A kind of zero-stick heat-insulating transparent atmosphere film and preparation method thereof

Abstract

The present invention provides a zero-stick heat-insulating transparent atmosphere film and a preparation method thereof, comprising a supporting substrate and a transparent conductive carrier, wherein the supporting substrate is made of a transparent material, a groove structure is provided on the supporting substrate, an LED light-emitting body is fixed on the transparent conductive carrier, and the transparent conductive carrier fixed with the LED light-emitting body is placed on the supporting substrate with the groove structure, the LED light-emitting body is embedded in the groove structure, and a side of the transparent conductive carrier close to the supporting substrate and a side of the supporting substrate close to the transparent conductive carrier are spaced apart by a micrometer-level gap. A certain gap is formed between the lower surface of the transparent conductive carrier of the present invention and the upper surface of the supporting substrate, and a zero-stick structure with a gap close to zero is formed between the transparent conductive carrier and the supporting substrate, so that Murray interference does not occur between the transparent conductive carrier and the supporting substrate, thereby being able to present a beautiful LED atmosphere effect.

Description

Technical Field

[0001] The invention relates to the technical field of transparent atmosphere films, in particular to a zero-sticking heat-insulating transparent atmosphere film and a preparation method thereof. Background Art

[0002] Thermal insulation transparent atmosphere film can be widely used in car sunroofs, car skylights, rest pavilions in tourist attractions, roof tea pavilions, viewing platforms, entrance halls and other scenes that require transparency, heat insulation and atmosphere. At present, thermal insulation transparent atmosphere film is generally prepared by fixing LED light emitters on transparent conductive carriers, and the base of transparent conductive carriers is mainly PET, which has high tensile strength. Transparent glass such as car sunroofs and car skylights is a hyperbolic spherical structure. When the arch height exceeds a certain height, affected by the tensile strength of PET, the transparent conductive carrier with PET as the base will be attached. After being wrinkled on the edges, it will affect the lighting atmosphere presented by the thermal insulation transparent atmosphere film. Summary of the invention

[0003] The purpose of the present invention is to improve and innovate the shortcomings and problems existing in the background technology, and to provide a zero-sticking heat-insulating transparent atmosphere film and a preparation method thereof.

[0004] According to a first aspect of the present invention, there is provided a zero-stick heat-insulating transparent atmosphere film, comprising a supporting substrate and a transparent conductive carrier, wherein the supporting substrate is made of a transparent material, a groove structure is provided on the supporting substrate, an LED light-emitting body is fixed on the transparent conductive carrier, and the transparent conductive carrier with the LED light-emitting body fixed is placed on the supporting substrate with the groove structure, the LED light-emitting body is embedded in the groove structure, and a side of the transparent conductive carrier close to the supporting substrate and a side of the supporting substrate close to the transparent conductive carrier are separated from each other by a micrometer-level gap.

[0005] A further solution is that the LED light emitter is fixed on the transparent conductive carrier through a conductive material layer, and the total height of the conductive material layer and the LED light emitter is greater than the depth of the groove structure.

[0006] A further solution is that at least one side of the supporting substrate close to the transparent conductive carrier or one side of the transparent conductive carrier close to the supporting substrate is distributed with a micro-nanoscale height micro-rough structure, and the depth of the groove structure is greater than the sum of the heights of the LED light-emitting body and the conductive material layer, so that the transparent conductive carrier and the supporting substrate are in zero-gap contact.

[0007] A further solution is that the shape of the groove structure can be a semi-concave shape, a quarter-concave shape, a cylindrical shape, a cube shape, or a rectangular parallelepiped shape.

[0008] A further solution is that the outer surface of the LED light emitting body is wrapped with a protective layer, the material of the protective layer can be silicone or acrylic glue or UV glue or polyurethane glue, and the protective layer is in contact with the inner wall of the groove structure.

[0009] A further solution is that at least two LED light-emitting bodies of different heights are fixed on the transparent conductive carrier, and correspondingly at least two groove structures of different depths are provided on the supporting substrate.

[0010] According to a second aspect of the present invention, a method for preparing a zero-sticking heat-insulating transparent atmosphere film is provided, which specifically comprises the following steps:

[0011] Grooving the supporting substrate to obtain a groove structure;

[0012] The LED light-emitting body is fixed to a transparent conductive carrier through a conductive material layer, and the transparent conductive carrier with the LED light-emitting body fixed is placed on a supporting substrate with a groove structure; wherein the LED light-emitting body is embedded in the groove structure, and a side of the transparent conductive carrier close to the supporting substrate and a side of the supporting substrate close to the transparent conductive carrier are separated from each other by a micrometer-level gap.

[0013] A further solution is that after the supporting substrate is grooved to obtain the groove structure, the method further comprises:

[0014] A micro-rough structure with a height of micro-nano level is distributed on one side of the supporting substrate close to the transparent conductive carrier or / and one side of the transparent conductive carrier close to the supporting substrate; wherein the depth of the groove structure is greater than the sum of the heights of the LED light-emitting body and the conductive material layer, so that the transparent conductive carrier is in zero-gap contact with the supporting substrate.

[0015] A further solution is that after the supporting substrate is grooved to obtain the groove structure, the method further comprises:

[0016] Referring to the position of the groove structure on the supporting substrate, a corresponding screen is designed and manufactured, and a gap structure with a certain mesh number is designed on the screen at the position of the groove structure, so that the amount of fluorescent material passing through the gap structure can be controlled;

[0017] Place the screen on the supporting substrate in advance; pour liquid fluorescent material on the screen, and use a scraper to embed the fluorescent material into the groove structure so that the fluorescent material flows naturally in the groove structure;

[0018] The fluorescent material is fixed by baking.

[0019] A further solution is that after the supporting substrate is grooved to obtain the groove structure, the method further comprises:

[0020] Referring to the position of the groove structure on the supporting substrate, the corresponding mask is designed and manufactured, a gap structure is designed on the mask at the position of the groove structure, and the rest of the mask is in a shielded state;

[0021] By adopting magnetron sputtering or evaporation deposition, the atoms required for the optical film are deposited on the inner wall of the groove structure using plasma, and the porosity of the void structure is adjusted so that the thickness of the optical film layer can reduce reflection or increase transmittance of the light emitted by the LED light source.

[0022] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention places a transparent conductive carrier with an LED light-emitting body fixed on a supporting substrate with a groove structure, and then fixes the transparent conductive carrier on a car sunroof, a car skylight, a rest pavilion in a tourist scenic spot, a roof tea pavilion, an observation platform, an entrance hall and other structures through the supporting substrate. On the one hand, the arch height of the supporting substrate can be controlled. In addition, the transparent conductive carrier with the LED light-emitting body is placed on the supporting substrate in a "zero-stick" manner, which retains its own natural extension ability and is not prone to edge wrinkles. In addition, through the mutual cooperation of the LED light-emitting body and the groove structure, a certain gap is formed between the lower surface of the transparent conductive carrier of the present invention and the upper surface of the supporting substrate, and a zero-stick structure with a gap close to zero is formed between the transparent conductive carrier and the supporting substrate, so that there is no Murray interference between the transparent conductive carrier and the supporting substrate, thereby being able to present a beautiful LED atmosphere effect.

[0023] (2) The present invention prepares a micro-rough structure on the surface of a transparent conductive carrier or a supporting substrate. The micro-rough structure is distributed on the surface and the height of the rough structure is at the micron level. With this structure, the depth of the groove structure can be greater than the height of the LED light emitter and the conductive material layer, and the transparent conductive carrier and the supporting substrate are in zero-gap contact. At this time, there will be no Murray interference between the transparent conductive carrier and the supporting substrate;

[0024] (3) The present invention wraps the outer surface of the LED light source with a protective layer. The material of the protective layer can be silicone, acrylic glue, UV glue or polyurethane glue. The protective layer is in close contact with the inner wall of the groove structure. The protective layer protects the LED light source on the one hand, and forms a zero-contact structure between the LED light source and the groove structure wall on the other hand. The zero-contact structure can reduce the back and forth reflection of the LED light inside the wall, thereby reducing the scattering of the LED light, making the peripheral visual light purer;

[0025] (4) The present invention coats fluorescent material or deposits an optical film layer on the inner wall of the groove structure. By introducing the fluorescent material, an atmosphere of other light colors can be derived; and the optical film layer can have the function of reducing reflection and increasing transmittance of the light emitted by the LED light source, which is conducive to presenting a beautiful LED atmosphere effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic structural diagram of a zero-stick heat-insulating transparent atmosphere film provided in the first embodiment of the present invention;

[0028] Figure 2 A schematic diagram of the structure of a zero-stick heat-insulating transparent atmosphere film fixed with LED light-emitting bodies of two heights provided in the first embodiment of the present invention.

[0029] Figure numerals: 1. transparent conductive carrier; 2. LED light-emitting body; 3. conductive material layer; 4. supporting substrate; 5. groove structure. DETAILED DESCRIPTION

[0030] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0033] Example 1

[0034] See also Figure 1The present invention provides a zero-stick heat-insulating transparent atmosphere film, including a supporting substrate 4 and a transparent conductive carrier 1. The supporting substrate 4 is made of a transparent material with a thickness of 1-6 mm. The supporting substrate 4 can be a flexible substrate such as a PC substrate or a PC / PMMA composite substrate or an acrylic substrate. A groove structure 5 is provided on the supporting substrate 4, and the groove structure 5 is realized by a laser or engraving process. Among them, the laser uses thermal energy to burn the corresponding groove structure 5 on the supporting substrate 4 in a non-contact manner, and the engraving uses a mechanical method to contact the engraving head with the supporting substrate 4 to engrave the corresponding groove structure 5 on the supporting substrate 4.

[0035] The LED luminous body 2 is fixed on the transparent conductive carrier 1; specifically, the LED luminous body 2 is fixed on the transparent conductive carrier 1 through a conductive material layer 3. The conductive material layer 3 can be a conductive silver paste, a conductive carbon paste, a conductive silver paste or a conductive copper paste. After the LED luminous body 2 is fixed to the transparent conductive carrier 1 through the conductive material layer 3, the height of the light-emitting surface of the LED luminous body 2 from the surface of the transparent conductive carrier 1 is composed of two parts, one part is the height of the LED luminous body 2 itself, and the other part is the height of the conductive material layer 3 after it is cured and dried.

[0036] In the present application, a transparent conductive carrier 1 fixed with an LED illuminant 2 is placed on a supporting substrate 4 with a groove structure 5, the LED illuminant 2 is embedded in the groove structure 5, and a gap of micrometers is provided between the lower surface of the transparent conductive carrier 1 close to the supporting substrate 4 and the upper surface of the supporting substrate 4 close to the transparent conductive carrier 1. It can be understood that, since the transparent conductive carrier 1 with the LED illuminant 2 is placed on the supporting substrate 4 in a "zero-attach" manner, it retains its own natural extension ability and is not prone to edge wrinkles; in addition, through the mutual cooperation of the LED illuminant 2 and the groove structure 5, a certain gap is formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the supporting substrate 4, and a zero-attach structure close to zero gap is formed between the transparent conductive carrier 1 and the supporting substrate 4, so that Murray interference will not occur between the transparent conductive carrier 1 and the supporting substrate 4. When the zero-stick thermal insulation atmosphere film of the present invention is applied to scenes requiring transparency, insulation and atmosphere, such as car sunroofs, car skylights, rest pavilions in tourist attractions, rooftop tea pavilions, viewing platforms, and entrance halls, it is fixed to the original structure through the supporting substrate 4. The light of the LED light-emitting body 2 on the transparent conductive carrier 1 passes through the supporting substrate 4 and can present a beautiful lighting atmosphere from top to bottom, while the area other than the LED light-emitting body 2 remains transparent.

[0037] It should be noted that there is a micron-sized gap between the lower surface of the transparent conductive carrier 1 close to the supporting substrate 4 and the upper surface of the supporting substrate 4 close to the transparent conductive carrier 1. The depth of the groove structure 5 may be smaller than the overall height of the LED light-emitting body 2 and the conductive material layer 3. When the LED light-emitting body 2 is embedded in the groove structure 5, the LED light-emitting body 2 will hit the wall of the groove structure 5, and a micron-sized gap will be formed between the transparent conductive carrier 1 and the supporting substrate 4. The size of the gap is close to zero, that is, a zero-paste structure. In actual application, the present application can also prepare a micro-rough structure on the surface of the transparent conductive carrier 1 and / or the supporting substrate 4. The micro-rough structure may be a pyramid structure. The micro-rough structure is distributed on its surface, and the height of the rough structure is in the micron level. With this micro-rough structure, the depth of the groove structure 5 can be greater than the height of the LED light-emitting body 2 and the conductive material layer 3, so that the transparent conductive carrier 1 and the supporting substrate 4 are in zero-gap contact, but a zero-contact structure close to zero gap is still formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the supporting substrate 4; therefore, the micron-level rough structure can ensure that there will be no Murray interference between the transparent conductive carrier 1 and the supporting substrate 4.

[0038] Furthermore, the present application can dispense glue on the surface of the LED light-emitting body 2, and wrap the LED light-emitting body 2 with the colloid, so that the outer surface of the LED light-emitting body 2 is wrapped with a protective layer. The colloid can be silicone or acrylic glue or UV glue or polyurethane glue, and the present application does not make specific limitations. For a cubic LED light-emitting body 2, the colloid can be placed on the surface of the LED light-emitting body 2 by dispensing glue. Since the colloid has a certain fluidity, it will flow around and form a "hat" structure on the surface of the LED light-emitting body 2 after flowing; then, by baking, the colloid can firmly wrap the LED light-emitting body 2. To form a colloid structure of other shapes to adapt to groove structures 5 of different shapes, glue can be poured into the mold to obtain colloids of other shapes, all of which belong to the protection scope of the present application. When the LED light-emitting body 2 with a protective layer is embedded into the groove structure 5, the colloid on the surface of the LED light-emitting body 2 can be in close contact with the inner wall of the groove structure 5, and a "zero-stick" structure between the LED light-emitting body 2 and the inner wall of the groove structure 5 is also formed inside the groove structure 5. The zero-stick structure can reduce the reflection of the light of the LED light-emitting body 2 back and forth on the inner wall of the groove structure 5, reduce the scattering of the LED light in the wall, and make the peripheral visual light purer.

[0039] It should be noted that the shape of the groove structure 5 can be a concave shape such as a semi-concave shape, a quarter concave shape, or a cylindrical shape, or a cube shape, or a rectangular parallelepiped shape; this application does not make specific restrictions. For an LED illuminant 2 with a protective layer, the size of the groove structure 5 corresponds to the overall size of the LED illuminant 2, the conductive material layer 3 and the protective layer. Taking the LED illuminant 2 of model 620 as an example, its length is 500um, the width is 150um, and the thickness is 120um. After the protective layer is added to the surface of the LED illuminant 2, its length will increase to 780um, the width will increase to 280um, and the thickness will increase to 290um. If a concave shape is adopted, the opening diameter should be greater than 780um and the depth should be greater than 290um. If a cylindrical shape is adopted, the opening diameter should be greater than 780um and the depth should be greater than 290um. If a cube shape is adopted, the opening width should be greater than 780um and the depth should be greater than 290um. If a rectangular shape is used, the opening width should be greater than 280um, the opening length should be greater than 780um, and the depth should be greater than 290um.

[0040] Furthermore, a fluorescent substance may be coated on the inner wall of the groove structure 5 or an optical film layer may be deposited. The light emitted by the LED illuminator 2 interacts with the fluorescent substance to derive other light colors. For example, the LED illuminator 2 emits red light, which derives yellow light when it encounters a green fluorescent substance. The primary colors of the LED illuminator 2 are only red, green and blue. By introducing fluorescent substances, the atmosphere of other light colors can be derived. The optical film layer deposited inside the groove structure 5 can be an optical anti-reflection film or an optical anti-reflection film. The thickness of the optical film layer can be designed according to the wavelength of light emitted by the LED illuminator 2. The designed thickness of the optical film layer can have the functions of anti-reflection and anti-transmission for the light emitted by the LED illuminator 2.

[0041] Specifically, the specific method of coating the fluorescent material on the inner wall of the groove structure 5 is to design and manufacture the screen based on the position of the groove structure 5, and design a certain mesh gap structure on the screen at the position of the groove structure 5 to form a structure similar to a screen. The design of a certain mesh gap structure can prevent the amount of fluorescent material entering the groove structure 5 from being uncontrolled. Then the screen is placed on the supporting substrate 4 in advance, and then placed on the printing machine as a whole, and the liquid fluorescent material is poured on the screen, and the fluorescent material is embedded into the groove structure 5 by a scraper. The fluorescent material will have a natural flow process in the groove structure 5, and then the fluorescent material is fixed by baking, that is, the preparation of the fluorescent material is completed. Finally, the transparent conductive carrier 1 fixed with the LED light emitter 2 is covered on the supporting substrate 4, so that the LED light emitter 2 is embedded in the groove structure 5, and the light emitted by the LED light emitter 2 can interact with the fluorescent material in the wall.

[0042] Specifically, the specific method for depositing the optical thin film layer on the inner wall of the groove structure 5 is to design and manufacture a corresponding mask based on the position of the groove structure 5, the mask is in a gap state at the position of the groove structure 5, and the other positions are in a shielded state, and magnetron sputtering, evaporation and other processes are used to use plasma to deposit the atoms required for the optical thin film on the inner wall of the groove structure 5. Because the gaps in the mask will have a certain blocking effect on atoms, it is necessary to optimize the gaps and their deposition power to achieve the required thickness of the optical thin film layer.

[0043] See also Figure 2 The transparent conductive carrier 1 of the present application can be fixed with LED illuminants 2 of two heights, and the supporting substrate 4 is correspondingly provided with groove structures 5 of two depths. After the transparent conductive carrier 1 with LED illuminants 2 of two heights fixed is covered on the supporting substrate 4 with the groove structure 5, a double-layered sense of hierarchy can be brought; therefore, such a structural design can bring a richer atmosphere experience.

[0044] Example 2

[0045] The present invention also provides a method for preparing a zero-stick heat-insulating transparent atmosphere film, which specifically comprises the following steps:

[0046] Step S1, groove the support substrate 4 to obtain a groove structure 5;

[0047] Specifically, the support substrate 4 is made of a transparent material and has a thickness of 1-6 mm. The support substrate 4 may be a PC substrate or a PC / PMMA composite substrate or a flexible substrate such as acrylic, and the present application does not make any specific limitation thereto.

[0048] The groove structure 5 is realized by laser or engraving. The laser uses heat energy to burn the corresponding groove structure 5 on the supporting substrate 4 in a non-contact manner, while engraving uses a mechanical method to contact the engraving head with the supporting substrate 4 to carve the corresponding groove structure 5 on the supporting substrate 4.

[0049] Step S2, fixing the LED illuminant 2 to the transparent conductive carrier 1 through the conductive material layer 3, and placing the transparent conductive carrier 1 fixed with the LED illuminant 2 on the supporting substrate 4 with the groove structure 5; wherein the LED illuminant 2 is embedded in the groove structure 5, and a surface of the transparent conductive carrier 1 close to the supporting substrate 4 and a surface of the supporting substrate 4 close to the transparent conductive carrier 1 are separated from each other by a micrometer-level gap;

[0050] It can be seen from the above technical solution that since the transparent conductive carrier 1 with the LED illuminant 2 is placed on the supporting substrate 4 in a "zero-stick" manner, it retains its own natural extension ability and is not prone to edge wrinkles. In addition, through the mutual cooperation of the LED illuminant 2 and the groove structure 5, a certain gap is formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the supporting substrate 4, and a zero-stick structure close to zero gap is formed between the transparent conductive carrier 1 and the supporting substrate 4, so that there will be no Murray interference between the transparent conductive carrier 1 and the supporting substrate 4; when the zero-stick heat-insulating atmosphere film of the present invention is applied to scenes that require transparency, heat insulation, and atmosphere, such as car sunroofs, car skylights, rest pavilions in tourist attractions, roof tea pavilions, viewing platforms, and entrance halls, the supporting substrate 4 is fixed to the original structure, and the light of the LED illuminant 2 on the transparent conductive carrier 1 passes through the supporting substrate 4 and can present a beautiful lighting atmosphere from top to bottom, while the area other than the LED illuminant 2 remains transparent.

[0051] It should be noted that there is a micrometer-level gap between the upper surface of the support substrate 4 and the lower surface of the support substrate 4 close to the transparent conductive carrier 1. The depth of the groove structure 5 may be less than the overall height of the LED light-emitting body 2 and the conductive material layer 3. When the LED light-emitting body 2 is embedded in the groove structure 5, the LED light-emitting body 2 will hit the wall of the groove structure 5, and a micrometer-level gap will be formed between the transparent conductive carrier 1 and the support substrate 4. The size of the gap is close to zero, that is, a zero-paste structure. In actual use, the present application can also prepare a micro-rough structure on the surface of the transparent conductive carrier 1 or / and the support substrate 4, so that a zero-paste structure with a gap close to zero is formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the support substrate 4; wherein the micro-rough structure is distributed on the surface of the transparent conductive carrier 1 or / and the support substrate 4, and the height of the rough structure is at the micrometer level. With this micro-rough structure, the depth of the groove structure 5 can be greater than the height of the LED light-emitting body 2 and the conductive material layer 3, so that the transparent conductive carrier 1 and the supporting substrate 4 are in zero-gap contact, but there is a micron-level gap between the smooth surface of the transparent conductive carrier 1 and the smooth surface of the supporting substrate 4; therefore, the micron-level rough structure can ensure that there will be no Murray interference between the transparent conductive carrier 1 and the supporting substrate 4.

[0052] It should be further explained that the LED light emitters 2 on the transparent conductive carrier 1 can have two heights, and the supporting substrate 4 has corresponding groove structures 5 with two depths. After the transparent conductive carrier 1 with the LED light emitters 2 of two heights fixed is covered on the supporting substrate 4 with the groove structure 5, a double-layered sense of hierarchy can be brought; therefore, such a structural design can bring a richer atmosphere experience.

[0053] In some embodiments, the step S1 further includes:

[0054] Coating a fluorescent substance on the inner wall of the groove structure 5 or depositing an optical thin film layer on the inner wall of the groove structure 5;

[0055] Specifically, coating the fluorescent material on the inner wall of the groove structure 5 specifically includes:

[0056] Referring to the position of the groove structure 5 on the supporting substrate 4, a corresponding screen is designed and manufactured, and a gap structure with a certain mesh number is designed on the screen at the position of the groove structure 5, so that the amount of fluorescent material passing through the gap structure can be controlled;

[0057] Place the screen on the supporting substrate 4 in advance; pour the fluorescent material in liquid state on the screen, and embed the fluorescent material into the groove structure 5 by scraper, so that the fluorescent material flows naturally in the groove structure 5;

[0058] The fluorescent material is fixed by baking.

[0059] It is understandable that the inner wall of the groove structure 5 is coated with fluorescent material, and the light emitted by the LED illuminator 2 interacts with the fluorescent material to derive other light colors. For example, the red light emitted by the LED illuminator 2 will derive yellow light when it encounters the green fluorescent material. The primary colors of the LED illuminator 2 are only red, green and blue. By introducing fluorescent materials, the atmosphere of other light colors can be derived.

[0060] Specifically, depositing the optical thin film layer on the inner wall of the groove structure 5 specifically includes:

[0061] Referring to the position of the groove structure 5 on the supporting substrate 4, a corresponding mask is designed and manufactured, a gap structure with a certain mesh number is designed on the mask at the position where the groove structure 5 is located, and the rest of the mask is in a shielded state;

[0062] Magnetron sputtering or evaporation is used to deposit the atoms required for the optical film onto the inner wall of the groove structure 5 using plasma. The gap structure with a certain mesh size is used to make the thickness of the optical film layer capable of reducing reflection and increasing transmittance of the light emitted by the LED light source 2.

[0063] It can be understood that the optical film layer deposited inside the groove structure 5 can be an optical anti-reflection film or an optical anti-reflection film. The thickness of the optical film layer can be designed according to the wavelength of light emitted by the LED light source 2. The designed thickness of the optical film layer can have the functions of anti-reflection and anti-reflection for the light emitted by the LED light source 2.

[0064] In some embodiments, after fixing the LED light emitter 2 to the transparent conductive carrier 1 through the conductive material layer 3 in step S2, the method further includes:

[0065] Glue is dispensed on the surface of the LED luminous body 2 so that the outer surface of the LED luminous body 2 is wrapped with a protective layer. The colloid may be silicone glue, acrylic glue, UV glue or polyurethane glue.

[0066] Specifically, glue is dispensed on the surface of the LED illuminant 2, and the LED illuminant 2 is wrapped by the colloid. For a square LED illuminant 2, the colloid can be dispensed on the surface of the LED illuminant 2. Since the colloid has a certain fluidity, it will flow around, and after flowing, a "hat" structure is formed on the surface of the LED illuminant; then, by baking, the colloid can firmly wrap the LED illuminant 2. To form a colloid structure of other shapes to adapt to the groove structure 5 of different shapes, glue can be poured into the mold to obtain colloids of other shapes, all of which belong to the protection scope of this application. When the LED illuminant 2 with a protective layer is embedded in the groove structure 5, the colloid on the surface of the LED illuminant 2 can be in close contact with the inner wall of the groove structure 5, and a "zero-stick" structure between the LED illuminant 2 and the inner wall of the groove structure 5 is also formed inside the groove structure 5. The zero-stick structure can reduce the back and forth reflection of the light of the LED illuminant 2 in the wall, reduce the scattering of the LED light in the wall, and make the peripheral visual light purer.

[0067] Although the present invention has been specifically shown and described in conjunction with preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined in the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A zero-stick heat-insulating transparent atmosphere film, characterized in that: It includes a supporting substrate and a transparent conductive carrier, wherein the supporting substrate is made of a transparent material, a groove structure is opened on the supporting substrate, an LED light-emitting body is fixed on the transparent conductive carrier, and the transparent conductive carrier with the LED light-emitting body is placed on the supporting substrate with the groove structure, the LED light-emitting body is embedded in the groove structure, and a side of the transparent conductive carrier close to the supporting substrate and a side of the supporting substrate close to the transparent conductive carrier are separated by a micrometer-level gap, and a fluorescent substance is coated on the inner wall of the groove structure or an optical thin film layer is deposited on the inner wall of the groove structure.

2. The zero-stick heat-insulating transparent atmosphere film according to claim 1, characterized in that: The LED illuminant is fixed on the transparent conductive carrier through a conductive material layer, and the total height of the conductive material layer and the LED illuminant is greater than the depth of the groove structure.

3. The zero-stick heat-insulating transparent atmosphere film according to claim 1, characterized in that: At least one side of the supporting substrate close to the transparent conductive carrier or one side of the transparent conductive carrier close to the supporting substrate is evenly distributed with a micro-nanoscale micro-rough structure, the depth of the groove structure is greater than the sum of the heights of the LED light-emitting body and the conductive material layer, so that the transparent conductive carrier is in zero-gap contact with the supporting substrate, and the LED light-emitting body is fixed on the transparent conductive carrier through the conductive material layer.

4. A zero-stick heat-insulating transparent atmosphere film according to any one of claims 1 to 3, characterized in that: The shape of the groove structure can be a semi-concave shape, a quarter-concave shape, a cylindrical shape, a cube shape, or a rectangular parallelepiped shape.

5. A zero-stick heat-insulating transparent atmosphere film according to any one of claims 1 to 3, characterized in that: The outer surface of the LED light emitting body is wrapped with a protective layer, the material of the protective layer can be silicone or acrylic glue or UV glue or polyurethane glue, and the protective layer is in contact with the inner wall of the groove structure.

6. A zero-stick heat-insulating transparent atmosphere film according to any one of claims 1 to 3, characterized in that: At least two LED light-emitting bodies of different heights are fixed on the transparent conductive carrier, and correspondingly at least two groove structures of different depths are provided on the supporting substrate.

7. A method for preparing a zero-stick heat-insulating transparent atmosphere film, characterized in that: The specific steps include: Grooving the supporting substrate to obtain a groove structure; Coating a fluorescent substance on the inner wall of the groove structure or depositing an optical thin film layer on the inner wall of the groove structure; The LED light-emitting body is fixed to a transparent conductive carrier through a conductive material layer, and the transparent conductive carrier with the LED light-emitting body fixed is placed on a supporting substrate with a groove structure; wherein the LED light-emitting body is embedded in the groove structure, and a side of the transparent conductive carrier close to the supporting substrate and a side of the supporting substrate close to the transparent conductive carrier are separated from each other by a micrometer-level gap.

8. The method for preparing a zero-stickiness heat-insulating transparent atmosphere film according to claim 7, characterized in that: After the supporting substrate is grooved to obtain the groove structure, the following steps are further included: A micro-rough structure with a height of micro-nano level is distributed on one side of the supporting substrate close to the transparent conductive carrier or / and one side of the transparent conductive carrier close to the supporting substrate; wherein the depth of the groove structure is greater than the sum of the heights of the LED light-emitting body and the conductive material layer, so that the transparent conductive carrier is in zero-gap contact with the supporting substrate.

9. The method for preparing a zero-stickiness heat-insulating transparent atmosphere film according to claim 7, characterized in that: The coating of the fluorescent material on the inner wall of the groove structure comprises: Referring to the position of the groove structure on the supporting substrate, a corresponding screen is designed and manufactured, and a gap structure with a certain mesh number is designed on the screen at the position of the groove structure, so that the amount of fluorescent material passing through the gap structure can be controlled; Place the screen on the supporting substrate in advance; pour liquid fluorescent material on the screen, and use a scraper to embed the fluorescent material into the groove structure so that the fluorescent material flows naturally in the groove structure; The fluorescent material is fixed by baking.

10. The method for preparing a zero-sticking heat-insulating transparent atmosphere film according to claim 7, characterized in that: Depositing an optical thin film layer on the inner wall of the groove structure comprises: Referring to the position of the groove structure on the supporting substrate, the corresponding mask is designed and manufactured, a gap structure is designed on the mask at the position of the groove structure, and the rest of the mask is in a shielded state; By adopting magnetron sputtering or evaporation deposition, the atoms required for the optical film are deposited on the inner wall of the groove structure using plasma, and the porosity of the void structure is adjusted so that the thickness of the optical film layer can reduce reflection or increase transmittance of the light emitted by the LED light source.

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