Intelligent Power Module

Abstract

The present invention discloses an intelligent power module, including a substrate, a frame, a power chip, a driving chip and a conductive member. The frame is arranged on one side of the thickness direction of the substrate, and the frame includes a base island, a control pin and a power pin. The control pin and the base island are both located on the control side, and the power pin is located on the power side; the power chip is arranged on the side of the substrate facing the frame; the driving chip is arranged on the side of the base island facing the substrate; the conductive member is located between the base island and the substrate, one end of the conductive member is connected to the substrate, and the conductive member is electrically connected to the power chip through a first lead, and the other end of the conductive member is electrically connected to the driving chip through a second lead. According to the intelligent power module of the present invention, on the one hand, the distance between the driving chip and the power chip is increased, so that the heat generated by the driving chip and the power chip when working can be dispersed, thereby improving the heat dissipation effect of the intelligent power module; on the other hand, it is conducive to the miniaturization design of the intelligent power module.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to an intelligent power module. Background Art

[0002] In the related art, the intelligent power module usually includes a driver chip, a power chip, a circuit board and a copper frame. The driver chip is mounted on the copper frame, and the power chip is mounted on the circuit board. In order to facilitate the electrical connection between the driver chip and the power chip, the distance between the driver chip and the power chip is small. However, the arrangement of the driver chip and the power chip causes heat to be transferred between the driver chip and the power chip, resulting in poor heat dissipation of the intelligent power module and reducing the reliability of the intelligent power module. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an intelligent power module, which improves the heat dissipation effect of the intelligent power module and facilitates the miniaturization design of the intelligent power module.

[0004] According to an embodiment of the present invention, the intelligent power module includes: a substrate, wherein the two sides of the substrate in the width direction are respectively a power side and a control side; a frame, wherein the frame is arranged on one side of the substrate in the thickness direction, the frame includes a base island, a control pin and a power pin, the control pin and the base island are both located on the control side, and the power pin is located on the power side; a power chip, wherein the power chip is arranged on a side of the substrate facing the frame, and the power chip is electrically connected to the power pin; a driving chip, wherein the driving chip is arranged on a side of the base island facing the substrate, and the driving chip is electrically connected to the control pin; a conductive member, wherein the conductive member is located between the base island and the substrate, one end of the conductive member is connected to the substrate, and the conductive member is electrically connected to the power chip through a first lead, and the other end of the conductive member is electrically connected to the driving chip through a second lead.

[0005] According to the intelligent power module of the embodiment of the present invention, a conductive member is arranged between the base island and the substrate, and the conductive member is electrically connected to the power chip through the first lead, and the conductive member is electrically connected to the driver chip through the second lead. Therefore, compared with the traditional intelligent power module, on the one hand, while realizing the electrical connection between the driver chip and the power chip, the distance between the driver chip and the power chip is increased, so that the heat generated by the driver chip and the power chip during operation can be dispersed, avoiding heat accumulation on the control side of the substrate, thereby improving the heat dissipation effect of the intelligent power module; on the other hand, the minimum distance between the conductive member and the power pin is reduced, so that the substrate can be designed as a small-sized substrate, which is conducive to the miniaturization design of the intelligent power module.

[0006] According to some embodiments of the present invention, the conductive member includes: a first conductive segment, the first conductive segment extends along the width direction of the substrate, and the second lead is connected to the first conductive segment; a second conductive segment, one end of the second conductive segment is connected to the first conductive segment, and the second conductive segment extends obliquely toward the substrate.

[0007] According to some embodiments of the present invention, in the thickness direction of the substrate, a surface of the first conductive segment facing the substrate is flush with a surface of the base island facing the substrate.

[0008] According to some embodiments of the present invention, the first conductive segment includes a first sub-segment and a second sub-segment connected to each other, the second sub-segment is connected to the second conductive segment, and at least one side of the first sub-segment protrudes from the second sub-segment in the length direction of the substrate.

[0009] According to some embodiments of the present invention, each of the control pins includes a first pin segment and a second pin segment connected to each other, the second pin segment is located on a side of the first pin segment away from the substrate, the first pin segment is located inside the plastic shell, and the second pin segment is located outside the plastic shell; each of the power pins includes a third pin segment and a fourth pin segment connected to each other, the fourth pin segment is located on a side of the third pin segment away from the substrate, the third pin segment is located inside the plastic shell, and the fourth pin segment is located outside the plastic shell; wherein, in the thickness direction of the substrate, a surface of the first pin segment away from the substrate, a surface of the third pin segment away from the substrate, a surface of the base island away from the substrate, and a surface of the first conductive segment away from the substrate are flush.

[0010] According to some embodiments of the present invention, the conductive member further includes: a third conductive segment, the third conductive segment is connected to the other end of the second conductive segment, the third conductive segment extends along the width direction of the substrate, and the third conductive segment is connected to the substrate; wherein the length of the third conductive segment in the width direction of the substrate is less than or equal to the length of the first conductive segment.

[0011] According to some embodiments of the present invention, the substrate includes a functional area and a connection area, the functional area and the connection area are spaced apart along the width direction of the substrate, the power chip is arranged in the functional area, one end of the conductive member is connected to the connection area, the two ends of the first lead are respectively connected to the connection area and the power chip, and the conductive member and the power chip are electrically connected through the connection area and the first lead.

[0012] According to some embodiments of the present invention, there are multiple conductive members and multiple connection areas, the multiple conductive members correspond one-to-one to the multiple connection areas, the multiple connection areas are spaced apart along the length direction of the substrate, and the multiple connection areas are all located on the control side of the substrate.

[0013] According to some embodiments of the present invention, the plurality of connection regions include a high voltage connection region and a low voltage connection region, and the length of the high voltage connection region in the length direction of the substrate is shorter than the length of the low voltage connection region.

[0014] According to some embodiments of the present invention, the width of the high voltage connection area in the width direction of the substrate is greater than the length of the low voltage connection area.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 is a schematic diagram of a substrate of an intelligent power module according to an embodiment of the present invention;

[0018] Figure 2 Schematic diagram of a substrate and a frame of an intelligent power module according to an embodiment of the present invention

[0019] Figure 3 is a schematic diagram of an intelligent power module according to an embodiment of the present invention, wherein the plastic package housing is not shown;

[0020] Figure 4 yes Figure 3 The schematic diagram of the intelligent power module shown in FIG. 1 is another angle diagram, wherein the plastic package housing is not shown;

[0021] Figure 5 yes Figure 3 A side view of the intelligent power module shown, wherein the plastic package housing is not shown;

[0022] Figure 6 yes Figure 5 The enlarged view of the A part shown in the middle circle;

[0023] Figure 7 is a schematic diagram of an intelligent power module according to an embodiment of the present invention.

[0024] Reference numerals:

[0025] 100: Intelligent power module;

[0026] 1: substrate; 11: control side; 12: power side; 13: functional area; 131: low voltage functional area; 132: high voltage functional area; 14: connection area; 141: high voltage connection area; 142: low voltage connection area; 2: frame; 21: base island; 22: control pin; 221: first pin segment; 222: second pin segment; 23: power pin; 231: third pin segment; 232: fourth pin segment; 3: power chip; 31: high voltage power chip; 32: low voltage power chip; 4: driver chip; 5: conductive part; 51: first conductive segment; 511: first sub-segment; 512: second sub-segment; 52: second conductive segment; 53: third conductive segment; 6: first lead; 7: second lead; 8: plastic package shell. DETAILED DESCRIPTION

[0027] Reference below Figure 1-Figure 7 An intelligent power module 100 according to an embodiment of the present invention is described.

[0028] like Figure 1-Figure 7 As shown, the intelligent power module 100 according to the embodiment of the present invention includes: a substrate 1, a frame 2, a power chip 3, a driving chip 4 and a conductive member 5.

[0029] Specifically, the width direction of the substrate 1 (for example, Figure 4 The two sides of the substrate 1 are respectively a power side 12 and a control side 11, and the frame 2 is provided in the thickness direction of the substrate 1 (for example, Figure 5 The frame 2 includes a base island 21, a control pin 22 and a power pin 23. The control pin 22 and the base island 21 are both located at the control side 11, and the power pin 23 is located at the power side 12. The power chip 3 is arranged on the side of the substrate 1 facing the frame 2, and the power chip 3 is electrically connected to the power pin 23. The drive chip 4 is arranged on the side of the base island 21 facing the substrate 1, and the drive chip 4 is electrically connected to the control pin 22.

[0030] For example, in Figure 1-Figure 7 In the example, the base island 21 is located between the power pin 23 and the control pin 22, the power pin 23 and the control pin 22 are located on one side of the thickness direction of the base island 21, and the driver chip 4 and the substrate 1 are located on the other side of the thickness direction of the base island 21. The power chip 3 is located between the frame 2 and the substrate 1, the power chip 3 can be electrically connected to the power pin 23 through a thick aluminum wire, and the driver chip 4 can be electrically connected to the control pin 22 through a thin aluminum wire.

[0031] The conductive member 5 is located between the base island 21 and the substrate 1, one end of the conductive member 5 is connected to the substrate 1, and the conductive member 5 is electrically connected to the power chip 3 through the first lead 6, and the other end of the conductive member 5 is electrically connected to the driving chip 4 through the second lead 7. Figure 2-Figure 5The conductive member 5 is located between the power pin 23 and the base island 21, and the conductive member 5 is fixed on the substrate 1. The two ends of the first lead 6 are respectively connected to the conductive member 5 and the power chip 3, and the two ends of the second lead 7 are respectively connected to the conductive member 5 and the driving chip 4. Thus, the electrical connection between the driving chip 4 and the power chip 3 is achieved through the first lead 6, the conductive member 5 and the second lead 7.

[0032] Among them, by setting a conductive member 5 between the base island 21 and the substrate 1, the distance between the substrate 1 and the base island 21 can be increased, thereby increasing the distance between the driver chip 4 and the power chip 3, so that the heat generated by the driver chip 4 and the power chip 3 during operation can be dispersed to avoid heat accumulation on the control side 11 of the substrate 1, and at the same time reduce the heat generated by the power chip 3 during operation. Transfer to the driver chip 4 reduces the thermal impact on the driver chip 4, thereby improving the heat dissipation effect of the intelligent power module 100 and improving the reliability of the intelligent power module 100.

[0033] In addition, while increasing the distance between the substrate 1 and the base island 21, the minimum distance between the conductive member 5 and the power pin 23 is reduced, so that the substrate 1 can be designed as a small-sized substrate 1, which is conducive to the miniaturized design of the intelligent power module 100 and can reduce the cost of the intelligent power module 100.

[0034] According to the intelligent power module 100 of the embodiment of the present invention, a conductive member 5 is arranged between the base island 21 and the substrate 1, and the conductive member 5 is electrically connected to the power chip 3 through the first lead 6, and the conductive member 5 is electrically connected to the driver chip 4 through the second lead 7. Therefore, compared with the traditional intelligent power module, on the one hand, while realizing the electrical connection between the driver chip 4 and the power chip 3, the distance between the driver chip 4 and the power chip 3 is increased, so that the heat generated by the driver chip 4 and the power chip 3 during operation can be dispersed, and the heat is prevented from accumulating on the control side 11 of the substrate 1, thereby improving the heat dissipation effect of the intelligent power module 100; on the other hand, the minimum distance between the conductive member 5 and the power pin 23 is reduced, so that the substrate 1 can be designed as a small-sized substrate 1, which is conducive to the miniaturization design of the intelligent power module 100.

[0035] According to some embodiments of the present invention, the conductive member 5 includes a first conductive segment 51 and a second conductive segment 52, the first conductive segment 51 extends along the width direction of the substrate 1, the second lead 7 is connected to the first conductive segment 51, one end of the second conductive segment 52 is connected to the first conductive segment 51, and the second conductive segment 52 extends obliquely in a direction toward the substrate 1. Figure 2-Figure 6As shown, the first conductive segment 51 extends from the base island 21 to the power pin 23, that is, the first conductive segment 51 is close to the base island 21, which is conducive to the bonding of the two ends of the second lead 7 to the first conductive segment 51 and the driver chip 4 respectively, and the length of the second lead 7 can be shortened. The second conductive segment 52 extends obliquely from the first conductive segment 51 to the substrate 1, that is, the second conductive segment 52 is close to the power chip 3, and the length of the first lead 6 can also be shortened. As a result, the cost of the intelligent power module 100 is further reduced.

[0036] Among them, by setting the second conductive segment 52 to be inclined, the length of the second conductive segment 52 is increased and the structural strength of the conductive member 5 is enhanced. At the same time, the distance between the first conductive segment 51 and the substrate 1 can be reduced, thereby reducing the thickness of the intelligent power module 100, which is more conducive to the miniaturization design of the intelligent power module 100.

[0037] Furthermore, if Figure 6 As shown, in the thickness direction of the substrate 1, the surface of the first conductive segment 51 facing the substrate 1 is flush with the surface of the base island 21 facing the substrate 1. Since one end of the second lead 7 is connected to the side of the first conductive segment 51 facing the substrate 1, the other end of the second lead 7 is connected to the driver chip 4, and the driver chip 4 is arranged on the side of the base island 21 facing the substrate 1. In this way, the height difference between the driver chip 4 and the first conductive segment 51 can be reduced, which is beneficial to the bonding of the second lead 7, and the length of the second lead 7 can be further shortened, thereby further reducing the cost of the intelligent power module 100.

[0038] Furthermore, if Figure 2 and Figure 4 As shown, the first conductive segment 51 includes a first sub-segment 511 and a second sub-segment 512 connected to each other, and the second sub-segment 512 is connected to the second conductive segment 52. Figure 4 At least one side of the first sub-segment 511 protrudes from the second sub-segment 512 in the length direction of the substrate 1. For example, one side of the first sub-segment 511 protrudes from the second sub-segment 512 in the length direction of the substrate 1, and the shape of the first conductive segment 51 is roughly L-shaped or Z-shaped; or, both sides of the first sub-segment 511 protrude from the second sub-segment 512 in the length direction of the substrate 1, and the shape of the first conductive segment 51 is roughly T-shaped. Thus, the length of the first conductive segment 51 in the length direction of the substrate 1 is increased by the first sub-segment 511, which is conducive to the bonding of the second lead 7 to the first conductive segment 51, and while ensuring the structural strength of the conductive member 5, the material consumption of the conductive member 5 is reduced, and the weight of the conductive member 5 is reduced.

[0039] Optionally, in the length direction of the substrate 1 , the width of the second sub-segment 512 is equal to the width of the second conductive segment 52 .

[0040] According to some specific embodiments of the present invention, Figure 5 and Figure 6 As shown, each control pin 22 includes a first pin segment 221 and a second pin segment 222 connected to each other, the second pin segment 222 is located at a side of the first pin segment 221 away from the substrate 1, the first pin segment 221 is located inside the plastic package housing 8, and the second pin segment 222 is located outside the plastic package housing 8. Each power pin 23 includes a third pin segment 231 and a fourth pin segment 232 connected to each other, the fourth pin segment 232 is located at a side of the third pin segment 231 away from the substrate 1, the third pin segment 231 is located inside the plastic package housing 8, and the fourth pin segment 232 is located outside the plastic package housing 8.

[0041] Among them, in the thickness direction of the substrate 1, the side surface of the first pin segment 221 away from the substrate 1, the side surface of the third pin segment 231 away from the substrate 1, the side surface of the base island 21 away from the substrate 1 and the side surface of the first conductive segment 51 away from the substrate 1 are flush.

[0042] Reference Figure 2 , Figure 4 and Figure 5 One end of the substrate 1 in the width direction extends to the second conductive segment 52 of the conductive member 5, and the other end of the substrate 1 in the width direction extends to the end of the third pin segment 231 away from the fourth pin segment 232. Thus, the size of the substrate 1 is limited between the conductive member 5 and the power pin 23, further reducing the size of the substrate 1 and making better use of the miniaturized design of the intelligent power module 100.

[0043] According to some embodiments of the present invention, Figure 2 , Figure 4 and Figure 5 As shown, the conductive member 5 further includes a third conductive segment 53, the third conductive segment 53 is connected to the other end of the second conductive segment 52, the third conductive segment 53 extends along the width direction of the substrate 1, and the third conductive segment 53 is connected to the substrate 1. That is, the first conductive segment 51 and the third conductive segment 53 are respectively located at two ends of the length direction of the second conductive segment 52, and the first conductive segment 51 and the third conductive segment 53 both extend in a direction away from the second conductive segment 52. Through the third conductive segment 53, the contact area between the conductive member 5 and the substrate 1 can be increased, thereby improving the connection reliability between the conductive member 5 and the substrate 1.

[0044] The length of the third conductive segment 53 in the width direction of the substrate 1 is less than or equal to the length of the first conductive segment 51. This arrangement can reduce the length of the conductive member 5 while ensuring the connection reliability between the conductive member 5 and the substrate 1, thereby preventing the intelligent power module 100 from being too wide.

[0045] According to some embodiments of the present invention, Figure 1-Figure 4 As shown, the substrate 1 includes a functional area 13 and a connection area 14, and the functional area 13 and the connection area 14 are spaced apart along the width direction of the substrate 1. The power chip 3 is arranged in the functional area 13, the above-mentioned one end of the conductive member 5 is connected to the connection area 14, and the two ends of the first lead 6 are respectively connected to the connection area 14 and the power chip 3. The conductive member 5 and the power chip 3 are electrically connected through the connection area 14 and the first lead 6.

[0046] For example, in Figure 1-Figure 4 In the example, four functional areas 13 are provided on one side of the substrate 1 in the thickness direction, and the four functional areas 13 are spaced apart along the length direction of the substrate 1. At least one power chip 3 is mounted on each functional area 13 to realize the electrical connection between the power chip 3 and the substrate 1. A connection area 14 is provided on one side of each functional area 13 adjacent to the conductive member 5, and the connection area 14 extends along the length direction of the substrate 1. The third conductive segment 53 of the conductive member 5 is connected to the connection area 14 to realize the electrical connection between the conductive member 5 and the substrate 1. The connection area 14 is electrically connected to the power chip 3 through the first lead 6. Therefore, by providing the connection area 14, it is convenient to bond the first lead 6 to the connection area 14, and to connect the conductive member 5 to the substrate 1, so that the first lead 6 and the conductive member 5 in the same connection area 14 are spaced apart, and the first lead 6 and the conductive member 5 are prevented from interfering with each other and affecting the assembly efficiency of the intelligent power module 100.

[0047] Figure 1 Four functional areas 13 are shown for illustrative purposes, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to technical solutions with other numbers of functional areas 13, which also falls within the protection scope of the present invention.

[0048] Furthermore, there are multiple conductive members 5 and multiple connection areas 14. In the description of the present invention, "multiple" means two or more. Multiple conductive members 5 correspond to multiple connection areas 14 one by one. Multiple connection areas 14 are spaced apart along the length direction of the substrate 1, and multiple connection areas 14 are all located on the control side 11 of the substrate 1. Figure 1 , Figure 2 and Figure 4, there are nine conductive members 5 and nine connection areas 14, three of which are opposite to the three functional areas 13, respectively, and the three functional areas 13 are electrically connected to the same driver chip 4 through the three conductive members 5 and the three first leads 6. The remaining six connection areas 14 are opposite to the same functional area 13, and the functional area 13 is electrically connected to another driver chip 4 through the remaining six conductive members 5 and the six first leads 6. In this way, the electrical connection between the power chip 3 and the corresponding driver chip 4 is achieved, and the multiple conductive members 5 and the multiple first leads 6 can be spaced apart in the length direction of the substrate 1 to prevent the first leads 6 from crossing, making the structure of the intelligent power module 100 more regular.

[0049] Furthermore, if Figure 1 , Figure 2 and Figure 4 As shown, the multiple connection areas 14 include high-voltage connection areas 141 and low-voltage connection areas 142. For example, there are six high-voltage connection areas 141, and the six high-voltage connection areas 141 are opposite to the high-voltage functional area 132. Three high-voltage power chips 31 are arranged in the high-voltage functional area 132, and each high-voltage power chip 31 is connected to two high-voltage connection areas 141 through two first leads 6. There are three low-voltage connection areas 142, and the three low-voltage connection areas 142 are opposite to the three low-voltage functional areas 131, and each low-voltage functional area 131 is provided with a low-voltage power chip 32, and the low-voltage power chip 32 is connected to the low-voltage connection area 142 through the first lead 6.

[0050] The length of the high-voltage connection area 141 is shorter than the length of the low-voltage connection area 142 in the length direction of the substrate 1. Since the number of high-voltage connection areas 141 is large, the length of the high-voltage connection area 141 is short, and multiple high-voltage connection areas 141 can be spaced apart within the limited length of the substrate 1, so that the high-voltage connection area 141 is electrically connected to the corresponding pad of the driver chip 4 through the conductive member 5 and the second lead 7. Since one low-voltage connection area 142 corresponds to one low-voltage functional area 131, by making the length of the low-voltage connection area 142 longer, the area of ​​the low-voltage connection area 142 is increased, which facilitates the connection between the first lead 6 and the conductive member 5 and the low-voltage connection area 142.

[0051] In some optional embodiments, the width of the high-voltage connection area 141 is greater than the length of the low-voltage connection area 142 in the width direction of the substrate 1. This arrangement, on the one hand, reduces the width of the low-voltage connection area 142 while ensuring that the first lead 6 and the conductive member 5 can be connected to the low-voltage connection area 142, so that the low-voltage connection area 142 is closer to the driver chip 4; on the other hand, increases the area of ​​the high-voltage connection area 141, which is beneficial to the connection between the first lead 6 and the conductive member 5 and the high-voltage connection area 141.

[0052] Other structures and operations of the intelligent power module 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0053] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0054] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0056] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An intelligent power module, It is characterized in that include: A substrate, wherein two sides of the substrate in a width direction are respectively a power side and a control side; A frame, the frame is arranged on one side of the substrate in the thickness direction, the frame comprises a base island, a control pin and a power pin, the control pin and the base island are both located on the control side, and the power pin is located on the power side; A power chip, the power chip being arranged on a side of the substrate facing the frame, and the power chip being electrically connected to the power pin; A driving chip, the driving chip is arranged on a side of the base island facing the substrate, and the driving chip is electrically connected to the control pin; A conductive member, wherein the conductive member is located between the base island and the substrate, one end of the conductive member is connected to the substrate, and the conductive member is electrically connected to the power chip through a first lead, and the other end of the conductive member is electrically connected to the driving chip through a second lead; Wherein, the conductive member comprises: a first conductive segment, the first conductive segment extending along the width direction of the substrate, the second lead connected to the first conductive segment, and in the thickness direction of the substrate, a surface of the first conductive segment facing the substrate is flush with a surface of the base island facing the substrate; a second conductive segment, one end of which is connected to the first conductive segment, and the second conductive segment extends obliquely in a direction toward the substrate; A third conductive segment is connected to the other end of the second conductive segment, the third conductive segment extends along the width direction of the substrate, and the third conductive segment is connected to the substrate.

2. The intelligent power module according to claim 1, It is characterized in that The first conductive segment includes a first subsegment and a second subsegment connected to each other, the second subsegment is connected to the second conductive segment, and at least one side of the first subsegment protrudes from the second subsegment in the length direction of the substrate.

3. The intelligent power module according to claim 1, It is characterized in that Each of the control pins comprises a first pin segment and a second pin segment connected to each other, the second pin segment is located at a side of the first pin segment away from the substrate, the first pin segment is located inside the plastic package housing, and the second pin segment is located outside the plastic package housing; each of the power pins comprises a third pin segment and a fourth pin segment connected to each other, the fourth pin segment is located at a side of the third pin segment away from the substrate, the third pin segment is located inside the plastic package housing, and the fourth pin segment is located outside the plastic package housing; Among them, in the thickness direction of the substrate, a side surface of the first pin segment away from the substrate, a side surface of the third pin segment away from the substrate, a side surface of the base island away from the substrate and a side surface of the first conductive segment away from the substrate are flush.

4. The intelligent power module according to claim 1, It is characterized in that The length of the third conductive segment in the width direction of the substrate is less than or equal to the length of the first conductive segment.

5. The intelligent power module according to any one of claims 1 to 4, It is characterized in that The substrate includes a functional area and a connection area, the functional area and the connection area are spaced apart along the width direction of the substrate, the power chip is arranged in the functional area, the one end of the conductive member is connected to the connection area, the two ends of the first lead are respectively connected to the connection area and the power chip, and the conductive member and the power chip are electrically connected through the connection area and the first lead.

6. The intelligent power module according to claim 5, It is characterized in that There are multiple conductive members and multiple connection areas, the multiple conductive members correspond to the multiple connection areas one by one, the multiple connection areas are spaced apart along the length direction of the substrate, and the multiple connection areas are all located on the control side of the substrate.

7. The intelligent power module according to claim 6, It is characterized in that The plurality of connection areas include a high voltage connection area and a low voltage connection area, and the length of the high voltage connection area in the length direction of the substrate is shorter than the length of the low voltage connection area.

8. The intelligent power module according to claim 7, It is characterized in that The width of the high voltage connection area is greater than the width of the low voltage connection area in the width direction of the substrate.

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