A semiconductor waste gas treatment device and a semiconductor waste gas treatment system

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and provides a semiconductor waste gas treatment device and a semiconductor waste gas treatment system. The semiconductor waste gas treatment device includes a reaction chamber, a collar and a cooler. The cooler is provided with a channel for the circulation of a coolant, and the channel is arranged around the outside of the reaction chamber. The collar is provided with an overflow hole, and the collar is sleeved at the bottom of the reaction chamber, and a storage chamber for storing the coolant is formed between the collar and the reaction chamber. The coolant is stored in the storage chamber at the bottom of the reaction chamber to ensure that the weld at the bottom of the reaction chamber is not directly in contact with the exhaust gas, thereby reducing the corrosion at the bottom of the reaction chamber. At the same time, the coolant circulates in the channel all the time, ensuring that the coolant will not accumulate for a long time, resulting in high acid strength, thereby reducing the temperature in the reaction chamber, slowing down the corrosion rate, and increasing the service life of the reaction chamber.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor waste gas treatment device and a semiconductor waste gas treatment system. Background Art

[0002] When integrated circuits are produced and manufactured, various special gases are used to meet process requirements, such as CF gas, cl2 NF3 and other harmful gases, which are mainly highly toxic and acidic. Such gases cannot be discharged directly. Therefore, adsorption-type tail gas treatment equipment is required for treatment before discharge. The basic principle of adsorption-type tail gas treatment equipment is to use high temperature to open the chemical bonds of the gas, and then combine with oxygen to form oxides and then merge with water.

[0003] Because most of the process gases used in semiconductors are highly corrosive gases, such as HF, HBr, and HCl. The corrosiveness doubles when combined with water, which has a great impact on the service life of the reaction chamber and may even cause serious corrosion of the reaction chamber. In particular, there are welds in the circumferential position of the outer wall of the bottom of the reaction chamber, which are prone to sensitization effects. In addition, the temperature at the location where corrosion occurs is relatively high, which accelerates the corrosion rate, further reducing the corrosion resistance of the reaction chamber and affecting the normal use of the reaction chamber. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the related art. To this end, the present invention proposes a semiconductor waste gas treatment device.

[0005] The present invention also proposes a semiconductor waste gas treatment system, comprising the above-mentioned semiconductor waste gas treatment device.

[0006] According to the first aspect of the present invention, a semiconductor waste gas treatment device includes a reaction chamber, a collar and a cooler. The cooler is provided with a channel for circulating a cooling liquid. The channel is arranged around the outside of the reaction chamber. An overflow hole is provided on the collar. The collar is sleeved on the bottom of the reaction chamber, and a storage chamber for storing the cooling liquid is formed between the collar and the reaction chamber.

[0007] According to the semiconductor waste gas treatment device of the embodiment of the present invention, the channel extends along the axial direction of the reaction chamber.

[0008] According to the semiconductor waste gas treatment device of an embodiment of the present invention, the cooler includes a water storage tank, and the water storage tank is connected to the channel.

[0009] According to the semiconductor waste gas treatment device of an embodiment of the present invention, the cooler further includes a circulation pump and a circulation branch, and the circulation pump is connected to the water storage tank and the channel through the circulation branch.

[0010] According to the semiconductor waste gas treatment device of the embodiment of the present invention, a liquid outlet is provided at the bottom of the collar, and is connected to the water storage tank through the liquid outlet.

[0011] According to the semiconductor waste gas treatment device of the embodiment of the present invention, a pressure gauge is provided on the circulation branch.

[0012] According to the semiconductor waste gas treatment device of an embodiment of the present invention, the cooler further includes a control module, and the control module is connected to the circulation pump to control the operation of the circulation pump.

[0013] According to the semiconductor waste gas treatment device of the embodiment of the present invention, a limiting flow hole is arranged outside the reaction chamber, and the limiting flow hole is connected to the channel.

[0014] According to the semiconductor waste gas treatment device of the embodiment of the present invention, a cooling device is provided between the collar and the water storage tank.

[0015] Furthermore, an embodiment of the present invention also provides a semiconductor waste gas treatment system, including the semiconductor waste gas treatment device described above.

[0016] The above one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects:

[0017] An embodiment of the present invention provides a semiconductor waste gas treatment device, including a reaction chamber, a collar and a cooler, wherein the cooler is provided with a channel for the circulation of a coolant, the channel is arranged around the outside of the reaction chamber, an overflow hole is provided on the collar, the collar is sleeved on the bottom of the reaction chamber, and a storage chamber for storing the coolant is formed between the collar and the reaction chamber. The coolant is stored in the storage chamber at the bottom of the reaction chamber to ensure that the weld at the bottom of the reaction chamber is not directly in contact with the waste gas, thereby reducing corrosion at the bottom of the reaction chamber. At the same time, the coolant circulates in the channel all the time to ensure that the coolant will not accumulate for a long time, thereby reducing the temperature in the reaction chamber, slowing down the corrosion rate, and increasing the service life of the reaction chamber.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1The structure of the semiconductor waste gas treatment device provided by the embodiment of the present invention is shown in FIG. Figure 1 ;

[0021] Figure 2 It is a schematic diagram of the flow of the coolant provided in an embodiment of the present invention.

[0022] Reference numerals:

[0023] 1. Reaction chamber; 11. Flow limiting hole;

[0024] 2. Ring; 21. Overflow hole; 22. Storage chamber; 23. Liquid outlet;

[0025] 3. Cooler; 31. Channel; 32. Water storage tank; 33. Circulation pump; 34. Circulation branch; 35. Pressure gauge; 36. Control module;

[0026] 4. Cooling device. DETAILED DESCRIPTION

[0027] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0029] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0030] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] In addition, in the description of the embodiments of the present invention, unless otherwise specified, "multiple", "multiple roots", and "multiple groups" mean two or more, and "several", "several roots", and "several groups" mean one or more.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0033] An embodiment of one aspect of the present invention, in combination with Figure 1 As shown, a semiconductor waste gas treatment device is provided, including a reaction chamber 1, a collar 2 and a cooler 3, wherein the cooler 3 is provided with a channel 31 for the circulation of a coolant, wherein the channel 31 is arranged around the outside of the reaction chamber 1, and an overflow hole 21 is provided on the collar 2, which is sleeved on the bottom of the reaction chamber 1, and a storage chamber 22 for storing the coolant is formed between the collar 2 and the reaction chamber 1. The coolant is stored in the storage chamber 22 at the bottom of the reaction chamber 1, so as to ensure that the weld at the bottom of the reaction chamber 1 is not directly in contact with the waste gas, thereby reducing the corrosion at the bottom of the reaction chamber 1. At the same time, the coolant circulates in the channel 31 all the time, so as to ensure that the coolant will not accumulate for a long time, reduce the temperature in the reaction chamber 1, slow down the corrosion rate, and increase the service life of the reaction chamber 1.

[0034] The semiconductor waste gas treatment device according to the embodiment of the present invention is as follows: Figure 1As shown, it includes a reaction chamber 1 for waste gas reaction treatment, the reaction chamber 1 is a through structure from top to bottom, the collar 2 is sleeved at the bottom of the reaction chamber 1, and the cooler 3 is configured to form a channel 31 arranged around the reaction chamber 1 corresponding to the portion of the reaction chamber 1, and a coolant flows in the channel 31, and an overflow hole 21 is arranged on the collar 2, and the overflow hole 21 connects the channel 31, the storage chamber 22 and the reaction chamber 1, that is, the coolant flows through the channel 31 and after the storage chamber 22 is fully stored, it overflows along the overflow hole 21 to the inside of the reaction chamber 1 and flows out from the bottom of the collar 2. Optionally, the number of channels 31 can be one or more, and this application does not make specific restrictions on this.

[0035] like Figure 2 As shown, the present invention stores the coolant of the cooler 3 in the storage chamber 22 after flowing through the channel 31 through the channel 31, so that the storage chamber 22 is full of coolant, preventing the exhaust gas from contacting the weld at the bottom of the reaction chamber 1 and causing corrosion. At the same time, when the storage chamber 22 is full of coolant, the excess coolant will flow out from the overflow hole 21, so that the coolant in the storage chamber 22 is continuously circulated, ensuring that the coolant will not accumulate for a long time and cause its acidity to increase, which can improve the cooling effect of the reaction chamber 1. The circulation of the coolant reduces the temperature at the bottom of the reaction chamber 1 and can slow down the corrosion efficiency. The semiconductor waste gas treatment device of the present invention can use the coolant to prevent the exhaust gas from contacting the weld at the bottom of the reaction chamber 1, delay corrosion, effectively reduce the corrosion rate of the reaction chamber 1, and can also reduce the temperature of the reaction chamber 1, slow down the corrosion of the reaction chamber 1 by the exhaust gas, and can also make the coolant evenly distributed at the bottom of the reaction chamber 1 and always store enough coolant in the storage chamber 22, effectively isolating the exhaust gas from contacting the weld at the bottom of the reaction chamber 1, preventing the corrosion of the bottom of the reaction chamber 1, and extending the service life.

[0036] According to an embodiment provided by the present invention, the channel 31 extends along the axial direction of the reaction chamber 1. In this embodiment, the channel 31 is linear and is arranged along the axial extension of the outside of the reaction chamber 1. The channel 31 has a certain width and can cover the surface of the outer wall of the reaction chamber 1. The coolant flowing through the channel 31 can cool the reaction chamber 1 to a certain extent.

[0037] In other embodiments, the shape and direction of the channel 31 can be set according to actual use needs, and can also be partially curved, fully curved, or arranged in an axial spiral along the outside of the reaction chamber 1, etc. This application does not make specific limitations on this.

[0038] According to an embodiment provided by the present invention, the cooler 3 includes a water tank 32 arranged outside the reaction chamber 1, and the water tank 32 is connected to the channel 31. The water tank 32 can be used to provide cooling liquid to the channel 31. After flowing through the channel 31, the storage chamber 22 and the reaction chamber 1, the cooling liquid can return to the water tank 32 for recycling.

[0039] According to an embodiment provided by the present invention, an overflow hole 21 is provided on the side wall of the collar 2, and a storage chamber 22 is formed between the collar 2 and the reaction chamber 1. The storage chamber 22 is used to store coolant to ensure that the weld at the bottom of the reaction chamber 1 does not contact the exhaust gas. It can be understood that the height of the overflow hole 21 determines the volume of the storage chamber 22. The height of the overflow hole 21 can be set according to the needs of the part of the reaction chamber 1 that needs to be isolated. The higher the height of the overflow hole 21, the larger the volume of the storage chamber 22, the more coolant it can accommodate, and the larger the isolated area.

[0040] According to an embodiment provided by the present invention, in order to realize the circulation of the coolant between the channel 31, the storage chamber 22, the reaction chamber 1 and the water tank 32, the cooler 3 is further provided with a circulation pump 33 and a circulation branch 34. The circulation pump 33 is connected to the water tank 32 and the channel 31 through the circulation branch 34 to provide power for the circulation of the coolant, thereby ensuring the flow efficiency of the coolant to the greatest extent, preventing the coolant from accumulating in the storage chamber 22 for a long time, resulting in the acidity of the coolant in the storage chamber 22 being enhanced, which in turn accelerates the corrosion rate of the weld at the bottom of the reaction chamber 1. By accelerating the flow of the coolant through the circulation pump 33, the cooling efficiency of the reaction chamber 1 can also be improved, and the corrosion efficiency of the reaction chamber 1 can be reduced.

[0041] According to an embodiment provided by the present invention, a liquid outlet 23 is provided at the bottom of the collar 2, and the size and number of the liquid outlet 23 can be adjusted according to the actual needs of discharging the coolant. After sufficient coolant is stored in the storage chamber 22, the coolant above the overflow hole 21 will overflow from the overflow hole 21, reach the inside of the reaction chamber 1, and flow out through the liquid outlet 23 provided on the collar 2 at the bottom of the reaction chamber 1. The outflowing coolant can also be gathered in the water storage tank 32, and the next cycle can be carried out after necessary treatment in the water storage tank 32.

[0042] According to one embodiment of the present invention, a pressure gauge 35 is provided on the circulation branch 34. The pressure gauge 35 can monitor the pressure of the coolant inside the circulation branch 34. The pressure gauge 35 can also be used to determine whether the cooler 3 is abnormally damaged. When the measurement value of the pressure gauge 35 changes abnormally, it is necessary to arrange maintenance in time. For example, during the operation of the cooler 3, if it is suddenly found that the measurement value of the pressure gauge 35 is significantly reduced, it may be that a pipeline is damaged, leaking or blocked somewhere. At this time, the circulation branch 34 or the channel 31 and other pipelines can be arranged for maintenance to ensure the normal operation of the cooler 3.

[0043] In other embodiments, other branches that need to use coolant are included, and the circulation branch 34 is connected to the other branches to provide coolant to the other branches for easy control. Optionally, a one-way valve can be set on the circulation branch 34 as needed to control the flow direction of the coolant in the circulation branch 34, which is not specifically limited in this application.

[0044] According to one embodiment of the present invention, the cooler 3 is further provided with a control module 36, which can control the operation of the circulation pump 33 according to the measurement value of the pressure gauge 35, for example, control the power of the circulation pump 33 according to the measurement value of the pressure gauge 35, so as to achieve the purpose of controlling the flow rate of the coolant.

[0045] In other embodiments, a thermometer may be provided on the circulation branch 34 or in the storage chamber 22, and the thermometer is connected to the control module to adjust the operation of the circulation pump 33 according to the temperature. For example, when the thermometer detects that the temperature in the circulation branch 34 is greater than 25°C, the control module controls the circulation pump 33 to increase the power, increase the flow rate of the coolant, further reduce the temperature of the coolant, and reduce the corrosion rate of the reaction chamber 1.

[0046] According to one embodiment of the present invention, a limiting flow hole 11 is arranged outside the reaction chamber 1, and the limiting flow hole 11 is connected to the channel 31 correspondingly. The number of the limiting flow holes 11 is adapted to the number of the channels 31, and can be arranged according to actual needs. Each channel 31 has a limiting flow hole 11 as a liquid inlet. The coolant enters the channel 31 through the limiting flow hole 11, flows through the entire channel 31 and the storage chamber 22, and the excess coolant enters the reaction chamber 1 through the overflow hole 21, and flows out from the liquid outlet 23 at the bottom of the collar 2, and returns to the water storage tank 32 for the next cycle. The limiting flow hole 11, as the liquid inlet of each channel 31, can further control the pressure, flow rate and flow rate of the coolant entering the channel 31. The limiting flow hole 11 can be a hole arranged outside the reaction chamber 1, or it can be an independent limiting device outside that can control the coolant, and this application does not make specific restrictions on this.

[0047] According to one embodiment of the present invention, a cooling device 4 is further provided between the collar 2 and the water storage tank 32. The cooling device 4 can further cool the reaction chamber 1 and cool the coolant flowing out of the liquid outlet 23 of the collar 2, thereby reducing the temperature of the coolant during the circulation process, improving the cooling effect, and reducing the corrosion rate.

[0048] Another embodiment of the present invention further provides a semiconductor waste gas treatment system, including a semiconductor waste gas treatment device as described in the above embodiment.

[0049] The semiconductor waste gas treatment system of the embodiment of the present invention is provided with a reaction chamber 1 which runs through from top to bottom in the semiconductor waste gas treatment device, a collar 2 is provided at the bottom of the reaction chamber 1, a storage chamber 22 is formed between the collar 2 and the reaction chamber 1, and an overflow hole 21 is also provided on the collar 2. After the coolant flows through the channel 31 and the storage chamber 22, the excess coolant flows into the reaction chamber 1 through the overflow hole 21 and is discharged from the bottom of the reaction chamber 1.

[0050] An embodiment of the present invention provides a semiconductor waste gas treatment device, including a reaction chamber 1, a collar 2 and a cooler 3, wherein the cooler 3 is provided with a channel 31 for the circulation of a coolant, wherein the channel 31 is arranged around the outside of the reaction chamber 1, and an overflow hole 21 is provided on the collar 2, which is sleeved on the bottom of the reaction chamber 1, and a storage chamber 22 for storing the coolant is formed between the collar 2 and the reaction chamber 1. The coolant is stored in the storage chamber 22 at the bottom of the reaction chamber 1, so that the weld at the bottom of the reaction chamber 1 is not directly in contact with the waste gas, thereby reducing the corrosion of the weld at the bottom of the reaction chamber 1. At the same time, the coolant circulates in the channel 31 all the time, so that the coolant will not accumulate for a long time, thereby reducing the temperature in the reaction chamber 1, slowing down the corrosion rate, and increasing the service life of the reaction chamber 1.

[0051] It should be noted that the above-mentioned sequence of the embodiments of the present application is for description only and does not represent the advantages and disadvantages of the embodiments. The above-mentioned specific embodiments of this specification are described. Other embodiments are within the scope of the attached claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0052] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of this application.

Claims

1. A semiconductor waste gas treatment device, characterized in that: The invention comprises a reaction chamber (1), a collar (2) and a cooler (3), wherein the cooler (3) is provided with a channel (31) for circulating a cooling liquid, the channel (31) being arranged around the outside of the reaction chamber (1), the collar (2) being provided with an overflow hole (21), the collar (2) being sleeved on the bottom of the reaction chamber (1), and forming a storage chamber (22) for storing the cooling liquid between the collar (2) and the reaction chamber (1); The cooler (3) comprises a water storage tank (32), wherein the water storage tank (32) is in communication with the channel (31); a cooling device (4) is provided between the collar (2) and the water storage tank (32); The overflow hole (21) is connected to the channel (31), the storage chamber (22) and the reaction chamber (1), that is, after the coolant flows through the channel (31) and is fully stored in the storage chamber (22), it overflows along the overflow hole (21) into the interior of the reaction chamber (1) and flows out from the bottom of the collar (2).

2. The semiconductor waste gas treatment device according to claim 1, characterized in that: The channel (31) extends along the axial direction of the reaction chamber (1).

3. The semiconductor waste gas treatment device according to claim 1, characterized in that: The cooler (3) further comprises a circulation pump (33) and a circulation branch (34); the circulation pump (33) is connected to the water storage tank (32) and the channel (31) via the circulation branch (34).

4. The semiconductor waste gas treatment device according to claim 3, characterized in that: The bottom of the sleeve ring (2) is provided with a liquid outlet hole (23), which is connected to the water storage tank (32) through the liquid outlet hole (23).

5. The semiconductor waste gas treatment device according to claim 4, characterized in that: The circulation branch (34) is provided with a pressure gauge (35).

6. The semiconductor waste gas treatment device according to any one of claims 3 to 5, characterized in that: The cooler (3) further comprises a control module (36), wherein the control module (36) is connected to the circulation pump (33) to control the operation of the circulation pump (33).

7. The semiconductor waste gas treatment device according to claim 6, characterized in that: A limiting flow hole (11) is arranged outside the reaction chamber (1), and the limiting flow hole (11) is arranged in communication with the channel (31).

8. A semiconductor waste gas treatment system, characterized in that: It comprises a semiconductor waste gas treatment device as described in any one of claims 1-7.

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