A raw material laser cutting device and control system for parts processing
Through deep learning technology, the board information and cutting component status are analyzed, and the support sawtooth density and cutting path are dynamically adjusted, which solves the problem of existing laser cutting devices when cutting small materials and lack of adaptability to different plates, and improves the cutting quality and efficiency.
Patent Information
- Application Number
- CN202410951596.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2044-07-16
AI Technical Summary
The existing laser cutting device cannot handle the sawtooth plate when cutting small materials, which affects the cutting quality and efficiency. The contact between the sawtooth plate and the sheet material leads to a decrease in cutting quality, and there is a lack of intelligent adjustment of cutting parameters to adapt to the sheets of different thicknesses and materials.
A laser cutting device including a mobile station, cutting assembly, connecting frame, supporting sawtooth and rotating disc was designed. Through deep learning technology, the plate information and cutting assembly status are analyzed, and the support sawtooth density and cutting path are dynamically adjusted to realize the support sawtooth density and cutting path to achieve the Adaptive cutting.
It improves cutting quality and efficiency, enhances the ability to take on small objects, extends the service life of the equipment, and realizes intelligent cutting parameters adjustment of different plates.
Smart Images

Figure CN118752085B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of laser cutting, in particular to a raw material laser cutting device and a control system for parts processing. Background Art
[0002] In the prior art, before parts processing, the plate generally needs to be cut into a suitable size first, and then it can be easily operated. Laser cutting is widely used in plate raw material cutting activities due to its characteristics of fast cutting speed, high cutting accuracy, and good incision parallelism.
[0003] The existing patent document with announcement number CN217475111U discloses a laser cutting device, including: a main frame, a cutting robot arm and a serrated support arranged at the bottom of the cutting robot arm are provided on the top; a primary screen and a secondary screen are obliquely arranged at the bottom of the serrated support, the primary screen is arranged on the top of the secondary screen, and the lower end of the primary screen is arranged on the top of the higher end of the secondary screen; a storage box is arranged at the bottom of the secondary screen, the storage box includes three collection areas, the middle collection area is arranged directly below the screen, one of the collection areas is arranged at the bottom of the lower end of the primary screen, and the other collection area is arranged at the bottom of the lower end of the secondary screen.
[0004] However, the above device has the following problems when used:
[0005] When the existing device is in use, the plate is generally supported by placing the plate on a serrated plate. However, in the existing equipment, the density of the serrated plate is constant. When cutting, once the cut material is small, the serrated plate will not be able to take it, affecting the cutting quality and efficiency. When in use, the serrated plate is always in contact with the plate. Once a part of the serrated plate is damaged, it is easy to affect the cutting quality. At the same time, the existing laser cutting device lacks intelligent adjustment of cutting parameters when cutting plates of different thicknesses and materials.
[0006] To this end, we propose a raw material laser cutting device and control system for parts processing to solve the above problems. Summary of the invention
[0007] In view of the shortcomings of the prior art, the present invention provides a smart grid line loss prediction method based on deep learning to solve the problems raised in the above background technology.
[0008] In order to achieve the above object, the present invention adopts the following technical solutions:
[0009] A raw material laser cutting device and control system for parts processing, comprising a machine body, a moving platform slidably mounted on the machine body, a cutting assembly arranged on the moving platform, a connecting frame slidably mounted inside the machine body, a first mounting rod equidistantly and evenly fixedly mounted on the connecting frame, and a supporting sawtooth arranged on the first mounting rod;
[0010] The first connecting rods are fixedly mounted on the four corners of the connecting frame;
[0011] Two mounting plates are slidably mounted inside the machine body, and fixed blocks are evenly and evenly fixedly mounted on the two mounting plates, and a second mounting rod is fixedly mounted between the opposite fixed blocks, and the second mounting rod is provided with supporting saw teeth;
[0012] Second connecting rods are fixedly mounted on both sides of the two mounting plates;
[0013] Wheel bodies are fixedly mounted on the ends of the first connecting rod and the second connecting rod facing away from the moving platform;
[0014] A rotating disk is provided inside the machine body, a first accommodation chamber and a second accommodation chamber are fixedly mounted on the rotating disk, the first connecting rod is located inside the first accommodation chamber, and the second connecting rod is located inside the second accommodation chamber;
[0015] The first accommodating chamber and the second accommodating chamber are respectively provided with a first slide rail and a second slide rail for the wheel body to slide.
[0016] Preferably, there are four rotating disks, and a fixed rod is fixedly installed at the center of the bottom circle of the rotating disk. The two fixed rods on the same side are connected by a synchronous belt. A driving motor is arranged at the bottom of a rotating disk on both sides, and the shaft output ends of the two driving motors are fixedly connected to the fixed rod at the bottom of the corresponding rotating disk.
[0017] Preferably, a first height adjusting device is fixedly installed inside the first accommodating chamber, the first height adjusting device includes a first parallel section, a middle descending section and a tail parallel section, and a first slide rail is also provided on the first height adjusting device, and the fluctuation amplitude of the first slide rail is the same as that of the first height adjusting device.
[0018] Preferably, a second height adjusting device is fixedly installed inside the second accommodating chamber, the second height adjusting device includes a front ascending section and a rear parallel section, and a second slide rail is also provided on the second height adjusting device, and the fluctuation amplitude of the second slide rail is the same as that of the second height adjusting device.
[0019] Preferably, a reinforcing rod is fixedly installed at the center position of the connecting frame, and the reinforcing rod is fixedly connected to the first mounting rod.
[0020] Preferably, an adapting groove is provided at the center of the second mounting rod, and the adapting groove corresponds to the reinforcing rod.
[0021] Preferably, the first mounting rod is located directly above the gap between adjacent fixing blocks, and the fixing blocks will not affect the lifting and lowering movement of the second mounting rod.
[0022] The present invention comprises a data processing module, a path analysis module and a control module;
[0023] The data processing module is used to receive the plate information of the plate to be cut and the state information of the cutting assembly; comprehensively analyze the plate information of the plate to be cut and the state information of the cutting device to obtain the surface value, the path difference value, and the laser control value; and mark the surface value, the path difference value, and the laser control value as the identification analysis result;
[0024] Compare any parameter in the identification and analysis result with the standard threshold corresponding to the parameter, and if the parameter is less than the standard threshold corresponding to the parameter, generate a control signal corresponding to the parameter;
[0025] A path analysis module is used to identify and analyze the cutting path of the cutting point of the cutting component to obtain a priority cutting path;
[0026] The control module is used to receive control signaling to perform corresponding operations.
[0027] Preferably, the plate information of the plate to be cut and the state information of the cutting device are comprehensively analyzed, specifically:
[0028] Obtain a surface image of the plate to be cut, use image recognition technology to perform contour recognition on the surface image to obtain a two-dimensional contour of the plate to be cut; obtain two-dimensional contours from multiple viewing angles and use three-dimensional reconstruction technology to reconstruct the three-dimensional contour of the plate to be cut; calculate the area of the three-dimensional surface contour to obtain a surface value;
[0029] Obtain the three-dimensional position of the cutting focus of the cutting component and the starting point position of the preferred cutting path, calculate the distance difference between them, and obtain the path difference value;
[0030] Obtaining state information of the cutting focus on the cutting component, including laser power and laser speed; performing difference calculation between any parameter in the state information and the standard parameter value corresponding to the parameter to obtain the standard deviation value corresponding to the parameter;
[0031] Obtain the material of the plate to be cut and match the laser adjustment coefficient corresponding to the material;
[0032] The standard deviation value corresponding to the parameter and its laser adjustment coefficient are weightedly calculated to obtain the laser control value.
[0033] Preferably, the cutting path of the cutting point of the cutting component is identified and analyzed, specifically:
[0034] Obtain the cutting task and the three-dimensional contour of the plate to be cut, and extract the plate requirement information of the plate to be cut from the cutting task; use a pattern recognition algorithm to match the cutting path of the plate requirement information of the plate to be cut with the three-dimensional contour to obtain a matching result; the matching result includes several cutting paths; use a path planning algorithm to determine the optimal cutting path, and mark the optimal cutting path as the preferred cutting path.
[0035] Preferably, receiving control signaling to perform corresponding operations, specifically:
[0036] If a control signal corresponding to the surface value is generated, the corresponding support density is matched according to the surface value; the angle at which the rotating disk needs to rotate is calculated according to the support density; the driving motor is controlled to start, and the four rotating disks are driven to rotate according to the predetermined rotation angle, and the positions of the support serrations on the first mounting rod and the second mounting rod are adjusted to change the support density to adapt to plates of different sizes and shapes;
[0037] If a control signaling corresponding to the path difference is generated, the mobile station is controlled to adjust the three-dimensional position of the cutting point on the cutting component in the horizontal, longitudinal and vertical directions according to the path difference;
[0038] If a control signaling corresponding to the laser adjustment value is generated, the laser power of the cutting component is adjusted according to the laser adjustment value, and the moving speed of the moving stage is controlled.
[0039] Compared with the prior art, the present invention has the following beneficial effects:
[0040] (1) The present invention is provided with supporting saw teeth, a connecting frame, a first connecting rod, a second connecting rod, a mounting plate, a rotating disk, a first mounting rod, a second mounting rod, a wheel body, a first height adjusting device and a second height adjusting device. By rotating the rotating disk, the supporting saw teeth on the first mounting rod can be made the same as their initial positions, and the height of the supporting saw teeth on the second mounting rod can be gradually increased. When increased to the highest point, the supporting saw teeth on the second mounting rod are parallel to the supporting saw teeth on the first mounting rod, so that the density of the supporting saw teeth can be changed, the carrying capacity of small objects can be enhanced, and it is more convenient to use.
[0041] (2) The present invention is provided with a first connecting rod, a second connecting rod, a wheel body, a first height-adjusting device and a second height-adjusting device. By making the rotating disk continue to rotate, the height of the supporting saw teeth on the first mounting rod gradually decreases and then stably maintains at a lower position. The supporting saw teeth on the second mounting rod are always maintained at a higher state, so that the supporting saw teeth on the second mounting rod are exposed and perform supporting activities. When the supporting saw teeth on the first mounting rod are damaged, they can be replaced in time to ensure the continuous operation of the equipment, or the two can perform supporting activities alternately to increase the service life of the equipment.
[0042] (3) The present invention realizes precise control of the cutting process through comprehensive analysis of the plate information and the state of the cutting components through the control system, thereby improving the cutting quality and efficiency. It can also automatically adjust the position and density of the supporting saw teeth according to different plate information and cutting requirements, and has strong adaptability, simple operation and good stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] Figure 1 This is a schematic diagram of a raw material laser cutting device for parts processing proposed by the present invention.
[0044] Figure 2 This is a schematic diagram of the installation position of the supporting saw teeth of a raw material laser cutting device for parts processing proposed by the present invention.
[0045] Figure 3 This is a schematic diagram of the installation position of the supporting saw teeth on the first installation rod of the raw material laser cutting device for parts processing proposed by the present invention.
[0046] Figure 4 This is a schematic diagram of the installation position of the supporting saw teeth on the second mounting rod of a raw material laser cutting device for parts processing proposed by the present invention.
[0047] Figure 5 This is a schematic diagram of the synchronous rotation principle of a rotating disk in a raw material laser cutting device for parts processing proposed by the present invention.
[0048] Figure 6 This is a schematic diagram of a first height adjustment device of a raw material laser cutting device for parts processing proposed by the present invention.
[0049] Figure 7 This is a schematic diagram of the second height adjustment device of the raw material laser cutting device for parts processing proposed by the present invention.
[0050] Figure 8 This is a principle block diagram of a control system of a raw material laser cutting device for parts processing proposed by the present invention.
[0051] In the figure: 1. body; 2. moving table; 3. cutting assembly; 4. supporting saw teeth; 5. connecting frame; 6. first connecting rod; 7. second connecting rod; 8. mounting plate; 9. rotating disk; 10. synchronous belt; 11. driving motor; 12. first mounting rod; 13. reinforcing rod; 14. fixing block; 15. second mounting rod; 16. adapter groove; 17. first accommodating chamber; 18. second accommodating chamber; 19. wheel body; 20. first height-adjusting device; 21. first parallel section; 22. middle descending section; 23. tail parallel section; 24. first slide rail; 25. second height-adjusting device; 26. front ascending section; 27. rear parallel section; 28. second slide rail; 29. fixing rod. DETAILED DESCRIPTION
[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0053] See also Figures 1 to 8 A raw material laser cutting device and control system for parts processing, including a body 1, a moving table 2 is slidably installed on the body 1, and a cutting component 3 is arranged on the moving table 2. During specific work, a plate to be laser cut is placed on the body 1, and the movement of the moving table 2 on the body 1 causes the cutting component 3 to change on the Y axis. The cutting component 3 can move on the moving table 2 to achieve adjustment of the cutting component 3 on the X axis. By changing the height of the cutting component 3 itself, the cutting component 3 can achieve change in the Z axis, and then can be adjusted in three dimensions according to actual needs, so that the cutting component 3 can cut an ideal shape on the plate.
[0054] A connecting frame 5 is slidably mounted inside the machine body 1, and first mounting rods 12 are fixedly mounted on the connecting frame 5 at equal intervals and uniformly, and the first mounting rods 12 are provided with supporting saw teeth 4;
[0055] The connecting frame 5 can only move vertically on the machine body 1, and the supporting saw teeth 4 can support the plate so that the plate can remain stable during cutting.
[0056] The first connecting rods 6 are fixedly mounted on the four corners of the connecting frame 5;
[0057] Two mounting plates 8 are slidably mounted inside the machine body 1, and fixing blocks 14 are evenly and evenly fixedly mounted on the two mounting plates 8, and a second mounting rod 15 is fixedly mounted between the opposite fixing blocks 14, and the second mounting rod 15 is provided with a supporting sawtooth 4;
[0058] In the initial state, the height of the supporting serrations 4 on the first mounting rod 12 is higher than the height of the supporting serrations 4 on the second mounting rod 15 , so the supporting serrations 4 on the first mounting rod 12 are exposed, thereby supporting the plate.
[0059] Second connecting rods 7 are fixedly mounted on both sides of the two mounting plates 8;
[0060] The first connecting rod 6 and the second connecting rod 7 are both fixedly mounted with a wheel body 19 at one end away from the moving platform 2;
[0061] A rotating disk 9 is provided inside the machine body 1 , and a first accommodating chamber 17 and a second accommodating chamber 18 are fixedly mounted on the rotating disk 9 . The first connecting rod 6 is located inside the first accommodating chamber 17 , and the second connecting rod 7 is located inside the second accommodating chamber 18 .
[0062] By rotating the rotating disk 9, the positions of the first accommodating chamber 17 and the second accommodating chamber 18 are changed, and the relative positions of the first accommodating chamber 17 and the first connecting rod 6, and the second accommodating chamber 18 and the second connecting rod 7 are changed, which facilitates subsequent adjustment activities.
[0063] A first slide rail 24 and a second slide rail 28 are respectively disposed inside the first accommodation chamber 17 and the second accommodation chamber 18 , on which the wheel body 19 can slide.
[0064] The height change of the first slide rail 24 and the second slide rail 28 can make the height of the first connecting rod 6 and the second connecting rod 7 change synchronously, and then the height of the supporting serration 4 on the second mounting rod 15 and the supporting serration 4 on the first mounting rod 12 can be adjusted synchronously.
[0065] There are four rotating disks 9, and a fixed rod 29 is fixedly installed at the center of the bottom circle of the rotating disk 9. The two fixed rods 29 on the same side are connected by a synchronous belt 10. A driving motor 11 is provided at the bottom of a rotating disk 9 on both sides, and the shaft output ends of the two driving motors 11 are fixedly connected to the fixed rod 29 at the bottom of the corresponding rotating disk 9.
[0066] The two drive motors 11 are started synchronously, and have the same rotation angle and torque.
[0067] When the two driving motors 11 are started, the fixed rods 29 connected thereto rotate, and the rotation of the fixed rods 29 causes the two fixed rods 29 to rotate synchronously through the synchronous belt 10, and then the four rotating disks 9 rotate synchronously.
[0068] The first connecting rod 6 and the second connecting rod 7 on the same side are located on the same plane. The first connecting rod 6 and the second connecting rod 7 only move in the vertical direction, and the movement of the rotating disk 9 is relative to the first connecting rod 6 and the second connecting rod 7.
[0069] A first height adjusting device 20 is fixedly installed inside the first accommodating chamber 17 , and the first height adjusting device 20 includes a first parallel section 21 , a middle descending section 22 and a tail parallel section 23 . A first slide rail 24 is also provided on the first height adjusting device 20 , and the fluctuation amplitude of the first slide rail 24 is the same as that of the first height adjusting device 20 .
[0070] When the rotating disk 9 rotates, the wheel body 19 on the first connecting rod 6 is first located on the first parallel section 21. At this time, the supporting serration 4 on the first mounting rod 12 is the same as its initial position. The rotating disk 9 continues to rotate, and the wheel body 19 will be on the middle descending section 22. At this time, the height of the supporting serration 4 on the first mounting rod 12 gradually decreases. Afterwards, when the rotating disk 9 continues to rotate, the height of the supporting serration 4 on the first mounting rod 12 is stably maintained at a lower position.
[0071] A second height adjusting device 25 is fixedly installed inside the second accommodating chamber 18 . The second height adjusting device 25 includes a front ascending section 26 and a rear parallel section 27 . A second slide rail 28 is also provided on the second height adjusting device 25 . The fluctuation amplitude of the second slide rail 28 is the same as that of the second height adjusting device 25 .
[0072] When the rotating disk 9 rotates, the wheel body 19 on the second connecting rod 7 is first in the front rising section 26, and the height of the supporting serrations 4 on the second mounting rod 15 gradually increases. When it rises to the highest point, the supporting serrations 4 on the second mounting rod 15 are parallel to the supporting serrations 4 on the first mounting rod 12, so that the density can be changed. The rotating disk 9 continues to rotate, and the supporting serrations 4 on the second mounting rod 15 are always maintained at a higher state.
[0073] A reinforcing rod 13 is fixedly installed at the center position of the connecting frame 5. The reinforcing rod 13 is fixedly connected to the first mounting rod 12. The reinforcing rod 13 is used to keep the first mounting rod 12 in a horizontal state, thereby ensuring the jacking effect guaranteed by the supporting sawtooth 4.
[0074] An adapting groove 16 is formed at the center of the second mounting rod 15 . The adapting groove 16 corresponds to the reinforcing rod 13 , and the adapting groove 16 will not affect the falling movement of the reinforcing rod 13 .
[0075] The first mounting rod 12 is located directly above the gap between adjacent fixing blocks 14 , and the fixing blocks 14 will not affect the lifting and lowering movement of the second mounting rod 15 .
[0076] All these designs are to enable the first mounting rod 12 and the second mounting rod 15 to perform normal lifting activities.
[0077] The working process of the present invention is as follows: first, the density of the supporting teeth 4 is adjusted according to the area of the plate to be cut after unloading. When the area of the plate to be cut is large, no adjustment is required, so that the equipment is in the initial state. At this time, the height of the supporting teeth 4 on the first mounting rod 12 is higher than the height of the supporting teeth 4 on the second mounting rod 15, so the supporting teeth 4 on the first mounting rod 12 are exposed, thereby supporting the plate.
[0078] When the area of the plate to be cut is small, when the two driving motors 11 are started, the four rotating disks 9 are rotated synchronously through the synchronous belt 10, and the wheel body 19 on the first connecting rod 6 first moves on the first parallel section 21. At this time, the supporting saw teeth 4 on the first mounting rod 12 are the same as their initial positions, and the wheel body 19 on the second connecting rod 7 moves on the front rising section 26. The height of the supporting saw teeth 4 on the second mounting rod 15 gradually increases. When it is increased to the highest point, at this time, the supporting saw teeth 4 on the second mounting rod 15 are parallel to the supporting saw teeth 4 on the first mounting rod 12, so that the density can be changed.
[0079] When the supporting serration 4 on the first mounting rod 12 is damaged and cannot be used normally, the rotating disk 9 rotates and the wheel body 19 is on the middle descending section 22. At this time, the height of the supporting serration 4 on the first mounting rod 12 gradually decreases, and then the height of the supporting serration 4 on the first mounting rod 12 is stably maintained at a lower position. At the same time, the rear parallel section 27 makes the supporting serration 4 on the second mounting rod 15 always maintain a higher state.
[0080] At this time, the height of the supporting serrations 4 on the second mounting rod 15 is higher than that of the supporting serrations 4 on the first mounting rod 12. The supporting serrations 4 on the second mounting rod 15 can support the plate, and their height is the same as that of the supporting serrations 4 on the first mounting rod 12 in the initial state, eliminating the need for parameter adjustment and making it more practical.
[0081] Then, the plate to be cut is placed on the machine body 1. The movement of the movable table 2 on the machine body 1 causes the cutting component 3 to change on the Y axis. The cutting component 3 can be moved on the movable table 2 to achieve adjustment of the cutting component 3 on the X axis. By changing the height of the cutting component 3 itself, the cutting component 3 can achieve change in the Z axis, and then three-dimensional adjustment can be performed according to actual needs, so that the cutting component 3 can cut an ideal shape on the plate.
[0082] The present invention comprises a data processing module, a path analysis module and a control module;
[0083] The data processing module is used to receive the plate information of the plate to be cut and the state information of the cutting assembly 3; comprehensively analyze the plate information of the plate to be cut and the state information of the cutting device to obtain the surface value, path difference value, and laser control value; and mark the surface value, path difference value, and laser control value as identification and analysis results;
[0084] Compare any parameter in the identification and analysis result with the standard threshold corresponding to the parameter, and if the parameter is less than the standard threshold corresponding to the parameter, generate a control signal corresponding to the parameter;
[0085] A path analysis module, used to identify and analyze the cutting path of the cutting point of the cutting component 3 to obtain a priority cutting path;
[0086] The control module is used to receive control signaling to perform corresponding operations.
[0087] Comprehensive analysis is performed on the plate information of the plate to be cut and the status information of the cutting device, specifically:
[0088] Obtain a surface image of the plate to be cut, use image recognition technology to perform contour recognition on the surface image to obtain a two-dimensional contour of the plate to be cut; obtain two-dimensional contours from multiple viewing angles and use three-dimensional reconstruction technology to reconstruct the three-dimensional contour of the plate to be cut; calculate the area of the three-dimensional surface contour to obtain a surface value;
[0089] Obtain the three-dimensional position of the cutting focus of the cutting component 3 and the starting point position of the preferred cutting path, calculate the distance difference between them, and obtain the path difference value;
[0090] Obtain the state information of the cutting focus on the cutting component 3, including laser power and laser speed; perform difference calculation between any parameter in the state information and the standard parameter value corresponding to the parameter to obtain the standard deviation value Pu corresponding to the parameter, where u represents the index corresponding to the parameter;
[0091] Get the material of the plate to be cut and match the laser adjustment coefficient Yr corresponding to the material according to the material, where r represents the index corresponding to the material;
[0092] The standard deviation value corresponding to the parameter and its laser adjustment coefficient are weighted and calculated using the formula , and obtain the laser control value K; wherein ug1 and g2 represent the standard deviation value corresponding to the parameter u and the weight corresponding to its laser adjustment coefficient, respectively.
[0093] The cutting path of the cutting point of the cutting component 3 is identified and analyzed, specifically:
[0094] Obtain the cutting task and the three-dimensional contour of the plate to be cut, and extract the plate requirement information of the plate to be cut from the cutting task; use a pattern recognition algorithm to match the cutting path of the plate requirement information of the plate to be cut with the three-dimensional contour to obtain a matching result; the matching result includes several cutting paths; use a path planning algorithm to determine the optimal cutting path, and mark the optimal cutting path as the preferred cutting path.
[0095] Receive control signaling to perform corresponding operations, specifically:
[0096] If a control signal corresponding to the surface value is generated, the corresponding support density is matched according to the surface value; the angle at which the rotating disk 9 needs to rotate is calculated according to the support density; the driving motor 11 is controlled to start, and the four rotating disks 9 are driven to rotate according to the predetermined rotation angle, and the positions of the support teeth 4 on the first mounting rod 12 and the second mounting rod 15 are adjusted to change the support density to adapt to plates of different sizes and shapes;
[0097] If a control signaling corresponding to the path difference is generated, the mobile station 2 is controlled to adjust the three-dimensional position of the cutting point on the cutting component 3 in the horizontal, longitudinal and vertical directions according to the path difference;
[0098] If a control signal corresponding to the laser adjustment value is generated, the laser power of the cutting component 3 is adjusted according to the laser adjustment value, and the moving speed of the moving platform 2 is controlled.
[0099] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A raw material laser cutting device for parts processing, comprising a body (1), a movable table (2) slidably mounted on the body (1), a cutting assembly (3) being arranged on the movable table (2), characterized in that: A connecting frame (5) is slidably mounted inside the machine body (1), and first mounting rods (12) are fixedly mounted on the connecting frame (5) at equal intervals, and the first mounting rods (12) are provided with supporting saw teeth (4); first connecting rods (6) are fixedly mounted on the four corners of the connecting frame (5); two mounting plates (8) are slidably mounted inside the machine body (1), and fixed blocks (14) are fixedly mounted on the two mounting plates (8) at equal intervals, and second mounting rods (15) are fixedly mounted between the opposite fixed blocks (14), and the second mounting rods (15) are provided with supporting saw teeth (4); second connecting rods (7) are fixedly mounted on both sides of the two mounting plates (8); wheels (19) are fixedly mounted on the ends of the first connecting rod (6) and the second connecting rod (7) facing away from the moving platform (2); A rotating disk (9) is provided inside the machine body (1), and a first accommodating chamber (17) and a second accommodating chamber (18) are fixedly mounted on the rotating disk (9); the first connecting rod (6) is located inside the first accommodating chamber (17), and the second connecting rod (7) is located inside the second accommodating chamber (18); A first slide rail (24) and a second slide rail (28) are respectively provided inside the first accommodation chamber (17) and the second accommodation chamber (18) for the wheel body (19) to slide. A first height adjustment device (20) is fixedly installed inside the first accommodation chamber (17). The first height adjustment device (20) comprises a first parallel section (21), a middle descending section (22) and a rear parallel section (23). The first height adjustment device (20) is also provided with a first slide rail (24). The fluctuation amplitude of the first slide rail (24) is the same as that of the first height adjustment device (20). A second height-adjusting device (25) is fixedly installed inside the second accommodation chamber (18). The second height-adjusting device (25) comprises a front ascending section (26) and a rear parallel section (27). A second slide rail (28) is also provided on the second height-adjusting device (25). The fluctuation range of the second slide rail (28) is the same as that of the second height-adjusting device (25).
2. A raw material laser cutting device for parts processing according to claim 1, characterized in that: There are four rotating disks (9), and a fixed rod (29) is fixedly installed at the center of the bottom of each rotating disk (9). The two fixed rods (29) on the same side are connected by a synchronous belt (10). A driving motor (11) is arranged at the bottom of each rotating disk (9) on both sides, and the shaft output ends of the two driving motors (11) are fixedly connected to the fixed rod (29) at the bottom of the corresponding rotating disk (9).
3. A raw material laser cutting device for parts processing according to claim 1, characterized in that: A reinforcing rod (13) is fixedly mounted at the center of the connecting frame (5), and the reinforcing rod (13) is fixedly connected to the first mounting rod (12).
4. A raw material laser cutting device for parts processing according to claim 1, characterized in that: An adaption groove (16) is provided at the center of the second mounting rod (15), and the adaption groove (16) corresponds to the reinforcing rod (13).
5. A control system for a raw material laser cutting device for parts processing, using a raw material laser cutting device for parts processing as claimed in claims 1 to 4, characterized in that: It includes data processing module, path analysis module and control module; A data processing module is used to receive the plate information of the plate to be cut and the status information of the cutting assembly (3); perform a comprehensive analysis on the plate information of the plate to be cut and the status information of the cutting device to obtain a surface value, a path difference value, and a laser control value; and mark the surface value, the path difference value, and the laser control value as identification and analysis results; Compare any parameter in the identification and analysis result with the standard threshold corresponding to the parameter, and if the parameter is less than the standard threshold corresponding to the parameter, generate a control signal corresponding to the parameter; A path analysis module, used to identify and analyze the cutting path of the cutting point of the cutting component (3) to obtain a priority cutting path; The control module is used to receive control signaling to perform corresponding operations.
6. The control system of a raw material laser cutting device for parts processing according to claim 5, characterized in that: Comprehensive analysis is performed on the plate information of the plate to be cut and the status information of the cutting device, specifically: Obtain a surface image of the plate to be cut, and use image recognition technology to perform contour recognition on the surface image to obtain a two-dimensional contour of the plate to be cut; obtain two-dimensional contours from multiple viewing angles and use three-dimensional reconstruction technology to reconstruct the three-dimensional contour of the plate to be cut; Calculate the area of the three-dimensional surface contour to obtain the surface value; Obtaining the three-dimensional position of the cutting focus of the cutting component (3) and the starting position of the preferred cutting path, performing distance difference calculation on them, and obtaining a path difference value; Obtaining state information of the cutting focus on the cutting component (3), including laser power and laser speed; Calculate the difference between any parameter in the status information and the standard parameter value corresponding to the parameter to obtain the standard deviation value corresponding to the parameter; Obtain the material of the plate to be cut and match the laser adjustment coefficient corresponding to the material; The standard deviation value corresponding to the parameter and its laser adjustment coefficient are weightedly calculated to obtain the laser control value.
7. The control system of a raw material laser cutting device for parts processing according to claim 5, characterized in that: The cutting path of the cutting point of the cutting component (3) is identified and analyzed, specifically: Obtaining the to-be-cut task and the three-dimensional contour of the to-be-cut plate, and extracting the plate requirement information of the to-be-cut plate from the to-be-cut task; using a pattern recognition algorithm to match the plate requirement information of the to-be-cut plate with the three-dimensional contour for cutting paths, and obtaining a matching result; the matching result includes a plurality of cutting paths; The optimal cutting path is determined using a path planning algorithm, and the optimal cutting path is marked as a preferred cutting path.
8. The control system of a raw material laser cutting device for parts processing according to claim 5, characterized in that: Receive control signaling to perform corresponding operations, specifically: If a control signal corresponding to a surface value is generated, the corresponding support density is matched according to the surface value; The angle at which the rotating disk (9) needs to rotate is calculated according to the support density; the driving motor (11) is controlled to start, and the four rotating disks (9) are driven to rotate according to the predetermined rotation angle, and the positions of the supporting saw teeth (4) on the first mounting rod (12) and the second mounting rod (15) are adjusted to change the support density to adapt to plates of different sizes and shapes; If a control signal corresponding to the path difference is generated, the mobile station (2) is controlled to adjust the three-dimensional position of the cutting point on the cutting component (3) in the horizontal, longitudinal and vertical directions according to the path difference; If a control signal corresponding to the laser adjustment value is generated, the laser power of the cutting component (3) is adjusted according to the laser adjustment value, and the moving speed of the moving platform (2) is controlled.
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