A reliability testing process for transistors

Abstract

The present invention belongs to the field of transistor testing technology, and provides a reliability testing process for transistors, including: building a reliability testing platform based on the test conditions of the reliability testing project; configuring reliability testing equipment; designing a reliability testing program; relying on the reliability testing platform, using the reliability testing equipment, and based on the reliability testing program, performing reliability testing on the transistor. The present invention relies on the reliability testing platform, uses the reliability testing equipment, and performs reliability testing on the transistor based on the reliability testing program, and can efficiently and accurately implement the reliability testing of the transistor, which helps to improve the testing efficiency of the transistor and ensure the production quality of the transistor.

Description

Technical Field

[0001] The present invention relates to the technical field of transistor testing, and in particular to a reliability testing process for transistors. Background Art

[0002] Transistor testing is based on finished product testing equipment to test the functions and performance of integrated circuits. By analyzing the test results, it is determined whether the functions and performance are qualified.

[0003] Reliability testing refers to the reliability index of a transistor that can be used for a long time, and is the probability of a transistor failing under specified and rated conditions. In order to conduct efficient and high-quality tests on the reliability of transistors, multiple index tests are required;

[0004] The existing reliability test of transistors lacks a comprehensive and systematic reliability test process, which makes the reliability test results of transistors not comprehensive and accurate enough, making it difficult to fully reflect the reliability of transistors, thus affecting the test results of transistor quality.

[0005] Therefore, it is necessary to provide a reliability testing process for transistors. Summary of the invention

[0006] The present invention provides a reliability testing process for transistors. By relying on a reliability testing platform and utilizing reliability testing equipment, based on a reliability testing program, reliability testing of transistors can be performed efficiently and accurately, which helps to improve the testing efficiency of transistors and ensure the production quality of transistors.

[0007] The present invention provides a reliability testing process for a transistor, comprising:

[0008] Build a reliability test platform based on the test conditions of the reliability test project;

[0009] Configure reliability testing equipment;

[0010] Design reliability test procedures;

[0011] Relying on the reliability testing platform, using reliability testing equipment, and based on the reliability testing procedure, reliability testing of transistors is carried out.

[0012] Furthermore, based on the test conditions of the reliability test project, a reliability test platform is built, including:

[0013] Obtain reliability test items for transistors;

[0014] Obtain the test conditions required for testing reliability test items;

[0015] According to the test conditions, a reliability test platform is built to realize the test conditions required for the transistor reliability test project.

[0016] Furthermore, reliability test items include constant temperature and humidity, hot and cold shock, high temperature storage, high temperature cooking and reflow soldering high temperature.

[0017] Furthermore, the test conditions corresponding to constant temperature and humidity are: temperature is 85 degrees Celsius, relative humidity is 85%;

[0018] The test conditions corresponding to the thermal shock are: the temperature range is -55 degrees Celsius to 165 degrees Celsius;

[0019] The corresponding test conditions for high temperature storage are: temperature is 150 degrees Celsius;

[0020] The test conditions corresponding to high temperature cooking are: temperature of 121 degrees Celsius, relative humidity of 100%, and pressure of 205 kPa;

[0021] The test conditions corresponding to the high temperature of reflow soldering are: the reflow soldering cycle temperatures are 240 degrees Celsius, 260 degrees Celsius, 280 degrees Celsius and 300 degrees Celsius.

[0022] Furthermore, the reliability test items also include layered scanning, that is, cross-sectional image scanning and holographic image scanning of transistors that have undergone reflow high-temperature testing.

[0023] Furthermore, reliability testing equipment is configured, including: a hot and cold shock test chamber, a high temperature reverse bias aging machine, a programmable constant temperature and humidity test chamber, a high voltage accelerated aging chamber, a reflow soldering machine and an ultrasonic scanning microscope; the hot and cold shock test chamber is used to perform hot and cold shock tests, the high temperature reverse bias aging machine is used to perform high temperature storage tests, the programmable constant temperature and humidity test chamber is used to perform constant temperature and humidity tests, the high voltage accelerated aging chamber is used to perform high temperature boiling tests, the reflow soldering machine is used to perform reflow soldering high temperature tests, and the ultrasonic scanning microscope is used to perform layer scanning tests.

[0024] Furthermore, designing a reliability test program includes: based on the test requirements of the reliability test items, using a software program to write and generate the reliability test program.

[0025] Furthermore, relying on the reliability test platform, using the reliability test equipment, and based on the reliability test procedure, the reliability test of the transistor is performed, including:

[0026] Using the processor in the reliability test platform, a connection with the reliability test equipment is established;

[0027] Connecting the processor to a storage device storing a reliability test program, and importing the reliability test program into the processor;

[0028] Using a processor, based on a set test process, using reliability testing equipment, and based on a reliability testing program, reliability testing is performed on the transistor.

[0029] Furthermore, the test process settings include:

[0030] Based on the script writing software, write basic test script statements according to the basic framework content of the test process;

[0031] Based on the test conditions of the reliability test project, write several conversion test script statements for the conversion test conditions, add them to the basic test script statements, and generate test script statements;

[0032] Based on the test script statements, using the tree structure algorithm, the corresponding branches and child nodes in the test script statements are set, and the test script statements in the form of a tree structure are generated;

[0033] Execute the test script statements based on the set process executor to generate the test process;

[0034] In the case where the conversion test script statement is not executed due to the conversion test conditions not being prepared during the execution process, the set process scheduler is used to schedule the process to update the test process.

[0035] Furthermore, it also includes evaluating the reliability test results and optimizing the reliability test conditions or improving the reliability test procedures according to the evaluation results, specifically:

[0036] Obtain reliability test results, evaluate the reliability test results according to the set evaluation indicators, and obtain evaluation data;

[0037] According to the set data credibility analysis algorithm, the credibility of the evaluation data is analyzed to obtain the credibility of the evaluation data;

[0038] Screening first evaluation data corresponding to a credibility lower than a set credibility threshold;

[0039] Using a backtracking model to backtrack the first evaluation data, and obtaining a corresponding first reliability test condition and a first reliability test program;

[0040] Optimizing reliability test conditions or improving reliability test procedures to obtain second reliability test conditions and second reliability test procedures;

[0041] Based on the set simulation test model, a second reliability test condition or a second reliability test procedure is used to perform a simulation test. If the credibility of the evaluation data corresponding to the test result is higher than the set credibility threshold, the second reliability test condition or the second reliability test procedure is used as the optimization target content of the reliability test condition or the improvement target content of the reliability test procedure.

[0042] Compared with the prior art, the present invention has the following advantages and beneficial effects: by relying on a reliability testing platform, using reliability testing equipment, and based on a reliability testing program, reliability testing of transistors can be performed efficiently and accurately, which helps to improve the testing efficiency of transistors and ensure the production quality of transistors.

[0043] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0044] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0046] Figure 1 The figure is a schematic diagram of the process steps of transistor reliability testing;

[0047] Figure 2 Schematic diagram of the steps for building a reliability test platform;

[0048] Figure 3 Schematic diagram of the reliability test equipment. DETAILED DESCRIPTION

[0049] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0050] The present invention provides a reliability testing process for a transistor, such as Figure 1 As shown, including:

[0051] Build a reliability test platform based on the test conditions of the reliability test project;

[0052] Configure reliability testing equipment;

[0053] Design reliability test procedures;

[0054] Relying on the reliability testing platform, using reliability testing equipment, and based on the reliability testing procedure, reliability testing of transistors is carried out.

[0055] The working principle of the above technical solution is: in order to realize the reliability testing process of transistors, the present invention first builds a reliability testing platform based on the test conditions of the reliability testing project; then configures the reliability testing equipment; designs a reliability testing program; finally, relying on the reliability testing platform, using the reliability testing equipment, based on the reliability testing program, the reliability test of the transistor is performed, which can ensure the smooth implementation of the transistor reliability test.

[0056] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, by relying on a reliability testing platform, using reliability testing equipment, and based on a reliability testing program, reliability testing of transistors can be performed efficiently and accurately, which helps to improve the testing efficiency of transistors and ensure the production quality of transistors.

[0057] In one embodiment, Figure 2 As shown, based on the test conditions of the reliability test project, a reliability test platform is built, including:

[0058] Obtain reliability test items for transistors;

[0059] Obtain the test conditions required for testing reliability test items;

[0060] According to the test conditions, a reliability test platform is built to realize the test conditions required for the transistor reliability test project.

[0061] The working principle of the above technical solution is: in order to realize the construction of a reliability testing platform, the present invention first obtains the reliability testing items of the transistor; then obtains the test conditions required for testing the reliability testing items; finally, according to the test conditions, a reliability testing platform is built to realize the test conditions required for the reliability testing items of the transistor.

[0062] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, by building a reliability testing platform, a basis is provided for the subsequent connectivity of software and hardware and ensuring the smooth implementation of reliability testing.

[0063] In one embodiment, the reliability test items include constant temperature and humidity, hot and cold shock, high temperature storage, high temperature cooking and reflow high temperature.

[0064] The working principle of the above technical solution is: the reliability test items include constant temperature and humidity, hot and cold shock, high temperature storage, high temperature cooking and high temperature reflow soldering. These test items can reflect the reliability of transistors.

[0065] The beneficial effect of the above technical solution is: by adopting the solution provided by this embodiment, by obtaining reliability test items, the reliability test results are reflected more comprehensively and accurately.

[0066] In one embodiment, the test conditions corresponding to constant temperature and humidity are: temperature is 85 degrees Celsius, relative humidity is 85%;

[0067] The test conditions corresponding to the thermal shock are: the temperature range is -55 degrees Celsius to 165 degrees Celsius;

[0068] The corresponding test conditions for high temperature storage are: temperature is 150 degrees Celsius;

[0069] The test conditions corresponding to high temperature cooking are: temperature of 121 degrees Celsius, relative humidity of 100%, and pressure of 205 kPa;

[0070] The test conditions corresponding to the high temperature of reflow soldering are: the reflow soldering cycle temperatures are 240 degrees Celsius, 260 degrees Celsius, 280 degrees Celsius and 300 degrees Celsius.

[0071] The working principle of the above technical scheme is: in order to obtain the reliability test conditions corresponding to the reliability test items, the present invention sets the reliability test conditions, specifically: the test conditions corresponding to constant temperature and humidity are: temperature is 85 degrees Celsius, relative humidity is 85%; the test conditions corresponding to hot and cold shock are: temperature range is -55 degrees Celsius to 165 degrees Celsius; the test conditions corresponding to high temperature storage are: temperature is 150 degrees Celsius; the test conditions corresponding to high temperature cooking are: temperature is 121 degrees Celsius, relative humidity is 100%, and pressure is 205 kPa; the test conditions corresponding to reflow soldering high temperature are: reflow soldering cycle temperature is 240 degrees Celsius, 260 degrees Celsius, 280 degrees Celsius and 300 degrees Celsius.

[0072] The beneficial effect of the above technical solution is: by adopting the solution provided by this embodiment, by setting reliability test conditions, the necessary conditions for the smooth testing of transistor reliability test items are provided.

[0073] In one embodiment, the reliability test items further include layered scanning, that is, performing cross-sectional image scanning and holographic image scanning on the transistors that have undergone the reflow soldering high temperature test.

[0074] The working principle of the above technical solution is: in order to more clearly understand the structural changes of transistors that have undergone high-temperature reflow soldering testing, the present invention also sets up a layered scanning reliability test item, that is, performing cross-sectional image scanning and holographic image scanning on transistors that have undergone high-temperature reflow soldering testing.

[0075] The beneficial effect of the above technical solution is: by adopting the solution provided by this embodiment, the reliability test items of layered scanning can ensure that the test results are comprehensive and accurate.

[0076] In one embodiment, Figure 3 As shown, the reliability testing equipment is configured, including: a hot and cold shock test chamber, a high-temperature reverse bias aging machine, a programmable constant temperature and humidity test chamber, a high-voltage accelerated aging chamber, a reflow soldering machine and an ultrasonic scanning microscope; the hot and cold shock test chamber is used to perform hot and cold shock tests, the high-temperature reverse bias aging machine is used to perform high-temperature storage tests, the programmable constant temperature and humidity test chamber is used to perform constant temperature and humidity tests, the high-voltage accelerated aging chamber is used to perform high-temperature cooking tests, the reflow soldering machine is used to perform reflow soldering high-temperature tests, and the ultrasonic scanning microscope is used to perform layer scanning tests.

[0077] The working principle of the above technical scheme is: in order to ensure the efficient implementation of reliability testing, the present invention is equipped with reliability testing equipment, including: a hot and cold shock test chamber, a high-temperature reverse bias aging machine, a programmable constant temperature and humidity test chamber, a high-voltage accelerated aging chamber, a reflow soldering machine and an ultrasonic scanning microscope; the hot and cold shock test chamber is used to perform hot and cold shock testing, the high-temperature reverse bias aging machine is used to perform high-temperature storage testing, the programmable constant temperature and humidity test chamber is used to perform constant temperature and humidity testing, the high-voltage accelerated aging chamber is used to perform high-temperature boiling testing, the reflow soldering machine is used to perform reflow soldering high-temperature testing, and the ultrasonic scanning microscope is used to perform layered scanning testing.

[0078] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, by configuring the reliability testing equipment, the necessary basis and conditions are provided for carrying out the reliability test.

[0079] In one embodiment, designing a reliability test program includes: based on the test requirements of the reliability test project, using a software program to write and generate the reliability test program.

[0080] The working principle of the above technical solution is: based on the test requirements of the reliability test project, a reliability test program is written and generated using a software program to ensure the accuracy of the reliability test program.

[0081] The beneficial effect of the above technical solution is: by adopting the solution provided by this embodiment, a reliability test program is written and generated to provide a necessary software environment for reliability testing.

[0082] In one embodiment, a reliability test is performed on a transistor using a reliability test platform, a reliability test device, and a reliability test program, including:

[0083] Using the processor in the reliability test platform, a connection with the reliability test equipment is established;

[0084] Connecting the processor to a storage device storing a reliability test program, and importing the reliability test program into the processor;

[0085] Using a processor, based on a set test process, using reliability testing equipment, and based on a reliability testing program, reliability testing is performed on the transistor.

[0086] The working principle of the above technical solution is: in order to realize the specific testing process, the present invention first uses the processor in the reliability testing platform to establish a connection with the reliability testing equipment; then connects the processor to the storage device storing the reliability testing program, and imports the reliability testing program into the processor; finally, using the processor, based on the set testing process, using the reliability testing equipment, based on the reliability testing program, the reliability test of the transistor is performed.

[0087] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, reliability testing of transistors can be achieved through a processor based on a reliability testing platform, a connected reliability testing device and a called reliability testing software.

[0088] In one embodiment, the test process setting includes:

[0089] Based on the script writing software, write basic test script statements according to the basic framework content of the test process;

[0090] Based on the test conditions of the reliability test project, write several conversion test script statements for the conversion test conditions, add them to the basic test script statements, and generate test script statements;

[0091] Based on the test script statements, using the tree structure algorithm, the corresponding branches and child nodes in the test script statements are set, and the test script statements in the form of a tree structure are generated;

[0092] Execute the test script statements based on the set process executor to generate the test process;

[0093] In the case where the conversion test script statement is not executed due to the conversion test conditions not being prepared during the execution process, the set process scheduler is used to schedule the process to update the test process.

[0094] The working principle of the above technical solution is: in order to ensure the smooth implementation of the test, it is necessary to set the test process, specifically, based on the script writing software, write basic test script statements according to the basic framework content of the test process; based on the test conditions of the reliability test project, write several conversion test script statements for the conversion test conditions, add them to the basic test script statements, and generate test script statements; based on the test script statements, use the tree structure algorithm to set the corresponding branches and sub-nodes in the test script statements, and generate test script statements in the form of a tree structure; based on the set process executor, execute the test script statements to generate a test process; in the case where the conversion test script statements are not executed due to the failure to prepare the conversion test conditions during the execution process, use the set process scheduler to schedule the process to update the test process.

[0095] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, by setting the test script statements based on the tree structure, and using the process processor and process scheduler to execute and schedule the script, the accuracy of the test process can be guaranteed.

[0096] In one embodiment, the method further includes evaluating the reliability test results, and optimizing the reliability test conditions or improving the reliability test procedures according to the evaluation results, specifically:

[0097] Obtain reliability test results, evaluate the reliability test results according to the set evaluation indicators, and obtain evaluation data;

[0098] According to the set data credibility analysis algorithm, the credibility of the evaluation data is analyzed to obtain the credibility of the evaluation data;

[0099] Screening first evaluation data corresponding to a credibility lower than a set credibility threshold;

[0100] Using a backtracking model to backtrack the first evaluation data, and obtaining a corresponding first reliability test condition and a first reliability test program;

[0101] Optimizing reliability test conditions or improving reliability test procedures to obtain second reliability test conditions and second reliability test procedures;

[0102] Based on the set simulation test model, a second reliability test condition or a second reliability test procedure is used to perform a simulation test. If the credibility of the evaluation data corresponding to the test result is higher than the set credibility threshold, the second reliability test condition or the second reliability test procedure is used as the optimization target content of the reliability test condition or the improvement target content of the reliability test procedure.

[0103] The working principle of the above technical solution is as follows: in order to better promote the execution quality of reliability testing, the present invention also evaluates the reliability test results, and uses the evaluation results to optimize the reliability test conditions or improve the reliability test program. First, the reliability test results are obtained, and the reliability test results are evaluated according to the set evaluation indicators to obtain evaluation data; then, according to the set data credibility analysis algorithm, the evaluation data is credibility analyzed to obtain the credibility of the evaluation data; the first evaluation data corresponding to the credibility lower than the set credibility threshold is screened; the first evaluation data is backtracked using a backtracking model to obtain the corresponding first reliability test conditions and first reliability test program; the reliability test conditions are optimized or the reliability test program is improved to obtain the second reliability test conditions and the second reliability test program; finally, based on the set simulation test model, the second reliability test conditions or the second reliability test program are used to perform simulation testing. If the credibility of the evaluation data corresponding to the test result is higher than the set credibility threshold, the second reliability test condition or the second reliability test program is used as the optimization target content of the reliability test condition or the improvement target content of the reliability test program.

[0104] The beneficial effect of the above technical solution is: by adopting the solution provided in this embodiment, by evaluating the reliability test results and using the evaluation results to optimize the reliability test conditions or improve the reliability test procedures, the reliability test can be better improved and the execution quality of the reliability test can be improved.

[0105] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A reliability testing process for a transistor, characterized in that: include: Build a reliability test platform based on the test conditions of the reliability test project; Configure reliability testing equipment; Design reliability test procedures; Relying on the reliability test platform, using reliability test equipment, based on the reliability test procedure, the reliability test of transistors is carried out, including: Using the processor in the reliability test platform, a connection with the reliability test equipment is established; Connecting the processor to a storage device storing a reliability test program, and importing the reliability test program into the processor; Using a processor, based on a set test process, using a reliability test device, and based on a reliability test program, to perform reliability test on the transistor; The test process settings include: Based on the script writing software, write basic test script statements according to the basic framework content of the test process; Based on the test conditions of the reliability test project, write several conversion test script statements for the conversion test conditions, add them to the basic test script statements, and generate test script statements; Based on the test script statements, using the tree structure algorithm, the corresponding branches and child nodes in the test script statements are set, and the test script statements in the form of a tree structure are generated; Execute the test script statements based on the set process executor to generate the test process; In the case where the conversion test script statement is not executed due to the conversion test conditions not being prepared during the execution process, the set process scheduler is used to schedule the process to update the test process.

2. A transistor reliability testing process according to claim 1, characterized in that: Based on the test conditions of the reliability test project, a reliability test platform is built, including: Obtain reliability test items for transistors; Obtain the test conditions required for testing reliability test items; According to the test conditions, a reliability test platform is built to realize the test conditions required for the transistor reliability test project.

3. A transistor reliability testing process according to claim 2, characterized in that: Reliability test items include constant temperature and humidity, hot and cold shock, high temperature storage, high temperature cooking and high temperature reflow soldering.

4. A transistor reliability testing process according to claim 3, characterized in that: The corresponding test conditions for constant temperature and humidity are: temperature is 85 degrees Celsius, relative humidity is 85%; The test conditions corresponding to the thermal shock are: the temperature range is -55 degrees Celsius to 165 degrees Celsius; The corresponding test conditions for high temperature storage are: temperature is 150 degrees Celsius; The test conditions corresponding to high temperature cooking are: temperature of 121 degrees Celsius, relative humidity of 100%, and pressure of 205 kPa; The test conditions corresponding to the high temperature of reflow soldering are: the reflow soldering cycle temperatures are 240 degrees Celsius, 260 degrees Celsius, 280 degrees Celsius and 300 degrees Celsius.

5. A transistor reliability testing process according to claim 3, characterized in that: Reliability testing items also include layered scanning, which is cross-sectional image scanning and holographic image scanning of transistors that have undergone high-temperature reflow testing.

6. A transistor reliability testing process according to claim 5, characterized in that: Configure reliability testing equipment, including: configure hot and cold shock test chamber, high temperature reverse bias aging machine, programmable constant temperature and humidity test chamber, high voltage accelerated aging chamber, reflow soldering machine and ultrasonic scanning microscope; the hot and cold shock test chamber is used to perform hot and cold shock test, the high temperature reverse bias aging machine is used to perform high temperature storage test, the programmable constant temperature and humidity test chamber is used to perform constant temperature and humidity test, the high voltage accelerated aging chamber is used to perform high temperature cooking test, the reflow soldering machine is used to perform reflow soldering high temperature test, and the ultrasonic scanning microscope is used to perform layer scanning test.

7. A transistor reliability testing process according to claim 1, characterized in that: Design reliability test program, including: based on the test requirements of reliability test items, using software program to write and generate reliability test program.

8. A transistor reliability testing process according to claim 1, characterized in that: It also includes evaluating the reliability test results and optimizing the reliability test conditions or improving the reliability test procedures based on the evaluation results, specifically: Obtain reliability test results, evaluate the reliability test results according to the set evaluation indicators, and obtain evaluation data; According to the set data credibility analysis algorithm, the credibility of the evaluation data is analyzed to obtain the credibility of the evaluation data; Screening first evaluation data corresponding to a credibility lower than a set credibility threshold; Using a backtracking model to backtrack the first evaluation data, and obtaining a corresponding first reliability test condition and a first reliability test program; Optimizing reliability test conditions or improving reliability test procedures to obtain second reliability test conditions and second reliability test procedures; Based on the set simulation test model, a second reliability test condition or a second reliability test procedure is used to perform a simulation test. If the credibility of the evaluation data corresponding to the test result is higher than the set credibility threshold, the second reliability test condition or the second reliability test procedure is used as the optimization target content of the reliability test condition or the improvement target content of the reliability test procedure.

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