Wafer roll preparation method, wafer roll and wafer roll preparation device

Abstract

The embodiment of the present application relates to a wafer roll preparation method, a wafer roll and a wafer roll preparation device, wherein the wafer roll comprises a roll body and a roll core, and the wafer roll preparation method comprises: step S11. rolling the roll body and injecting the roll core therein, wherein the roll core comprises a first component and a second component mixed with each other, wherein in step S11, the temperature of the roll core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component. The embodiment of the present application can simultaneously perform the roll body rolling and the roll core injection of the wafer roll online, which can be beneficial to simplifying the wafer roll preparation process, improving production capacity, reducing difficulty and cost, and the first component is almost not melted or burned during the injection of the roll core, which can help maintain the specific properties, effects, taste, etc. of the first component and even the entire roll core.

Description

Technical Field

[0001] The invention relates to the field of food technology, and in particular to a wafer roll preparation method, a wafer roll and a wafer roll preparation device. Background Art

[0002] Among the foods available on the market, wafer rolls with a crispy body and a thick filling are often favored by consumers.

[0003] However, in some existing wafer roll preparation methods, the wafer roll body rolling and core injection are performed in stages, for example, the roll body is rolled first, and then the core is injected into the roll after the roll body is cooled, which makes the wafer roll preparation process complicated, the production capacity is low, and the difficulty and cost are high; or, when the core contains, for example, solid particles, such as the first component of popping candy, due to the high temperature during the rolling of the wafer roll body, the popping candy and the roll body are in direct contact and will melt, releasing carbon dioxide gas, which affects the taste of the product.

[0004] Therefore, there is an urgent need to provide a method for preparing a wafer roll in which the first component in the roll core comprises solid particles, especially suitable for the above-mentioned popping candy. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a wafer roll preparation method, a wafer roll and a wafer roll preparation device.

[0006] To achieve the above purpose, one aspect of an embodiment of the present invention relates to a method for preparing a wafer roll, wherein the wafer roll comprises a roll body and a roll core, and the method comprises: step S11. rolling the roll body and injecting the roll core therein, wherein the roll core comprises a first component and a second component that are mixed with each other, and in step S11, the temperature of the roll core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component.

[0007] In some embodiments, the first component includes solid particles, the solid particles include popping candies, and the weight of the popping candies accounts for 5%-10% of the weight of the curling core.

[0008] In some embodiments, in step S11, the temperature of the winding core is between 25°C and 30°C.

[0009] In some embodiments, the second component includes edible oil and powder, the edible oil includes a first fat having a first melting point and a second fat having a second melting point, and the first melting point and the second melting point are different from each other.

[0010] In some embodiments, the first melting point is between 38°C and 45°C, the second melting point is between 18°C ​​and 23°C, and the edible oil includes 60% to 70% by weight of the first fat and 30% to 40% by weight of the second fat.

[0011] In some embodiments, the second component includes 35 wt % to 40 wt % of edible oil and the balance is powder.

[0012] In some embodiments, the volume of the core accounts for 70%-100% of the volume of the roll body.

[0013] Another aspect of the embodiments of the present invention relates to a wafer roll, which is prepared by the wafer roll preparation method described in the present application.

[0014] Another aspect of an embodiment of the present invention relates to a wafer roll preparation device, which includes: a roll injection device, suitable for rolling a roll body and injecting a core into the roll body at the same time, the core including a first component and a second component mixed with each other, when being injected into the roll body, the temperature of the core is lower than the melting temperature or the burning temperature of the first component and not lower than the melting temperature of the second component.

[0015] In some embodiments, the wafer roll preparation device includes a storage device and a feeding device connected to each other, a first jacket is provided on the outside of the storage device, a second jacket is provided on the outside of the feeding device, and the feeding device connects the storage device and the rolling device.

[0016] The embodiments of the present application can simultaneously perform wafer roll body rolling and core injection online, which can be beneficial to simplifying the wafer roll preparation process, improving production capacity, reducing difficulty and cost, and the first component is hardly melted or burnt during the core injection, which can help maintain the specific properties, effects, taste, etc. of the first component and even the entire core.

[0017] If technical conditions permit, the technical solutions of the embodiments of the present application can be combined arbitrarily.

[0018] The present application will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals may be used in the drawings to refer to the same or similar elements, devices, shapes, structures, and steps in different embodiments, and the descriptions of the same or similar elements, devices, shapes, structures, steps, features, and effects in different embodiments and the descriptions of the same or similar elements, devices, shapes, structures, steps, features, and effects in the prior art may be omitted. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of a process for preparing a wafer roll according to an embodiment of the present invention;

[0020] Figure 2 is a three-dimensional schematic diagram of a wafer roll preparation device according to an embodiment of the present invention;

[0021] Figure 3 for Figure 2 A three-dimensional schematic diagram of a roll filling device of a medium wafer roll preparation device;

[0022] Figure 4 for Figure 3 A schematic cross-sectional view of a mid-volume injection device;

[0023] Figure 5 for Figure 2 A schematic cross-sectional view of a storage device of a medium wafer roll preparation device; and

[0024] Figure 6 for Figure 2 Schematic diagram of a partial cross-section of a feeding device of a wafer roll preparation machine. DETAILED DESCRIPTION

[0025] Figure 1 FIG. 1 is a schematic diagram of a process for preparing a wafer roll according to an embodiment of the present invention. Figure 1 As shown, one aspect of an embodiment of the present invention relates to a wafer roll preparation method 10, wherein the wafer roll comprises a roll body and a roll core, and the wafer roll preparation method 10 comprises: step S11. rolling the roll body and injecting the roll core therein, wherein the roll core comprises a first component and a second component mixed with each other, and in step S11, the temperature of the roll core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component.

[0026] In the wafer roll preparation method 10 of the present invention, through step S11, the wafer roll body rolling and core injection can be performed online at the same time, without the need for a cooling step between the body rolling and core injection, thereby simplifying the wafer roll preparation process and improving production capacity.

[0027] In addition, the roll body after cooling is crispy and easy to fall off, and the core injection operation is difficult. In step S11, the roll body is rolled and the core is injected simultaneously, which can reduce the difficulty of preparing the wafer roll.

[0028] Furthermore, by simultaneously performing the wafer roll body rolling and the wafer core injection online in step S11 , additional equipment such as a cooling device and an injection device can be omitted, thereby reducing the wafer roll preparation cost.

[0029] In step S11, the wafer roll body can be rolled according to a wafer roll body rolling method commonly used in the art. For example, flour, water, sugar, syrup, egg liquid and a little oil can be mixed in advance to prepare a batter, the batter is baked to form a dough skin, and then the dough skin is sent to the rolling device 22 (see Figure 2 ) is rolled to obtain a roll body.

[0030] The temperature of the core is lower than the melting temperature or burning temperature of the first component, which can prevent the first component from melting or burning when the core is injected, thereby preventing the first component from melting or burning and destroying the specific properties, effects, taste, etc. of the first component and even the entire core; the temperature of the core is not lower than the melting temperature of the second component, which can make the second component in a molten state and fluid when the core is injected, thereby giving the core fluidity, which can facilitate the easy and convenient operation of core injection.

[0031] The core of the roll includes a first component and a second component that are mixed with each other. In step S11, the temperature of the core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component. The core can be smoothly injected into the roll body while ensuring that the specific properties, effects, taste, etc. of the first component and even the entire core are not affected by the injection temperature.

[0032] Here, compared with the first component alone as the core, the first component and the second component are mixed with each other in the core, for example, the first component can be uniformly dispersed in the second component. In step S11, the probability of the first component directly contacting the inner wall of the roll whose rolling temperature is usually between 130°C and 150°C can also be reduced, which can reduce the risk of the first component melting or burning due to intolerance to the temperature of the inner wall of the roll.

[0033] Specifically, the first component and the second component can be mixed into a core in advance and placed in the storage device 30 (see Figure 2 ) for storage and standby, and then through the feeding device 32 (see Figure 2 ) sends the core to the roll injection device 22, and the roll injection device 22 injects the core into the roll body while rolling the roll body, so that the roll body rolling and core injection of the wafer roll are carried out online at the same time.

[0034] In some embodiments, the injected roll core may adopt a layered structure. Specifically, the first component and the second component may be mixed together to form a mixed filling, and then the second component may be wrapped around the outer periphery of the mixed filling to form the roll core. In the roll core formed in this way, the mixed filling is located in the innermost layer of the entire roll core, which can prevent the mixed filling from directly contacting the inner wall of the high-temperature roll, thereby causing, for example, popping candies therein to melt and release carbon dioxide gas, thereby losing a specific taste.

[0035] In specific implementation, the above steps can be performed by selecting a winding injection device with a core injection gun head having a multi-layer structure. For example, the core injection gun head with a multi-layer structure can be a ring structure, the inner ring can correspond to the mixed filling formed by mixing the first component and the second component, and the outer layer can correspond to the second component, but because this structure is not the focus of protection of this application, it will not be elaborated in detail.

[0036] In the embodiments of the present invention, unless otherwise specifically stated, the “first component” and the “second component” each refer to any component that can be used as a wafer roll core, as long as it is suitable for the present invention.

[0037] In the embodiments of the present invention, unless otherwise specified, "first", "second" and similar terms are not intended to indicate priority, importance, etc., but are mainly used to distinguish the indicators, elements, devices, shapes, structures, etc. they modify.

[0038] In the embodiments of the present invention, unless otherwise specified, "the temperature of the core is not lower than the melting temperature of the second component" means that the temperature of the core makes the second component in such an aggregated state that it can undergo irreversible continuous deformation when subjected to any small shear force. The aggregated state here mainly refers to a solid state that cannot undergo irreversible deformation, for example, it can be a liquid state, or a physical state similar to the "viscous flow state" or "plastic state" of a polymer.

[0039] In the embodiments of the present invention, unless otherwise specified, "fluidity" refers to the property that the entire molecules or molecular chains of a substance can slide against each other under the action of an external force, and the deformation caused by this mutual sliding is irreversible, that is, the deformation cannot spontaneously recover after the external force is removed.

[0040] In some embodiments, the first component includes solid particles, the solid particles include popping candies, and the weight of the popping candies accounts for 5%-10% of the weight of the curling core.

[0041] In this way, it is helpful to give the wafer roll a bouncing taste through the popping candy, which can help make the wafer roll interesting.

[0042] Solid particles may also include nuts, nut pieces, dried fruits, dried vegetables, cereals, biscuits, cakes and other granular ingredients.

[0043] Popping candy refers to candy particles with added carbon dioxide. The usage temperature of popping candy is below 40℃. When it melts in the mouth, it releases carbon dioxide gas, which creates a bouncing taste. Temperatures above 40℃ usually cause popping candy to melt.

[0044] If the content of popping candy in the roll core is less than 5% by weight, the final wafer roll will not have a distinct bouncy taste; if the content of popping candy in the roll core is more than 10% by weight, the wafer roll preparation cost is high, and the roll core at the roll injection device 22 is not smoothly injected. The weight of the popping candy is between 5% and 10% of the weight of the roll core, which not only makes the final wafer roll have a distinct bouncy taste, but also makes the wafer roll preparation cost low and the roll core injection smooth.

[0045] In the embodiments of the present invention, unless otherwise specified, the numerical range may include any sub-range therein. For example, 5%-10% may include 5%-7%, 7%-9%, 9%-10%, etc.

[0046] In some embodiments, in step S11, the temperature of the winding core is between 25°C and 30°C.

[0047] This can help prevent the popping candies in the roll from melting and other types of solid particles from burning.

[0048] The initial temperature of the core in the storage device 30 may be between 20°C and 25°C. During the process of being sent to the winding device 22 via the feeding device 32, the temperature may rise to 25°C to 30°C due to being sent and extruded.

[0049] In some embodiments, the second component includes edible oil and powder, the edible oil includes a first fat having a first melting point and a second fat having a second melting point, and the first melting point and the second melting point are different from each other.

[0050] This can be helpful in adjusting the fluidity and melting temperature of the second component, and can help the second component to give the core proper fluidity so that the core can be transported and injected smoothly while preventing the core injected into the roll from overflowing.

[0051] The powder may include white sugar, milk powder, maltodextrin, seasoning powder, salt, flavor pigment, etc. The seasoning powder may include powdered seasonings such as matcha powder, cheese powder, and whey powder.

[0052] By adjusting the ratio of edible oil to powder, the fluidity of the second component can be adjusted.

[0053] By adjusting the ratio of the first oil to the second oil, the melting temperature and fluidity of the second component can be adjusted.

[0054] In some embodiments, the first melting point is between 38°C and 45°C, the second melting point is between 18°C ​​and 23°C, and the edible oil includes 60% to 70% by weight of the first fat and 30% to 40% by weight of the second fat.

[0055] In this way, the melting temperature of the second component can be controlled between 20°C and 25°C, which can help the second component to impart fluidity to the core without melting or burning the first component.

[0056] The first oil may be, for example, palm oil or the like.

[0057] The second fat may be, for example, palm oil, coconut oil, or the like.

[0058] In some embodiments, the second component includes 35 wt % to 40 wt % of edible oil and the balance is powder.

[0059] In this way, the second component can have weak fluidity, which can help the second component to impart fluidity to the core and prevent the core from overflowing from the roll body and wasting raw materials.

[0060] For example, the second component may include 35% to 40% by weight of the first oil and the second oil, 23% to 27% by weight of white sugar, 25% to 30% by weight of milk powder and maltodextrin, 3% to 8% by weight of seasoning powder, and 1% to 1.5% by weight of salt and flavor pigments, so that the wafer core can be conveyed and injected smoothly, and the final wafer roll product is moderately soft and dry with a pleasant taste.

[0061] In some embodiments, the volume of the core accounts for 70%-100% of the volume of the roll body.

[0062] This can help enhance the bouncy taste of the first component in the wafer roll, such as popping candy, and can help the roll core to be sufficient in weight, with a rich and full-bodied taste. For example, the popping candy particles can be better embedded, effectively reducing the risk of the popping candy melting due to contact with the inner wall of the roll.

[0063] The wafer roll preparation method 10 of the present invention may further include, after step S11, a step of, for example, cutting the roll body with the core injected therein by a cutter. After cutting, the wafer roll body may have a length of about 50 mm and a weight of about 1.6 g. The weight of the core injected into each wafer roll body may be 2.1 g to 3 g.

[0064] The wafer roll preparation method 10 of the present invention may further include a step of cooling the cut wafer rolls. For example, since the roll core in the embodiment of the present invention will not overflow from the roll body, the cut wafer rolls can be directly stacked and naturally cooled to, for example, a roll body temperature below 35° C., to prevent the water vapor in the hot wafer rolls from affecting the taste of the product after packaging.

[0065] The wafer roll preparation method 10 of the present invention may further include a step of packaging the cooled wafer roll to obtain a wafer roll product.

[0066] Another aspect of an embodiment of the present invention relates to a wafer roll prepared by the method described in the present application.

[0067] In this way, as mentioned above, the wafer roll body rolling and core injection can be carried out simultaneously online, which can be beneficial to simplifying the wafer roll preparation process, improving production capacity, reducing difficulty and cost, and the first component is hardly melted or burnt during the core injection, which can help maintain the specific properties, effects, taste, etc. of the first component and even the entire core.

[0068] Figure 2 Schematic diagram of a wafer roll preparation device according to an embodiment of the present invention. Figure 2As shown, another aspect of an embodiment of the present invention relates to a wafer roll preparation device 20, which includes: a roll injection device 22, suitable for rolling a roll body and injecting a core into the roll body at the same time, the core including a first component and a second component mixed with each other, when being injected into the roll body, the temperature of the core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component.

[0069] The wafer roll preparation method 10 described in the present application can be effectively performed by the wafer roll preparation equipment 20. As mentioned above, the wafer roll body rolling and the core injection can be performed online at the same time, which can be beneficial to simplify the wafer roll preparation process, improve production capacity, reduce difficulty and cost, and the first component is hardly melted or burnt during the core injection, which can help to maintain the specific properties, effects, taste, etc. of the first component and even the entire core.

[0070] Unless otherwise specifically stated, the wafer roll making apparatus 20 and the roll filling device 22 may each have any possible configuration as long as it is suitable for use in the present invention.

[0071] Figure 3 for Figure 2 Schematic diagram of the rolling device of the wafer roll preparation machine. Figure 4 for Figure 3 A cross-sectional view of the mid-volume injection device. Figure 3 and 4 As shown, in some embodiments, the rolling and filling device 22 includes a rolling part 24 and a circulation part 26 that passes through the rolling part 24. The rolling part 24 is used to roll the dough into a roll body. The roll core can flow through the circulation part 26 and can directly reach the inner side of the roll body after flowing through the circulation part 26. In this way, the rolling and filling device 22 can simultaneously roll the roll body and fill the roll core through the rolling part 24 and the circulation part 26, respectively, so that the roll body rolling and roll core filling of the wafer roll can be carried out online at the same time.

[0072] The rolled portion 24 may be a substantially rod-shaped body. For example, the rolled portion 24 may be a substantially cylindrical member.

[0073] The flow-through portion 26 may be a space inside the rolled portion 24. For example, the flow-through portion 26 may be a substantially circular through hole defined by the rolled portion 24.

[0074] In some embodiments, the rolling portion 24 may include a groove 28 on the outer side thereof to increase the friction between the rolling portion 24 and the dough, making the rolling convenient and effective.

[0075] In the embodiment of the present invention, unless otherwise specified, the groove 28 may have any applicable structure.

[0076] Figure 5 for Figure 2 Schematic cross-sectional view of a storage device for a wafer roll production plant. Figure 6 for Figure 2 Schematic diagram of a partial cross section of the feeding device of a wafer roll making machine. Figure 2 In some embodiments, the wafer roll preparation device 20 includes a storage device 30 and a feeding device 32 that are connected to each other, such as Figure 5 As shown, a first jacket 34 is provided outside the storage device 30. Figure 6 As shown, a second jacket 36 is disposed outside the feeding device 32 , and the feeding device 32 is connected to the storage device 30 and the winding device 22 .

[0077] In this way, the temperature of the core can be controlled to be lower than the melting temperature or the burning temperature of the first component and not lower than the melting temperature of the second component, which can help the core to smoothly reach the winding device 22 from the storage device 30 through the feeding device 32.

[0078] The storage device 30 is used to store the winding cores and may be a substantially cylindrical container with an open top.

[0079] The feeding device 32 is used to feed the core, and may include a pipeline 38 and a delivery pump 40. The delivery pump 40 may provide feeding power to the feeding device 32, and may include, for example, a screw pump 42 and a gear pump 44 that are connected to each other. The pipeline 38 may connect the delivery pump 40 with the winding and injection device 22. The screw pump 42 may feed the core into the gear pump 44 continuously and stably, and then the gear pump 44 may continue to feed the core to the pipeline 38 until it reaches the circulation portion 26 of the winding and injection device 22, and finally reaches the inner side of the winding body through the circulation portion 26.

[0080] Unless otherwise specifically stated, the feeding device 32 , the pipeline 38 , the delivery pump 40 , the screw pump 42 , the gear pump 44 , the first jacket 34 and the second jacket 36 may have any possible configuration as long as they are suitable for the present invention.

[0081] The core may be stirred in the storage device 30, squeezed when being fed by the feeding device 32, and affected by the external environment of the wafer roll making apparatus 20, etc., which may cause the core temperature to rise. In order to make the core temperature lower than the melting temperature of the first component, a first jacket 34 and a second jacket 36 may be respectively arranged outside the storage device 30 and the pipeline 38, and cooling water may be respectively injected into the first jacket 34 and the second jacket 36 to make the core temperature meet the expectation.

[0082] The wafer roll preparation device 20 may further include a baking device 46 for baking a dough crust from a batter mixed with, for example, flour, water, sugar, syrup, egg liquid and a little oil. Unless otherwise specifically indicated, the baking device 46 may have any possible structure as long as it is suitable for the present invention.

[0083] When the wafer roll preparation equipment 20 of the present invention is used to prepare wafer rolls, the first component and the second component can be mixed into a roll core in advance and placed in a storage device 30 for storage and standby, and then the dough skin can be prepared by the baking device 46. At the same time, the roll core can be sent to the rolling and filling device 22 by the feeding device 32. While the rolling part 24 of the rolling and filling device 22 rolls the dough skin into a roll body, the roll core can reach the inner side of the roll body through the circulation part 26 of the rolling and filling device 22, so as to obtain a wafer roll with a roll body and a roll core in a preparation method in which the roll body rolling and the roll core injection are carried out online at the same time, so that the wafer roll preparation process is simplified, the production capacity is improved, the difficulty and cost are reduced, and so on.

[0084] The various specific embodiments described above and shown in the drawings are only used to illustrate the present invention, and are not the entire present invention. Within the scope of the basic technical concept of the present invention, any form of changes made by ordinary technicians in the relevant technical field to the present invention are within the protection scope of the present invention.

Claims

1. A method for preparing a wafer roll, wherein the wafer roll comprises a roll body and a roll core, wherein: The method comprises: Step S11. Rolling the roll body and injecting the core into the roll body. The winding core includes a first component and a second component mixed with each other. In the step S11, the temperature of the winding core is lower than the melting temperature or the burning temperature of the first component and is not lower than the melting temperature of the second component; The first component includes solid particles, the solid particles include popping candies, and the weight of the popping candies accounts for 5%-10% of the weight of the core; In the step S11, the temperature of the winding core is between 25°C and 30°C; The second component includes edible oil and powder, the edible oil includes a first fat having a first melting point and a second fat having a second melting point, and the first melting point and the second melting point are different from each other.

2. The wafer roll preparation method according to claim 1, characterized in that: The first melting point is between 38°C and 45°C, the second melting point is between 18°C ​​and 23°C, and the edible oil comprises 60% by weight to 70% by weight of the first fat and 30% by weight to 40% by weight of the second fat.

3. The wafer roll preparation method according to claim 1, characterized in that: The second component comprises 35% to 40% by weight of the edible oil and the remainder of the powder.

4. The wafer roll preparation method according to any one of claims 1 to 3, characterized in that: The volume of the core accounts for 70%-100% of the volume of the roll body.

5. The wafer roll preparation method according to claim 4, characterized in that: The wafer roll preparation method is performed by a wafer roll preparation device, the wafer roll preparation device comprising: The invention discloses a winding and injection device, which is suitable for winding a roll body and injecting a winding core into the roll body at the same time.

6. The wafer roll preparation method according to claim 5, characterized in that: The wafer roll preparation equipment also includes a storage device and a feeding device which are connected to each other. A first jacket is provided on the outside of the storage device, and a second jacket is provided on the outside of the feeding device. The feeding device connects the storage device and the rolling device.

7. A wafer roll, characterized in that: Prepared by the method according to any one of claims 1 to 6.

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