A sealing member on the plurality of flexible films covering the pad region, the sealing member extending less than the second portion of the dam member in the second direction.

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