An ultra-thin and highly efficient bubble-removing water cooling head

Abstract

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Description

Technical Field

[0001] The invention belongs to the technical field of water cooling accessory structures, in particular to an ultra-thin high-efficiency bubble-removing water cooling head. Background Art

[0002] The water cooling system is one of the common heat dissipation systems in electronic devices at present, in which the water cooling head is used to absorb the heat emitted by the central processing unit. In addition, the water cooling system also needs a water pump to drive the coolant circulation; there are currently two ways to set the water pump. One is to integrate the water pump into the water cooling head, such as the public technical document "CN218030667U, a high-efficiency cooling pump head". The heated component in this technical solution is in direct contact with the heat source and needs to rely on the refrigerant to absorb the heat of the heat source. However, the coolant only contacts the surface of the heat dissipation part during the circulation process. When the refrigerant is not liquefied, it cannot absorb the heat of the heat source, so the heat dissipation effect is limited;

[0003] The other is that the coolant directly enters the heated component, such as the content mentioned in the public technical document "CN111981868A, water cooling head assembly", which can achieve a good heat dissipation effect. However, one point that cannot be ignored is that during the circulation process, the water pump pushes the coolant to circulate, which will cause bubbles to mix into the coolant and eventually enter the cold head. The bubbles will be distributed and accumulated in various positions of the cold head and cannot be discharged, which will not only hinder the circulation of the coolant, but also affect the heat dissipation effect. Summary of the invention

[0004] The purpose of the present invention is to provide an ultra-thin and efficient air bubble removal water cooling head to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An ultra-thin high-efficiency bubble-removing water cooling head comprises a heat-conducting part, an inner cover and an outer cover;

[0007] A plurality of heat dissipation fins are arranged in parallel and staggered manner on a surface of the heat conduction portion;

[0008] The outer periphery of the inner cover is sealed to the surface of the heat conducting part, and the inner wall of the inner cover is sealed to the edge of each heat dissipation fin, so that a flow channel is formed between two adjacent heat dissipation fins, a flow channel opening is formed at the offset of two adjacent heat dissipation fins, through holes are provided on the heat dissipation fins near the corners, a plurality of conical water inlet holes are provided on one side of the inner cover, and a water outlet is provided on the other side;

[0009] The outer cover is located outside the inner cover and is sealed to the surface of the heat conducting part, so that a second flow channel is formed between the outer cover and the inner cover. A water inlet is arranged on the outer cover.

[0010] According to a further technical solution, the through holes are tapered holes, and a plurality of the through holes are distributed in a ring array.

[0011] According to a further technical solution, the inner cover is made of a high thermal conductivity plastic material or a metal material.

[0012] According to a further technical solution, the heat conducting part includes a heat conducting sheet and a bottom plate;

[0013] The heat conducting sheet and the heat dissipating fins are integrally formed of metal material;

[0014] The bottom plate is injection molded, the heat dissipation fins extend out of the bottom plate to the other side, and the heat conductive sheet is closely attached to the bottom surface of the bottom plate;

[0015] A flow dividing protrusion is arranged at the opening of the flow channel.

[0016] According to a further technical solution, the diverter protrusion is in the shape of a triangular prism.

[0017] According to a further technical solution, a plurality of heat-conducting metal rods are provided on the side surface of the inner cover, and two ends of the heat-conducting metal rods are respectively in contact with the coolant in the flow channel 1 and the flow channel 2.

[0018] A further technical solution is that a sealing bracket is provided between the inner cover and the outer cover, the sealing bracket, the outer wall of the inner cover and the inner wall of the outer cover enclose a pressurized chamber, and the water inlet hole and the water inlet port are provided corresponding to the pressurized chamber;

[0019] The water outlet is communicated with the second flow channel, and the outer cover is provided with a water outlet.

[0020] A further technical solution also includes a semiconductor cooling plate, wherein the hot surface of the semiconductor cooling plate is in contact with the heat conducting part.

[0021] A further technical solution also includes a lamp bead copper plate, which is arranged around the semiconductor refrigeration plate.

[0022] Beneficial effects of the present invention:

[0023] The present invention provides

[0024] The present invention adopts a pump-free design, and the inner cover and the outer cover are a sleeve structure, which can greatly reduce the overall thickness, making it lighter, thinner and simpler. In addition, the design of the flow channel 1 and the flow channel 2 can realize the process of absorbing heat twice, which can improve the utilization rate of the coolant and the overall heat dissipation effect.

[0025] Under the internal pressure, bubbles can pass through the through hole, that is, from one flow channel 1 to another adjacent flow channel 1 through the through hole, and at the same time, larger bubbles are divided into small bubbles, thereby achieving the purpose of eliminating bubbles accumulated in the corners, and the small bubbles entering the other flow channel 1 can also move along the flow direction of the coolant and finally be discharged to the outside and enter the circulation.

[0026] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 : A three-dimensional structural diagram of an embodiment of the present invention.

[0028] Figure 2 : A three-dimensional cross-sectional view of an embodiment of the present invention.

[0029] Figure 3 : Disassembly diagram of embodiment 1 of the present invention.

[0030] Figure 4 : Schematic diagram of coolant flow in embodiment 1 of the present invention.

[0031] Figure 5 : 3D structure diagram of embodiment 2 of the present invention.

[0032] Figure 6 : A three-dimensional cross-sectional view of embodiment 2 of the present invention.

[0033] Figure 7 : Disassembly diagram of embodiment 2 of the present invention.

[0034] Figure 8 :Application state diagram of the present invention

[0035] Figure markings: 1-heat conducting part, 11-heat conducting plate, 12-bottom plate, 21-inner cover, 22-water inlet, 23-water outlet, 24-heat conducting metal rod, 31-outer cover, 32-water inlet, 33-water outlet, 4-heat sinking fins, 51-flow channel one, 52-flow channel opening, 53-through hole, 54-flow channel two, 55-diverter boss, 56-sealing bracket, 57-boosting chamber, 6-semiconductor cooling plate, 7-lamp bead copper plate. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0037] Please refer to Figure 1-8 ;

[0038] The water cooling head described in the present invention is a non-pump structure, and its usage is the same as that of the products in the prior art. The cooling liquid is driven to circulate by an external pump body, so as to remove bubbles accumulated in the water cooling head during use and maintain the heat dissipation effect. Specifically, it comprises a heat conducting part 1, an inner cover 21 and an outer cover 31. The heat conducting part 1 is in contact with a heat source, and is used to absorb the heat of the heat source to achieve the effect of heat dissipation, such as the central processing unit of a computer. Of course, in the existing products, semiconductor cooling sheets are also used to dissipate heat from the heat source, and then the water cooling head dissipates heat from the hot surface of the semiconductor cooling sheet, and the principle is the same.

[0039] Embodiment 1, refer to Figure 1-Figure 4 ;

[0040] A plurality of heat dissipation fins 4 are arranged in parallel and offset on one surface of the heat conducting part 1, and the other surface is in contact with the heat source. The outer periphery of the inner cover 21 is sealed and connected to the surface of the heat conducting part 1, and the inner wall of the inner cover 21 is sealed and connected to the edge of each heat dissipation fin 4, so that a flow channel 51 is formed between two adjacent heat dissipation fins 4, and a flow channel opening 52 is formed at the offset of two adjacent heat dissipation fins 4. Assuming that the heat dissipation fins 4 are rectangular, three edges of the heat dissipation fins 4 are exposed. In one of the methods, a plurality of embedding grooves are arranged on the inner wall of the inner cover 21, and the embedding grooves correspond to the upper sides of the heat dissipation fins 4 and the sides away from the flow channel opening 52. At the same time, sealing glue is applied in the embedding grooves, so that a flow channel 51 is formed between two adjacent heat dissipation fins 4. In this embodiment, the heat conducting part 1 and the heat dissipation fins 4 are made of metal material, and the inner cover 21 can be made of metal material or plastic material with high thermal conductivity, wherein the high thermal conductivity material is a metal oxide, graphite fiber or carbon with thermal conductivity added to ordinary plastic. The plastic composite material composed of fibers and the like, the thermal conductivity of the composite material can reach 3-30W / (m·k). When it is made of metal material, its sealing can be ensured by laser welding. If it is made of plastic material, a first embedding groove adapted to the bottom surface of the inner cover 21 can be set on the surface of the heat conducting part 1, and then the sealing glue is applied to bond the inner cover 21 to the heat conducting part 1; a through hole 53 is provided on the heat dissipating fin 4 near the corner, a plurality of conical water inlet holes 22 are provided on one side of the inner cover 21, and a water outlet 23 is provided on the other side; the outer cover 31 is located on the outer side of the inner cover 21, and is sealed and connected with the surface of the heat conducting part 1, so that a flow channel 2 54 is formed between the outer cover 31 and the inner cover 21, and a water inlet 32 ​​is provided on the outer cover 31. The water outlet 23 in this embodiment has multiple implementation methods, one of which is to provide a water outlet pipe on the side away from the water inlet hole 22, and the water outlet pipe runs through the outer cover 31 and extends to the outside, and of course the water outlet pipe and the outer cover 31 are sealed and waterproofed.

[0041] In normal use of the product, there are usually three ways of placement: horizontal, sideways or inclined. The bubbles are usually generated by the water ripples stirred up by the water pump in the process of coolant circulation, and then circulated into the flow channel 51. Another situation is that in the process of heat release, the heat dissipation fins 4 instantly evaporate a small amount of coolant to form gas due to the high heat generation; no matter which way the bubbles are formed, some of the small bubbles will gather together to form large bubbles, and finally accumulate at the corners of the flow channel 51, narrowing the space at the corners of the flow channel 51, causing the circulation to be not smooth, resulting in affecting the heat dissipation effect, and it is difficult to remove the bubbles at the corners.

[0042] Based on the above structure, it is assumed that the water-cooled head is used in a side-placed manner, and the initial state is that the flow channel 1 51 and the flow channel 2 54 are filled with coolant. First, the coolant enters the flow channel 2 54 from the water inlet 32 ​​of the shell, and the flow channel 2 54 completely wraps the outer side of the inner cover 21. The surface of the inner cover 21 will also emit heat, and the temperature of the coolant entering from the outside is relatively low, so the coolant in the flow channel 2 54 absorbs the heat emitted by the inner cover 21 and absorbs heat for the first time, and then enters the flow channel 1 51 from the water inlet 22 under the action of the internal pressure and contacts with the heat dissipation fins 4 for the second heat absorption. The temperature of the heat dissipation fins 4 is much higher than the temperature of the outer surface of the inner cover 21, so after the first heat absorption, it will not affect the heat absorption effect of the coolant on the heat dissipation fins 4; the circulation speed in the current water cooling system is relatively fast, and the heat absorption of the coolant on the heat dissipation fins 4 is limited. The present invention can realize the process of two heat absorptions through the design of the flow channel 1 51 and the flow channel 2 54, which can improve the utilization rate of the coolant and also improve the overall heat dissipation effect;

[0043] In the present invention, the method of entering the flow channel 1 51 is through a plurality of conical water inlet holes 22. If the entering coolant itself contains relatively large bubbles, the large bubbles can be separated into a plurality of small bubbles through the plurality of water inlet holes 22 before entering the flow channel 1 51. The conical design makes the contact surface between the large bubbles and the water inlet holes 22 gradually smaller, making it easier to separate. It should be noted that some bubbles may accumulate in the flow channel 2 54 and cannot enter the flow channel 1 51. However, the heat dissipation of the water cooling head mainly depends on the flow channel 1 51, and the flow channel 2 54 is wrapped around the outer periphery of the inner cover 21, so it will not affect the entry of the coolant into the flow channel 1 51.

[0044] Preferably, a small hole can be provided at the corner of the outer cover 31, which is usually sealed with a sealing plug. After using it for a period of time, the user can choose the time for maintenance by himself. The water cooling head can be disassembled and laid on its side with the small hole facing upward. If there are bubbles, they will naturally gather in the small hole. Then the sealing plug can be opened and the gas can be sucked out with a syringe. After the liquid overflows, the small hole can be re-sealed with the sealing plug. Of course, the coolant needs to be replenished regularly.

[0045] After the coolant enters the flow channel 51, some small bubbles will not accumulate but will be directly discharged along the flow channel 51, while some small bubbles and some bubbles generated in the flow channel 51 will gather together and stay at the corners of the flow channel 51. At this time, the flow of water cannot drive the bubbles to move, but the bubbles can pass through the through hole 53 under the internal pressure, that is, from one flow channel 51 to another adjacent flow channel 51 through the through hole 53, and at the same time, the larger bubbles are divided into small bubbles, so as to achieve the purpose of eliminating the bubbles accumulated at the corners, and the small bubbles entering the other flow channel 51 can also move with the flow direction of the coolant, and finally be discharged to the outside and enter the circulation;

[0046] Moreover, each heat dissipating fin 4 is provided with a through hole 53 so that the bubbles accumulated in the flow channel 51 can be effectively cleared, thereby maintaining the smooth flow of the coolant and the heat dissipation effect. Preferably, the through hole 53 is a conical hole and has a plurality of through holes distributed in a ring array, which can more effectively divide the large bubbles.

[0047] When placed on its side, the water outlet 23 is preferably arranged upward, which is more conducive to the discharge of bubbles. In addition, the present invention adopts a pump-free design, and the inner cover 21 and the outer cover 31 are a nested structure, which can greatly reduce the overall thickness, making it lighter and simpler, while realizing two heat absorption processes to improve the heat dissipation effect.

[0048] One embodiment of the heat conducting part 1 of the present invention specifically includes a heat conducting sheet 11 and a bottom plate 12; the heat conducting sheet 11 and the heat dissipating fins 4 are integrally formed of metal material; the bottom plate 12 is injection molded, the heat dissipating fins 4 extend out of the other side of the bottom plate 12, the heat conducting sheet 11 is closely attached to the bottom surface of the bottom plate 12, and a flow dividing protrusion 55 is provided at the position of the flow channel opening 52;

[0049] In this embodiment, the bottom plate 12 may be provided with a plurality of holes for the plurality of heat dissipating fins 4 to pass through, and then the heat conducting sheet 11 contacts the bottom surface of the bottom plate 12; or a relatively large through hole is provided on the bottom plate 12, and a step is provided at the periphery of the through hole, and the periphery of the heat conducting sheet 11 contacts the step and is sealed and connected. In this way, the coolant can directly contact the heat conducting sheet 11, thereby improving the heat absorption effect;

[0050] In addition, the diverter boss 55 can be integrally injection molded with the base plate 12, or when the inner cover 21 is made of plastic material, the diverter boss 55 can also be integrally injection molded with the inner cover 21. Regardless of which forming method is used, the two ends of the diverter boss 55 will eventually contact the end surface of the base plate 12 and the upper end of the inner cover 21 respectively.

[0051] Assuming that there are bubbles trapped at the corner of flow channel 51, the corner is opposite to the flow channel opening 52. When the coolant enters from the flow channel opening 52, it will be divided into two streams with faster flow rates by the diverter protrusion 55. One stream directly enters the flow channel 51, and the other stream enters the corner and then enters the flow channel 51. The fluid entering the corner can impact the bubbles trapped at the corner. After continuous flushing, the bubbles at the corner can be dispersed so that they can enter the flow channel 51 and follow the flow of the coolant. Even if the bubbles cannot be dispersed, they can be flushed away from the corner and finally discharged to the outside of the water cooling head and enter the circulation. In addition, it can also avoid the problem of bubbles staying for a long time and becoming larger and squeezing the flow channel opening 52, causing the coolant to flow poorly. Preferably, the diverter protrusion 55 is in the shape of a triangular prism, which is conducive to diverting the coolant and reducing resistance.

[0052] In the embodiment of the present invention, the inner cover 21 is formed by injection molding. During the production process, a plurality of heat-conducting metal rods 24 are placed therein, so that the plurality of heat-conducting metal rods 24 are fixed on both sides of the formed inner cover 21. Both ends of the heat-conducting metal rods 24 can contact the coolant in the flow channel 1 51 and the flow channel 2 54.

[0053] In one of the embodiments, the end of the heat-conducting metal rod 24 near the flow channel 1 51 can be flush with the side wall of the inner cover 21 to avoid obstructing the flow of the coolant, and the other end can extend into the flow channel 2 54. During the circulation process, the temperature inside the inner cover 21 is higher than the temperature of the flow channel 2 54, and the coolant circulates at a relatively fast speed, and the utilization rate is not high. Based on the secondary heat absorption process in the above embodiment to take away the heat from the heat source, some heat can be conducted out with the help of a number of heat-conducting metal rods 24, thereby further improving the utilization efficiency of the coolant. Within the same circulation time, more heat is absorbed, thereby improving the heat dissipation effect.

[0054] Example 2, refer to Figure 5-Figure 7 ;

[0055] A sealing bracket 56 is provided between the inner cover 21 and the outer cover 31. The sealing bracket 56, the outer wall of the inner cover 21 and the inner wall of the outer cover 31 enclose a pressurization chamber 57. The water inlet hole 22 and the water inlet port 32 are provided corresponding to the pressurization chamber 57. The outer cover 31 covers the outer periphery of the inner cover 21 to form five areas, namely, front, rear, left, right and upper areas, which are also areas for forming the flow channel 2 54. The water inlet hole 22 is provided on one side of the inner cover 21. Then, the pressurization space only encloses one of the spaces above to form the pressurization space. The space for the external coolant to move becomes smaller, so that the pressure of the external coolant entering the pressurization cavity becomes larger, so that the cooling can enter the flow channel 1 51 more quickly from the plurality of water inlet holes 22, and the external coolant is prevented from being retained in the flow channel 2 54 for a long time.

[0056] Based on this embodiment, the nature of secondary heat absorption also changes. The external coolant first enters the flow channel 1 51 to absorb heat from the heat sink 4. Since the coolant flows at a fast rate, the temperature of the coolant after absorbing the heat from the heat sink 4 is not too high. Then the coolant flows out from the water outlet 23 and enters the flow channel 2 54 to absorb heat from the outer surface of the inner cover 21 for a secondary time, thereby improving the utilization rate of the coolant, and finally flows out from the water outlet 33 on the outer cover 31.

[0057] In the embodiment of the present invention, a semiconductor cooling plate is also included, and the hot surface of the semiconductor cooling plate is in contact with the heat conducting part; and a lamp bead copper plate is also included, and the lamp bead copper plate is arranged around the semiconductor cooling plate.

[0058] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0059] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. An ultra-thin high-efficiency bubble-removing water cooling head, characterized in that: It comprises a heat conducting part (1), an inner cover (21) and an outer cover (31); A plurality of heat dissipation fins (4) are arranged in parallel and staggered manner on a surface of the heat conducting portion (1); The outer periphery of the inner cover (21) is sealed to the surface of the heat conducting part (1), and the inner wall of the inner cover (21) is sealed to the edge of each heat dissipation fin (4), so that a flow channel (51) is formed between two adjacent heat dissipation fins (4), a flow channel opening (52) is formed at the offset between two adjacent heat dissipation fins (4), a through hole (53) is provided on the heat dissipation fin (4) near the corner, a plurality of conical water inlet holes (22) are provided on one side of the inner cover (21), and a water outlet (23) is provided on the other side; The outer cover (31) is located outside the inner cover (21) and is sealed to the surface of the heat conducting part (1), so that a second flow channel (54) is formed between the outer cover (31) and the inner cover (21). A water inlet (32) is provided on the outer cover (31).

2. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 1, characterized in that: The through holes (53) are tapered holes, and a plurality of through holes (53) are distributed in a ring array.

3. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 1, characterized in that: The inner cover (21) is made of a high thermal conductivity plastic material or a metal material.

4. An ultra-thin high-efficiency bubble-removing water cooling head according to claim 1 or 3, characterized in that: The heat conducting part (1) comprises a heat conducting sheet (11) and a bottom plate (12); The heat conducting sheet (11) and the heat dissipating fins (4) are integrally formed of a metal material; The bottom plate (12) is injection molded, the heat dissipation fins (4) extend out of the bottom plate (12) to the other side, and the heat conducting sheet (11) is in close contact with the bottom surface of the bottom plate (12); A flow dividing protrusion (55) is provided at the position of the flow channel opening (52).

5. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 4, characterized in that: The diverter convex column (55) is in the shape of a triangular prism.

6. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 3, characterized in that: A plurality of heat-conducting metal rods (24) are provided on the side of the inner cover (21), and two ends of the heat-conducting metal rods (24) are respectively in contact with the cooling liquid in the flow channel 1 (51) and the flow channel 2 (54).

7. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 4, characterized in that: A sealing bracket (56) is provided between the inner cover (21) and the outer cover (31); the sealing bracket (56), the outer wall of the inner cover (21) and the inner wall of the outer cover (31) together form a pressurization chamber (57); the water inlet hole (22) and the water inlet port (32) are provided corresponding to the pressurization chamber (57); The water outlet (23) is in communication with the second flow channel (54), and the outer cover (31) is provided with a water outlet (33).

8. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 1, characterized in that: It also includes a semiconductor cooling sheet, wherein the heat surface of the semiconductor cooling sheet is in contact with the heat conducting part.

9. The ultra-thin high-efficiency bubble-removing water cooling head according to claim 8, characterized in that: It also includes a lamp bead copper plate, which is arranged around the semiconductor refrigeration plate.

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