Semiconductor memory assembly equipment

Abstract

The present invention relates to the field of semiconductor assembly technology, specifically to an assembly device for semiconductor storage, including an assembly device for assembling semiconductor storage, the assembly device consisting of a first feeding part, a receiving part, a second feeding part and an injection molding part; the first feeding part includes a first U-shaped frame, a first support frame welded to the lower surface of the first U-shaped frame, a conveying roller rotatably mounted inside the first U-shaped frame, and a transmission structure arranged on the first U-shaped frame to drive the first U-shaped frame; the receiving part includes a machine base and a gantry, and a receiving structure arranged on the machine base to receive the semiconductor storage. The assembly device for semiconductor storage of the present invention realizes the synchronous use of the receiving structure and the suction structure through a linkage structure, thereby realizing the linkage when the receiving part is used, realizing an orderly and quick feeding process, and continuously packaging the semiconductor, thereby achieving the advantage of good assembly effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor assembly, and in particular to an assembly device for a semiconductor memory. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials.

[0003] After semiconductor production is completed, it needs to be packaged. Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips through the dicing process, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuits. The outer ring of the chip is glued to ensure the firmness of the chip, and then the independent chip is encapsulated and protected by injection molding resin shells.

[0004] When the above processing method is adopted, during the process of chip outer ring glue filling and injection molding resin shell, the chip needs to be transferred between various workstations by a robotic arm. Manual loading and replacement is inefficient and slow, while loading by a robotic arm is expensive and costly. In addition, the robotic arm needs to rotate continuously to adjust the direction and load the materials in sequence, which reduces the efficiency of semiconductor packaging and brings inconvenience to packaging.

[0005] Therefore, there is an urgent need to improve the semiconductor memory assembly device to solve the above-mentioned problems. Summary of the invention

[0006] The object of the present invention is to provide an assembly device for a semiconductor memory, which has the advantage of good assembly effect.

[0007] In order to achieve the above-mentioned purpose, the main technical scheme adopted by the present invention includes: an assembly device for semiconductor memory, including an assembly device for assembling semiconductor memory, the assembly device is composed of a first feeding part, a receiving part, a second feeding part and an injection molding part;

[0008] The first feeding part includes a first U-shaped frame, a first support frame welded to the lower surface of the first U-shaped frame, a conveying roller rotatably installed inside the first U-shaped frame, and a transmission structure arranged on the first U-shaped frame to drive the first U-shaped frame;

[0009] The material receiving part includes a machine base and a gantry, a material receiving structure arranged on the machine base for receiving materials from the semiconductor storage device, a material suction structure for conveying the semiconductor storage device, a first driving structure for lifting the material suction structure, and a linkage structure for linking and cooperating the material receiving structure and the material suction structure;

[0010] The second feeding part includes a supporting assembly and a second driving structure installed inside the supporting assembly to collect the conductor storage;

[0011] The injection molding component comprises a telescopic frame detachably mounted on the outside of the supporting assembly and a glue injection head arranged on the telescopic frame.

[0012] Preferably, the transmission structure includes a first stepper motor fixedly mounted on the upper surface of the first U-shaped frame, a connecting shaft installed inside the first U-shaped frame through a bearing and fixed to the top of the conveying roller, a first transmission wheel fixedly mounted on the output shaft of the first stepper motor, and a second transmission wheel and a third transmission wheel fixedly mounted on the top of the connecting shaft.

[0013] Preferably, there are several conveying rollers and connecting shafts, and the several conveying rollers are equidistantly distributed inside the first U-shaped frame, and a first belt is installed between the first transmission wheel and the leftmost second transmission wheel and between two adjacent second transmission wheels and the third transmission wheel.

[0014] Preferably, the material receiving structure includes a material receiving plate arranged above one side of the machine base, a bottom plate fixedly installed inside the machine base, a rotating disk and a lever installed on the bottom plate through bearings, two shaft rods symmetrically installed on the outside of the rotating disk, a connecting strip arranged inside the machine base, a sliding block fixedly installed between the connecting strip and the material receiving plate, and a connecting piece installed on the outside of the connecting strip and abutting against one of the shaft rods, a pushing rod penetrating the inside of the lever is fixedly installed on the outside of the connecting strip, four guide wheels distributed in a rectangular shape are rotatably installed on one side of the material receiving plate close to the rotating disk, the connecting strip is in rolling contact with the four guide wheels, and a guide rod penetrating the inside of the sliding block is fixedly installed on the inside of the machine base.

[0015] Preferably, the material suction structure includes an installation box arranged between the machine base and the gantry, a suction cup arranged outside the installation box, a first eccentric block, a second eccentric block and an abutment plate arranged inside the installation box, a return spring fixedly installed between the bottom wall of the installation box and the lower surface of the abutment plate, a connecting rod fixedly installed on the lower surface of the abutment plate and extending to the outside of the installation box, a buffer spring and a telescopic rod fixedly installed between the connecting rod and the suction cup, the first eccentric block and the second eccentric block are both installed inside the installation box through a connecting rod, and two positioning grooves for placing objects are opened on the receiving plate, and buffer pads are installed on the inner sides of the two positioning grooves.

[0016] Preferably, the first driving structure includes an intermittent motor fixedly installed inside the installation box, a transmission wheel fixedly installed outside the two coupling rods, and a transmission belt transmission-connected between the two transmission wheels, and one end of the coupling rod of the first eccentric block is fixed to the output shaft of the intermittent motor.

[0017] Preferably, the linkage structure includes a driving motor fixedly installed inside the machine base, a first linkage rod and a second linkage rod installed on the base plate through bearings, and a linkage wheel fixedly installed on the outside of the first linkage rod and the second linkage rod, a linkage belt is transmission-connected between the two linkage wheels, the first linkage rod extends to the outside of the machine base and passes through the inside of the installation box and is rotatably connected to the gantry, the installation box is fixedly installed on the outer surface of the first linkage rod, and one end of the second linkage rod is fixed to the rotating disk.

[0018] Preferably, the support assembly includes a second U-shaped frame and a second support frame welded to the lower surface of the second U-shaped frame, the second driving structure includes a conveyor belt arranged inside the second U-shaped frame, a processing seat detachably mounted on the outside of the conveyor belt, a gear shaft installed between the left and right inner walls of the second support frame through bearings, a second stepper motor fixedly mounted on the inner bottom wall of the second support frame, a first driving wheel fixedly mounted on the output shaft of the second stepper motor and the outside of the gear shaft, and a second driving wheel symmetrically fixedly mounted on the outside of the gear shaft.

[0019] Preferably, a second belt is connected for transmission between the two first driving wheels, the number of the gear shafts is two, and a third belt is connected for transmission between the two second driving wheels opposite to each other on the left and right, a socket for disassembly and assembly is installed on the lower surface of the processing seat, and a plurality of adjustment grooves which are evenly distributed and matched with the sockets are opened inside the conveyor belt.

[0020] Preferably, the telescopic frame includes a telescopic sleeve fixedly installed on the outside of the second U-shaped frame by bolts and a telescopic plate slidably connected to the inside of the telescopic sleeve and extending to the outside thereof, and the telescopic sleeve and the telescopic plate are internally connected with adjusting pins for adjusting the height, and a material pipe connected to a glue injection head is fixedly installed inside the telescopic plate, and a solenoid valve is installed on the glue injection head.

[0021] The present invention has at least the following beneficial effects:

[0022] 1. The semiconductor storage assembly device uses a linkage structure to synchronize the material receiving structure and the material suction structure, thereby realizing the linkage when the material receiving part is used, realizing an orderly and fast material loading process, realizing reciprocating operation, and continuously packaging semiconductors, thereby achieving the advantage of good assembly effect.

[0023] 2. The semiconductor storage assembly device can prevent the telescopic cylinder from being damaged by excessive descent by installing a buffer spring and a telescopic rod. The semiconductor storage can be protected by installing a buffer pad to prevent damage to the semiconductor storage by impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1 A three-dimensional diagram of the overall structure of the semiconductor storage assembly device of the present invention;

[0026] Figure 2 It is a structural schematic diagram of a first embodiment of a semiconductor storage assembly device of the present invention;

[0027] Figure 3 For the present invention Figure 2 A is a schematic diagram of the enlarged structure shown;

[0028] Figure 4 It is a structural schematic diagram of a second embodiment of a semiconductor storage assembly device of the present invention;

[0029] Figure 5 It is a schematic diagram of the overall structure of the material connection structure of the semiconductor storage assembly device of the present invention;

[0030] Figure 6 It is a partial structural schematic diagram of the material connection structure of the semiconductor storage assembly device of the present invention;

[0031] Figure 7 A structural cross-sectional view of a mounting box for a semiconductor storage assembly device according to the present invention;

[0032] Figure 8 It is a partial structural schematic diagram of the material suction structure of the semiconductor storage assembly device of the present invention;

[0033] Fig. 9 A schematic diagram of the structure of a buffer pad of a semiconductor storage assembly device of the present invention;

[0034] Fig.10 It is a structural schematic diagram of a third embodiment of a semiconductor storage assembly device of the present invention;

[0035] Fig.11 For the present invention Fig.10 The enlarged structural schematic diagram of B is shown;

[0036] Fig.12 It is a structural schematic diagram of a processing base of a semiconductor storage assembly device of the present invention;

[0037] Fig.13 It is a structural schematic diagram of the injection molding part of the semiconductor storage assembly device of the present invention.

[0038] In the figure, 1, assembly device; 2, first feeding part; 201, first U-shaped frame; 202, first support frame; 203, conveying roller; 204, transmission structure; 2041, first stepper motor; 2042, connecting shaft; 2043, first transmission wheel; 2044, second transmission wheel; 2045, third transmission wheel; 2046, first belt; 3, material receiving part; 301, machine base; 302, material receiving structure; 3021, material receiving plate; 30211, positioning groove; 30212, buffer Punch pad; 3022, bottom plate; 3023, rotating disk; 3024, lever; 3025, shaft; 3026, connecting strip; 3027, slider; 3028, push rod; 3029, connector; 303, gantry; 304, suction structure; 3041, installation box; 3042, suction cup; 3043, first eccentric block; 3044, second eccentric block; 3045, abutment plate; 3046, return spring; 3047, connecting rod; 3048, buffer spring; 3049, telescopic rod; 305, first driving structure; 3051, intermittent motor; 3052, transmission wheel; 3053, transmission belt; 306, linkage structure; 3061, driving motor; 3062, first linkage rod; 3063, second linkage rod; 3064, linkage wheel; 3065, linkage belt; 307, guide wheel; 3071, guide rod; 4, second feeding part; 401, support assembly; 4011, second U-shaped frame; 4012, second support frame; 402, second driving structure Structure; 4021, conveyor belt; 40210, adjustment groove; 4022, processing seat; 40221, socket; 4023, gear shaft; 4024, second stepping motor; 4025, first driving wheel; 4026, second belt; 4027, second driving wheel; 4028, third belt; 5, injection molding part; 501, telescopic frame; 5011, telescopic sleeve; 5012, telescopic plate; 5013, adjustment pin; 502, injection head; 5021, material pipe; 5022, solenoid valve. DETAILED DESCRIPTION

[0039] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0040] like Figure 1 As shown, a semiconductor memory assembly device includes an assembly device 1 for assembling semiconductor storage, and the assembly device 1 is composed of a first feeding part 2, a receiving part 3, a second feeding part 4 and an injection molding part 5; the first feeding part 2, the receiving part 3 and the second feeding part 4 are set to have corresponding heights of a feeding end and a receiving end according to usage requirements. Embodiment 1:

[0041] In this embodiment, if Figure 1-Figure 3 As shown, the first feeding part 2 includes a first U-shaped frame 201, a first support frame 202 welded to the lower surface of the first U-shaped frame 201, a conveying roller 203 rotatably installed inside the first U-shaped frame 201, and a transmission structure 204 arranged on the first U-shaped frame 201 to drive the first U-shaped frame 201; the transmission structure 204 includes a first stepper motor 2041 fixedly installed on the upper surface of the first U-shaped frame 201, a connecting shaft 2042 installed inside the first U-shaped frame 201 through a bearing and fixed to the top of the conveying roller 203, a first transmission wheel 2043 fixedly installed on the output shaft of the first stepper motor 2041, a second transmission wheel 2044 and a third transmission wheel 2045 fixedly installed on the top of the connecting shaft 2042.

[0042] It should be noted that there are several conveying rollers 203 and connecting shafts 2042, and the several conveying rollers 203 are equidistantly distributed inside the first U-shaped frame 201, and a first belt 2046 is installed between the first transmission wheel 2043 and the leftmost second transmission wheel 2044 and between the two adjacent second transmission wheels 2044 and the third transmission wheel 2045.

[0043] The outer surface of the conveying roller 203 is provided with a tightening mechanism to facilitate better contact between the conveying roller 203 and the object, thereby improving the conveying effect. Embodiment 2:

[0044] For the transport of semiconductor storage, in this embodiment, as Figure 4-Figure 9As shown, the material receiving part 3 includes a machine base 301 and a gantry 303, a material receiving structure 302 arranged on the machine base 301 for receiving materials from the semiconductor storage device, a material suction structure 304 for conveying the semiconductor storage device, a first driving structure 305 used for lifting the material suction structure 304, and a linkage structure 306 for linkage and cooperation between the material receiving structure 302 and the material suction structure 304; the material receiving structure 302 includes a material receiving plate 3021 arranged on the upper side of the machine base 301, a bottom plate 3022 fixedly installed inside the machine base 301, a rotating disk 3023 and a lever 3024 installed on the bottom plate 3022 through a bearing, and a first driving structure 305 symmetrically installed outside the rotating disk 3023. The machine base 301 includes two shaft rods 3025, a connecting strip 3026 disposed inside the machine base 301, a slider 3027 fixedly installed between the connecting strip 3026 and the receiving plate 3021, and a connecting piece 3029 installed outside the connecting strip 3026 and abutting against one of the shaft rods 3025. A push rod 3028 penetrating the interior of the lever 3024 is fixedly installed outside the connecting strip 3026. Four guide wheels 307 distributed in a rectangular shape are rotatably installed on one side of the receiving plate 3021 close to the rotating disk 3023. The connecting strip 3026 is in rolling contact with the four guide wheels 307. Through the installation of the guide wheels 307, the connecting strip 3026 is linearly displaced and moved better. A guide rod 3071 penetrating the interior of the slider 3027 is fixedly installed inside the machine base 301 to enhance the displacement stability of the connecting strip 3026. A sliding opening for the movement of the slider 3027 is provided inside the machine base 301.

[0045] The material suction structure 304 includes an installation box 3041 disposed between the machine base 301 and the gantry 303, a suction cup 3042 disposed outside the installation box 3041, a first eccentric block 3043 disposed inside the installation box 3041, a second eccentric block 3044 and an abutment plate 3045, a return spring 3046 fixedly mounted between the inner bottom wall of the installation box 3041 and the lower surface of the abutment plate 3045, a connecting rod 3047 fixedly mounted on the lower surface of the abutment plate 3045 and extending to the outside of the installation box 3041, a buffer spring 3048 fixedly mounted between the connecting rod 3047 and the suction cup 3042, and a telescopic rod 3049. The buffer spring 3048 surrounds the outside of the telescopic rod 3049, and through the installation of the telescopic rod 3049, the buffer spring 3048 is fully deformed to improve the material suction effect. The first eccentric block 3043 and the second eccentric block 3044 are both installed in the installation box 3041 through a connecting rod. Two positioning grooves 30211 for placing objects are provided on the receiving plate 3021, and buffer pads 30212 are installed inside the two positioning grooves 30211. The buffer spring 3048 and the telescopic rod 3049 are installed to prevent the suction cup 3042 from falling too much and causing damage to the semiconductor storage.

[0046] The first driving structure 305 includes an intermittent motor 3051 fixedly installed inside the installation box 3041, a transmission wheel 3052 fixedly installed outside the two coupling rods, and a transmission belt 3053 connected between the two transmission wheels 3052. One end of the coupling rod of the first eccentric block 3043 is fixed to the output shaft of the intermittent motor 3051. The gantry 303 and the base 301 are fixed by bolts.

[0047] It should be noted that the protruding parts of the first eccentric block 3043 and the second eccentric block 3044 are arranged relative to each other, so that the two suction cups 3042 can intermittently descend. The two suction cups 3042 are arranged symmetrically, and the positions of the two suction cups 3042 match the two positioning grooves 30211, and the heights of the two positioning grooves 30211 match the height of the discharge end of the first U-shaped frame 201. The outer shape of the lever 3024 is L-shaped.

[0048] In order to increase the linkage of the material receiving part 3, the linkage structure 306 includes a driving motor 3061 fixedly installed inside the machine base 301, a first linkage rod 3062 and a second linkage rod 3063 installed on the base plate 3022 through bearings, and a linkage wheel 3064 fixedly installed on the outside of the first linkage rod 3062 and the second linkage rod 3063, and a linkage belt 3065 is connected between the two linkage wheels 3064 for transmission. The first linkage rod 3062 extends to the outside of the machine base 301 and passes through the inside of the installation box 3041 and is rotatably connected to the gantry 303. The installation box 3041 is fixedly installed on the outer surface of the first linkage rod 3062, and one end of the second linkage rod 3063 is fixed to the rotating disk 3023. Embodiment three:

[0049] In this embodiment, if Figure 10-13 As shown, the support assembly 401 includes a second U-shaped frame 4011 and a second support frame 4012 welded to the lower surface of the second U-shaped frame 4011, and the second driving structure 402 includes a conveyor belt 4021 arranged inside the second U-shaped frame 4011, a processing seat 4022 detachably mounted on the outside of the conveyor belt 4021, a gear shaft 4023 mounted between the inner walls on the left and right sides of the second support frame 4012 through a bearing, a second stepper motor 4024 fixedly mounted on the inner bottom wall of the second support frame 4012, a first driving wheel 4025 fixedly mounted on the output shaft of the second stepper motor 4024 and the outside of the gear shaft 4023, and a second driving wheel 4027 symmetrically fixedly mounted on the outside of the gear shaft 4023. The second feeding part 4 includes a support assembly 401, and a second driving structure 402 mounted inside the support assembly 401 to collect the conductor storage;

[0050] In order to realize the use of the second driving structure 402, a second belt 4026 is connected to the two first driving wheels 4025, there are two gear shafts 4023, and a third belt 4028 is connected to the two second driving wheels 4027 opposite to each other on the left and right. A socket 40221 for disassembly and assembly is installed on the lower surface of the processing seat 4022, and a plurality of adjustment grooves 40210 which are evenly distributed and matched with the socket 40221 are opened inside the conveyor belt 4021.

[0051] In addition, the processing seat 4022 can be rotated to facilitate better assembly work. The second driving structure 402 can be extended according to needs to increase the conveying distance of the semiconductor storage.

[0052] In order to assemble semiconductor memory, such as Fig.11 As shown, the injection molding part 5 includes a telescopic frame 501 detachably mounted on the outside of the support assembly 401, and a glue injection head 502 arranged on the telescopic frame 501. The telescopic frame 501 includes a telescopic sleeve 5011 fixedly mounted on the outside of the second U-shaped frame 4011 by bolts and a telescopic plate 5012 slidably connected to the inside of the telescopic sleeve 5011 and extending to the outside thereof, and an adjusting pin 5013 for adjusting the height is inserted into the inside of the telescopic sleeve 5011 and the telescopic plate 5012, and a material pipe 5021 connected to the glue injection head 502 is fixedly mounted inside the telescopic plate 5012, and a solenoid valve 5022 is installed on the glue injection head 502. The other end of the material pipe 5021 is connected to a feed pump.

[0053] The telescopic plate 5012 is L-shaped. The glue injection head 502 is located above the processing seat 4022. The telescopic frame 501 is installed on the outside of the second U-shaped frame 4011 by bolts. The glue injection head 502 can also be set to a lifting shape, so that it can be better assembled.

[0054] like Figure 1-Figure 13As shown, the principle of the semiconductor storage assembly device provided by this embodiment is as follows: when in use, the semiconductor storage with the wafer connected to the substrate is placed on the first U-shaped frame 201, and the conveying rollers 203 on the left and right sides are in contact with the semiconductor storage, and a plurality of conveying rollers 203 are driven by the transmission structure 204 to realize the conveying of the semiconductor storage, and the rotating disk 3023 is rotated. At this time, one of the shaft rods 3025 is abutted against the connecting member 3029 to drive the receiving plate 3021 to move. As the rotating disk 3023 rotates, the shaft rod 3025 abutting against the connecting member 3029 no longer abuts against the connecting member 3029, and the other shaft rod 3025 abuts against the lever 3024 and rotates according to the rotation. The top end is connected to the push rod 3028, so that the material receiving plate 3021 is displaced back, thereby realizing the back and forth material receiving of the positioning groove 30211. Through the use of the intermittent motor 3051, the transmission wheel 3052 and the transmission belt 3053, the first eccentric block 3043 and the second eccentric block 3044 are intermittently fitted with the two abutment plates 3045 to realize the lifting and lowering adjustment of the two suction cups 3042. At the same time, through the linkage structure 306, the synchronous use of the material receiving structure 302 and the material suction structure 304 is realized, thereby realizing the linkage when the material receiving part 3 is used. At this time, the suction cup 3042 can rotate, and the sucked conductor storage is placed on the processing seat 4022, transported by the second driving structure 402 and assembled and processed by the injection head 502.

[0055] For example, certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in names as a way to distinguish components, but use differences in the functions of components as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0056] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or system. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the product or system including the elements.

[0057] The above description shows and describes several preferred embodiments of the present invention, but as mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention concept described herein through the above teachings or the technology or knowledge of the relevant field. Changes and variations made by those skilled in the art do not depart from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A semiconductor memory assembly device, characterized in that: The invention comprises an assembling device (1) for assembling a semiconductor storage device, wherein the assembling device (1) comprises a first feeding part (2), a receiving part (3), a second feeding part (4) and an injection molding part (5); The first feeding part (2) comprises a first U-shaped frame (201), a first support frame (202) welded to the lower surface of the first U-shaped frame (201), a conveying roller (203) rotatably mounted inside the first U-shaped frame (201), and a transmission structure (204) arranged on the first U-shaped frame (201) to drive the first U-shaped frame (201); The material receiving section (3) comprises a machine base (301) and a gantry (303), a material receiving structure (302) arranged on the machine base (301) for receiving materials from the semiconductor storage device, a material suction structure (304) for conveying the semiconductor storage device, a first driving structure (305) for lifting and lowering the material suction structure (304), and a linkage structure (306) for linkage and coordination between the material receiving structure (302) and the material suction structure (304); The second feeding portion (4) comprises a support component (401), and a second driving structure (402) installed inside the support component (401) and collecting the conductor storage; The injection molding part (5) comprises a telescopic frame (501) detachably mounted on the outside of the support assembly (401), and a glue injection head (502) arranged on the telescopic frame (501); The transmission structure (204) comprises a first stepper motor (2041) fixedly mounted on the upper surface of the first U-shaped frame (201), a connecting shaft (2042) mounted inside the first U-shaped frame (201) via a bearing and fixed to the top of the conveying roller (203), a first transmission wheel (2043) fixedly mounted on the output shaft of the first stepper motor (2041), and a second transmission wheel (2044) and a third transmission wheel (2045) fixedly mounted on the top of the connecting shaft (2042); The number of the conveying rollers (203) and the connecting shafts (2042) is multiple, and the multiple conveying rollers (203) are evenly spaced and distributed inside the first U-shaped frame (201); a first belt (2046) is installed between the first transmission wheel (2043) and the leftmost second transmission wheel (2044), as well as between two adjacent second transmission wheels (2044) and the third transmission wheel (2045); The material receiving structure (302) comprises a material receiving plate (3021) disposed above one side of the machine base (301), a bottom plate (3022) fixedly mounted inside the machine base (301), a rotating disk (3023) and a lever (3024) mounted on the bottom plate (3022) via a bearing, two shaft rods (3025) symmetrically mounted outside the rotating disk (3023), a connecting strip (3026) disposed inside the machine base (301), a sliding block (3027) fixedly mounted between the connecting strip (3026) and the material receiving plate (3021), and a sliding block (3028) mounted on the connecting strip (3028). A connecting piece (3029) is disposed outside the strip (3026) and abuts against one of the shaft rods (3025); a push rod (3028) penetrating the interior of the lever (3024) is fixedly mounted outside the connecting strip (3026); four guide wheels (307) distributed in a rectangular shape are rotatably mounted on a side of the receiving plate (3021) close to the rotating disk (3023); the connecting strip (3026) is in rolling contact with the four guide wheels (307); and a guide rod (3071) penetrating the interior of the slider (3027) is fixedly mounted inside the machine base (301); The material suction structure (304) comprises an installation box (3041) arranged between the machine base (301) and the gantry (303), a suction cup (3042) arranged outside the installation box (3041), a first eccentric block (3043), a second eccentric block (3044) and an abutment plate (3045) arranged inside the installation box (3041), a return spring (3046) fixedly installed between the inner bottom wall of the installation box (3041) and the lower surface of the abutment plate (3045), and a return spring (3046) fixedly installed on the lower surface of the abutment plate (3045) and extending a connecting rod (3047) extending to the outside of the installation box (3041), a buffer spring (3048) and a telescopic rod (3049) fixedly installed between the connecting rod (3047) and the suction cup (3042); the first eccentric block (3043) and the second eccentric block (3044) are both installed inside the installation box (3041) via a connecting rod; two positioning grooves (30211) for placing objects are provided on the receiving plate (3021), and buffer pads (30212) are installed inside the two positioning grooves (30211); The first driving structure (305) comprises an intermittent motor (3051) fixedly mounted inside the mounting box (3041), a transmission wheel (3052) fixedly mounted outside two coupling rods, and a transmission belt (3053) drivingly connected between the two transmission wheels (3052); one end of the coupling rod of the first eccentric block (3043) is fixed to the output shaft of the intermittent motor (3051); The linkage structure (306) comprises a driving motor (3061) fixedly mounted inside the machine base (301), a first linkage rod (3062) and a second linkage rod (3063) mounted on the bottom plate (3022) via bearings, and a linkage wheel (3064) fixedly mounted outside the first linkage rod (3062) and the second linkage rod (3063); a linkage belt (3065) is connected in a transmission manner between the two linkage wheels (3064); the first linkage rod (3062) extends to the outside of the machine base (301) and passes through the inside of the installation box (3041) to be rotatably connected to the gantry (303); the installation box (3041) is fixedly mounted on the outer surface of the first linkage rod (3062); and one end of the second linkage rod (3063) is fixed to the rotating disk (3023); The support assembly (401) comprises a second U-shaped frame (4011) and a second support frame (4012) welded to the lower surface of the second U-shaped frame (4011); the second driving structure (402) comprises a conveyor belt (4021) arranged inside the second U-shaped frame (4011), a processing seat (4022) detachably mounted outside the conveyor belt (4021), a gear shaft (4023) mounted between left and right inner walls of the second support frame (4012) via a bearing, a second stepping motor (4024) fixedly mounted on the inner bottom wall of the second support frame (4012), a first driving wheel (4025) fixedly mounted on the output shaft of the second stepping motor (4024) and outside the gear shaft (4023), and a second driving wheel (4027) symmetrically fixedly mounted outside the gear shaft (4023).

2. The semiconductor memory assembly equipment according to claim 1, characterized in that: A second belt (4026) is connected in transmission between the two first drive wheels (4025), the number of the gear shafts (4023) is two, and a third belt (4028) is connected in transmission between the two second drive wheels (4027) opposite to each other on the left and right, a socket (40221) for disassembly and assembly is installed on the lower surface of the processing seat (4022), and a plurality of adjustment grooves (40210) which are evenly distributed and matched with the sockets (40221) are opened inside the conveyor belt (4021).

3. The semiconductor memory assembly equipment according to claim 1, characterized in that: The telescopic frame (501) comprises a telescopic sleeve (5011) fixedly mounted on the outside of the second U-shaped frame (4011) by means of bolts, and a telescopic plate (5012) slidably connected to the inside of the telescopic sleeve (5011) and extending to the outside thereof, an adjusting pin (5013) for adjusting the height being plugged into the inside of the telescopic sleeve (5011) and the telescopic plate (5012), a material pipe (5021) in communication with a glue injection head (502) being fixedly mounted inside the telescopic plate (5012), and a solenoid valve (5022) being mounted on the glue injection head (502).

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