High-temperature evaporation equipment for manufacturing nano metal powder and automatic feeding system thereof
By combining water-cooled walls and ceramic walls in the design of high-temperature evaporation equipment, and employing a combination of plasma heating and high-frequency heating, along with cooling jet technology and an automatic feeding system, the problems of corrosion resistance, short lifespan, and inconvenient feeding in high-temperature evaporation equipment have been solved, achieving efficient and stable production of nano-metal powder.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU XINCHUAN NEW MATERIALS CO LTD
- Filing Date
- 2023-05-31
- Publication Date
- 2026-05-29
AI Technical Summary
Existing high-temperature evaporation equipment suffers from problems such as severe corrosion of high-temperature resistant materials, short service life, cumbersome feeding process, inaccurate temperature control, and low production efficiency in the production of nano-metal powder, resulting in unstable quality and low production efficiency of nano-metal powder.
The furnace body adopts a combination of water-cooled walls and ceramic walls, and is designed with multi-wall-petal cooling water channels and internal heat sink lining. It combines plasma heating and high-frequency heating, uses cooling jet technology and circulating water flow to cool the plasma electrodes, and adopts a double-air-barrier funnel and gravity sensor feeding device. It is automatically controlled by infrared thermometer and radar level gauge.
It improves the service life and production efficiency of high-temperature evaporation equipment, ensures the uniformity and quality stability of nano-metal powder particles, reduces production costs and energy consumption, and improves production efficiency and economic benefits.
Smart Images

Figure CN116550983B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a nano-metal powder production equipment, and more particularly to a high-temperature evaporation equipment for manufacturing nano-metal powder and its automatic feeding system. Background Technology
[0002] With the development of science and technology and the progress of the times, nanomaterials are increasingly used in high-tech fields, especially nanomaterial powders, which are widely used in antibacterial and antiviral, medical diagnosis and imaging, grinding and polishing, 3D printing, catalysis, functional ceramics, electronic components, new energy and other fields.
[0003] There are many methods for preparing nano-metal powders, mainly including physical vapor phase method, electro-explosion method, mechanical pulverization method, chemical reduction method, and high-temperature vapor phase reduction method. Among them, the physical vapor phase method, also known as the evaporation-condensation method, is a relatively mature method for manufacturing nano-metal powders, producing nano-metal powder products with a particle size of 5-1000 nm. The normal physical vapor phase method for producing nano-metal powders involves heating the metal material to a high temperature through a high-temperature evaporation device until the metal gas evaporates, and then introducing the evaporated metal gas into a condensation device, where an inert gas is used to rapidly condense the metal gas, thereby generating fine nano-metal powders.
[0004] Because conventional metal evaporation requires temperatures of several hundred to several thousand degrees Celsius, the high-temperature resistance requirements for high-temperature evaporation equipment are very high. Commonly used high-temperature evaporation equipment includes graphite or ceramic crucibles, water-cooled shells or ceramic inner walls with metal outer shells, and heating devices. Since high-temperature evaporation equipment operates at high temperatures for extended periods during the production of nano-metal powders, the high temperatures cause significant corrosion to the crucibles and furnace shells, resulting in a very limited lifespan for the equipment. The normal lifespan of high-temperature evaporation equipment is between 200 and 300 hours. One common method to extend the lifespan of high-temperature evaporation equipment is to thicken the ceramic wall. However, increasing the ceramic wall thickness increases the furnace volume and also increases the rate of corrosion at high temperatures, resulting in minimal increase in lifespan. Another common method is to make the furnace wall a circulating water-cooled shell. However, the rapid cooling of the circulating water consumes a large amount of heating energy and also affects the uniformity of metal evaporation, leading to poor quality nano-metal powder.
[0005] In the process of producing nano-metal powder using plasma arc evaporation, it is crucial to control the liquid level and temperature of the metal solution in the high-temperature evaporation equipment. Existing high-temperature evaporation equipment is equipped with an observation tube containing multiple layers of high-temperature resistant transparent glass. Operators observe the crucible inside the smelting and evaporation equipment through the glass above the observation tube. Based on the observed melting state of the metal raw material in the crucible and the distance between the crucible opening and the solution surface, the operator adds material accordingly. However, due to the extremely high smelting and evaporation temperatures, the sensors used to measure these temperatures are prone to malfunction and inaccurate readings. This leads to inaccurate temperature control of the smelting and evaporation equipment, resulting in uneven nano-metal powder particles and contributing to poor nano-metal powder quality.
[0006] Furthermore, due to the prolonged high-temperature operation of the high-temperature evaporation equipment, the lifespan of the plasma electrodes is very limited. Normally, new electrodes need to be replaced after 100 hours of use. Each replacement of a new electrode requires tedious work such as shutdown, cooling, disassembly, reinstallation, and restarting. This not only affects the production schedule but also requires technicians to repeat the tedious loading and unloading process and consumes funds to manufacture new electrodes, seriously affecting the production efficiency and benefits of nano-metal powder.
[0007] Furthermore, in conventional nano-metal powder production, the high-temperature evaporation equipment is in a sealed state during operation. Each feeding requires a cumbersome process of stopping heating, depressurizing, opening the feeding port, feeding, closing the feeding port, and reheating. This results in very low production efficiency and wastes a lot of heating energy. Moreover, the process of heating, stopping heating, and restarting heating involves going from a low temperature to a gradually high temperature and then from a high temperature to a gradually low temperature. This makes the evaporation temperature of the evaporator unstable and uneven during the production of nano-metal powder, leading to uneven particle size and causing serious problems with the quality of nano-metal powder.
[0008] Therefore, the production of nano-metal powder urgently requires an advanced high-temperature evaporation equipment that has both appropriate cooling and heat preservation properties, as well as a long service life and a production equipment and system that can maintain a high temperature for a long time; it also requires a highly automated feeding device and an automatic feeding system for manufacturing nano-metal powder.
[0009] To address the aforementioned pressing challenges, we actively organized a technical team, summarized years of production experience and practical lessons learned, and combined relevant technical theories to conduct in-depth exploration and research. We carried out a great deal of creative work, including design, testing, trial use, optimization, and improvement, on high-temperature evaporation equipment, feeding devices, and control systems for producing nano-metal powders. Summary of the Invention
[0010] In view of the technical problems mentioned in the background art, the present invention provides a high-temperature evaporation device for manufacturing nano-metal powder and its automatic feeding system, which can solve the problems mentioned in the background art.
[0011] The technical solution of this invention to solve its technical problem is:
[0012] 1. A combination of water-cooled walls and ceramic walls is used to solve the problems of poor cooling effect of metal-shell ceramic inner fireplaces and low energy efficiency and short service life of metal-shell water-cooled fireplaces in high-temperature evaporation equipment; 2. To solve the problem of easy high-temperature corrosion of the inner wall of the water-cooled crucible in high-temperature evaporation equipment, resulting in a short service life, the crucible is designed as a pot body composed of multiple wall petals, and the wall petals are designed as a cooling water channel structure. Furthermore, to improve the heat dissipation performance and service life of the wall petals, inner heat dissipation fins are installed on the inner side of the water channels of the wall petals, and outer high-temperature resistant fins are installed on the outer wall of the wall petals. The surface of the high-temperature resistant fins is further coated with a high-temperature resistant material; 4. To solve the problem of easy high-temperature corrosion of the bottom wall of the water-cooled crucible in high-temperature evaporation equipment, resulting in a short service life, in 5. To address the problem of high-temperature evaporation equipment's plasma negative electrode being easily corroded by high temperatures, resulting in a short service life and frequent replacements, thus reducing the production efficiency of nano-metal powder, a cooling jet technology is used for continuous online cooling of the plasma negative electrode. This involves setting up a jet channel and jet device inside the plasma electrode, using a high-speed refrigerant jet for efficient online cooling, enabling the plasma electrode to withstand high-temperature corrosion for extended periods, thereby extending its service life. 6. To address the problem of poor water flow efficiency in the metal-shell water-cooled furnace chamber of high-temperature evaporation equipment, a water collection chamber is installed in the water-cooled shell. 7. To address the problem of high-temperature evaporation equipment... To address the short service life of ceramic walls due to high-temperature corrosion during smelting, recycled ceramic powder is mixed with ceramic and diatomaceous earth. 8. To solve the problem of uneven plasma heating in high-temperature evaporation equipment leading to poor metal powder evaporation, and the issue of poor metal powder evaporation due to high-frequency heating being limited to the coil inductance area and lacking heating outside the inductance area, a composite heating method combining plasma heating and high-frequency heating is adopted. 9. To address the problem of low nano-metal powder production efficiency due to the short service life of the plasma positive electrode in high-temperature evaporation equipment, online continuous cooling of the plasma negative electrode is achieved using circulating water. This involves setting up a circulation channel inside the crucible bottom, connected to a circulating water source, thereby enabling the plasma... The positive electrode and crucible bottom can work effectively for a long time; 10. To solve the serious problems of low production efficiency due to the need to stop heating during the feeding of nano-metal powder and the uneven particle size of nano-metal powder, which leads to unstable quality of nano-metal powder, a metal material feeding device composed of a double-barrier funnel, a solenoid valve and a gravity sensor is adopted. It can realize online feeding without stopping heating. In order to further improve the feeding efficiency and production quality, a weighing hopper is set up to accurately measure the amount of material fed, and a radar level gauge is used to detect the liquid level information of the metal solution in the high-temperature evaporation equipment and send it to the single-chip microcomputer controller for automatic feeding control, so that the high-temperature evaporation equipment can continuously and efficiently produce nano-metal powder; 11.To address the issue of inaccurate temperature control in smelting and evaporation equipment, an automatic heating control system is implemented, combining an infrared thermometer, a heat insulation structure, and a microcontroller. This system enables automated heating control for the production of nano-metal powders, ensuring precise and stable smelting temperatures in the smelting and evaporation equipment.
[0013] A high-temperature evaporation device for manufacturing nano-metal powder using the above-mentioned technical solution includes a water-cooled cylindrical shell, a water-cooled hemispherical shell, an evaporation chamber, a cooling water inlet A, a connecting flange, fastening bolts, an observation channel, a metal material input channel, a cooling water accumulation chamber A, a cooling water inlet C, a plasma cathode column, a cooling water inlet D, a metal vapor channel, an inner wall of the evaporation chamber, an inert gas inlet channel, an insulation wall, a hemispherical shell cooling water channel, a shell connecting ceramic, a cooling water accumulation chamber B, a cooling water inlet B, crucible wall petals, a high-frequency inductor coil, a support frame, a pressure relief port, a cooling water outlet A, a plasma anode terminal, an anode insulating sleeve, a crucible bottom, a cooling water outlet B, wall petal connecting ceramic, a hemispherical shell cooling water channel, a cylindrical shell cooling water channel, a ceramic fiber composite hoop, composite insulation material, and a cathode mounting channel.
[0014] An automatic feeding system for manufacturing nano-metal powder using the above technical solution includes a computer, a switch, a microcontroller, a radar level gauge, an infrared thermometer, a metal material feeding device, a high-frequency generator, a plasma power supply, and a high-temperature evaporation device.
[0015] The metal material feeding device includes a material collection hopper, solenoid valve a, through pipe A, through pipe B, through pipe C, weighing hopper, 3-6 gravity sensors, leakage guide pipe, weighing bracket, fixing frame, material collection hopper bracket, solenoid valve b, solenoid valve c, air-blocking hopper A, solenoid valve d, air-blocking hopper B, solenoid valve e, and metal material input channel.
[0016] Furthermore, the water circulation cooler A of the high-temperature evaporation equipment is connected to the cooling water outlet B and the cooling water inlet A and cooling water inlet B for water circulation. When the nano metal powder production system is working, water flows through the water circulation cooler A, through the cooling water inlet A and cooling water inlet B into the cooling water channel of the cylindrical shell, and then through the cooling water outlet B to the water circulation cooler A for circulation, thereby cooling the water-cooled cylindrical shell.
[0017] Furthermore, the water circulation cooler B of the high-temperature evaporation equipment is connected to the cooling water outlet A and the cooling water inlet C and D for water circulation. When the nano-metal powder production system is working, water flows through the water circulation cooler B and into the cooling water channel of the hemispherical shell through the cooling water inlet C and the cooling water inlet D, and then enters the water circulation cooler B through the cooling water outlet A for circulation, thereby cooling the water-cooled hemispherical shell.
[0018] Furthermore, the high-temperature evaporation equipment includes a plasma cathode column installed in the cathode mounting channel, which is electrically connected to a plasma power supply; the plasma cathode column is also connected to the cooling water inlet D.
[0019] Furthermore, the infrared thermometer device is connected to the microcontroller controller in the observation channel to detect the heating temperature of the evaporation chamber;
[0020] Furthermore, the radar level gauge is connected to a microcontroller in the observation channel to detect the liquid level of the metal solution in multiple crucible wall segments;
[0021] Furthermore, the observation channel of the high-temperature evaporation equipment is equipped with multiple quartz glass plates, the distance between the quartz glass plates is 5-25mm, and the space between the quartz glass plates in the 5-25mm distance is filled with nitrogen.
[0022] Furthermore, the metal material feeding device is connected to the metal material input channel and to a microcontroller; it is used for feeding and feeding control.
[0023] Furthermore, the metal vapor channel of the high-temperature evaporation equipment is connected to a metal vapor condensation device, which is connected to a metal powder collection device; the metal vapor is transported through the metal vapor channel to the metal vapor condensation device, condensed into nano-metal powder, and then collected by the metal powder collection device.
[0024] Furthermore, the inert gas input device is connected through an inert gas inlet channel, and its function is to input inert gas during the production of nano-metal powder;
[0025] Furthermore, one end of the plasma power supply is connected to the conductive terminal of the plasma cathode post, and the other end is connected to the conductive terminal of the plasma anode post; its function is to generate a plasma heating effect with the inert gas, providing a basic heating source for the production of nano-metal powder.
[0026] Furthermore, the high-frequency generator is connected to a high-frequency inductor coil; its function is to generate an inductive heating effect that combines with a plasma heating source to create a composite heating field, which makes the processed metal material melt quickly and evaporate evenly, thereby producing nano-metal powder with uniform particle size and individual particles ≤10 nm; thus making the nano-metal powder of good quality and high production efficiency.
[0027] Furthermore, the water-cooled cylindrical shell of the high-temperature evaporation equipment is a cylindrical shell composed of inner and outer metal walls, with a hollow section serving as a cooling water channel. This cooling water channel allows cooling water or other cooling fluids to pass through, thus cooling the shell. A cooling water accumulation chamber B is located at the upper part of the cooling water channel. A connecting flange is located at the upper edge of the water-cooled cylindrical shell. One to four cooling water inlets A are located on the lower left half of the connecting flange, and one to four cooling water inlets B are located on the lower right half of the connecting flange. At the bottom of the cylindrical shell, a cooling water outlet B connecting to the cooling water channel and a pressure relief port passing through the inner and outer metal walls to isolate the cooling water channel are provided. A cooling water outlet A also passes through the inner and outer metal walls to isolate the cooling water channel.
[0028] Furthermore, the water-cooled hemispherical shell of the high-temperature evaporation equipment is composed of inner and outer metal walls, with a hollow space serving as a cooling water channel for the shell. This cooling water channel allows cooling water or other cooling fluids to pass through, thus cooling the shell. The upper part of the cooling water channel has a cooling water accumulation chamber A, and the lower part has a water inlet. Above the cooling water accumulation chamber A are 1-2 cooling water inlets C and 1-2 cooling water inlets D. The lower outer edge of the water-cooled hemispherical shell has a connecting flange, and the lower inner edge of the water-cooled hemispherical shell has a connecting flange for the cooling water inlet. The cooling channel has a water inlet; a cathode mounting channel for installing plasma cathode columns is provided in the upper middle part of the water-cooled hemispherical shell; 1-2 cooling water inlets C are provided on the left periphery of the cathode mounting channel, and 1-2 cooling water inlets D are provided on the right periphery; a metal material input channel is provided below the cooling water inlet C; an observation channel is provided below the metal material input channel, which is used to install an infrared thermometer and a radar level gauge; a metal vapor channel is provided below the cooling water inlet D; and an inert gas inlet channel is provided below the metal vapor channel.
[0029] Furthermore, the plasma cathode column of the high-temperature evaporation equipment includes a cathode column, a liquid chamber, liquid flow holes, a high-temperature resistant conductive coating C, a micro water pump, a suction pipe, and a jet pipe; characterized in that: the cathode column is provided with a high-temperature resistant conductive coating C on its exterior, and the cathode column is provided with a liquid chamber for containing liquid and a liquid flow hole for liquid flow within its interior; the liquid chamber and the two liquid flow holes allow cooling water or cooling liquid to flow through; a micro water pump is installed above the liquid chamber and the two liquid flow holes, the micro water pump is provided with a suction pipe and a jet pipe, the jet pipe is in the space of the liquid chamber, and the suction pipe is connected to the cooling water inlet D for water flow; the function of the plasma cathode column is that: the liquid chamber and liquid flow holes of the plasma cathode column allow cooling water to flow, the micro water pump, suction pipe, and jet pipe allow water to flow at high speed, thereby efficiently cooling the cathode column; the function of the high-temperature resistant conductive coating C is to further increase the high-temperature resistance and conductivity of the plasma cathode column, thereby improving the effective working time and service life of the plasma cathode column.
[0030] Furthermore, in the metal material feeding device, the upper part of the fixed frame is provided with a hopper support, and the middle part is provided with a weighing support. A hopper is installed on the hopper support, and a solenoid valve a is installed below the hopper. A through pipe A is installed below the solenoid valve a. A solenoid valve b is installed on the weighing support, and a weighing hopper is installed on the solenoid valve b. The upper port of the weighing hopper surrounds the through pipe A below the solenoid valve a. A through pipe B is installed below the weighing support and connected to a solenoid valve c. An air-isolating hopper A is installed below the solenoid valve c. A solenoid valve d is installed below the air-isolating hopper A and connected to the air-isolating hopper B. A solenoid valve e is installed below the air-isolating hopper B. A through pipe C is installed below the solenoid valve e and connected to the metal material input channel.
[0031] Furthermore, the microcontroller controller of the automatic feeding system for manufacturing nano-metal powder includes a CPU chip, ROM memory, RAM memory, power module, network module, MAX232 module, A / D input module, and thyristor output module; the computer includes CPU programming software and automatic feeding control software for manufacturing nano-metal powder; the CPU programming software is used to program the CPU program of the microcontroller; the automatic feeding control software for manufacturing nano-metal powder includes main power control, plasma heating control, inductive heating control, furnace temperature setting of the high-temperature evaporation equipment, furnace temperature display of the high-temperature evaporation equipment, feeding setting, and solenoid valve control; the infrared thermometer and radar level gauge are located in the high-temperature evaporation equipment and are connected to the A / D input module of the microcontroller controller; the gravity sensor is located at the lower end of the solenoid valve a of the metal material feeding device and is connected to the A / D input module of the microcontroller controller;
[0032] The automatic feeding control method for the automatic feeding system for manufacturing nano-metal powder;
[0033] The radar level gauge detects the metal liquid level in the high-temperature evaporation equipment online and transmits the information to the microcontroller controller. The microcontroller controller processes the information transmitted by the radar level gauge. When the metal liquid level in the high-temperature evaporation equipment is lower than the set range, the microcontroller controller controls the feeding device to add material to the high-temperature evaporation equipment. When the radar level gauge detects that the metal liquid level in the high-temperature evaporation equipment is higher than the set range, the feeding stops. This automatically maintains the metal liquid level in the high-temperature evaporation equipment within the set range, thereby ensuring stable metal vapor evaporation and achieving continuous and efficient uninterrupted production of metal powder.
[0034] The beneficial effects of this invention are:
[0035] 1. Because the high-temperature evaporation equipment adopts a furnace structure that combines water-cooled walls and ceramic walls, it can save energy, improve product quality and production efficiency when producing nano-metal powders. This can bring beneficial effects to manufacturing enterprises, such as reducing production costs and improving economic benefits; and to society, it can bring beneficial effects such as reducing environmental pollution and saving energy.
[0036] 2. Because the crucible of the high-temperature evaporation equipment is designed as a pot body composed of multiple wall petals, and the wall petals are designed as a cooling water channel structure, and the inner side of the water channel of the wall petals is provided with heat dissipation fins, and the outer wall of the wall petals is provided with high-temperature resistant fins, and the surface of the high-temperature resistant fins is coated with high-temperature resistant material, the crucible has stable performance and long service life, which can bring the beneficial effects of reducing production costs and improving economic benefits to nano-metal powder production enterprises;
[0037] 3. Because the crucible bottom wall of the high-temperature evaporation equipment is equipped with a water-cooling channel structure, the crucible bottom has increased cooling performance, reduced crucible bottom maintenance costs, and extended crucible bottom service life; this can bring beneficial effects to nano-metal powder production enterprises, such as reducing production costs and improving economic benefits.
[0038] 4. Due to the high temperature resistance and good conductivity of the high-temperature conductive coating C of the plasma cathode column in the high-temperature evaporation equipment, the liquid chamber and liquid flow holes facilitate the flow of cooling water, and the micro water pump, suction pipe, and jet pipe enable high-speed water flow, thus efficiently cooling the cathode column. This extends the service life of the cathode column, reduces replacement efficiency, enhances discharge performance, saves energy, reduces cathode column replacement costs, and extends the service life of the cathode column, thus improving the production efficiency and product quality of nano-metal powder.
[0039] 5. Because the hemispherical shell cooling water channel of the high-temperature evaporation equipment has a cooling water accumulation chamber A and the cylindrical shell cooling water channel has a cooling water accumulation chamber B, the accumulated water can be effectively and evenly distributed to the hemispherical shell cooling water channel and the cylindrical shell cooling water channel. This results in high cooling efficiency in the hemispherical shell cooling water channel and the cylindrical shell cooling water channel, which is conducive to the evaporation of metal vapor, thereby improving the production quality of nano-metal powder; increasing the service life of the high-temperature evaporation equipment; and reducing the production cost of nano-metal powder.
[0040] 6. Because the insulation wall of the high-temperature evaporation equipment is made of recycled ceramic powder combined with ceramic and diatomaceous earth, the insulation wall is more resistant to high temperatures, has a longer service life, and is easy to disassemble. The composite insulation material is more resistant to high temperatures and more breathable than ceramic, has a longer service life, and is easy to disassemble and reuse. Furthermore, because the composite insulation material is made by mixing 70-150 mesh ceramic clay particles, 60-200 mesh recycled ceramic particles, and 150-300 mesh diatomaceous earth particles, it has better high-temperature resistance, extends the service life of the high-temperature evaporation equipment, reduces the production cost of nano-metal powder, and improves production efficiency. It also saves energy and reduces environmental pollution.
[0041] 7. Because the high-temperature evaporation equipment uses a combination of plasma heating and high-frequency heating, the evaporation gas distribution and particle size are uniform during the production of nano-metal powders. This results in stable product quality and high production efficiency for the nano-metal powders.
[0042] 8. In particular, because the metal material feeding device adopts a double air-proof funnel and solenoid valve control, it can realize online feeding of the evaporator without stopping the heating of the evaporator, which improves the feeding efficiency of the evaporator and the production quality of nano metal powder; the weighing hopper can accurately measure the amount of material fed, and the radar level gauge can detect the liquid level of the metal solution and the single-chip microcomputer controller can automatically control the high-temperature evaporation equipment to continuously and stably produce nano metal powder; and make the nano metal powder have uniform particle size and stable quality. Attached Figure Description
[0043] Figure 1 A cross-sectional view of the structure of a high-temperature evaporation device for manufacturing nano-metal powders.
[0044] Figure 2 This is a schematic diagram of a nano-metal powder production system.
[0045] Figure 3 This is a schematic diagram showing the composition and assembly connection of a nano-metal powder production system.
[0046] Figure 4 This is a structural diagram of a metal feeding device.
[0047] Figure 5 Block diagram of an automated feeding system for manufacturing nano-metal powder.
[0048] Figure 6 This is a schematic diagram showing the internal structure of the weighing hopper of the metal feeding device, the structural relationship and connection of the solenoid valve b, gravity sensor, through pipe A, through pipe B, leakage guide pipe, and weighing support.
[0049] Figure 7 This is a structural diagram of the crucible wall and bottom of a high-temperature evaporation device, and the ceramic and ceramic fiber composite hoop connecting the wall.
[0050] Figure 8 This is a cross-sectional view of the combined structure of the crucible wall and bottom, and the ceramic and ceramic fiber composite hoop connecting the wall of a high-temperature evaporation device.
[0051] Figure 9 This is a three-dimensional view of the crucible wall flaps in a high-temperature evaporation device.
[0052] Figure 10 for Figure 9 EE-directed sectional view.
[0053] Figure 11 for Figure 10 Enlarged view of part I.
[0054] Figure 12 for Figure 10 , Figure 11 FF section view.
[0055] Figure 13 This is a three-dimensional view of the crucible bottom of a high-temperature evaporation device.
[0056] Figure 14 for Figure 13 HH sectional view.
[0057] Figure 15 This is a structural diagram of the plasma cathode column in a high-temperature evaporation device.
[0058] The numbers in the diagram are: 100. High-temperature evaporation equipment; 200. Switch; 300. Computer;
[0059] The diagram is labeled as follows: 1. Water-cooled cylindrical shell; 2. Evaporation chamber; 3. Cooling water inlet A; 4. Connecting flange; 5. Fastening bolt; 6. Observation channel; 7. Water-cooled hemispherical shell; 8. Metal material input channel; 9. Cooling water accumulation chamber A; 10. Cooling water inlet C; 11. Plasma cathode column; 12. Cooling water inlet D; 13. Metal vapor channel; 14. Inner wall of evaporation chamber; 15. Inert gas inlet channel; 16. Insulation wall; 17. Shell connecting ceramic; 18. Cooling water accumulation chamber B; 19. Cooling water inlet B; 20. Crucible wall flap; 21. Metal solution; 22. High-frequency inductor coil; 23. Support frame; 24. Pressure relief port; 25. Cooling water outlet A; 26. Plasma anode wiring. Column; 261. Anode insulating sleeve; 27. Crucible bottom; 28. Cooling water outlet B; 29. Ceramic connecting piece for crucible wall; 30. Hemispherical shell cooling water channel; 301. Water inlet; 31. Cylindrical shell cooling water channel; 32. Ceramic fiber composite hoop; 33. Composite insulation material; 34. Cathode mounting channel; 35. Inert gas input device; 36. Water circulation cooler A; 37. Water circulation cooler B; 38. Pressure relief valve; 39. High frequency generator; 40. Infrared thermometer; 41. Metal material feeding device; 42. Plasma power supply; 43. Metal vapor condensation device; 44. Metal powder collection device; 45. Microcontroller controller; 46. Radar level gauge; 47. Quartz glass plate; 48. Nitrogen gas;
[0060] The diagram is labeled as follows: 11-1. Cathode column; 11-2. Liquid chamber; 11-3. Liquid flow hole; 11-4. High-temperature resistant conductive coating C; 11-5. Miniature water pump; 11-6. Water jet pipe; 11-7. Water suction pipe;
[0061] The diagram is labeled as follows: 20-1. Arc wall channel; 20-2. Outer arc wall; 20-3. Inner arc wall; 20-4. Side wall; 20-5. Connecting bolt; 20-6. Inner heat sink lining; 20-7. Inner heat-resistant sheet; 20-8. High-temperature resistant coating;
[0062] The labels in the diagram are as follows: 27-1 Ceramic upper ring; 27-2 Cooling channel inlet; 27-3 High-temperature conductive coating B; 27-4 Ceramic inner ring skeleton; 27-5 Plasma positive electrode; 27-6 Ceramic middle disk; 27-7 Ceramic bottom ring disk; 27-8 Ceramic body cooling channel; 27-9 Cooling ceramic tube; 27-10 Cooling ceramic pipe; 27-11 Conductor connection hole; 27-12 Hollow ceramic column; 27-13 Outer ceramic wall; 27-14 Ceramic toothed spacer.
[0063] The following are the labels in the diagram: 411. Collection hopper; 412. Solenoid valve a; 4131. Through pipe A; 4132. Through pipe B; 4133. Through pipe C; 414. Weighing hopper; 4141. Gravity sensor; 4142. Leakage pipe; 4143. Weighing bracket; 4144. Fixing frame; 4145. Collection hopper bracket; 415. Solenoid valve b; 416. Solenoid valve c; 417. Air-blocking hopper A; 418. Solenoid valve d; 419. Air-blocking hopper B; 410. Solenoid valve e; 8. Metal material input channel. Detailed Implementation
[0064] Example
[0065] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0066] exist Figure 1In this high-temperature evaporation device (100) for manufacturing nano-metal powder includes a water-cooled cylindrical shell (1), a water-cooled hemispherical shell (7), an evaporation chamber (2), a cooling water inlet A (3), a connecting flange (4), fastening bolts (5), an observation channel (6), a metal material input channel (8), a cooling water accumulation chamber A (9), a cooling water inlet C (10), a plasma cathode column (11), a cooling water inlet D (12), a metal vapor channel (13), an inner wall of the evaporation chamber (14), an inert gas inlet channel (15), and an insulation wall (16). Hemispherical shell cooling water channel (30), shell connecting ceramic (17), cooling water accumulation chamber B (18), cooling water inlet B (19), crucible wall flap (20), high-frequency inductor coil (22), support frame (23), pressure relief port (24), cooling water outlet A (25), plasma anode terminal (26), anode insulating sleeve (261), crucible bottom (27), cooling water outlet B (28), wall flap connecting ceramic (29), hemispherical shell cooling water channel (30), cylindrical shell cooling water channel (31), ceramic fiber composite Hoop (32), composite insulation material (33), cathode mounting channel (34); the water-cooled cylindrical shell (1) of the high-temperature evaporation equipment (100) is a cylindrical shell composed of inner and outer metal walls, with a hollow cylindrical shell cooling water channel (31) for cooling water or other cooling fluids to pass through to cool the shell; the upper part of the cylindrical shell cooling water channel (31) is provided with a cooling water accumulation chamber B (18); the upper edge of the water-cooled cylindrical shell (1) is provided with a connecting flange (4), The lower left half of the connecting flange (4) is provided with 1-4 cooling water inlets A (3), and the lower right half of the connecting flange (4) is provided with 1-4 cooling water inlets B (19); at the bottom of the circular barrel shell (1), there is a cooling water outlet B (28) connecting the cooling water channel (31) of the circular barrel shell and a pressure relief port (24) passing through the inner and outer metal barrel walls to isolate the cooling water channel (31) of the circular barrel shell, and a cooling water outlet A (25) passing through the inner and outer metal barrel walls to isolate the cooling water channel (31) of the circular barrel shell.
[0067] exist Figure 1In the high-temperature evaporation equipment (100), the water-cooled hemispherical shell (7) is composed of inner and outer metal walls, and the hollow part is a hemispherical shell cooling water channel (30). The hemispherical shell cooling water channel (30) is used for cooling water or other cooling fluids to pass through and generate a cooling effect on the shell. The upper part of the hemispherical shell cooling water channel (30) is provided with a cooling water accumulation chamber A (9), and the lower part is provided with a water inlet (301). The upper part of the cooling water accumulation chamber A (9) is provided with 1-2 cooling water inlets C (10) and 1-2 cooling water inlets D (12). The lower outer edge of the water-cooled hemispherical shell (7) is provided with a connecting flange (4), and the lower inner edge of the water-cooled hemispherical shell (7) is provided with a connecting flange. The cooling water channel (30) has a water inlet (301); a cathode mounting channel (34) for mounting plasma cathode columns (11) is provided in the upper middle part of the water-cooled hemispherical shell (7); 1-2 cooling water inlets C (10) are provided on the left periphery of the cathode mounting channel (34), and 1-2 cooling water inlets D (12) are provided on the right periphery; a metal material input channel (8) is provided at the lower part of the cooling water inlet C (10); an observation channel (6) is provided at the lower part of the metal material input channel (8), and a metal vapor channel (13) is provided at the lower part of the cooling water inlet D (12); an inert gas inlet channel (15) is provided at the lower part of the metal vapor channel (13).
[0068] exist Figure 7 , Figure 8 , Figure 1 In this structure, the crucible wall segments (20), crucible bottom (27), wall segment connecting ceramics (29), and ceramic fiber composite hoop (32) form a pot-shaped structure, which is installed in a water-cooled cylindrical shell (1). N crucible wall segments (20) are installed on the crucible bottom (27), and the crucible wall segments (20) are spaced apart to form a conical barrel shape. The spacing between the crucible wall segments (20) is 8-32 mm. Wall segment connecting ceramics (29) are provided in the spacing between the crucible wall segments (20). The wall segment connecting ceramics (29) are made of clay that has been air-dried and fired at high temperature. The crucible wall segments (20) and N wall segment connecting ceramics (29) are combined to form a conical barrel shape, and two ceramic fiber composite hoops (32) are provided on the outside to secure it. One ceramic fiber composite hoop (32) is set at the outer periphery where the N crucible wall segments (20) are connected to the crucible bottom (27); the other is set at the upper middle part of the outer periphery of the N crucible wall segments (20) and the N wall segment connecting ceramics (29). The ceramic fiber composite hoop (32) plays the role of stabilizing the crucible bottom (27) and the N crucible wall segments (20) and the N wall segment connecting ceramics (29) to form a conical barrel. The ceramic fiber composite hoop (32) is a ceramic fiber composite material.
[0069] exist Figure 9 , Figure 10 , Figure 11 , Figure 12 In the crucible wall segment (20), the crucible wall segment (20) includes an arc wall channel (20-1), an outer arc wall (20-2), an inner arc wall (20-3), a side wall (20-4), a connecting bolt (20-5), an inner heat sink lining (20-6), an inner heat-resistant sheet (20-7), and a high-temperature resistant coating (20-8); characterized in that: the outer arc wall (20-2), the inner arc wall (20-3), and the two side walls (20-4) are combined to form a four-walled arc-shaped tube, and the inner arc wall (20-3) is located within the inner arc wall (20-3). The inner heat sink (20-6) is provided on the side, and the inner heat-resistant sheet (20-7) is provided on the outer side; a connecting bolt (20-5) is provided in the inner arc wall (20-3) to connect the inner heat sink (20-6) and the inner heat-resistant sheet (20-7), and the connecting bolt (20-5) connects the inner heat sink (20-6), the inner arc wall (20-3), and the inner heat-resistant sheet (20-7) into one unit; the surface of the inner heat-resistant sheet (20-7) is coated with a high-temperature resistant coating (20-8);
[0070] The outer arc wall (20-2), inner arc wall (20-3), and side wall (20-4) are made of copper-manganese alloy; the mass ratio of the copper and manganese composite components is: 59.5-70.5 parts copper and 26.5-37.5 parts manganese.
[0071] The material of the inner heat sink (20-6) is aluminum;
[0072] The inner heat-resistant sheet (20-7) is made of an alloy of tungsten, tantalum carbide, and copper. The mass ratio of the composite components of tungsten, tantalum carbide, and copper is: 32.5-43.5 parts tungsten, 22.5-33.5 parts tantalum carbide, and 26.5-37.5 parts copper.
[0073] The high-temperature resistant coating (20-8) is a composite coating of graphene, tantalum carbide, copper, and tungsten. The mass ratio of graphene, tantalum carbide, copper, and tungsten in the high-temperature resistant coating (20-8) is as follows: graphene 14.5-25.5 parts, tantalum carbide 17.5-28 parts, copper 13-24 parts, and tungsten 24.5-35.5 parts. The spraying method is plasma spraying.
[0074] The functions of the crucible wall segments (20) are as follows: Due to the use of various high-temperature resistant materials to form a special water-cooling structure, it has certain high-temperature resistance, enabling the crucible composed of multiple crucible wall segments (20) to withstand high temperatures and have a long service life; the arc wall channels (20-1) of the crucible wall segments (20) play a role in cooling and resisting high temperatures; the inner heat dissipation fins (20-6) play a role in quickly dissipating the heat energy of the inner arc wall (20-3) to the cooling water; the inner heat-resistant sheet (20-7) plays a role in protecting the inner arc wall (20-3) against high temperatures, thereby extending the service life of the crucible wall segments (20); the high-temperature resistant coating (20-8) The inner heat-resistant plate (20-7) is protected against high temperatures, making it more durable. It also protects the inner arc wall (20-3) of the crucible wall (20), further extending the service life of the crucible wall (20). The connecting bolt (20-5) connects the inner heat sink (20-6), the inner arc wall (20-3), and the inner heat-resistant plate (20-7) into one unit, thereby further ensuring the stable heat dissipation performance of the inner heat sink (20-6) and the stable heat resistance performance of the inner heat-resistant plate (20-7), thus stabilizing the performance and service life of the crucible wall (20).
[0075] exist Figure 13 , Figure 14In the crucible bottom (27), the ceramic upper ring layer (27-1), cooling channel opening (27-2), high-temperature resistant conductive coating B (27-3), ceramic inner ring skeleton (27-4), plasma positive electrode (27-5), ceramic middle disk (27-6), ceramic bottom ring disk (27-7), ceramic body cooling channel (27-8), cooling ceramic tube (27-9), cooling ceramic pipe (27-10), conductor connection hole (27-11), hollow ceramic column (27-12), outer ceramic wall (27-13), and ceramic toothed spacer (27-14). The feature is that: the outer periphery of the upper ceramic ring (27-1) is provided with a plurality of ceramic toothed partitions (27-14), the plurality of ceramic toothed partitions (27-14) are connected to the outer ceramic wall (27-13); the plurality of ceramic toothed partitions (27-14), the upper ceramic ring (27-1), and the outer ceramic wall (27-13) form a cooling channel opening (27-2); the upper ceramic ring (27-1), the inner ceramic ring skeleton (27-4), and the middle ceramic disk (27-6) form a recessed disk cavity, and a plasma positive electrode (27-5) is provided in the recessed disk cavity. The plasma positive electrode (27-5) is a disc-shaped conductor, and a high-temperature resistant conductive coating B (27-3) is provided on the top of the plasma positive electrode (27-5). The outer ceramic wall (27-13), the ceramic bottom ring disk (27-7), the ceramic tooth spacer (27-14), the ceramic inner ring skeleton (27-4), and the ceramic middle disc (27-6) form a double-layer hollow shell structure, so that the outer ceramic wall (27-13) and the ceramic inner ring skeleton (27-4) form a ceramic body cooling channel (27-8), and the ceramic bottom ring disk (27-7) and the ceramic middle disc (27-6) form a ceramic body cooling channel (27-8). 6) A ceramic cooling channel (27-8) is formed; a cooling ceramic tube (27-9) is provided in the lower part of the ceramic bottom ring plate (27-7), and a cooling ceramic pipe (27-10) is provided in the cooling ceramic tube (27-9); the cooling ceramic pipe (27-10) is connected to the ceramic cooling channel (27-8) and the cooling channel opening (27-2); a hollow ceramic column (27-12) is provided between the ceramic middle disc (27-6) and the ceramic bottom ring plate (27-7), and a conductor connection hole (27-11) is provided in the hollow ceramic column (27-12);
[0076] The plasma positive electrode (27-5) is an alloy of tungsten and copper, and the mass ratio of the composite components of tungsten and copper is: 16.5-27.5 parts tungsten and 30.5-41.5 parts copper.
[0077] The high-temperature resistant conductive coating B is a composite coating of graphene, silicon carbide, aluminum nitride, tungsten, and carbon; the mass ratio of graphene, silicon carbide, aluminum nitride, tungsten, and carbon in the high-temperature resistant conductive coating B (27-3) is as follows: graphene 13-24 parts, silicon carbide 19.5-30.5 parts, aluminum nitride 7-18 parts, tungsten 22.5-33.5 parts, and carbon 24.5-35.5 parts; the spraying method is plasma spraying.
[0078] The crucible bottom (27) is configured to connect with multiple crucible wall segments (20) to form a water-cooled crucible bottom (27) with circulating water cooling. The cooling ceramic pipe (27-10) is connected to the ceramic cooling channel (27-8) and the cooling channel opening (27-2), allowing cooling water to flow through the interior of the crucible bottom (27). This cools the plasma positive electrode (27-5) and enhances its heat resistance, enabling the plasma positive electrode (27-5) to resist high-temperature corrosion and thus improve the service life of the crucible bottom (27). The high-temperature resistant conductive coating B (27-3) can further improve the high-temperature resistance and electrical properties of the plasma positive electrode (27-5), thereby improving the service life and heating performance of the crucible bottom (27).
[0079] exist Figure 15 The plasma cathode column (11) comprises a cathode column (11-1), a liquid chamber (11-2), a liquid flow hole (11-3), a high-temperature resistant conductive coating C (11-4), a micro water pump (11-5), a suction pipe (11-7), and a jet pipe (11-6); characterized in that: the cathode column (11-1) is provided with a high-temperature resistant conductive coating C (11-4) on its exterior, and the cathode column (11-1) is provided with a liquid chamber (11-2) capable of containing liquid and a flow channel for the liquid. The liquid flow holes (11-3) of the body; the liquid chamber (11-2) and the two liquid flow holes (11-3) can be circulated with cooling water or cooling liquid; a micro water pump (11-5) is installed on the upper part of the liquid chamber and the two liquid flow holes (11-3), the micro water pump (11-5) is provided with a suction pipe (11-7) and a water jet pipe (11-6), the water jet pipe (11-6) is in the space of the liquid chamber (11-2), and the suction pipe (11-7) is connected to the cooling water inlet D (12) for water circulation;
[0080] The cathode column (11-1) is made of a composite of tungsten, copper, silver and carbon materials. The mass ratio of tungsten, copper, silver and carbon in the cathode column (11-1) is: 17-28 parts tungsten, 14.5-25.5 parts copper, 3-14 parts silver and 14.5-25.5 parts carbon.
[0081] The high-temperature resistant conductive coating C is a composite coating of graphene, silicon carbide, molybdenum, tungsten, and carbon; the mass ratio of graphene, silicon carbide, molybdenum, tungsten, and carbon in the high-temperature resistant conductive coating C (11-4) is as follows: graphene 14.5-25.5 parts, silicon carbide 12.5-23.5 parts, molybdenum 2-13 parts, tungsten 24.5-35.5 parts, and carbon 22.5-33.5 parts; the spraying method is plasma spraying.
[0082] The plasma cathode column (11) features the following functions: the liquid chamber (11-2) and liquid flow hole (11-3) of the plasma cathode column (11) allow cooling water to circulate; the micro water pump (11-5), water suction pipe (11-7), and water jet pipe (11-6) allow water to circulate at high speed, thereby efficiently cooling the cathode column (11-1); the high-temperature resistant conductive coating C (11-4) further increases the high-temperature resistance and conductivity of the plasma cathode column (11), thereby improving the effective working time and service life of the plasma cathode column (11); it can achieve the beneficial effects of reducing maintenance costs and improving production efficiency.
[0083] The beneficial effects achieved by the plasma cathode column (11) are: to enhance discharge performance, save energy, reduce the replacement cost of the cathode column (11-1), extend the service life of the cathode column (11-1), and improve the production efficiency of nano-metal powder.
[0084] Application of high-temperature evaporation equipment.
[0085] exist Figure 2 , Figure 3 A nano-metal powder production system includes a high-temperature evaporation device (100) for manufacturing nano-metal powder, a switch (200), a computer (300), a water circulation cooler A (36), a water circulation cooler B (37), a pressure relief valve (38), an inert gas input device (35), a high-frequency generator (39), an infrared thermometer (40), a metal material feeding device (41), a plasma power supply (42), a metal vapor condensation device (43), a metal powder collection device (44), a single-chip microcomputer controller (45), a radar level gauge (46), a quartz glass plate (47), nitrogen gas (48), and a metal solution (21); wherein the computer (300), the switch (200), the single-chip microcomputer controller (45), the radar level gauge (46), the infrared thermometer (40), the high-temperature evaporation device (100), and the metal material feeding device (41) constitute an automatic feeding system for manufacturing nano-metal powder;
[0086] The high-temperature evaporation equipment (100) is installed in the production workshop, and the computer (300) and switch (200) are installed in the control room; there is a partition wall or isolation room between the production workshop and the control room, and the isolation distance is 0.5-100m;
[0087] The water circulation cooler A (36), water circulation cooler B (37), and inert gas input device (35) are connected to the high-temperature evaporation equipment (100) outside the production workshop; the pressure relief valve (38) is installed below the high-temperature evaporation equipment (100);
[0088] The high-frequency generator (39) and plasma power supply (42) are connected to the high-temperature evaporation equipment (100) in the production workshop;
[0089] The infrared thermometer and radar level gauge are located in the high-temperature evaporation equipment (100);
[0090] The single-chip microcontroller (45) is installed in the production workshop, and its lines are connected to an infrared thermometer (40) and a radar level gauge (46), and its lines are connected to a switch (200) and a computer (300) in the control room.
[0091] The metal material feeding device (41) is installed in the upper middle part of the high-temperature evaporation equipment (100);
[0092] The metal vapor channel (13) is connected to the metal vapor condensing device (43), and the metal vapor condensing device (43) is connected to the metal powder collecting device (44); the metal vapor is transported through the metal vapor channel (13) to the metal vapor condensing device (43) to be condensed into nano metal powder, and then collected by the metal powder collecting device (44);
[0093] The inert gas input device (35) is connected through the inert gas inlet channel (15) and its function is to input inert gas during the production of nano-metal powder;
[0094] One end of the plasma power supply (42) is connected to the conductive terminal of the plasma cathode post (11), and the other end is connected to the conductive terminal of the plasma anode post (26); its function is to generate a plasma heating effect with the inert gas and provide a basic heating source for the production of nano-metal powder.
[0095] The high-frequency generator (39) is connected to the high-frequency inductor coil (22); its function is to generate an inductive heating effect and a plasma heating source to generate a composite heating field, so that the processed metal material melts quickly and evaporates evenly, thereby producing nano-metal powder with uniform particle size and individual particles ≤10 nm; thus making the nano-metal powder of good quality and high production efficiency.
[0096] The water circulation cooler A (36) is connected to the cooling water outlet B (28), cooling water inlet A (3), and cooling water inlet B (19) for water flow. When the nano-metal powder production system is working, water flows through the water circulation cooler A (36), through the cooling water inlet A (3), and cooling water inlet B (19) into the cooling water channel (31) of the cylindrical shell, and then through the cooling water outlet B (28) into the water circulation cooler A (36) for circulation, thereby cooling the water-cooled cylindrical shell (1). The water circulation cooler B (37) is connected to the cooling water outlet A (25) and the cooling water inlet C (10) and cooling water inlet D (12) for water circulation. When the nano metal powder production system is working, water flows through the water circulation cooler B (37) and into the cooling water channel (30) of the hemispherical shell through the cooling water inlet C (10) and cooling water inlet D (12), and then enters the water circulation cooler B (37) through the cooling water outlet A (25) for circulation, thereby generating a cooling effect on the water-cooled hemispherical shell (7). The cathode mounting channel (34) houses a plasma cathode column (11), which is electrically connected to a plasma power supply (42). The plasma cathode column (11) is connected to the cooling water inlet D (12). The infrared thermometer (40) is connected to a single-chip microcomputer controller (45) in the observation channel (6) to detect the heating temperature of the evaporation chamber (2). The radar level gauge (46) is connected to a single-chip microcomputer controller (45) in the observation channel (6) to detect multiple crucible wall segments (2). 0) The liquid level of the metal solution (21) in the observation channel (6); multiple quartz glass plates (47) are installed in the observation channel (6), the distance between the quartz glass plates (47) is 5-25mm, and nitrogen gas (48) is filled in the 5-25mm space between the quartz glass plates (47); the nitrogen gas (48) in the space between the quartz glass plates (47) further improves the heat insulation effect, so as to better protect the infrared thermometer and the radar level gauge.
[0097] exist Figure 5An automatic feeding system for manufacturing nano-metal powder includes a high-temperature evaporation device, a computer, a switch, a microcontroller, a radar level gauge, an infrared thermometer, and a metal material feeding device. The computer includes CPU programming software and automatic feeding control software for manufacturing nano-metal powder. The CPU programming software is used to program the microcontroller's CPU. The automatic feeding control software includes main power control, furnace temperature display for the high-temperature evaporation device, feeding settings, and solenoid valve control. The metal material feeding device includes a collection hopper, solenoid valve a, a weighing hopper, a gravity sensor, solenoid valve b, solenoid valve c, air-sealing hopper A, solenoid valve d, air-sealing hopper B, and solenoid valve e. The microcontroller processes information from the radar level gauge and gravity sensor to automatically control the metal material feeding device. The metal material feeding device works in conjunction with the microcontroller to perform the collection, weighing, and feeding of metal material.
[0098] The microcontroller controller (45) includes a CPU chip, ROM memory, RAM memory, power supply module, network module, MAX232 module, A / D input module, and thyristor output module; the function of the microcontroller controller is to process the information from the infrared thermometer, radar level gauge, and gravity sensor to control the feeding device.
[0099] The automatic feeding control software for manufacturing nano-metal powder includes overall power control, plasma heating control, inductive heating control, furnace temperature setting and display for the high-temperature evaporation equipment, feeding settings, and solenoid valve control. The plasma heating control includes current setting and airflow setting; the inductive heating control includes current setting and power display; the feeding settings include automatic feeding and manual feeding, with automatic feeding including setting the amount fed per cycle and feeding frequency, and manual feeding including setting the amount fed per cycle; the solenoid valve control includes switches for solenoid valve a, solenoid valve b, solenoid valve c, solenoid valve d, and solenoid valve e.
[0100] exist Figure 4 The metal material feeding device (41) includes a material collection hopper (411), a solenoid valve a (412), a through pipe A (4131), a through pipe B (4132), a through pipe C (4133), a weighing hopper (414), 3-6 gravity sensors (4141), a material leakage guide pipe (4142), a weighing bracket (4143), a fixing frame (4144), a material collection hopper bracket (4145), a solenoid valve b (415), a solenoid valve c (416), an air-blocking hopper A (417), a solenoid valve d (418), an air-blocking hopper B (419), a solenoid valve e (410), and a metal material input channel (8).
[0101] exist Figure 6In the metal material feeding device (41), the upper part of the fixed frame (4144) is provided with a hopper support (4145), and the middle part is provided with a weighing support (4143). A hopper (411) is installed on the hopper support (4145), and a solenoid valve a (412) is installed below the hopper (411). A through pipe A (4131) is installed below the solenoid valve a (412). A solenoid valve b (415) is installed on the weighing support (4143), and a weighing hopper (414) is installed on the solenoid valve b (415). The upper end of the weighing hopper (414) The opening surrounds the through pipe A (4131) under the solenoid valve a (412); the through pipe B (4132) under the weighing bracket (4143) is connected to the solenoid valve c (416), the air-isolating hopper A (417) is installed under the solenoid valve c (416), the solenoid valve d (418) under the air-isolating hopper A (417) is connected to the air-isolating hopper B (419), the solenoid valve e (410) is installed under the air-isolating hopper B (419); the through pipe C (4133) under the solenoid valve e (410) is connected to the metal material input channel (8);
[0102] The weighing hopper (414) has a connecting pipe A (4131) suspended in its upper opening. The lower end of the connecting pipe A (4131) is 10-50mm below the upper end of the weighing hopper (414). The lower end of the weighing hopper (414) is connected to a solenoid valve b (415). A material leakage guide pipe (4142) is installed at the lower end of the solenoid valve b (415). The material leakage guide pipe (4142) is hollow between the connecting pipe B (4132), the weighing hopper (414), 3-6 gravity sensors (4141), the material leakage guide pipe (4142), and the weighing bracket (4143), and there is a gap between it and the connecting pipe B (4132), the weighing hopper (414), the 3-6 gravity sensors (4141), the material leakage guide pipe (4142), and the weighing bracket (4143), without any connection. The gap between the material leakage guide pipe (4142) and the weighing bracket (4143) and the through pipe B (4132) is 3-10mm; the distance between the material leakage guide pipe (4142) and 3-6 gravity sensors (4141) is 10-50mm; the lower end of the material leakage guide pipe (4142) is higher than the upper end of the through pipe B (4132) under the weighing bracket (4143); the weighing hopper (414), solenoid valve b (415), and material leakage guide pipe (4142) are integrated on the 3-6 gravity sensors (4141); the movable device of the 3-6 gravity sensors (4141) is located on the solenoid valve b (415). Between the weighing hopper (414) and the weighing support (4143); the function of the solenoid valve b (415) is to open or close the passage between the weighing hopper (414) and the material leakage guide pipe (4142). When the solenoid valve b (415) is open, the metal material in the weighing hopper (414) leaks into the material leakage guide pipe (4142) through the solenoid valve b (415). When the solenoid valve b (415) is closed, the metal material in the weighing hopper (414) cannot leak into the material leakage guide pipe (4142) through the solenoid valve b (415). A through pipe B (4132) is provided on the periphery of the material leakage guide pipe (4142). The through pipe B (4132) and the material leakage guide pipe (4142) are connected without contact.
[0103] Furthermore, the infrared thermometer (40) and radar level gauge (46) are installed in the high-temperature evaporation equipment (100) and connected to the A / D input module of the microcontroller; the gravity sensor is installed at the lower end of the solenoid valve a of the metal material feeding device and connected to the A / D input module of the microcontroller.
[0104] Three to six gravity sensors (4141) are provided between the lower end of the solenoid valve b (415) and the weighing bracket (4143). The function of the gravity sensors (4141) is to sense the total weight of the weighing hopper (414), solenoid valve b (415), material leakage guide pipe (4142) and the metal material in the weighing hopper (414), and subtract the weight of the weighing hopper (414), solenoid valve b (415) and material leakage guide pipe (4142) to obtain the net weight of the metal material.
[0105] The metal material feeding device (41) is connected to the metal material input channel (8) and to the single-chip microcomputer controller (45); it is used for feeding and feeding control.
[0106] Furthermore, the automatic feeding control method and steps of the automatic feeding system for manufacturing nano-metal powder;
[0107] The radar level gauge (46) detects the metal liquid level information of the high-temperature evaporation equipment (100) online and transmits the information to the microcontroller controller (45). The microcontroller controller (45) processes the information transmitted by the radar level gauge (46). When the metal liquid level of the high-temperature evaporation equipment (100) is lower than the set range, the microcontroller controller (45) controls the metal material feeding device (41) to feed the high-temperature evaporation equipment (100). When the radar level gauge (46) detects that the metal liquid level of the high-temperature evaporation equipment (100) is higher than the set range, it controls the metal material feeding device (41) to stop feeding. This keeps the metal liquid level of the high-temperature evaporation equipment (100) automatically within the set range, thereby stabilizing the metal vapor evaporation of the high-temperature evaporation equipment (100) and achieving the purpose of continuous and efficient uninterrupted production of metal powder.
[0108] The specific automatic feeding steps are as follows:
[0109] Step 1: When the A / D input module of the single-chip microcomputer controller receives the metal liquid level detected by the radar level gauge (46) and the height of the metal liquid is 750-1000mm lower than the upper end face of the crucible wall (20), the CPU sends a command signal to the thyristor output module to open the solenoid valve a (412). The thyristor output module then controls the solenoid valve a (412) to open, so that the metal material in the collecting hopper (411) is discharged into the weighing hopper (414) through the solenoid valve a (412).
[0110] Step 2: When the A / D input module of the single-chip microcomputer controller receives the net weight of the material in the weighing hopper (414) detected by the gravity sensor (4141) and it reaches 1880-2050g, the CPU sends a command signal to the thyristor output module to close the solenoid valve a (412). The thyristor output module then controls the solenoid valve a (412) to close, while the solenoid valves b (415) and c (416) open. The metal material in the weighing hopper (414) leaks into the air-tight hopper A (417) through the solenoid valves b (415) and c (416).
[0111] Step 3: When the A / D input module of the single-chip microcomputer controller receives the net weight of the material in the weighing hopper (414) detected by the gravity sensor (4141) and it is between 0-250g, the CPU sends a command signal to the thyristor output module to close the solenoid valves b (415) and c (416). The thyristor output module then controls the solenoid valves b (415) and c (416) to close.
[0112] Step 4: After the solenoid valves b and c are closed for 10-15 seconds, the CPU of the microcontroller sends a command signal to the thyristor output module to open the solenoid valve d (418). The thyristor output module then controls the solenoid valve d (418) to open, and at this time the metal material in the air-isolating hopper A (417) leaks to the air-isolating hopper B (419).
[0113] Step 5: After the solenoid valve d (418) is opened for 20-30 seconds, the CPU of the microcontroller sends a command signal to the thyristor output module to close the solenoid valve d (418), and the thyristor output module controls the solenoid valve d (418) to close.
[0114] Step 6: After the solenoid valve d is closed for 10-15 seconds, the CPU of the single-chip microcomputer controller sends a command signal to the thyristor output module to open the solenoid valve e (410). The thyristor output module then controls the solenoid valve e (410) to open, and the metal material in the gas-proof hopper B (419) is leaked to the high-temperature evaporation equipment (100) through the solenoid valve e (410).
[0115] Step 7: After the solenoid valve e is opened for 3-30 seconds, the CPU sends a command signal to the thyristor output module to close the solenoid valve e (410), and the thyristor output module controls the solenoid valve e (410) to close.
[0116] Steps one through seven can automatically feed the metal solution according to the liquid level of the metal solution in the high-temperature evaporation equipment (100), so that the liquid level of the metal solution in the high-temperature evaporation equipment (100) is always kept within the set height range. This allows the high-temperature evaporation equipment (100) to work continuously without being affected by the feeding. Compared with manual feeding, the automatic feeding method of the present invention greatly improves the production efficiency of nano-metal powder. Furthermore, due to the multiple air-isolation feeding function composed of air-isolation hopper A (417), air-isolation hopper B (419), and solenoid valves c (416), d (418), and e (410), the feeding of the high-temperature evaporation equipment (100) is completely isolated from the outside air and is not affected by the external ambient temperature. This makes the temperature and pressure inside the high-temperature evaporation equipment (100) stable, so that the evaporation of metal vapor is uniform and stable, and the produced nano-metal powder particles are uniform in size and stable in quality. Example
[0117] The control method and steps of an automatic feeding system for manufacturing nano-nickel powder are as follows:
[0118] Step 1: When the A / D input module of the single-chip microcomputer controller receives the molten nickel liquid level detected by the radar level gauge (46) and finds that the height of the molten nickel liquid is 850-1200mm lower than the upper end face of the crucible wall (20), the CPU sends a command signal to the thyristor output module to open the solenoid valve a (412). The thyristor output module then controls the solenoid valve a (412) to open, so that the nickel material in the collecting hopper (411) is leaked into the weighing hopper (414) through the solenoid valve a (412).
[0119] Step 2: When the A / D input module of the single-chip microcomputer controller receives the net weight of nickel material in the weighing hopper (414) detected by the gravity sensor (4141) and it reaches 1250-2000g, the CPU sends a command signal to the thyristor output module to close the solenoid valve a (412). The thyristor output module then controls the solenoid valve a (412) to close, while the solenoid valves b (415) and c (416) open. The nickel material in the weighing hopper (414) leaks into the air-tight hopper A (417) through the solenoid valves b (415) and c (416).
[0120] Step 3: When the A / D input module of the single-chip microcomputer controller receives the net weight of nickel material in the weighing hopper (414) detected by the gravity sensor (4141) and it is between 0-150g, the CPU sends a command signal to the thyristor output module to close the solenoid valves b (415) and c (416), and the thyristor output module controls the solenoid valves b (415) and c (416) to close.
[0121] Step 4: After the solenoid valves b and c are closed for 10-15 seconds, the CPU of the microcontroller sends a command signal to the thyristor output module to open the solenoid valve d (418). The thyristor output module then controls the solenoid valve d (418) to open, and at this time the nickel material in the gas-isolating hopper A (417) leaks to the gas-isolating hopper B (419).
[0122] Step 5: After the solenoid valve d (418) is opened for 20-30 seconds, the CPU of the microcontroller sends a command signal to the thyristor output module to close the solenoid valve d (418), and the thyristor output module controls the solenoid valve d (418) to close.
[0123] Step 6: After the solenoid valve d is closed for 10-15 seconds, the CPU of the single-chip microcomputer controller sends a command signal to the thyristor output module to open the solenoid valve e (410). The thyristor output module then controls the solenoid valve e (410) to open, and the nickel material in the gas-isolating hopper B (419) is leaked to the high-temperature evaporation equipment (100) through the solenoid valve e (410).
[0124] Step 7: After the solenoid valve e is opened for 5-10 seconds, the CPU sends a command signal to the thyristor output module to close the solenoid valve e (410), and the thyristor output module controls the solenoid valve e (410) to close.
[0125] Steps one through seven can automatically feed the nickel solution according to the liquid level of the nickel solution in the high-temperature evaporation equipment (100), so that the liquid level of the nickel solution in the high-temperature evaporation equipment (100) is always kept within the set height range. This allows the high-temperature evaporation equipment (100) to work continuously without being affected by the feeding. Compared with manual feeding, the automatic feeding method of the present invention greatly improves the production efficiency of nano nickel powder. Furthermore, due to the multiple gas-isolation feeding function composed of gas-isolation hopper A (417), gas-isolation hopper B (419), and solenoid valves c (416), d (418), and e (410), the feeding of the high-temperature evaporation equipment (100) is completely isolated from the air outside the furnace and is not affected by the external ambient temperature. This makes the temperature and pressure inside the high-temperature evaporation equipment (100) stable, so that the evaporation of nickel vapor is uniform and stable, and the produced nano nickel powder particles are uniform in size and stable in quality.
[0126] The above methods and steps are also used in the production of nanopowders for cobalt, tantalum, and tungsten.
Claims
1. An automated feeding system for manufacturing nano-metal powder, characterized in that: Includes high-temperature evaporation equipment, computer (300), switch (200), single-chip microcontroller (45), radar level gauge (46), infrared thermometer (40), and metal material feeding device (41). The high-temperature evaporation equipment (100) includes a water-cooled cylindrical shell (1), a water-cooled hemispherical shell (7), an evaporation chamber (2), a cooling water inlet A (3), a connecting flange (4), fastening bolts (5), an observation channel (6), a metal material input channel (8), a cooling water accumulation chamber A (9), a cooling water inlet C (10), a plasma cathode column (11), a cooling water inlet D (12), a metal vapor channel (13), an inner wall of the evaporation chamber (14), an inert gas inlet channel (15), an insulation wall (16), a shell connecting ceramic (17), and a cooling water accumulation chamber B (18). Water inlet B (19), crucible wall flap (20), high-frequency inductor coil (22), support frame (23), pressure relief port (24), cooling water outlet A (25), plasma anode terminal (26), anode insulating sleeve (261), crucible bottom (27), cooling water outlet B (28), wall flap connecting ceramic (29), hemispherical shell cooling water channel (30), cylindrical shell cooling water channel (31), ceramic fiber composite hoop (32), composite insulation material (33), cathode mounting channel (34); the upper part of the hemispherical shell cooling water channel (30) is provided with a cooling water accumulation chamber A (9); The metal material feeding device (41) includes a collection hopper (411), solenoid valve a (412), weighing hopper (414), gravity sensor (4141), solenoid valve b (415), solenoid valve c (416), air-sealing hopper A (417), solenoid valve d (418), air-sealing hopper B (419), and solenoid valve e (410). The microcontroller (45) is used to process the information from the radar level gauge (46) and gravity sensor (4141) to automatically control the metal material feeding device (41). The metal material feeding device (41) is used to cooperate with the microcontroller (45) to perform the collection, weighing, and feeding of metal materials.
2. The automatic feeding system for manufacturing nano-metal powder according to claim 1, characterized in that: The cooling water accumulation chamber A (9) is provided with 1-2 cooling water inlets C (10) and 1-2 cooling water inlets D (12).
3. The automatic feeding system for manufacturing nano-metal powder according to claim 1, characterized in that: The water-cooled cylindrical shell (1) of the high-temperature evaporation equipment (100) is a cylindrical shell composed of inner and outer metal walls. The hollow part is the cylindrical shell cooling water channel (31), which is used for cooling water or other cooling fluids to pass through.
4. The automatic feeding system for manufacturing nano-metal powder according to claim 1, characterized in that: The computer (300) includes CPU programming software and automatic feeding control software for manufacturing nano-metal powder; the CPU programming software is used to program the CPU program of the microcontroller.
5. The automatic feeding system for manufacturing nano-metal powder according to claim 1, characterized in that: The automatic feeding control software for manufacturing nano-metal powder includes main power control, furnace temperature display for high-temperature evaporation equipment, feeding settings, and solenoid valve control.
6. The automatic feeding system for manufacturing nano-metal powder according to claim 1, characterized in that: The microcontroller (45) of the automatic feeding system for manufacturing nano-metal powder includes a CPU chip, ROM memory, RAM memory, power module, network module, MAX232 module, A / D input module, and thyristor output module. The function of the microcontroller (45) is to process the information from the radar level gauge (46) and gravity sensor (4141) and control the feeding device.