A test device for photosensitive semiconductor production

Abstract

The present invention discloses a test device for photosensitive semiconductor production, which relates to the technical field related to optical property test devices, and solves the problem that it is difficult to achieve measurement and control of light under different states and difficult to reflect the actual optical power and current capabilities of photosensitive semiconductors when performing light tests on photosensitive semiconductors. The test device for photosensitive semiconductor production includes a test machine, a protective shell, an optical detection module, an integrated test mechanism, and a photosensitive semiconductor element. A protective shell is installed on one side of the top of the test machine, and an optical detection module is provided on the side of the protective shell. The photosensitive semiconductor element is installed inside a support assembly, and the support assembly is installed on the inner side of the integrated test mechanism. In the present invention, through the design of a battery pack and a reverse bias connection method for photosensitive semiconductors, optical properties under different states can be measured and controlled, and the actual optical power and current capabilities of photosensitive semiconductors can be reflected more accurately and efficiently.

Description

Technical Field

[0001] The invention relates to the technical field of optical property testing devices, in particular to a testing device for photosensitive semiconductor production. Background Art

[0002] Photosensitive semiconductors are photoelectric conversion sensors based on the semiconductor photoelectric effect. They use optical and electrical technologies to achieve contactless, long-distance, fast and accurate measurements. They are often used to indirectly measure other physical or chemical quantities that can be converted into light. When producing and processing photosensitive semiconductors, it is necessary to test their optical properties.

[0003] The existing Chinese patent application with publication number CN108444682A discloses a semiconductor laser automatic function test system, including a workbench; an optical power detection component, the optical power detection component includes an optical power meter probe and a power collector; the optical power meter probe generates a corresponding power electrical signal according to the power of the laser light, and the power collector collects the power electrical signal; a spectrum detection component, the spectrum detection component includes a spectrum light-guiding optical fiber and a spectrometer coupled to the spectrum light-guiding optical fiber; a driving power supply for outputting current to the semiconductor laser; and a data processing device, the spectrometer outputs spectrum detection data to the data processing device; the data processing device controls the output current of the driving power supply; the invention controls the output current of the driving power supply by the data processing device, so that the current passing through the semiconductor laser changes according to a predetermined rule, and combines the detection data of the optical power detection component and the spectrum detection component, so as to automatically calculate the optical power current characteristic curve and the spectrum current characteristic curve of the semiconductor laser.

[0004] However, the photosensitive semiconductor testing device has the following defects when used in practice:

[0005] 1. When testing the optical properties of a photosensitive semiconductor, the existing photosensitive semiconductor testing device needs to simulate the state of the photosensitive semiconductor when it is actually installed and used, so it is necessary to make a conductive connection to the photosensitive semiconductor. When the conventional testing device is actually used, the connection with the photosensitive semiconductor is generally carried out in a positive connection manner. However, the above technology is difficult to achieve measurement and control under different light states, and it is difficult to reflect the actual optical power and current capabilities of the photosensitive semiconductor during testing;

[0006] 2. When testing photosensitive semiconductors, existing photosensitive semiconductor testing devices require a light irradiator to emit light for testing its optical properties. However, in actual use, the traditional solution has a large irradiation range for the light emitted by the light irradiator, making it difficult to accurately and comprehensively cover the photosensitive area of ​​the photosensitive semiconductor, resulting in low accuracy and efficiency and high cost when testing the optical properties later. Summary of the invention

[0007] The object of the present invention is to provide a testing device for photosensitive semiconductor production to solve the problems raised in the above background technology.

[0008] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0009] The present invention provides a testing device for photosensitive semiconductor production, comprising a testing machine, a protective shell, an optical detection module, an integrated testing mechanism and a photosensitive semiconductor element, wherein a protective shell is installed on one side of the top of the testing machine, an optical detection module is arranged on the side of the protective shell, the photosensitive semiconductor element is installed inside a supporting assembly, and the supporting assembly is installed inside the integrated testing mechanism.

[0010] The integrated testing mechanism is installed inside the protective shell and is electrically connected to the optical detection module.

[0011] The integrated testing mechanism includes:

[0012] A circulation component, the circulation component is installed on the top of the test machine and is located outside the support component, an optical power adjustment component is installed on one side of the top of the circulation component, and the optical power adjustment component is arranged toward the photosensitive semiconductor element; and

[0013] A reverse bias conductive component is installed on the other side of the top of the circulation component and is rotationally connected to the inner center of the support component. The reverse bias conductive component is set toward the photosensitive semiconductor element and is electrically connected to the photosensitive semiconductor element.

[0014] As a preferred solution of the present invention, a bottom plate is installed at the inner bottom of the test machine, and an optical detection module is supported on the top of the bottom plate, and

[0015] A working part is also arranged at the edge of the top of the testing machine, and the working part is located on the side of the protective shell.

[0016] As a preferred embodiment of the present invention, the optical detection module includes:

[0017] A central control panel, which is mounted on the top of the test machine through a support at the bottom and is located on the side of the protective shell, and the back of the central control panel is connected to a data processing module by wires;

[0018] A driving power supply module is installed on the top of the base plate and is connected to the data processing module by wires. The driving power supply module wires are connected to the optical power adjustment component and the reverse bias conductive component.

[0019] As a preferred solution of the present invention, the support assembly includes:

[0020] A support column, the support column is installed on the top of the test machine by screws, a support disc is installed on the top of the support column, and a support seat is installed at the eccentric position of the top of the support disc.

[0021] The photosensitive semiconductor element is supported inside the support base, and a photosensitive portion is provided on a side of the support base close to the optical power adjustment component.

[0022] As a preferred embodiment of the present invention, the circulation component comprises:

[0023] An external frame, which is mounted on the top of the test machine by screws and is arranged in a "Z" shape, and a driving motor is installed on the top of the external frame;

[0024] A driving shaft, the driving shaft is connected to the output end of the driving motor and is rotatably connected to the bottom of the external frame, a first gear is installed at the bottom of the driving shaft, and a second gear is meshed and connected to the side of the first gear,

[0025] Wherein, the first gear and the second gear are both rotatably connected to the top of the testing machine.

[0026] As a preferred embodiment of the present invention, the gear ratio between the first gear and the second gear is 1:8, the support column is arranged at the inner center of the second gear, and

[0027] An optical power adjustment component is installed on one side of the top of the second gear, and a reverse bias conductive component is installed on the other side of the top of the second gear.

[0028] As a preferred solution of the present invention, the optical power adjustment component includes:

[0029] A telescopic cylinder, the telescopic cylinder is installed on one side of the top of the second gear, the output end of the telescopic cylinder is connected to a gas rod, the top of the gas rod is installed with a universal ball, and the inner top of the universal ball is installed with a mounting seat;

[0030] An inner mounting component is mounted on the inner side of the mounting seat, a light irradiator is installed inside the inner mounting component, and the light irradiator is arranged toward the photosensitive semiconductor element.

[0031] Wherein, the light irradiator emits light and transmits it through the light sensing part to the light sensing area of ​​the photosensitive semiconductor element;

[0032] The peripheral frame is installed on the outside of the mounting seat by screws, and a slide rail is installed on the side. The side of the slide rail is connected to a slide frame through an electric slider, and the slide frame is located on the side of the light emitting end of the light irradiator.

[0033] As a preferred solution of the present invention, a collimating lens is installed at the inner center of the sliding frame, the collimating lens is located on the side of the light emitting end of the light irradiator, and two sets of polarization beam splitting prisms are arranged on the side of the collimating lens away from the light irradiator, and

[0034] The polarization beam splitter prism is installed on the inner side of the positioning ring. The two groups of positioning rings are connected to each other, and an electric slide bar is installed at the bottom. The electric slide bar is installed on the side of the sliding frame.

[0035] The electric sliding rod is located outside the collimating lens, and a gap is left between the two groups of polarization beam splitting prisms.

[0036] As a preferred embodiment of the present invention, the reverse bias conductive component includes:

[0037] A top frame, the top frame is installed on the other side of the top of the second gear and is located on the side of the telescopic cylinder, a connecting rod is installed at the bottom of the top frame, and the connecting rod is rotatably connected to the center of the inner part of the supporting disc;

[0038] An external device sleeve, the external device sleeve is installed on the outside of the connecting rod and is located at the bottom of the top frame, the internal part of the external device sleeve is movably connected with a movable frame, the movable frame is connected to the output end of the servo motor, and the servo motor is installed on one side of the external device sleeve;

[0039] An optical power testing device is installed inside the movable frame and is arranged toward the photosensitive semiconductor element. The optical power testing device performs an optical property test on the photosensitive semiconductor element.

[0040] As a preferred solution of the present invention, a battery pack is installed on the top of the top frame, and the battery pack is connected to a conductive socket through a wire.

[0041] The negative electrode of the battery pack is connected to the positive electrode of the photosensitive semiconductor element, and the positive electrode of the battery pack is connected to the negative electrode of the photosensitive semiconductor element.

[0042] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0043] 1. In the test device for the production of photosensitive semiconductors, when testing the optical properties of photosensitive semiconductors, the battery pack and the conductive socket can be designed to connect to the positive and negative electrodes of the photosensitive semiconductor to simulate the state of the photosensitive semiconductor during installation and use, thereby improving the accuracy of the test results. At the same time, the photosensitive semiconductor and the battery pack are connected in a reverse biased manner. When there is no light irradiation, only a small amount of reverse saturation current flows due to the reverse bias. However, when light is irradiated onto the photosensitive semiconductor, the energy of the photon is absorbed, generating electron-hole pairs, further increasing the reverse saturation current. Compared with the traditional connection method, it can measure and control the optical properties under different states, and more accurately and efficiently reflect the actual optical power current capability of the photosensitive semiconductor;

[0044] 2. In the test device for photosensitive semiconductor production, when testing photosensitive semiconductors, the light irradiator can emit light to provide illumination for the test operation of the photosensitive semiconductor, meeting the conditions for testing the optical properties of the photosensitive semiconductor. At the same time, the illumination range emitted by the light irradiator can be designed through the polarization beam splitter prism and collimating lens installed on its side, the distance between the polarization beam splitter prism and collimating lens and the light irradiator, and the distance between the polarization beam splitter prism and collimating lens, to achieve calibration and polarization beam splitting operations, ensure that the light can cover the light sensing area of ​​the photosensitive semiconductor and will not spread too much, and improve the accuracy of subsequent testing of the photosensitive semiconductor;

[0045] 3. In the test device for photosensitive semiconductor production, when testing the optical properties of photosensitive semiconductors, the optical power test equipment in the recording and shooting test state can drive the movable frame and the optical power test equipment installed inside the movable frame to rotate by a servo motor, so that the optical power test equipment can always record toward the photosensitive semiconductor and transmit the recorded image information to the inside of the data processing module. The data processing module then transmits the analysis data to the central control panel, which is convenient for the staff to classify and store good and defective photosensitive semiconductors;

[0046] 4. In the test device for the production of photosensitive semiconductors, when the optical properties of a number of photosensitive semiconductors are tested, the light irradiator and the optical power test equipment for the test can be driven by a driving motor to drive the output end drive shaft, the first gear at the bottom of the drive shaft, and the side of the first gear meshing with the second gear to rotate in a circular manner, thereby facilitating the testing of a number of photosensitive semiconductors and improving the efficiency of testing photosensitive semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0048] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0050] Figure 2 It is a schematic structural diagram of the overall side of the present invention;

[0051] Figure 3 It is a structural schematic diagram of the connection between the optical detection module and the integrated testing mechanism of the present invention;

[0052] Figure 4 It is a structural schematic diagram of the optical detection module of the present invention;

[0053] Figure 5 It is a schematic diagram of the structure of the connection between the supporting assembly and the photosensitive semiconductor element of the present invention;

[0054] Figure 6 It is a structural schematic diagram of the connection between the support assembly and the integrated testing mechanism of the present invention;

[0055] Figure 7 It is a structural schematic diagram of the integrated testing mechanism of the present invention;

[0056] Figure 8 It is a structural schematic diagram of the optical power adjustment component of the present invention;

[0057] Fig. 9 The present invention Figure 8 Schematic diagram of the structure of the enlarged area A in the middle;

[0058] Fig.10 It is a structural schematic diagram of the back side of the optical power adjustment component of the present invention;

[0059] Fig.11 is a schematic structural diagram of a reverse bias conductive component of the present invention;

[0060] Fig.12 The present invention Fig.11 Schematic diagram of the structure of the enlarged area B in the middle;

[0061] In the figure:

[0062] 10. Testing machine; 101. Bottom plate; 102. Working part;

[0063] 20. Protective shell;

[0064] 30. Optical detection module; 301. Central control panel; 302. Support; 303. Data processing module; 304. Driving power module;

[0065] 40. integrated testing mechanism; 50. photosensitive semiconductor element; 501. photosensitive area;

[0066] 60, support assembly; 601, support column; 602, support disc; 603, support seat; 604, photosensitive part;

[0067] 70, circulation assembly; 701, external frame; 702, driving motor; 703, driving shaft; 704, first gear; 705, second gear;

[0068] 80. Optical power adjustment assembly; 801. Telescopic cylinder; 802. Air rod; 803. Universal ball; 804. Mounting seat; 805. Internal mounting component; 806. Light irradiator; 807. External rack; 808. Slide rail; 809. Sliding rack; 8091. Collimating lens; 8092. Polarization beam splitter prism; 8093. Positioning ring; 8094. Electric slide rod;

[0069] 90. Reverse bias conductive component; 901. Top frame; 9011. Battery pack; 9012. Conductive socket; 902. Connecting rod; 903. Peripheral sleeve; 904. Movable frame; 905. Servo motor; 906. Optical power test equipment. DETAILED DESCRIPTION

[0070] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0071] See also Figure 1-Figure 12A test device for photosensitive semiconductor production includes a test platform 10, a protective shell 20, an optical detection module 30, an integrated test mechanism 40 and a photosensitive semiconductor element 50. The protective shell 20 is installed on one side of the top of the test platform 10, and the optical detection module 30 is arranged on the side of the protective shell 20. The photosensitive semiconductor element 50 is installed inside a support component 60, and the support component 60 is installed on the inner side of the integrated test mechanism 40. The integrated test mechanism 40 is installed inside the protective shell 20 and is electrically connected to the optical detection module 30. The integrated test mechanism 40 The test apparatus comprises: a circulation component 70, which is mounted on the top of the test bench 10 and is located on the outside of the support component 60; an optical power adjustment component 80 is mounted on one side of the top of the circulation component 70, and the optical power adjustment component 80 is arranged toward the photosensitive semiconductor element 50; and a reverse bias conductive component 90, which is mounted on the other side of the top of the circulation component 70 and is rotatably connected to the inner center of the support component 60; the reverse bias conductive component 90 is arranged toward the photosensitive semiconductor element 50 and is electrically connected to the photosensitive semiconductor element 50.

[0072] The above working principle: when testing the optical properties of the photosensitive semiconductor element 50, firstly, a plurality of photosensitive semiconductor elements 50 are installed inside the support assembly 60, and the design of the circulation assembly 70 is matched to improve the efficiency of testing the photosensitive semiconductor element 50 each time. Then, the reverse bias conductive assembly 90 is manually connected to the positive and negative electrodes of the photosensitive semiconductor element 50 to complete the electrical connection of the photosensitive semiconductor element 50, simulating the state of the photosensitive semiconductor element 50 in actual use, and adopting the electrical connection method of the reverse bias connection method, the measurement and control of light can be realized, and the actual optical power current capacity of the photosensitive semiconductor can be accurately and quickly reflected. In the process of testing, the optical power adjustment assembly 80 can provide light for testing the optical properties, and the light provided can be adjusted and controlled, and more concentratedly irradiated on the photosensitive semiconductor element 50, so as to improve the accuracy of the optical property test of the photosensitive semiconductor element 50, and the cost is low. Moreover, the entire process of the above optical property test is controlled by the optical detection module 30, which can effectively improve its intelligence.

[0073] Specific reference Figure 2 A base plate 101 is installed at the inner bottom of the test platform 10 , the top of the base plate 101 supports the optical detection module 30 , and a working part 102 is also arranged at the edge of the top of the test platform 10 , and the working part 102 is located on the side of the protective shell 20 .

[0074] In the photosensitive semiconductor production test device of the present invention, the base plate 101 is designed to support the optical detection module 30. The working part 102 is designed to facilitate the installation and removal of the photosensitive semiconductor element 50 by the staff.

[0075] Specific reference Figure 4 The optical detection module 30 includes a central control panel 301, which is installed on the top of the test machine 10 through a support 302 at the bottom and is located on the side of the protective shell 20. The back of the central control panel 301 is connected to the data processing module 303 by wires; a driving power supply module 304, which is installed on the top of the base plate 101 and is connected to the data processing module 303 by wires.

[0076] In this embodiment, the driving power module 304 is connected to the optical power regulating component 80 and the reverse bias conductive component 90 by wires, and the design of the driving power module 304 can control and drive the optical power regulating component 80 and the reverse bias conductive component 90 to operate.

[0077] In the test device for photosensitive semiconductor production of the present invention, the data processing module 303 analyzes and transmits the results of the optical property test, and displays and records them inside the central control panel 301, which facilitates the subsequent classification and processing of good and defective photosensitive semiconductor elements 50.

[0078] Specific reference Figure 5 The support assembly 60 includes a support column 601, which is installed on the top of the test machine 10 by screws. A support disc 602 is installed on the top of the support column 601, and a support seat 603 is installed at the eccentric position of the top of the support disc 602, wherein the interior of the support seat 603 supports a photosensitive semiconductor element 50, and a photosensitive portion 604 is provided on the side of the support seat 603 close to the optical power adjustment component 80.

[0079] In the testing device for photosensitive semiconductor production of the present invention, when testing the photosensitive semiconductor element 50, the photosensitive semiconductor element 50 is first placed inside the support seat 603, and the light sensing area 501 of the photosensitive semiconductor element 50 is placed close to the photosensitive part 604, so as to facilitate the subsequent optical property test and improve the efficiency of the optical property test.

[0080] Specific reference Figure 7 The circulation component 70 includes an external frame 701, which is installed on the top of the test machine 10 by screws, and the external frame 701 is arranged in a "Z" shape, and a driving motor 702 is installed on the top of the external frame 701; a driving shaft 703, the driving shaft 703 is connected to the output end of the driving motor 702, and is rotatably connected to the bottom of the external frame 701, and a first gear 704 is installed at the bottom of the driving shaft 703, and the side of the first gear 704 is meshed with a second gear 705, wherein the first gear 704 and the second gear 705 are both rotatably connected to the top of the test machine 10.

[0081] In this embodiment, the gear ratio of the first gear 704 and the second gear 705 is 1:8, a support column 601 is arranged at the inner center of the second gear 705, and an optical power adjustment component 80 is installed on one side of the top of the second gear 705, and a reverse bias conductive component 90 is installed on the other side of the top of the second gear 705. The rotation of the second gear 705 can drive the optical power adjustment component 80 and the reverse bias conductive component 90 to perform circular motion, so as to perform testing operations on different photosensitive semiconductor elements 50.

[0082] In the test device for photosensitive semiconductor production of the present invention, after completing the test on a group of photosensitive semiconductor elements 50, the central control panel 301 starts the drive motor 702 to operate, driving the drive shaft 703 connected to the output end of the drive motor 702 to rotate. At this time, when the drive shaft 703 rotates, it will drive the first gear 704 installed at the bottom to rotate, and then drive the second gear 705 meshingly connected to the side of the first gear 704 to rotate.

[0083] Specific reference Figure 8 , Fig. 9 and Fig.10 The optical power adjustment component 80 includes a telescopic cylinder 801, which is installed on one side of the top of the second gear 705. The output end of the telescopic cylinder 801 is connected to a gas rod 802, and a universal ball 803 is installed on the top of the gas rod 802. A mounting seat 804 is installed on the inner top of the universal ball 803; an inner mounting component 805, which is installed on the inner side of the mounting seat 804, and a light irradiator 806 is installed inside the inner mounting component 805. The light irradiator 806 is set toward the photosensitive semiconductor element 50, wherein the light irradiator 806 emits light and transmits it to the light sensing area 501 of the photosensitive semiconductor element 50 through the photosensitive part 604; an external frame 807, which is installed on the outer side of the mounting seat 804 by screws, and a slide rail 808 is installed on the side, and the side of the slide rail 808 is connected to a sliding frame 809 through an electric slider, and the sliding frame 809 is located on the side of the light emitting end of the light irradiator 806.

[0084] In this embodiment, a collimating lens 8091 is installed at the inner center of the sliding frame 809, and the collimating lens 8091 is located on the side of the light emitting end of the light irradiator 806. Two groups of polarization beam splitting prisms 8092 are arranged on the side of the collimating lens 8091 away from the light irradiator 806, and the polarization beam splitting prisms 8092 are installed on the inner side of the positioning ring 8093. The two groups of positioning rings 8093 are connected to each other, and an electric slide bar 8094 is installed at the bottom, and the electric slide bar 8094 is installed on the side of the sliding frame 809, wherein the electric slide bar 8094 is located on the outer side of the collimating lens 8091, and a gap is left between the two groups of polarization beam splitting prisms 8092. The design of the collimating lens 8091 and the polarization beam splitting prism 8092 can improve the concentration rate of the light emitted by the light irradiator 806, reduce the degree of light diffusion, and perfectly cover the light sensing area 501 of the photosensitive semiconductor element 50, so as to perform optical property testing operations. At the same time, the electric slider 8094 can adjust the distance between the polarization beam splitter prism 8092 and the collimating lens 8091, further controlling the size of the area covered by the light and improving the accuracy of the optical property test.

[0085] In the photosensitive semiconductor production test device of the present invention, when testing the photosensitive semiconductor element 50, the telescopic cylinder 801 adjusts the position height of the mounting seat 804, the internal mounting component 805 and the light irradiator 806 connected to the top of the gas rod 802 through the universal ball 803 through the telescopic movement of the output end gas rod 802, so that the light emitted by the light irradiator 806 passes through the photosensitive part 604 and covers the light sensing area 501 of the photosensitive semiconductor element 50, and performs the light irradiation operation. At the same time, the slide rail 808 installed on the outside of the mounting seat 804 through the external frame 807, and the sliding frame 809 installed on the outside of the slide rail 808 will slide on the outside of the slide rail 808, adjust the distance between the light irradiator 806 and the collimating lens 8091, control the size of the area covered by the light, and improve the accuracy of the optical property test.

[0086] Specific reference Fig.11 and Fig.12The reverse bias conductive component 90 includes a top frame 901, which is installed on the other side of the top of the second gear 705 and is located on the side of the telescopic cylinder 801. A connecting rod 902 is installed at the bottom of the top frame 901, and the connecting rod 902 is rotatably connected to the center of the inside of the support disk 602; an external sleeve 903, which is installed on the outside of the connecting rod 902 and is located at the bottom of the top frame 901. The internal movability of the external sleeve 903 is connected with a movable frame 904, and the movable frame 904 is connected to the output end of the servo motor 905, and the servo motor 905 is installed on one side of the external sleeve 903; an optical power test device 906, which is installed inside the movable frame 904 and is set toward the photosensitive semiconductor element 50, and the optical power test device 906 performs an optical property test on the photosensitive semiconductor element 50.

[0087] In this embodiment, a battery pack 9011 is installed on the top of the top frame 901, and the battery pack 9011 is connected to a conductive socket 9012 through a wire, wherein the negative electrode of the battery pack 9011 is connected to the positive electrode of the photosensitive semiconductor element 50, and the positive electrode of the battery pack 9011 is connected to the negative electrode of the photosensitive semiconductor element 50. Through the design of the conductive socket 9012, the conductive socket 9012 can be electrically connected to the positive and negative electrodes of the photosensitive semiconductor element 50, providing energy for the operation of the photosensitive semiconductor element 50, simulating the state and environment of the photosensitive semiconductor element 50 when it is installed and used. At the same time, the way in which the battery pack 9011 is electrically connected to the photosensitive semiconductor element 50 is a reverse bias connection method, which can realize the measurement and control of light, and facilitate the accuracy of subsequent test operations.

[0088] In the photosensitive semiconductor production test device of the present invention, when testing, firstly, the conductive socket 9012 is inserted into the positive and negative electrodes of the photosensitive semiconductor element 50 respectively, so as to increase the power of the photosensitive semiconductor element 50 when it is in operation, and simulate its state when it is actually installed and used. Then, when testing, the direction of the optical power test device 906 can be driven by the servo motor 905 to rotate the output end movable frame 904, so that the optical power test device 906 installed inside the movable frame 904 always faces the photosensitive semiconductor element 50, and the optical power (optical property) of the optical power test device 906 in the operating state is tested.

[0089] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A testing device for photosensitive semiconductor production, comprising a testing machine (10), a protective shell (20), an optical detection module (30), an integrated testing mechanism (40) and a photosensitive semiconductor element (50), characterized in that: A protective shell (20) is installed on one side of the top of the test platform (10), an optical detection module (30) is arranged on the side of the protective shell (20), the photosensitive semiconductor element (50) is installed inside a support assembly (60), and the support assembly (60) is installed on the inner side of an integrated test mechanism (40), The integrated testing mechanism (40) is installed inside the protective shell (20) and is electrically connected to the optical detection module (30). The integrated testing mechanism (40) comprises: a circulation component (70), the circulation component (70) being mounted on the top of the test machine (10) and being located outside the support component (60), an optical power adjustment component (80) being mounted on one side of the top of the circulation component (70), the optical power adjustment component (80) being arranged toward the photosensitive semiconductor element (50); and a reverse bias conductive component (90), the reverse bias conductive component (90) being mounted on the other side of the top of the circulation component (70) and being rotatably connected to the inner center of the support component (60), the reverse bias conductive component (90) being disposed toward the photosensitive semiconductor element (50) and being electrically connected to the photosensitive semiconductor element (50); The optical power adjustment component (80) comprises: A telescopic cylinder (801), the telescopic cylinder (801) being mounted on one side of the top of the second gear (705), the output end of the telescopic cylinder (801) being connected to a gas rod (802), the top of the gas rod (802) being mounted with a universal ball (803), the inner top of the universal ball (803) being mounted with a mounting seat (804); An inner mounting component (805), the inner mounting component (805) is mounted on the inner side of the mounting seat (804), a light irradiator (806) is installed inside the inner mounting component (805), and the light irradiator (806) is arranged toward the photosensitive semiconductor element (50), The light irradiator (806) emits light which is transmitted through the light sensing portion (604) to the light sensing area (501) of the photosensitive semiconductor element (50); An external device frame (807), the external device frame (807) is mounted on the outside of the mounting seat (804) by means of screws, and a slide rail (808) is mounted on the side thereof, the side of the slide rail (808) is connected to a slide frame (809) via an electric slider, and the slide frame (809) is located on the side of the light emitting end of the light irradiator (806); The reverse bias conductive component (90) comprises: A top frame (901), the top frame (901) is installed on the other side of the top of the second gear (705) and is located on the side of the telescopic cylinder (801), and a connecting rod (902) is installed at the bottom of the top frame (901), and the connecting rod (902) is rotatably connected to the center of the inside of the supporting disc (602); An external device sleeve (903), the external device sleeve (903) is installed on the outside of the connecting rod (902) and is located at the bottom of the top frame (901), the internal part of the external device sleeve (903) is movably connected to a movable frame (904), the movable frame (904) is connected to the output end of a servo motor (905), and the servo motor (905) is installed on one side of the external device sleeve (903); An optical power testing device (906) is installed inside the movable frame (904) and is disposed toward the photosensitive semiconductor element (50). The optical power testing device (906) performs an optical property test on the photosensitive semiconductor element (50).

2. A photosensitive semiconductor production testing device according to claim 1, characterized in that: A bottom plate (101) is installed on the inner bottom of the testing machine (10), and an optical detection module (30) is supported on the top of the bottom plate (101); and A working portion (102) is also provided at the edge of the top of the testing machine (10), and the working portion (102) is located on the side of the protective shell (20).

3. A testing device for photosensitive semiconductor production according to claim 2, characterized in that: The optical detection module (30) comprises: A central control panel (301), the central control panel (301) being installed on the top of the test machine (10) via a support (302) at the bottom and being located on the side of the protective shell (20), and a data processing module (303) being connected to the back side of the central control panel (301) by wires; A driving power supply module (304), the driving power supply module (304) is installed on the top of the base plate (101) and is connected to the data processing module (303) by wires, and the driving power supply module (304) is connected to the optical power adjustment component (80) and the reverse bias conductive component (90) by wires.

4. A photosensitive semiconductor production testing device according to claim 1, characterized in that: The support assembly (60) comprises: A support column (601), wherein the support column (601) is mounted on the top of the test machine (10) by means of screws, a support disc (602) is mounted on the top of the support column (601), and a support seat (603) is mounted at an eccentric position on the top of the support disc (602). The photosensitive semiconductor element (50) is supported inside the support base (603), and a photosensitive portion (604) is provided on a side of the support base (603) close to the optical power adjustment component (80).

5. A testing device for photosensitive semiconductor production according to claim 4, characterized in that: The circulation component (70) comprises: An external frame (701), the external frame (701) being mounted on the top of the testing machine (10) by means of screws, and the external frame (701) being arranged in a "Z" shape, and a driving motor (702) being mounted on the top of the external frame (701); A driving shaft (703), the driving shaft (703) is connected to the output end of the driving motor (702), and is rotatably connected to the bottom of the external frame (701), a first gear (704) is installed at the bottom of the driving shaft (703), and a second gear (705) is meshedly connected to the side of the first gear (704), Wherein, the first gear (704) and the second gear (705) are both rotatably connected to the top of the testing machine (10).

6. A testing device for photosensitive semiconductor production according to claim 5, characterized in that: The gear ratio between the first gear (704) and the second gear (705) is 1:8, the support column (601) is arranged at the inner center of the second gear (705), and An optical power adjustment component (80) is installed on one side of the top of the second gear (705), and a reverse bias conductive component (90) is installed on the other side of the top of the second gear (705).

7. A photosensitive semiconductor production testing device according to claim 1, characterized in that: A collimating lens (8091) is installed at the inner center of the sliding frame (809), and the collimating lens (8091) is located on the side of the light emitting end of the light irradiator (806). Two groups of polarization beam splitting prisms (8092) are arranged on the side of the collimating lens (8091) away from the light irradiator (806); and The polarization beam splitter prism (8092) is installed on the inner side of the positioning ring (8093), the two sets of positioning rings (8093) are connected to each other, and an electric slide bar (8094) is installed at the bottom, and the electric slide bar (8094) is installed on the side of the sliding frame (809). The electric slide bar (8094) is located outside the collimating lens (8091), and a gap is left between the two groups of polarization beam splitting prisms (8092).

8. The photosensitive semiconductor production testing device according to claim 1, characterized in that: A battery pack (9011) is installed on the top of the top frame (901), and the battery pack (9011) is connected to a conductive socket (9012) via a wire. The negative electrode of the battery pack (9011) is connected to the positive electrode of the photosensitive semiconductor element (50), and the positive electrode of the battery pack (9011) is connected to the negative electrode of the photosensitive semiconductor element (50).

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