MiniLED lamp bead and display structure of PCB type substrate

Abstract

The present invention relates to a MiniLED lamp bead and display structure of a PCB type substrate, wherein the MiniLED lamp bead comprises a PCB type substrate and a light-emitting chipset, wherein the second end face of the PCB type substrate is a square, wherein four electrodes are respectively located on the four sides of the second end face, and each electrode is located between the end point and the midpoint of the side of the second end face where it is located, and the two electrodes on any two adjacent sides are arranged symmetrically with respect to a 90-degree rotation around the center of the second end face, wherein the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are located on the first signal layer, and the signal line of the common cathode is located on the second signal layer. By rearranging the four electrodes on the second end face of the PCB type substrate, the present invention can realize packaging on a module substrate using only two signal line layers when the gap between the lamp beads is smaller, thereby effectively reducing the production cost. Compared with the traditional layout, the electrode layout in the present invention can use a relatively larger electrode pad, making the patch more stable and more firm after welding.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a MiniLED lamp bead and a display structure on a PCB type substrate. Background Art

[0002] An LED lamp bead usually contains three chips: R chip, G chip and B chip, and its packaging substrate usually contains 4 electrodes or 6 electrodes. Figure 1 (a), the four electrodes include R anode, G anode, B anode (corresponding to the shaded box in the figure) and common cathode (corresponding to the blank box in the figure); refer to Figure 1 (b), the six electrodes include R anode, G anode, B anode, R cathode, G cathode, and B cathode (corresponding to the shaded boxes in the figure).

[0003] Among them, compared with 6-electrode LED lamp beads or RGB LED chip COB, 4-electrode LED lamp beads save 2 electrodes. When the LED lamp beads are subsequently mounted on the module substrate, the module substrate can generally save one signal layer in circuit design: for example, when there are 6 electrodes, 1 layer is required for R anode and B anode signals, 1 layer for G anode signals, and 1 layer for common cathode signals; when there are 4 electrodes, 1 layer can be used for R anode, G anode, B anode, and 1 layer for common cathode signals. Figure 2 and Figure 3 Therefore, one signal layer is saved, which comprehensively reduces the production cost of the PCB and improves the yield.

[0004] In the field of Mini LED direct display, the current mainstream technologies are mainly divided into two routes: SMT and COB. The main advantage of SMT lamp beads is that they can use the process equipment of traditional LED lamp beads and can split light in advance. At the same time, in theory, the PCB cost is greatly reduced compared with the actual 6-electrode COB solution; and the main advantage of COB is that it saves the cost and time of lamp bead bagging, and is theoretically more efficient. At this stage, SMT patch MiniLED lamp beads are a relatively more mature solution;

[0005] As MiniLED lamp beads used for patch, their substrates are generally divided into bracket-type substrates and PCB-type substrates. The bracket-type substrate is affected by the characteristics of the shell material, and the overall thickness after packaging is relatively high. At the same time, considering the size and precision of the suction nozzle during crystal bonding, the size cannot be too small, otherwise there is a risk of hitting the bracket cup wall. Therefore, at this stage, MiniLED lamp beads generally use PCB-type substrates.

[0006] However, with the further improvement of the requirements for MiniLED direct display, including the display pixel spacing and smaller lamp beads and chips, the traditional 4-electrode lamp beads also encountered the problem that the 2-layer signal line on the PCB board cannot be routed, and 3 layers must be used. Figure 4Under this premise, the MiniLED display of the SMT solution has no obvious advantage over the COB solution in terms of PCB cost. Summary of the invention

[0007] To this end, the technical problem to be solved by the present invention is to provide a MiniLED lamp bead with a PCB-type substrate with a more reasonable electrode layout and good patch stability.

[0008] In order to solve the above technical problems, the present invention provides a MiniLED lamp bead with a PCB type substrate, which includes a PCB type substrate and a light-emitting chip group, the PCB type substrate includes a first end surface and a second end surface, the light-emitting chip group is arranged on the first end surface of the PCB type substrate, the light-emitting chip group includes an R chip, a G chip and a B chip, and the second end surface of the PCB type substrate is provided with four electrodes, the four electrodes are an R anode, a G anode, a B anode and a common cathode or are an R cathode, a G cathode, a B cathode and a common anode;

[0009] The second end face of the PCB type substrate is a square, the four electrodes are respectively located on the four sides of the second end face, and each electrode is located between the end point and the midpoint of the side of the second end face where it is located, and the two electrodes on any two adjacent sides are arranged 90 degrees rotationally symmetrically around the center of the second end face;

[0010] When the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are located in a first signal layer, and the signal line of the common cathode is located in a second signal layer;

[0011] When the four electrodes are R cathode, G cathode, B cathode and common anode, the signal line of R cathode, the signal line of G cathode and the signal line of B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

[0012] In one embodiment of the present invention, the four electrodes are all rectangles of equal size, and one side of each electrode coincides with one side of the second end surface where the electrode is located.

[0013] In one embodiment of the present invention, the four electrodes are all squares of equal size, the side lengths of the four electrodes are t, the side length of the second end surface is N, and t≤N / 4 is satisfied.

[0014] In one embodiment of the present invention, the gap between two adjacent MiniLED lamp beads is p, and the processing limit of the PCB substrate is the minimum line width a and the minimum line gap b, satisfying: 4a+5b-2p <N<4a+6b。

[0015] In one embodiment of the present invention, when the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common cathode is a straight line and is arranged along a second direction;

[0016] When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common anode is a straight line and is arranged along a second direction; the first direction is perpendicular to the second direction.

[0017] The present invention also provides a display structure, which includes a module substrate and MiniLED lamp beads of the PCB type substrate described in any of the above items, the MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines.

[0018] In one embodiment of the present invention, the module substrate is a PCB board, glass or a flexible circuit board.

[0019] The present invention further provides a MiniLED lamp bead with a PCB type substrate, comprising a PCB type substrate and a light-emitting chipset, wherein the PCB type substrate comprises a first end face and a second end face, the light-emitting chipset is arranged on the first end face of the PCB type substrate, the light-emitting chipset comprises an R chip, a G chip and a B chip, and the second end face of the PCB type substrate is provided with four electrodes, the four electrodes comprise an R anode, a G anode, a B anode and a common cathode or are an R cathode, a G cathode, a B cathode and a common anode;

[0020] The second end surface of the PCB type substrate is a square, the four electrodes are respectively located on the four sides of the second end surface, and the R anode, the G anode, and the B anode are all at different distances from the two end points of the side of the second end surface where they are located;

[0021] When the four electrodes are an R anode, a G anode, a B anode and a common cathode, any adjacent electrodes among the R anode, the G anode and the B anode are arranged 90 degrees rotationally symmetrically around the center of the second end face, the distance from the common cathode to the center of the second end face is greater than the distance from the R anode, the G anode and the B anode to the center of the second end face, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are located in the first signal layer, and the signal line of the common cathode is located in the second signal layer;

[0022] When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, any adjacent electrodes among the R cathode, G cathode and B cathode are arranged in a 90-degree rotational symmetry around the center of the second end face, the distance from the common anode to the center of the second end face is greater than the distance from the R cathode, G cathode and B cathode to the center of the second end face, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

[0023] In one embodiment of the present invention, when the four electrodes are an R anode, a G anode, a B anode and a common cathode, two of the three signal lines, namely, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode, are straight lines parallel to each other and are routed in a first direction, and the third is a curve and runs through the gap between two adjacent MiniLED lamp beads to avoid the common cathode; the signal line of the common cathode is a straight line and is routed in a second direction;

[0024] When the four electrodes are R cathode, G cathode, B cathode and common anode, two of the three signal lines, namely the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode, are straight lines parallel to each other and are routed along a first direction, and the third is a curve and runs through the gap between two adjacent MiniLED lamp beads to avoid the common anode; the signal line of the common anode is a straight line and is routed along a second direction; the first direction is perpendicular to the second direction.

[0025] The present invention also provides a display structure, which includes a module substrate and MiniLED lamp beads of a PCB-type substrate as described in any of the above items, the MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines.

[0026] The above technical solution of the present invention has the following advantages compared with the prior art:

[0027] The MiniLED lamp bead with a PCB substrate of the present invention can realize packaging on a module substrate using only two signal line layers with a smaller lamp bead gap by rearranging the four electrodes on the second end surface of the PCB substrate, thereby effectively reducing production costs.

[0028] Compared with the traditional layout, the electrode layout in the present invention can use a relatively larger electrode pad, so that the patch is more stable and more firm after welding.

[0029] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0031] Figure 1 It is a schematic diagram of electrodes of existing 4-electrode lamp beads and 6-electrode lamp beads;

[0032] Figure 2 This is a schematic diagram of the signal lines that can be used when the gap between existing LED lamp beads is large;

[0033] Figure 3 This is a schematic diagram of the signal lines that can be used when the gap between existing LED lamp beads is small but the size of the lamp beads themselves is large;

[0034] Figure 4 This is a schematic diagram of the signal line that can be used when the gap between existing LED lamp beads is small and the size of the lamp beads is also small;

[0035] Figure 5 Schematic diagram of electrodes of a MiniLED lamp bead on a PCB substrate in Embodiment 1 of the present invention;

[0036] Figure 6 This is a schematic diagram of a 2-layer signal line of a MiniLED lamp bead on a PCB substrate in the first embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of electrodes of a MiniLED lamp bead with a PCB-type substrate in Embodiment 3 of the present invention;

[0038] Figure 8 It is a schematic diagram of the 2-layer signal line of the MiniLED lamp bead on the PCB substrate in the third embodiment of the present invention. DETAILED DESCRIPTION

[0039] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0040] Embodiment 1

[0041] The present embodiment discloses a MiniLED lamp bead with a PCB type substrate, wherein the MiniLED lamp bead with a PCB type substrate comprises a PCB type substrate and a light-emitting chip group, wherein the PCB type substrate comprises a first end surface and a second end surface, wherein the light-emitting chip group is arranged on the first end surface of the PCB type substrate, wherein the light-emitting chip group comprises an R chip, a G chip and a B chip, and wherein the second end surface of the PCB type substrate is provided with four electrodes, wherein the four electrodes are an R anode, a G anode, a B anode and a common cathode, or are an R cathode, a G cathode, a B cathode and a common anode.

[0042] Reference Figure 5 The second end surface of the PCB substrate (refer to Figure 5 The large square in the middle box is a square, and the four electrodes (refer to Figure 5 The four small squares in the middle are respectively located on the four sides of the second end face, and each electrode is located between the end point and the midpoint of the side of the second end face where it is located, and the two electrodes on any two adjacent sides are arranged in 90-degree rotational symmetry around the center of the second end face.

[0043] When the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode (refer to Figure 6 The horizontal solid line in the middle) is located in the first signal layer, and the common cathode signal line (refer to Figure 6 The middle vertical dotted line) is located in the second signal layer;

[0044] When the four electrodes are R cathode, G cathode, B cathode and common anode, the signal line of R cathode, the signal line of G cathode and the signal line of B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

[0045] Optionally, the four electrodes are all rectangles of equal size, and one side of each electrode coincides with one side of the second end surface where the electrode is located.

[0046] Furthermore, the four electrodes are all squares of equal size, the side length of the four electrodes is t, the pad size is approximately t*t, the side length of the second end surface is N, and t≤N / 4 is satisfied, so that the projections of the four electrodes on the second end surface in the horizontal and vertical directions have no overlap.

[0047] Specifically, when the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common cathode is a straight line and is arranged along a second direction;

[0048] When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common anode is a straight line and is arranged along a second direction; the first direction is perpendicular to the second direction, with reference to Figure 6 Under this layout, even if the gap between the lamp beads is further reduced, even if the gap is only b, the module substrate only needs to use two signal line layers as in the traditional method, which can effectively reduce the production cost. Among them, the processing limit of the PCB type substrate is the minimum line gap b.

[0049] Let the gap between two adjacent MiniLED beads be p, and the processing limit of the PCB substrate be the minimum line width a and the minimum line gap b. If the traditional electrode layout is used and only two layers of signal lines are to be routed as shown in Figure 2 and Figure 3 , then the following requirements apply:

[0050] When p ≥ 2a + 3b, it is required that t ≤ (N - a - 2b) / 2;

[0051] When a + 2b ≤ p < 2a + 3b, it is required that t < (N - 2a - 3b) / 2;

[0052] If b ≤ p < a + 2b, three layers of signal lines must be routed anyway.

[0053] If the electrode layout in this embodiment is used:

[0054] As long as p ≥ b and t ≤ N / 4, t ≤ N + p - 3a - 4b, t < (N + p - 2a - 3b) / 2, and t < (N + p - a - 2b) / 3 are satisfied, only two layers of signal lines can be routed.

[0055] In summary, when (N - 2a - 3b) / 2 < N / 4, and (N - 2a - 3b) / 2 < N + p - 3a - 4b and (N - 2a - 3b) / 2 < (N + p - 2a - 3b) / 2 (this is an inevitable event) and (N - 2a - 3b) / 2 < (N + p - a - 2b) / 3;

[0056] That is, N < 4a + 6b and N < 2p + 4a + 5b and N > 4a + 5b - 2p,

[0057] Considering p > b, it is further simplified to: 4a + 5b - 2p < N < 4a + 6b.

[0058] Substituting into the actual process capabilities calculation, for example, for mainstream Mini LED beads such as 0606 beads used in a module board with a pixel pitch of 0.9375 mm, the size N*N is 0.65*0.65 mm, and the bead gap p = 0.9375 - 0.65 = 0.2875 mm; for mainstream board factories capable of making HDI PCB boards, the minimum line width a = 0.075 mm and the minimum line gap b is 0.075 mm.

[0059] If the traditional electrode layout is adopted, since p = 0.2875 mm < 2a + 3b = 0.375 mm, therefore, when it is required that t ≤ (N - 2a - 3b) / 2 = (0.65 - 0.375) / 2 = 0.1375 mm, only two layers of signal lines can be routed;

[0060] If the electrode layout in this embodiment is used:

[0061] t≤N / 4=0.65 / 4=0.1625mm, t≤N+p-3a-4b=0.65+0.2875-0.525=0.4125mm;

[0062] t≤(N+p-2a-3b) / 2=(0.65+0.2875-0.375) / 2=0.28125mm;

[0063] t≤(N+pa-2b) / 3=(0.65+0.2875-0.225) / 3=0.2375mm;

[0064] That is, when t≤0.1625mm, only two layers of signal lines can be used;

[0065] If we consider increasing the brightness of the light while limiting the thickness of the copper foil on the PCB board, and taking into account the use of a lower-cost PCB copper wire etching process, the line width will generally not be used to the lowest limit. For example, 0606 lamp beads are still used for module boards with a pixel pitch of 0.9375mm, but with a relatively thicker line width of 0.1mm and a larger line gap of 0.1mm.

[0066] Then, according to the above calculation, the traditional electrode layout requires t≤0.075mm; the electrode layout in this embodiment requires t≤0.1625mm and t≤0.2375mm and t≤0.21875mm and t≤0.2125mm, that is, t≤0.1625mm; it can be seen that under this premise, the electrode layout in this embodiment has a more obvious advantage.

[0067] The MiniLED lamp bead with a PCB substrate in this embodiment can be packaged on the module substrate using only two signal line layers with a smaller gap between the lamp beads by rearranging the four electrodes on the second end surface of the PCB substrate, thereby effectively reducing production costs.

[0068] Compared with the traditional layout, the electrode layout in this embodiment can use a relatively larger electrode pad, so that the patch is more stable and more firm after welding.

[0069] Embodiment 2

[0070] This embodiment discloses a display structure, which includes a module substrate and the MiniLED lamp beads of the PCB type substrate described in the first embodiment, the MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines. Optionally, the module substrate is a PCB board, glass or a flexible circuit board.

[0071] Embodiment 3

[0072] The present embodiment discloses a MiniLED lamp bead with a PCB type substrate, comprising a PCB type substrate and a light-emitting chip group, wherein the PCB type substrate comprises a first end surface and a second end surface, the light-emitting chip group is arranged on the first end surface of the PCB type substrate, the light-emitting chip group comprises an R chip, a G chip and a B chip, and the second end surface of the PCB type substrate is provided with four electrodes, wherein the four electrodes are an R anode, a G anode, a B anode and a common cathode, or are an R cathode, a G cathode, a B cathode and a common anode.

[0073] Reference Figure 7 The second end surface of the PCB substrate (refer to Figure 7 The large square in the middle box is a square, and the four electrodes (refer to Figure 7 The four small boxes in the middle are respectively located on the four sides of the second end face, and the R anode, the G anode, and the B anode are all at different distances from the two end points of the side of the second end face where they are located.

[0074] When the four electrodes are an R anode, a G anode, a B anode and a common cathode, the R anode, the G anode, the B anode (refer to Figure 7 Any adjacent electrodes in the three shaded small boxes) are arranged 90 degrees rotationally symmetrically around the center of the second end face, and the common cathode (refer to Figure 7 The distance from the R anode, the G anode, and the B anode to the center of the second end face is greater than the distance from the R anode, the G anode, and the B anode to the center of the second end face, the signal line of the R anode, the signal line of the G anode, and the signal line of the B anode are located in the first signal layer, and the signal line of the common cathode is located in the second signal layer.

[0075] When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, any adjacent electrodes among the R cathode, G cathode and B cathode are arranged in a 90-degree rotational symmetry around the center of the second end face, the distance from the common anode to the center of the second end face is greater than the distance from the R cathode, G cathode and B cathode to the center of the second end face, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

[0076] Optionally, the four electrodes are all rectangles of equal size, and one side of each electrode coincides with one side of the second end surface where the electrode is located.

[0077] Furthermore, when the four electrodes are R anode, G anode, B anode and common cathode, the two endpoints of the edge of the second end face where the common cathode is located are M and N respectively, and endpoint M is the endpoint closer to the common cathode. The difference between this embodiment and embodiment 1 is that the common cathode continues to move toward endpoint M, and can even move to the corner of the second end face. At this time, the two edges of the common cathode overlap with the two edges of the second end face respectively. At the same time, the R anode, G anode, and B anode are no longer restricted by the midpoint of the edge of the second end face where they are located, that is, at least one of the R anode, G anode, and B anode can be located at the center point of the edge of the second end face where it is located, and it is only necessary to ensure that the projections of the R anode, G anode, and B anode on the second end face in the horizontal and vertical directions have no overlap.

[0078] Optionally, two of the three signal lines, namely, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode, are straight lines parallel to each other and run along a first direction, and the third is a curve and runs through the gap between two adjacent MiniLED lamp beads to avoid the common cathode; the signal line of the common cathode is a straight line and runs along a second direction; the first direction is perpendicular to the second direction, with reference to Figure 8 .

[0079] The same applies when the four electrodes are an R cathode, a G cathode, a B cathode and a common anode.

[0080] The MiniLED lamp bead with a PCB substrate in this embodiment can also be packaged on the module substrate using only two signal line layers when the gap between the lamp beads is smaller by rearranging the four electrodes on the second end surface of the PCB substrate, thereby effectively reducing production costs.

[0081] Compared with the traditional layout, the electrode layout in this embodiment can use a relatively larger electrode pad, so that the patch is more stable and more firm after welding.

[0082] Embodiment 4

[0083] This embodiment discloses a display structure, which includes a module substrate and MiniLED lamp beads on the PCB type substrate described in Example 3. The MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines.

[0084] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the protection scope of the invention.

Claims

1. A MiniLED lamp bead with a PCB substrate, comprising a PCB substrate and a light-emitting chipset, wherein the PCB substrate comprises a first end face and a second end face, the light-emitting chipset is arranged on the first end face of the PCB substrate, the light-emitting chipset comprises an R chip, a G chip and a B chip, the second end face of the PCB substrate is provided with four electrodes, the four electrodes are an R anode, a G anode, a B anode and a common cathode or an R cathode, a G cathode, a B cathode and a common anode, characterized in that: The second end face of the PCB type substrate is a square, the four electrodes are respectively located on the four sides of the second end face, and each electrode is located between the end point and the midpoint of the side of the second end face where it is located, and the two electrodes on any two adjacent sides are arranged 90 degrees rotationally symmetrically around the center of the second end face; When the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are located in a first signal layer, and the signal line of the common cathode is located in a second signal layer; When the four electrodes are R cathode, G cathode, B cathode and common anode, the signal line of R cathode, the signal line of G cathode and the signal line of B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

2. The MiniLED lamp bead with a PCB substrate according to claim 1, characterized in that: The four electrodes are all rectangles of equal size, and one side of each electrode coincides with one side of the second end surface where it is located.

3. The MiniLED lamp bead with a PCB substrate according to claim 2, characterized in that: The four electrodes are all squares of equal size, the side lengths of the four electrodes are t, the side length of the second end surface is N, and t≤N / 4 is satisfied.

4. The MiniLED lamp bead with a PCB substrate according to claim 3, characterized in that: The gap between two adjacent MiniLED lamp beads is p, and the processing limit of the PCB substrate is the minimum line width a and the minimum line gap b, which satisfies: 4a+5b-2p <N<4a+6b。 5. The MiniLED lamp bead with a PCB substrate according to claim 1, characterized in that: When the four electrodes are an R anode, a G anode, a B anode and a common cathode, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common cathode is a straight line and is arranged along a second direction; the first direction is perpendicular to the second direction; When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are straight lines parallel to each other and are arranged along a first direction; the signal line of the common anode is a straight line and is arranged along a second direction; the first direction is perpendicular to the second direction.

6. A display structure, characterized in that: A MiniLED lamp bead comprising a module substrate and a PCB type substrate as described in any one of claims 1 to 5, wherein a MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines.

7. The display structure according to claim 6, characterized in that: The module substrate is a PCB board, glass or a flexible circuit board.

8. A MiniLED lamp bead with a PCB substrate, comprising a PCB substrate and a light-emitting chipset, wherein the PCB substrate comprises a first end face and a second end face, the light-emitting chipset is arranged on the first end face of the PCB substrate, the light-emitting chipset comprises an R chip, a G chip and a B chip, the second end face of the PCB substrate is provided with four electrodes, the four electrodes comprise an R anode, a G anode, a B anode and a common cathode or an R cathode, a G cathode, a B cathode and a common anode, characterized in that: The second end face of the PCB type substrate is a square, the four electrodes are respectively located on the four sides of the second end face, and any electrode among the R anode, the G anode, and the B anode or any electrode among the R cathode, the G cathode, and the B cathode maintains a distance from the two end points of the side of the second end face where it is located, and the distances are unequal; When the four electrodes are an R anode, a G anode, a B anode and a common cathode, any adjacent electrodes among the R anode, the G anode and the B anode are arranged 90 degrees rotationally symmetrically around the center of the second end face, the distance from the common cathode to the center of the second end face is greater than the distance from the R anode, the G anode and the B anode to the center of the second end face, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode are located in the first signal layer, and the signal line of the common cathode is located in the second signal layer; When the four electrodes are an R cathode, a G cathode, a B cathode and a common anode, any adjacent electrodes among the R cathode, G cathode and B cathode are arranged in a 90-degree rotational symmetry around the center of the second end face, the distance from the common anode to the center of the second end face is greater than the distance from the R cathode, G cathode and B cathode to the center of the second end face, the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode are located in the first signal layer, and the signal line of the common anode is located in the second signal layer.

9. The MiniLED lamp bead with a PCB substrate according to claim 8, characterized in that: When the four electrodes are an R anode, a G anode, a B anode and a common cathode, two of the three signal lines, namely, the signal line of the R anode, the signal line of the G anode and the signal line of the B anode, are straight lines parallel to each other and run along a first direction, and the third is a curve and runs through a gap between two adjacent MiniLED lamp beads to avoid the common cathode; the signal line of the common cathode is a straight line and runs along a second direction; the first direction is perpendicular to the second direction; When the four electrodes are R cathode, G cathode, B cathode and common anode, two of the three signal lines, namely the signal line of the R cathode, the signal line of the G cathode and the signal line of the B cathode, are straight lines parallel to each other and are routed along a first direction, and the third is a curve and runs through the gap between two adjacent MiniLED lamp beads to avoid the common anode; the signal line of the common anode is a straight line and is routed along a second direction; the first direction is perpendicular to the second direction.

10. A display structure, characterized in that: A MiniLED lamp bead comprising a module substrate and a PCB type substrate as described in any one of claims 8 to 9, wherein a MiniLED lamp bead array is arranged on the module substrate, and the MiniLED lamp beads are electrically connected to each other through signal lines.

Images