A low inductance SiC module structure

Abstract

The invention discloses a low-inductance SiC module structure, comprising a substrate plate, a copper plate fixedly connected to the top of the substrate plate, an integrated circuit board arranged on the surface of the copper plate, a bracket fixedly connected to one side of the copper plate for use with the integrated circuit board, and an auxiliary mechanism is arranged so that the SiC module takes into account the advantages of high input impedance of MOSFET and low conduction voltage drop of GTR, and has the functions of low driving power and low saturation voltage drop, thereby reducing the energy consumption of the SiC module and further improving the operation performance of the SiC module. By arranging a positioning mechanism, a primary bolt fixing method is firstly adopted between the substrate plate, the copper plate and the packaging box, and then a secondary buckle fixing method is adopted between the substrate plate, the copper plate and the packaging box, so as to prevent the SiC module from being affected by the workplace and the environment and to provide protection for its internal components, and by arranging a cooling mechanism, an embedded cooling cycle method is adopted to quickly carry and dissipate the heat generated by the integrated circuit board and other components on the copper plate.

Description

Technical Field

[0001] The present invention relates to the technical field of SiC modules, and in particular to a low-inductance SiC module structure. Background Art

[0002] With the development of power electronics technology, the continuous demand for high-efficiency and high-power density design has made the performance of power semiconductors reach the limit of silicon materials. Wide bandgap semiconductor materials include SiC (silicon carbide) and GaN (gallium nitride). Compared with Si (silicon) materials, GaN (gallium nitride) can reduce both conduction loss and switching loss. However, with the increase of switching speed and operating frequency, the influence of parasitic parameters in module packaging is also increasing. Therefore, SiC (silicon carbide) is mostly used as a microelectronic module material on the market, including SiC modules.

[0003] During the assembly process of the SiC modules currently used, sealants are mostly used to seal the substrate and the packaging box as a whole. The two-stage positioning method cannot be used to tightly package the SiC module. When the SiC module is used for a long time or is affected by the use environment, debonding is prone to occur, resulting in a gap between the substrate and the packaging box of the SiC module, which in turn affects the electronic components in the SiC module, reduces the sensitivity of the SiC module, and shortens the service life of the SiC module:

[0004] Moreover, during the long-term operation of SiC modules, the internal heat is mostly dissipated through openings or fans, and the embedded cooling cycle cannot be used to quickly carry and dissipate the heat of the SiC module, resulting in the SiC module The heat dissipation effect is not obvious. At the same time, there are also problems of large driving power and high saturation voltage drop, which directly reduce the operating performance of the SiC module. For this reason, a low-inductance SiC module structure is proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a low inductance SiC module structure to solve the problems of the currently used SiC modules mentioned in the above background technology, which cannot adopt a two-stage positioning method to perform a tight packaging operation on the SiC modules, and also cannot adopt an embedded cooling cycle method to quickly carry and dissipate the heat of the SiC modules, and have large driving power and high saturation voltage drop.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-inductance SiC module structure, comprising a substrate plate, a copper plate fixedly connected to the top of the substrate plate, an integrated circuit board arranged on the surface of the copper plate, a bracket used in conjunction with the integrated circuit board fixedly connected to one side of the copper plate, a packaging box used in conjunction with the integrated circuit board and the bracket arranged on the side of the substrate plate close to the copper plate, buckle handle grooves are provided on both the front and rear sides of the packaging box, plug-in holes are sequentially provided on one side of the packaging box from left to right, reserved holes are provided around the packaging box, and an auxiliary mechanism is provided on the surface of the copper plate close to the integrated circuit board;

[0007] One side of the substrate plate and the packaging box is provided with a positioning mechanism used in conjunction with the copper plate:

[0008] The inner cavity of the substrate plate is provided with a cooling mechanism used in conjunction with the copper plate:

[0009] Both sides of the bottom of the substrate plate are provided with shock absorbing mechanisms used in conjunction with the positioning mechanism.

[0010] Preferably, the auxiliary mechanism includes a central integrated chip, and two groups of the central integrated chips are fixed on both sides of the copper plate close to the integrated circuit board, and a low-voltage insulating area is sprayed on one side of the copper plate close to the central integrated chip, and a connector upper tube and a connector lower tube are fixedly connected on one side of the low-voltage insulating area, respectively, dual IGBT modules are embedded on both sides of the substrate board, and an IGBT module plug used in conjunction with the packaging box is inserted into the inner cavity of the dual IGBT module, and the top of the bracket is fixedly connected with a positive plug-in terminal, a negative plug-in terminal and an output plug-in terminal used in conjunction with the plug-in hole from left to right.

[0011] Preferably, the positioning mechanism includes a sealing gasket, which is arranged on the side facing the copper plate and the packaging box, the bottom of the substrate plate near the reserved hole is fixedly connected to a limit spring, and the bottom of the limit spring is fixedly connected to a rubber base, screws used in conjunction with the reserved hole, the limit spring and the rubber base are inserted around the packaging box, and the screw head sleeve of the screw is provided with an anti-loosening gasket, the bottom of the packaging box is fixedly connected to a holder used in conjunction with the substrate plate, the copper plate and the sealing gasket, and a slot is provided on the inner side of the holder, a miniature double-headed cylinder is fixedly connected to the center of the bottom of the substrate plate, and the two piston rods of the miniature double-headed cylinder are fixedly connected to a push seat, both sides of the push seat are fixedly connected to push frames, and the other side of the push frame is fixedly connected to a block engaged with the slot.

[0012] Preferably, the cooling mechanism includes cooling holes, which are provided around the substrate plate near the copper plate, and cooling grooves are provided around the copper plate near the integrated circuit board. A micro-circulation pump is fixedly connected to one side of the copper plate near the integrated circuit board, and the bottom end of the micro-circulation pump is connected to an angle tube, the other end of the angle tube is connected to a three-way pipe, and both ends of the three-way pipe are connected to a circulation coil embedded in the substrate plate, the bottom end of the circulation coil is connected to a drain outlet, and the bottom end of the drain outlet is threadedly connected to a threaded plug, and the other end of the circulation coil is connected to a water inlet, and the top end of the water inlet is plugged with a rubber plug.

[0013] Preferably, the shock absorbing mechanism includes a T-shaped slide rail, the T-shaped slide rail is opened around the bottom of the base material plate, the inner cavity of the T-shaped slide rail is slidably connected with a T-shaped slider, the front and rear sides of the T-shaped slider are fixedly connected with anti-collision heads used in conjunction with the T-shaped slide rail, the bottom of the T-shaped slider is fixedly connected with an elastic ring, the elastic ring is fixedly connected with a support plate fixedly matched with a rubber base away from the bottom of the T-shaped slider, and the rubber base and the support plate are located on the same horizontal mounting surface.

[0014] Preferably, the connector upper tube and the connector lower tube are distributed in a diagonal state along the central axis of the low-voltage insulation zone, the connector upper tube adopts an X400 specification, and the connector lower tube adopts an X300 specification.

[0015] Preferably, a small auxiliary wheel is fixedly connected to the bottom of the push seat, and the small auxiliary wheel, the rubber base and the support plate are located on the same horizontal mounting surface.

[0016] Preferably, the card slots and the card blocks are distributed in an axisymmetric state along the central axis of the substrate plate, and both the card slots and the card blocks are designed in a triangular shape.

[0017] Preferably, both sides of the substrate plate and the copper plate are provided with heat dissipation holes and the heat dissipation holes are distributed in an array along the central integrated chip. A micro heat dissipation fan used in conjunction with the central integrated chip is fixedly connected to the bottom of the substrate plate near the heat dissipation holes.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. In the present invention, by setting an auxiliary mechanism, the operation and processing performance of the SiC module is improved by two sets of central integrated chips, and the cooperation of the low-voltage insulation area, the connector upper tube, the connector lower tube, the dual IGBT module, the IGBT module plug, the positive plug-in terminal, the negative plug-in terminal and the output plug-in terminal enables the SiC module to take into account the advantages of both the high input impedance of the MOSFET and the low conduction voltage drop of the GTR, and has the functions of low driving power and low saturation voltage drop, thereby reducing the energy consumption of the SiC module and further improving the operation performance of the SiC module;

[0020] By setting a positioning mechanism, the base plate, copper plate and packaging box are fixed by a primary bolt method in advance by the cooperation of a sealing gasket, a limit spring, a rubber base and a screw rod, and then the base plate, copper plate and packaging box are fixed by a secondary buckle method again by the cooperation of a card seat, a card slot, a micro double-head cylinder, a push seat, a push frame and a card block, replacing the traditional sealing adhesive bonding method, so as to prevent the SiC module from being affected by the workplace and the environment and to provide protection for its internal components;

[0021] By setting up a cooling mechanism, the heat generated by the integrated circuit board and other components on the copper plate is quickly carried and dissipated by the cooperation of cooling holes, cooling grooves, micro-circulation pumps, angle pipes, tees, circulation coils, drain ports, threaded plugs, water inlets and rubber plugs, and an embedded cooling circulation method is adopted to quickly carry and dissipate the heat, so as to prevent the heat from being dissipated in time, affecting the service life and operating performance of the SiC module;

[0022] By setting up a shock-absorbing mechanism, through the cooperation of T-shaped slide rails, T-shaped sliders, anti-collision heads, elastic rings and support plates, shock-absorbing and buffering compensation is provided for the SiC module to prevent the SiC module from loosening in a vibration application environment. At the same time, the stress caused by external forces on the SiC module is also eliminated, thereby further improving the stability of the SiC module.

[0023] 2. In the present invention, the connector upper tube and the connector lower tube are distributed in a diagonal state along the central axis of the low-voltage insulation zone, thereby improving the low-voltage and low-inductance performance of the SiC module, and also improving the rationality of the distribution of the connector upper tube and the connector lower tube to prevent mutual interference. Auxiliary mobile support compensation is provided to the push seat through small auxiliary wheels to improve the stability of the push seat in movement to prevent shaking during the movement of the push seat. The card slot and the card block are both designed in a triangle, and according to the stability principle of the triangle, the overall buckle stability of the card slot and the card block is improved to prevent the card slot and the card block from being displaced and loosened due to force. Auxiliary air-cooling heat dissipation compensation is provided to the two groups of central integrated chips through heat dissipation holes and micro heat dissipation fans, which is beneficial to the ventilation and cooling of the two groups of central integrated chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 It is a structural front view of the substrate plate and the copper plate of the present invention;

[0026] Figure 3 It is a structural exploded view of the substrate plate and the copper plate of the present invention;

[0027] Figure 4 It is a partial top view of the structure of the substrate plate of the present invention;

[0028] Figure 5 It is a structural front exploded view of the cooling mechanism of the present invention;

[0029] Figure 6 A bottom view of the structure of the substrate plate of the present invention;

[0030] Figure 7 It is a structural front view of the shock absorbing mechanism of the present invention;

[0031] Figure 8 It is a bottom view of the structure of the packaging box of the present invention.

[0032] In the figure: 1. substrate board; 2. copper plate; 3. bracket; 4. packaging box; 5. plug-in hole; 6. auxiliary mechanism; 61. central integrated chip; 62. low voltage insulation area; 63. connector upper tube; 64. connector lower tube; 65. dual IGBT module; 66. IGBT module plug; 67. positive plug-in terminal; 68. negative plug-in terminal; 69. output plug-in terminal; 7. positioning mechanism; 71. sealing gasket; 72. limit spring; 73. rubber base; 74. screw; 75. card seat; 76. card slot; 77. Miniature double-headed cylinder; 78, push seat; 79, push frame; 710, block; 8, cooling mechanism; 81, cooling hole; 82, cooling trough; 83, miniature circulation pump; 84, angle pipe; 85, three-way pipe; 86, circulation coil; 87, drain outlet; 88, threaded plug; 89, water inlet; 810, rubber plug; 9, shock absorbing mechanism; 91, T-type slide rail; 92, T-type slider; 93, anti-collision head; 94, elastic ring; 95, support plate; 10, small auxiliary wheel; 11, heat dissipation hole; 12, miniature cooling fan. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1

[0035] See also Figure 1-Figure 8The present invention provides a technical solution: a low inductance SiC module structure, comprising a substrate plate 1, a copper plate 2 is fixedly connected to the top of the substrate plate 1, an integrated circuit board is arranged on the surface of the copper plate 2, a bracket 3 used in conjunction with the integrated circuit board is fixedly connected to one side of the copper plate 2, a packaging box 4 used in conjunction with the integrated circuit board and the bracket 3 is arranged on the side of the substrate plate 1 close to the copper plate 2, buckle handle grooves are provided on the front and rear sides of the packaging box 4, plug holes 5 are sequentially provided on one side of the packaging box 4 from left to right, reserved holes are provided on all sides of the packaging box 4, and auxiliary Mechanism 6, by setting up auxiliary mechanism 6, two groups of central integrated chips 61 improve the operation and processing performance of SiC module, and by the coordination of low voltage insulation area 62, connector upper tube 63, connector lower tube 64, dual IGBT module 65, IGBT module plug 66, positive plug-in terminal 67, negative plug-in terminal 68 and output plug-in terminal 69, the SiC module takes into account the advantages of high input impedance of MOSFET and low conduction voltage drop of GTR, and has the functions of low driving power and low saturation voltage drop, which reduces the energy consumption of SiC module and further improves the operation performance of SiC module;

[0036] A positioning mechanism 7 used in conjunction with the copper plate 2 is provided on one side of the substrate plate 1 and the packaging box 4. By providing the positioning mechanism 7, a sealing gasket 71, a limit spring 72, a rubber base 73 and a screw 74 are used to preliminarily fix the substrate plate 1, the copper plate 2 and the packaging box 4 by a primary bolt fixation method, and then a clamping seat 75, a clamping slot 76, a micro double-headed cylinder 77, a push seat 78, a push frame 79 and a clamping block 710 are used to fix the substrate plate 1, the copper plate 2 and the packaging box 4 by a secondary buckle fixation method, replacing the traditional sealing adhesive bonding method, so as to prevent the SiC module from being affected by the workplace and the environment and to provide protection for its internal components:

[0037] The inner cavity of the substrate plate 1 is provided with a cooling mechanism 8 used in conjunction with the copper plate 2. By providing the cooling mechanism 8, the cooling holes 81, the cooling grooves 82, the micro-circulation pump 83, the angle tube 84, the three-way tube 85, the circulation coil 86, the drain port 87, the threaded plug 88, the water inlet 89 and the rubber plug 810 are coordinated to quickly carry and dissipate the heat generated by the integrated circuit board and other components on the copper plate 2 in an embedded cooling circulation manner to prevent the heat from being dissipated in time, which affects the service life and operating performance of the SiC module:

[0038] Shock absorbing mechanisms 9 used in conjunction with the positioning mechanism 7 are provided on both sides of the bottom of the substrate plate 1. By providing the shock absorbing mechanism 9, the cooperation of the T-shaped slide rail 91, the T-shaped slider 92, the anti-collision head 93, the elastic ring 94 and the support plate 95 provides shock absorbing and buffering compensation for the SiC module to prevent the SiC module from loosening in a vibration application environment, and also eliminates the stress caused by the external force on the SiC module, thereby further improving the stability of the SiC module.

[0039] Example 2

[0040] See also Figure 1-Figure 8The present invention provides a technical solution: a low inductance SiC module structure, including a substrate plate 1, a copper plate 2 is fixedly connected to the top of the substrate plate 1, an integrated circuit board is arranged on the surface of the copper plate 2, a bracket 3 used in conjunction with the integrated circuit board is fixedly connected to one side of the copper plate 2, a packaging box 4 used in conjunction with the integrated circuit board and the bracket 3 is arranged on the side of the substrate plate 1 close to the copper plate 2, buckle handle grooves are provided on the front and rear sides of the packaging box 4, plug holes 5 are sequentially provided on one side of the packaging box 4 from left to right, reserved holes are provided around the packaging box 4, an auxiliary mechanism 6 is provided on the surface of the copper plate 2 close to the integrated circuit board, the auxiliary mechanism 6 includes a central integrated chip 61, and two groups of central integrated chips 61 are fixed on the copper plate 2 close to the integrated circuit board On both sides of the substrate plate 1 and the copper plate 2, heat dissipation holes 11 are opened on both sides, and the heat dissipation holes 11 are distributed in an array along the central integrated chip 61. A micro heat dissipation fan 12 used in conjunction with the central integrated chip 61 is fixedly connected to the bottom of the substrate plate 1 near the heat dissipation holes 11, providing auxiliary air-cooling heat dissipation compensation for the two groups of central integrated chips 61, which is beneficial to the ventilation and cooling work of the two groups of central integrated chips 61. A low-voltage insulation area 62 is sprayed on one side of the copper plate 2 near the central integrated chip 61, and a connector upper tube 63 and a connector lower tube 64 are fixedly connected on one side of the low-voltage insulation area 62. The connector upper tube 63 and the connector lower tube 64 are diagonally distributed along the central axis of the low-voltage insulation area 62. The connector upper tube 63 adopts the specification of X400. The connector lower tube 64 adopts the X300 specification to improve the low-voltage and low-inductance performance of the SiC module, and also improves the rationality of the distribution of the connector upper tube 63 and the connector lower tube 64 to prevent mutual interference. Dual IGBT modules 65 are embedded on both sides of the substrate plate 1, and the inner cavity of the dual IGBT module 65 is inserted with an IGBT module plug 66 used in conjunction with the packaging box 4. The top of the bracket 3 is fixedly connected with the positive plug-in terminal 67, the negative plug-in terminal 68 and the output plug-in terminal 69 used in conjunction with the plug-in hole 5 from left to right. By setting up an auxiliary mechanism 6, the operation and processing performance of the SiC module is improved by two sets of central integrated chips 61, which are composed of the low-voltage insulation area 62, the connector upper tube 63, the connector lower tube 64, and the dual The cooperation of the IGBT module 65, the IGBT module plug 66, the positive plug-in terminal 67, the negative plug-in terminal 68 and the output plug-in terminal 69 enables the SiC module to take into account the advantages of the high input impedance of the MOSFET and the low conduction voltage drop of the GTR, and has the functions of low driving power and low saturation voltage drop, which reduces the energy consumption of the SiC module and further improves the operating performance of the SiC module; a positioning mechanism 7 used in conjunction with the copper plate 2 is provided on one side of the substrate plate 1 and the packaging box 4, and the positioning mechanism 7 includes a sealing gasket 71, which is arranged on the side facing the copper plate 2 and the packaging box 4, and a limit spring 72 is fixedly connected to the bottom of the substrate plate 1 near the reserved hole, and a rubber base 73 is fixedly connected to the bottom of the limit spring 72.Screws 74 used in conjunction with the reserved holes, limit springs 72 and rubber bases 73 are inserted around the packaging box 4, and the screw head sleeves of the screws 74 are provided with anti-loosening washers. The bottom of the packaging box 4 is fixedly connected with a holder 75 used in conjunction with the substrate plate 1, the copper plate 2 and the sealing gasket 71 around the bottom, and a slot 76 is provided on the inner side of the holder 75. A miniature double-headed cylinder 77 is fixedly connected to the center of the bottom of the substrate plate 1, and the two piston rods of the miniature double-headed cylinder 77 are fixedly connected to a push seat 78. Push racks 79 are fixedly connected to both sides of the push seat 78, and a block 710 engaged with the slot 76 is fixedly connected to the other side of the push rack 79. The slot 76 and the block 710 are axially symmetrically distributed along the central axis of the substrate plate 1. The slot 76 and the block 710 are both The triangular design is adopted, and according to the principle that the triangle has stability, the overall buckle stability of the card slot 76 and the card block 710 is improved to prevent the card slot 76 and the card block 710 from being displaced and loosened due to force. By setting the positioning mechanism 7, the sealing gasket 71, the limit spring 72, the rubber base 73 and the screw 74 are matched to preliminarily use a primary bolt fixing method for the substrate plate 1, the copper plate 2 and the packaging box 4, and then the card seat 75, the card slot 76, the micro double-headed cylinder 77, the push seat 78, the push frame 79 and the card block 710 are matched to again use a secondary buckle fixing method for the substrate plate 1, the copper plate 2 and the packaging box 4, replacing the traditional sealing adhesive bonding method, so as to prevent the SiC module from being affected by the workplace and the environment and causing gaps, and to prevent the internal components of the SiC module from being affected by the workplace and the environment. Provide protection: The inner cavity of the substrate plate 1 is provided with a cooling mechanism 8 used in conjunction with the copper plate 2, the cooling mechanism 8 includes cooling holes 81, the cooling holes 81 are opened around the substrate plate 1 near the copper plate 2, the copper plate 2 is provided with cooling grooves 82 around the integrated circuit board, a micro-circulation pump 83 is fixedly connected to one side of the copper plate 2 near the integrated circuit board, and the bottom end of the micro-circulation pump 83 is connected to an angle tube 84, the other end of the angle tube 84 is connected to a three-way pipe 85, and both ends of the three-way pipe 85 are connected to a circulation coil 86 embedded in the substrate plate 1, the bottom end of the circulation coil 86 is connected to a drain port 87, and the bottom end of the drain port 87 is threadedly connected to a threaded plug 88, the other end of the circulation coil 86 is connected to a water inlet 89, and the top of the water inlet 89 The plug is provided with a rubber plug 810. By setting a cooling mechanism 8, the cooling hole 81, the cooling groove 82, the micro-circulation pump 83, the angle tube 84, the three-way pipe 85, the circulation coil 86, the drain port 87, the threaded plug 88, the water inlet 89 and the rubber plug 810 cooperate to adopt an embedded cooling circulation method to quickly carry and dissipate the heat generated by the integrated circuit board and other components on the copper plate 2 to prevent the heat from being dissipated in time and affecting the service life and operating performance of the SiC module: both sides of the bottom of the substrate plate 1 are provided with a shock absorbing mechanism 9 used in conjunction with the positioning mechanism 7, and the shock absorbing mechanism 9 includes a T-type slide rail 91, which is opened around the bottom of the substrate plate 1, and the inner cavity of the T-type slide rail 91 is slidably connected with a T-type slider 92.The front and rear sides of the T-shaped slider 92 are fixedly connected with anti-collision heads 93 used in conjunction with the T-shaped slide rail 91. The bottom of the T-shaped slider 92 is fixedly connected with an elastic ring 94. The elastic ring 94 is fixedly connected with a support plate 95 fixedly matched with the rubber base 73 away from the bottom of the T-shaped slider 92. The rubber base 73 and the support plate 95 are located on the same horizontal mounting surface. The bottom of the push seat 78 is fixedly connected with a small auxiliary wheel 10. The small auxiliary wheel 10 is located on the same horizontal mounting surface as the rubber base 73 and the support plate 95, providing auxiliary movement support compensation for the push seat 78, improving the movement stability of the push seat 78, and preventing the push seat 78 from shaking during movement. By setting the shock absorbing mechanism 9, the cooperation of the T-shaped slide rail 91, the T-shaped slider 92, the anti-collision head 93, the elastic ring 94 and the support plate 95 provides shock absorbing and buffering compensation for the SiC module, preventing the SiC module from loosening in a vibration application environment, and also eliminating the stress caused by the external force on the SiC module, further improving the stability of the SiC module.

[0041] Working principle: When workers seal and assemble the copper plate 2 on the substrate plate 1 and the packaging box 4, they first place the sealing gasket 71 at the predetermined position on the copper plate 2, and the packaging box 4 is tightly attached to the sealing gasket 71 and seals and covers the components on the copper plate 2. At the same time, the four groups of card seats 75 at the bottom of the packaging box 4 are correspondingly carded at the predetermined positions at the bottom of the substrate plate 1, and then four screws 74 are respectively screwed into the rubber base 73 through the reserved holes and the limit spring 72, and the sealing gasket 71 is pressed and sealed, so as to seal the substrate plate 1 and the packaging box 4. The first-level thread positioning is performed between the boxes 4, and then the micro double-headed cylinder 77 is controlled to open and drive the two sets of push seats 78 to push outward synchronously. The two sets of small auxiliary wheels 10 provide mobile support compensation for the two sets of push seats 78. Then, the two sets of push seats 78 drive the two sets of clamping blocks 710 to push toward the two sets of clamping seats 75 through the two sets of push frames 79, until the two sets of clamping blocks 710 are tightly clamped into the two sets of clamping grooves 76 correspondingly, and the second-level buckle positioning is performed between the substrate plate 1 and the packaging box 4, and the overall fastening and packaging work of the SiC module can be completed;

[0042] Before the SiC module is operated, the positive plug, negative plug and output plug prepared in advance are respectively inserted into the three groups of plug holes 5 into the positive plug terminal 67, negative plug terminal 68 and output plug terminal 69 on the bracket 3 in sequence, and then the dual central integrated chip 61 performs high-performance computing on the data, and the low-voltage insulation area 62 reduces the inductance flowing into the connector upper tube 63 and the connector lower tube 64, and then the two groups of dual IGBT modules 65 and two groups of IGBT module plugs 66 reduce the driving power of the SiC module and increase the saturation voltage drop;

[0043] Before the SiC module runs for a long time, first pull out the rubber plug 810 on the water inlet 89, and add coolant to the water inlet 89, and the coolant reaches the circulation coil 86. During the long-term operation of the SiC module, control the micro-circulation pump 83 to start and apply a circulation negative pressure to the two circulation coils 86 through the angle tube 84 and the three-way tube 85. The circulation negative pressure forces the coolant to circulate in the two circulation coils 86, and the circulating coolant carries the heat generated inside the SiC module through the cooling hole 81 and the cooling groove 82 for heat dissipation. At the same time, two groups of micro-cooling fans 12 assist in heat dissipation of the heat generated by the dual central integrated chip 61 through the two groups of heat dissipation holes 11. When the coolant reaches the replacement cycle, unscrew the threaded plug 88 on the drain port 87, and the cooling waste liquid in the two circulation coils 86 flows into the pre-connected drainage pipe through the drain port 87 to the waste liquid collection container, and new coolant is re-injected into the water inlet 89;

[0044] When the SiC module is running in a vibration application environment, the vibration force drives the substrate plate 1 to vibrate, and the two sets of anti-collision heads 93 provide anti-collision compensation for the two sets of T-shaped sliders 92. The vibration force on the substrate plate 1 forces the T-shaped sliders 92 on the two sets of elastic rings 94 to slide inward or outward in the two sets of T-shaped slide rails 91 accordingly, and the two sets of elastic rings 94 will be deformed by the vibration force and distributed in a flat shape. The two sets of support plates 95 provide fixed support compensation for the two sets of deformed elastic rings 94. The two sets of deformed elastic rings 94 offset the vibration force on the substrate plate 1, thereby weakening the vibration amplitude of the substrate plate 1.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low inductance SiC module structure, comprising a substrate plate (1), characterized in that: The top of the substrate plate (1) is fixedly connected to a copper plate (2), an integrated circuit board is arranged on the surface of the copper plate (2), a bracket (3) used in conjunction with the integrated circuit board is fixedly connected to one side of the copper plate (2), a packaging box (4) used in conjunction with the integrated circuit board and the bracket (3) is arranged on the side of the substrate plate (1) close to the copper plate (2), buckle handle grooves are provided on both the front and rear sides of the packaging box (4), power plug holes (5) are provided on one side of the packaging box (4) from left to right, reserved holes are provided on all sides of the packaging box (4), and an auxiliary mechanism (6) is provided on the surface of the copper plate (2) close to the integrated circuit board; One side of the substrate plate (1) and the packaging box (4) is provided with a positioning mechanism (7) for use with the copper plate (2): The inner cavity of the substrate plate (1) is provided with a cooling mechanism (8) used in conjunction with the copper plate (2): Both sides of the bottom of the substrate plate (1) are provided with a shock absorbing mechanism (9) for use in conjunction with the positioning mechanism (7); The auxiliary mechanism (6) comprises a central integrated chip (61), two groups of the central integrated chips (61) are fixed on both sides of the copper plate (2) close to the integrated circuit board, a low-voltage insulation area (62) is sprayed on one side of the copper plate (2) close to the central integrated chip (61), and a connector upper tube (63) and a connector lower tube (64) are respectively fixedly connected on one side of the low-voltage insulation area (62), dual IGBT modules (65) are embedded on both sides of the substrate plate (1), and an IGBT module plug (66) used in conjunction with the packaging box (4) is inserted into the inner cavity of the dual IGBT module (65), and a positive plug-in terminal (67), a negative plug-in terminal (68) and an output plug-in terminal (69) used in conjunction with the plug-in hole (5) are fixedly connected to the top of the bracket (3) in sequence from left to right; The positioning mechanism (7) comprises a sealing gasket (71), the sealing gasket (71) being arranged on the side facing the copper plate (2) and the packaging box (4), the bottom of the substrate plate (1) close to the reserved hole being fixedly connected to a limit spring (72), and the bottom of the limit spring (72) being fixedly connected to a rubber base (73), the four sides of the packaging box (4) are all provided with screws (74) for use with the reserved hole, the limit spring (72) and the rubber base (73), and the screw head sleeve of the screw (74) is provided with an anti-loosening washer, and the packaging box (4) ) are fixedly connected to a base (75) for use with the substrate plate (1), the copper plate (2) and the sealing gasket (71) on all sides of the bottom, and a card slot (76) is provided on the inner side of the base (75); a micro double-headed cylinder (77) is fixedly connected to the center of the bottom of the substrate plate (1), and two piston rods of the micro double-headed cylinder (77) are fixedly connected to a push seat (78); both sides of the push seat (78) are fixedly connected to push racks (79), and the other side of the push rack (79) is fixedly connected to a card block (710) that is engaged with the card slot (76); The cooling mechanism (8) comprises cooling holes (81), the cooling holes (81) are provided around the substrate plate (1) near the copper plate (2), the copper plate (2) is provided with cooling grooves (82) around the integrated circuit board, a micro-circulation pump (83) is fixedly connected to one side of the copper plate (2) near the integrated circuit board, and the bottom end of the micro-circulation pump (83) is connected to an angle tube (84), the other end of the angle tube (84) is connected to a three-way pipe (85), and both ends of the three-way pipe (85) are connected to a circulation coil (86) embedded in the substrate plate (1), the bottom end of the circulation coil (86) is connected to a drain port (87), and the bottom end of the drain port (87) is threadedly connected to a threaded plug (88), and the other end of the circulation coil (86) is connected to a water inlet (89), and the top end of the water inlet (89) is plugged with a rubber plug (810); The shock absorbing mechanism (9) comprises a T-shaped slide rail (91), the T-shaped slide rail (91) being arranged around the bottom of the substrate plate (1), the inner cavity of the T-shaped slide rail (91) being slidably connected to a T-shaped slider (92), the front and rear sides of the T-shaped slider (92) being fixedly connected to anti-collision heads (93) used in conjunction with the T-shaped slide rail (91), the bottom of the T-shaped slider (92) being fixedly connected to an elastic ring (94), the elastic ring (94) being fixedly connected to a support plate (95) fixedly matched with a rubber base (73) away from the bottom of the T-shaped slider (92), the rubber base (73) and the support plate (95) being located on the same horizontal mounting surface.

2. A low inductance SiC module structure according to claim 1, characterized in that: The connector upper tube (63) and the connector lower tube (64) are distributed in a diagonal state along the central axis of the low-voltage insulation area (62); the connector upper tube (63) adopts an X400 specification, and the connector lower tube (64) adopts an X300 specification.

3. A low inductance SiC module structure according to claim 2, characterized in that: A small auxiliary wheel (10) is fixedly connected to the bottom of the push seat (78); the small auxiliary wheel (10) is located on the same horizontal mounting surface as the rubber base (73) and the support plate (95).

4. A low inductance SiC module structure according to claim 3, characterized in that: The clamping slot (76) and the clamping block (710) are distributed in an axisymmetric state along the central axis of the substrate plate (1); the clamping slot (76) and the clamping block (710) are both triangular in design.

5. The low inductance SiC module structure according to claim 1, characterized in that: Both sides of the substrate plate (1) and the copper plate (2) are provided with heat dissipation holes (11), and the heat dissipation holes (11) are distributed in an array along the central integrated chip (61). A micro heat dissipation fan (12) used in conjunction with the central integrated chip (61) is fixedly connected to the bottom of the substrate plate (1) near the heat dissipation holes (11).

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