Chip packaging equipment

Abstract

The invention belongs to the technical field of chip packaging, in particular to a chip packaging device, a glue dispensing machine; the glue dispensing machine is provided with a glue dispensing driving mechanism, the top surface of the glue dispensing machine is fixedly connected with an electric guide rail, a slider is slidably connected with the electric guide rail, the top surface of the slider is fixedly connected with a motor, the output end of the motor is fixedly connected with a disk, the side wall of the disk is provided with a ring, and the ring is provided with a connecting mechanism connected with the disk; the disk and the ring are driven to rotate by a motor, so that a PCB board enters a connecting shell, and at this time, a heating wire can be started to dry the glue applied on the PCB board and the chip, and while drying, a PCB board can be placed on another placement board to continue the glue dispensing packaging work, and the above mechanism can complete the rapid drying of the glue without transferring the chip, thereby improving the efficiency of drying the chip.

Description

Technical Field

[0001] The invention belongs to the technical field of chip packaging, in particular to a chip packaging device. Background Art

[0002] Chip packaging will use a chip packaging dispensing machine. The chip also needs to be pre-installed on the PCB board, and then placed on the chip packaging dispensing machine. The dispensing machine is then used to dispense glue to adhere the chip to the PCB board to protect the chip from the external environment. The chip is then transferred to a drying device for drying. The glue is quickly dried and solidified. Otherwise, slight external vibrations or collisions may cause damage to the chip.

[0003] However, the above technology often has the following defects: during the process of drying and transferring the chip during glue dispensing packaging, the chip may be contaminated by external dust, impurities, etc., affecting its quality and performance. At the same time, the chip transfer also requires a certain amount of time, which will reduce the drying and curing efficiency of the glue. For this reason, the present invention provides a chip packaging device. Summary of the invention

[0004] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a chip packaging device described in the present invention includes a dispensing machine; a dispensing driving mechanism is provided on the dispensing machine, the top surface of the dispensing machine is fixedly connected to an electric rail, a slider is slidably connected to the electric rail, the top surface of the slider is fixedly connected to a motor (not shown in the figure), the output end of the motor is fixedly connected to a disc, the side wall of the disc is provided with a ring, the ring is provided with a connecting mechanism connected to the disc, the top surface of the ring is fixedly connected to a pair of placement plates, the side wall of the slider is fixedly connected to a connecting plate, the connecting plate is fixedly connected to a connecting shell that fits the bottom surface of the ring, both sides of the connecting shell are provided with rectangular grooves for the placement plates to pass through, a group of copper tubes are provided in the connecting shell, and a heating wire is provided in the copper tube; in the prior art, during the drying and transfer of the chip during dispensing packaging, the chip may be contaminated by external dust, impurities, etc., affecting its quality and performance, and the chip transfer also requires a certain amount of time, which will reduce the drying and curing efficiency of the glue; the present invention pre-installs the chip on the PCB board, then places the PCB board on the placement board, and then drives the disc and the ring to rotate with the help of a motor, so that the PCB board moves to the bottom of the glue dispensing drive mechanism, and then uses the glue dispensing drive mechanism to perform glue dispensing and packaging on the chip on the PCB board. After the glue dispensing and packaging is completed, the disc and the ring are driven by the motor to rotate again, so that the PCB board enters the connecting shell, and then the heating wire can be started to dry the glue on the PCB board and the chip. While drying, the PCB board can be placed on another placement board to continue the glue dispensing and packaging work. Through the above mechanism, the glue can be quickly dried without transferring the chip, thereby improving the efficiency of chip drying, and at the same time, the possibility of contamination caused by the chip during the transfer process can be reduced, and the packaging work of other chips will not be affected.

[0006] Preferably, the inner and outer walls of the connecting shell corresponding to the rectangular groove are both slidably connected with a sealing plate, one side of the sealing plate is fixedly connected with a driving block, the side of the driving block away from the sealing plate is inclined, and the top surface of the placement plate is fixedly connected with a fixing rod for pushing the driving block; since the rectangular groove on the connecting shell is in an open state, when the glue is dried, hot air can easily escape from the rectangular groove, thereby affecting the drying effect of the glue, and when the circular ring rotates and drives the placement plate to move into the connecting shell through the above-mentioned mechanism, the circular ring continues to rotate, and at this time the fixing rod will push the inclined surface of the driving block, so that the sealing plate moves upward, so that the placement plate enters the connecting shell smoothly, and after the placement plate enters the connecting shell, the sealing plate will move downward due to gravity to seal the rectangular groove, thereby effectively preventing the hot air in the connecting shell from escaping from the rectangular groove, thereby improving the drying effect of the glue.

[0007] Preferably, the connecting shell is fixedly connected with an elastic hollow block near the side wall of the disc, and a hollow plate connected to the inner wall of the hollow block is fixedly connected inside the connecting shell. A group of air outlet holes located above the placement plate are opened on the hollow plate, and a group of push rods for pushing the hollow block are fixedly connected to the top surface of the disc, and the ring is rotatably connected to the outer wall of the disc; when the placement plate enters the connecting shell, the connecting mechanism no longer connects the ring and the disc. At this time, the disc can be driven to rotate with the help of a motor, which will not affect the drying and gluing of the chip. When the motor drives the disc to rotate, the push rod will intermittently push the hollow block, so that the gas in the hollow block enters the hollow plate, and then blows onto the glue of the PCB board and the chip from the air outlet, thereby further improving the curing efficiency of the glue.

[0008] Preferably, the connecting mechanism includes a fixing plate fixed to the top surface of the disc, a magnetic rod is slidably connected in the fixing plate, a pair of positioning rings are fixedly connected to the magnetic rod, a connecting block is fixedly connected to the top surface of the ring, a slot is provided on the side of the connecting block close to the connecting shell, brackets are fixedly connected to both sides of the connecting shell, and a magnetic block that repels the magnetic rod is fixedly connected to the other end of the bracket; the placement plate is driven into the connecting shell by driving the disc and the ring, and the magnetic block corresponds to the position of the magnetic rod, so that the magnetic block pushes the magnetic rod out of the slot, and the disc can rotate alone to drive the push rod to squeeze the hollow block (this process The rotation speed of the disc is low). When the disc and the ring need to rotate together, the speed of the motor output end is increased to increase the rotation speed of the disc. At this time, the slide bar will be swung outward due to centrifugal force. Then, during the rotation of the disc, the slide bar will enter the slot to push the connecting block to rotate. After the slide bar enters the slot, the rotation speed of the turntable is reduced. At this time, the turntable will drive the ring to rotate together, so that the placement plate can be taken out of the connecting shell. The above mechanism can be used to control the rotation speed of the disc, so that the disc and the ring can be connected and disconnected without manual operation, thereby improving the automation level of chip packaging equipment.

[0009] Preferably, a hollow moving block is sealed and slidably connected in the hollow plate, a first spring is fixedly connected between a side of the moving block close to the hollow block and an inner wall of the hollow plate, an air inlet hole is provided on the side of the hollow plate close to the first spring, an air outlet groove is provided on the side of the hollow plate away from the first spring, and a connecting hole offset with the air outlet hole is provided on the bottom surface of the moving block; when the air outlet holes on the hollow plate are exhausting air, the closer the air outlet holes are to the hollow block, the greater the wind force will be, and the smaller the wind force will be further backward, resulting in the wind being unable to blow evenly on the glue of the PCB board and the chip. At this time, the gas in the hollow block can enter the hollow plate through the above-mentioned mechanism, and the gas inlet hole can enter the moving block, pushing the moving block to move until the connecting hole is aligned with the air outlet hole, and the gas will be blown evenly from the air outlet hole on the glue, thereby further improving the curing efficiency of the glue.

[0010] Preferably, the inner wall of the connecting shell is slidably connected with a rectangular plate, and a connecting frame is fixedly installed on the side of the rectangular plate away from the inner wall of the connecting shell, the copper tube is fixedly connected to the inner wall of the connecting frame, and an adjusting member for adjusting the height of the steel tube is arranged in the connecting shell; because when the heating wire is just started, the heating speed in the connecting shell tends to be constant, at this time, if the copper tube is set at a position close to the placement plate, although the efficiency of drying the glue can be improved, the temperature will also be relatively high, which may cause damage to the chip. At this time, the above-mentioned mechanism is improved, and the copper tube can be set at a position close to the chip and the PCB board when the chip and the PCB board enter the connecting shell. At this time, the heat dissipated by the copper tube can effectively dry and solidify the glue, and as the temperature in the connecting shell continues to rise and slowly tends to stabilize, the position of the copper tube can be moved upward with the help of a driving member to prevent the copper tube from being too close to the chip and the PCB board to cause damage to the chip, thereby achieving the effect of protecting the chip and the PCB board.

[0011] Preferably, the adjusting member comprises an arc-shaped memory metal, the top end of the memory metal is fixedly connected to the fixing plate, and the bottom end of the memory metal is fixedly connected to the inner wall of the connecting shell; when the heating wire in the copper tube is working, the temperature in the connecting shell will rise, and the memory metal will deform according to the temperature change (the deformation angle of the memory metal is related to the temperature), so that the memory metal slowly straightens and pushes the rectangular plate, so that the copper tube gradually moves away from the chip and the PCB board, thereby achieving the effect of adjusting the position of the steel tube according to the temperature of the connecting shell.

[0012] Preferably, a hollow elastic block is fixedly connected to the bottom surface of the hollow plate, dry powder is stored in the elastic block, and a plurality of sets of puncture cones are fixedly connected to the top surface of the connecting frame. The dry powder stored in the elastic block may be BC dry powder, ABC dry powder, etc. When the chip and PCB board in the connecting shell spontaneously combust due to an accident, the temperature in the connecting shell will rise to a very high level. At this time, the memory metal will push the puncture cone on the connecting frame to puncture the elastic block, so that the dry powder can be sprayed on the chip and PCB board for timely fire extinguishing.

[0013] Preferably, a hollow connecting column is fixedly connected to the connecting plate, a sliding rod is slidably connected to the top surface of the connecting column, a rubber block in contact with the bottom surface of the ring is fixedly connected to the top surface of the sliding rod, and a second spring is fixedly connected between the bottom surface of the sliding rod and the inner wall of the connecting column; since the ring rotates under the push of the disc, when the disc stops rotating, the ring is easy to rotate due to inertia, so that the ring cannot stop at the desired stopping position, and the friction force generated by the rubber block and the ring can be used to provide a braking effect for the ring, so that when the disc stops rotating, the ring can also stop rotating, and the second spring will push the rubber block to further increase the friction between the rubber block and the ring.

[0014] Preferably, an adjusting block is fixedly connected to the bottom surface of the sliding rod, a threaded rod is threadedly connected to one side of the connecting column, and the side of the adjusting block close to the threaded rod is inclined; since the rubber block will have a certain wear during use, the force of the second spring of the rubber block pushing the sliding rod will gradually decrease, thereby affecting the effect of the rubber block on limiting the ring. At this time, the adjusting block can be pushed by rotating the screw rod, so that the adjusting block pushes the connecting column, and then the rubber block can better fit the ring, thereby improving the limiting effect of the rubber block on the ring.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The present invention drives the disc and the ring to rotate by means of a motor, so that the PCB board enters the connection shell. At this time, the heating wire can be started to dry the glue on the PCB board and the chip. During the drying process, the PCB board can be placed on another placement plate to continue the glue dispensing and packaging work. The above mechanism can complete the rapid drying of the glue without transferring the chip, thereby improving the efficiency of drying the chip.

[0017] 2. In the present invention, when the circular ring rotates and drives the placement plate to move into the connecting shell, the circular ring continues to rotate. At this time, the fixed rod will push the inclined surface of the driving block to move the sealing plate upward, so that the placement plate can smoothly enter the connecting shell. After the placement plate enters the connecting shell, the sealing plate will move downward due to gravity to seal the rectangular groove, thereby effectively preventing the hot air in the connecting shell from escaping from the rectangular groove and improving the drying effect of the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a stereogram of the present invention;

[0020] Figure 2 It is a schematic diagram of the internal structure of the connecting shell in the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the state where the plate is placed in the connection shell in the present invention;

[0022] Figure 4 The present invention Figure 1 A magnified image of point A;

[0023] Figure 5 It is a schematic diagram of the internal structure of the hollow plate of the present invention;

[0024] Figure 6 It is a structural schematic diagram of embodiment 2 of the present invention.

[0025] In the figure: 1. glue dispenser; 2. glue dispensing drive mechanism; 3. electric guide rail; 4. disc; 5. ring; 6. placement plate; 7. connecting plate; 8. connecting shell; 9. copper tube; 10. fixing rod; 11. driving block; 12. sealing plate; 13. hollow block; 14. hollow plate; 15. air outlet; 16. push rod; 17. connecting block; 18. slot; 19. fixing plate; 20. magnetic rod; 21. positioning ring; 22. bracket; 23. magnetic block; 24. moving block; 25. connecting hole; 26. first spring; 27. air outlet groove; 28. memory metal; 29. ​​rectangular plate; 30. connecting frame; 31. puncture cone; 32. elastic block; 33. slider; 34. connecting column; 35. slide rod; 36. rubber block; 37. second spring; 38. adjusting block; 39. threaded rod. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0027] Embodiment 1: Figures 1 to 5As shown, a chip packaging device described in an embodiment of the present invention includes a dispensing machine 1; a dispensing driving mechanism 2 is provided on the dispensing machine 1, an electric rail 3 is fixedly connected to the top surface of the dispensing machine 1, a slider 33 is slidably connected to the electric rail 3, a motor (not shown in the figure) is fixedly connected to the top surface of the slider 33, a disc 4 is fixedly connected to the output end of the motor, a ring 5 is provided on the side wall of the disc 4, the ring 5 is provided with a connecting mechanism connected to the disc 4, a pair of placement plates 6 are fixedly connected to the top surface of the ring 5, a connecting plate 7 is fixedly connected to the side wall of the slider 33, a connecting shell 8 that fits the bottom surface of the ring 5 is fixedly connected to the connecting plate 7, rectangular grooves for allowing the placement plate 6 to pass through are opened on both sides of the connecting shell 8, a group of copper tubes 9 are provided in the connecting shell 8, and a heating wire is provided in the copper tube 9;

[0028] In the prior art, during the drying and transfer of the chip during the glue dispensing packaging, the chip may be contaminated by external dust, impurities, etc., which will affect its quality and performance. At the same time, the chip transfer also requires a certain amount of time, which will reduce the drying and curing efficiency of the glue. The present invention pre-installs the chip on the PCB board, and then places the PCB board on the placement plate 6. Then, the motor drives the disc 4 and the ring 5 to rotate, so that the PCB board moves to the bottom of the glue dispensing drive mechanism 2, and then the glue dispensing drive mechanism 2 is used to perform glue dispensing packaging on the chip on the PCB board. After the glue dispensing packaging is completed, the motor drives the disc 4 and the ring 5 to rotate again, so that the PCB board enters the connecting shell 8. At this time, the heating wire can be started to dry the glue on the PCB board and the chip. While drying, the PCB board can be placed on another placement plate 6 to continue the glue dispensing packaging work. Through the above mechanism, the glue can be quickly dried without transferring the chip, thereby improving the efficiency of chip drying, and at the same time, the possibility of contamination caused by the chip during the transfer process can be reduced, and the packaging work of other chips will not be affected.

[0029] The inner and outer walls of the connecting shell 8 corresponding to the rectangular groove are slidably connected with a sealing plate 12, and a driving block 11 is fixedly connected to one side of the sealing plate 12, and the side of the driving block 11 away from the sealing plate 12 is in an inclined shape, and the top surface of the placement plate 6 is fixedly connected with a fixing rod 10 for pushing the driving block 11; since the rectangular groove on the connecting shell 8 is in an open state, when the glue is dried, hot air can easily escape from the rectangular groove, thereby affecting the drying effect of the glue, and when the ring 5 rotates and drives the placement plate 6 to move to the inside of the connecting shell 8 through the above-mentioned mechanism, the ring 5 continues to rotate, and at this time the fixing rod 10 will push the inclined surface of the driving block 11, so that the sealing plate 12 moves upward, so that the placement plate 6 enters the connecting shell 8 smoothly, and after the placement plate 6 enters the connecting shell 8, the sealing plate 12 will move downward due to gravity to seal the rectangular groove, thereby effectively preventing the hot air in the connecting shell 8 from escaping from the rectangular groove, thereby improving the drying effect of the glue.

[0030] The connecting shell 8 is fixedly connected with an elastic hollow block 13 on the side wall close to the disk 4, and a hollow plate 14 connected with the inner wall of the hollow block 13 is fixedly connected inside the connecting shell 8. A group of air outlets 15 located above the placement plate 6 are opened on the hollow plate 14, and a group of push rods 16 for pushing the hollow block 13 are fixedly connected to the top surface of the disk 4, and the ring 5 is rotatably connected to the outer wall of the disk 4; when the placement plate 6 enters the connecting shell 8, the connecting mechanism no longer connects the ring 5 and the disk 4. At this time, the disk 4 can be driven to rotate by the motor, which will not affect the drying and dispensing of the chip. When the motor drives the disk 4 to rotate, the push rod 16 will intermittently push the hollow block 13, so that the gas in the hollow block 13 enters the hollow plate 14, and then blows on the glue of the PCB board and the chip from the air outlet 15, thereby further improving the curing efficiency of the glue.

[0031] The connection mechanism includes a fixing plate 19 fixed on the top surface of the disk 4, a magnetic rod 20 is slidably connected in the fixing plate 19, a pair of positioning rings 21 are fixedly connected to the magnetic rod 20, a connecting block 17 is fixedly connected to the top surface of the ring 5, a slot 18 is provided on the side of the connecting block 17 close to the connecting shell 8, brackets 22 are fixedly connected to both sides of the connecting shell 8, and a magnetic block 23 that repels the magnetic rod 20 is fixedly connected to the other end of the bracket 22;

[0032] By driving the disc 4 and the ring 5, the placement plate 6 is driven to enter the connection shell 8. At this time, the magnetic block 23 will correspond to the position of the magnetic rod 20, so that the magnetic block 23 pushes the magnetic rod 20 to disengage from the slot 18. At this time, the disc 4 can rotate alone to drive the push rod 16 to squeeze the hollow block 13 (the rotation speed of the disc 4 is relatively low in this process). When the disc 4 and the ring 5 need to rotate together, the speed of rotation of the motor output end is accelerated, so that the rotation speed of the disc 4 is increased. At this time, the slide bar 35 will be thrown outward due to centrifugal force, and then during the rotation of the disc 4, the slide bar 35 will enter the slot 18 to push the connection block 17 to rotate. After the slide bar 35 enters the slot 18, the rotation speed of the turntable is reduced. At this time, when the turntable rotates, it will drive the ring 5 to rotate together, so that the placement plate 6 can be taken out of the connection shell 8. Through the above mechanism, the rotation speed of the disc 4 can be controlled, so that the disc 4 and the ring 5 can be connected and disconnected without manual operation, thereby improving the automation of the chip packaging equipment.

[0033] A hollow moving block 24 is sealed and slidably connected inside the hollow plate 14, a first spring 26 is fixedly connected between the side of the moving block 24 close to the hollow block 13 and the inner wall of the hollow plate 14, an air inlet hole is provided on the side of the hollow plate 14 close to the first spring 26, an air outlet groove 27 is provided on the side of the hollow plate 14 away from the first spring 26, and a connecting hole 25 is provided on the bottom surface of the moving block 24, which is staggered with the air outlet hole 15;

[0034] When the air outlet holes 15 on the hollow plate 14 are venting air, the closer the air outlet holes 15 are to the hollow block 13, the greater the wind force will be, and the further back the wind force is, the smaller the wind force will be, resulting in the wind not being able to blow evenly on the glue of the PCB board and the chip. At this time, the gas in the hollow block 13 can enter the hollow plate 14 through the above-mentioned mechanism, allowing the gas inlet hole to enter the moving block 24, pushing the moving block 24 to move until the connecting hole 25 is aligned with the air outlet holes 15. At this time, the gas will be evenly blown onto the glue from the air outlet holes 15, thereby further improving the curing efficiency of the glue.

[0035] The inner wall of the connecting shell 8 is slidably connected with a rectangular plate 29, a connecting frame 30 is fixedly installed on the side of the rectangular plate 29 away from the inner wall of the connecting shell 8, the copper tube 9 is fixedly connected to the inner wall of the connecting frame 30, and an adjusting member for adjusting the height of the steel tube is provided in the connecting shell 8;

[0036] When the heating wire is just started, the heating speed of the connection shell 8 tends to be constant. At this time, if the copper tube 9 is set close to the placement plate 6, the efficiency of drying the glue can be improved, but the temperature will be relatively high, which may cause damage to the chip. At this time, the above-mentioned mechanism is improved, and the copper tube 9 can be set close to the chip and the PCB board when the chip and the PCB board enter the connection shell 8. At this time, the heat dissipated by the copper tube 9 can effectively dry and solidify the glue. As the temperature in the connection shell 8 continues to rise and slowly tends to stabilize, the position of the copper tube 9 can be moved upward with the help of a driving member to prevent the copper tube 9 from being too close to the chip and the PCB board to cause damage to the chip, thereby achieving the effect of protecting the chip and the PCB board.

[0037] The adjusting member includes an arc-shaped memory metal 28, the top end of the memory metal 28 is fixedly connected to the fixing plate 19, and the bottom end of the memory metal 28 is fixedly connected to the inner wall of the connecting shell 8; when the heating wire in the copper tube 9 is working, the temperature in the connecting shell 8 will rise, and the memory metal 28 will deform according to the temperature change (the deformation angle of the memory metal 28 is related to the temperature), so that the memory metal 28 slowly straightens and pushes the rectangular plate 29, so that the copper tube 9 gradually moves away from the chip and the PCB board, thereby achieving the effect of adjusting the position of the steel tube according to the temperature of the connecting shell 8.

[0038] A hollow elastic block 32 is fixedly connected to the bottom surface of the hollow plate 14, and dry powder is stored in the elastic block 32. A plurality of puncture cones 31 are fixedly connected to the top surface of the connecting frame 30. The dry powder stored in the elastic block 32 may be BC dry powder, ABC dry powder, etc. When the chip and PCB board in the connecting shell 8 spontaneously combust due to an accident, the temperature in the connecting shell 8 will rise to a very high level. At this time, the memory metal 28 will push the puncture cone 31 on the connecting frame 30 to puncture the elastic block 32, so that the dry powder can be sprayed on the chip and PCB board for timely fire extinguishing.

[0039] Embodiment 2: Figure 6As shown, compared with Example 1, another implementation of the present invention is: a hollow connecting column 34 is fixedly connected to the connecting plate 7, and a sliding rod 35 is slidably connected to the top surface of the connecting column 34, and a rubber block 36 in contact with the bottom surface of the ring 5 is fixedly connected to the top surface of the sliding rod 35, and a second spring 37 is fixedly connected between the bottom surface of the sliding rod 35 and the inner wall of the connecting column 34; since the ring 5 rotates under the push of the disc 4, when the disc 4 stops rotating, the ring 5 is easy to rotate due to the effect of inertia, so that the ring 5 cannot stop at the desired stopping position, and the friction force generated by the rubber block 36 and the ring 5 can be used to provide a braking effect for the ring 5, so that when the disc 4 stops rotating, the ring 5 can also stop rotating, and the second spring 37 will push the rubber block 36 to further increase the friction between the rubber block 36 and the ring 5.

[0040] An adjusting block 38 is fixedly connected to the bottom surface of the slide rod 35, and a threaded rod 39 is threadedly connected to one side of the connecting column 34, and the side of the adjusting block 38 close to the threaded rod 39 is in an inclined shape; since the rubber block 36 will have a certain amount of wear during use, the force of the second spring 37 of the rubber block 36 pushing the slide rod 35 will gradually decrease, thereby affecting the effect of the rubber block 36 on limiting the ring 5. At this time, the adjusting block 38 can be pushed by rotating the screw rod, so that the adjusting block 38 pushes the connecting column 34, and then the rubber block 36 can better fit the ring 5, thereby improving the limiting effect of the rubber block 36 on the ring 5.

[0041] Working principle: The chip is pre-installed on the PCB board, and then the PCB board is placed on the placement plate 6, and then the motor drives the disc 4 and the ring 5 to rotate, so that the PCB board moves to the bottom of the dispensing drive mechanism 2, and then the dispensing drive mechanism 2 is used to perform dispensing and packaging on the chip on the PCB board. After the dispensing and packaging is completed, the motor drives the disc 4 and the ring 5 to rotate again, so that the PCB board enters the connecting shell 8. At this time, the heating wire can be started to dry the glue on the PCB board and the chip. While drying, the PCB board can be placed on another placement plate 6 to continue the dispensing and packaging work. The above mechanism can complete the rapid drying of the glue without transferring the chip, thereby improving the efficiency of drying the chip, and can also In order to reduce the possibility of chip contamination during the transfer process, it will not affect the packaging work of other chips. Since the rectangular groove on the connecting shell 8 is in an open state, when the glue is dried, hot air can easily escape from the rectangular groove, thereby affecting the drying effect of the glue. When the ring 5 rotates to drive the placement plate 6 to move into the connecting shell 8 through the above-mentioned mechanism, the ring 5 continues to rotate. At this time, the fixing rod 10 will push the inclined surface of the driving block 11, so that the sealing plate 12 moves upward, so that the placement plate 6 smoothly enters the connecting shell 8. After the placement plate 6 enters the connecting shell 8, the sealing plate 12 will move downward due to gravity to seal the rectangular groove, thereby effectively preventing the hot air in the connecting shell 8 from escaping from the rectangular groove, and improving the drying effect of the glue.

[0042] When the placement plate 6 enters the connection shell 8, the connection mechanism no longer connects the ring 5 and the disc 4. At this time, the motor can be used to drive the disc 4 to rotate, which will not affect the drying and dispensing of the chip. When the motor drives the disc 4 to rotate, the push rod 16 will intermittently push the hollow block 13, so that the gas in the hollow block 13 enters the hollow plate 14, and then blows on the glue of the PCB board and the chip from the air outlet 15, thereby further improving the curing efficiency of the glue; by driving the disc 4 and the ring 5 with When the disk 4 and the ring 5 need to be rotated together, the speed of the motor output end is accelerated, so that the rotation speed of the disk 4 is increased. At this time, the slide bar 35 will be thrown outward due to the centrifugal force, and then during the rotation of the disk 4, the slide bar 35 will enter the slot 18 and push the connecting block 17 to rotate. After the slide bar 35 enters the slot 18, the speed of the turntable is reduced. At this time, the turntable will drive the ring 5 to rotate together, so that the placement plate 6 can be taken out of the connection shell 8. The above mechanism can be used to control the rotation speed of the disk 4, so that the disk 4 and the ring 5 can be connected and disconnected without manual operation, thereby improving the automation of the chip packaging equipment; because the air outlet 15 on the hollow plate 14 is in operation When the air is discharged, the closer to the air outlet 15 of the hollow block 13, the greater the wind force will be, and the further back, the smaller the wind force will be, which will cause the wind to be unable to blow evenly on the glue of the PCB board and the chip. At this time, the gas in the hollow block 13 can enter the hollow plate 14 through the above mechanism, and the gas inlet hole can enter the moving block 24, pushing the moving block 24 to move until the connecting hole 25 is aligned with the air outlet 15. At this time, the gas will be evenly blown on the glue from the air outlet 15, thereby further improving the curing efficiency of the glue;

[0043] When the heating wire is just started, the heating speed of the connection shell 8 tends to be constant. At this time, if the copper tube 9 is set at a position close to the placement plate 6, the efficiency of drying the glue can be improved, but the temperature will be relatively high, which may cause damage to the chip. At this time, the above-mentioned mechanism can be improved, and the copper tube 9 can be set at a position close to the chip and the PCB board when the chip and the PCB board enter the connection shell 8. At this time, the heat dissipated by the copper tube 9 can effectively dry and solidify the glue. As the temperature in the connection shell 8 continues to rise and slowly tends to be stable, the position of the copper tube 9 can be moved upward with the help of a driving member to prevent the copper tube 9 from being too close to the chip and the PCB board and causing damage to the chip, thereby achieving the effect of protecting the chip and the PCB board; when the heating wire in the copper tube 9 is working, the temperature in the connection shell 8 will rise, and the memory metal 28 will deform according to the change in temperature (the deformation angle of the memory metal 28 is related to the temperature), so that the memory metal 28 slowly straightens and pushes the rectangular plate 29, so that the copper tube 9 gradually moves away from the chip and the PCB board, thereby achieving the effect of adjusting the position of the steel pipe according to the temperature of the connection shell 8;

[0044] The dry powder stored in the elastic block 32 may be BC dry powder, ABC dry powder, etc. When the chip and PCB board in the connecting shell 8 spontaneously combust due to an accident, the temperature in the connecting shell 8 will rise to a very high level. At this time, the memory metal 28 will push the puncture cone 31 on the connecting frame 30 to puncture the elastic block 32, so that the dry powder can be sprayed on the chip and PCB board for timely fire extinguishing.

[0045] The above-mentioned front, back, left, right, top and bottom are all based on the figures in the specification. Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present invention.

[0047] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip packaging device, characterized in that: The invention comprises a glue dispensing machine (1); the glue dispensing machine (1) is provided with a glue dispensing driving mechanism (2); the top surface of the glue dispensing machine (1) is fixedly connected to an electric guide rail (3); a slider (33) is slidably connected to the electric guide rail (3); the top surface of the slider (33) is fixedly connected to a motor; the output end of the motor is fixedly connected to a disk (4); a side wall of the disk (4) is provided with a ring (5); the ring (5) is provided with a connecting mechanism connected to the disk (4); the top surface of the ring (5) is fixedly connected to a pair of placement plates (6); the side wall of the slider (33) is fixedly connected to the side wall of the slider (33); A connecting plate (7) is fixedly connected to the wall, a connecting shell (8) that is in contact with the bottom surface of the circular ring (5) is fixedly connected to the connecting plate (7), rectangular grooves are provided on both sides of the connecting shell (8) for allowing the placement plate (6) to pass through, a group of copper tubes (9) are arranged in the connecting shell (8), heating wires are arranged in the copper tubes (9), sealing plates (12) are slidably connected to the inner and outer walls of the connecting shell (8) corresponding to the rectangular grooves, a driving block (11) is fixedly connected to one side of the sealing plate (12), and the driving block (11) is away from the side of the sealing plate (12). The device is in the shape of an inclined plane, the top surface of the placement plate (6) is fixedly connected to a fixing rod (10) for pushing a driving block (11), the side wall of the connection shell (8) close to the disk (4) is fixedly connected to an elastic hollow block (13), the connection shell (8) is fixedly connected to a hollow plate (14) in communication with the inner wall of the hollow block (13), the hollow plate (14) is provided with a group of air outlet holes (15) located above the placement plate (6), the top surface of the disk (4) is fixedly connected to a group of push rods (16) for pushing the hollow block (13), the ring (5) is connected to the outer wall of the disk (4) The side wall is rotatably connected, and the connection mechanism comprises a fixed plate (19) fixed to the top surface of the disk (4), a magnetic rod (20) is slidably connected inside the fixed plate (19), a pair of positioning rings (21) are fixedly connected to the magnetic rod (20), a connection block (17) is fixedly connected to the top surface of the circular ring (5), a slot (18) is provided on a side of the connection block (17) close to the connection shell (8), brackets (22) are fixedly connected to both sides of the connection shell (8), and a magnetic block (23) that repels the magnetic rod (20) is fixedly connected to the other end of the bracket (22).

2. A chip packaging device according to claim 1, characterized in that: A hollow moving block (24) is sealingly and slidably connected inside the hollow plate (14); a first spring (26) is fixedly connected between a side of the moving block (24) close to the hollow block (13) and an inner wall of the hollow plate (14); an air inlet hole is provided on a side of the hollow plate (14) close to the first spring (26); an air outlet groove (27) is provided on a side of the hollow plate (14) away from the first spring (26); and a connecting hole (25) is provided on the bottom surface of the moving block (24) and is offset from the air outlet hole (15).

3. A chip packaging device according to claim 2, characterized in that: A rectangular plate (29) is slidably connected to the inner wall of the connecting shell (8); a connecting frame (30) is fixedly mounted on a side of the rectangular plate (29) away from the inner wall of the connecting shell (8); the copper tube (9) is fixedly connected to the inner wall of the connecting frame (30); and an adjusting member for adjusting the height of the steel tube is provided in the connecting shell (8).

4. The chip packaging device according to claim 3, characterized in that: The adjusting member comprises an arc-shaped memory metal (28), the top end of the memory metal (28) is fixedly connected to the fixing plate (19), and the bottom end of the memory metal (28) is fixedly connected to the inner wall of the connecting shell (8).

5. The chip packaging device according to claim 4, characterized in that: A hollow elastic block (32) is fixedly connected to the bottom surface of the hollow plate (14), dry powder is stored in the elastic block (32), and a plurality of groups of puncturing cones (31) are fixedly connected to the top surface of the connecting frame (30).

6. The chip packaging device according to claim 5, characterized in that: A hollow connecting column (34) is fixedly connected to the connecting plate (7), a sliding rod (35) is slidably connected to the top surface of the connecting column (34), a rubber block (36) in contact with the bottom surface of the ring (5) is fixedly connected to the top surface of the sliding rod (35), and a second spring (37) is fixedly connected between the bottom surface of the sliding rod (35) and the inner wall of the connecting column (34).

7. The chip packaging device according to claim 6, characterized in that: The bottom surface of the sliding rod (35) is fixedly connected to an adjusting block (38), one side of the connecting column (34) is threadedly connected to a threaded rod (39), and the side of the adjusting block (38) close to the threaded rod (39) is in an inclined shape.

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