Circuit board assembly and camera module

Abstract

The present application discloses a circuit board assembly and a camera module. The circuit board assembly includes: a circuit board hard board part, a flexible connecting belt, at least one electromagnetic shielding layer and at least one covering part. The circuit board hard board part includes a chip hard board part and a connecting hard board part; the flexible connecting belt is connected to the circuit board hard board part and is located between the chip hard board part and the connecting hard board part; at least one electromagnetic shielding layer extends between the surface of the circuit board hard board part and the surface of the flexible connecting belt; the electromagnetic shielding layer has at least one connecting corresponding part, and the connecting corresponding part corresponds to the place where the flexible connecting belt and the circuit board hard board part are connected to each other; at least one covering part is arranged on the outer surface of at least one connecting corresponding part.

Description

Technical Field

[0001] The present application relates to the field of imaging, and more specifically, to a circuit board assembly and a imaging module. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules applied to mobile electronic devices for helping users to obtain images have been rapidly developed and improved.

[0003] The circuit board assembly is an important component of the camera module, which is used to provide electrical connections for the various components of the camera module to ensure the coordinated operation of the various components. The camera module usually requires the circuit board to be electrically connected to the mainboard of the mobile electronic device to complete the conduction between the camera module and the mobile electronic device. However, the current generated by other devices in the mobile electronic device during operation may interfere with the circuit board of the camera module. Therefore, it is necessary to set an electromagnetic interference layer (i.e., EMI layer, the full English name is: Electro Magnetic Interference) on the circuit board of the camera module. The electromagnetic interference layer is used as an electromagnetic shielding layer to reduce or prevent electromagnetic interference by shielding, absorbing or reflecting electromagnetic waves.

[0004] However, the electromagnetic shielding layer also brings troubles to the manufacturing of the camera module while achieving electromagnetic shielding. For example, the electromagnetic shielding layer is prone to bulging or damage and failure. Therefore, a new circuit board assembly design is needed. Summary of the invention

[0005] The main advantage of the present application is to provide a circuit board assembly and a camera module, wherein the circuit board assembly can avoid bulging or damage and failure of the electromagnetic shielding layer to a certain extent by optimizing its structure.

[0006] Another advantage of the present application is that it provides a circuit board assembly and a camera module, wherein the electromagnetic shielding layer of the circuit board assembly arranged on the front side of its flexible connecting belt avoids the chip hard board part, which can avoid affecting the layout and function of the electronic components preset on the front side of the chip hard board part.

[0007] Another advantage of the present application is that it provides a circuit board assembly and a camera module, wherein the electromagnetic shielding layer of the circuit board assembly arranged on the back side of its flexible connecting belt avoids the connecting hard board part, which can avoid affecting the layout and function of the connector preset on the back side of the connecting hard board part.

[0008] Another advantage of the present application is that it provides a circuit board assembly and a camera module, wherein the structural configuration of the electromagnetic shielding layer of the circuit board assembly disposed on the front side of its flexible connecting tape adjacent to the chip hard board portion can reduce the risk of the electromagnetic shielding layer being damaged and failing when the flexible connecting tape is bent.

[0009] Another advantage of the present application is that it provides a circuit board assembly and a camera module, wherein the structural configuration of the silk-screen portion of the circuit board assembly can match the light spot distribution, thereby enhancing the anti-stray light performance while avoiding blocking the light spot.

[0010] According to one aspect of the present application, there is provided a circuit board assembly, comprising:

[0011] The circuit board hard board part includes: chip hard board part and connection hard board part;

[0012] A flexible connecting strip connected between the chip hard board portion and the connecting hard board portion;

[0013] At least one electromagnetic shielding layer extends between the surface of the hard board part of the circuit board and the surface of the flexible connecting belt; the electromagnetic shielding layer has at least one connection corresponding part, and the connection corresponding part corresponds to the mutual connection between the flexible connecting belt and the hard board part of the circuit board;

[0014] At least one covering portion is disposed on the outer surface of at least one of the connection corresponding portions.

[0015] In one embodiment of the circuit board assembly described in the present application, the connecting hard board portion has a relative connecting hard board front side and a connecting hard board back side; the flexible connecting belt has a relative flexible belt front side and a flexible belt back side; the electromagnetic shielding layer is a front electromagnetic shielding layer, and the front electromagnetic shielding layer extends between the front side of the flexible belt and the front side of the connecting hard board; the front electromagnetic shielding layer has a first connecting corresponding part, and the first connecting corresponding part corresponds to the place where the connecting hard board portion and the flexible connecting belt are connected to each other; the covering part is a first covering part, and the first covering part is arranged on the front side of the first connecting corresponding part, a part of which corresponds to the flexible connecting belt, and the other part corresponds to the connecting hard board portion.

[0016] In one embodiment of the circuit board assembly described in the present application, the chip hard board part has a relative chip hard board front side and a chip hard board back side; the flexible connecting belt has a relative flexible belt front side and a flexible belt back side; the electromagnetic shielding layer is a back electromagnetic shielding layer, and the back electromagnetic shielding layer extends between the back side of the flexible connecting belt and the back side of the chip hard board; the back electromagnetic shielding layer has a second connection corresponding part, and the second connection corresponding part corresponds to the connection between the chip hard board part and the flexible connecting belt; the covering part is a second covering part, and the second covering part is arranged on the back side of the second connection corresponding part, a part of which corresponds to the flexible connecting belt, and the other part corresponds to the chip hard board part.

[0017] In one embodiment of the circuit board assembly according to the present application, the first covering portion is glue, and the first covering portion is only connected to the front electromagnetic shielding layer.

[0018] In one embodiment of the circuit board assembly described in the present application, the side where the chip hard board part is connected to the flexible connecting belt is defined as the chip hard board connection side; the front electromagnetic shielding layer has a front shielding layer side, the front shielding layer side is located on the flexible connecting belt, the front shielding layer side is spaced apart from the chip hard board connection side, and the distance between the front shielding layer side and the chip hard board connection side is 0.1mm-1mm.

[0019] In one embodiment of the circuit board assembly according to the present application, the front electromagnetic shielding layer has a front shielding layer side, the front shielding layer side is located on the flexible connecting belt, and the front shielding layer side is wavy.

[0020] In one embodiment of the circuit board assembly according to the present application, the spacing between every two adjacent wave peaks on one side of the front shielding layer is 1 mm-3 mm.

[0021] In one embodiment of the circuit board assembly according to the present application, the second covering portion is glue, and the second covering portion is only connected to the back electromagnetic shielding layer.

[0022] In one embodiment of the circuit board assembly described in the present application, the side where the connecting hard board part is connected to the flexible connecting belt is defined as the connecting hard board connection side; the back electromagnetic shielding layer has a back shielding layer side, the back shielding layer side is located on the flexible connecting belt, the back shielding layer side is spaced apart from the connecting hard board connection side, and the distance between the back shielding layer side and the connecting hard board connection side is 0.1mm-1mm.

[0023] In one embodiment of the circuit board assembly according to the present application, the circuit board assembly further comprises a reinforcement portion, and the reinforcement portion is disposed on the front side where the flexible connecting strip is connected to the hard board portion of the chip.

[0024] In one embodiment of the circuit board assembly described in the present application, the circuit board assembly also includes a filter bracket and a filter element; the filter bracket is arranged on the chip hard board part, and the filter element is installed on the filter bracket; the filter element includes a filter and a silk screen portion arranged around the filter; the silk screen portion includes a silk screen body and at least one protrusion, the silk screen body includes a long side and a short side, wherein the length of the long side is greater than the length of the short side, and the long side of the silk screen body corresponds to the distribution shape of the light spot received by the circuit board assembly.

[0025] In one embodiment of the circuit board assembly according to the present application, the protrusion protrudes inward from a middle region of the long side of the screen-printed body in the length direction thereof.

[0026] In one embodiment of the circuit board assembly according to the present application, the circuit board assembly further comprises dust-catching glue disposed on the silk-screen portion, and the dust-catching glue is made of a light-absorbing material.

[0027] According to another aspect of the present application, a camera module is also provided, which includes: the circuit board assembly as described above.

[0028] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0029] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0031] Figure 1 A schematic perspective view of a circuit board assembly according to an embodiment of the present application is illustrated.

[0032] Figure 2 A partial perspective view schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0033] Figure 3Another partial perspective view schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0034] Figure 4 A partial cross-sectional schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0035] Figure 5 A partial cross-sectional schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0036] Figure 6 Another partial cross-sectional schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0037] Figure 7 Another partially enlarged schematic diagram of a circuit board assembly according to an embodiment of the present application is illustrated.

[0038] Figure 8 The figure shows a schematic diagram of a light spot distribution diagram corresponding to a circuit board assembly according to an embodiment of the present application.

[0039] Fig. 9 The figure shows a schematic three-dimensional diagram of a camera module according to an embodiment of the present application.

[0040] In the figure: 100, camera module; 1, circuit board assembly; 2, optical lens; 10, circuit board; 110, circuit board hard board part; 11, chip hard board part; 1110, chip mounting cavity; 1120, peripheral area; 101, chip hard board connection side; 111, chip hard board front; 112, chip hard board back; 12, connection hard board part; 102, connection hard board connection side; 121, connection hard board front; 122, connection hard board back; 13, flexible connection belt; 131, flexible belt front; 132, flexible belt back; 14, first reinforcement plate; 15, second reinforcement plate; 16, reinforcement part; 20, electromagnetic shielding layer; 21, front electromagnetic shielding layer; 201, front shielding layer side; 202, front shielding layer two sides; 22, back electromagnetic shielding layer; 203, back shielding layer side; 204, back screen Two sides of the shielding layer; 301, the first interconnection; 302, the second interconnection; 303, the front air gap; 304, the back air gap; 210, the connection corresponding part; 211, the first connection corresponding part; 212, the second connection corresponding part; 30, the covering part; 31, the first covering part; 32, the second covering part; 40, the photosensitive chip; 50, the electronic component; 60, the filter element; 61, the filter; 62, the silk screen part; 621, the silk screen body; 622, the protrusion; 6221, the first protrusion; 6222, the second protrusion; 601, the slot; 6211, the first side; 6212, the second side; 6213, the third side; 6214, the fourth side; 70, the filter bracket; 80, the dust-catching glue; O, the center of the light spot distribution; d1, the width of the protrusion 622; d2, the width of the slot 601. DETAILED DESCRIPTION

[0041] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described here.

[0042] The electromagnetic shielding layer not only achieves electromagnetic shielding, but also brings troubles to the manufacturing of the camera module. For example, during the ultrasonic cleaning process, due to the influence of ultrasonic vibration, the electromagnetic shielding layer is prone to bulging, and further damage and failure during the cleaning process. Therefore, a new circuit board assembly design is needed.

[0043] Specifically, in practical applications, the camera module mainly uses a circuit board of the flexible and rigid board (FPCB, the full name in English is: Flexible Printed Circuit Board) type. The flexible and rigid board mainly includes a chip hard board part, a connecting hard board part and a flexible connecting belt, and the flexible connecting belt is connected between the chip hard board part and the connecting hard board part. The electromagnetic shielding layer covers between the surface of the flexible connecting belt and the surface of the chip hard board part and / or between the surface of the flexible connecting belt and the surface of the connecting hard board part.

[0044] However, there is usually a height difference between the flexible connection belt and the chip hard board part, and the surface is not flush; therefore, in some cases, the electromagnetic shielding layer is tilted at the connection between the flexible connection belt and the chip hard board part, and the electromagnetic shielding layer is not completely attached to the flexible connection belt and the chip hard board part at the connection, so that there is an air gap between the electromagnetic shielding layer and the flexible connection belt and the chip hard board part at the connection, resulting in bulging or damage to the electromagnetic shielding layer. Moreover, the length and height fluctuations of the adhesive between the flexible connection belt and the chip hard board part are also likely to cause the electromagnetic shielding layer to be not completely attached to the flexible connection belt and the chip hard board part at the connection, so that there is an air gap between the electromagnetic shielding layer and the flexible connection belt and the chip hard board part at the connection, resulting in bulging or damage to the electromagnetic shielding layer.

[0045] There is also usually a height difference between the flexible connection belt and the connecting hard board part, and the surface is not flush; therefore, in some cases, the electromagnetic shielding layer is tilted at the place where the flexible connection belt and the connecting hard board part are connected to each other, and the electromagnetic shielding layer is not completely in contact with the flexible connection belt and the connecting hard board part at the place where they are connected to each other, so that there is an air gap between the electromagnetic shielding layer and the flexible connection belt and the connecting hard board part at the place where they are connected to each other, resulting in bulging or damage to the electromagnetic shielding layer. Moreover, the length and height fluctuations of the adhesive between the flexible connection belt and the connecting hard board part are also likely to cause the electromagnetic shielding layer to be not completely in contact with the flexible connection belt and the connecting hard board part at the place where they are connected to each other, so that there is an air gap between the electromagnetic shielding layer and the flexible connection belt and the connecting hard board part at the place where they are connected to each other, resulting in bulging or damage to the electromagnetic shielding layer.

[0046] Based on the above-mentioned problems discovered in the present application, the present application proposes to add a covering portion on the outer surface of the electromagnetic shielding layer to reduce the risk of bulging or damage of the electromagnetic shielding layer at the connection between the flexible connecting belt and the connecting hard board part and / or at the connection between the flexible connecting belt and the chip hard board part.

[0047] Based on this, the present application proposes a circuit board assembly, which includes: a circuit board hard board part, a flexible connecting belt, at least one electromagnetic shielding layer and at least one covering part. The circuit board hard board part includes a chip hard board part and a connecting hard board part; the flexible connecting belt is connected to the circuit board hard board part and is located between the chip hard board part and the connecting hard board part; at least one electromagnetic shielding layer extends between the surface of the circuit board hard board part and the surface of the flexible connecting belt; the electromagnetic shielding layer has at least one connecting corresponding part, and the connecting corresponding part corresponds to the mutual connection between the flexible connecting belt and the circuit board hard board part; at least one covering part is arranged on the outer surface of at least one connecting corresponding part.

[0048] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0049] like Figures 1 to 8 As shown, the circuit board assembly 1 according to the embodiment of the present application is illustrated. The circuit board assembly 1 can avoid the electromagnetic shielding layer 20 from bulging or breaking and failing to a certain extent by optimizing its structure. Specifically, as Figure 1 As shown, the circuit board assembly 1 includes a circuit board 10, at least one electromagnetic shielding layer 20 and at least one covering portion 30. The circuit board 10 includes a circuit board hard board portion 110 and a flexible connecting tape 13. The circuit board hard board portion 110 includes a chip hard board portion 11 and a connecting hard board portion 12. The flexible connecting tape 13 is connected to the circuit board hard board portion 110 and is located between the chip hard board portion 11 and the connecting hard board portion 12. At least one electromagnetic shielding layer 20 extends between the surface of the circuit board hard board portion 110 and the surface of the flexible connecting tape 13. The electromagnetic shielding layer 20 has at least one connecting corresponding portion 210, and the connecting corresponding portion 210 corresponds to the mutual connection between the flexible connecting tape 13 and the circuit board hard board portion 110. The covering portion 30 is arranged on the outer surface of at least one connecting corresponding portion 210. The covering portion 30 can prevent the electromagnetic shielding layer 20 from bulging or breaking and failure to a certain extent.

[0050] More specifically, the chip hard board part 11 is used to mount and electrically connect the photosensitive chip 40 and the electronic components 50 such as capacitors, resistors, and driver chips. The chip hard board part 11 has a chip mounting cavity 1110 and a peripheral area 1120 surrounding the chip mounting cavity 1110.

[0051] Correspondingly, the circuit board assembly 1 further includes a photosensitive chip 40 and at least one electronic component 50. The photosensitive chip 40 and the electronic component 50 are mounted on the chip hard board part 11. More specifically, the photosensitive chip 40 is mounted on the chip mounting cavity 1110 of the chip hard board part 11; the electronic component 50 is mounted on the pad of the peripheral area 1120 of the chip hard board part 11. It can be connected to the pad of the peripheral area 1120 of the chip hard board part 11 through a lead.

[0052] In the present application, the side of the circuit board assembly 1 facing the optical lens 2 when it is used in the camera module 100 is defined as the front side, and the side of the circuit board assembly 1 facing away from the optical lens 2 when it is used in the camera module 100 is defined as the back side. The front side of each component of the circuit board assembly 1 is consistent with the defined front side of the circuit board assembly 1. The back side of each component of the circuit board assembly 1 is consistent with the defined back side of the circuit board assembly 1.

[0053] Accordingly, the chip hard board portion 11 has a relative chip hard board front side 111 and a chip hard board back side 112. The chip hard board front side 111 faces the optical lens 2 when the circuit board assembly 1 is in the camera module 100, and the chip hard board back side 112 faces away from the optical lens 2 in the camera module 100 to which the circuit board assembly 1 is applied.

[0054] A reinforcing plate may be fixed to the back side 112 of the chip hard board of the chip hard board part 11, and the overall strength and structural stability of the chip hard board part 11 may be improved by the reinforcing plate. The reinforcing plate fixed to the back side 112 of the chip hard board of the chip hard board part 11 is defined as a first reinforcing plate 14. The first reinforcing plate 14 may be implemented as a metal sheet, for example, a metal sheet made of stainless steel, which may improve the heat dissipation performance of the chip hard board part 11. Specifically, the first reinforcing plate 14 may be fixed to the back side 112 of the chip hard board of the chip hard board part 11 by means of a conductive glue (for example, a conductive silver glue), and at this time, the first reinforcing plate 14 and the ground electrode of the back side 112 of the chip hard board of the chip hard board part 11 are electrically connected by means of the conductive glue.

[0055] The connection hard board portion 12 is used to install and electrically connect a connector, so that the circuit board assembly 1 can be electrically connected to a mobile electronic device through the connector provided on the connection hard board portion 12 .

[0056] The connecting hard board portion 12 has a connecting hard board front side 121 and a connecting hard board back side 122. The connecting hard board front side 121 faces the optical lens 2 when the circuit board assembly 1 is in the camera module 100, and the connecting hard board back side 122 faces away from the optical lens 2 in the camera module 100 to which the circuit board assembly 1 is applied.

[0057] A reinforcing plate may be fixed to the connecting hard board front side 121 of the connecting hard board portion 12, and the reinforcing plate may be used to improve the overall strength and structural stability of the connecting hard board portion 12. The reinforcing plate fixed to the connecting hard board front side 121 of the connecting hard board portion 12 is defined as a second reinforcing plate 15. The second reinforcing plate 15 may be implemented as a metal sheet, for example, a metal sheet made of stainless steel, which may improve the heat dissipation performance of the connecting hard board portion 12. Specifically, the second reinforcing plate 15 may be fixed to the connecting hard board front side 121 of the connecting hard board portion 12 by means of a conductive adhesive (for example, a conductive silver adhesive), and at this time, the second reinforcing plate 15 and the ground electrode of the chip hard board front side 111 of the connecting hard board portion 12 are electrically connected by means of the conductive adhesive.

[0058] The flexible connecting strip 13 is connected between the chip hard board part 11 and the connecting hard board part 12. The flexible connecting strip 13 has a flexible strip front side 131 and a flexible strip back side 132 opposite to each other. The flexible strip front side 131 faces the optical lens 2 when the circuit board assembly 1 is in the camera module 100, and the flexible strip back side 132 faces away from the optical lens 2 in the camera module 100 to which the circuit board assembly 1 is applied.

[0059] A front electromagnetic shielding layer 21 may be provided on the front side 131 of the flexible connecting tape 13, and a back electromagnetic shielding layer 22 may be provided on the back side 132 of the flexible connecting tape 13. Theoretically, the front electromagnetic shielding layer 21 provided on the front side 131 of the flexible tape may be selected to extend between the front side 131 of the flexible connecting tape 13 and the chip hard board front side 111 of the chip hard board portion 11, or may be selected to extend between the front side 131 of the flexible connecting tape 13 and the chip hard board front side 111 of the connecting hard board portion 12. However, considering that the electronic components 50 such as capacitors, resistors, and driver chips are usually provided on the chip hard board front side 111 of the chip hard board portion 11, a plurality of pads may be provided on the chip hard board front side 111, and the pads may be provided on the side of the chip hard board front side 111 close to the flexible connecting tape 13. Therefore, preferably, the present application will extend the front electromagnetic shielding layer 21 arranged on the front side 131 of the flexible belt between the flexible belt front side 131 of the flexible connecting belt 13 and the connecting hard board front side 121 of the connecting hard board part 12 to prevent the front electromagnetic shielding layer 21 from being incorrectly connected to the solder pads on the chip hard board front side 111, thereby reducing the impact on the layout and function of the electronic components 50 preset on the front side of the chip hard board part 11.

[0060] The front electromagnetic shielding layer 21 may be silver foil, copper foil, or other electromagnetic shielding materials.

[0061] Further, it should be understood that the larger the area of ​​the flexible connecting band 13 covered by the electromagnetic shielding layer 20 is, the stronger the electromagnetic shielding effect is. However, considering that there will be an attachment tolerance in the attachment of the front electromagnetic shielding layer 21, a certain space is reserved on the side of the front electromagnetic shielding layer 21 close to the chip hard board part 11.

[0062] Correspondingly, the side where the chip hard board part 11 is connected to the flexible connecting tape 13 is defined as the chip hard board connection side 101; the front electromagnetic shielding layer 21 has a front shielding layer side 201 and a front shielding layer side 202; the front shielding layer side 201 is located at the flexible tape front side 131 on the flexible connecting tape 13, and the front shielding layer side 202 is located at the connecting hard board front side 121 of the connecting hard board part 12; the front shielding layer side 201 is spaced from the chip hard board connection side 101, and the distance between the front shielding layer side 201 and the chip hard board connection side 101 is 0.1mm-1mm, for example, 0.5mm.

[0063] The front electromagnetic shielding layer 21 extends to one side of the connecting hard board part 12, that is, the size of the part of the two sides 202 of the front shielding layer extending on the connecting hard board part 12 is usually about 1 mm, which can cover the grounding electrode (such as the grounding hole) of the connecting hard board part 12.

[0064] Furthermore, considering that the flexible connecting belt 13 will be bent, the part of the front electromagnetic shielding layer 21 arranged on the flexible connecting belt 13 and facing the chip hard board part 11 will break during the bending process of the flexible connecting belt 13, thereby causing partial failure. In this application, the side of the front electromagnetic shielding layer 21 facing the chip hard board part 11, that is, the side 201 of the front shielding layer is set to be wavy, shaped like a sine curve, such as Figure 2 As shown, the front electromagnetic shielding layer 21 is prevented from breaking when the flexible connecting belt 13 is bent. In other words, the structural configuration of the side of the front electromagnetic shielding layer 21 adjacent to the chip hard board part 11 can reduce the risk of the electromagnetic shielding layer 20 breaking and failing when the flexible connecting belt 13 is bent.

[0065] It is worth mentioning that the larger the spacing between the wave crests, the sparser the waves, and the lower the risk of fracture failure on this side. Preferably, the spacing between the wave crests is between 1mm and 3mm. Accordingly, the spacing between each two adjacent wave crests on one side 201 of the front shielding layer is 1mm to 3mm.

[0066] The front surface 131 of the flexible connecting belt 13 is not flush with the front surface 121 of the connecting hard plate. For example, in one example of the present application, the height of the front surface 131 of the flexible connecting belt is lower than the height of the front surface 121 of the connecting hard plate. Figure 4As shown, the front electromagnetic shielding layer 21 is in an inclined state at the interconnection point between the flexible connecting belt 13 and the connecting hard plate part 12 (the interconnection point is defined as the first interconnection point 301), and the front electromagnetic shielding layer 21 is not completely in contact with the flexible connecting belt 13 and the connecting hard plate part 12 at the interconnection point, so that there is an air gap between the front electromagnetic shielding layer 21 and the flexible connecting belt 13 and the connecting hard plate part 12 at the first interconnection point 301 (the air gap at this point is defined as the front air gap 303), which may cause bulging or damage to the front electromagnetic shielding layer 21. Moreover, the fluctuations in the length and height of the adhesive between the flexible connecting tape 13 and the connecting hard plate part 12 may easily cause the front electromagnetic shielding layer 21 to be incompletely attached to the flexible connecting tape 13 and the connecting hard plate part 12 at the first interconnection 301, so that there is a front air gap 303 between the electromagnetic shielding layer 20 and the flexible connecting tape 13 and the connecting hard plate part 12 at the interconnection point, causing the electromagnetic shielding layer 20 to bulge or be damaged.

[0067] In order to solve the problem that the front electromagnetic shielding layer 21 is prone to bulging or damage at the connection between the flexible connecting belt 13 and the connecting hard plate part 12, the present application proposes to add a covering part 30 on the outer surface of the front electromagnetic shielding layer 21.

[0068] Accordingly, in this application, if Figures 2 to 5 As shown, the front electromagnetic shielding layer 21 has a first connection corresponding part 211, and the first connection corresponding part 211 corresponds to the connection between the hard board part 12 and the flexible connection belt 13; the covering part 30 is a first covering part 31, and the first covering part 31 is arranged on the front of the first connection corresponding part 211, a part of which corresponds to the flexible connection belt 13, and the other part corresponds to the hard board part 12. The first covering part 31 can be implemented as glue, wherein the glue can be UV glue, so that it can be directly cured by UV light (ultraviolet light) without baking, thereby simplifying the process. Specifically, viewed in a direction perpendicular to the front of the circuit board 10, the first covering part 31 overlaps with the hard board part 12 and the flexible connection belt 13.

[0069] It is worth mentioning that the first covering portion 31 is only connected to the front electromagnetic shielding layer 21 and is arranged above the front electromagnetic shielding layer 21. In other words, the first covering portion 31 is not connected to other components (i.e., components other than the front electromagnetic shielding layer 21), such as a motor and a circuit board 10, so as to avoid the connection between other components and the first covering portion 31 forming a new factor that causes damage to the front electromagnetic shielding layer 21. Specifically, when the first covering portion 31 is connected to other components, the deformation of other components may affect the deformation of the first covering portion 31, causing damage to the front electromagnetic shielding layer 21. For example, when the first covering portion 31 is arranged on the connecting hard board portion 12, the deformation of the connecting hard board portion 12 may affect the deformation of the first covering portion 31, thereby causing damage to the front electromagnetic shielding layer 21.

[0070] Theoretically, the back electromagnetic shielding layer 22 disposed on the back side 132 of the flexible tape may be selected to extend between the back side 132 of the flexible connecting tape 13 and the back side 112 of the chip hard board portion 11, or may be selected to extend between the back side 132 of the flexible connecting tape 13 and the back side 112 of the chip hard board portion 12. However, since the front electromagnetic shielding layer 21 disposed on the front side 131 of the flexible tape extends between the front side 131 of the flexible connecting tape 13 and the front side 121 of the connecting hard board portion 12, in order to provide a good electromagnetic shielding effect, the back electromagnetic shielding layer 22 disposed on the back side 132 of the flexible tape is further extended between the back side 132 of the flexible connecting tape 13 and the back side 112 of the chip hard board portion 11.

[0071] The back electromagnetic shielding layer 22 may be silver foil, copper foil, or other electromagnetic shielding materials.

[0072] Further, it should be understood that the larger the area of ​​the flexible connecting band 13 covered by the electromagnetic shielding layer 20 is, the stronger the electromagnetic shielding effect is. However, considering that there will be an attachment tolerance in the attachment of the back electromagnetic shielding layer 22, a certain space is reserved on the side of the back electromagnetic shielding layer 22 close to the connecting hard plate part 12.

[0073] Correspondingly, the side where the connecting hard board part 12 is connected to the flexible connecting belt 13 is defined as the connecting hard board connecting side 102; the back electromagnetic shielding layer 22 has a back shielding layer side 203 and a back shielding layer side 204; the back shielding layer side 203 is located at the back side 132 of the flexible belt on the flexible connecting belt 13, and the back shielding layer side 204 is located at the back side 112 of the chip hard board of the chip hard board part 11; the back shielding layer side 203 is spaced apart from the connecting hard board connecting side 102, and the distance between the back shielding layer side 203 and the connecting hard board connecting side 102 is 0.1mm-1mm, for example, 0.5mm.

[0074] The back electromagnetic shielding layer 22 extends to one side of the chip hard board part 11, that is, the size of the part of the two sides 204 of the back shielding layer extending on the chip hard board part 11 is usually about 1 mm, which can cover the grounding electrode (such as the grounding hole) of the chip hard board part 11.

[0075] Furthermore, considering that the flexible connecting belt 13 will be bent, the part of the back electromagnetic shielding layer 22 disposed on the flexible connecting belt 13 and facing the connecting hard plate part 12 breaks during the bending process of the flexible connecting belt 13, thereby causing partial failure. In this application, the side of the back electromagnetic shielding layer 22 facing the connecting hard plate part 12, that is, the side 203 of the back shielding layer is configured to be wavy, shaped like a sine curve, to avoid the back electromagnetic shielding layer 22 from breaking when the flexible connecting belt 13 is bent. In other words, the structural configuration of the side of the back electromagnetic shielding layer 22 adjacent to the connecting hard plate part 12 can reduce the risk of the electromagnetic shielding layer 20 breaking and failing when the flexible connecting belt 13 is bent.

[0076] It is worth mentioning that the larger the spacing between the wave crests, the sparser the waves, and the lower the risk of fracture failure on this side. Preferably, the spacing between the wave crests is between 1mm and 3mm. Correspondingly, the spacing between each two adjacent wave crests on one side 203 of the back shielding layer is 1mm to 3mm.

[0077] The flexible tape back side 132 of the flexible connecting tape 13 is not flush with the chip hard board back side 112. For example, in one example of the present application, the height of the flexible tape back side 132 is higher than the height of the chip hard board back side 112. Therefore, the back electromagnetic shielding layer 22 is tilted at the interconnection point between the flexible connecting tape 13 and the chip hard board part 11 (the interconnection point is defined as the second interconnection point 302), and the back electromagnetic shielding layer 22 is not completely attached to the flexible connecting tape 13 and the chip hard board part 11 at the second interconnection point 302, so that there is an air gap between the back electromagnetic shielding layer 22 and the flexible connecting tape 13 and the chip hard board part 11 at the second interconnection point 302 (the air gap at this point is defined as the back air gap 304), resulting in bulging or damage to the back electromagnetic shielding layer 22. Moreover, the fluctuations in the length and height of the adhesive between the flexible connecting tape 13 and the chip hard board part 11 may easily cause the back electromagnetic shielding layer 22 to be incompletely attached to the flexible connecting tape 13 and the chip hard board part 11 at the second interconnection 302, so that there is a back air gap 304 between the electromagnetic shielding layer 20 and the flexible connecting tape 13 and the chip hard board part 11 at the second interconnection 302, causing the electromagnetic shielding layer 20 to bulge or be damaged.

[0078] In order to solve the problem that the back electromagnetic shielding layer 22 is prone to bulging or damage at the connection between the flexible connecting belt 13 and the chip hard board part 11, the present application proposes to add a covering portion 30 on the outer surface of the back electromagnetic shielding layer 22.

[0079] Accordingly, in this application, if Figures 2 to 6 As shown, the back electromagnetic shielding layer 22 has a second connection corresponding portion 212, and the second connection corresponding portion 212 corresponds to the connection between the chip hard board portion 11 and the flexible connection belt 13; the covering portion 30 is a second covering portion 32, and the second covering portion 32 is arranged on the back of the second connection corresponding portion 212, a part of which corresponds to the flexible connection belt 13, and the other part corresponds to the chip hard board portion 11. The second covering portion 32 can be implemented as glue. Specifically, when viewed in a direction perpendicular to the back of the circuit board 10, the second covering portion 32 overlaps with the chip hard board portion 11 and the flexible connection belt 13.

[0080] It is worth mentioning that the second covering portion 32 is only connected to the back electromagnetic shielding layer 22 and is arranged below the back electromagnetic shielding layer 22. In other words, the second covering portion 32 is not connected to other components (i.e., components other than the back electromagnetic shielding layer 22), such as a motor and a circuit board 10, so as to avoid the connection between other components and the second covering portion 32 forming a new factor that causes damage to the back electromagnetic shielding layer 22. Specifically, when the second covering portion 32 is connected to other components, the deformation of other components may affect the deformation of the second covering portion 32, causing damage to the back electromagnetic shielding layer 22. For example, when the second covering portion 32 is arranged on the connecting hard board portion 12, the deformation of the connecting hard board portion 12 may affect the deformation of the second covering portion 32, thereby causing damage to the back electromagnetic shielding layer 22.

[0081] It is also worth mentioning that, optionally, the covering portion 30 has elasticity, and the elasticity of the covering portion 30 is greater than the elasticity of the electromagnetic shielding layer 20. Accordingly, in an example of the present application, the first covering portion 31 has elasticity, and the elasticity of the first covering portion 31 is greater than the elasticity of the front electromagnetic shielding layer 21; the second covering portion 32 has elasticity, and the elasticity of the second covering portion 32 is greater than the elasticity of the back electromagnetic shielding layer 22.

[0082] Further optionally, the electromagnetic shielding layer 20 is not elastic. Accordingly, in an example of the present application, the front electromagnetic shielding layer 21 is not elastic; the back electromagnetic shielding layer 22 is not elastic. Further, in this example, the first covering portion 31 is elastic, and the second covering portion 32 is elastic.

[0083] In the embodiment of the present application, the circuit board assembly 1 further includes a reinforcement portion 16, which is disposed on the front side of the connection between the flexible connection belt 13 and the chip hard board portion 11, and is used to protect the flexible connection belt 13 and prevent the flexible connection belt 13 from bending. The reinforcement portion 16 can be implemented as glue, wherein the glue can be UV glue, so that it can be directly cured by UV light (ultraviolet light) without baking, thereby simplifying the process.

[0084] It is worth mentioning that, although both the covering portion 30 and the reinforcing portion 16 can be implemented as glue, the covering portion 30 and the reinforcing portion 16 are completely different. Specifically, in the present application, the covering portion 30 is used to protect the electromagnetic shielding layer 20, to prevent the electromagnetic shielding layer 20 from bulging or being damaged at the first connection corresponding portion 211 or the second connection corresponding portion 212, resulting in electromagnetic shielding failure; the reinforcing portion 16 is used to protect the flexible connecting belt 13, to prevent the flexible connecting belt 13 from being damaged when being bent.

[0085] Accordingly, preferably, the covering portion 30 and the reinforcing portion 16 are made of different materials. Specifically, the material to prevent the electromagnetic shielding layer 20 from bulging or breaking should have a relatively large elastic modulus. Accordingly, the elastic modulus of the covering portion 30 is greater than the elastic modulus of the reinforcing portion 16.

[0086] In the embodiment of the present application, the circuit board assembly 1 further includes a filter bracket 70 and a filter element 60. The filter bracket 70 is fixedly arranged on the chip hard board part 11; the filter element 60 is installed on the filter bracket 70, and then fixed to the chip hard board part 11 through the filter bracket 70. The electronic component 50 is arranged around the filter bracket 70.

[0087] In the present application, a silk screen is provided around the filter element 60 for reducing stray light.

[0088] Correspondingly, the filter element 60 includes a filter 61 and a silk-screen portion 62 disposed around the filter 61 .

[0089] The silk screen portion 62 is a structure formed on the surface of the filter 61 by a precision printing process. The silk screen portion 62 can be made of a light-absorbing material. Accordingly, the silk screen portion 62 is black, which can effectively reduce the reflection problem caused by the gold wire around the photosensitive chip 40 or other factors during the imaging process, and can block unnecessary stray light.

[0090] It is worth mentioning that the structural configuration of the silk-screen portion 62 of the circuit board assembly 1 can match the light spot distribution, thereby enhancing the anti-stray light performance while avoiding blocking the light spot.

[0091] Specifically, by observing the distribution of the light spots received by the circuit board assembly 1, it is found that the light spots on the outside are distributed along an arc. When the inner surface of the side of the silk-screen portion 62 is a plane, it is inconsistent with the distribution of the light spots. If the inner diameter of the silk-screen portion 62 is larger than the maximum outer diameter of the light spot distribution range, the ability to block stray light will be reduced. If the inner diameter of the silk-screen portion 62 is reduced as a whole, the light spots may be blocked.

[0092] The present application proposes that if the consistency between the inner surface of the silk-screen portion 62 and the distribution form of the light spot is improved, the inner diameter of the silk-screen portion 62 can be reduced to enhance the anti-stray light performance while avoiding blocking the light spot. For example, the overall distribution of the light spot is that the light spot located in the middle of at least one side of the light spot is concave toward the light spot distribution center O, that is, closer to the light spot distribution center O. Accordingly, the radial size of the middle position of at least one side of the silk-screen portion 62 of the present application can be relatively reduced.

[0093] Correspondingly, in the embodiment of the present application, the silk-screen portion 62 includes a silk-screen body 621 and at least one protrusion 622; the silk-screen body 621 includes a plurality of side edges, and at least one protrusion 622 protrudes inward relative to the inner surface of the long side edge of the silk-screen body 621, so that the radial dimension of the side edge of the silk-screen portion 62 at which the protrusion 622 is arranged is relatively small.

[0094] In one embodiment of the present application, the silk-screen body 621 includes a first side 6211, a second side 6212, a third side 6213, and a fourth side 6214, wherein the first side 6211 is opposite to the third side 6213, and the second side 6212 is opposite to the fourth side 6214. The length of the first side 6211 is greater than the length of the second side 6212 and the length of the fourth side 6214, and the length of the third side 6213 is greater than the length of the second side 6212 and the length of the fourth side 6214. Accordingly, the silk-screen body 621 includes a long side and a short side, wherein the length of the long side is greater than the length of the short side, the first side 6211 and the third side 6213 are the long sides of the silk-screen body 621, and the second side 6212 and the fourth side 6214 are the short sides of the silk-screen body 621.

[0095] In this embodiment, the long side of the silk-screen body 621 corresponds to the distribution form of the light spot received by the circuit board assembly 1. Specifically, in this embodiment, the protrusion 622 is respectively provided on the first side 6211 and the third side 6213. Correspondingly, the silk-screen part 62 includes two protrusions 622. The two protrusions 622 are respectively a first protrusion 6221 and a second protrusion 6222. The first protrusion 6221 protrudes inwardly relative to the inner surface of the first side 6211. The second protrusion 6222 protrudes inwardly relative to the inner surface of the third side 6213 to match the distribution form of the light spot.

[0096] Further, the protrusion 622 protrudes inward from the middle area of ​​the long side of the screen printing body 621 in the length direction. Correspondingly, the first protrusion 6221 protrudes inward from the middle area of ​​the first side 6211 of the screen printing body 621 in the length direction. The second protrusion 6222 protrudes inward from the middle area of ​​the third side 6213 of the screen printing body 621 in the length direction.

[0097] In the embodiment of the present application, at least one side is provided with a groove 601, and the groove 601 is recessed outward relative to the inner surface of the side to avoid the problem of dark corners in the imaging of the camera module 100. In an example of the present application, the groove 601 is provided between each two adjacent side edges.

[0098] Further, in an example of the present application, a width d1 of the protrusion 622 is smaller than a width d2 of the groove 601 .

[0099] In the embodiment of the present application, the circuit board assembly 1 further includes a dust-catching glue 80 disposed on the silk-screen portion 62. It should be understood that the dust-catching glue 80 disposed on the silk-screen portion 62 can capture dust from the filter element 60 to the greatest extent, thereby reducing dust to the greatest extent, and will not affect the normal passage of light. In the embodiment of the present application, the dust-catching glue 80 is disposed on the four sides of the silk-screen portion 62, respectively.

[0100] Preferably, the dust-catching glue 80 is made of a light-absorbing material to reduce the stray light problem that may be generated by the dust-catching glue 80. Accordingly, the dust-catching glue 80 is preferably dark in color, such as black.

[0101] According to the above circuit board assembly 1 of the present application, the present application proposes a camera module 100, and the camera module 100 includes the above circuit board assembly 1. It should be understood that the camera module 100 also includes other components, such as an optical lens 2, a motor, etc.

[0102] In summary, the circuit board assembly 1 and the camera module 100 according to the embodiment of the present application are explained. The circuit board assembly 1 can avoid the electromagnetic shielding layer 20 from bulging or breaking and failing to a certain extent by optimizing its structure.

[0103] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A circuit board assembly, characterized in that: include: The circuit board hard board part includes: chip hard board part and connection hard board part; A flexible connecting strip connected to the chip hard board portion and the connecting hard board portion; At least one electromagnetic shielding layer extends between the surface of the hard board part of the circuit board and the surface of the flexible connecting belt; the electromagnetic shielding layer has at least one connection corresponding part, and the connection corresponding part corresponds to the mutual connection between the flexible connecting belt and the hard board part of the circuit board; At least one covering portion, disposed on the outer surface of at least one of the connection corresponding portions; The connecting hard board part has a relative front side of the connecting hard board and a relative back side of the connecting hard board; the flexible connecting belt has a relative front side of the flexible belt and a relative back side of the flexible belt; the electromagnetic shielding layer is a front electromagnetic shielding layer, and the front electromagnetic shielding layer extends between the front side of the flexible belt and the front side of the connecting hard board; the front electromagnetic shielding layer has a first connecting corresponding part, and the first connecting corresponding part corresponds to the place where the connecting hard board part and the flexible connecting belt are connected to each other; the covering part is a first covering part, and the first covering part is arranged on the front side of the first connecting corresponding part, a part of which corresponds to the flexible connecting belt, and the other part corresponds to the connecting hard board part.

2. The circuit board assembly according to claim 1, wherein: The chip hard board part has a relative chip hard board front side and a chip hard board back side; the flexible connecting belt has a relative flexible belt front side and a flexible belt back side; the electromagnetic shielding layer is a back electromagnetic shielding layer, and the back electromagnetic shielding layer extends between the back side of the flexible connecting belt and the back side of the chip hard board; the back electromagnetic shielding layer has a second connection corresponding part, and the second connection corresponding part corresponds to the connection between the chip hard board part and the flexible connecting belt; the covering part is a second covering part, and the second covering part is arranged on the back side of the second connection corresponding part, a part of which corresponds to the flexible connecting belt, and the other part corresponds to the chip hard board part.

3. The circuit board assembly according to claim 1, wherein: The first covering portion is glue, and the first covering portion is only connected to the front electromagnetic shielding layer.

4. The circuit board assembly according to claim 1, wherein: The side where the chip hard board part is connected to the flexible connecting belt is defined as the chip hard board connection side; the front electromagnetic shielding layer has a front shielding layer side, the front shielding layer side is located on the flexible connecting belt, the front shielding layer side is spaced from the chip hard board connection side, and the distance between the front shielding layer side and the chip hard board connection side is 0.1mm-1mm.

5. The circuit board assembly according to claim 1, wherein: The front electromagnetic shielding layer has a front shielding layer side, the front shielding layer side is located on the flexible connecting belt, and the front shielding layer side is wavy.

6. The circuit board assembly according to claim 1, wherein: The distance between each two adjacent wave crests on one side of the front shielding layer is 1mm-3mm.

7. The circuit board assembly according to claim 2, wherein: The second covering portion is glue, and the second covering portion is only connected to the back electromagnetic shielding layer.

8. The circuit board assembly according to claim 2, wherein: The side where the connecting hard board part is connected to the flexible connecting belt is defined as the connecting hard board connection side; the back electromagnetic shielding layer has a back shielding layer side, the back shielding layer side is located on the flexible connecting belt, the back shielding layer side is spaced apart from the connecting hard board connection side, and the distance between the back shielding layer side and the connecting hard board connection side is 0.1mm-1mm.

9. The circuit board assembly according to claim 1, wherein: The circuit board assembly further comprises a reinforcement portion, which is arranged on the front side where the flexible connection belt is connected to the chip hard board portion.

10. The circuit board assembly according to claim 1, wherein: The circuit board assembly also includes a filter bracket and a filter element; the filter bracket is arranged on the hard board part of the chip, and the filter element is installed on the filter bracket; the filter element includes a filter and a silk-screen part arranged around the filter; the silk-screen part includes a silk-screen body and at least one protrusion, the silk-screen body includes a long side and a short side, wherein the length of the long side is greater than the length of the short side, and the long side of the silk-screen body corresponds to the distribution shape of the light spot received by the circuit board assembly.

11. The circuit board assembly according to claim 10, wherein: The protrusion protrudes inward from a middle area of ​​the long side of the screen printing body in the length direction thereof.

12. The circuit board assembly according to claim 11, wherein: The circuit board assembly further comprises dust-catching glue arranged on the silk-screen portion, and the dust-catching glue is made of light-absorbing material.

13. A camera module, characterized in that: Comprising a circuit board assembly as claimed in any one of claims 1 to 12.

Images