A coating machine for semiconductor chip manufacturing

Abstract

The present application relates to the technical field of chip coating equipment, and specifically discloses a coating machine for semiconductor chip manufacturing, including an outer chassis, an inner chassis is arranged inside the outer chassis, a plurality of rotating carriers arranged equidistantly in the longitudinal direction are arranged inside the inner chassis, and each rotating carrier is provided with a chip placement slot, the outer side of the rotating carrier is movably sleeved and sealed with the inner wall of the inner chassis, two partitions are respectively arranged between the outer side of the front and back of the inner chassis and the inner wall of the outer chassis, and a door panel is arranged on the front of the outer chassis. By setting up multiple layers of rotating carriers in the inner chassis, the chips on each rotating carrier can be coated at the same time without affecting the coating of the chips on other layers of rotating carriers, thereby improving the efficiency of coating, and during coating, there is no need to frequently start and stop the vacuum equipment to replace the chip for re-coating, avoiding the problem of frequent start and stop causing damage to the vacuum pump, thereby improving the service life and stability of the coating equipment.

Description

Technical Field

[0001] The present application relates to the technical field of chip coating equipment, and in particular to a coating machine for semiconductor chip manufacturing. Background Art

[0002] In the semiconductor manufacturing process, coating is an indispensable part, which is crucial to improving the surface properties or functions of semiconductor materials. Semiconductor chip coating can improve the conductivity, reflectivity, mechanical properties, corrosion resistance, optical transparency and electrical insulation of materials by forming a thin film on the substrate. Among them, atomic layer deposition equipment (ALD) plays an irreplaceable role in advanced processes and storage devices at 28nm and below. It can better meet the higher requirements of film thickness, three-dimensional conformality, etc. in the thin film deposition process due to the continuous reduction of device size and 3D structure. Compared with traditional PVD (physical vapor deposition) and CVD (chemical vapor deposition), ALD technology has outstanding film uniformity control capability, and can deposit a coating with completely uniform thickness around deep trenches, porous media and particles, which makes ALD technology have broad application potential in microelectronics, energy, information and other fields.

[0003] However, when existing atomic layer deposition equipment is coating chips, since ALD technology is based on the principle of surface self-limiting reaction, it is required that only a layer of atoms on the surface react with the precursor each time to achieve atomic-level thin film growth. Each round of reaction includes three steps: precursor adsorption, precursor reaction and nitrogen cleaning. By controlling the number and time of these three steps, the thickness and composition of the film can be precisely controlled, which makes the coating efficiency low. In addition, since the coating environment is carried out under vacuum, each time the coating is completed, it is necessary to stop the machine and replace the chip to be coated, resulting in low efficiency. Summary of the invention

[0004] The present application proposes a coating machine for semiconductor chip manufacturing, which has the advantage of high coating efficiency and is used to solve the problem of low efficiency of existing atomic layer deposition equipment when coating chips.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical scheme: a coating machine for semiconductor chip manufacturing, comprising an outer chassis, one side of the outer chassis is connected to a nitrogen main pipe, a precursor I main pipe and a precursor II main pipe, and the other side of the outer chassis is provided with a vacuum pumping device, an inner chassis is provided inside the outer chassis, a plurality of rotating carriers arranged equidistantly in the longitudinal direction are provided inside the inner chassis, and each rotating carrier is provided with a chip placement slot, the outer side of the rotating carrier is movably connected to the inner wall of the inner chassis and sealed, two partitions are respectively provided between the outer sides of the front and back sides of the inner chassis and the inner wall of the outer chassis, and a door panel is provided on the front side of the outer chassis, and one side of the inner chassis is provided with air outlet slots having the same number as the rotating carriers, and the air outlet slots are connected to the inner cavity of the inner chassis and the vacuum pumping device.

[0006] When in use, the chips on each layer of the rotating carrier are coated at the same time, and the coating of the chips on each layer of the rotating carrier does not affect each other.

[0007] Furthermore, a longitudinal baffle is provided between the side of the inner chassis away from the vacuum pumping equipment and the inner wall of the outer chassis, and the longitudinal baffle divides the left chamber of the partition between the outer chassis and the inner chassis into a precursor I storage chamber and a precursor II storage chamber, and the precursor I storage chamber is connected to the precursor I main pipe, and the precursor II storage chamber is connected to the precursor II main pipe, and the longitudinal baffle is provided with transverse through grooves that are the same in number as the air outlet grooves and correspond in position to each other, an air inlet pipe is fixedly installed on one side of the transverse through groove, and the air inlet pipe connects the transverse through groove and the inner cavity of the inner chassis, and a nitrogen branch pipe is connected to the other side of the transverse through groove, and one end of the nitrogen branch pipe extends to the outside of the outer chassis and is connected to the nitrogen main pipe.

[0008] Furthermore, the interior of the precursor I storage chamber and the precursor II storage chamber are both provided with a plurality of longitudinally equidistantly arranged transverse baffles, which separate the precursor I storage chamber and the precursor II storage chamber into a plurality of independent precursor sub-chambers, and the number of precursor sub-chambers in the precursor I storage chamber and the precursor II storage chamber is the same as the number of nitrogen branch pipes, and an intake valve device penetrating the transverse through groove is fixedly mounted on the longitudinal baffle, and both ends of the intake valve device extend into the precursor I storage chamber and the precursor II storage chamber respectively.

[0009] Further, the intake valve device includes a positioning conduit fixedly mounted on the longitudinal baffle, the positioning conduit is vertically arranged with the transverse through slot, vent holes are respectively opened on both sides of the middle of the positioning conduit, one of the vent holes faces the nitrogen branch pipe, and the other vent hole faces the intake pipe, the internal movable sleeve of the positioning conduit is provided with a movable conduit, the middle of the movable conduit facing the nitrogen branch pipe is provided with an intake groove I, and the size of the intake groove I is adapted to the size of the vent hole, the side of the movable conduit facing the intake pipe is provided with an outlet groove, and the outlet groove is provided at the same time. The length of the air groove is three times the length of the vent hole, and air intake grooves II are provided at both ends of the air intake groove I, and the two ends of the air intake groove I are respectively fixedly connected with piston sleeve I and piston sleeve II through U-shaped connectors, the end of the piston sleeve I away from the movable conduit is movably connected to one end of the precursor I conduit, and the end of the piston sleeve II away from the movable conduit is movably connected to the precursor II conduit, the end of the piston sleeve I close to the U-shaped connector is provided with air intake groove I, and the end of the piston sleeve II close to the U-shaped connector is provided with air intake groove II.

[0010] Furthermore, an L-shaped bracket is fixedly installed on one side of the longitudinal baffle, a hydraulic cylinder III is fixedly installed on the L-shaped bracket, a piston shaft of the hydraulic cylinder III is fixedly connected to a linkage block, one side of the linkage block is fixedly connected to a linkage shaft, and one end of the linkage shaft away from the linkage block is fixedly connected to one of the U-shaped connectors.

[0011] Furthermore, a movable sleeve in the middle of the inner cavity of the inner chassis is provided with a rotating shaft, and the rotating shaft is driven to rotate by a motor arranged in the inner cavity at the bottom of the outer chassis. The rotating shaft is connected to the rotating carrier through a linkage device, and a positioning support plate located below the rotating carrier is fixedly installed inside the inner chassis, and an ejection device close to the door panel side is fixedly installed on the top of the positioning support plate.

[0012] Furthermore, the linkage device includes a locking sleeve fixedly mounted on the rotating shaft, a positioning ring plate fixedly installed on the top of the locking sleeve, the positioning ring plate is mounted on the outside of the rotating shaft, and a friction disk I is fixedly installed on the top of the positioning ring plate, and a friction disk II is fixedly mounted on the bottom of the rotating carrier, and the bottom of the friction disk II is frictionally connected to the top of the friction disk I.

[0013] Furthermore, two hydraulic cylinders I located below the positioning ring plate are fixedly mounted on the positioning support plate, the piston shafts of the hydraulic cylinders I are fixedly connected to the passive ring plate, and the passive ring plate is connected to the positioning ring plate via a plane bearing.

[0014] Furthermore, the ejection device includes a hydraulic cylinder II, the piston shaft of the hydraulic cylinder II is fixedly connected to a moving plate, a plurality of positioning shafts distributed in a circumferential array are fixedly installed on the outer edge of the top of the moving plate, and a support block is fixedly installed on the top of the positioning shaft.

[0015] Beneficial effects of the present invention:

[0016] 1. By setting up multiple layers of rotating carriers in the inner chassis, the chips on each rotating carrier can be coated at the same time without affecting the coating of chips on other layers of rotating carriers, thereby improving the coating efficiency. During the coating period, there is no need to frequently start and stop the vacuum equipment to replace the chips for re-coating. Avoiding frequent start and stop will cause the internal structure of the vacuum pump to be constantly impacted, which may cause deformation, damage and stability problems of the internal components of the pump, thereby improving the service life and stability of the coating equipment.

[0017] 2. Through the structural design of the air intake valve device, while setting up multiple layers of rotating carriers to coat the chips simultaneously and independently, only one air intake valve device is set on each layer, which is controlled by a hydraulic cylinder III, so that the introduction of precursor I, precursor II and nitrogen can be realized. There is no need to set valves to separately control the introduction of precursor I, precursor II and nitrogen for each layer, thereby saving costs and simplifying the complexity of operation.

[0018] 3. The precursor I storage chamber and the precursor II storage chamber are separated into independent precursor sub-chambers by transverse baffles, and the space of each precursor sub-chamber remains fixed. The transverse baffles can be adjusted to control the space of each precursor sub-chamber connected to the inner chassis to ensure that the amount of precursor entering the inner chassis for reaction each time remains the same and can be controlled, which is beneficial for different batches of chip coating to have the same thickness, further improving the chip coating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which constitute a part of the specification, illustrate embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application.

[0020] The present application can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the internal structure of the middle and outer boxes;

[0023] Figure 3 for Figure 2 A front view of

[0024] Figure 4 for Figure 1 A schematic diagram of a cross-section viewed from above at aa;

[0025] Figure 5 for Figure 1 Schematic diagram of the middle section structure;

[0026] Figure 6 for Figure 3 A local enlarged structural schematic diagram;

[0027] Figure 7 for Figure 5 A schematic diagram of the local enlarged structure at B;

[0028] Figure 8 for Figure 2 Structural schematic diagram of the middle ejector device;

[0029] Fig. 9 for Figure 2 A schematic diagram of the separation state of the positioning catheter and the moving catheter;

[0030] Fig.10 for Fig. 9 A schematic diagram of a three-dimensional structure in a rear-view state;

[0031] Fig.11 It is a schematic diagram of the state of the precursor I in the intake valve device entering the intake pipe;

[0032] Fig.12 It is a schematic diagram of the state of the precursor II in the intake valve device entering the intake pipe;

[0033] Fig.13 This is a schematic diagram of the state of nitrogen entering the intake pipe in the intake valve device.

[0034] In the figure:

[0035] 1. External chassis; 2. Internal chassis; 201. Air outlet slot; 3. Partition plate; 4. Door plate; 5. Vacuum chamber; 6. Longitudinal baffle plate; 601. Horizontal through slot; 7. Precursor I storage chamber; 8. Precursor II storage chamber; 9. Rotating shaft; 10. Motor; 11. Rotating carrier; 12. Air inlet pipe; 13. Nitrogen branch pipe; 14. Nitrogen main pipe; 15. Horizontal baffle plate; 16. Precursor I conduit; 17. Precursor I main pipe; 18. Precursor II conduit; 19. Precursor II main pipe; 20. Locking sleeve; 21. Positioning ring plate; 22. Friction disc I; 23 , friction disc II; 24, positioning support plate; 25, hydraulic cylinder I; 26, passive ring plate; 27, ejection device; 271, hydraulic cylinder II; 272, moving disc; 273, positioning shaft; 274, support block; 28, positioning guide tube; 281, vent hole; 29, moving guide tube; 291, air inlet groove I; 292, air outlet groove; 293, air inlet groove II; 30, U-shaped connector; 31, piston sleeve I; 311, ventilation groove I; 32, piston sleeve II; 321, ventilation groove II; 33, hydraulic cylinder III; 34, linkage block; 35, linkage shaft. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] Example: See Figure 1-Figure 5 A coating machine for semiconductor chip manufacturing includes an outer chassis 1, an inner chassis 2 is arranged inside the outer chassis 1, two partitions 3 are respectively arranged between the outer sides of the front and back sides of the inner chassis 2 and the inner wall of the outer chassis 1, and a spacing is reserved between the two partitions 3, wherein the arrangement of the two partitions 3 between the front side of the inner chassis 2 and the inner wall of the outer chassis 1 facilitates the chip to be placed from the outer side of the outer chassis 1 into the inner chassis 2 between the two partitions 3, or to be taken out from the inner chassis 2, and a door panel 4 is arranged on the front side of the outer chassis 1, and when the chip is coated, the door panel 4 is controlled to be closed for sealing. The two partitions 3 between the inner door of the inner chassis 2 and the inner wall of the outer chassis 1 are arranged to facilitate the connection of the wires in the inner chassis 2 to the outside of the outer chassis 1. Through the partition arrangement of the partition 3, the chamber on the right side of the partition 3 between the outer chassis 1 and the inner chassis 2 is a vacuum chamber 5. A vacuum pumping device connected to the negative pressure chamber is arranged on one side of the outer chassis 1. A longitudinal baffle 6 is arranged between the side of the inner chassis 2 away from the vacuum chamber 5 and the inner wall of the outer chassis 1. The longitudinal baffle 6 separates the chamber on the left side of the partition 3 between the outer chassis 1 and the inner chassis 2 into a precursor I storage chamber 7 and a precursor II storage chamber 8.

[0038] The middle part of the inner cavity of the inner case 2 is provided with a rotating shaft 9, which is driven to rotate by a motor 10 arranged in the inner cavity at the bottom of the outer case 1. Figure 2 , Figure 5 , Figure 6-Figure 7 A plurality of longitudinally equidistantly arranged linkage devices are fixedly mounted on the rotating shaft 9, and the number of the linkage devices is not less than two, each linkage device is respectively connected to a rotating carrier 11 in a transmission manner, and a plurality of chip placement grooves distributed in a circumferential array are provided on the rotating carrier 11, and the chip placement grooves are close to the outer edge of the rotating carrier 11, and the outer side of the rotating carrier 11 is movably arranged and sealed with the inner wall of the inner chassis 2, and the plurality of layers of longitudinally arranged rotating carriers 11 are arranged in the inner chassis 2, and each rotating carrier 11 is separated and sealed with the inner wall of the inner chassis 2, so that the chips on each layer of the rotating carrier 11 can be coated at the same time, and the coating of the chips on each layer of the rotating carrier 11 does not affect each other.

[0039] Please continue reading Figure 1-Figure 5The same number of air outlet grooves 201 as the number of the rotating carrier 11 are provided on the side of the inner chassis 2 away from the longitudinal baffle 6. Through the provision of the air outlet grooves 201, the interior of the inner chassis 2 is connected with the vacuum chamber 5, so that when the vacuum chamber 5 is evacuated by the vacuum pumping equipment, the interior of the inner chassis 2 is evacuated at the same time. The same number of transverse through grooves 601 as the number of the air outlet grooves 201 and the positions corresponding to each other are provided on the longitudinal baffle 6. An air inlet pipe 12 is fixedly installed on one side of the transverse through groove 601. The air inlet pipe 12 connects the transverse through groove 601 and the inner cavity of the inner chassis 2. The other side of the transverse through groove 601 is connected with a nitrogen branch pipe 13. One end of the nitrogen branch pipe 13 extends to the outside of the outer chassis 1 and is connected with a nitrogen main pipe 14.

[0040] The interior of the precursor I storage chamber 7 and the precursor II storage chamber 8 are both provided with a plurality of transverse baffles 15 which are arranged equidistantly in the longitudinal direction. The transverse baffles 15 separate the precursor I storage chamber 7 and the precursor II storage chamber 8 into a plurality of independent precursor sub-chambers, and the number of precursor sub-chambers in the precursor I storage chamber 7 and the precursor II storage chamber 8 is the same as the number of nitrogen branch pipes 13, so that the precursor in each independent precursor sub-chamber can enter the inner chassis 2 of the corresponding layer separately, and be used for coating the chip on the rotating carrier 11 of the corresponding layer in the inner chassis 2.

[0041] A precursor I conduit 16 connected to the precursor I storage chamber 7 is fixedly installed on the side of the outer case 1 away from the vacuum pumping device, and one end of the transverse baffle 15 is connected to the precursor I main pipe 17 located outside the outer case 1. A precursor II conduit 18 connected to the precursor II storage chamber 8 is fixedly installed on the side of the outer case 1 away from the vacuum pumping device, and one end of the precursor II conduit 18 is connected to the precursor II main pipe 19 located outside the outer case 1. The precursors in the precursor I storage chamber 7 are connected to each layer through the precursor I main pipe 17. The precursor I required for chip coating is introduced into the precursor sub-chamber, and the precursor II required for chip coating is introduced into each layer of the precursor sub-chamber in the precursor II storage chamber 8 through the precursor II main pipe 19. An air intake valve device that runs through the transverse through groove 601 is fixedly mounted on the longitudinal baffle 6, and both ends of the air intake valve device extend to the precursor I storage chamber 7 and the precursor II storage chamber 8 respectively. The precursors in the precursor I storage chamber 7 and the precursor II storage chamber 8 are controlled to enter the inner chassis 2 through the air intake valve device.

[0042] See also Figure 3 , Figure 5-Figure 7The linkage device includes a locking sleeve 20 fixedly mounted on the rotating shaft 9, a positioning ring plate 21 is fixedly installed on the top of the locking sleeve 20, and the positioning ring plate 21 is mounted on the outside of the rotating shaft 9. A friction disk I 22 is fixedly installed on the top of the positioning ring plate 21, and a friction disk II 23 is fixedly installed on the bottom of the rotating carrier 11. The bottom of the friction disk II 23 is frictionally connected with the top of the friction disk I 22, so that when the rotating shaft 9 drives the locking sleeve 20, the positioning ring plate 21 and the friction disk I 22 to rotate, it can drive the friction disk II 23 and the rotating carrier 11 to rotate, so as to promote the surface contact between the precursor and the chip, and improve the uniformity and efficiency of chip coating.

[0043] A positioning support plate 24 located below the rotating carrier 11 is fixedly installed inside the inner chassis 2, and two hydraulic cylinders I 25 located below the positioning ring plate 21 are fixedly installed on the positioning support plate 24. The piston shaft of the hydraulic cylinder I 25 is fixedly connected with a passive ring plate 26. The passive ring plate 26 is connected to the positioning ring plate 21 through a plane bearing. The hydraulic cylinder I 25 drives the piston shaft to push the passive ring plate 26 to move up, so that the positioning ring plate 21 and the friction plate I 22 move up and contact with the friction plate II 23. The rotating shaft 9 can drive the rotating carrier 11 to rotate, and the hydraulic cylinder I 25 drives the piston shaft to drive the passive ring plate 26, the positioning ring plate 21 and the friction plate I 22 to move down, so that the friction plate I 22 is separated from the friction plate II 23. The rotating shaft 9 can no longer drive the rotating carrier 11 to rotate, so that the chip after coating on the rotating carrier 11 can be taken out and the chip to be coated can be replaced, and the coating work of the rotating carriers 11 on other layers in the inner chassis 2 will not be affected, thereby further improving the coating efficiency.

[0044] See also Figure 1-Figure 2 , Figure 8 , an ejection device 27 close to one side of the door panel 4 is fixedly installed on the top of the positioning support plate 24, and the ejection device 27 includes a hydraulic cylinder II 271, and the piston shaft of the hydraulic cylinder II 271 is fixedly connected to a moving disk 272, and a plurality of positioning shafts 273 distributed in a circumferential array are fixedly installed on the outer edge of the top of the moving disk 272, and a support block 274 is fixedly installed on the top of the positioning shaft 273. When coating the chip, the hydraulic cylinder II 271 drives the piston shaft to drive the moving disk 272 to move downward, so that the support block 274 does not contact the rotating carrier 11. When the rotating carrier 11 stops rotating and the chip needs to be replaced for further coating, the piston shaft is driven upward by the hydraulic cylinder II 271 to drive the moving disk 272, the positioning shaft 273 and the support block 274 to move upward, and the coated chip on the rotating carrier 11 is ejected by the support block 274, so that the chip in the inner chassis 2 can be taken out by a robot or other means and the chip to be coated can be replaced.

[0045] See also Figure 2 , Figure 4 , Fig. 9 and Fig.10The intake valve device includes a positioning conduit 28 fixedly mounted on the longitudinal baffle 6, the positioning conduit 28 is vertically arranged with the transverse through slot 601, and vent holes 281 are respectively opened on both sides of the middle of the positioning conduit 28, one of the vent holes 281 faces the nitrogen branch pipe 13, and the other vent hole 281 faces the intake pipe 12, and the internal movable sleeve of the positioning conduit 28 is provided with a movable conduit 29, and the middle of the movable conduit 29 facing the nitrogen branch pipe 13 is provided with an intake groove I 291, and the size of the intake groove I 291 is adapted to the size of the vent hole 281, and the side of the movable conduit 29 facing the intake pipe 12 is provided with an outlet groove 292, and the outlet groove The length value of 292 is three times the length value of the vent hole 281, and air inlet grooves Ⅱ 293 are provided at both ends of the air inlet groove Ⅰ 291, and the two ends of the air inlet groove Ⅰ 291 are respectively fixedly connected with piston sleeve Ⅰ 31 and piston sleeve Ⅱ 32 through U-shaped connecting piece 30, the end of piston sleeve Ⅰ 31 away from the movable conduit 29 is movably connected with one end of the precursor Ⅰ conduit 16, and the end of piston sleeve Ⅱ 32 away from the movable conduit 29 is movably connected with the precursor Ⅱ conduit 18, the end of piston sleeve Ⅰ 31 close to the U-shaped connecting piece 30 is provided with air vent groove Ⅰ 311, and the end of piston sleeve Ⅱ 32 close to the U-shaped connecting piece 30 is provided with air vent groove Ⅱ 321.

[0046] An L-shaped bracket is fixedly installed on one side of the longitudinal baffle 6, and a hydraulic cylinder III 33 is fixedly installed on the L-shaped bracket. The piston shaft of the hydraulic cylinder III 33 is fixedly connected to a linkage block 34, and one side of the linkage block 34 is fixedly connected to a linkage shaft 35. The end of the linkage shaft 35 away from the linkage block 34 is fixedly connected to one of the U-shaped connectors 30. The piston shaft is driven by the hydraulic cylinder III 33 to drive the linkage block 34 to move, thereby driving the linkage shaft 35, the U-shaped connector 30, the movable guide tube 29, the piston sleeve I 31 and the piston sleeve II 32 to move as a whole.

[0047] See also Figure 4 , Figure 11-13 , such as Fig.11As shown, the space above the longitudinal baffle 6 is a sub-chamber of the precursor I storage chamber 7, and the space below the longitudinal baffle 6 is a sub-chamber of the precursor II storage chamber 8. At this time, the air inlet groove II 293 at one end of the movable conduit 29 close to the piston sleeve I 31 is located in the precursor I storage chamber 7, so that the precursor I storage chamber 7 is connected with the air inlet pipe 12, and the air inlet groove II 293 at the other end of the movable conduit 29 is located in the positioning conduit 28, the precursor II storage chamber 8 is separated from the air inlet pipe 12, and the piston sleeve II 32 is located in the positioning conduit 28. The ventilation groove II 321 at the end is located on the outside of the precursor II duct 18, the precursor II storage chamber 8 is connected with the precursor II duct 18, the precursor II enters the precursor II storage chamber 8 through the precursor II duct 18 for replenishment, and the air inlet groove I 291 is located above the transverse through groove 601, so that the nitrogen branch pipe 13 and the air inlet pipe 12 are separated. At this time, the precursor I in the sub-chamber of the precursor I storage chamber 7 enters the inner chassis 2 through the air inlet pipe 12, and acts on the chip surface on the rotating carrier 11 in the inner chassis 2.

[0048] Then the hydraulic cylinder III 33 drives the piston shaft to move, so that the movable guide tube 29 moves to the position as shown in FIG. Fig.12 In the state shown, the ventilation groove II 321 is located in the precursor II conduit 18, the air inlet groove II 293 at one end of the movable conduit 29 close to the piston sleeve II 32 is located in the precursor II storage chamber 8, so that the precursor II storage chamber 8 is connected with the air inlet pipe 12, and the air inlet groove II 293 at the other end of the movable conduit 29 is located in the precursor II storage chamber 8, and the precursor I storage chamber 7 and the air inlet pipe 12 are separated. The ventilation groove I 311 is located outside the precursor I conduit 16, and the precursor I enters the precursor I storage chamber 7 through the precursor I conduit 16 for replenishment. The air inlet groove I 291 is located below the transverse through groove 601, so that the nitrogen branch pipe 13 and the air inlet pipe 12 are separated. At this time, the precursor II in the precursor II storage chamber 8 enters the inner chassis 2 through the air inlet pipe 12, and acts on the chip surface on the rotating carrier 11 in the inner chassis 2, thereby completing a layer of coating on the surface of the chip.

[0049] Finally, the hydraulic cylinder III 33 drives the piston shaft to move in the reverse direction, so that the movable guide tube 29 moves to the position as shown in FIG. Fig.13 In the state shown, the air inlet grooves II 293 at both ends of the movable conduit 29 are both located in the positioning conduit 28, the precursor I storage chamber 7 and the precursor II storage chamber 8 are separated from the air inlet pipe 12, and the air inlet groove I 291 is located at the transverse through groove 601, so that the nitrogen branch pipe 13 and the air inlet pipe 12 are connected, and the nitrogen enters the inner chassis 2 through the nitrogen branch pipe 13 and the air inlet pipe 12 for flushing, and the excess unreacted precursor in the inner chassis 2 is flushed away to ensure that only a single layer of film is retained on the chip substrate, and then the hydraulic cylinder III 33 drives the piston shaft to move in the opposite direction, so that the movable conduit 29 moves to the position as shown in FIG. Fig.11 Just continue coating as shown.

Claims

1. A coating machine for semiconductor chip manufacturing, comprising an outer case (1), one side of the outer case (1) being connected to a nitrogen main pipe (14), a precursor I main pipe (17) and a precursor II main pipe (19), and the other side of the outer case (1) being provided with a vacuum pumping device, characterized in that: An inner case (2) is provided inside the outer case (1), a plurality of rotating carriers (11) are arranged equidistantly in the longitudinal direction, and each rotating carrier (11) is provided with a chip placement slot, the outer side of the rotating carrier (11) is movably sleeved and sealed with the inner wall of the inner case (2), two partitions (3) are provided between the outer side of the front and back sides of the inner case (2) and the inner wall of the outer case (1), and a door panel (4) is provided on the front side of the outer case (1), and a side of the inner case (2) is provided with the same number of air outlet slots as the number of rotating carriers (11), and the air outlet slots are connected to the inner cavity of the inner case (2) and the vacuum pumping device; When in use, the chips on each layer of the rotating carrier (11) are coated at the same time, and the coating of the chips on each layer of the rotating carrier (11) does not affect each other; A longitudinal baffle (6) is provided between the side of the inner case (2) away from the vacuum pumping device and the inner wall of the outer case (1), and the longitudinal baffle (6) divides the left chamber of the partition (3) between the outer case (1) and the inner case (2) into a precursor I storage chamber (7) and a precursor II storage chamber (8), wherein the precursor I storage chamber (7) is connected to the precursor I main pipe (17), and the precursor II storage chamber (8) is connected to the precursor II main pipe (19). (6) is provided with transverse through grooves (601) having the same number as the air outlet grooves and corresponding positions, an air intake pipe (12) is fixedly mounted on one side of the transverse through groove (601), the air intake pipe (12) communicates with the transverse through groove (601) and the inner cavity of the inner chassis (2), and the other side of the transverse through groove (601) is connected to a nitrogen branch pipe (13), one end of the nitrogen branch pipe (13) extends to the outside of the outer chassis (1) and is connected to the nitrogen main pipe (14); The interior of the precursor I storage chamber (7) and the precursor II storage chamber (8) are both provided with a plurality of transverse baffles (15) arranged at equal intervals in the longitudinal direction, the transverse baffles (15) dividing the precursor I storage chamber (7) and the precursor II storage chamber (8) into a plurality of independent precursor sub-chambers, and the number of precursor sub-chambers in the precursor I storage chamber (7) and the precursor II storage chamber (8) is the same as the number of nitrogen branch pipes (13), and an air intake valve device penetrating the transverse through groove (601) is fixedly mounted on the longitudinal baffle (6), and the two ends of the air intake valve device extend into the precursor I storage chamber (7) and the precursor II storage chamber (8) respectively; The intake valve device comprises a positioning conduit (28) fixedly mounted on the longitudinal baffle (6), the positioning conduit (28) being arranged perpendicularly to the transverse through slot (601), vent holes (281) being respectively provided on both sides of the middle of the positioning conduit (28), one of the vent holes (281) being directed toward the nitrogen branch pipe (13), and the other of the vent holes (281) being directed toward the intake pipe (12), a movable conduit (29) being movably sleeved inside the positioning conduit (28), an intake groove I (291) being provided in the middle of the side of the movable conduit (29) facing the nitrogen branch pipe (13), and the size of the intake groove I (291) being matched to the size of the vent hole (281), and an outlet groove being provided on the side of the movable conduit (29) facing the intake pipe (12), and the outlet groove The length value is three times the length value of the vent hole (281), both ends of the air inlet groove I (291) are provided with air inlet grooves II (293), and the two ends of the air inlet groove I (291) are respectively fixedly connected with a piston sleeve I (31) and a piston sleeve II (32) through a U-shaped connecting piece (30), the end of the piston sleeve I (31) away from the movable conduit (29) is movably connected to one end of the precursor I conduit (16), the end of the piston sleeve II (32) away from the movable conduit (29) is movably connected to the precursor II conduit (18), the end of the piston sleeve I (31) close to the U-shaped connecting piece (30) is provided with a vent groove I (311), and the end of the piston sleeve II (32) close to the U-shaped connecting piece (30) is provided with a vent groove II (321); An L-shaped bracket is fixedly mounted on one side of the longitudinal baffle (6), a hydraulic cylinder III (33) is fixedly mounted on the L-shaped bracket, a piston shaft of the hydraulic cylinder III (33) is fixedly connected to a linkage block (34), a linkage shaft (35) is fixedly connected to one side of the linkage block (34), and an end of the linkage shaft (35) away from the linkage block (34) is fixedly connected to one of the U-shaped connecting members (30).

2. The coating machine for semiconductor chip manufacturing according to claim 1, characterized in that: A rotating shaft (9) is mounted in the middle of the inner cavity of the inner case (2). The rotating shaft (9) is driven to rotate by a motor (10) disposed in the inner cavity at the bottom of the outer case (1). The rotating shaft (9) is connected to the rotating carrier (11) through a linkage device. A positioning support plate (24) located below the rotating carrier (11) is fixedly mounted inside the inner case (2). An ejection device (27) close to one side of the door panel (4) is fixedly mounted on the top of the positioning support plate (24).

3. The coating machine for semiconductor chip manufacturing according to claim 2, characterized in that: The linkage device comprises a locking sleeve (20) fixedly mounted on the rotating shaft (9), a positioning ring plate (21) fixedly mounted on the top of the locking sleeve (20), the positioning ring plate (21) being mounted on the outside of the rotating shaft (9), and a friction disk I (22) fixedly mounted on the top of the positioning ring plate (21), a friction disk II (23) fixedly mounted on the bottom of the rotating carrier (11), and the bottom of the friction disk II (23) being frictionally connected to the top of the friction disk I (22).

4. The coating machine for semiconductor chip manufacturing according to claim 3, characterized in that: Two hydraulic cylinders I (25) located below the positioning ring plate (21) are fixedly mounted on the positioning support plate (24); piston shafts of the hydraulic cylinders I (25) are fixedly connected to a passive ring plate (26); and the passive ring plate (26) is connected to the positioning ring plate (21) via a plane bearing.

5. The coating machine for semiconductor chip manufacturing according to claim 2, characterized in that: The ejection device (27) comprises a hydraulic cylinder II (271), the piston shaft of the hydraulic cylinder II (271) being fixedly connected to a moving disk (272), a plurality of positioning shafts (273) distributed in a circumferential array being fixedly mounted on the outer edge of the top of the moving disk (272), and a support block (274) being fixedly mounted on the top of the positioning shaft (273).

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