Liquid metal-phase change working medium composite type uniform temperature cold plate

By using a liquid metal-phase change working fluid composite homogeneous cooling plate, combined with a serpentine flow channel and fin structure, the temperature rise problem of liquid metal cooling plates in the process of heat dissipation from multiple heat sources is solved, achieving efficient homogeneous heat dissipation and cost reduction.

CN116981220BActive Publication Date: 2026-07-10THE 724TH RESEARCH INSTITUTE OF CHINA STATE SHIPBUILDING CORP LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
THE 724TH RESEARCH INSTITUTE OF CHINA STATE SHIPBUILDING CORP LTD
Filing Date
2023-07-19
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Liquid metal has a low specific heat capacity, which leads to a rapid temperature rise during chip heat dissipation and reduces its ability to achieve uniform heat dissipation. Existing technologies have failed to effectively address the need for uniform heat dissipation from multiple heat sources.

Method used

A liquid metal-phase change working fluid composite heat exchanger is adopted. By combining liquid metal and phase change working fluid, the heat dissipation performance is improved by utilizing the heat exchange capacity of the phase change working fluid. Combined with a serpentine flow channel and fin structure, efficient heat transfer is achieved.

Benefits of technology

It improves the temperature uniformity of liquid metal cold plates, reduces temperature rise, reduces device size and cost, and simplifies the control structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a liquid metal-phase change working medium composite type temperature equalizing cold plate and belongs to the technical field of electronic equipment heat dissipation. The device comprises a shell, a first flow channel, a second flow channel, an evaporation cavity, a condensation cavity, a partition plate and a filling port. The liquid metal flows inside the first flow channel to absorb heat. The first flow channel is internally provided with the partition plate. The liquid metal changes the flow direction at the partition plate and enters the second flow channel to release heat. The second flow channel is staggered with the evaporation cavity. The phase change working medium inside the evaporation cavity absorbs the heat transferred by the liquid metal inside the second flow channel. The steam formed by the evaporation of the working medium is condensed on the wall surface of the condensation cavity. The condensed liquid working medium flows back to the evaporation cavity through the inclined wall surface. The filling port is communicated with the condensation cavity and can adjust the pressure of the phase change working medium by filling and discharging the working medium. The application combines the liquid metal with the phase change heat transfer, effectively suppresses the temperature rise in the heat exchange process of the liquid metal, improves the temperature equalization of the electronic equipment and enhances the reliability of the equipment.
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Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for electronic devices. Background Technology

[0002] Liquid metal thermal management technology has been innovatively applied to chip heat dissipation due to its advantages such as low noise, low energy consumption, no moving mechanical parts, and high convective heat transfer coefficient. However, compared with conventional liquid cooling media such as water, although liquid metal has a higher convective heat transfer coefficient, its specific heat capacity is smaller. At lower flow rates, liquid metal experiences a faster temperature rise along the heat exchange process, reducing the uniform heat dissipation capacity of the liquid metal cold plate.

[0003] Invention patent CN201720483971.5 discloses a thermal control device that uses composite phase change material and liquid metal for heat dissipation. The device includes an electronic device heat source base plate, which is in close contact with a composite phase change material module. A thermocouple is installed at the interface between the electronic device heat source base plate and the composite phase change material module. Pipes are embedded in the composite phase change material module and extend to the outside of the composite phase change material module. A pump and a radiator are installed on the pipes outside the composite phase change material module. The radiator stores low-melting-point liquid metal. Both the thermocouple and the pump are connected to a control module. This invention utilizes liquid metal and phase change working fluid to control the temperature of high heat flux density devices. The phase change module absorbs heat from the heat source, and the liquid metal carries away the heat from the phase change module. However, the phase change working fluid inside the phase change module has a low thermal conductivity, and the liquid metal's heat dissipation efficiency is reduced due to the low thermal conductivity of the phase change working fluid inside the phase change module. In addition, this thermal control device requires thermocouples and a control module, which increases the difficulty of practical application. This device does not solve the problem of low heat capacity of liquid metal. Invention patent CN201711037146.3 discloses a liquid metal constant temperature heat dissipation device, including a heat sink, a liquid metal circulation pipeline, a liquid metal driving device, and a phase change working fluid circulation pipeline. The heat sink is divided into two isolated chambers. One chamber is a liquid metal chamber for connecting with the heating surface of electronic components. The two ends of the liquid metal circulation pipeline are connected to the liquid metal chamber to form a closed pipeline. The other chamber is a phase change working fluid chamber. The two ends of the phase change working fluid circulation pipeline are connected to the phase change working fluid chamber to form a closed pipeline. The liquid metal circulation pipeline extends along the phase change working fluid circulation pipeline and is closely fitted to the phase change working fluid circulation pipeline. The cross-section of the liquid metal circulation pipeline is smaller than the cross-section of the phase change working fluid circulation pipeline. The heat transfer direction of this invention is heat sink → liquid metal → phase change working fluid → air. Compared with the liquid metal directly transferring heat to the air, this increases the thermal resistance. Furthermore, all the heat is transferred through the liquid metal to the phase change working fluid and then dissipated into the air. If the heat exchange between the liquid metal and the phase change working fluid is not timely or sufficient, and the liquid metal pipeline lacks a heat dissipation end, heat accumulation is likely, and the temperature will continue to rise. Invention patent CN201710947362.5 discloses a high-efficiency heat sink for high heat flux density devices with a closed structure. This heat sink utilizes the high thermal conductivity and fluidity of liquid metal, employing a driving pump to drive the liquid metal within the pipeline, forming a self-circulating heat transport system. The liquid metal continuously carries the heat generated during device operation from the heat absorption device to the heat dissipation fins. However, this invention only solves the heat dissipation needs of high heat flux density devices and does not address the need for temperature equalization for multiple heat sources.Invention patent CN202011010990.9 discloses a liquid metal heat dissipation device. This heat dissipation device utilizes the strong convective heat transfer capability of liquid metal to transfer the highly concentrated heat in a small area from multiple heat sources to the heat exchanger for direct contact heat exchange with the coolant. Then, the coolant dissipates the heat into the ambient air through a large area of ​​cooling water. This invention solves the heat dissipation needs of multiple heat sources. However, each heat source requires a separate liquid metal loop heat dissipation device for control, and each loop needs to be equipped with an electromagnetic pump. The uniformity of the heat source is ensured by individually adjusting each electromagnetic pump, making the operation and structure relatively complex. Summary of the Invention

[0004] To address the need for uniform temperature dissipation in multi-heat-source areas using liquid metal cold plates, this invention proposes a liquid metal-phase change working fluid composite uniform temperature cold plate. By combining the high convective heat transfer capacity of liquid metal with the uniform temperature dissipation capacity of phase change working fluid, the uniform temperature dissipation capacity of the liquid metal cold plate is improved.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] A liquid metal-phase change working fluid composite isothermal cooling plate includes a shell 1, a first flow channel 2, a second flow channel 3, an evaporation chamber 4, a condensation chamber 5, a partition 6, and a filling port 7; the partition 6 is distributed inside the first flow channel 2; the first flow channel 2 is connected to the second flow channel 3; the evaporation chamber 4 is connected to the condensation chamber 5; the condensation chamber 5 is connected to the filling port 7; the first flow channel 2, the second flow channel 3, the evaporation chamber 4, and the condensation chamber 5 are isolated from each other.

[0007] Furthermore, the second flow channel 3 and the evaporation chamber 4 are staggered, allowing the liquid metal in the second flow channel 3 to fully exchange heat with the phase change working fluid in the evaporation chamber 4.

[0008] Furthermore, the filling port 7 adjusts the phase change temperature of the working fluid inside the evaporation chamber 4 by filling and discharging the working fluid to match the liquid metal inlet temperature and the heat consumption of the heat source.

[0009] Furthermore, the connection between the condensation chamber 5 and the evaporation chamber 4 is an inclined wall.

[0010] Furthermore, the first flow channel 2 is a serpentine flow channel with fins distributed inside, and the flow channels between the fins are micro-flow channels.

[0011] Furthermore, the evaporation chamber 4 has a hydrophilic coating on its wall surface, and the condensation chamber 5 has a hydrophobic coating on its wall surface.

[0012] Compared with the prior art, the present invention has the following significant advantages:

[0013] (1) The present invention uses liquid metal to carry away the heat generated by the high heat flux density heat source. During the flow process, the liquid metal changes the flow direction under the action of the baffle and exchanges heat with the phase change working fluid in the evaporation cavity. After releasing heat, the liquid metal re-enters the next heat-generating area for heat exchange. Compared with the prior art, it can reduce the temperature rise during the heat exchange process of liquid metal and improve the temperature uniformity of the cold plate.

[0014] (2) The present invention adjusts the phase change temperature of the working fluid by filling and discharging the phase change working fluid through the filling port, matches the heat dissipation conditions of liquid metal, suppresses its heat dissipation temperature rise, and improves the temperature uniformity of the cold plate.

[0015] (3) The present invention integrates the liquid metal cold plate and the phase change heat-converting cold plate together, which reduces the size of the device and the heat dissipation space requirement compared with the prior art.

[0016] (4) The present invention absorbs part of the heat carried by the liquid metal by the phase change working medium, which reduces the heat dissipation requirements of the liquid metal at the far end, effectively reducing the amount of liquid metal required and lowering the cost.

[0017] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a front view of the liquid metal-phase change working fluid composite isothermal cold plate of the present invention.

[0019] Figure 2 This is a top view of the liquid metal-phase change working fluid composite isothermal cold plate of the present invention.

[0020] Figure 3 The present invention relates to a liquid metal-phase change working fluid composite homogeneous cooling plate along... Figure 1 Sectional view of AA.

[0021] Figure 4 The present invention relates to a liquid metal-phase change working fluid composite homogeneous cooling plate along... Figure 1 BB section view.

[0022] Figure 5 The present invention relates to a liquid metal-phase change working fluid composite homogeneous cooling plate along... Figure 1 CC section view.

[0023] Figure 6 The present invention relates to a liquid metal-phase change working fluid composite homogeneous cooling plate along... Figure 2 DD section view.

[0024] The components are: 1. Shell; 2. First flow channel; 3. Second flow channel; 4. Evaporation chamber; 5. Condensation chamber; 6. Baffle; 7. Filling port. Detailed Implementation

[0025] To illustrate the technical solution and objectives of this invention, the invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0026] Combination Figures 1-6 The embodiments of the present invention include a shell 1, a first flow channel 2, a second flow channel 3, an evaporation chamber 4, a condensation chamber 5, a partition 6, and a filling port 7; the partition 6 is distributed inside the first flow channel 2; the first flow channel 2 is connected to the second flow channel 3; the evaporation chamber 4 is connected to the condensation chamber 5; the condensation chamber 5 is connected to the filling port 7; the first flow channel 2, the second flow channel 3, the evaporation chamber 4, and the condensation chamber 5 are isolated from each other.

[0027] The second flow channel 3 and the evaporation chamber 4 are staggered, and the liquid metal can fully exchange heat with the phase change working fluid in the evaporation chamber 4 in the second flow channel 3.

[0028] The phase change temperature of the working fluid inside the evaporation chamber 4 can be adjusted by filling and discharging the working fluid through the filling port 7 according to the liquid metal inlet temperature and the heat consumption of the heat source.

[0029] The connection between the condensation chamber 5 and the evaporation chamber 4 is an inclined wall.

[0030] The first flow channel 2 is a serpentine flow channel with fins distributed inside, and the flow channels between the fins are micro-flow channels.

[0031] The evaporation chamber 4 has a hydrophilic coating on its wall, and the condensation chamber 5 has a hydrophobic coating on its wall.

[0032] In some embodiments, fins are mounted on the outer surface of the housing 1.

[0033] In some embodiments, the evaporation chamber 4 and the condensation chamber 5 are filled with phase change working fluids such as R124, R134a, and R245fa.

[0034] In some embodiments, the liquid metal inside the first flow channel 2 and the second flow channel 3 is Ga66In20.5Sn13.5.

[0035] The uniform temperature cooling plate has a length of 100-200mm, a width of 100-200mm, and a thickness of 15-25mm. The first flow channel has a width of 15-20mm and a height of 3-8mm. The fin thickness is 1-3mm and the fin spacing is 1-3mm. The second flow channel has a width of 1-3mm and a height of 3-8mm. The evaporation chamber has a width of 1-3mm and a height of 3-8mm. The condensation chamber has a height of 1-5mm. The inclined wall has an inclination angle of 5°-15°.

Claims

1. A liquid metal-phase change working fluid composite temperature-regulating cold plate, characterized in that: The system includes a shell (1), a first flow channel (2), a second flow channel (3), an evaporation chamber (4), a condensation chamber (5), a partition (6), and a filling port (7). The first flow channel (2) is a serpentine flow channel with fins distributed inside, and the flow channels between the fins are micro-channels. The partition (6) is distributed inside the first flow channel (2). The first flow channel (2) is connected to the second flow channel (3). The evaporation chamber (4) is connected to the condensation chamber (5). The condensation chamber (5) is connected to the filling port (7). The second flow channel (3) and the evaporation chamber (4) are interleaved. The liquid metal exchanges heat with the phase change working fluid in the second flow channel (3) and the evaporation cavity (4); the filling port (7) adjusts the phase change temperature of the working fluid inside the evaporation cavity (4) by filling and discharging the phase change working fluid, matching the liquid metal inlet temperature and the heat consumption of the heat source; the first flow channel (2) and the second flow channel (3) are isolated from the evaporation cavity (4) and the condensation cavity (5); the liquid metal carries away the heat generated by the high heat flux density heat source, and the liquid metal changes its flow direction under the action of the baffle during the flow process, and exchanges heat with the phase change working fluid in the evaporation cavity (4).

2. The liquid metal-phase change working fluid composite temperature-regulating plate according to claim 1, characterized in that: The connection between the condenser chamber (5) and the evaporator chamber (4) is an inclined wall.

3. The liquid metal-phase change working fluid composite temperature-regulating cold plate according to claim 1, characterized in that: The evaporation chamber (4) has a hydrophilic coating on its wall, and the condensation chamber (5) has a hydrophobic coating on its wall.