Semiconductor laser and semiconductor laser side pump module

Abstract

The present invention relates to the field of lasers, specifically a semiconductor laser and a semiconductor laser side pump module. It includes a water-passing mechanism, an initial positioning assembly, a laser module and a terminal tightening plate; the initial positioning assembly includes a mounting plate installed on the upper part of the water-passing mechanism and a plurality of guide positioning plates evenly arranged in a ring shape around the central axis of the mounting plate at the bottom of the mounting plate; the laser module is arranged horizontally and multiple groups are evenly distributed in a spiral shape along the vertical direction. The laser module includes a water cooling mechanism connected to the water-passing mechanism, multiple groups of clamping assemblies evenly distributed around the central axis of the water cooling mechanism, and multiple lasers distributed in a ring shape. The water cooling mechanism includes a hollow cooling ring in an annular shape; the terminal tightening plate is installed at the lower part of the water-passing mechanism and is tightened on the clamping assembly of the lowest laser module. The present invention can synchronously press multiple lasers to achieve regular assembly, and multiple lasers are centrally cooled through the same cooling ring. The structure of the laser itself is relatively simple.

Description

Technical Field

[0001] The invention relates to the field of lasers, and in particular to a semiconductor laser and a semiconductor laser side pump module. Background Art

[0002] Chinese patent announcement number CN112821185B discloses a semiconductor laser and a semiconductor laser side pump module, including an insulating water-cooling plate, a plurality of laser units, a positive lead-out plate, a negative lead-out plate and a fixing assembly. The positive lead-out plate is arranged between the insulating water-cooling plate and the positive electrode plate and is provided with two connecting holes, having a first exposed portion, and a protruding series portion is provided on the second to the last first exposed portion along a preset direction. The negative lead-out plate is fitted on the negative electrode plate, having a second exposed portion, and the first to the second to the last second exposed portion along the preset direction are fitted with the adjacent series portion along the preset direction.

[0003] However, the above technical solution has the following disadvantages: in the semiconductor laser, the water path is distributed inside the insulating water cooling plate, there are many small parts, and the semiconductor laser itself has a complex structure. When multiple semiconductor lasers are installed in a ring shape, on the one hand, it is not easy to achieve uniform and regular installation, and on the other hand, the water path is complex and inconvenient to connect. Summary of the invention

[0004] The purpose of the present invention is to address the problems existing in the background technology and to propose a semiconductor laser and a semiconductor laser side pump module. The structure of the laser itself is relatively simple, and multiple lasers can be installed in a regular manner, and multiple lasers can be centrally cooled through the same cooling ring.

[0005] The present invention provides a semiconductor laser and a semiconductor laser side pump module, comprising a water-passing mechanism, an initial positioning assembly, a laser module and a terminal tightening plate; the initial positioning assembly comprises a mounting plate mounted on the upper part of the water-passing mechanism and a plurality of guide positioning plates uniformly arranged in a ring shape around the central axis of the mounting plate at the bottom of the mounting plate; the laser module is arranged horizontally and a plurality of groups are uniformly distributed in a spiral shape along the vertical direction; the laser module comprises a water-cooling mechanism connected to the water-passing mechanism, a plurality of groups of clamping assemblies uniformly distributed around the central axis of the water-cooling mechanism and a plurality of lasers distributed in a ring shape; the water-cooling mechanism comprises a hollow cooling ring in a ring shape, and the clamping assembly is rotatably arranged on the cooling ring. on the inner ring surface of the cooling ring; in the placed state, the upper part of the clamping assembly is inclined from bottom to top toward the central axis of the cooling ring, and a placement space for the laser is formed between each two adjacent groups of clamping assemblies; when multiple groups of laser modules are installed in sequence from bottom to top, the clamping assemblies in the first group of laser modules are guided by the guide positioning plate and the placed lasers are pressed against the inner ring surface of the cooling ring, and the clamping assemblies in the remaining laser modules are guided by the clamping assemblies in the adjacent upper laser modules and the corresponding placed lasers are pressed against the inner ring surface of the cooling ring; the terminal clamping plate is installed at the lower part of the water-passing mechanism and is pressed against the clamping assembly of the lowest laser module.

[0006] Preferably, the laser comprises a substrate and a laser chip mounted on the substrate, the laser chip faces the central axis of the cooling ring, and the laser chip is exposed between two adjacent clamping components.

[0007] Preferably, the outer ring of the cooling ring has a water inlet end and a water outlet end which are relatively distributed, and the inner ring of the cooling ring has a plurality of mounting surfaces and cooling surfaces which are evenly and alternately distributed in an annular shape.

[0008] Preferably, the lower part of the guide and positioning plate is gradually inclined from top to bottom toward the center axis of the cooling ring, and the clamping assembly includes a connecting electrode for electrically contacting two adjacent lasers, a connecting platform arranged at the lower part of the inner ring surface of the cooling ring, and a clamping part rotatably connected to the connecting platform, the connecting electrode is installed on the clamping part, the center of gravity height of the clamping part is higher than the height of the rotation center axis of the clamping part, and the distances from the bottom end of the clamping part and the bottom end of the guide and positioning plate to the center axis of the cooling ring are respectively smaller than the distance from the top end of the clamping part to the center axis of the cooling ring.

[0009] Preferably, the clamping part includes a main plate portion, a limiting plate portion connected to the main plate portion and located below the connecting platform, a positioning plate portion connected to the main plate portion and located below the limiting plate portion, a guide plate portion and an abutting plate portion respectively connected to the bottom and top of the main plate portion, two guide plate portions respectively connected to both sides of the upper portion of the main plate portion, two side plate portions respectively connected to both sides of the middle portion of the main plate portion, and a supporting plate portion connected to the bottom end of the side plate portion, the limiting plate portion, the guide plate portion, the supporting plate portion and the positioning plate portion are all folded along a direction away from the central axis of the cooling ring, the upper portion of the guide plate portion is inclined inwardly, the side plate portion is folded along a direction away from the inner ring of the cooling ring, the guide plate portion is gradually inclined toward the central axis of the cooling ring from top to bottom, the abutting plate portion is staggered with the main plate portion along a direction away from the central axis of the cooling ring, and the staggered width is the thickness of the main plate portion; the connecting electrode is arranged to fit the main plate portion and the two side plate portions; the mounting plate and the terminal tightening plate both have an annular through channel, and the top surface of the terminal tightening plate is pressed against the bottom surface of the positioning plate portion.

[0010] Preferably, the water cooling mechanism also includes two groups of elastic connecting mechanisms respectively connected at the water inlet and the water outlet, the elastic connecting mechanism includes an elastic connecting component, a sealing ring and a sealing platform which are connected in sequence along the direction away from the cooling ring, the elastic connecting component includes a rubber sleeve and a spring, the rubber sleeve includes a spiral sleeve portion and a rubber portion, the rubber portion is axially connected to the spiral surface of the spiral sleeve portion and forms a through channel on the inner side, the spiral sleeve portion has an installation channel for embedding the spring, the ends of the rubber sleeve and the spring are flush, the rubber sleeve and the spring have one end on the same side both sealedly connected to the cooling ring, the rubber sleeve and the spring have the other end on the same side both sealedly connected to the sealing ring, the sealing ring has a connecting hole a, and the sealing platform has a connecting hole b.

[0011] Preferably, the water-passing mechanism includes two groups of water-passing installation components that are evenly distributed in an annular shape and detachably connected. The water-passing installation components include a semi-annular hollow water tank and a plurality of guide columns distributed in sequence around the central axis on the inner ring surface of the water tank. The guide columns are vertically arranged. The guide columns have vertically distributed guide channels for the sealing ring to slide. The upper part of the guide channel has water-passing holes for the sealing platform to be inserted. The water-passing holes on the plurality of guide columns are distributed in a spiral shape. The top of the water tank has a through hole, and the inner ring of the water tank has a water flow hole connected to the water-passing hole.

[0012] Preferably, in the same water-passing installation assembly, the bottom ends of multiple guide columns are flush and the top heights are distributed in a spiral direction in sequence, the bottom end of the guide channel is open, the top heights of multiple guide channels are distributed in a spiral direction in sequence, and the mounting plate and the terminal tightening plate are respectively installed at the top and bottom of the longest guide column.

[0013] Preferably, the outer peripheral surface of the sealing platform is a truncated cone-shaped side surface, and the water through hole has a conical inner surface that matches the truncated cone-shaped side surface.

[0014] Preferably, a guide mechanism is arranged inside the cooling ring, and the guide mechanism includes a guide platform a, a guide platform b and two groups of symmetrically distributed guide components. The guide platform a and the guide platform b are both arranged on the inner circumferential surface of the cooling ring. The guide platform a and the guide platform b are both vertically distributed triangular columnar structures with their tips facing the water inlet and the water outlet respectively. The guide component includes a plurality of guide plates a arranged on the inner circumferential surface of the cooling ring and a plurality of guide plates b arranged on the outer circumferential surface of the cooling ring. The plurality of guide plates a and the plurality of guide plates b are alternately distributed and evenly distributed along a circular arc. The guide plates a and the guide plates b are both inclined in the direction of water flow, and the ends are bent to one side toward the water flow.

[0015] Compared with the prior art, the present invention has the following beneficial technical effects:

[0016] The present invention can simultaneously press multiple lasers to achieve regular assembly of lasers, and centrally cool and dissipate heat through the same cooling ring to ensure the service life of the lasers. The structure of the laser itself is relatively simple. The laser module is connected to the water-passing mechanism through the cooling ring, and the water path is relatively simple. Each time a group of laser modules is installed upward in place, the multiple lasers in the laser module can be automatically pressed to the corresponding cooling surface to ensure the regularity of the laser installation and to ensure that the heat is effectively transferred to the cooling ring when the laser is running, thereby improving the heat dissipation efficiency and heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of a laser module in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A partial structural cross-sectional view;

[0019] Figure 3 It is a schematic diagram of the structure of the connecting electrode, the connecting platform and the clamping member in the embodiment of the present invention;

[0020] Figure 4 It is the structural explosion diagram of the rubber sleeve, spring, sealing ring and sealing platform;

[0021] Figure 5 It is a schematic diagram of the structure of the semiconductor laser side pump module in the assembled state;

[0022] Figure 6 for Figure 5 The structural diagram without the water tank;

[0023] Figure 7 for Figure 6 A partial structural cross-sectional view;

[0024] Figure 8 for Figure 7 A magnified view of the structure at center A;

[0025] Fig. 9 for Figure 7 A magnified view of the structure at B in the middle;

[0026] Fig.10 for Figure 7 A magnified view of the structure at C in the middle;

[0027] Fig.11 It is a structural exploded diagram of the water tank, guide column a, guide column b and guide column c;

[0028] Fig.12 is a schematic diagram of the structure of the guide column a;

[0029] Fig.13 This is a cross-sectional view of the structure after adding a guide platform and guide plates in the cooling ring.

[0030] Figure numerals: 100, laser module; 1, cooling ring; 101, water inlet; 102, water outlet; 103, mounting surface; 104, cooling surface; 2, rubber sleeve; 3, spring; 4, sealing ring; 5, sealing platform; 6, laser; 61, substrate; 62, laser chip; 7, connecting electrode; 8, connecting platform; 9, clamping part; 91, main plate; 92, limit plate; 93, guide plate; 94, side plate; 95, support plate; 96, guide plate; 97, positioning Plate portion; 98, abutment plate portion; 10, guide positioning plate; 11, mounting plate; 12, terminal tightening plate; 13, water tank; 131, through hole; 14, guide column a; 141, guide channel a; 142, water hole a; 15, guide column b; 151, guide channel b; 152, water hole b; 16, guide column c; 161, guide channel c; 162, water hole c; 171, guide platform a; 172, guide platform b; 181, guide plate a; 182, guide plate b. DETAILED DESCRIPTION

[0031] Embodiment 1, as Figure 1-Figure 12 As shown, a semiconductor laser and a semiconductor laser side pump module proposed in this embodiment include a water passing mechanism, an initial positioning component, a laser module 100 and a final tightening plate 12.

[0032] like Figure 5 , Figure 6 , Figure 7 and Fig. 9 As shown, the initial positioning assembly includes a mounting plate 11 mounted on the upper part of the water-passing mechanism and a plurality of guide positioning plates 10 uniformly arranged in a ring shape at the bottom of the mounting plate 11 around the central axis of the mounting plate 11 .

[0033] The laser module 100 is arranged horizontally and evenly distributed in a spiral shape in the vertical direction. The laser module 100 includes a water cooling mechanism connected to the water supply mechanism, multiple groups of clamping components evenly distributed around the central axis of the water cooling mechanism, and multiple lasers 6 distributed in a ring shape. The laser 6 includes a substrate 61 and a laser chip 62 mounted on the substrate 61. The laser chip 62 faces the central axis of the cooling ring 1. The laser chip 62 is exposed between two adjacent clamping components, so that it can emit lasers. A crystal rod is arranged at the central axis of the multiple groups of laser modules 100, and all laser chips 62 irradiate the crystal rod vertically.

[0034] The water cooling mechanism includes a hollow cooling ring 1 in an annular shape. The outer ring of the cooling ring 1 has a relatively distributed water inlet end 101 and a water outlet end 102. Water enters from the water inlet end 101 and is discharged from the water outlet end 102. When the water circulates inside the cooling ring 1, it takes away the heat transferred to the cooling ring 1 during the operation of the laser 6. The inner ring of the cooling ring 1 has a plurality of mounting surfaces 103 and cooling surfaces 104 that are evenly and alternately distributed in an annular shape, and the mounting surfaces 103 and the cooling surfaces 104 are connected.

[0035] The clamping assembly is rotatably arranged on the inner ring surface of the cooling ring 1. In the placement state where the laser 6 is to be placed, the upper part of the clamping assembly is inclined from bottom to top toward the central axis direction of the cooling ring 1, and a placement space for the laser 6 is formed between each two adjacent groups of clamping assemblies, which can position the placement process of the laser 6 and facilitate the accurate placement of the laser 6 in the placement space. When multiple groups of laser modules 100 are installed sequentially from bottom to top, the clamping assembly in the first group of laser modules 100 is guided by the guide positioning plate 10 and presses the placed laser 6 on the inner ring surface of the cooling ring 1, specifically on the cooling surface 104, and the clamping assemblies in the remaining laser modules 100 are guided by the clamping assemblies in each adjacent upper laser module 100 and press the corresponding placed laser 6 on the inner ring surface of the cooling ring 1, specifically on the cooling surface 104, and the substrate 61 of the laser 6 can be closely attached to the cooling surface 104, which is more conducive to heat conduction and heat dissipation. When installing the laser module 100 , the multiple snap-in components in the laser module 100 can be pushed synchronously, the snap-in components drive the multiple lasers 6 to move, and the multiple lasers 6 are synchronously pressed on the cooling surfaces 104 in corresponding positions, thereby achieving regular assembly of the multiple lasers 6 .

[0036] The final clamping plate 12 is installed at the lower part of the water-passing mechanism and is pressed against the clamping assembly of the lowest laser module 100, thereby clamping the clamping assemblies in multiple groups of laser modules 100 between the initial positioning assembly and the final clamping plate 12 to prevent the laser modules 100 from falling off and also prevent multiple lasers 6 from scattering.

[0037] The working principle of this embodiment is as follows: multiple lasers 6 are pressed synchronously to achieve regular assembly of the lasers 6, and multiple lasers 6 are centrally cooled and dissipated through the same cooling ring 1 to ensure the service life of the lasers 6. The structure of the laser 6 itself is relatively simple. The laser module 100 is connected to the water-passing mechanism through the cooling ring 1, and the water path is relatively simple. Each time a group of laser modules 100 is installed upwardly in place, the multiple lasers 6 in the laser module 100 can be automatically pressed to the corresponding cooling surface 104. On the one hand, the regularity of the installation of the laser 6 is ensured. On the other hand, the water cooling mechanism can be connected to the water-passing mechanism after the laser module 100 is installed in place. On the other hand, it can also ensure that the heat is effectively transferred to the cooling ring 1 when the laser 6 is running, thereby improving the heat dissipation efficiency and heat dissipation effect.

[0038] Embodiment 2, as Figure 1-Figure 12 As shown, a semiconductor laser and a semiconductor laser side pump module proposed in this embodiment, compared with the first embodiment, in this embodiment, the lower part of the guide positioning plate 10 is gradually inclined from top to bottom toward the central axis direction of the cooling ring 1. The clamping assembly includes a connecting electrode 7 for electrically contacting two adjacent lasers 6, a connecting platform 8 arranged at the lower part of the inner ring surface of the cooling ring 1, and a clamping member 9 rotatably connected to the connecting platform 8, and the connecting platform 8 is specifically arranged at the lower part of the mounting surface 103. The connecting electrode 7 is mounted on the clamping member 9, and the clamping member 9 is an insulating structure. The height of the center of gravity of the clamping member 9 is higher than the height of the rotation center axis of the clamping member 9. When the upper part of the clamping member 9 is pushed inward, a placement space for the laser 6 can be formed. The distances from the bottom end of the clamp 9 and the bottom end of the guide positioning plate 10 to the central axis of the cooling ring 1 are respectively smaller than the distance from the top end of the clamp 9 to the central axis of the cooling ring 1, so as to ensure that the guide positioning plate 10 can guide the clamp 9 in the first group of installed laser modules 100 in an abutting manner, and the clamp 9 can also guide the clamp 9 below in an abutting manner during subsequent installation.

[0039] When installing the first group of laser modules 100, the clamping parts 9 in the first group of laser modules 100 will gradually rotate under the guidance of the guide positioning plate 10, and the upper part of the clamping parts 9 will rotate outwards. The clamping parts 9 drive the laser 6 to rotate outwards through the connecting electrode 7, and the laser 6 is pressed against the cooling surface 104 through the connecting electrode 7. The two ends of the connecting electrode 7 are respectively in electrical contact with the two adjacent lasers 6. When installing the remaining laser modules 100, the clamping parts 9 in the corresponding laser modules 100 will be guided by the clamping parts 9 in the upper laser module 100 that have been rotated into place, and the upper part will also rotate outwards, and the laser 6 will be pressed against the cooling surface 104.

[0040] like Figure 3As shown, the clamping component 9 includes a main plate portion 91, a limiting plate portion 92 connected to the main plate portion 91 and located below the connecting platform 8, a positioning plate portion 97 connected to the main plate portion 91 and located below the limiting plate portion 92, a guide plate portion 96 and an abutment plate portion 98 respectively connected to the bottom and top ends of the main plate portion 91, two guide plate portions 93 respectively connected to both sides of the upper portion of the main plate portion 91, two side plate portions 94 respectively connected to both sides of the middle portion of the main plate portion 91, and a support plate portion 95 connected to the bottom end of the side plate portion 94. The entire clamping component 9 is formed in one piece.

[0041] like Figure 1-Figure 3 As shown, the limit plate portion 92, the guide plate portion 93, the support plate portion 95 and the positioning plate portion 97 are all folded in the direction away from the central axis of the cooling ring 1. In the placed state, the upper portion of the main plate portion 91 is tilted inward, and the limit plate portion 92 abuts against the bottom surface of the cooling ring 1 for limiting, and sufficient placement space is formed between adjacent clamps 9 to place the laser 6. The upper portion of the guide plate portion 93 is tilted inward, and when the laser 6 is placed, the guide plate portion 93 is used to guide the laser 6. After the laser 6 is placed, the support plate portion 95 is used to lift the substrate 61 of the laser 6. After the clamp 9 presses the laser 6 into place by connecting the electrode 7, the positioning plate portion 97 tilts downward. The side plate portion 94 is folded along the direction away from the inner circle of the cooling ring 1 to correspond to the connecting electrode 7 in the form of a folded plate for mounting. The connecting electrode 7 is arranged to fit the main plate portion 91 and the two side plate portions 94. After the connecting electrode 7 presses the substrate 61 onto the cooling surface 104, the two ends of the connecting electrode 7 are respectively in regular electrical contact with the substrates 61 of the two adjacent lasers 6 to ensure good electrical connection.

[0042] The guide plate portion 96 gradually tilts from top to bottom toward the central axis of the cooling ring 1, and the abutment plate portion 98 is staggered with the main plate portion 91 in the direction away from the central axis of the cooling ring 1, and the staggered width is the thickness of the main plate portion 91. When the clip 9 moves upward with the laser module 100 to be installed, the abutment plate portion 98 at the top of the clip 9 will first abut against the inclined guide plate portion 96 in the upper clip 9. As the laser module 100 continues to move upward, the top of the abutment plate portion 98 gradually moves upward along the inclined guide plate portion 96, so that the upper part of the clip 9 rotates toward the inner ring of the cooling ring 1. When the abutment plate portion 98 moves upward to press against the positioning plate portion 97, the clip 9 reaches the same vertical state as the upper adjacent clip 9. At this time, the laser 6 is neatly pressed against the cooling surface 104.

[0043] Both the mounting plate 11 and the final clamping plate 12 have an annular through channel, and the top surface of the final clamping plate 12 is pressed against the bottom surface of the positioning plate portion 97. When the final clamping plate 12 is installed upward, the final clamping plate 12 can be moved up to a position abutting against the positioning plate portion 97 for installation through the guiding positioning of the annular through channel and the guide plate portion 96 of the lowest clamping part 9.

[0044] Working principle of this embodiment: the guide positioning plate 10 guides the clamping parts 9 in the first group of upwardly installed laser modules 100 in abutment form, and the clamping parts 9 in the installed laser modules 100 can guide the clamping parts 9 in the lower laser modules 100 in abutment form during subsequent installation. After the clamping parts 9 are guided, the upper part rotates outward and presses the laser 6 into place through the connecting electrode 7, thereby realizing the electrical connection between the connecting electrode 7 and the laser 6. After all laser modules 100 are installed, the final clamping plate 12 is moved up to a position where it abuts against the positioning plate portion 97 of the lowest clamping part 9 for installation. By tightening the final clamping plate 12 upward, all laser modules 100 are clamped between the initial positioning assembly and the final clamping plate 12.

[0045] Embodiment three, as Figure 1-Figure 12 As shown, a semiconductor laser and a semiconductor laser side pump module proposed in this embodiment, compared with the first and second embodiments, in this embodiment, the water cooling mechanism also includes two groups of elastic connecting mechanisms respectively connected at the water inlet end 101 and the water outlet end 102, and the elastic connecting mechanism includes an elastic connecting component, a sealing ring 4 and a sealing platform 5 connected in sequence in a direction away from the cooling ring 1. The elastic connecting component includes a rubber sleeve 2 and a spring 3, the rubber sleeve 2 includes a spiral sleeve part and a rubber part, the rubber part is axially connected to the spiral surface of the spiral sleeve part and forms a through channel on the inner side, the spiral sleeve part has an installation channel for the spring 3 to be embedded, the ends of the rubber sleeve 2 and the spring 3 are flush, the rubber sleeve 2 and the spring 3 are both sealed on the same side of the cooling ring 1, and the rubber sleeve 2 and the spring 3 are both sealed on the other side of the sealing ring 4. The spring 3 is used to make the elastic connecting component have elastic expansion and contraction characteristics, and the rubber sleeve 2 is used to make the elastic connecting component have water conveying characteristics and will not leak. When the spring 3 is expanded and contracted, the rubber sleeve 2 undergoes elastic deformation, but still maintains a sealed connection and can be used for water conveyance. The sealing ring 4 has a connecting hole a, and the sealing platform 5 has a connecting hole b. The cooling ring 1 and the water-passing mechanism are connected through two sets of elastic connecting mechanisms to achieve water cooling and heat dissipation.

[0046] The water-passing mechanism includes two groups of water-passing installation components that are evenly distributed in an annular shape and detachably connected. The water-passing installation components include a semi-annular hollow water tank 13 and three guide columns that are sequentially distributed around the central axis on the inner surface of the water tank 13. The three guide columns are guide column a14, guide column b15 and guide column c16. The guide columns are vertically arranged, and have guide channels that are vertically distributed and for the sealing ring 4 to slide. Specifically, the guide column a14 has a guide channel a141, the guide column b15 has a guide channel b151, and the guide column c16 has a guide channel c161. The depth of the guide channel is greater than the sum of the thicknesses of the sealing ring 4 and the sealing platform 5, and the width of the guide channel is adapted to the diameter of the sealing ring 4. When the sealing ring 4 slides, the sealing platform 5 also slides in the guide channel.

[0047] In order to further keep the elastic connection mechanism as a whole in a horizontal state and move in the vertical direction, a guide assembly is horizontally installed between the cooling ring 1 and the sealing ring 4. The guide assembly includes a slide bar and a guide cylinder. The slide bar is horizontally slidably connected to the guide cylinder. The slide bar is connected to the end face of the sealing ring 4, and the end of the guide cylinder is connected to the cooling ring 1. When the laser module 100 is installed upward, the guide assembly causes the spring 3 to deform in the horizontal direction, and the sealing ring 4 and the sealing platform 5 move in the horizontal direction.

[0048] The upper portion of the guide channel has a water hole for the sealing platform 5 to be inserted into. Specifically, the guide column a14 has a water hole a142, the guide column b15 has a water hole b152, and the guide column c16 has a water hole c162. The water holes on the three guide columns are distributed along a spiral shape, so that the elastic connecting mechanisms in the laser modules 100 at different heights can be connected.

[0049] The top of the water tank 13 has a through hole 131, and the inner circle of the water tank 13 has a water flow hole connected to the water through hole. The through hole 131 on the top of one water tank 13 is connected to an external water source, and the water flow hole, water through hole, elastic connecting mechanism and water inlet 101 on one side of the water tank 13 are connected in sequence, and the water outlet 102 is connected to the water flow hole of another water tank 13 through the corresponding elastic connecting mechanism and water through hole, and water is discharged through the through hole 131 on the top of the other water tank 13, and water takes away heat from the inside of the cooling ring 1 during the circulation process.

[0050] When the laser module 100 is installed upward, the sealing ring 4 moves upward along the guide channel, the elastic connecting component is squeezed and deformed, and when the sealing platform 5 moves to the height of the water hole, the elastic connecting component releases elastic potential energy and stretches, so that the sealing platform 5 is stuck in the water hole. If the sealing platform 5 cannot be automatically stuck in the water hole, a rod-shaped tool is used to push the sealing ring 4 and the sealing platform 5 upward until the sealing platform 5 is stuck in the water hole, which plays a role in preventing the entire laser module 100 from falling. When the terminal top plate 12 is installed in place, all the sealing platforms 5 are sealed and connected in the water hole.

[0051] In the same water-through installation assembly, the bottom ends of the three guide posts are flush and the top heights are distributed in a spiral direction in sequence. The bottom end of the guide channel is open and provided with a guide bevel. The top heights of the three guide channels are distributed in a spiral direction in sequence. The lengths of the guide posts a14, b15 and c16 decrease in sequence. The water-through hole a142 on the guide post a14 is used to communicate with the elastic connection assembly of the top laser module 100, the water-through hole b152 on the guide post b15 is used to communicate with the elastic connection assembly of the second group of laser modules 100, and the water-through hole c162 on the guide post c16 is used to communicate with the elastic connection assembly of the bottom laser module 100, thereby staggering the elastic connection mechanisms of laser modules 100 of different heights. The mounting plate 11 and the terminal top plate 12 are respectively installed at the top and bottom ends of the longest guide post, i.e., the top and bottom ends of the guide post a14.

[0052] The outer peripheral surface of the sealing platform 5 is a truncated cone-shaped side surface, and the water hole has a conical inner surface that matches the truncated cone-shaped side surface, so that the sealing platform 5 can be better connected with the water hole and is easy to insert. In addition, a ceramic ring can be added to the outer end surface of the sealing platform 5. When the laser module 100 moves up, the end surface of the ceramic ring abuts against the surface of the guide channel of the guide column. The ceramic ring made of ceramic material has a low friction coefficient and can slide smoothly. After the sealing platform 5 is inserted into the water hole, the truncated cone-shaped side surface of the sealing platform 5 is sealed and abutted against the conical inner surface of the water hole. The middle part of the ceramic ring has an opening and will not block the flow of water.

[0053] Working principle of this embodiment: The guide column can guide the upward movement of the laser module 100, which is specifically achieved by the sliding of the sealing ring 4 and the sealing platform 5 in the elastic connecting mechanism on the inner side of the guide channel. The elastic connecting component is compressed during the movement of the laser module 100. After the laser module 100 moves up to its position, the elastic connecting component stretches, and the sealing platform 5 can finally get stuck in the water hole and achieve connection. The elastic connecting component has both telescopic performance and connecting function. In this embodiment, three groups of laser modules 100 are used, and the elastic connecting mechanisms in the three groups of laser modules 100 are staggered and distributed, which can all achieve vertical movement, and finally the three groups of laser modules 100 are installed in a vertical side-by-side distribution state.

[0054] Embodiment 4, as Figure 1-Figure 13As shown, a semiconductor laser and a semiconductor laser side pump module proposed in this embodiment, compared with the first to third embodiments, in this embodiment, a guide mechanism is arranged inside the cooling ring 1, and the guide mechanism includes a guide platform a171, a guide platform b172 and two groups of symmetrically distributed guide components, and the guide platform a171 and the guide platform b172 are both arranged on the inner circumferential surface of the cooling ring 1, and the guide platform a171 and the guide platform b172 are both vertically distributed triangular columnar structures and the tips are respectively facing the water inlet end 101 and the water outlet end 102. When water flows into the cooling ring 1 from the water inlet end 101, it first flows to the guide platform a171, and is divided to both sides through the guide platform a171. Under the respective guide effects of the guide components on both sides, it flows to the guide platform b172, and is converged by the guide platform b172 to the water outlet end 102 for discharge. When the water flows inside the cooling ring 1, it takes away the heat transferred to the cooling ring 1 when the laser 6 is running.

[0055] The guide assembly includes a plurality of guide plates a181 arranged on the inner peripheral surface of the cooling ring 1 and a plurality of guide plates b182 arranged on the outer peripheral surface of the cooling ring 1. The plurality of guide plates a181 and the plurality of guide plates b182 are alternately distributed and evenly distributed along the arc shape. The guide plates a181 and the guide plates b182 are inclined in the direction of water flow, and the ends are bent to one side toward the water flow. When water flows along the guide plates a181 and the guide plates b182, a vortex will be formed at the end. The vortex will generally continue to flow along the direction from the water inlet end 101 to the water outlet end 102. The vortex makes it easier for water in different areas to swirl to the area in contact with the inner wall of the cooling ring 1, thereby improving the utilization rate of water and enhancing the cooling effect. If the guide plate is not designed, when the water flows, only the water in contact with the inner wall of the cooling ring 1 distributed on the periphery can effectively transfer heat, while the water in contact with the inner wall of the cooling ring 1 distributed in the middle has a poor cooling effect and a low utilization rate.

[0056] Working principle of this embodiment: the guide platform and guide plate in the guide mechanism can guide the flow direction of water, so that water in different areas can more easily flow to the area in contact with the inner wall of the cooling ring 1, making it easier to achieve water cooling and improve the utilization rate of cooling water.

[0057] Working principle of the present invention: from the perspective of synchronous regular assembly and centralized cooling and heat dissipation, multiple lasers 6 are pressed synchronously, and centralized cooling and heat dissipation are performed through the cooling ring 1 to ensure the service life of the laser 6. The structure of the laser 6 itself is relatively simple. During assembly, the guide is specifically guided by the guide column, the clamping part 9 and the guide positioning plate 10. After the laser module 100 is installed in place, the waterway can be connected, and the water is guided by the guide mechanism during circulation, so that the water in different areas flows to the area in contact with the inner wall of the cooling ring 1 for heat transfer, thereby improving the utilization rate of water.

[0058] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor laser and a semiconductor laser side pump module, characterized in that: include: Water supply mechanism; An initial positioning assembly, comprising a mounting plate (11) mounted on the upper portion of the water-passing mechanism and a plurality of guide positioning plates (10) uniformly arranged in a ring shape around a central axis of the mounting plate (11) at the bottom of the mounting plate (11); A laser module (100) is horizontally arranged and has multiple groups evenly distributed in a spiral shape in a vertical direction, comprising a water cooling mechanism connected to a water supply mechanism, multiple groups of clamping assemblies evenly distributed around a central axis of the water cooling mechanism, and multiple lasers (6) distributed in an annular shape, wherein the water cooling mechanism comprises an annular hollow cooling ring (1), and the clamping assemblies are rotatably arranged on the inner ring surface of the cooling ring (1); in a placed state, the upper part of the clamping assemblies is inclined from bottom to top in the direction of the central axis of the cooling ring (1), and a placement space for placing the laser (6) is formed between each two adjacent groups of clamping assemblies; when multiple groups of laser modules (100) are sequentially installed from bottom to top, the clamping assemblies in the first group of laser modules (100) are guided by the guide positioning plate (10) and press the placed lasers (6) against the inner ring surface of the cooling ring (1), and the clamping assemblies in the remaining laser modules (100) are guided by the clamping assemblies in the adjacent upper laser modules (100) and press the corresponding placed lasers (6) against the inner ring surface of the cooling ring (1); A terminal tightening plate (12) mounted at the bottom of the water-passing mechanism and tightened against a clamping assembly of the lowest laser module (100); The laser (6) comprises a substrate (61) and a laser chip (62) mounted on the substrate (61), the laser chip (62) faces the central axis of the cooling ring (1), and the laser chip (62) is exposed between two adjacent clamping components; The outer ring of the cooling ring (1) has a water inlet end (101) and a water outlet end (102) that are relatively distributed, and the inner ring of the cooling ring (1) has a plurality of mounting surfaces (103) and cooling surfaces (104) that are evenly and alternately distributed in an annular shape; The lower part of the guide positioning plate (10) is gradually inclined from top to bottom toward the central axis of the cooling ring (1), and the clamping assembly comprises a connecting electrode (7) for electrically contacting two adjacent lasers (6), a connecting platform (8) arranged at the lower part of the inner ring surface of the cooling ring (1), and a clamping member (9) rotatably connected to the connecting platform (8), the connecting electrode (7) is mounted on the clamping member (9), the center of gravity height of the clamping member (9) is higher than the height of the rotation center axis of the clamping member (9), and the distances from the bottom end of the clamping member (9) and the bottom end of the guide positioning plate (10) to the central axis of the cooling ring (1) are both shorter than the distance from the top end of the clamping member (9) to the central axis of the cooling ring (1); The clamping member (9) comprises a main plate portion (91), a limiting plate portion (92) connected to the main plate portion (91) and located below the connecting platform (8), a positioning plate portion (97) connected to the main plate portion (91) and located below the limiting plate portion (92), a guide plate portion (96) and an abutting plate portion (98) respectively connected to the bottom and top ends of the main plate portion (91), two guide plate portions (93) respectively connected to both sides of the upper portion of the main plate portion (91), two side plate portions (94) respectively connected to both sides of the middle portion of the main plate portion (91), and a supporting plate portion (95) connected to the bottom end of the side plate portion (94), the limiting plate portion (92), the guide plate portion (93), the supporting plate portion (95) and the positioning plate portion (97) The positioning plate portion (97) is folded in a direction away from the central axis of the cooling ring (1), the upper portion of the guide plate portion (93) is inclined inwardly, the side plate portion (94) is folded in a direction away from the inner ring of the cooling ring (1), the guide plate portion (96) is gradually inclined from top to bottom in the direction of the central axis of the cooling ring (1), and the abutment plate portion (98) is staggered with the main plate portion (91) in a direction away from the central axis of the cooling ring (1), and the staggered width is the thickness of the main plate portion (91); the connecting electrode (7) is arranged to fit the main plate portion (91) and the two side plate portions (94); the mounting plate (11) and the terminal clamping plate (12) both have an annular through-channel, and the top surface of the terminal clamping plate (12) is clamped against the bottom surface of the positioning plate portion (97).

2. The semiconductor laser and semiconductor laser side pump module according to claim 1, characterized in that: The water cooling mechanism also includes two groups of elastic connecting mechanisms respectively connected at the water inlet end (101) and the water outlet end (102), the elastic connecting mechanism including an elastic connecting component, a sealing ring (4) and a sealing platform (5) connected in sequence in a direction away from the cooling ring (1), the elastic connecting component including a rubber sleeve (2) and a spring (3), the rubber sleeve (2) including a spiral sleeve portion and a rubber portion, the rubber portion being axially connected to the spiral surface of the spiral sleeve portion and forming a through channel on the inner side, the spiral sleeve portion having an installation channel for embedding the spring (3), the ends of the rubber sleeve (2) and the spring (3) being flush, one end of the rubber sleeve (2) and the spring (3) on the same side being both sealedly connected to the cooling ring (1), the other end of the rubber sleeve (2) and the spring (3) on the same side being both sealedly connected to the sealing ring (4), the sealing ring (4) having a connecting hole a, and the sealing platform (5) having a connecting hole b.

3. The semiconductor laser and semiconductor laser side pump module according to claim 2, characterized in that: The water-passing mechanism comprises two groups of water-passing installation components which are evenly distributed in an annular shape and detachably connected. The water-passing installation components comprise a semi-annular hollow water tank (13) and a plurality of guide columns which are sequentially distributed around a central axis on the inner ring surface of the water tank (13). The guide columns are vertically arranged. The guide columns have guide channels which are vertically distributed and for the sealing ring (4) to slide. The upper part of the guide channels has water-passing holes for the sealing platform (5) to be inserted. The water-passing holes on the plurality of guide columns are distributed in a spiral shape. The top of the water tank (13) has a through hole (131). The inner ring of the water tank (13) has a water flow hole which is connected to the water-passing hole.

4. The semiconductor laser and semiconductor laser side pump module according to claim 3, characterized in that: In the same water-through installation assembly, the bottom ends of the plurality of guide columns are flush and the top heights are arranged in a spiral direction in sequence, the bottom end of the guide channel is open, the top heights of the plurality of guide channels are arranged in a spiral direction in sequence, and the installation plate (11) and the terminal tightening plate (12) are respectively installed at the top and bottom ends of the longest guide column.

5. The semiconductor laser and semiconductor laser side pump module according to claim 3, characterized in that: The outer peripheral surface of the sealing platform (5) is a truncated cone-shaped side surface, and the water through hole has a conical inner surface that matches the truncated cone-shaped side surface.

6. The semiconductor laser and semiconductor laser side pump module according to claim 1, characterized in that: A flow guide mechanism is arranged inside the cooling ring (1), the flow guide mechanism comprising a flow guide platform a (171), a flow guide platform b (172) and two groups of symmetrically distributed flow guide components, the flow guide platform a (171) and the flow guide platform b (172) are both arranged on the inner peripheral surface of the cooling ring (1), the flow guide platform a (171) and the flow guide platform b (172) are both vertically distributed triangular columnar structures with their tips facing the water inlet end (101) and the water outlet end (102) respectively, the flow guide components comprising a plurality of flow guide plates a (181) arranged on the inner peripheral surface of the cooling ring (1) and a plurality of flow guide plates b (182) arranged on the outer peripheral surface of the cooling ring (1), the plurality of flow guide plates a (181) and the plurality of flow guide plates b (182) are alternately arranged and evenly distributed along an arc shape, the flow guide plates a (181) and the flow guide plates b (182) are both inclined in the direction of water flow, and the ends are both bent to one side towards the water flow.

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