A stacked circuit board probe test fixture

Abstract

The present invention discloses a stacked circuit board probe test fixture, comprising a circuit board stack formed by stacking a plurality of circuit boards to be tested with their front faces facing downwards, a probe lifting platform which can be lifted up and down above the circuit board stack, and a plurality of circuit board detection probes distributed on the lower side of the probe lifting platform; a flipping fixture is arranged between the circuit board stack and the probe lifting platform, and the flipping fixture can flip the top circuit board to be tested in the circuit board stack to face upwards, and a plurality of contact points on the flipped circuit board to be tested correspond to the circuit board detection probes above; the present invention realizes that after the circuit boards are stacked, probe tests are performed on the top circuit boards in the stack one by one, and has the advantages of high space utilization, etc.

Description

Technical Field

[0001] The invention belongs to the field of circuit board probe testing. Background Art

[0002] The idea of ​​stacking the circuit boards, performing a probe test on the top circuit board of the stack one by one, and then taking the tested circuit boards away one by one with a suction cup, in an ideal situation, not only has the advantages of high space utilization, but also high efficiency and is conducive to automation. However, this idea also has the following disadvantages:

[0003] The probe of the probe test acts on the front of the circuit board. The front of the circuit board is generally covered with many components such as capacitors, chips, jumpers, interfaces and solder joints, which is not conducive to the suction cup unit adsorbing the front of the circuit board. On the contrary, the back of the circuit board is generally relatively flat, which is conducive to the smooth adsorption of the negative pressure suction cup unit. Once the front side is facing down, the probe test cannot be implemented;

[0004] At the same time, since the front sides of the circuit boards 10 to be tested in the circuit board stack 11 have numerous capacitors, chips, jumpers, interfaces, solder joints and other components of inconsistent heights, if the probe test is performed one by one in a stacked form, the topmost circuit board of the stack can only be guaranteed to be nearly horizontal and cannot be guaranteed to be completely flat, which leads to the problem of inaccurate positioning of the probe. Summary of the invention

[0005] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a stacked circuit board probe test fixture, which can perform probe tests on the topmost circuit boards in the stack one by one after the circuit boards are stacked.

[0006] Technical solution: To achieve the above-mentioned purpose, a stacked circuit board probe test fixture of the present invention includes a circuit board stack formed by stacking a number of circuit boards to be tested with their front faces facing downward, a probe lifting platform that can be lifted up and down above the circuit board stack, and a number of circuit board detection probes distributed on the lower side of the probe lifting platform; a flipping fixture is arranged between the circuit board stack and the probe lifting platform, and the flipping fixture can flip the top circuit board to be tested in the circuit board stack to face upward, and a number of contacts on the flipped circuit board to be tested correspond to the circuit board detection probes above.

[0007] Furthermore, a longitudinal ejector is provided below the circuit board stack, and an upper end of a telescopic portion of the longitudinal ejector is fixedly connected to a supporting plate for supporting the circuit board stack upward.

[0008] Furthermore, two lifting and telescopic cylinders and two longitudinal restraining rods are respectively arranged around the circuit board stack; the two lifting and telescopic cylinders and the two longitudinal restraining rods are respectively slidably matched with the four side surfaces of the circuit board stack.

[0009] Furthermore, the upper ends of the telescopic rods of the two lifting and telescopic cylinders are connected to lifting beams; the flipping fixture includes horizontal flipping motors fixedly installed at the ends of each lifting beam, and the ends of the horizontal output shafts of the flipping motors are fixedly connected to downwardly facing negative pressure suction cups, which can be lowered with the lifting beams to adsorb the reverse side of a circuit board to be tested on the top of the stack of circuit boards.

[0010] Furthermore, the flipping fixture also includes four vertical motors respectively arranged at four positions above the circuit board stack, and the four vertical motors are all fixed on the motor bracket; the upper end of the longitudinal output shaft of each vertical motor is fixedly connected with a precise positioning member;

[0011] In a top-down perspective: four precise positioning members are distributed outside four circuit board contour edges of a circuit board to be tested on the top of the circuit board stack.

[0012] Further, the precise positioning member includes a horizontal disc and a positioning column fixed on the horizontal disc;

[0013] In the top view: the outer contours of the horizontal disk and the positioning column are recorded as outer contour a and outer contour b respectively; outer contour b is within the enclosed range of outer contour a, and the end of outer contour b close to the edge of the circuit board contour is intangent to outer contour a, and the tangent point between outer contour b and outer contour a is recorded as reference point a; the end of outer contour b away from reference point a is recorded as reference point b; the axis of the longitudinal output shaft is recorded as axis a, and the axis of the positioning column is recorded as axis b, axis a and axis b do not coincide, and axis b is on the line connecting axis a and reference point b.

[0014] Furthermore, when the positioning column rotates 180° around the axis a relative to the initial state, the b outer peripheral contour is tangent to the circuit board contour edge line at the b reference point.

[0015] Furthermore, after each precise positioning part is rotated 90° along the axis a of the longitudinal output shaft to which it is connected, in a top-down perspective, the outer contour a on each precise positioning part intersects with the edge line of the circuit board outline, and the outer contour b of each precise positioning part maintains a gap with the edge line of the circuit board outline of the circuit board to be tested facing upward; after each precise positioning part is further rotated 90° along the axis a of the longitudinal output shaft to which it is connected, the outer contour b on each precise positioning part is tangent to the edge line of the circuit board outline at the b reference point.

[0016] Beneficial effects: The present invention realizes the probe test of the topmost circuit board of the stack one by one after the circuit boards are stacked, and has the advantages of high space utilization; at the same time, it also solves the problem that the front side of the circuit board cannot be smoothly adsorbed by the negative pressure suction cup, and the posture and positioning in the stacked state are inaccurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] AttachedFigure 1 This is the overall front view of the scheme;

[0018] Attached Figure 2 The upper and lower figures are schematic diagrams at the end of "step 2" and "step 3" respectively;

[0019] Attached Figure 3 The upper, middle and lower figures are the three-dimensional schematic diagrams at the end of "step five", "step six" and "step seven" respectively;

[0020] Attached Figure 4 The top, middle and bottom figures are schematic diagrams from a bird's-eye view at the end of "step five", "step six" and "step seven" respectively;

[0021] Attached Figure 5 For attachment Figure 4 An enlarged schematic diagram of the mark 16;

[0022] Attached Figure 6 The figure is a schematic diagram of the overall disassembly of the device. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] As attached Figures 1 to 6 A stacked circuit board probe test fixture shown in FIG. 1 includes a circuit board stack 11 formed by stacking a plurality of circuit boards 10 to be tested facing downward, a probe lifting platform 15 capable of lifting up and down is arranged above the circuit board stack 11, and the probe lifting platform 15 is installed on a lifting device 13; Figure 1 A number of circuit board detection probes 14 are distributed on the lower side of the probe lifting platform 15; a turning jig is arranged between the circuit board stack 11 and the probe lifting platform 15, and the turning jig can turn over the top of the circuit board stack 11 to be tested 10 to face up, and a number of contacts on the turned circuit board 10 to be tested correspond to the circuit board detection probes 14 above.

[0025] like Figure 1 A supporting base 26 is provided below the circuit board stack 11, and a pair of longitudinal ejectors 24 are fixedly installed on the inner side of the supporting base 26. The upper end of the telescopic portion of the longitudinal ejectors 24 is fixedly connected to a supporting plate 25 that supports the circuit board stack 11 upward. The circuit board stack 11 rises and falls under the action of the longitudinal ejectors 24.

[0026] Two lifting and telescopic cylinders 28 and two longitudinal restraining rods 27 are respectively arranged around the circuit board stack 11; the two lifting and telescopic cylinders 28 and the two longitudinal restraining rods 27 are respectively slidably matched with the four sides of the circuit board stack 11, and the circuit board stack 11 moves up and down under the common restraint of the two lifting and telescopic cylinders 28 and the two longitudinal restraining rods 27; the lower parts of the two lifting and telescopic cylinders 28 and the two longitudinal restraining rods 27 are fixedly installed on the supporting base 26.

[0027] The upper ends of the telescopic rods at the upper ends of the two lifting and telescopic cylinders 28 are fixedly connected to the lifting beams 19; the flipping fixture includes a horizontal flipping motor 20 fixedly installed at the end of each lifting beam 19, and the end of the horizontal output shaft 21 of the flipping motor 20 is fixedly connected to a downward negative pressure suction cup 22, and the negative pressure suction cup 22 can be lowered with the lifting beam 19 to adsorb the reverse side of the topmost circuit board 10 to be tested in the circuit board stack 11.

[0028] Four vertical motors 17 are respectively arranged at four positions above the circuit board stack 11 , and the four vertical motors 17 are all fixed on the motor bracket 23 ; the upper end of the longitudinal output shaft 5 of each vertical motor 17 is fixedly connected with a precise positioning member 16 .

[0029] In a top view, the four precise positioning members 16 are distributed outside four circuit board contour edges 9 of the topmost circuit board 10 to be tested in the circuit board stack 11 .

[0030] The precise positioning member 16 includes a horizontal disc 7 and a positioning column 12 fixed on the horizontal disc 7; Figure 5 , in a top-down perspective: the outer contours of the horizontal disk 7 and the positioning column 12 are recorded as a outer contour 8 and b outer contour 6 respectively; b outer contour 6 is within the enclosed range of a outer contour 8, and the end of b outer contour 6 close to the circuit board contour edge line 9 is inscribed with a outer contour 8, and the tangent point of b outer contour 6 and a outer contour 8 is recorded as a reference point 1; the end of b outer contour 6 away from a reference point 1 is recorded as b reference point 4; the axis of the longitudinal output shaft 5 is recorded as a axis 2, and the axis of the positioning column 12 is recorded as b axis 3, a axis 2 and b axis 3 do not coincide, and b axis 3 is on the line connecting a axis 2 and b reference point 4; the distance between b axis 3 and a axis 2 is recorded as h, and the spacing between a reference point 1 and the circuit board contour edge line 9 is I; when the positioning column 12 rotates 180° around a axis 2 relative to the initial state, b outer contour 6 is tangent to the circuit board contour edge line 9 at b reference point 4; as shown Figure 5 In an ideal state, if the topmost circuit board 10 to be tested in the circuit board stack 11 is already in a precisely positioned state at the end of "step seven", then 2h=I holds true.

[0031] The automatic test method and working principle of the stacked circuit board probe test fixture need to be combined with Figures 2 to 4In summary:

[0032] Step 1: Stack several circuit boards 10 to be tested with their front sides facing downward to form a circuit board stack 11, which is placed under the probe lifting platform 15. At this time, two lifting and telescopic cylinders 28 and two longitudinal restraining rods 27 are respectively slidably matched with the four sides of the circuit board stack 11. Each circuit board 10 to be tested on the circuit board stack 11 cannot float horizontally under the joint restraint of the two lifting and telescopic cylinders 28 and the two longitudinal restraining rods 27. Since there are many components such as capacitors, chips, jumpers, interfaces and solder joints on the front of each circuit board 10 to be tested on the circuit board stack 11 with different heights, each circuit board 10 to be tested on the circuit board stack 11 is only in a nearly horizontal state, not an accurate horizontal state.

[0033] At the same time, in the subsequent process, the overall height of the circuit board stack 11 is controlled in real time by the longitudinal pusher 24, so that the height of the top circuit board 10 to be tested in the circuit board stack 11 is always at a predetermined height, so that the negative pressure suction cup 22 can smoothly descend to adsorb the top circuit board 10 to be tested in the circuit board stack 11;

[0034] Step 2: The two lifting and telescopic cylinders 28 drive the two lifting beams 19 and the negative pressure suction cups 22 to descend until the two negative pressure suction cups 22 descend to absorb the back side of the topmost circuit board 10 to be tested in the circuit board stack 11;

[0035] Step 3: The two negative pressure suction cups 22 and the circuit board 10 to be tested adsorbed thereon are driven to rise to a certain height by the two lifting and telescopic cylinders 28;

[0036] Step 4, then control the two horizontal output shafts 21 to rotate 180 degrees synchronously, so that the circuit board 10 to be tested, which was originally facing down, becomes facing down. At this time, the two negative pressure suction cups 22 are on the lower side of the circuit board 10 to be tested, which is facing up. At this time, although the circuit board 10 to be tested is facing up, its posture is not in an accurate horizontal state, and its horizontal position is not accurately positioned.

[0037] Step 5: The two negative pressure suction cups 22 and the circuit board 10 to be tested facing upward are driven to continue to rise by the two lifting and telescopic cylinders 28 until the circuit board 10 to be tested facing upward continues to rise to a level higher than the horizontal disks 7 on the four precise positioning members 16;

[0038] Step 6, control each precise positioning member 16 to rotate 90° along the axis a 2 of the longitudinal output shaft 5 to which it is connected. At this time, in a top-down perspective, the outer contour a 8 on each precise positioning member 16 intersects with the circuit board contour edge line 9; at this time, the two negative pressure suction cups 22 and the adsorbed circuit board 10 facing up are driven to descend by the two lifting and telescopic cylinders 28 until the upper surfaces of the four horizontal discs 7 on the four precise positioning members 16 respectively support the four contour edges of the lower surface of the circuit board 10 facing up; at the same time, control the negative pressure suction cup 22 to release the negative pressure adsorption state, and descend to separate from the circuit board 10 facing up. At this time, the four contour edges of the circuit board 10 facing up are respectively supported by four horizontal discs 7 of completely equal height, so that the circuit board 10 facing up is transformed into a precise horizontal state, but at this time, the outer contour b 6 of each precise positioning member 16 maintains a gap with the circuit board contour edge line 9 of the circuit board 10 facing up, so the horizontal position of the circuit board 10 facing up is not yet precisely positioned;

[0039] Step 7, control each precise positioning member 16 to continue rotating 90° along the axis a 2 of the longitudinal output shaft 5 to which it is connected, so that the b peripheral contours 6 on the four precise positioning members 16 are tangent to the circuit board contour edge line 9 at the b reference point 4; at this time, the circuit board 10 to be tested facing upward is completely and precisely positioned under the common constraint of the four b peripheral contours 6 of the four precise positioning members 16 on the four sides;

[0040] Step eight, the lifting device 13 drives the probe lifting platform 15 to descend until each circuit board detection probe 14 on the lower side of the probe lifting platform 15 electrically contacts each detection contact on the fully positioned front-facing circuit board 10 to be tested, thereby completing the probe detection of the circuit board;

[0041] Step nine, finally the probe lifting platform 15 rises to a sufficient height, and the manipulator takes away the circuit board 10 to be tested that has just been detected by the probe. At this point, the probe detection of a circuit board 10 to be tested on the circuit board stack 11 is completed. After restoring the initial state, the other circuit boards 10 to be tested on the circuit board stack 11 can be detected according to the rules of "steps 2" to "step 8" above.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A stacked circuit board probe test fixture, Features: The invention comprises a circuit board stack (11) formed by stacking a plurality of circuit boards (10) to be tested facing downward, a probe lifting platform (15) above the circuit board stack (11) capable of being lifted and lowered, and a plurality of circuit board detection probes (14) distributed below the probe lifting platform (15); a flipping fixture is arranged between the circuit board stack (11) and the probe lifting platform (15), and the flipping fixture can flip the topmost circuit board (10) to be tested in the circuit board stack (11) to face upward, and a plurality of contact points on the flipped circuit board (10) to be tested correspond to the circuit board detection probes (14) above; Two lifting and telescopic cylinders (28) and two longitudinal restraining rods (27) are respectively arranged around the circuit board stack (11); the two lifting and telescopic cylinders (28) and the two longitudinal restraining rods (27) are respectively slidably matched with the four side surfaces of the circuit board stack (11); The upper ends of the telescopic rods of the two lifting and telescopic cylinders (28) are connected to lifting beams (19); the flipping fixture comprises a horizontal flipping motor (20) fixedly installed at the end of each lifting beam (19); the end of the horizontal output shaft (21) of the flipping motor (20) is fixedly connected to a downward negative pressure suction cup (22); the negative pressure suction cup (22) can be lowered along with the lifting beam (19) to absorb the reverse side of the topmost circuit board (10) to be tested in the circuit board stack (11); The turning jig further comprises four vertical motors (17) respectively arranged at four positions above the circuit board stack (11), and the four vertical motors (17) are all fixed on a motor bracket (23); the upper end of the longitudinal output shaft (5) of each vertical motor (17) is fixedly connected with a precise positioning member (16); In a top-down perspective: four precise positioning members (16) are distributed outside four circuit board contour edges (9) of a circuit board to be tested (10) on the top of the circuit board stack (11); The precise positioning member (16) comprises a horizontal disc (7) and a positioning column (12) fixed on the horizontal disc (7); In a top-down perspective: the outer contours of the horizontal disk (7) and the positioning column (12) are respectively recorded as a outer contour (8) and b outer contour (6); the b outer contour (6) is within the enclosed range of the a outer contour (8), and the end of the b outer contour (6) close to the circuit board contour edge line (9) is inscribed in the a outer contour (8), and the tangent point of the b outer contour (6) and the a outer contour (8) is recorded as a reference point (1); the end of the b outer contour (6) away from the a reference point (1) is recorded as the b reference point (4); the axis of the longitudinal output shaft (5) is recorded as the a axis (2), and the axis of the positioning column (12) is recorded as the b axis (3), the a axis (2) and the b axis (3) do not overlap, and the b axis (3) is on the line connecting the a axis (2) and the b reference point (4); When the positioning column (12) rotates 180° around the axis a (2) relative to the initial state, the outer contour b (6) is tangent to the circuit board contour edge line (9) at the reference point b (4); After each precise positioning member (16) is rotated 90° along the axis a (2) of the longitudinal output shaft (5) to which it is connected, the outer contour a (8) on each precise positioning member (16) intersects with the circuit board contour edge line (9) in a top view, and the outer contour b (6) on each precise positioning member (16) maintains a gap with the circuit board contour edge line (9) of the circuit board (10) to be tested facing upward; after each precise positioning member (16) is further rotated 90° along the axis a (2) of the longitudinal output shaft (5) to which it is connected, the outer contour b (6) on each precise positioning member (16) is tangent to the circuit board contour edge line (9) at the b reference point (4).

2. A stacked circuit board probe test fixture according to claim 1, Features: A longitudinal ejector (24) is arranged below the circuit board stack (11), and a supporting plate (25) for supporting the circuit board stack (11) upward is fixedly connected to the upper end of the telescopic portion of the longitudinal ejector (24).

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