Insulating adhesive composition and preparation method and application thereof

Abstract

The invention provides an insulating adhesive composition and a preparation method and application thereof. The insulating adhesive composition comprises an epoxy resin A, an epoxy resin B, an amino-terminated pseudorotaxane and a curing agent, wherein the epoxy resin A is a phenolic epoxy resin, and the epoxy resin B is an epoxy resin containing at least two epoxy groups. By combining the two types of epoxy resins and introducing an amino-terminated pseudorotaxane, the insulating adhesive composition has a high room temperature bonding strength, a high adhesive residue rate on a high temperature damage surface, no warping and delamination after multiple high and low temperature thermal shocks, excellent thermal shock resistance, and is suitable for application in large-size chip packaging.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesives, and specifically relates to an insulating adhesive composition and a preparation method and application thereof. Background Art

[0002] In the field of electronic packaging, adhesives play many functions including bonding, fixing, sealing protection, gap filling, grounding, insulation, flame retardancy, etc. Among them, the most common way of use is to mount electronic components or integrated circuit chips on lead frames or plastic substrates. After the adhesive undergoes processes such as thermal baking (baking) curing, wire bonding (wire bonding) and epoxy molding compound EMC plastic sealing, the packaged device becomes a part of the printed circuit board or an important electrical component after high-temperature reflow soldering (reflow).

[0003] Adhesives used in electronic packaging usually need to meet the requirements of both process performance and use performance. Process performance includes appropriate rheological properties to cope with construction methods and methods in various application scenarios, and appropriate curing conditions (temperature and time); use performance requires that the adhesive has good mechanical strength and thermophysical properties after curing, and has a suitable coefficient of thermal expansion (CTE) and modulus relative to the substrate, molding compound, etc. When experiencing high and low temperature thermal shock, it will not cause delamination and cracking of the adhesive layer or severe warping of the chip due to thermal mismatch of the interface contact material.

[0004] At present, the mainstream adhesive for chip mounting is a curing system with epoxy resin as the base resin. CN111440579A discloses a highly flexible epoxy resin adhesive, its preparation method and application. The highly flexible epoxy resin adhesive is prepared from the following raw materials: 40 to 100 parts by mass of polyether-modified epoxy resin, 20 to 60 parts by mass of quaternary thiol compounds, 0 to 3 parts by mass of colorant, 0 to 10 parts by mass of fumed silica, and 0 to 5 parts by mass of curing accelerator; the invention improves the flexibility of the cured product by introducing polyether groups into the epoxy resin and mercapto groups into the curing agent.

[0005] However, with the improvement of chip integration, the heat dissipation of large-size chips has become a problem that cannot be ignored. In particular, the popular application of power semiconductors has put forward high requirements on the adhesive's resistance to cold and heat shock. Conventional epoxy resin system chip glue can no longer meet the increasingly stringent application requirements.

[0006] Therefore, in order to solve the above technical problems, it is urgent to develop an insulating adhesive composition with high bonding reliability and good resistance to cold and heat shock. Summary of the invention

[0007] In view of the deficiencies in the prior art, the object of the present invention is to provide an insulating adhesive composition and a preparation method and application thereof. By introducing amino-terminated pseudorotaxane into the raw materials, the obtained insulating adhesive composition has a high room temperature bonding strength, a high residual adhesive rate on the high-temperature damage surface, a good high-temperature bonding effect, and no warping and delamination after multiple high and low temperature thermal shocks, and has excellent thermal shock resistance.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides an insulating adhesive composition, the insulating adhesive composition comprising epoxy resin A, epoxy resin B, amino-terminated pseudorotaxane and a curing agent;

[0010] The epoxy resin A is a phenolic epoxy resin, and the epoxy resin B is an epoxy resin containing at least two epoxy groups.

[0011] The insulating adhesive composition provided by the present invention adopts two epoxy resins, a phenolic epoxy resin and an epoxy resin containing at least two epoxy groups, and introduces an amino-terminated pseudorotaxane; wherein the phenolic epoxy resin is prepared by reacting a linear phenolic resin (Novolac Resin) with epichlorohydrin or β-alkyl epichlorohydrin as raw materials under alkaline conditions, which can effectively improve the reaction activity and crosslinking density, thereby improving the mechanical strength of the insulating adhesive composition after curing, and then the amino-terminated pseudorotaxane is introduced, so that the insulating adhesive composition finally obtained has a higher room temperature bonding strength, a high residual adhesive rate on a high-temperature damage surface, and warping and delamination after multiple high and low temperature cold and hot shocks, and has excellent cold and hot shock resistance.

[0012] Preferably, the epoxy resin A includes any one of phenol-type novolac epoxy resin, o-cresol-type novolac epoxy resin or bisphenol A-type novolac epoxy resin, or a combination of at least two of them.

[0013] Preferably, the epoxy resin B includes any one of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, brominated bisphenol A epoxy, biphenyl epoxy resin, naphthalene epoxy resin, aralkyl epoxy resin or polybutadiene epoxy resin, or a combination of at least two thereof, and more preferably bisphenol A epoxy resin and / or bisphenol F epoxy resin.

[0014] Preferably, based on the total mass of the epoxy resin A and the epoxy resin B being 100%, the mass of the epoxy resin A is not less than 20%, for example, 22%, 24%, 26%, 28% or 30%.

[0015] Preferably, based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the amino-terminated pseudorotaxane is 1 to 10%, for example, 2%, 3%, 4%, 5%, 6%, 7%, 8% or 9%, etc., more preferably 2 to 7.5%, and even more preferably 2 to 5%.

[0016] Preferably, the guest polymer of the amino-terminated pseudorotaxane comprises any one of polyglycol, polyolefin or polyether, or a combination of at least two thereof.

[0017] Preferably, the main molecule of the amino-terminated pseudorotaxane includes any one of cyclodextrin (CD), crown ether or calixarene, or a combination of at least two of them.

[0018] Preferably, based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the curing agent is 5 to 30%, for example, 7%, 9%, 11%, 13%, 15%, 17%, 19%, 21%, 23%, 25%, 27% or 29%, etc., and more preferably 16 to 24%.

[0019] Preferably, the curing agent is an amino compound containing an aromatic ring.

[0020] Preferably, the amino compound includes any one of 4,4-diaminodiphenylmethane (DDM), 3,3'-diethyl-4,4'diaminodiphenylmethane (DEDDM), diethyltoluenediamine, 3,3'-dichloro-4,4'diaminodiphenylmethane (MOCA), 4,4'-diaminodiphenyl ether (DDO), 4,4-diaminodiphenyl sulfone (DDS), meta-phenylenediamine (MPD) or meta-phenylenediamine (mXDA) or a combination of at least two thereof.

[0021] Preferably, the insulating adhesive composition also includes an epoxy diluent, which is a small molecule epoxy compound containing an epoxy group. Adding the epoxy diluent into the formula can reduce the viscosity of the epoxy resin and improve the processing properties of the insulating adhesive composition. The epoxy diluent can also participate in the curing reaction and become a part of the cured cross-linked network structure.

[0022] Preferably, the epoxy diluent includes any one of a monofunctional epoxy diluent, a difunctional epoxy diluent, a multifunctional epoxy diluent or a glycidyl ester type diluent, or a combination of at least two thereof.

[0023] Preferably, the monofunctional epoxy diluent includes any one of butyl glycidyl ether, phenyl glycidyl ether, o-cresyl glycidyl ether, benzyl glycidyl ether, p-tert-butylphenyl glycidyl ether, octyl glycidyl ether, decyl glycidyl ether, C12-14 alkyl glycidyl ether or C8-10 alkyl glycidyl ether, or a combination of at least two thereof.

[0024] Preferably, the difunctional epoxy diluent includes any one of 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether or resorcinol diglycidyl ether, or a combination of at least two thereof.

[0025] Preferably, the multifunctional epoxy diluent includes any one of glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, propoxyglycerol triglycidyl ether, castor oil triglycidyl ether, pentaerythritol tetraglycidyl ether or sorbitol glycidyl ether, or a combination of at least two thereof.

[0026] Preferably, the glycidyl ester type diluent includes any one of diglycidyl dimer acid ester, diglycidyl methyltetrahydrophthalate, diglycidyl adipate or glycidyl methacrylate, or a combination of at least two thereof.

[0027] Preferably, the insulating adhesive composition also includes a curing accelerator, which can promote the curing of the epoxy resin.

[0028] Preferably, based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the curing accelerator is 2-4%, for example, 2.2%, 2.4%, 2.6%, 2.8%, 3%, 3.2%, 3.4%, 3.6% or 3.8%, etc.

[0029] Preferably, the curing accelerator includes any one of a urea curing accelerator, an imidazole curing accelerator or an encapsulated curing accelerator, or a combination of at least two thereof.

[0030] Preferably, the urea curing accelerator includes any one of p-chlorophenyl-N,N-dimethylurea, 3-phenyl-1,1-dimethylurea, 3,4-dichlorophenyl-N,N-dimethylurea or N-(3-chloro-4-methylphenyl)-N′,N′-dimethylurea or a combination of at least two thereof.

[0031] In the present invention, commercial curing accelerators may also be directly selected, such as UR200, UR300, UR400, UR500, UR700, UR800, URAcc13, URAcc57 and other products from Alzchem, and OmicureU24, U35, U52, U-405, U410, U415 and other products from Huntsman.

[0032] Preferably, the insulating adhesive composition also includes a silane coupling agent.

[0033] The present invention does not impose any special restriction on the amount of silane coupling agent added. The recommended amount is 0.5-2% of the total mass of the insulating adhesive composition (excluding fillers), such as 0.7%, 0.9%, 1.1%, 1.3%, 1.5%, 1.7% or 1.9%.

[0034] Preferably, the silane coupling agent includes any one of a vinyl silane coupling agent, an epoxy silane coupling agent, an amino silane coupling agent or a mercapto silane coupling agent, or a combination of at least two thereof.

[0035] Preferably, the silane coupling agent includes γ-(2,3-glycidoxy)propyltrimethoxysilane (KH-560) and / or γ-(methacryloyloxy)propyltrimethoxysilane (KH-570).

[0036] Preferably, the insulating adhesive composition further comprises silicon powder filler.

[0037] Preferably, the average particle size of the silicon powder filler is 0.5 to 30 μm, for example, 3 μm, 6 μm, 9 μm, 13 μm, 16 μm, 19 μm, 23 μm, 26 μm or 29 μm, and more preferably 1 to 10 μm.

[0038] Preferably, the silicon powder filler includes silicon dioxide, and commercially available spherical silicon dioxide can be selected, such as SO-C5, FE-920A, FEB25K-SED or SC6200-STE from Admatech.

[0039] The present invention also does not impose any special restriction on the amount of silicon powder filler added. The recommended amount is 0.5 to 1.5 times the total mass of the insulating adhesive composition (excluding the filler), such as 0.7 times, 0.9 times, 1.1 times or 1.3 times.

[0040] Preferably, the insulating adhesive composition also includes fumed silica, and commercial fumed silica products can be directly selected, such as TS-720, TS-710 or TS610 from Cabot Corporation, and AEROSIL R202, AEROSIL R805 or AEROSIL R720 from Evonik Corporation.

[0041] The present invention also does not impose any special restriction on the amount of fumed silica added. The recommended amount is 0.5-3% of the total mass of the insulating adhesive composition (including fillers), for example 0.7%, 0.9%, 1.3%, 1.6%, 1.9%, 2.3%, 2.6% or 2.9%.

[0042] In a second aspect, the present invention provides a method for preparing the insulating adhesive composition as described in the first aspect, the preparation method comprising: mixing epoxy water resin A, epoxy resin B, amino-terminated pseudorotaxane, a curing agent, optionally a curing accelerator, optionally a diluent, optionally a silane coupling agent, optionally a silicon powder filler and optionally a fumed silica to obtain the insulating adhesive composition.

[0043] In a third aspect, the present invention provides a use of the insulating adhesive composition as described in the first aspect in electronic packaging.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] The insulating adhesive composition provided by the present invention comprises an epoxy resin A, an epoxy resin B, an amino-terminated pseudorotaxane and a curing agent, wherein the epoxy resin A is a phenolic epoxy resin, and the epoxy resin B is an epoxy resin containing at least two epoxy groups. By using the above two types of epoxy resins for matching and introducing the amino-terminated pseudorotaxane, the obtained insulating adhesive composition has a high room temperature bonding strength, a high residual adhesive rate on a high-temperature damage surface, no warping and delamination after multiple high and low temperature thermal shocks, has excellent thermal shock resistance, and is suitable for application in large-size chip packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 The NMR spectrum of the amino-terminated pseudorotaxane provided in Preparation Example 1;

[0047] Figure 2 This is the NMR spectrum of the amino-terminated pseudorotaxane provided in Preparation Example 2. DETAILED DESCRIPTION

[0048] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0049] Some raw material information involved in the specific implementation of the present invention is shown in Table 1 below:

[0050] Table 1

[0051] use Brand Supplier Name Phenolic epoxy resin N-730A DIC Co., Ltd. Bisphenol A epoxy resin EXA-850CRP DIC Co., Ltd. Curing agent 4,4'-Diaminodiphenyl sulfone (DDS) Hubei Yuancheng Pharmaceutical Co., Ltd. Epoxy Thinner Denacol EX-214L Nagase Chemtex Silane coupling agent KH-560 Dow Corning Curing accelerator Dyhard UR300 Alzchem Fumed Silica TS-720 Cabot Silicon dioxide powder FE-920A Admatech

[0052] Preparation Example 1

[0053] An amino-terminated pseudorotaxane, the preparation method of which comprises: adding amino-terminated polyethylene glycol (Mn=400 g / mol) and α-cyclodextrin in a molar ratio of 1:2 in deionized water, reacting at room temperature for 2 hours, then cooling and taking out a precipitate for freeze-drying to obtain the amino-terminated pseudorotaxane;

[0054] The detailed preparation method of the amino-terminated pseudorotaxane provided in this preparation example can be referred to "CN116874804A";

[0055] Using nuclear magnetic tester 1 The amino-terminated pseudorotaxane obtained in Preparation Example 1 was tested by H NMR (600 MHz, DMSO-d6), and its NMR spectrum was as follows: Figure 1 shown.

[0056] Preparation Example 2

[0057] An amino-terminated pseudorotaxane, the preparation method of which comprises: adding amino-terminated polyethylene glycol (Mn=2000 g / mol) and α-cyclodextrin in a molar ratio of 0.2:2 in deionized water, reacting at room temperature for 2 hours, then cooling and taking out a precipitate for freeze-drying to obtain the amino-terminated pseudorotaxane;

[0058] The detailed preparation method of the amino-terminated pseudorotaxane provided in this preparation example can be referred to "CN116874804A"; the nuclear magnetic resonance tester is used 1 The amino-terminated pseudorotaxane obtained in Preparation Example 2 was tested by H NMR (600 MHz, DMSO-d6), and its NMR spectrum was as follows: Figure 2 shown.

[0059] Embodiment 0

[0060] An insulating adhesive composition comprises the following components in parts by weight:

[0061]

[0062] The preparation method of the insulating adhesive composition provided in this embodiment includes: mixing a curing agent, a curing accelerator and an epoxy diluent, heating to 80°C to fully dissolve and filtering to remove insoluble matter, cooling to room temperature, adding terminal amino pseudorotaxane, phenolic epoxy resin, bisphenol A type epoxy resin and silane coupling agent to mix, after mixing evenly, adding fumed silica and silica powder, mixing in a high-speed disperser (Shenzhen Zhongyi Technology ZYMC-305VS) at a stirring speed of 800 rpm for 15 minutes, and then degassing in a vacuum (vacuum degree <-0.095 MPa) at a stirring speed of 2000 rpm for 10 minutes, and discharging at normal pressure after devacuation to obtain the insulating adhesive composition.

[0063] Example 1

[0064] An insulating adhesive composition, which differs from Example 0 only in that the amino-terminated pseudorotaxane provided in Preparation Example 2 is used to replace the amino-terminated pseudorotaxane obtained in Preparation Example 1, and other components, amounts and preparation methods are the same as those in Example 0.

[0065] Example 2

[0066] An insulating adhesive composition, which differs from Example 1 only in that the added amount of the amino-terminated pseudorotaxane (Preparation Example 2) is 0.75, and the other components, amounts and preparation methods are the same as those in Example 1.

[0067] Example 3

[0068] An insulating adhesive composition, which differs from Example 2 only in that the added amount of the amino-terminated pseudorotaxane (Preparation Example 2) is 1.05, and the other components, amounts and preparation methods are the same as those in Example 2.

[0069] Example 4

[0070] An insulating adhesive composition, which differs from Example 2 only in that the added amount of the amino-terminated pseudorotaxane (Preparation Example 2) is 1.5, and the other components, amounts and preparation methods are the same as those in Example 2.

[0071] Example 5

[0072] An insulating adhesive composition, which differs from Example 2 in that the added amount of phenolic epoxy resin N-730A is 12 parts by weight, the added amount of bisphenol A epoxy resin 850CRP is 3 parts by weight, and the other components, amounts and preparation methods are the same as those in Example 2.

[0073] Example 6

[0074] An insulating adhesive composition, which differs from Example 2 in that the added amount of the curing agent (DDS) is 2.4 parts by weight, and the other components, amounts and preparation methods are the same as those in Example 2.

[0075] Example 7

[0076] An insulating adhesive composition, which differs from Example 2 in that the added amount of the curing agent (DDS) is 3.6 parts by weight, and the other components, amounts and preparation methods are the same as those in Example 2.

[0077] Example 8

[0078] An insulating adhesive composition is disclosed, which differs from Example 1 in that the added amount of the curing agent (DDS) is 1.5 parts by weight, and the other components, amounts and preparation methods are the same as those in Example 1.

[0079] Example 9

[0080] An insulating adhesive composition, which differs from Example 1 in that the added amount of the curing agent (DDS) is 4.5 parts by weight, and the other components, amounts and preparation methods are the same as those in Example 1.

[0081] Comparative Example 1

[0082] An insulating adhesive composition, which differs from Example 2 in that amino-terminated pseudorotaxane (Preparation Example 2) is not added, and other components, amounts and preparation methods are the same as those in Example 2.

[0083] Comparative Example 2

[0084] An insulating adhesive composition, which differs from Example 2 in that bisphenol A epoxy resin 850CRP is not added, the added amount of phenolic epoxy resin N-730A is 15 parts by weight, and other components, amounts and preparation methods are the same as those in Example 2.

[0085] Comparative Example 3

[0086] An insulating adhesive composition, which differs from Example 2 in that no phenolic epoxy resin N-730A is added, the added amount of bisphenol A epoxy resin 850CRP is 15 parts by weight, and other components, amounts and preparation methods are the same as those in Example 2.

[0087] Performance Test:

[0088] (1) Adhesive strength: The test method refers to "HG / T 5912-2021 Conductive Adhesives", the silicon wafer size is: 2×2mm; the substrate is a silver-plated copper sheet, and the curing conditions are a hot plate at 175℃×60min; the test equipment is a DAGE-4000P multi-function push-pull test machine (Nordson DAGE Precision Industries LTD, USA) with a temperature-controlled heating table, and the shear strength is the thrust size (unit is kgF, kilogram force); when measuring high-temperature thrust, the temperature of the temperature-controlled heating table is set, and after reaching the target temperature, it is stabilized for 5 minutes before starting to measure the thrust. Five specimens are taken for each adhesive sample, and the arithmetic average is taken;

[0089] (2) Residual adhesive rate on the damaged surface: The residual adhesive on the substrate after the thrust damage was observed under an optical microscope, and the area ratio of the residual adhesive part (the percentage relative to the chip area) was evaluated using a 10-point system, with 100% residual adhesive corresponding to 10; 90% residual adhesive corresponding to 9, and so on. 10% residual adhesive corresponding to 1; 0% residual adhesive corresponding to 0; the arithmetic average of 10 samples was taken;

[0090] (3) Chip warpage: A silver-plated frame with a chip size of 9×9 mm was used. After the chip was glued and bonded, the chip / frame was baked and cured at 175°C for 60 min. The warpage was measured along the diagonal direction of the chip using a surface roughness measuring instrument. The unit is μm. A value less than 20 μm was considered passed, and a value exceeding 20 μm was considered unqualified.

[0091] (4) Delamination resistance after wet heat aging: After die bonding, the chip / frame is encapsulated with a molding compound (Sumikon EME-7026, Sumitomo Bakelite Co., Ltd., Japan). A group of 20 chips are cured at "double 85" (85% relative humidity and 85°C) for 8 days. After three reflow solderings (each time at 260°C, 10s), the delamination is observed using an ultrasonic microscope SAT ultrasonic scanning (T-Scan mode). If any chip delaminates, the test is considered to have failed.

[0092] The insulating adhesive compositions provided by Examples 1 to 10 and Comparative Examples 1 to 3 were tested according to the above test method. The test results are shown in Table 2:

[0093] Table 2

[0094]

[0095]

[0096] From the data in Table 2, we can see that:

[0097] (1) Comparison of the data of Examples 0 to 4 and Comparative Example 1 shows that, when other materials are constant, the amount of amino-terminated pseudorotaxane added increases from 0 parts by weight to 1.5 parts by weight. At room temperature, the chip thrust increases first and then decreases with the increase of its content. At high temperatures, the chip thrust decreases significantly compared to room temperature. When amino-terminated pseudorotaxane is not added, the bonding strength is only 0.15 kgF, and the residual adhesive rate on the damaged surface is only 1 point, and the chip warpage exceeds 30 μm. After adding amino-terminated pseudorotaxane, the residual adhesive surface is significantly increased to 5 to 6 points, and the chip thrust at high temperature is also significantly increased. Taking Example 1 as an example, it is increased by about 2 times, and the highest reaches 0.7 kgF (Example 3);

[0098] Meanwhile, compared with Example 1, Example 0 uses an amino-terminated pseudorotaxane with a molecular weight of only 400 as the guest polymer. When other conditions remain unchanged, there is no obvious improvement in performance compared with Comparative Example 1.

[0099] (2) Comparing Example 2, Example 5 and Comparative Examples 2-3, the ratio between the phenolic epoxy resin N730A and the bisphenol A epoxy resin 850CRP was adjusted. The bisphenol A epoxy resin and the phenolic epoxy resin were respectively eliminated from Comparative Examples 2-3. The chip thrust at room temperature of the former decreased significantly, and the bonding strength decreased from 12kgF to 8.5kgF. The high-temperature chip thrust was also relatively low, and the bonding strength was only 0.15kgF, but the residual adhesive surface and chip warping were better;

[0100] (3) Finally, by comparing the data of Example 2 with those of Examples 6 to 9, it can be found that the curing agent also affects the performance of the insulating adhesive composition. The chip thrust corresponding to the too low and too high amounts of curing agent added in Examples 8 to 9 are reduced to a certain extent relative to Examples 2 and 6 to 7, and the bonding strength decreases from more than 10 kgF to less than 10 kgF. The corresponding high-temperature chip thrust is also less than 0.5 kgF, but the residual adhesive rate on the damaged surface and the chip warpage are relatively good.

[0101] The applicant declares that the present invention illustrates an insulating adhesive composition and its preparation method and application through the above embodiments, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. An insulating adhesive composition, characterized in that: The insulating adhesive composition comprises epoxy resin A, epoxy resin B, amino-terminated pseudorotaxane and a curing agent; The epoxy resin A is a phenolic epoxy resin, and the epoxy resin B is an epoxy resin containing at least two epoxy groups; The phenolic epoxy resin is prepared by reacting a linear phenolic resin with epichlorohydrin or β-alkyl epichlorohydrin as raw materials under alkaline conditions; The epoxy resin B includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, brominated bisphenol A epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, aralkyl epoxy resin or polybutadiene epoxy resin; The guest polymer of the amino-terminated pseudorotaxane is any one of polyglycol, polyolefin or polyether or a combination of at least two thereof; The main molecule of the amino-terminated pseudorotaxane includes any one of cyclodextrin, crown ether or calixarene, or a combination of at least two of them; Based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the epoxy resin A is not less than 22%, the mass of the amino-terminated pseudorotaxane is 3-10%, and the mass of the curing agent is 5-30%.

2. The insulating adhesive composition according to claim 1, characterized in that: The epoxy resin A is composed of any one of phenol-type novolac epoxy resin, o-cresol-type novolac epoxy resin or bisphenol A-type novolac epoxy resin or a combination of at least two of them.

3. The insulating adhesive composition according to claim 1, characterized in that: The epoxy resin B is bisphenol A epoxy resin and / or bisphenol F epoxy resin.

4. The insulating adhesive composition according to claim 1, characterized in that: Based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the amino-terminated pseudorotaxane is 3-7.5%.

5. The insulating adhesive composition according to claim 4, characterized in that: Based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the amino-terminated pseudorotaxane is 3-5%.

6. The insulating adhesive composition according to claim 1, characterized in that: Based on the total mass of the epoxy resin A and the epoxy resin B being 100%, the mass of the curing agent is 16-24%.

7. The insulating adhesive composition according to claim 1, characterized in that: The curing agent is an amino compound containing an aromatic ring.

8. The insulating adhesive composition according to claim 7, characterized in that: The amino compound includes any one of 4,4-diaminodiphenylmethane, 3,3'-diethyl-4,4'diaminodiphenylmethane, diethyltoluenediamine, 3,3'-dichloro-4,4'diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, meta-phenylenediamine or meta-phenylenediamine, or a combination of at least two thereof.

9. The insulating adhesive composition according to claim 1, characterized in that: The insulating adhesive composition also includes an epoxy diluent.

10. The insulating adhesive composition according to claim 9, characterized in that: The epoxy diluent includes any one of a monofunctional epoxy diluent, a difunctional epoxy diluent, a multifunctional epoxy diluent or a glycidyl ester type diluent or a combination of at least two thereof.

11. The insulating adhesive composition according to claim 10, characterized in that: The monofunctional epoxy diluent includes any one of butyl glycidyl ether, phenyl glycidyl ether, o-cresyl glycidyl ether, benzyl glycidyl ether, p-tert-butylphenyl glycidyl ether, octyl glycidyl ether, decyl glycidyl ether, carbon twelve to fourteen alkyl glycidyl ether or carbon eight to ten alkyl glycidyl ether, or a combination of at least two thereof.

12. The insulating adhesive composition according to claim 10, characterized in that: The bifunctional epoxy diluent includes any one of 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether or resorcinol diglycidyl ether, or a combination of at least two thereof.

13. The insulating adhesive composition according to claim 10, characterized in that: The multifunctional epoxy diluent includes any one of glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, propoxyglycerol triglycidyl ether, castor oil triglycidyl ether, pentaerythritol tetraglycidyl ether or sorbitol glycidyl ether, or a combination of at least two thereof.

14. The insulating adhesive composition according to claim 10, characterized in that: The glycidyl ester type diluent includes any one of diglycidyl dimer acid, diglycidyl methyltetrahydrophthalate, diglycidyl adipate or glycidyl methacrylate, or a combination of at least two thereof.

15. The insulating adhesive composition according to claim 1, characterized in that: The insulating adhesive composition also includes a curing accelerator.

16. The insulating adhesive composition according to claim 15, characterized in that: Based on the total mass of the epoxy resin A and the epoxy resin B as 100%, the mass of the curing accelerator is 2-4%.

17. The insulating adhesive composition according to claim 15, characterized in that: The curing accelerator includes any one of a urea curing accelerator, an imidazole curing accelerator or an encapsulated curing accelerator, or a combination of at least two of them.

18. The insulating adhesive composition according to claim 17, characterized in that: The urea curing accelerator includes any one of p-chlorophenyl-N,N-dimethylurea, 3-phenyl-1,1-dimethylurea, 3,4-dichlorophenyl-N,N-dimethylurea or N-(3-chloro-4-methylphenyl)-N′,N′-dimethylurea or a combination of at least two thereof.

19. The insulating adhesive composition according to claim 1, characterized in that: The insulating adhesive composition also includes a silane coupling agent.

20. The insulating adhesive composition according to claim 19, characterized in that: The silane coupling agent includes any one of a vinyl silane coupling agent, an epoxy silane coupling agent, an amino silane coupling agent or a mercapto silane coupling agent, or a combination of at least two thereof.

21. The insulating adhesive composition according to claim 19, characterized in that: The silane coupling agent includes γ-(2,3-epoxypropoxy)propyltrimethoxysilane and / or γ-(methacryloyloxy)propyltrimethoxysilane.

22. The insulating adhesive composition according to claim 1, characterized in that: The insulating adhesive composition also includes silicon powder filler.

23. The insulating adhesive composition according to claim 22, characterized in that: The average particle size of the silicon powder filler is 0.5-30 μm.

24. The insulating adhesive composition according to claim 23, characterized in that: The average particle size of the silicon powder filler is 1-10 μm.

25. The insulating adhesive composition according to claim 22, characterized in that: The silicon powder filler includes silicon dioxide.

26. The insulating adhesive composition according to claim 1, characterized in that: The insulating adhesive composition also includes fumed silica.

27. A method for preparing the insulating adhesive composition according to any one of claims 1 to 26, characterized in that: The preparation method comprises: mixing epoxy water resin A, epoxy resin B, amino-terminated pseudorotaxane, curing agent, optional curing accelerator, optional diluent, optional silane coupling agent, optional silicon powder filler and optional fumed silica to obtain the insulating adhesive composition.

28. Use of the insulating adhesive composition according to any one of claims 1 to 26 in electronic packaging.

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