A color photovoltaic room-temperature packaging method for reducing glue overflow and bubbles

Abstract

The present invention discloses a color photovoltaic room temperature packaging method for reducing glue overflow and bubbles, which relates to the technical field of color photovoltaic packaging, and includes the following steps: selecting a front plate glass and a photovoltaic module back plate glass, cleaning and pre-treating them; using laser technology to make uniformly distributed micropores on the front plate glass; using a spraying device to uniformly spray a transparent adhesive on the back plate glass to form an adhesive layer with excellent adhesion, light transmittance and fluidity; spraying color on the front plate glass, with the color picture of the front plate glass facing downward, aligning and bonding with the back plate glass sprayed with varnish adhesive; packaging under normal temperature conditions; and curing by ultraviolet curing technology after packaging. The present invention effectively discharges bubbles and reduces glue overflow by setting a microporous structure on the front plate glass, thereby improving the packaging quality and the optical performance of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of color photovoltaic packaging, and in particular to a color photovoltaic room-temperature packaging method capable of reducing glue overflow and bubbles. Background Art

[0002] In recent years, with the advancement of photovoltaic building integration, monotonous black photovoltaic modules are difficult to meet the aesthetic requirements of building exterior design, and colored photovoltaic modules are increasingly recognized by the market. At the same time, the market has more and more requirements for colored photovoltaic modules, such as: high power generation efficiency, long service life, and a variety of optional colors.

[0003] The existing photovoltaic packaging method is a high-temperature lamination method, which combines the photovoltaic glass and the front glass by melting the EVA film at high temperature. The above packaging method has the following disadvantages:

[0004] 1. The above traditional packaging method has high energy consumption, high temperature conditions, and long equipment startup time, resulting in energy waste;

[0005] 2. The above traditional EVA method is easy to overflow around the photovoltaic modules, and some packaging films are easy to produce harmful gases and waste;

[0006] 3. Because glass has curvature, bubbles are easily generated during packaging.

[0007] Therefore, those skilled in the art provide a color photovoltaic room-temperature packaging method that reduces glue overflow and bubbles to solve the problems raised in the above background technology. Summary of the invention

[0008] The present invention provides a method for room temperature packaging through a microporous structure on a front glass plate, which effectively discharges bubbles and reduces glue overflow, thereby improving the packaging quality and the optical performance of the product; the room temperature packaging process reduces production costs and energy consumption, and the front glass plate and the back glass plate are bonded together by an adhesive, while avoiding the problems of thermal stress and deformation that may be caused by high-temperature packaging, thereby providing a color photovoltaic room temperature packaging method that reduces glue overflow and bubbles.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] A color photovoltaic room-temperature packaging method for reducing glue overflow and bubbles of the present invention comprises:

[0011] Step 1: Select the front glass and the back glass of the photovoltaic module for cleaning and pretreatment;

[0012] Step 2: Using laser technology to create uniformly distributed micro-holes on the front glass;

[0013] Step 3: Use a spraying device to evenly spray a transparent adhesive on the back glass to form an adhesive layer with excellent adhesion, light transmittance and fluidity;

[0014] Step 4: Spray color on the front glass, place the colored image of the front glass facing downward, and align and bond it with the back glass sprayed with varnish adhesive;

[0015] Step 5: Encapsulate at room temperature, use the microporous structure on the front glass to discharge bubbles and reduce the occurrence of glue overflow, and use a glue roller to assist in applying pressure to accelerate the removal of bubbles;

[0016] Step 6: After packaging, use UV curing technology to cure.

[0017] Furthermore, the diameter of the micropores in step 2 is 1-100 μm, and the distance between adjacent micropores is 1-100 μm.

[0018] Furthermore, the thickness of the adhesive layer in step three is 0.08±0.01 mm.

[0019] Furthermore, the amount of the adhesive sprayed on the back glass in step three is 80±3 ml per square meter.

[0020] Furthermore, the spraying range of the adhesive in step three is 2-5 mm smaller than the back panel glass.

[0021] Furthermore, in step six, the wavelength of the ultraviolet lamp is 300-395nm.

[0022] Furthermore, in step six, the temperature of the UV lamp is 30°C, with an error of 3°C.

[0023] Furthermore, in step six, the distance between the ultraviolet lamp and the encapsulated front glass and rear glass is 500 microns.

[0024] Furthermore, in the step 1, the front plate glass and the back plate glass are cleaned until there is no dust and impurities visible to the naked eye, and after cleaning, plasma treatment is performed until the dyne value of the surface material of the front plate glass and the back plate glass exceeds 50.

[0025] In the above technical solution, the present invention provides a color photovoltaic room temperature packaging method for reducing glue overflow and bubbles, which has the following beneficial effects:

[0026] 1. The present invention provides a microporous structure on the front glass plate to effectively discharge bubbles and reduce glue overflow, thereby improving the packaging quality and the optical performance of the product.

[0027] 2. The adhesive has good adhesion and light transmittance, ensuring the close bonding between the front glass and the back glass and the effective transmission of light.

[0028] 3. The room temperature packaging process reduces production costs, improves production efficiency, and avoids the problems that may be caused by high temperature packaging.

[0029] 4. This method is suitable for glass packaging needs of various sizes and shapes and has wide applicability and flexibility. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] A color photovoltaic room-temperature packaging method for reducing glue overflow and bubbles according to an embodiment of the present invention comprises:

[0032] Step 1: Select the front glass and the back glass of the photovoltaic module, clean the front glass and the back glass until there is no dust and impurities visible to the naked eye, and then perform plasma treatment until the dyne value of the surface material of the front glass and the back glass exceeds 50, which can be tested with a dyne pen;

[0033] Step 2: Use laser technology to create uniformly distributed micropores on the front glass. The diameter of the micropores is 1-100μm, and the distance between adjacent micropores is 1-100μm. The micropores not only help to discharge bubbles, but also increase the light penetration efficiency to a certain extent. The micropores are designed to discharge bubbles and reduce glue overflow, avoid bubble generation, and improve the quality and performance of photovoltaic modules.

[0034] Step 3: Use a spraying device to evenly spray a transparent adhesive on the back glass to form an adhesive layer with excellent adhesion, light transmittance and fluidity, wherein the adhesive is a varnish adhesive; the thickness of the adhesive layer is 0.08±0.01mm, and the amount of the adhesive sprayed on the back glass is 80±3ml per square meter. The spraying range of the adhesive in step 3 is 2-5mm smaller than that of the back glass; the properties of the varnish adhesive enable it to fit tightly to the front glass and the back glass, and at the same time, in combination with the micropores, it can reduce the overflow of the adhesive at the interface;

[0035] Step 4: Spray the color on the front glass, place the color image of the front glass facing downward, and align it with the back glass sprayed with varnish adhesive, so that the color is on the inner layer and combined with the adhesive, which can improve the service life and firmness of the component;

[0036] Step 5: Encapsulate at room temperature, use the microporous structure on the front glass to discharge bubbles, reduce the occurrence of glue overflow, and use a glue roller to assist in applying pressure to accelerate the removal of bubbles. At the same time, the transparent adhesive enters the micropores. Therefore, the present application is transparent, which can increase the penetration of light and improve the power generation efficiency of photovoltaic modules. Under this condition, the micropores will be filled with adhesive, thereby reducing the entry of water vapor and air, which helps to improve the service life; Encapsulate at room temperature to avoid the expansion of materials and increased fluidity caused by high temperature, thereby reducing the risk of glue overflow;

[0037] Step 6. After packaging, use UV curing technology for curing. The wavelength of the UV lamp is 300-395nm, the temperature is 30°C, the error is 3°C, and the distance between the medium UV lamp and the front and rear glass after packaging is 500 microns. Compared with traditional thermal curing packaging, room temperature UV curing packaging has the advantages of low energy consumption, fast curing speed and less material consumption.

[0038] The specific process of curing with UV curing technology is as follows: start the equipment, set parameters such as conveyor belt speed and UV curing lamp power; place the photovoltaic modules to be cured on the conveyor belt, and the conveyor belt transports the modules to the inside of the equipment; turn on the UV curing lamp in advance, and automatically adjust to maintain a distance of 5mm from the modules according to the height of the modules; the UV curing lamp performs segmented curing according to the length of the modules; after curing is completed, the UV curing lamp automatically turns off, and the water-cooled heat dissipation device starts to dissipate heat from the equipment.

[0039] After the overall packaging is completed, necessary post-processing steps are carried out, such as curing, cleaning, etc. These steps can further ensure the curing effect and stability of the adhesive and reduce the glue overflow caused by uncured or poorly cured.

[0040] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles, characterized in that: include: Step 1: Select the front glass and the back glass of the photovoltaic module for cleaning and pretreatment; Step 2: Using laser technology to create uniformly distributed micro-holes on the front glass; Step 3: Use a spraying device to evenly spray a transparent adhesive on the back glass to form an adhesive layer with excellent adhesion, light transmittance and fluidity; Step 4: Spray color on the front glass, place the front glass with the color image facing downward, and align and bond it with the back glass sprayed with varnish adhesive; Step 5: Encapsulate at room temperature, use the microporous structure on the front glass to discharge bubbles and reduce the occurrence of glue overflow, and use a glue roller to assist in applying pressure to accelerate the removal of bubbles; Step 6: After packaging, use UV curing technology to cure.

2. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 1, characterized in that: The diameter of the micropores in step 2 is 1-100 μm, and the distance between adjacent micropores is 1-100 μm.

3. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 1, characterized in that: The thickness of the adhesive layer in step three is 0.08±0.01 mm.

4. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 3, characterized in that: The amount of the adhesive sprayed on the back glass in step 3 is 80±3 ml per square meter.

5. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 3, characterized in that: The spraying range of the adhesive in step 3 is 2-5 mm smaller than the back glass.

6. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 1, characterized in that: In step six, the wavelength of the ultraviolet lamp is 300-395nm.

7. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 6, characterized in that: In step six, the temperature of the UV lamp is 30°C, with an error of 3°C.

8. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 7, characterized in that: In step six, the distance between the UV lamp and the encapsulated front glass and rear glass is 500 microns.

9. A color photovoltaic room temperature packaging method for reducing glue overflow and bubbles according to claim 1, characterized in that: In the step 1, the front plate glass and the back plate glass are cleaned until there is no dust and impurities visible to the naked eye, and after cleaning, plasma treatment is performed until the dyne value of the surface material of the front plate glass and the back plate glass exceeds 50.