A semiconductor lead frame processing equipment for automobile interactive taillights and its products

Abstract

The present invention discloses a semiconductor lead frame processing equipment for an automobile interactive taillight and its products, which relate to the field of semiconductor technology, including a workbench unit, an integrated processing unit, and a plurality of integrated processing units are arranged on the top of the operating table. The downward movement of the push-out bottom plate inside the integrated processing unit completes the downward positioning of the coil inside the positioning frame and limits the downward pressure of the electric test pin pre-welded on the top of the coil, thereby reducing the offset of the electric test pin during the stamping process of the stamping block, and the pressing of the stamping block and the electric test pin will form an injection channel that is connected to the construction cavity, thereby completing the stamping modeling, that is, the coil on the top surface of the middle sleeve hollow block, the push-out bottom plate, the stamping block, the surrounding plate, and the bearing plate forms a sealed mold cavity between the construction cavity and the positioning frame, so that the side wall of the reaction cup and the mouth of the reaction cup are injection molded inside the mold cavity, thereby reducing the time consumption of re-clamping and re-injection molding to form the side wall of the reaction cup and the mouth of the reaction cup after stamping.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor lead frame processing device for an automobile interactive taillight and a product thereof. Background Art

[0002] The lead frame is one of the key components in semiconductor packaging, used to carry the chip and provide a path for electrical connection to the external circuit. The lead frame is usually made of metal (such as copper or iron-nickel alloy) and is formed into a specific shape through a precision stamping or etching process.

[0003] Chinese patent CN113257799A discloses a semiconductor lead frame, including a pad, multiple pins and an insulating adhesive layer, wherein: the pad is used to place the chip, multiple pins are located on the outside of the pad, and the pins are used to connect to the chip; an insulating interval is formed between any adjacent pins and between the pad and the pin, and the insulating adhesive layer is arranged in the insulating interval to fix the pad and the multiple pins. In this scheme, the proposed semiconductor lead frame has the chip fixed on the pad, and the pad is specifically used for heat dissipation and conductive separation, which can achieve a higher power combination; and the pad and the multiple pins are fixed by the insulating adhesive layer, which is convenient for production and manufacturing, and has high production efficiency.

[0004] Chinese patent CN104209409B discloses a lead frame stamping die, including a punch, a stripper plate located below the punch, and a die below the stripper plate. The punch is provided with a plurality of positioning pins for circular hole positioning, the stripper plate is provided with through holes for the positioning pins to pass through, the punch is provided with a plurality of mounting grooves, a spring is provided in the mounting groove, the lower end of the spring is connected to the upper end of the positioning pin, the upper end of the spring is fixedly connected to the punch through a screw plug, and the die is provided with a plurality of avoidance holes for avoiding the positioning pins. The first positioning pin is a tapered guide pin, and its lower end has a conical positioning portion that gradually increases from bottom to top. The aperture of the stamped circular hole is larger than the minimum diameter of the positioning portion and smaller than the maximum diameter of the positioning portion. The other positioning pins are straight-insertion guide pins. By adopting the first tapered guide pin and the other straight-insertion guide pins for positioning, accurate positioning can be ensured, and interference between the guide pins can be ensured, thereby improving product processing accuracy.

[0005] The above patents and prior art have the following problems:

[0006] After the existing lead frame is stamped, it is necessary to use resin to relatively isolate the various pads and electrical test pins of the lead frame, which requires the stamped lead frame to be removed and placed in a specific mold for injection molding to form a resin isolation belt. The process is cumbersome and time-consuming to transport. In addition, the lead frame is relatively precise, and deviations are prone to occur during transportation and injection molding after stamping, resulting in deviations in the surface distribution of the isolation belt formed by injection molding on the lead frame, resulting in insufficient isolation protection between the pads and the electrical test pins, and poor distribution of the resin isolation belt on the surface of the lead frame. Summary of the invention

[0007] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0008] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0009] A semiconductor lead frame processing device for an automobile interactive taillight includes a work frame unit, wherein the work frame unit includes a frame body, three sets of operating tables are arranged on the top of the frame body, and a pressing piece is installed on the top of the operating table, including:

[0010] Integrated processing unit, a plurality of integrated processing units are arranged on the top of the operating table;

[0011] The integrated processing unit comprises a punching block movably arranged on the top of the frame, an outward push top plate, a middle sleeve hollow block and an outward push bottom plate are movably arranged on the outside of the punching block, a surrounding plate is fixed around the surface of the punching block, a control pressing block is movably arranged inside the punching block, a positioning frame is arranged on the outside of the punching block and the control pressing block, a bearing plate is arranged inside the positioning frame, and a molding cavity is arranged inside the bearing plate;

[0012] The middle sleeve hollow block, the outward push bottom plate, the stamping block, the surrounding plate and the coiled material on the top surface of the supporting plate form a structural cavity which is positioned by stamping by the stamping block. The structural cavity is movably connected to the control pressing block inside the stamping block. The bottom of the supporting plate is provided with trimming pieces 1 and 2 for assisting injection molding of plastic.

[0013] As a preferred solution of the semiconductor lead frame processing equipment for automobile interactive taillights of the present invention, the middle operating table of the three groups of operating tables is fixedly connected to the top of the raised frame through the output shaft of the top pressing piece thereof, and the adjacent raised frames are fixedly connected through inner connecting rods;

[0014] The left and right operating tables in the three groups of operating tables are fixedly connected to the top of the inner concave frame through the output shaft of the top pressing piece, and the adjacent inner concave frames are fixedly connected through the outer connecting rod;

[0015] The integrated processing unit further comprises a middle push rod and an outer push rod, wherein the middle push rod is fixedly arranged at the bottom of the raised frame, and the outer push rod is fixedly arranged at the bottom of the recessed frame.

[0016] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: a pressing plate is fixedly connected to the bottom of the middle push rod, a movable rod is fixedly connected to the bottom of the pressing plate, and the pressing plate is fixedly connected to the horizontal plate through the movable rod at the bottom thereof;

[0017] The bottom of the transverse plate is fixedly connected with a control pressing block.

[0018] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: a stamping block is movably arranged at the bottom of the pressing plate, an open cavity is opened inside the stamping block, and an opening is arranged on the surface of the stamping block corresponding to the open cavity, the bottom surface of the surrounding plate is fixedly connected to the stamping block through the inner concave cavity, and the inner concave cavity is fixedly arranged at the opening of the open cavity;

[0019] The transverse plate is movably arranged inside the inner concave cavity and the open cavity, and the control pressing block at the bottom of the transverse plate is movably arranged inside the open cavity, and the width of the control pressing block is the same as that of the punching block.

[0020] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: the left and right sides of the pressing plate are symmetrically provided with extension rods, the bottom of the outer side of the extension rod is downwardly extended with a vertical rod, and the extension rod is movable through the notch on the surface of the mounting plate through the vertical rod;

[0021] A convex arc block is fixedly mounted on the surface of the vertical rod opposite to the punching block.

[0022] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: an outward push top plate is fixedly arranged at the bottom of the outward push rod, a movable opening is opened in the middle of the outward push top plate, and the bottom of the outward push top plate is fixedly connected to the outward push bottom plate through a middle sleeve hollow block;

[0023] The middle sleeve hollow block and the outer push bottom plate are provided with an active cavity inside, and the active opening and the active cavity are provided with a punching block inside, and the punching block is movably connected with the active cavity through the surrounding plate;

[0024] The outer contour shape of the outward-pushing bottom plate is consistent with the inner contour shape of the positioning frame.

[0025] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: the positioning frame is fixedly connected to the top surface of the second cavity extraction plate through the reinforcement rod on its outer surface;

[0026] The inner movably clamped bearing plate of the positioning frame has a downwardly recessed molding cavity on the top surface of the bearing plate, a downwardly recessed transverse groove is provided inside the molding cavity, a fixed frame is fixedly installed on the bottom of the bearing plate, the bottom of the fixed frame is fixedly connected to the output shaft of the telescopic member, and the fixed frame is fixedly connected to the mounting plate via the telescopic member.

[0027] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: the length side and the width side of the bottom of the positioning frame are respectively installed with a first cavity extraction plate and a second cavity extraction plate, the first cavity extraction plate and the second cavity extraction plate are fixedly installed on the top of the mounting plate, and the first cavity extraction plate and the second cavity extraction plate are conductively connected with the extraction cavity at the bottom of the mounting plate, and the side of the extraction cavity is installed with an exhaust member;

[0028] The first and second cavity extraction plates are provided with openings on the surfaces opposite to the positioning frame, and a second trimming piece is installed at the opening of the second cavity extraction plate;

[0029] The second trimming piece comprises a vertical bevel knife and a bottom connecting plate. The second trimming piece is fixedly connected to the bottom connecting plate through its opening. The vertical bevel knife is vertically fixedly installed on the opposite surface of the bottom connecting plate and the positioning frame.

[0030] As a preferred solution of the semiconductor lead frame processing equipment for the automobile interactive taillight of the present invention, wherein: the opening of the cavity extraction plate 1 is movably provided with a trimming piece 1, the trimming piece 1 and the trimming piece 2 have the same structure, the top surface of the cavity extraction plate 1 is provided with a vertical through groove, the top of the trimming piece 1 is fixedly installed with a folding plate, the folding plate is movably provided inside the vertical through groove, and the opposite surface of the folding plate and the vertical rod is rotatably provided with a rolling wheel;

[0031] A vertical plate is fixedly installed on the top of the cavity extraction plate and on the side opposite to the vertical rod, and an elastic member is elastically installed between the vertical plate and the folding plate;

[0032] An injection molded part is fixedly installed on the side of the extraction and storage cavity, and the injection molded part is conductively connected to the inner side of the positioning frame through a discharge pipe.

[0033] Another object of the present invention is to provide a semiconductor lead frame processing product for an automotive interactive taillight in view of the deficiencies of the prior art, comprising:

[0034] A workpiece, the workpiece comprising a lead frame, a plurality of pads being arranged in the middle of the lead frame, and adjacent pads being isolated by an isolation belt;

[0035] A reaction cup side wall is arranged on the top of the lead frame, and a reaction cup mouth is arranged on the reaction cup side wall extending downward and being integrally formed. A reaction cup mouth is arranged on the surface of the lead frame excluding the pad part, and an electric test pin is embedded between the reaction cup side wall and the reaction cup mouth and the lead frame, and chamfers are arranged on the four corners of the reaction cup side wall.

[0036] Beneficial effects of the present invention:

[0037] First, the downward positioning of the coil inside the positioning frame is completed by moving the push-out bottom plate downward, and the downward pressure of the electric test pin pre-welded on the top of the coil is limited, so as to reduce the displacement of the electric test pin during the stamping process of the stamping block, and the pressing of the stamping block and the electric test pin will form an injection channel connected to the construction cavity, thereby completing the stamping modeling, that is, the coil between the middle sleeve hollow block, the push-out bottom plate, the stamping block, the surrounding plate and the top surface of the carrier plate forms a sealed mold cavity between the construction cavity and the positioning frame, so that the side wall of the reaction cup and the mouth of the reaction cup are injection molded inside the mold cavity, thereby reducing the time-consuming need to re-clamp and re-inject to form the side wall and mouth of the reaction cup after stamping.

[0038] Second, the stamping block is pre-contacted with the coil by the push-out bottom plate, so that when the push-out bottom plate presses down, the electric test foot on the top of the coil will pre-press and position the coil on the top of the carrier plate, thereby reducing the subsequent stamping shape deviation of the coil, and then the outer periphery of the coil is restricted by the positioning frame, and the push-out bottom plate moves downward so that the coil is restricted between the push-out bottom plate and the carrier plate, so that the coil is fully restricted and positioned, reducing subsequent stamping deviation.

[0039] 3. The side wall and the mouth of the reaction cup are formed by relying on the outer side of the stamping block, so that the offset error between the pads punched by the stamping block and the side wall and the mouth of the reaction cup is small, so that the overall molding quality of the lead frame is high.

[0040] Fourth, the controlled pressing block periodically beats the injection plastic at the top of the construction cavity, thereby forming a strong local vibration force, and the beating position is located in the middle of the construction cavity, that is, the center of the mold cavity, combined with the overall vibration caused by the bottom impact of the trimming piece, so that the injection plastic is fully distributed inside the mold cavity, thereby reducing the occurrence of cracks in the isolation zone and the mouth of the reaction cup, so that the mouth of the reaction cup is formed between adjacent electrical test pins to play a role in fixing and isolating the electrical test pins.

[0041] 5. The output shaft of the shrinking part and the pressing part move downward synchronously, so that the edge of the injection molding coil in the restricted state will contact the processing port surrounded by the trimming part 1 and the trimming part 2. At this time, the middle part of the injection molding coil is limited and supported by the top of the carrier plate, the punching block and the bottom of the outward push bottom plate, so that the vertical bevel knives of the trimming part 1 and the trimming part 2 are in stable contact with the outer side of the carrier plate, so that the vertical bevel knife scrapes the periphery of the reaction cup mouth of the coil on the top of the carrier plate, so that the excess injection plastic around the reaction cup mouth of the coil on the surface of the carrier plate is scraped off, and the design of the vertical bevel knife can only shear and scrape the reaction cup mouth that exceeds the vertical plane of the vertical bevel knife, so that the outer side surface of the electrical test pin on the inner side of the reaction cup mouth is scraped out and trimmed flush with the reaction cup mouth.

[0042] 6. The contact surface between the vertical bevel knife and the mouth of the reaction cup is a plane. It will only be trimmed when the residual or flash of the injection plastic exceeds its vertical plane. Therefore, the trimming of the mouth of the reaction cup and the electrical test pin on the outside of the carrier plate is completed without excessively cutting the periphery of the mouth of the reaction cup on the vertical plane. During the trimming process, the vacuum part will be started to transmit negative pressure suction through the internal space of the chamber plate 1 and the chamber plate 2, so that the suction force of the vacuum part will suck the waste trimmed on the top of the trimming part 1 and the trimming part 2 into the inside of the suction chamber, thereby reducing the impact of the trimming waste on the subsequent processing and ensuring the appearance quality of the workpiece.

[0043] 7. The load-bearing plate, the punching block, the push-out bottom plate and the positioning frame are independently movable structures, so that they can be independently movable after being assembled to form the mold cavity and the injection molding is completed, so that each can be reset, and the molded reaction cup side wall and the reaction cup mouth can be disassembled and demolded.

[0044] 8. The side wall of the reaction cup provides effective direction identification, which helps automated production. The chamfer can improve the optical path design inside the LED package, help light to be more effectively reflected from the LED chip and directed to the outside, thereby improving light output efficiency and uniformity, reducing stress concentration, and improving the fluidity and filling of the packaging material, thereby facilitating subsequent assembly. The solder pad is recessed relative to the lead frame, thereby increasing the heat dissipation effect of the solder pad.

[0045] 9. The electric test pin is wrapped inside the mouth of the reaction cup, and the electric test pin is made flush with the outside of the mouth of the reaction cup through trimming, which increases the stability of the electric test pin. The overall mechanical strength and vibration resistance of the package can be enhanced by surrounding the mouth of the reaction cup, ensuring the structural stability of the LED in harsh environments or after long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following is a brief introduction to the drawings required for describing the embodiment, wherein:

[0047] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0048] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of part A;

[0049] Figure 3 It is a schematic diagram of the connection structure of adjacent raised frames and adjacent recessed frames of the present invention;

[0050] Figure 4 It is a schematic diagram of the connection of the integrated processing unit of the present invention;

[0051] Figure 5 It is a schematic diagram of the internal integral structure connection between the active cavity and the punching block of the present invention;

[0052] Figure 6 This is a schematic diagram of the internal structure connection of the integrated processing unit of the present invention;

[0053] Figure 7 for Figure 6 A schematic diagram of the enlarged structure of part B;

[0054] Figure 8 It is a schematic diagram of the splitting of the active cavity and the punching block of the present invention;

[0055] Fig. 9 This is a schematic diagram of the top view of the carrier plate of the present invention;

[0056] Fig.10 It is a schematic diagram of the disassembly of the carrying plate and the positioning frame of the present invention;

[0057] Fig.11 This is a schematic diagram of the connection of the processing port structure of the present invention;

[0058] Fig.12 This is a schematic diagram of the internal structure connection of the cavity extraction plate 1 of the present invention;

[0059] Fig.13 This is a schematic diagram of the internal structure connection of the second drawer plate of the present invention;

[0060] Fig.14 for Fig.13 A schematic diagram of the enlarged structure of the middle C part;

[0061] Fig.15 This is a schematic diagram of the connection of the second structure of the trimming member of the present invention;

[0062] Fig.16 This is a schematic diagram of the lead frame structure connection of the present invention;

[0063] Fig.17 This is a schematic diagram of the side wall of the reaction cup of the present invention from a side perspective;

[0064] Fig.18 It is a schematic diagram of the internal connection between the welding pad, the isolation belt and the mouth of the reaction cup of the present invention.

[0065] In the figure:

[0066] 1. Work frame unit; 101. Frame body; 102. Operation table; 1021. Pressing member; 1022. Raised frame; 10221. Inner connecting rod; 1023. Inner recessed frame; 10231. Outer connecting rod;

[0067] 2. Integrated processing unit; 201. Middle push rod; 202. Outer push rod; 2021. Outer push top plate; 20211. Movable opening; 2022. Middle sleeve hollow block; 20221. Movable cavity; 2023. Outer push bottom plate; 203. Pressing plate; 2031. Movable rod; 20311. Horizontal plate; 20312. Control pressing block; 2032. Extension rod; 20321. Vertical rod; 20322. Protruding arc block; 2033. Stamping block; 2034. Open cavity; 20341. Inner concave cavity; 2035. Surrounding plate; 2036. Construction cavity; 204. Mounting plate; 2041. Extraction cavity ; 20411, exhaust part; 2042, injection molding part; 20421, discharge pipe; 2043, telescopic part; 20431, fixed frame; 205, positioning frame; 2051, reinforcement rod; 206, bearing plate; 2061, molding cavity; 2062, horizontal fixed groove; 207, cavity extraction plate 1; 2071, vertical through groove; 2072, folding plate; 20721, rolling wheel; 2073, vertical plate; 2074, elastic part; 2075, finishing part 1; 208, cavity extraction plate 2; 2081, finishing part 2; 20811, vertical oblique knife; 20812, bottom connecting plate; 209, processing port;

[0068] 3. Processing parts; 301. Lead frame; 302. Solder pad; 303. Isolation tape; 304. Side wall of reaction cup; 3041. Mouth of reaction cup; 305. Electrical test pin. DETAILED DESCRIPTION

[0069] Embodiment 1: Figure 1-15 As shown, a semiconductor lead frame processing device for an automobile interactive taillight includes a work frame unit 1, wherein the work frame unit 1 includes a frame body 101, and three sets of operating tables 102 are arranged on the top of the frame body 101. A pressing piece 1021 is installed on the top of the operating table 102, including:

[0070] Integrated processing unit 2: a plurality of integrated processing units 2 are arranged on the top of the operating table 102, and the number of the integrated processing units 2 is preferably 7 or an odd number;

[0071] The integrated processing unit 2 includes a punching block 2033 movably arranged on the top of the frame 101, an outward push top plate 2021, a middle sleeve hollow block 2022 and an outward push bottom plate 2023 are movably arranged on the outer side of the punching block 2033, a surrounding plate 2035 is fixed around the surface of the punching block 2033, a control pressing block 20312 is movably arranged inside the punching block 2033, a positioning frame 205 is arranged on the outer side of the punching block 2033 and the control pressing block 20312, a bearing plate 206 is arranged inside the positioning frame 205, and a molding cavity 2061 is arranged inside the bearing plate 206;

[0072] The middle sleeve hollow block 2022, the outward push bottom plate 2023, the punching block 2033, the surrounding plate 2035 and the coiled material on the top surface of the carrier plate 206 form a construction cavity 2036 which is positioned by punching by the punching block 2033. The interior of the construction cavity 2036 contains injection plastic. The construction cavity 2036 is movably connected to the control pressing block 20312 inside the punching block 2033. The bottom of the carrier plate 206 is provided with a trimming piece 1 2075 and a trimming piece 2 2081 for assisting injection plastic molding. The trimming piece 1 2075 and the trimming piece 2 2081 for assisting injection plastic molding trim the edge of the reaction cup mouth 3041 formed by injection molding on the surface of the carrier plate 206, and the trimming piece 1 2075 will also intermittently impact the fixed frame 20431 at the bottom of the carrier plate 206, so that the injection plastic is evenly dispersed by impact vibration.

[0073] like Figure 1-3 As shown, the middle operating table 102 among the three sets of operating tables 102 is fixedly connected to the top of the raised frame 1022 through the output shaft of the top pressing piece 1021 thereof, and the adjacent raised frames 1022 are fixedly connected through the inner connecting rod 10221;

[0074] The left and right operating tables 102 of the three operating tables 102 are fixedly connected to the top of the inner recessed frame 1023 through the output shaft of the top pressing piece 1021, and the adjacent inner recessed frames 1023 are fixedly connected through the outer connecting rod 10231;

[0075] The integrated processing unit 2 further includes a middle push rod 201 and an outer push rod 202 . The middle push rod 201 is fixedly disposed at the bottom of the raised frame 1022 , and the outer push rod 202 is fixedly disposed at the bottom of the recessed frame 1023 .

[0076] like Figure 4-8 As shown, the bottom of the middle push rod 201 is fixedly connected with a pressing plate 203, the bottom of the pressing plate 203 is fixedly connected with a movable rod 2031, and the pressing plate 203 is fixedly connected through the movable rod 2031 and the horizontal plate 20311 at the bottom thereof;

[0077] A control pressing block 20312 is fixedly connected to the bottom of the transverse plate 20311 .

[0078] A punching block 2033 is movably provided at the bottom of the pressing plate 203, an open cavity 2034 is provided inside the punching block 2033, and an opening is provided on the surface of the punching block 2033 corresponding to the open cavity 2034. The bottom surface of the surrounding plate 2035 is fixedly connected to the punching block 2033 through an inner concave cavity 20341, and the inner concave cavity 20341 is fixedly provided at the opening of the open cavity 2034, so that the opening of the open cavity 2034 above the bottom surface of the surrounding plate 2035 on the surface of the punching block 2033 is closed by the inner concave cavity 20341, so that the opening of the open cavity 2034 below the bottom surface of the surrounding plate 2035 is not blocked;

[0079] The transverse plate 20311 is movably arranged inside the inner concave cavity 20341 and the open cavity 2034, and the control pressure block 20312 at the bottom of the transverse plate 20311 is movably arranged inside the open cavity 2034, and the width of the control pressure block 20312 is the same as that of the stamping block 2033, so that the side of the control pressure block 20312 and the side of the stamping block 2033 are coplanar.

[0080] The middle push rod 201 drives the pressing plate 203 downward, which makes the pressing plate 203 fit against the top of the punching block 2033 and pushes it downward, and the middle push rod 201 drives the pressing plate 203 upward, which makes the movable rod 2031 at the bottom of the pressing plate 203 drive the cross plate 20311 to rise, and then when the cross plate 20311 moves to the top of the inner concave cavity 20341, the top of the cross plate 20311 and the top of the inner concave cavity 20341 will fit and engage, so that the cross plate 20311 is restricted by the top of the inner concave cavity 20341, thereby making the cross plate 20311 rise and eventually drive the inner concave cavity 20341 and the punching block 2033 to rise, while the cross plate 20311 is not When reaching the top of the inner concave cavity 20341, the up and down movement of the cross plate 20311 and the control pressure block 20312 inside the open cavity 2034 will not drive the stamping block 2033 to move, and by increasing the weight of the metal material of the stamping block 2033 itself, the stamping block 2033 will not produce additional shaking during the movement of the cross plate 20311 and the control pressure block 20312. By designing the length of the movable rod 2031, when the pressing plate 203 covers the top of the stamping block 2033, the bottom of the control pressure block 20312 is flush with the bottom of the stamping block 2033 or the bottom surface of the control pressure block 20312 exceeds the bottom surface of the stamping block 2033.

[0081] Extension rods 2032 are symmetrically arranged on the left and right sides of the pressing plate 203. A vertical rod 20321 is installed on the bottom of the outer side of the extension rod 2032, and the extension rod 2032 is movable through the notch on the surface of the mounting plate 204 through the vertical rod 20321.

[0082] A raised arc block 20322 is fixedly mounted on the surface of the vertical rod 20321 opposite to the punching block 2033 .

[0083] An outward push top plate 2021 is fixedly provided at the bottom of the outward push rod 202, a movable opening 20211 is opened in the middle of the outward push top plate 2021, and the bottom of the outward push top plate 2021 is fixedly connected through a middle sleeve hollow block 2022 and an outward push bottom plate 2023;

[0084] The middle sleeve hollow block 2022 and the outward push bottom plate 2023 are provided with an active cavity 20221 inside, and a punching block 2033 is movably provided inside the active opening 20211 and the active cavity 20221, and the punching block 2033 is movably connected to the active cavity 20221 through the surrounding plate 2035;

[0085] The outer contour of the outward-pushing bottom plate 2023 matches the inner contour of the positioning frame 205 , and the match is preferably a clearance fit or an interference fit.

[0086] like Figure 9-10 As shown, the positioning frame 205 is fixedly connected to the top surface of the second cavity extraction plate 208 through the reinforcement rod 2051 on its outer surface;

[0087] The internal movable card of the positioning frame 205 is connected with a carrier plate 206, and the external contour shape of the carrier plate 206 is consistent with the internal contour shape of the positioning frame 205, and the consistency is preferably a clearance fit or an interference fit. The top surface of the carrier plate 206 is recessed downward with a molding cavity 2061, and the interior of the molding cavity 2061 is recessed downward and provided with a transverse groove 2062. The bottom of the carrier plate 206 is fixedly installed with a fixed frame 20431, and the bottom of the fixed frame 20431 is fixedly connected to the output shaft of the telescopic member 2043. The fixed frame 20431 is fixedly connected to the mounting plate 204 through the telescopic member 2043. The lower pressing member 1021 and the telescopic member 2043 are preferably oil cylinders or air cylinders, and are powered by external energy and controlled by a PLC circuit.

[0088] Operation process:

[0089] The coil to be processed is placed in the space surrounded by the positioning frame 205 and the carrier plate 206, so as to complete the restriction and positioning of the coil to be processed. It should be noted that an electric test pin 305 is welded on the top of the coil. When the coil is restricted, the pressing piece 1021 on the top of the frame 101 is activated, so that the output shaft of the pressing piece 1021 of the outer operating table 102 pushes the inner recessed frame 1023 at the bottom thereof to move downward, and the pressing piece 1021 of the middle operating table 102 moves accordingly. The output shaft of the frame 101 pushes the protruding frame 1022 at the bottom thereof downward, and the downward movement of the inner recessed frame 1023 drives the inner recessed frame 1023 at the top of the adjacent integrated processing unit 2 to move downward through the outer connecting rod 10231. At the same time, the downward movement of the protruding frame 1022 drives the adjacent protruding frame 1022 to move downward through the inner connecting rod 10221, so that the multiple protruding frames 1022 and the inner recessed frames 1023 in the frame body 101 are close to the integrated processing unit 2, which is convenient for subsequent multi-station processing;

[0090] When the inner recessed frame 1023 moves downward, the outer push rod 202 and the outer push bottom plate 2023 at the bottom thereof will preliminarily contact the pressing plate 203 and the stamping block 2033 at the bottom of the middle push rod 201 with the coil, so that the outer push rod 202 drives the outer push top plate 2021, the middle sleeve hollow block 2022 and the outer push bottom plate 2023 to move downward, and finally the downward movement of the outer push bottom plate 2023 will gradually approach and finally fit to the inner side of the positioning frame 205, so that the outer push bottom plate 2023 will be pressed to the positioning frame 205. The top surface of the electric test pin 305 at the top of the coil inside the frame 205 is squeezed and sealed by the outward-pushing bottom plate 2023, so that the adjacent electric test pins 305 are covered by the outward-pushing bottom plate 2023 to form an injection channel, so that the formed reaction cup mouth 3041 is flush with the top of the electric test pin 305, and the injection molding material inside the injection molding channel can fix and isolate the adjacent electric test pins 305 after subsequent cooling and shaping. The injection molding material is preferably resin.

[0091] The stamping block 2033 is pre-contacted with the coil by the outward push bottom plate 2023, so that when the outward push bottom plate 2023 presses down on the top of the coil, the electric test pin 305 will pre-press and position the coil on the top of the carrier plate 206, thereby reducing the subsequent stamping shape deviation of the coil, and then the outer periphery of the coil is restricted by the positioning frame 205, and the outward push bottom plate 2023 moves downward so that the coil is restricted between the outward push bottom plate 2023 and the carrier plate 206, so that the coil is fully restricted and positioned, reducing the subsequent stamping deviation;

[0092] The middle push rod 201 drives the pressing plate 203 to move downward, which drives the punching block 2033 and the control pressing block 20312 to move downward along the active cavity 20221. The downward movement of the punching block 2033 will be pressed against the surface of the active cavity 20221 through the surrounding plate 2035, thereby reducing the left and right shaking of the punching block 2033 during the downward movement, so that the punching block 2033 can press the coil at the bottom to enter the interior of the molding cavity 2061, so that the molding cavity 2061 and the punching block The control block 2033 and the control pressing block 20312 are combined to stamp the middle of the coil to form a pad 302. At this time, the bottom of the control pressing block 20312 and the stamping block 2033 are flush, and the control pressing block 20312 can also be made to protrude from the stamping block 2033, so that the control pressing block 20312 and the horizontal groove 2062 are combined, so that the inside of the molding cavity 2061 is depressed downward to form a groove, thereby increasing the area of ​​the back side of the coil stamping, and increasing the heat dissipation area of ​​the back side of the lead frame 301 formed by the coil stamping;

[0093] At this time, the middle sleeve hollow block 2022, the outer push bottom plate 2023, the stamping block 2033, the surrounding plate 2035 and the coiled material on the top surface of the carrier plate 206 form a construction cavity 2036, and the channel between the construction cavity 2036 and the positioning frame 205 is connected by the injection molding channel between the adjacent electrical test pins 305. After the coiled material is downwardly molded in the molding cavity 2061, the lower pressing piece 1021 at the middle end of the top of the frame body 101 continues to start, so that the lower pressing piece 1021 drives the raised frame 1022 and the middle push rod 201 to lift upward, so that the middle push rod 201 drives the pressing plate 203 and the bottom of the pressing plate 203 The movable rod 2031 is lifted upward, and the lifting height is below the bottom surface of the surrounding plate 2035, so that the horizontal plate 20311 at the bottom of the movable rod 2031 drives the control pressing block 20312 to shrink into the open cavity 2034 along the inner concave cavity 20341, so that a rectangular open space is formed between the bottom of the control pressing block 20312 and the open cavity 2034 below the bottom surface of the surrounding plate 2035, so that the rectangular open space connects the construction cavities 2036, so that the isolation belt 303 is formed inside the rectangular open space, thereby increasing the transfer efficiency of the injection plastic between the construction cavities 2036;

[0094] The reaction cup side wall 304 and the reaction cup mouth 3041 are formed by relying on the outer side of the punching block 2033, so that the offset error between the pad 302 punched by the punching block 2033 and the reaction cup side wall 304 and the reaction cup mouth 3041 is small, so that the overall molding quality of the lead frame 301 is high;

[0095] The groove formed by the combination of the transverse groove 2062 and the coil can make the injection plastic in the rectangular opening space flow into the concave space formed by the transverse groove 2062 on the surface of the coil, so that the injection plastic increases the spatial combination area with the coil in the fixed cavity 2061, so that the isolation belt 303 can be more firmly and accurately distributed between the large and small pads 302;

[0096] Therefore, when the stamping is completed, a rectangular opening space is formed by lifting the control pressing block 20312, so that the flow channel of the construction cavity 2036 inside the mold cavity is increased, and the injection molded part 2042 is started at this time, so that the injection molded part 2042 is injected into the inner side of the positioning frame 205 through the discharge pipe 20421, so that the mold cavity inside the positioning frame 205 is injected with injection plastic, and the injection plastic inside the positioning frame 205 will enter the interior of the construction cavity 2036 along the injection channel surrounded by the outward push bottom plate 2023 and the adjacent electrical test pin 305. The lifting of the control pressing block 20312 inside the stamping block 2033 between the construction cavity 2036 forms a rectangular opening space at the bottom thereof, so that the flow rate of the injection plastic is increased;

[0097] In summary, the downward movement of the outward-pushing bottom plate 2023 completes the downward positioning of the coil inside the positioning frame 205 and limits the downward pressure of the electric test pin 305 pre-welded on the top of the coil, thereby reducing the displacement of the electric test pin 305 during the stamping process of the stamping block 2033, and the pressing of the stamping block 2033 and the electric test pin 305 will form an injection channel that is connected to the construction cavity 2036, thereby completing the stamping modeling, that is, the coil between the middle sleeve hollow block 2022, the outward-pushing bottom plate 2023, the stamping block 2033, the surrounding plate 2035 and the top surface of the carrier plate 206 forms a sealed mold cavity between the construction cavity 2036 and the positioning frame 205, so that the reaction cup side wall 304 and the reaction cup cup mouth 3041 are injection molded inside the mold cavity, thereby reducing the time required to re-clamp and re-inject to form the reaction cup side wall 304 and the reaction cup cup mouth 3041 after stamping.

[0098] Example 2: Reference Figure 9-15 As shown, this embodiment is different from the first embodiment in that:

[0099] The length side and width side of the bottom of the positioning frame 205 are respectively installed with a first extraction plate 207 and a second extraction plate 208, the first extraction plate 207 and the second extraction plate 208 are fixedly installed on the top of the mounting plate 204, and the first extraction plate 207 and the second extraction plate 208 are conductively connected with the extraction and storage chamber 2041 at the bottom of the mounting plate 204, and the side of the extraction and storage chamber 2041 is installed with an air extraction member 20411, and the air extraction member 20411 is preferably a vacuum pump, and is powered by an external energy source and controlled by a PLC circuit;

[0100] The first and second cavity extraction plates 207 and 208 are provided with openings on the surfaces opposite to the positioning frame 205, and the second trimming piece 2081 is installed at the opening of the second cavity extraction plate 208;

[0101] The second trimming piece 2081 includes a vertical bevel knife 20811 and a bottom connecting plate 20812. The second trimming piece 2081 is fixedly connected to the bottom connecting plate 20812 through its opening. The vertical bevel knife 20811 is vertically fixedly installed on the surface opposite to the positioning enclosure 205 of the bottom connecting plate 20812. The vertical bevel knife 20811 is composed of a plane opposite to the positioning enclosure 205 and an inclined bevel blade between the plane and the bottom connecting plate 20812.

[0102] The opening of the chamber extraction plate 207 is movably provided with a trimming piece 2075, and the trimming piece 2075 has the same structure as the trimming piece 2081. The top surface of the chamber extraction plate 207 is provided with a vertical through groove 2071, and the top of the trimming piece 2075 is fixedly installed with a folding plate 2072, and the folding plate 2072 is movably provided inside the vertical through groove 2071, and the folding plate 2072 is rotatably provided with a rolling wheel 20721 on the opposite surface of the vertical rod 20321;

[0103] A vertical plate 2073 is fixedly installed on the top of the cavity extraction plate 207 and on the side opposite to the vertical rod 20321. An elastic member 2074 is elastically installed between the vertical plate 2073 and the folding plate 2072. The elastic member 2074 is preferably a spring. Under the pull of the elastic member 2074, the edge of the vertical bevel knife 20811 in the trimming piece 2075 is flush with the length side of the carrying plate 206, so that the trimming piece 1 2075 and the trimming piece 2081 are surrounded by a processing port 209. The internal shape of the processing port 209 is consistent with the external shape of the carrying plate 206. A gap is set between the positioning frame 205 and the trimming piece 1 2075 and the trimming piece 2081.

[0104] An injection molded part 2042 is fixedly installed on the side of the extraction chamber 2041, and the injection molded part 2042 is conductively connected to the inner side of the positioning frame 205 through a discharge pipe 20421. The injection molded part 2042 is preferably a small injection molding machine, and the output end of the injection molding machine is conductively connected to the inner side of the positioning frame 205 through the discharge pipe 20421.

[0105] The rest of the structure is the same as that of the first embodiment.

[0106] Operation process:

[0107] During the injection molding process, the lower pressing piece 1021 can be started, so that the lower pressing piece 1021 drives the middle push rod 201 and the control pressing block 20312 to reciprocate up and down, and then the control pressing block 20312 that reciprocates up and down can intermittently beat the injection plastic inside the rectangular opening space connected to the structural cavity 2036 at its bottom, so that the injection plastic can flow quickly, and the up and down reciprocating motion of the pressing plate 203 can also drive the vertical rod 20321 to reciprocate up and down through the extension rod 2032, so that the convex surface of the vertical rod 20321 The arcing block 20322 intermittently contacts the rolling wheel 20721, so that the height of the convex arc block 20322 and the height of the vertical rod 20321 are switched, and the folding plate 2072 on the inner side of the rolling wheel 20721 in contact with the convex arc block 20322 and the vertical rod 20321 is intermittently pushed to make a linear reciprocating motion, so that the trimming piece 2075 at the bottom of the folding plate 2072 intermittently hits the side of the fixed frame 20431 connected to the shaping cavity 2061, so that the bottom of the shaping cavity 2061 is vibrated;

[0108] It should be noted that the periodic beating of the control block 20312 at the top of the construction cavity 2036 directly beats the injection plastic, thereby forming a strong local vibration force, and the beating position is located in the middle of the construction cavity 2036, that is, the center of the mold cavity, combined with the overall vibration caused by the bottom impact of the trimming piece 2075, so that the injection plastic is fully distributed inside the mold cavity, thereby reducing the occurrence of cracks inside the isolation belt 303 and the reaction cup mouth 3041, so that the reaction cup mouth 3041 is formed between adjacent electrical test pins 305 to play a role in fixing and positioning the electrical test pins 305.

[0109] It should be noted that the injection channel formed by the outward-pushing bottom plate 2023 and the adjacent electric test pin 305 on the top of the coil corresponds to the discharge port of the discharge pipe 20421, that is, the electric test pin 305 extends along the outside of the carrier plate 206 to the inside of the construction cavity 2036. When the stamping block 2033 is driven to move into the molding cavity 2061 through the pressing plate 203, the vertical rod 20321 will pass through the through groove on the surface of the mounting plate 204 and move downward, thereby reducing the offset of the stamping block 2033 during the stamping process. During this process, the rolling wheel 20721 and the vertical rod 20321 are always in contact, and the downward movement of the vertical rod 20321 will also cause the convex arc block 20322 to move toward the rolling wheel 20721. When the stamping block 2033 approaches and stamps the coil on the top of the molding cavity 2061, the raised arc block 20322 has been in contact with the rolling wheel 20721, thereby pushing the folding plate 2072 and the trimming piece 2075 to contact the fixed frame 20431 at the bottom of the molding cavity 2061, so that the rolling wheel 20721 on the outside of the folding plate 2072 is pushed by the raised arc block 20322 to push the trimming piece 2075 and the fixed frame 20431 to contact and collide to generate vibration. When the rolling wheel 20721 is not in contact with the raised arc block 20322, the trimming piece 2075 is reset under the pulling force of the elastic piece 2074 and surrounds the processing port 209 with the trimming piece 2081.

[0110] When the injection molding is completed and the preset molding time is over, the output shaft of the telescopic member 2043 and the pressing member 1021 drive the middle push rod 201 and the outer push rod 202 to move downward synchronously. At this time, the rolling wheel 20721 passes over the convex arc block 20322 and continues to contact the vertical rod 20321, so that the trimming member 1 2075 is reset and the trimming member 2 2081 surrounds the processing port 209;

[0111] Thus, the output shaft of the telescopic member 2043 and the pressing member 1021 move downward synchronously, so that the injection molding coil, i.e., the workpiece 3, which is restricted at the top of the carrier plate 206 and the bottom of the punching block 2033 and the outward push bottom plate 2023, can move downward in a restricted state, so that demoulding is completed between the carrier plate 206 and the positioning frame 205;

[0112] As the output shaft of the telescopic member 2043 and the pressing member 1021 move downward synchronously, the edge of the injection molding coil in the restricted state will contact the processing port 209 surrounded by the trimming member 1 2075 and the trimming member 2 2081. At this time, the middle part of the injection molding coil is limited and supported by the top of the carrier plate 206 and the bottom of the punching block 2033 and the outward push bottom plate 2023, so that the vertical inclined blades 20811 of the trimming member 1 2075 and the trimming member 2 2081 are in stable contact with the outer side of the carrier plate 206, thereby The vertical bevel knife 20811 is used to scrape the periphery of the reaction cup opening 3041 of the coiled material on the top of the carrier plate 206, so that the excess injection plastic around the reaction cup opening 3041 of the coiled material on the surface of the carrier plate 206 is scraped off, and the vertical bevel knife 20811 is designed to shear and scrape only the reaction cup opening 3041 that is beyond the vertical plane of the vertical bevel knife 20811, so that the outer side surface of the electric test pin 305 inside the reaction cup opening 3041 is scraped off and trimmed to be flush with the reaction cup opening 3041;

[0113] The contact surface between the vertical bevel knife 20811 and the reaction cup mouth 3041 is a plane, and it will only be trimmed when the residual plastic or flash exceeds its vertical plane, thereby completing the trimming of the reaction cup mouth 3041 and the electrical test pin 305 on the outside of the carrier plate 206 without excessively cutting the periphery of the reaction cup mouth 3041 on the vertical plane. During the trimming process, the vacuum member 20411 will be started to transmit negative pressure suction through the internal space of the chamber plate 1 207 and the chamber plate 2 208, so that the suction force of the vacuum member 20411 will suck the waste trimmed on the top of the trimming member 1 2075 and the trimming member 2 2081 into the inside of the extraction chamber 2041, thereby reducing the impact of the trimming waste on subsequent processing and ensuring the appearance quality of the workpiece.

[0114] The supporting plate 206, the punching block 2033, the push-out bottom plate 2023 and the positioning frame 205 are independently movable structures, and can also move independently after being assembled to form the mold cavity and completing the injection molding, so that each can be reset, and the formed reaction cup side wall 304 and the reaction cup mouth 3041 can be disassembled and demolded.

[0115] Example 3: Reference Figure 16-18 As shown, this embodiment is different from the above embodiment in that:

[0116] A workpiece 3, the workpiece 3 comprising a lead frame 301, a plurality of pads 302 are arranged in the middle of the lead frame 301, and adjacent pads 302 are isolated by isolation strips 303;

[0117] A reaction cup side wall 304 is provided on the top of the lead frame 301, and the reaction cup side wall 304 extends downward and is integrally formed with a reaction cup mouth 3041. The surface of the lead frame 301 excluding the pad 302 is provided with a reaction cup mouth 3041, and an electric test pin 305 is embedded between the reaction cup side wall 304 and the reaction cup mouth 3041 and the lead frame 301. The four corners of the reaction cup side wall 304 are provided with chamfers, and the chamfers are preferably C-angles. The reaction cup side wall 304 and the reaction cup mouth 3041 are preferably made of resin material.

[0118] The side wall 304 of the reaction cup provides effective direction identification, which helps automated production. The chamfer can improve the light path design inside the LED package, help the light to be more effectively reflected from the LED chip and directed to the outside, thereby improving the light extraction efficiency and uniformity, reducing stress concentration, and improving the fluidity and filling of the packaging material, thereby facilitating subsequent assembly. The solder pad 302 is recessed relative to the lead frame 301, thereby increasing the heat dissipation effect of the solder pad 302.

[0119] The electric test pin 305 is wrapped inside the reaction cup mouth 3041, and the electric test pin 305 is made flush with the outside of the reaction cup mouth 3041 through trimming, thereby increasing the stability of the electric test pin 305. The overall mechanical strength and vibration resistance of the package can be enhanced by surrounding the reaction cup mouth 3041, thereby ensuring the structural stability of the LED in harsh environments or after long-term use.

[0120] The rest of the structures are the same as those of the first and second embodiments.

Claims

1. A semiconductor lead frame processing device for an automobile interactive taillight, comprising a work frame unit (1), the work frame unit (1) comprising a frame body (101), three sets of operating tables (102) are arranged on the top of the frame body (101), a pressing piece (1021) is installed on the top of the operating table (102), and the characteristics are: include: An integrated processing unit (2), wherein a plurality of integrated processing units (2) are arranged on the top of the operating table (102); The integrated processing unit (2) comprises a punching block (2033) movably arranged on the top of the frame (101); an outward push top plate (2021), a middle hollow block (2022) and an outward push bottom plate (2023) are movably arranged on the outside of the punching block (2033); a surrounding plate (2035) is fixedly arranged around the surface of the punching block (2033); a control pressing block (20312) is movably arranged inside the punching block (2033); a positioning frame (205) is arranged on the outside of the punching block (2033) and the control pressing block (20312); a bearing plate (206) is arranged inside the positioning frame (205); and a molding cavity (2061) is arranged inside the bearing plate (206); The middle sleeve hollow block (2022), the outward push bottom plate (2023), the punching block (2033), the surrounding plate (2035) and the coiled material on the top surface of the bearing plate (206) form a construction cavity (2036) which is positioned by punching by the punching block (2033); the construction cavity (2036) is movably connected to a control pressing block (20312) inside the punching block (2033); and a trimming piece 1 (2075) and a trimming piece 2 (2081) for assisting injection molding are provided at the bottom of the bearing plate (206).

2. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 1, characterized in that: The middle operating table (102) of the three groups of operating tables (102) is fixedly connected to the top of the raised frame (1022) via the output shaft of the top pressing piece (1021) thereof, and adjacent raised frames (1022) are fixedly connected via an inner connecting rod (10221); The left and right operating tables (102) of the three groups of operating tables (102) are fixedly connected via the output shaft of the top pressing piece (1021) and the top of the inner recessed frame (1023), and adjacent inner recessed frames (1023) are fixedly connected via an external connecting rod (10231); The integrated processing unit (2) further comprises a middle push rod (201) and an outer push rod (202), wherein the middle push rod (201) is fixedly arranged at the bottom of the raised frame (1022), and the outer push rod (202) is fixedly arranged at the bottom of the recessed frame (1023).

3. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 2, characterized in that: The bottom of the middle push rod (201) is fixedly connected to a pressing plate (203), the bottom of the pressing plate (203) is fixedly connected to a movable rod (2031), and the pressing plate (203) is fixedly connected via the movable rod (2031) and the horizontal plate (20311) at its bottom; A control pressing block (20312) is fixedly connected to the bottom of the transverse plate (20311).

4. The semiconductor lead frame processing equipment for automobile interactive taillights as claimed in claim 3, characterized in that: A punching block (2033) is movably provided at the bottom of the pressing plate (203), an open cavity (2034) is provided inside the punching block (2033), and an opening is provided on the surface of the punching block (2033) corresponding to the open cavity (2034); the bottom surface of the surrounding plate (2035) is fixedly connected to the punching block (2033) via an inner concave cavity (20341), and the inner concave cavity (20341) is fixedly provided at the opening of the open cavity (2034); The transverse plate (20311) is movably disposed inside the inner concave cavity (20341) and the open cavity (2034), and the control pressing block (20312) at the bottom of the transverse plate (20311) is movably disposed inside the open cavity (2034), and the width of the control pressing block (20312) is the same as that of the punching block (2033).

5. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 4, characterized in that: Extension rods (2032) are symmetrically arranged on the left and right sides of the pressing plate (203); a vertical rod (20321) is installed on the bottom of the outer side of the extension rod (2032) extending downward; the extension rod (2032) is movably passed through the surface notch of the mounting plate (204) via the vertical rod (20321); A convex arc block (20322) is fixedly mounted on the surface of the vertical rod (20321) opposite to the punching block (2033).

6. The semiconductor lead frame processing equipment for automobile interactive taillights according to any one of claims 2 to 5, characterized in that: An outward push top plate (2021) is fixedly provided at the bottom of the outward push rod (202), a movable opening (20211) is opened in the middle of the outward push top plate (2021), and the bottom of the outward push top plate (2021) is fixedly connected via a middle sleeve hollow block (2022) and an outward push bottom plate (223); An active cavity (20221) is provided inside the middle sleeve hollow block (2022) and the outward push bottom plate (2023); a punching block (2033) is movably provided inside the active opening (20211) and the active cavity (20221); and the punching block (2033) is movably connected to the active cavity (20221) via the surrounding plate (2035); The outer contour shape of the outward-pushing bottom plate (2023) matches the inner contour shape of the positioning frame (205).

7. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 6, characterized in that: The positioning frame (205) is fixedly connected to the top surface of the second cavity extraction plate (208) via a reinforcement rod (2051) on its outer surface; The positioning frame (205) is movably connected to a carrier plate (206) inside, the top surface of the carrier plate (206) is recessed downward to form a molding cavity (2061), the interior of the molding cavity (2061) is recessed downward to form a transverse groove (2062), a fixed frame (20431) is fixedly installed at the bottom of the carrier plate (206), the bottom of the fixed frame (20431) is fixedly connected to the output shaft of the telescopic member (2043), and the fixed frame (20431) is fixedly connected to the mounting plate (204) via the telescopic member (2043).

8. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 7, characterized in that: A first extraction chamber plate (207) and a second extraction chamber plate (208) are respectively installed on the length side and the width side of the bottom of the positioning frame (205); the first extraction chamber plate (207) and the second extraction chamber plate (208) are fixedly installed on the top of the mounting plate (204); the first extraction chamber plate (207) and the second extraction chamber plate (208) are conductively connected to the extraction chamber (2041) at the bottom of the mounting plate (204); and a suction member (20411) is installed on the side of the extraction chamber (2041); The first and second cavity extraction plates (207 and 208) are provided with openings on surfaces opposite to the positioning frame (205), and a second trimming piece (2081) is installed at the opening of the second cavity extraction plate (208); The second trimming piece (2081) comprises a vertical bevel knife (20811) and a bottom connecting plate (20812); the second trimming piece (2081) is fixedly connected to the bottom connecting plate (20812) via its opening; the vertical bevel knife (20811) is vertically fixedly mounted on the opposite surface of the bottom connecting plate (20812) and the positioning frame (205).

9. The semiconductor lead frame processing equipment for automobile interactive taillights according to claim 8, characterized in that: The opening of the first cavity extraction plate (207) is movably provided with a trimming piece (2075), the trimming piece (2075) and the trimming piece (2081) have the same structure, a vertical through groove (2071) is provided on the top surface of the first cavity extraction plate (207), a folding plate (2072) is fixedly installed on the top of the first trimming piece (2075), the folding plate (2072) is movably provided inside the vertical through groove (2071), and a rolling wheel (20721) is rotatably provided on the surface opposite to the vertical rod (20321); A vertical plate (2073) is fixedly mounted on the top of the first cavity extraction plate (207) and on the side opposite to the vertical rod (20321), and an elastic member (2074) is elastically mounted between the vertical plate (2073) and the folding plate (2072); An injection molded part (2042) is fixedly mounted on the side of the extraction and storage cavity (2041), and the injection molded part (2042) is conductively connected to the inner side of the positioning enclosure frame (205) via a discharge pipe (20421).

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