A method for preparing an integrated lightweight photovoltaic module and its packaging material

Abstract

The invention discloses an integrated lightweight photovoltaic module and a preparation method of a packaging material thereof, belonging to the technical field of photovoltaics. The packaging material comprises the following raw materials in parts by weight: 50-100 parts of alicyclic epoxy resin, 0-20 parts of liquid bisphenol epoxy resin, 0-20 parts of UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate, 5-15 parts of toughening resin, 5-15 parts of 3,4-epoxycyclohexyl methacrylate, 0.1-2 parts of α-hydroxy ketone, 0.1-5 parts of cationic photoinitiator and 0.1-5 parts of auxiliary agent; the preparation method of UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate is as follows: S1. 10-20 parts of hexamethylene diisocyanate are mixed with 20-60 parts of polycarbonate polyol, 1-5 parts of dibutyltin dilaurate and 2-5 parts of 1,4-butanediol, and stirred at 60-120°C for 3-5h. It solves the problems of slow curing speed, poor weather resistance and excessive weight of existing photovoltaic module packaging materials. It has the advantages of lightweight and simple process.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular to a method for preparing an integrated lightweight photovoltaic component and a packaging material thereof. Background Art

[0002] With the growth of global energy demand and the improvement of environmental protection awareness, solar photovoltaic technology has developed rapidly. As a key component for converting solar energy into electrical energy, the performance and reliability of photovoltaic modules directly affect the efficiency and life of solar power generation systems. Traditional photovoltaic module packaging materials are mostly encapsulated with EVA (ethylene-vinyl acetate copolymer) film. Although this material has been widely used in the photovoltaic industry, it also has some shortcomings, mainly including: (1) Weight problem: The high density of EVA film leads to a large overall weight of the photovoltaic module, which not only increases the cost of installation and transportation, but also limits its application in certain occasions, such as portable photovoltaic modules. (2) Weather resistance problem: EVA film is prone to aging when exposed to outdoor environment for a long time, resulting in a decrease in light transmittance, thereby affecting the photoelectric conversion efficiency of photovoltaic modules. (3) Environmental protection problem: EVA film will cause certain environmental pollution during the production process, and its waste disposal is also an issue that needs to be solved urgently.

[0003] In order to solve the above problems, researchers have begun to explore new packaging materials in recent years. Among them, UV curing technology has received widespread attention in the field of photovoltaic module packaging due to its characteristics of rapid curing, energy saving and environmental protection. UV curing packaging materials can be cured and formed in a short time, reducing the energy consumption and time required for traditional thermal curing, and improving production efficiency. However, UV curing materials also face some challenges, especially how to control the curing speed. In the process of positioning and assembling solar cells, a certain operating time window is often required to ensure that the various parts of the component can be accurately aligned and stably fixed. If the curing speed is too fast, it may cause the position of the solar cell to deviate and affect the performance of the component; if the curing speed is too slow, it will increase the production cycle and affect production efficiency.

[0004] Therefore, there is an urgent need for a method for preparing an integrated lightweight photovoltaic module and its packaging material, which aims to solve the problems existing in the prior art, ensure the assembly accuracy of the module while achieving rapid curing, improve the performance and reliability of the photovoltaic module, and at the same time reduce the weight of the module, enhance weather resistance, and extend service life. Summary of the invention

[0005] To this end, the present invention provides a method for preparing an integrated lightweight photovoltaic module and its packaging material to solve the problems of slow curing speed, poor weather resistance and excessive weight of photovoltaic module packaging materials in the prior art.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] According to a first aspect of the present invention, there is provided a packaging material for packaging a photovoltaic module, the packaging material comprising the following raw materials in parts by weight:

[0008] 50-100 parts of alicyclic epoxy resin, 0-20 parts of liquid bisphenol epoxy resin, 0-20 parts of UV-curable isocyanate-fluorinated polyurethane modified functional epoxy acrylate, 5-15 parts of toughening resin, 5-15 parts of 3,4-epoxycyclohexyl methacrylate, 0.1-2 parts of α-hydroxy ketone, 0.1-5 parts of cationic photoinitiator and 0.1-5 parts of auxiliary agent;

[0009] The preparation method of the UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate is as follows:

[0010] S1. 10-20 parts of hexamethylene diisocyanate, 20-60 parts of polycarbonate polyol, 1-5 parts of dibutyltin dilaurate and 2-5 parts of 1,4-butanediol are mixed at 60-120° C. and stirred for 3-5 hours to obtain a prepolymer containing a terminal isocyanate group, 1-5 parts of neopentyl glycol are added to the prepolymer containing a terminal isocyanate group, stirred at 30-90° C. for 2-4 hours, and mixed evenly to obtain a terminal isocyanate polyurethane;

[0011] S2. Add 3-5 parts of modified nano-silica to the isocyanate-terminated polyurethane obtained in S1, stir at 60-120°C and 400-600rpm for 2-4h, then add 0.1-3 parts of dibutyltin dilaurate, 5-15 parts of polyoxyethylene and 10-20 parts of fluorinated acrylate monomer and continue stirring for 2-4h to obtain an isocyanate-terminated fluorinated polyurethane;

[0012] S3. 10-40 parts of maleic anhydride, 30-90 parts of polyoxyethylene ether containing double bonds and 30-150 parts of toluene are added to the reactor, and stirred for reaction at 80-120° C. under nitrogen protection for 6-12 hours to obtain maleic anhydride-modified polyoxyethylene ether, and then 5-25 parts of epoxy acrylate and 1-3 parts of N, N-dimethylcyclohexylamine are added, and the reaction is continued by stirring for 6-12 hours, and then the toluene is removed by vacuum distillation to obtain functionalized epoxy acrylate;

[0013] S4. 15-30 parts of the functionalized epoxy acrylate obtained in S3 are reacted with 10-20 parts of the isocyanate-terminated fluorinated polyurethane obtained in S2 and 20-35 parts of the double-bond-containing maleate at 70-90° C. for 30-100 min to obtain a modified functionalized epoxy acrylate;

[0014] S5. Take 15-30 parts of the modified functionalized epoxy acrylate obtained in S4 and 0.25-1.25 parts of dimethylethanolamine for neutralization reaction to obtain UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate.

[0015] Furthermore, the preparation method of the modified nano-silica is: 10-30 parts by weight of water, 40-80 parts by weight of ethanol, 0.2-0.6 parts by weight of acetic acid, and 2-4 parts by weight of nano-silica are mixed, and then 5-15 parts by weight of methyltrimethoxysilane and 3-6 parts by weight of octadecyltrimethoxysilane are slowly added to the mixture to react to obtain modified nano-silica.

[0016] Furthermore, the preparation method of the fluorinated acrylate monomer is as follows: under nitrogen protection and 30-35° C., 80-120 parts by weight of hexafluoroisopropanol are added dropwise to 90-150 parts by weight of isophorone diisocyanate, and then 0.3-1.5 parts by weight of N, N-dimethylcyclohexylamine are added dropwise, and after the addition is completed, the mixture is stirred at 400-600 rpm for reaction for 2-4 hours; then 0.5-1 parts by weight of hydroxyethyl acrylate is added, and the remaining N, N-dimethylcyclohexylamine is added; the temperature is adjusted to 80-85° C., stirred for 3-6 hours, and the product is purified by column chromatography to obtain the fluorinated acrylate monomer.

[0017] Furthermore, the cationic photoinitiator is at least one of diaryliodonium salts, triarylsulfonium salts, alkylsulfonium salts or iron arene salts.

[0018] Further, the alicyclic epoxy resin is at least one of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, poly[(2-epoxyethylene)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propylene glycol ether, tetrahydroindene diepoxide, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate or vinylcyclohexene dioxide.

[0019] Furthermore, the liquid bisphenol-based epoxy resin includes at least one of liquid bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin, liquid bisphenol F epoxy resin or liquid hydrogenated bisphenol F epoxy resin.

[0020] Furthermore, the toughening resin includes at least one of core-shell toughened alicyclic epoxy resin, epoxidized polybutadiene, liquid rubber or polyol.

[0021] Furthermore, the auxiliary agent includes at least one of a leveling agent, a dispersant, a coupling agent or an anti-yellowing agent.

[0022] According to a second aspect of the present invention, a method for preparing a packaging material is provided, comprising uniformly mixing the components of any of the above packaging materials and then melting them to form a glue-like solution for later use.

[0023] According to a third aspect of the present invention, there is provided an integrated lightweight photovoltaic module, using any of the above-mentioned packaging materials, and the preparation steps include:

[0024] S1. Lay a layer of surface-treated fluoroplastic film on the bottom of the mold, then pour the first layer of packaging material, and irradiate with UV until the packaging material does not flow but is not completely cured;

[0025] S2. Laying glass fiber cloth on the above packaging material, and then repeating step S1 to obtain a second layer of packaging material;

[0026] S3. Place the cell on the surface of the second layer of packaging material described in S2; then apply the third layer of packaging material, and irradiate with UV until the glue does not flow but is not completely cured;

[0027] S4. Repeat step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0028] S5. Laying a layer of surface-treated fluoroplastic film on the surface of the fourth layer of packaging material;

[0029] S6. The mold is then placed in a laminator and heated to 80-120°C for 20-60 minutes. The lamination is performed to shape the mold, and after solidification, the mold is removed to obtain an integrated lightweight photovoltaic module.

[0030] The present invention has the following advantages:

[0031] 1. The packaging material of the present application contains UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate, which has excellent UV stability and weather resistance, and can effectively protect photovoltaic modules from harsh environmental conditions. The packaging material also contains ingredients such as alicyclic epoxy resin, liquid bisphenol-based epoxy resin and toughening resin, which can improve the mechanical strength and toughness of the packaging material, thereby improving the overall reliability and service life of the photovoltaic modules.

[0032] 2. This application can optimize the curing process of the packaging material by using cationic photoinitiators and additives, ensuring that the packaging material can be quickly cured under UV irradiation while maintaining good transparency and electrical insulation properties; the layered packaging method combined with UV curing technology can significantly shorten the production cycle of photovoltaic modules and improve production efficiency. In addition, this method also simplifies the packaging process, reduces production costs, and has the advantages of lightweight, integration, simple process, and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0034] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0035] Figure 1 A schematic diagram of the structure of an integrated lightweight photovoltaic module provided by the present invention;

[0036] In the figure: 1. Fluoroplastic film; 2. Fourth layer packaging material; 3. Fiberglass cloth; 4. Third layer packaging material; 5. Battery cell; 6. Second layer packaging material; 7. First layer packaging material. DETAILED DESCRIPTION

[0037] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In this document, unless otherwise specified, all percentages, ratios or parts involved are by weight. "Parts by weight" refers to the basic unit of measurement of the weight ratio of multiple components, and 1 part can represent any unit weight, for example, 1 part can be represented as 1g, 1.5g, or 5g, etc.

[0039] The present invention provides a packaging material for packaging photovoltaic modules, wherein the packaging material comprises the following raw materials in parts by weight:

[0040] 50-100 parts of alicyclic epoxy resin, 0-20 parts of liquid bisphenol epoxy resin, 0-20 parts of UV-curable isocyanate-fluorinated polyurethane modified functional epoxy acrylate, 5-15 parts of toughening resin, 5-15 parts of 3,4-epoxycyclohexyl methacrylate, 0.1-2 parts of α-hydroxy ketone, 0.1-5 parts of cationic photoinitiator and 0.1-5 parts of auxiliary agent;

[0041] The preparation method of UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate is as follows:

[0042] S1. 10-20 parts of hexamethylene diisocyanate, 20-60 parts of polycarbonate polyol, 1-5 parts of dibutyltin dilaurate and 2-5 parts of 1,4-butanediol are mixed at 60-120° C. and stirred for 3-5 hours to obtain a prepolymer containing a terminal isocyanate group, 1-5 parts of neopentyl glycol are added to the prepolymer containing a terminal isocyanate group, stirred at 30-90° C. for 2-4 hours, and mixed evenly to obtain a terminal isocyanate polyurethane;

[0043] S2. Add 3-5 parts of modified nano-silica to the isocyanate-terminated polyurethane obtained in S1, stir at 60-120°C and 400-600rpm for 2-4h, then add 0.1-3 parts of dibutyltin dilaurate, 5-15 parts of polyoxyethylene and 10-20 parts of fluorinated acrylate monomer and continue stirring for 2-4h to obtain an isocyanate-terminated fluorinated polyurethane;

[0044] S3. 10-40 parts of maleic anhydride, 30-90 parts of polyoxyethylene ether containing double bonds and 30-150 parts of toluene are added to the reactor, and stirred for reaction at 80-120° C. under nitrogen protection for 6-12 hours to obtain maleic anhydride-modified polyoxyethylene ether, and then 5-25 parts of epoxy acrylate and 1-3 parts of N, N-dimethylcyclohexylamine are added, and the reaction is continued by stirring for 6-12 hours, and then the toluene is removed by vacuum distillation to obtain functionalized epoxy acrylate;

[0045] S4. 15-30 parts of the functionalized epoxy acrylate obtained in S3 are reacted with 10-20 parts of the isocyanate-terminated fluorinated polyurethane obtained in S2 and 20-35 parts of the double-bond-containing maleate at 70-90° C. for 30-100 min to obtain a modified functionalized epoxy acrylate;

[0046] S5. Take 15-30 parts of the modified functionalized epoxy acrylate obtained in S4 and 0.25-1.25 parts of dimethylethanolamine for neutralization reaction to obtain UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate.

[0047] Specifically, the preparation method of modified nano-silica is: 10-30 parts by weight of water, 40-80 parts by weight of ethanol, 0.2-0.6 parts by weight of acetic acid, and 2-4 parts by weight of nano-silica are mixed, and then 5-15 parts by weight of methyltrimethoxysilane and 3-6 parts by weight of octadecyltrimethoxysilane are slowly added to the mixture to react to obtain modified nano-silica.

[0048] Specifically, the preparation method of the fluorinated acrylate monomer is as follows: under nitrogen protection and 30-35° C., 80-120 parts by weight of hexafluoroisopropanol are added dropwise to 90-150 parts by weight of isophorone diisocyanate, and then 0.3-1.5 parts by weight of N, N-dimethylcyclohexylamine is added dropwise, and after the addition is completed, the mixture is stirred at 400-600 rpm for 2-4 hours; then 0.5-1 parts by weight of hydroxyethyl acrylate is added, and the remaining N, N-dimethylcyclohexylamine is added; the temperature is adjusted to 80-85° C., stirred for 3-6 hours, and the product is purified by column chromatography to obtain the fluorinated acrylate monomer.

[0049] Specifically, the cationic photoinitiator is at least one of diaryl iodonium salt, triaryl sulfonium salt, alkyl sulfonium salt or iron arene salt. Preferably, diaryl iodonium salt (UVI-6976) is selected in the present application.

[0050] Specifically, the alicyclic epoxy resin is at least one of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, poly[(2-epoxyethylene)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propylene glycol ether, tetrahydroindene diepoxide, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate or vinylcyclohexene dioxide. Preferably, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester is selected in the present application.

[0051] Specifically, the liquid bisphenol-based epoxy resin includes at least one of liquid bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin, liquid bisphenol F epoxy resin or liquid hydrogenated bisphenol F epoxy resin. Preferably, liquid bisphenol A epoxy resin is selected in the present application.

[0052] Specifically, the toughening resin includes at least one of core-shell toughened alicyclic epoxy resin, epoxidized polybutadiene, liquid rubber or polyol. Preferably, the present application selects core-shell toughened alicyclic epoxy resin.

[0053] Specifically, the auxiliary agent includes at least one of a leveling agent, a dispersant, a coupling agent or an anti-yellowing agent. Preferably, the present application uses a non-ionic wetting and dispersing agent (BYK066N), an epoxy group-containing silane coupling agent (Z-6040), a non-ionic leveling agent (BYK-3550) and an anti-yellowing agent (V-73B).

[0054] The invention provides a method for preparing a packaging material from the above components, which comprises the steps of uniformly mixing the above components and then melting them to form a glue-like material for standby use.

[0055] The present invention provides an integrated lightweight photovoltaic module comprising the packaging material prepared above, and the preparation steps include:

[0056] S1. Lay a layer of surface-treated fluoroplastic film or fluorocarbon coating on the bottom of the mold, preferably, the fluoroplastic film used in this application; then pour the first layer of packaging material, UV irradiation until the packaging material does not flow but has not yet completely cured;

[0057] S2. Laying glass fiber cloth on the above packaging material and then repeating step S1 to obtain a second layer of packaging material;

[0058] S3. Place the cell on the surface of the packaging material in S2; then apply the third layer of packaging material and irradiate with UV until the glue stops flowing but is not completely cured;

[0059] S4. Repeat step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0060] S5. Laying a layer of surface-treated fluoroplastic film on the surface of the fourth layer of packaging material;

[0061] S6. Then put the mold into a laminator and heat it to 80-120°C for 20-60 minutes. Lamination is performed and the mold is removed after solidification. Figure 1 The integrated lightweight photovoltaic module shown. Example 1

[0062] The preparation method of UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate is as follows:

[0063] S1. 15 g of hexamethylene diisocyanate was mixed with 40 g of polycarbonate polyol, 3 g of dibutyltin dilaurate and 3.5 g of 1,4-butanediol and stirred at 90 ° C for 4 h to obtain a prepolymer containing a terminal isocyanate group, 3 g of neopentyl glycol was added to the prepolymer containing a terminal isocyanate group, stirred at 60 ° C for 3 h, and mixed evenly to obtain a terminal isocyanate polyurethane;

[0064] S2. 4 g of modified nano-silica was added to the isocyanate-terminated polyurethane obtained in S1, and the mixture was stirred at 90 ° C and 600 rpm for 3 h, and then 1.5 g of dibutyltin dilaurate, 15 g of polyoxyethylene and 15 g of fluorinated acrylate monomer were added and stirred for 3 h to obtain an isocyanate-terminated fluorinated polyurethane;

[0065] S3. 25 g of maleic anhydride, 60 g of polyoxyethylene ether containing double bonds and 90 g of toluene were added to the reactor, and the reaction was stirred at 100 ° C for 9 h under nitrogen protection to obtain maleic anhydride-modified polyoxyethylene ether, and then 15 g of epoxy acrylate and 2 g of N, N-dimethylcyclohexylamine were added. After stirring for 6 h, the toluene was removed by vacuum distillation to obtain functionalized epoxy acrylate;

[0066] S4. 20 g of the functionalized epoxy acrylate obtained in S3 was reacted with 15 g of the isocyanate-terminated fluorinated polyurethane obtained in S2 and 25 g of the double-bond-containing maleate at 80 ° C for 60 min to obtain a modified functionalized epoxy acrylate;

[0067] S5. Take 20 g of the modified functionalized epoxy acrylate obtained in S4 and 0.75 g of dimethylethanolamine for neutralization reaction to obtain UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate.

[0068] Specifically, the preparation method of modified nano-silica is: 20g of water, 60g of ethanol, 0.4g of acetic acid, and 3g of nano-silica are mixed, and then 10g of methyltrimethoxysilane and 4.5g of octadecyltrimethoxysilane are slowly added to the mixture to react and obtain modified nano-silica.

[0069] Specifically, the preparation method of the fluorinated acrylate monomer is as follows: under nitrogen protection and 35° C., 100 g of hexafluoroisopropanol is added dropwise to 100 g of isophorone diisocyanate, and then 1 g of N, N-dimethylcyclohexylamine is added dropwise, and after the addition is completed, the mixture is stirred at 600 rpm for 3 hours; then 0.5 g of hydroxyethyl acrylate is added, and the remaining N, N-dimethylcyclohexylamine is added; then the temperature is adjusted to 80° C., stirred for 6 hours, and the product is purified by column chromatography to obtain the fluorinated acrylate monomer. Example 2

[0070] The packaging materials of this embodiment include: 100g of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, 20g of liquid hydrogenated bisphenol A epoxy resin, 20g of UV-cured isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate, 10g of core-shell toughened alicyclic epoxy resin, 15g of 3,4-epoxycyclohexyl methacrylate, 2g of α-hydroxy ketone, 1g of diaryliodonium salt, and additives: 0.3g of non-ionic wetting and dispersing agent, 0.5g of epoxy group-containing silane coupling agent, 0.5g of non-ionic leveling agent, and 1g of anti-yellowing agent.

[0071] This embodiment provides a method for preparing a packaging material from the above components, which includes mixing the above components evenly and then melting them to form a glue-like material for later use.

[0072] This embodiment provides a method for preparing an integrated lightweight photovoltaic module, comprising the following steps:

[0073] S1 is placed in the mold, with a layer of surface-treated fluoroplastic film on the bottom, and then poured with a 1mm thick first layer of packaging material. It is irradiated with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 ;

[0074] S2: Lay a layer of 7628 glass fiber cloth on the adhesive surface of the first layer of packaging material; then repeat step S1 to obtain a second layer of packaging material;

[0075] S3 places the cell on the adhesive surface of the second layer of packaging material; then applies a 1mm thick third layer of packaging material and irradiates with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 .

[0076] S4 repeats step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0077] S5: Lay a layer of surface-treated fluoroplastic film on the top layer;

[0078] S6 then puts the mold into a laminator for heating and lamination, with a heating temperature of 100° C. and a heating time of 10 min. Example 3

[0079] The packaging material composition of this embodiment is as follows: 90g of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, 10g of 1,2-epoxy-4-vinylcyclohexane, 20g of liquid hydrogenated bisphenol A epoxy resin, 15g of UV-cured isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate, 10g of core-shell toughened alicyclic epoxy resin, 15g of 3,4-epoxycyclohexyl methacrylate, 2g of α-hydroxy ketone, 1g of diaryliodonium salt, and additives: 0.3g of non-ionic wetting and dispersing agent, 0.5g of epoxy group-containing silane coupling agent, 0.5g of non-ionic leveling agent, and 1g of anti-yellowing agent.

[0080] This embodiment provides a method for preparing a packaging material from the above components, which includes mixing the above components evenly and then melting them to form a glue-like material for later use.

[0081] This embodiment provides a method for preparing an integrated lightweight photovoltaic module, comprising the following steps:

[0082] S1 is placed in the mold, with a layer of surface-treated fluoroplastic film on the bottom, and then poured with a 1mm thick first layer of packaging material. It is irradiated with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 ;

[0083] S2: Lay a layer of 7628 glass fiber cloth on the adhesive surface of the first layer of packaging material; then repeat step S1 to obtain a second layer of packaging material;

[0084] S3 places the cell on the adhesive surface of the second layer of packaging material; then applies a 1mm thick third layer of packaging material and irradiates with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 .

[0085] S4 repeats step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0086] S5: Lay a layer of surface-treated fluoroplastic film on the top layer;

[0087] S6 then puts the mold into a laminator for heating and lamination, with a heating temperature of 100° C. and a heating time of 10 min. Example 4

[0088] The packaging material composition of this embodiment is: 100g of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, 10g of liquid hydrogenated bisphenol A epoxy resin, 10g of UV-curable isocyanate-fluorinated polyurethane modified functional epoxy acrylate, 15g of epoxidized polybutadiene, 15g of 3,4-epoxycyclohexyl methacrylate, 2g of α-hydroxy ketone, 1g of diaryliodonium, and additives: 0.3g of non-ionic wetting and dispersing agent, 0.5g of silane coupling agent containing epoxy group, 0.5g of non-ionic leveling agent, and 1g of anti-yellowing agent.

[0089] This embodiment provides a method for preparing a packaging material from the above components, which includes mixing the above components evenly and then melting them to form a glue-like material for later use.

[0090] This embodiment provides a method for preparing an integrated lightweight photovoltaic module, comprising the following steps:

[0091] S1 is placed in the mold, with a layer of surface-treated fluoroplastic film on the bottom, and then poured with a 1mm thick first layer of packaging material. It is irradiated with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 ;

[0092] S2: Lay a layer of 7628 glass fiber cloth on the adhesive surface of the first layer of packaging material; then repeat step S1 to obtain a second layer of packaging material;

[0093] S3 places the cell on the adhesive surface of the second layer of packaging material; then applies a 1mm thick third layer of packaging material and irradiates with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 .

[0094] S4 repeats step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0095] S5: Lay a layer of surface-treated fluoroplastic film on the top layer;

[0096] S6 then puts the mold into a laminator for heating and lamination, with a heating temperature of 100° C. and a heating time of 10 min.

[0097] Comparative Example

[0098] The packaging material composition of this embodiment is: 100g of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, 10g of UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate, 15g of 3,4-epoxycyclohexyl methacrylate, 2g of α-hydroxy ketone, 1g of diaryliodonium salt, and additives: 0.3g of non-ionic wetting and dispersing agent, 0.5g of epoxy group-containing silane coupling agent, 0.5g of non-ionic leveling agent, and 1g of anti-yellowing agent.

[0099] This embodiment provides a method for preparing a packaging material from the above components, which includes mixing the above components evenly and then melting them to form a glue-like material for later use.

[0100] This embodiment provides a method for preparing an integrated lightweight photovoltaic module, comprising the following steps:

[0101] S1 is placed in the mold, with a layer of surface-treated fluoroplastic film on the bottom, and then poured with a 1mm thick first layer of packaging material. It is irradiated with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 ;

[0102] S2: Lay a layer of 7628 glass fiber cloth on the adhesive surface of the first layer of packaging material; then repeat step S1 to obtain a second layer of packaging material;

[0103] S3 places the cell on the adhesive surface of the second layer of packaging material; then applies a 1mm thick third layer of packaging material and irradiates with a 365nm wavelength UV LED with a total energy of 600mj / cm 2 .

[0104] S4 repeats step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material;

[0105] S5: Lay a layer of surface-treated fluoroplastic film on the top layer;

[0106] S6 then puts the mold into a laminator for heating and lamination, with a heating temperature of 100° C. and a heating time of 10 min.

[0107] Performance Test:

[0108] The present invention has carried out performance tests on the above-mentioned embodiments 2-4 and the comparative example, and the results are shown in the following table:

[0109] Table 1 Performance test results of photovoltaic modules manufactured in Examples 2-4 and Comparative Examples

[0110]

[0111] in conclusion:

[0112] 1. Package structure weight: The package structure weights of all embodiments (Example 2, Example 3, Example 4) and the comparative example are all less than 1 kg / ㎡, indicating that the adopted package materials perform well in weight control, which is beneficial to reducing the total weight of the photovoltaic module and facilitating installation and transportation.

[0113] 2. Light transmittance: In the wavelength range of 380-1100nm, the light transmittances of Example 2, Example 3 and Example 4 are 93.2%, 92.3% and 92.1% respectively, while the light transmittance of the comparative example is 89.5%. This shows that the encapsulation materials of the examples have excellent light transmittance and can ensure that the photovoltaic modules have good photoelectric conversion efficiency.

[0114] 3. Double 85*1000h light transmittance: After double 85*1000h aging test, the light transmittance of Example 2, Example 3 and Example 4 were 92.3%, 91.5% and 91% respectively, while the light transmittance of the comparative example was 89%. This shows that the encapsulation material of the embodiment has good weather resistance and can maintain a high light transmittance even in harsh environments, which is conducive to improving the long-term stability and reliability of photovoltaic modules.

[0115] 4. Mechanical properties: The bending strength of Example 2, Example 3 and Example 4 are 76MPa, 75MPa and 73MPa respectively, and the tensile strength is 385MPa, 381MPa and 376MPa respectively, while the bending strength and tensile strength of the comparative example are 50MPa and 330MPa respectively. This shows that the packaging material of the embodiment performs better in terms of mechanical strength, has higher bending strength and tensile strength, and can better resist the influence of external stress.

[0116] 5. Elongation at break: The elongations at break of Examples 2, 3 and 4 are 432%, 415% and 387% respectively, while the elongation at break of the comparative example is 352%. This indicates that the encapsulation materials of the examples have better toughness, higher elongation at break, and can better adapt to the deformation of photovoltaic modules under temperature changes and mechanical stress.

[0117] In summary, the packaging materials used in Example 2, Example 3 and Example 4 all perform well in terms of weight, transmittance, weather resistance, mechanical strength and toughness, and can meet the requirements of lightweight photovoltaic modules and improve the overall performance of photovoltaic modules. The comparative example is lower than the example in terms of performance indicators, especially in terms of mechanical strength and toughness. This shows that the UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate in the example has a significant improvement in terms of weather resistance, mechanical strength and toughness of the packaging material, making the packaging material prepared by the example better than the comparative example in overall performance, and more suitable for the packaging of high-performance photovoltaic modules.

[0118] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A packaging material for packaging photovoltaic modules, characterized in that: The packaging material includes the following raw materials in parts by weight: 50-100 parts of alicyclic epoxy resin, 0-20 parts of liquid bisphenol epoxy resin, 0-20 parts of UV-curable isocyanate-fluorinated polyurethane modified functional epoxy acrylate, 5-15 parts of toughening resin, 5-15 parts of 3,4-epoxycyclohexyl methacrylate, 0.1-2 parts of α-hydroxy ketone, 0.1-5 parts of cationic photoinitiator and 0.1-5 parts of auxiliary agent; The amount of the UV-curable isocyanate-fluorinated polyurethane modified functional epoxy acrylate is not 0; The preparation method of the UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate is as follows: S1. 10-20 parts of hexamethylene diisocyanate, 20-60 parts of polycarbonate polyol, 1-5 parts of dibutyltin dilaurate and 2-5 parts of 1,4-butanediol are mixed at 60-120° C. and stirred for 3-5 hours to obtain a prepolymer containing a terminal isocyanate group, 1-5 parts of neopentyl glycol are added to the prepolymer containing a terminal isocyanate group, stirred at 30-90° C. for 2-4 hours, and mixed evenly to obtain a terminal isocyanate polyurethane; S2. Add 3-5 parts of modified nano-silica to the isocyanate-terminated polyurethane obtained in S1, stir at 60-120°C and 400-600rpm for 2-4h, then add 0.1-3 parts of dibutyltin dilaurate, 5-15 parts of polyoxyethylene and 10-20 parts of fluorinated acrylate monomer and continue stirring for 2-4h to obtain an isocyanate-terminated fluorinated polyurethane; S3. 10-40 parts of maleic anhydride, 30-90 parts of polyoxyethylene ether containing double bonds and 30-150 parts of toluene are added to the reactor, and stirred for reaction at 80-120° C. under nitrogen protection for 6-12 hours to obtain maleic anhydride-modified polyoxyethylene ether, and then 5-25 parts of epoxy acrylate and 1-3 parts of N, N-dimethylcyclohexylamine are added, and the reaction is continued by stirring for 6-12 hours, and then the toluene is removed by vacuum distillation to obtain functionalized epoxy acrylate; S4. 15-30 parts of the functionalized epoxy acrylate obtained in S3 are reacted with 10-20 parts of the isocyanate-terminated fluorinated polyurethane obtained in S2 and 20-35 parts of the double-bond-containing maleate at 70-90° C. for 30-100 min to obtain a modified functionalized epoxy acrylate; S5. Take 15-30 parts of the modified functionalized epoxy acrylate obtained in S4 and 0.25-1.25 parts of dimethylethanolamine for neutralization reaction to obtain UV-curable isocyanate-fluorinated polyurethane modified functionalized epoxy acrylate.

2. The packaging material according to claim 1, characterized in that: The preparation method of the modified nano-silica comprises: mixing 10-30 parts by weight of water, 40-80 parts by weight of ethanol, 0.2-0.6 parts by weight of acetic acid, and 2-4 parts by weight of nano-silica, and then slowly adding 5-15 parts by weight of methyltrimethoxysilane and 3-6 parts by weight of octadecyltrimethoxysilane into the mixture to react and obtain the modified nano-silica.

3. The packaging material according to claim 1, characterized in that: The preparation method of the fluorinated acrylate monomer is as follows: under nitrogen protection and 30-35° C., 80-120 parts by weight of hexafluoroisopropanol are dripped into 90-150 parts by weight of isophorone diisocyanate, and then 0.3-1.5 parts by weight of N, N-dimethylcyclohexylamine are dripped, and after the dripping is completed, the mixture is stirred at 400-600 rpm for reaction for 2-4 hours; then 0.5-1 parts by weight of hydroxyethyl acrylate is added, and the remaining N, N-dimethylcyclohexylamine is added; the temperature is adjusted to 80-85° C., stirred for 3-6 hours, and the product is purified by column chromatography to obtain the fluorinated acrylate monomer.

4. The packaging material according to claim 1, characterized in that: The cationic photoinitiator is at least one of diaryliodonium salt, triarylsulfonium salt, alkylsulfonium salt or iron arene salt.

5. The packaging material according to claim 1, characterized in that: The alicyclic epoxy resin is at least one of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, poly[(2-epoxyethylene)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propylene glycol ether, tetrahydroindene diepoxide, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate or vinylcyclohexene dioxide.

6. The packaging material according to claim 1, characterized in that: The liquid bisphenol-based epoxy resin includes at least one of liquid bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin, liquid bisphenol F epoxy resin or liquid hydrogenated bisphenol F epoxy resin.

7. The packaging material according to claim 1, characterized in that: The toughening resin includes at least one of core-shell toughening alicyclic epoxy resin, epoxidized polybutadiene, and liquid rubber.

8. The packaging material according to claim 1, characterized in that: The auxiliary agent includes at least one of a leveling agent, a dispersant, a coupling agent or an anti-yellowing agent.

9. A method for preparing a packaging material, characterized in that: The method comprises mixing the components of the packaging material according to any one of claims 1 to 8 uniformly and then melting them to form a glue-like substance for later use.

10. An integrated lightweight photovoltaic module, characterized in that: Using the packaging material as described in any one of claims 1 to 8, the preparation steps include: S1. Lay a layer of surface-treated fluoroplastic film on the bottom of the mold, then pour the first layer of packaging material, and irradiate with UV until the packaging material does not flow but is not completely cured; S2. Laying glass fiber cloth on the above packaging material, and then repeating step S1 to obtain a second layer of packaging material; S3. Place the cell on the surface of the second layer of packaging material described in S2; then apply the third layer of packaging material, and irradiate with UV until the glue does not flow but is not completely cured; S4. Repeat step S2 on the surface of the third layer packaging material obtained in S3 to obtain a fourth layer packaging material; S5. Laying a layer of surface-treated fluoroplastic film on the surface of the fourth layer of packaging material; S6. The mold is then placed in a laminator and heated to 80-120°C for 20-60 minutes. The lamination is performed to shape the mold, and after solidification, the mold is removed to obtain an integrated lightweight photovoltaic module.

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