Epoxy resin packaging material, preparation method and application thereof

Abstract

The present invention relates to the technical field of packaging materials, and specifically discloses an epoxy resin packaging material, a preparation method and its application, comprising the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide modified boron nitride modifier; wherein the mass ratio of epoxy resin, curing agent, continuous adjustment improver and yttrium oxide modified boron nitride modifier is (10-14):3:(3-5):(2-3). The epoxy resin packaging material of the present invention adopts epoxy resin and curing agent, and adopts continuous adjustment improver and yttrium oxide modified boron nitride modifier to be mutually reconciled, and the synergistic effect is achieved to enhance the product's resistance to cold and heat shock and insulation, optimize the coordination of the two performances, and improve the product's acid corrosion resistance stability.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resin packaging, and in particular to an epoxy resin packaging material, a preparation method and application thereof. Background Art

[0002] Epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in coatings, adhesives, electronic packaging materials, etc. Epoxy resin as electronic packaging material is one of its most important uses. Existing epoxy resin packaging materials have poor thermal shock resistance. In order to improve its thermal shock resistance, it is easy to lead to poor insulation of the product, and it is difficult to achieve coordinated improvement of the thermal shock resistance and insulation of the product. The product has poor acid corrosion resistance and stability, which limits the use efficiency of the product. Summary of the invention

[0003] In view of the defects of the prior art, the object of the present invention is to provide an epoxy resin packaging material, a preparation method and application thereof, so as to solve the problems raised in the above background technology.

[0004] The present invention solves the technical problem by adopting the following technical solution:

[0005] The present invention provides an epoxy resin packaging material, comprising the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; wherein the material mass ratio of the epoxy resin, the curing agent, the continuous adjustment improver and the yttrium oxide-modified boron nitride modifier is (10-14):3:(3-5):(2-3).

[0006] Preferably, the curing agent is styrene maleic anhydride copolyester with a molecular weight of 1,000 to 50,000.

[0007] Preferably, the preparation method of the continuous adjustment improver is:

[0008] S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent;

[0009] S02: Add 3-5 parts of 10% sodium dodecylbenzene sulfonate solution and 1-2 parts of silane coupling agent to 6-8 parts of chitosan solution and stir to mix evenly, and finally add 0.25-0.35 parts of glycolic acid and stir well to obtain a modified solution;

[0010] S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent;

[0011] S04: The modified silicon carbide whisker agent and mica continuous adjustment liquid are subjected to ball milling modification treatment in a weight ratio of 5:3, the ball milling speed is 1000-1500r / min, the ball milling time is 1-2h, and after the ball milling is completed, the continuous adjustment improver is obtained by washing with water and drying.

[0012] Preferably, the mass fraction of the sodium dodecylbenzene sulfonate solution is 10-15%; the mass fraction of the chitosan solution is 4-7%; and the silane coupling agent is silane coupling agent KH560.

[0013] Preferably, the stirring speed of the stirring modification treatment is 550-650 r / min, and the stirring time is 20-30 min.

[0014] Preferably, the mica mixing solution comprises the following raw materials in parts by weight:

[0015] 4-7 parts of nano mica powder, 2-4 parts of lanthanum chloride solution, 1-2 parts of nano silica sol, 5-9 parts of sodium lignin sulfonate solution and 0.5-0.7 parts of glass fiber.

[0016] Preferably, the mass fraction of the lanthanum chloride solution is 2-5%; the mass fraction of the sodium lignin sulfonate solution is 10-15%.

[0017] Preferably, the preparation method of the yttrium oxide-modified boron nitride modifier is:

[0018] S101: irradiating the boron nitride in a proton irradiation box for 10 to 15 minutes at an irradiation power of 300 to 350 W, and obtaining a boron nitride irradiation agent after the irradiation is completed;

[0019] S102: Mix a boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse them evenly in a 10% sodium alginate solution with a mass fraction of 3 to 5 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 210 to 220°C for 5 to 10 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

[0020] The invention provides a method for preparing an epoxy resin packaging material, comprising the following steps: uniformly mixing raw materials according to a proportion, and then kneading at 100-110° C. for 2-5 minutes to obtain the epoxy resin packaging material of the invention.

[0021] The invention also provides an application of the epoxy resin packaging material in electronic packaging.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The epoxy resin encapsulation material of the present invention adopts epoxy resin and curing agent, and adopts continuous adjustment improver and yttrium oxide modified boron nitride modifier to be mutually reconciled, and the synergistic effect is achieved to enhance the product's resistance to cold and heat shock and insulation, optimize the coordination of the two properties, and improve the acid corrosion resistance stability of the product;

[0024] 2. The continuous adjustment improver adopts silicon carbide whiskers treated with hydrochloric acid solution and combined with potassium permanganate to optimize the active efficiency and dispersibility of the whiskers. At the same time, the whiskers are modified by a modified solution prepared by mixing sodium dodecylbenzene sulfonate solution, silane coupling agent, chitosan solution and glycolic acid, which further optimizes the active efficiency and compatibility of the whiskers, so that the modified silicon carbide whisker agent can better cooperate with the mica continuous adjustment solution to achieve synergistic effect;

[0025] 3. The nano-mica powder in the mica continuous adjustment liquid is the matrix with a lamellar structure. It is mixed with lanthanum chloride solution, nano-silica sol and sodium lignin sulfonate solution to enhance the interfacial activity of the system raw materials. Then, it is reinforced by glass fiber. The mica continuous adjustment liquid thus obtained optimizes the modified silicon carbide whisker agent in the system, thereby coordinating with the whisker dispersion system to further enhance the insulation and thermal shock resistance of the system, and optimize the acid corrosion resistance stability of the product.

[0026] 4. The boron nitride modifier based on yttrium oxide modification uses boron nitride for proton irradiation to optimize the activity performance of boron nitride, and then yttrium oxide is used for coordination, and then it is dispersed and blended with sodium alginate solution, so that the boron nitride and yttrium oxide are better coordinated and synergized. Finally, after heat treatment, the activity performance of the system is further optimized, so that the boron nitride modifier based on yttrium oxide modification can better synergize with the continuous adjustment improver, and the performance of the product is further enhanced. DETAILED DESCRIPTION

[0027] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] An epoxy resin packaging material of this embodiment includes the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; wherein the mass ratio of epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier is (10-14):3:(3-5):(2-3).

[0029] The curing agent in this embodiment is styrene maleic anhydride copolyester with a molecular weight of 1000 to 50000.

[0030] The preparation method of the continuous adjustment improver of this embodiment is:

[0031] S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent;

[0032] S02: Add 3-5 parts of 10% sodium dodecylbenzene sulfonate solution and 1-2 parts of silane coupling agent to 6-8 parts of chitosan solution and stir to mix evenly, and finally add 0.25-0.35 parts of glycolic acid and stir well to obtain a modified solution;

[0033] S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent;

[0034] S04: The modified silicon carbide whisker agent and mica continuous adjustment liquid are subjected to ball milling modification treatment in a weight ratio of 5:3, the ball milling speed is 1000-1500r / min, the ball milling time is 1-2h, and after the ball milling is completed, the continuous adjustment improver is obtained by washing with water and drying.

[0035] The mass fraction of the sodium dodecylbenzene sulfonate solution in this embodiment is 10-15%; the mass fraction of the chitosan solution is 4-7%; and the silane coupling agent is silane coupling agent KH560.

[0036] The stirring speed of the stirring modification treatment in this embodiment is 550-650 r / min, and the stirring time is 20-30 min.

[0037] The mica mixing solution of this embodiment includes the following raw materials in parts by weight:

[0038] 4-7 parts of nano mica powder, 2-4 parts of lanthanum chloride solution, 1-2 parts of nano silica sol, 5-9 parts of sodium lignin sulfonate solution and 0.5-0.7 parts of glass fiber.

[0039] The mass fraction of the lanthanum chloride solution in this embodiment is 2-5%; the mass fraction of the sodium lignin sulfonate solution is 10-15%.

[0040] The preparation method of the yttrium oxide-modified boron nitride modifier of this embodiment is:

[0041] S101: irradiating the boron nitride in a proton irradiation box for 10 to 15 minutes at an irradiation power of 300 to 350 W, and obtaining a boron nitride irradiation agent after the irradiation is completed;

[0042] S102: Mix a boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse them evenly in a 10% sodium alginate solution with a mass fraction of 3 to 5 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 210 to 220°C for 5 to 10 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

[0043] The preparation method of an epoxy resin packaging material of the present embodiment comprises the following steps: mixing the raw materials uniformly according to the proportion, and then kneading them at 100-110° C. for 2-5 minutes to obtain the epoxy resin packaging material of the present invention.

[0044] The present embodiment provides an application of an epoxy resin packaging material in electronic packaging.

[0045] Example 1.

[0046] An epoxy resin packaging material of the present embodiment includes the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; wherein the mass ratio of the epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier is 10:3:3:2.

[0047] The curing agent in this embodiment is styrene maleic anhydride copolyester with a molecular weight of 1000.

[0048] The preparation method of the continuous adjustment improver of this embodiment is:

[0049] S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent;

[0050] S02: Add 3 parts of 10% sodium dodecylbenzene sulfonate solution and 1 part of silane coupling agent to 6 parts of chitosan solution and stir to mix evenly, and finally add 0.25 parts of glycolic acid and stir well to obtain a modified solution;

[0051] S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent;

[0052] S04: The modified silicon carbide whisker agent and mica continuous adjustment liquid are subjected to ball milling modification treatment in a weight ratio of 5:3, the ball milling speed is 1000r / min, the ball milling time is 1h, and after the ball milling is completed, the continuous adjustment improver is obtained by washing with water and drying.

[0053] The mass fraction of the sodium dodecylbenzene sulfonate solution in this embodiment is 10%; the mass fraction of the chitosan solution is 4%; and the silane coupling agent is silane coupling agent KH560.

[0054] The stirring speed of the stirring modification treatment in this embodiment is 550 r / min, and the stirring time is 20 min.

[0055] The mica mixing solution of this embodiment includes the following raw materials in parts by weight:

[0056] 4 parts of nano mica powder, 2 parts of lanthanum chloride solution, 1 part of nano silica sol, 5 parts of sodium lignin sulfonate solution and 0.5 parts of glass fiber.

[0057] The mass fraction of the lanthanum chloride solution in this embodiment is 2%; the mass fraction of the sodium lignin sulfonate solution is 10%.

[0058] The preparation method of the yttrium oxide-modified boron nitride modifier of this embodiment is:

[0059] S101: irradiating the boron nitride in a proton irradiation box for 10 minutes at an irradiation power of 300 W, and obtaining a boron nitride irradiation agent after the irradiation is completed;

[0060] S102: Mix a boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse evenly in a 10% sodium alginate solution with a mass fraction of 3 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 210°C for 5 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

[0061] The preparation method of an epoxy resin packaging material of the present embodiment comprises the following steps: mixing the raw materials uniformly according to the proportion, and then kneading them at 100° C. for 2 minutes to obtain the epoxy resin packaging material of the present invention.

[0062] The present embodiment provides an application of an epoxy resin packaging material in electronic packaging.

[0063] Example 2.

[0064] An epoxy resin packaging material of this embodiment includes the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; wherein the mass ratio of the epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier is 14:3:5:3.

[0065] The curing agent in this embodiment is styrene maleic anhydride copolyester with a molecular weight of 50,000.

[0066] The preparation method of the continuous adjustment improver of this embodiment is:

[0067] S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent;

[0068] S02: Add 5 parts of 10% sodium dodecylbenzene sulfonate solution and 2 parts of silane coupling agent to 8 parts of chitosan solution and stir to mix evenly, and finally add 0.35 parts of glycolic acid and stir well to obtain a modified solution;

[0069] S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent;

[0070] S04: The modified silicon carbide whisker agent and mica continuous adjustment liquid are subjected to ball milling modification treatment in a weight ratio of 5:3, the ball milling speed is 1500r / min, the ball milling time is 2h, and after the ball milling is completed, the continuous adjustment improver is obtained by washing with water and drying.

[0071] The mass fraction of the sodium dodecylbenzene sulfonate solution in this embodiment is 15%; the mass fraction of the chitosan solution is 7%; and the silane coupling agent is silane coupling agent KH560.

[0072] The stirring speed of the stirring modification treatment in this embodiment is 650 r / min, and the stirring time is 30 min.

[0073] The mica mixing solution of this embodiment includes the following raw materials in parts by weight:

[0074] 7 parts of nano mica powder, 4 parts of lanthanum chloride solution, 2 parts of nano silica sol, 9 parts of sodium lignin sulfonate solution and 0.7 parts of glass fiber.

[0075] The mass fraction of the lanthanum chloride solution in this embodiment is 5%; the mass fraction of the sodium lignin sulfonate solution is 15%.

[0076] The preparation method of the yttrium oxide-modified boron nitride modifier of this embodiment is:

[0077] S101: irradiating the boron nitride in a proton irradiation box for 15 minutes at an irradiation power of 350 W, and obtaining a boron nitride irradiation agent after the irradiation is completed;

[0078] S102: Mix a boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse them evenly in a 10% sodium alginate solution with a mass fraction of 5 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 220°C for 10 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

[0079] The preparation method of an epoxy resin packaging material of the present embodiment comprises the following steps: mixing the raw materials uniformly according to the proportion, and then kneading them at 110° C. for 5 minutes to obtain the epoxy resin packaging material of the present invention.

[0080] The present embodiment provides an application of an epoxy resin packaging material in electronic packaging.

[0081] Example 3.

[0082] An epoxy resin packaging material of this embodiment includes the following raw materials: epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; wherein the mass ratio of the epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier is 12:3:4:2.5.

[0083] The curing agent in this embodiment is styrene maleic anhydride copolyester with a molecular weight of 20,000.

[0084] The preparation method of the continuous adjustment improver of this embodiment is:

[0085] S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent;

[0086] S02: Add 4 parts of 10% sodium dodecylbenzene sulfonate solution and 1.5 parts of silane coupling agent to 7 parts of chitosan solution and stir to mix evenly, and finally add 0.30 parts of glycolic acid and stir well to obtain a modified solution;

[0087] S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent;

[0088] S04: The modified silicon carbide whisker agent and mica continuous adjustment liquid are subjected to ball milling modification treatment in a weight ratio of 5:3, the ball milling speed is 1250r / min, the ball milling time is 1.5h, and after the ball milling is completed, the mixture is washed with water and dried to obtain a continuous adjustment improver.

[0089] The mass fraction of the sodium dodecylbenzene sulfonate solution in this embodiment is 12.5%; the mass fraction of the chitosan solution is 5.5%; and the silane coupling agent is silane coupling agent KH560.

[0090] The stirring speed of the stirring modification treatment in this embodiment is 600 r / min, and the stirring time is 5 min.

[0091] The mica mixing solution of this embodiment includes the following raw materials in parts by weight:

[0092] 5.5 parts of nano mica powder, 3 parts of lanthanum chloride solution, 1.5 parts of nano silica sol, 7 parts of sodium lignin sulfonate solution and 0.6 parts of glass fiber.

[0093] The mass fraction of the lanthanum chloride solution in this embodiment is 3.5%; the mass fraction of the sodium lignin sulfonate solution is 12.5%.

[0094] The preparation method of the yttrium oxide-modified boron nitride modifier of this embodiment is:

[0095] S101: irradiating the boron nitride in a proton irradiation box for 12.5 minutes at an irradiation power of 325 W, and obtaining a boron nitride irradiation agent after the irradiation is completed;

[0096] S102: Mix a boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse evenly in a 10% sodium alginate solution with a mass fraction of 4 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 215°C for 7.5 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

[0097] The preparation method of an epoxy resin packaging material of the present embodiment comprises the following steps: mixing the raw materials uniformly according to the proportion, and then kneading them at 105° C. for 3.5 minutes to obtain the epoxy resin packaging material of the present invention.

[0098] The present embodiment provides an application of an epoxy resin packaging material in electronic packaging.

[0099] Comparative Example 1.

[0100] The difference from Example 3 is that no continuous adjustment improver is added.

[0101] Comparative Example 2.

[0102] The difference from Example 3 is that step S01 is not used in the preparation of the continuous adjustment improver.

[0103] Comparative Example 3.

[0104] The difference from Example 3 is that no modifying liquid treatment is used in the preparation of the continuous adjustment improver.

[0105] Comparative Example 4.

[0106] The difference from Example 3 is that no sodium dodecylbenzene sulfonate solution or silane coupling agent is added in the preparation of the modified solution.

[0107] Comparative Example 5.

[0108] The difference from Example 3 is that mica continuous adjustment liquid treatment is not used in the preparation of the continuous adjustment improver.

[0109] Comparative Example 6.

[0110] The difference from Example 3 is that no yttria-modified boron nitride modifier is added.

[0111] Comparative Example 7.

[0112] The difference from Example 3 is that the S102 step is not used in the preparation of the yttrium oxide-modified boron nitride modifier.

[0113] Comparative Example 8.

[0114] The difference from Example 3 is that yttrium oxide is not added in the treatment of step S102 and the sodium alginate solution is not used for uniform dispersion.

[0115] The products of Examples 1-3 and Comparative Examples 1-8 were placed under normal conditions and in 2% hydrochloric acid mist for 12 hours to test the acid corrosion resistance of the products. The performance measurement results are as follows:

[0116]

[0117]

[0118] It can be concluded from Examples 1-3 and Comparative Examples 1-8 that

[0119] The product of Example 3 of the present invention has excellent thermal shock performance under normal conditions, and at the same time, the breakdown strength performance effect is obvious. The product can achieve coordinated improvement of thermal shock and breakdown strength, and still has excellent thermal shock and breakdown strength performance under acid corrosion resistance conditions;

[0120] From Comparative Examples 1-5, Comparative Example 6 and Example 3, it can be seen that the performance of the product has a significant deterioration trend when the present invention does not add a continuous adjustment improver or one of the boron nitride modifiers based on yttrium oxide modification. The coordinated combination of the two can achieve coordinated improvement.

[0121] In the preparation of the continuous adjustment improver, the S01 step treatment, the modifying liquid treatment, the addition of sodium dodecylbenzene sulfonate solution, the silane coupling agent, and the mica continuous adjustment liquid treatment were not used, and the performance of the product showed a trend of deterioration. At the same time, it was found that the performance of the product without the mica continuous adjustment liquid treatment had the greatest impact on the preparation of the continuous adjustment improver, and the continuous adjustment improver obtained by the specific modifying liquid treatment method of the present invention in combination with the mica continuous adjustment liquid treatment and the S01 step treatment of the present invention had the most significant performance effect. The use of other methods instead was not as obvious as the effect of the present invention.

[0122] It can be seen from Comparative Example 7, Comparative Example 8 and Example 3 that the performance of the products tended to deteriorate when the S102 step was not used in the preparation of the yttrium oxide-modified boron nitride modifier, yttrium oxide was not added in the S102 step, and the product was not evenly dispersed in the sodium alginate solution. The product performance effect was most significant when the S102 step was used in the preparation of the yttrium oxide-modified boron nitride modifier using the specific method of the present invention.

[0123] Based on the fact that the mica continuous adjustment liquid has a significant impact on the performance of the product, further research is conducted on this:

[0124] The mica continuous mixing solution includes the following raw materials in parts by weight:

[0125] 5.5 parts of nano-mica powder, 3 parts of lanthanum chloride solution, 1.5 parts of nano-silica sol, 7 parts of sodium lignin sulfonate solution and 0.6 parts of glass fiber; the mass fraction of the lanthanum chloride solution is 3.5%; the mass fraction of the sodium lignin sulfonate solution is 12.5%.

[0126] Experimental example 1.

[0127] The only difference from Example 3 is that no lanthanum chloride solution is added in the preparation of the mica mixed solution.

[0128] Experimental example 2.

[0129] The only difference from Example 3 is that no nano mica powder is added in the preparation of the mica continuous adjustment solution.

[0130] Experimental Example 3.

[0131] The only difference from Example 3 is that no nano-silica sol is added in the preparation of the mica mixed solution.

[0132] Experimental Example 4.

[0133] The only difference from Example 3 is that no glass fiber is added in the preparation of the mica mixing solution.

[0134] Experimental Example 5.

[0135] The only difference from Example 3 is that no sodium lignin sulfonate solution is added in the preparation of the mica mixed solution.

[0136]

[0137] It can be seen from Experimental Examples 1-5 that nano-mica powder is not added in the preparation of the mica continuous adjustment liquid. Among the preparation factors of the mica continuous adjustment liquid, the performance of the product deteriorates significantly. The second is that glass fiber is not added. At the same time, lanthanum chloride solution, sodium lignin sulfonate solution and nano-silica sol are not added. The performance of the product has a tendency to deteriorate. Only by using the specific raw materials of the present invention, the performance effect of the product is the most significant. Using other raw materials instead cannot achieve the technical effect of the present invention.

[0138] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0139] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An epoxy resin packaging material, characterized in that: The raw materials include epoxy resin, curing agent, continuous adjustment improver and yttrium oxide-modified boron nitride modifier; The mass ratio of epoxy resin, curing agent, continuous adjustment improver and yttria-modified boron nitride modifier is (10-14):3:(3-5):(2-3); The preparation method of the continuous adjustment improver is: S01: adding the silicon carbide whisker into a sufficient amount of 5% by mass hydrochloric acid solution, stirring and mixing, then washing and drying, and then mixing in a sufficient amount of 10% by mass potassium permanganate solution, and finally filtering and drying to obtain a pretreated silicon carbide whisker agent; S02: Add 3-5 parts of 10% sodium dodecylbenzene sulfonate solution and 1-2 parts of silane coupling agent to 6-8 parts of chitosan solution and stir to mix evenly, and finally add 0.25-0.35 parts of glycolic acid and stir well to obtain a modified solution; S03: the pretreated silicon carbide whisker agent and the modifying liquid are stirred and modified in a weight ratio of 2:5, and after the modification is completed, the modified silicon carbide whisker agent is washed with water and dried to obtain the modified silicon carbide whisker agent; S04: ball-milling the modified silicon carbide whisker agent and mica continuous adjustment liquid at a weight ratio of 5:3, with a ball-milling speed of 1000-1500 r / min and a ball-milling time of 1-2 h. After the ball-milling is completed, washing with water and drying are performed to obtain a continuous adjustment improver; The mica continuous adjustment liquid comprises the following raw materials in parts by weight: 4-7 parts of nano mica powder, 2-4 parts of lanthanum chloride solution, 1-2 parts of nano silica sol, 5-9 parts of sodium lignin sulfonate solution and 0.5-0.7 parts of glass fiber.

2. The epoxy resin packaging material according to claim 1, characterized in that: The curing agent is styrene maleic anhydride copolyester with a molecular weight of 1000 to 50000.

3. The epoxy resin packaging material according to claim 1, characterized in that: The mass fraction of the chitosan solution is 4-7%; the silane coupling agent is silane coupling agent KH560.

4. The epoxy resin packaging material according to claim 1, characterized in that: The stirring speed of the stirring modification treatment is 550-650 r / min, and the stirring time is 20-30 min.

5. The epoxy resin packaging material according to claim 1, characterized in that: The mass fraction of the lanthanum chloride solution is 2-5%; the mass fraction of the sodium lignin sulfonate solution is 10-15%.

6. The epoxy resin packaging material according to claim 1, characterized in that: The preparation method of the yttrium oxide-modified boron nitride modifier is as follows: S101: irradiating the boron nitride in a proton irradiation box for 10 to 15 minutes at an irradiation power of 300 to 350 W, and obtaining a boron nitride irradiation agent after the irradiation is completed; S102: Mix the boron nitride irradiating agent and yttrium oxide in a weight ratio of 3:1, and then disperse them evenly in a 10% sodium alginate solution with a mass fraction of 3 to 5 times the total amount of the boron nitride irradiating agent, wash with water, dry, and then heat treat at 210 to 220°C for 5 to 10 minutes, and finally cool to room temperature to obtain a boron nitride modifier based on yttrium oxide modification.

7. A method for preparing the epoxy resin packaging material according to any one of claims 1 to 6, comprising the following steps: The raw materials are mixed evenly according to the proportions, and then kneaded at 100-110° C. for 2-5 minutes to obtain the epoxy resin packaging material.

8. Use of the epoxy resin packaging material according to any one of claims 1 to 7 in electronic packaging.

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