A semiconductor device production sampling detection device
By using bubble level, elastic telescopic rod and fill light components in the production sampling and detection device of semiconductor devices, the rapid positioning and centering of semiconductor wafers is achieved, combined with radiation protection and marking devices, the problems of low detection efficiency and radioactive material emission are solved, and the problems of high detection efficiency are improved. Test efficiency and safety.
Patent Information
- Application Number
- CN202411250048.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2044-09-06
AI Technical Summary
When the existing semiconductor device production sampling and testing devices are used to detect semiconductor wafers, it is difficult to ensure that the wafers are always located in the center of the detection table, resulting in an extended detection preparation time, a reduction in detection efficiency, and a risk of radioactive substances being emitted.
Using protective plates, elastic telescopic rods, bubble level, detection tables, vertical rods, L-shaped plates, scale plates, shrapnels, reciprocating screws and fill light components, the rapid positioning of semiconductor wafers is achieved through bubble level and elastic telescopic rods. And centered, the protective plate and radiation-proof device prevent the light source from scattering and absorbing radioactive particles, and the marking device performs low temperature processing and marking.
The observation time of semiconductor wafer centering is shortened, the detection efficiency is improved, the wafer collision and damage is avoided, the radioactive material content in the working area is reduced, and the accuracy of yield statistics and the cooling efficiency of semiconductor wafers are improved through the labeling device.
Smart Images
Figure CN118824904B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of semiconductor technology, in particular to a semiconductor device production sampling detection device. Background Art
[0002] The semiconductor industry belongs to the electronic information industry and the hardware industry. It is an industry developed based on semiconductors. Ultra-thin wafers are used in the semiconductor industry. After the wafers are processed, they need to be sampled and tested. With the rapid development of science and technology, detection components are becoming more and more advanced.
[0003] The patent with the patent announcement number CN116544162B discloses a semiconductor device production sampling inspection grasping mechanism, which relates to the field of semiconductor device production technology. The semiconductor device production sampling inspection grasping mechanism includes a conveying component and an inspection table. A mounting column is installed on one side outer wall of the conveying component, a placement table is installed on the top of the mounting column, a control panel is installed on one side outer wall of the inspection table, a stabilizing component is arranged inside the placement table, and a grasping component is arranged above the placement table, and the grasping component is used to grasp the wafer to be inspected; the grasping component includes a fixed plate 2, a suction cup, an air pipe, an air pump, and an extrusion rod. The top of the suction cup is installed on the bottom of the fixed plate 2 through a support rod 2, which effectively improves the grasping stability of the semiconductor wafer and prevents the semiconductor wafer from falling and causing damage during grasping. At the same time, it can effectively ensure the stability of the wafer during the conveying process and will not fall from the placement table.
[0004] However, the device still has some shortcomings: the device can randomly grab semiconductor wafers and place them on the testing table for testing, but when the staff is testing the semiconductor wafers, it is difficult to ensure that the grabbing components place the semiconductor wafers in the center of the testing table at all times. The testing personnel are required to observe the position with the naked eye and then manually control the equipment to center it, which prolongs the preparation time before testing the semiconductor wafers and reduces the testing efficiency. Summary of the invention
[0005] In view of the deficiencies of the prior art, the present invention provides a semiconductor device production sampling detection device, which solves the problems raised in the above background technology.
[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor device production sampling and testing device, including a conveying component, the conveying component is connected through an external pulley transmission, a plurality of partitions are equidistantly arranged on the outer wall of the conveying component, a fixed rod is arranged on the back of the conveying component, a motor is arranged inside the fixed rod, an electric slide rail is arranged on the top of the motor output end inside the fixed rod, a telescopic component is slidably installed inside the electric slide rail, an electric suction cup is arranged at the bottom of the telescopic end of the telescopic component, the electric suction cup is located above the conveying component, a long board is arranged at the bottom of the fixed rod, and a sliding block is arranged on the top of the long board, a protective plate is fixedly installed at the top edge of the long board, a motor is arranged on the back of the protective plate, and the long board slides Four elastic telescopic rods are hinged on the top of the block, two of the four elastic telescopic rods form a group, and the elastic telescopic rods consist of a fixed end and a telescopic end, a bubble level is hinged on the top of the telescopic end of the elastic telescopic rod, a detection platform is fixedly installed on the top of the bubble level, and a square groove is opened at the center of the inner wall of the detection platform, the front and back of the inner wall of the square groove fit the diameter of the semiconductor wafer, a slide groove is opened inside the detection platform, and the detection platform is light-transmitting, a vertical rod is fixedly installed at the top edge of the detection platform, an L-shaped plate is fixedly installed on the top of the vertical rod, the L-shaped plate is hollow in design, two scale plates are installed inside the L-shaped plate through spring sliding, a spring is fixedly installed on the front of the scale plate, and the arc surface of the spring is located on the left side of the electric slide rail On the motion track, a reciprocating screw is fixedly installed at the output end of the motor on the back of the protective plate, and a fill light component is sleeved and slidably installed on the outer wall of the reciprocating screw, which drives the conveying component to transmit through an external pulley, and the conveying component drives the partition to transmit, and the partition separates and transports the semiconductor wafers, starts the electric slide rail and the telescopic component, and the fixed rod limits the electric slide rail. After the electric slide rail causes the telescopic component to slide inside itself to an adapted position, the telescopic end of the telescopic component drives the electric suction cup to descend to suck the semiconductor wafer and then rise, and the electric slide rail is driven by the output end of the motor inside the fixed rod to rotate toward the detection platform, and the semiconductor wafer is placed in the square slot of the detection platform for manual detection, and at the same time, the detection platform generates downward pressure under the gravity pressure of the semiconductor wafer. The bubble level is prompted to move downward through the transmission of force, and the bubble level presses the telescopic end of the elastic telescopic rod to move downward synchronously. When the semiconductor wafer deviates from the center position of the inspection table, the bubble level presses the telescopic end of the elastic telescopic rod to rotate the hinge shaft. At this time, the telescopic end of the elastic telescopic rod contracts in a non-vertical direction. At this time, the bubble inside the bubble level leaves its own center position. The inspector moves the semiconductor wafer manually or with the help of tools, observes the position of the bubble inside the bubble level to prompt the semiconductor wafer to be in the center position of the inspection table, starts the motor on the back of the protective plate, and the output end of the motor drives the reciprocating screw to rotate. When the reciprocating screw rotates, the reciprocating spiral groove on its outer wall restricts the fill light component, and the block inside the fill light component continuously contacts the inner wall of the reciprocating spiral groove.Therefore, when the reciprocating screw rotates, the fill light assembly slides forward along the bottom of the inspection table, and fills the square slot of the inspection table with light through the light transmittance of the inspection table; when the electric slide rail rotates, it will contact the arc surface of the spring piece to generate resistance, and the spring piece will deform due to the resistance force. When the spring piece no longer deforms, the electric slide rail receives resistance feedback and stops rotating according to the set intelligence level. At the same time, the spring piece pushes the scale plate to move away from the center of the L-shaped plate. At this time, the vertical rod limits the L-shaped plate. After the inspection is completed, the spring piece resets and drives the scale plate to reset. After that, the electric slide rail puts the qualified materials back to the conveying assembly for transportation, and the electric slide rail rotates in the opposite direction to discard the unqualified materials.
[0007] According to the above technical solution, the two scale plates are symmetrically distributed around the axis of the L-shaped plate, one end of the front end of the reciprocating screw passes through the inside of the protective plate, the top of the fill light component is slidably installed on the bottom of the detection table, and the left and right sides of the fill light component are provided with radiation protection devices for absorbing high-energy particles emitted when radioactive materials such as uranium or thorium inside the semiconductor wafer decay.
[0008] According to the above technical scheme, the radiation protection device includes a flat plate, an L-shaped light baffle, a cylinder and an insulating wheel. The back of the flat plate is fixedly installed on the front of the protective plate, and the flat plate is located below the detection table. The L-shaped light baffle is fixedly installed on the outer wall of the fill light assembly near the center of the flat plate. A square groove is opened on the inner side of the L-shaped light baffle, and the outer wall of the L-shaped light baffle is located inside the slide groove of the detection table. The upper and lower ends of the cylinder are fixedly installed inside the square groove of the L-shaped light baffle. The outer wall of the cylinder is rotatably installed with an insulating wheel. When the fill light assembly slides forward and resets, it drives the L-shaped light baffle to slide synchronously inside the slide groove of the detection table. The L-shaped light baffle follows the fill light assembly to move synchronously to block the light source. At the same time, the L-shaped light baffle drives the cylinder to move synchronously, and the cylinder drives the insulating wheel to move synchronously. The outer wall of the insulating wheel contacts the outer wall of the semiconductor wafer to generate friction, causing the insulating wheel to rotate along the outer wall of the cylinder.
[0009] According to the above technical solution, the radiation protection device also includes a transmission plate, a rotating wheel, a rotating rod and several shielding plates. The top of the transmission plate is hinged to the bottom of the L-shaped light blocking plate. A torsion spring is arranged between the top of the transmission plate and the bottom of the L-shaped light blocking plate. The rotating wheel is rotatably installed on the inner wall of the transmission plate away from the center of the flat plate. The left and right ends of the rotating rod are fixedly installed at the center of the inner wall of the rotating wheel. Several shielding plates are equidistant and fixedly installed on the outer wall surface of the rotating rod. When the L-shaped light blocking plate moves, it drives the transmission plate to move synchronously. The transmission plate drives the rotating wheel to slide synchronously along the top of the flat plate. The rotating wheel contacts the top of the flat plate to generate friction and starts to rotate. When the rotating wheel rotates, it drives the rotating rod to rotate. When the rotating rod rotates, it drives the shielding plate to rotate.
[0010] According to the above technical solution, the outer wall of the rotating wheel contacts the top surface of the flat plate, the outer wall of the rotating rod is provided with an arc-shaped groove, the outer wall of the shielding plate is coated with a metal shielding layer, and a marking device is provided inside the L-shaped light-blocking plate for performing low-temperature treatment on the sampled materials as a mark to calculate the material yield.
[0011] According to the above technical scheme, the marking device includes a cam, a resistance rod, a hinge rod, an inclined rod, a low-temperature component and a circular frame. The cam is fixedly installed on the outer wall surface of the rotating rod, the resistance rod is located at the top of the cam, and a ring is fixedly installed on the outer wall of the resistance rod. The hinge rod is fixedly installed on the outer wall of the resistance rod ring near the center of the rotating rod, and the hinge rod is fixedly connected to the side away from the center of the rotating rod. The bottom of the inclined rod is hinged at the top of the resistance rod, the bottom of the low-temperature component is hinged at the top of the inclined rod, the bottom of the circular frame is slidably installed at the bottom of the inner wall of the L-shaped light baffle, and the back of the low-temperature component is fixedly installed on the front of the circular frame. When the rotating rod rotates, the cam is driven to rotate. When the cam rotates, the protrusion pushes the resistance rod to move upward. The resistance rod is restricted by the hinge rod on the outer wall ring, so that the resistance rod can only move up and down. When the resistance rod moves upward, it drives the inclined rod to move synchronously. The hinge shaft between the inclined rod and the low-temperature component starts to rotate, prompting the inclined rod to push the low-temperature component to move away from the center of the fill light component, and the low-temperature component drives the circular frame to slide synchronously along the bottom of the inner wall of the L-shaped light baffle.
[0012] According to the above technical solution, the marking device also includes an octagonal plate, a transmission rod and a sliding ring. The bottom of the octagonal plate is rotatably installed on the bottom of the inner wall of the L-shaped light-blocking plate. The outer wall of the octagonal plate contacts the outer wall of the circular frame. The bottom of the transmission rod is fixedly installed on the top of the octagonal plate. A spiral groove is provided on the outer wall of the transmission rod. The inner wall of the sliding ring is sleeved and slidably installed on the outer wall surface of the transmission rod.
[0013] According to the above technical scheme, the marking device also includes a reset frame, a movable plate and a hinged plate. The reset frame is fixedly installed on the outer wall of the fill light assembly near the center of the detection platform. A connecting plate is installed inside the reset frame through spring sliding, and the connecting plate passes through and is fixedly installed on the outer wall surface of the sliding ring. The bottom of the movable plate is fixedly installed on the top of the sliding ring. The top of the hinged plate is hinged to the bottom of the detection platform through a torsion spring, and the bottom of the hinged plate is located on the movement trajectory of the movable plate. The sliding ring drives the movable plate to move synchronously, and the top of the movable plate resists the hinged plate to cause a resistance force. The hinged plate causes the hinge axis of its own top and the bottom of the detection platform to start rotating through the resistance force. At this time, the bottom of the hinged plate slides in an arc shape along the top of the movable plate, and then the reset frame causes the connecting plate to reset through the built-in spring elastic force, and the connecting plate drives the sliding ring to reset, and the reciprocating motion of the movable plate and the hinged plate is enabled.
[0014] The present invention provides a semiconductor device production sampling detection device, which has the following beneficial effects:
[0015] (1) The present invention cooperates with a protective plate, an elastic telescopic rod, a bubble level, a testing table, a vertical rod, an L-shaped plate, a scale plate, a spring, a reciprocating screw and a fill light assembly to enable the testing personnel to quickly locate the semiconductor wafer through the bubble position, thereby shortening the time for centered observation. The fill light effect of the fill light assembly makes the semiconductor wafer bright and transparent during testing, which is convenient for the staff to promptly find out whether there are defects. At the same time, the extension range of the scale plate is expanded to facilitate the staff to determine the position of the electric suction cup for powering off and releasing the material, thereby speeding up the preparation work for the inspection of the semiconductor wafer, avoiding the need for the staff to position the semiconductor wafer multiple times when placing the semiconductor wafer, reducing the inspection efficiency, and avoiding the semiconductor wafer from being damaged by collision.
[0016] (2) The present invention provides a radiation protection device, and cooperates with a fill light assembly, a flat plate, an L-shaped light shielding plate, a cylinder, an insulating wheel, a transmission plate, a rotating wheel, a rotating rod and a shielding plate, so that the L-shaped light shielding plate blocks the light source inside the square slot of the detection table, thereby preventing the light source from radiating other components and generating shadows that affect the judgment of the detection personnel, and the insulating wheel rolls in contact with the outer wall of the semiconductor wafer to ensure that the semiconductor wafer is always in the center during the detection process; and when the shielding plate rotates, the metal shielding coating on its outer wall absorbs the high-energy particles emitted when radioactive substances such as uranium or thorium inside the semiconductor wafer decay, thereby reducing the content of radioactive substances in the working area and providing protection for the health of the detection personnel to a certain extent.
[0017] (3) The present invention expands the range of motion of the cryogenic component and marks the semiconductor wafers under test by setting a marking device through the coordination of a connecting rod, a cryogenic component, a circular frame, an octagonal plate, a transmission rod, a sliding ring, a reset frame, a movable plate and a hinged plate. Later, statisticians will count the cryogenic semiconductor wafers that have not been discarded, and then roughly estimate the yield rate in the semiconductor wafer production process based on the total production volume to facilitate whether the production process needs to be improved. At the same time, the cold air emitted by the cryogenic component is evenly dispersed to avoid concentrated cooling, which will cause the temperature of the semiconductor wafer to be too low and mix with the heat to generate mist, thereby avoiding blurring during semiconductor wafer testing. At the same time, the gas around the test table is evenly mixed with the cold air emitted by the cryogenic component, so that the semiconductor wafer is cooled faster and at a lower temperature within the same period of time, thereby improving the marking effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic diagram of the present invention as a whole;
[0019] Figure 2 It is a bottom perspective schematic diagram of the present invention as a whole;
[0020] Figure 3 It is a schematic diagram of the peripheral structure of the detection platform of the present invention;
[0021] Figure 4 It is a schematic diagram of the radiation protection device of the present invention;
[0022] Figure 5 For the present invention Figure 4 A schematic diagram of the structure enlargement in the middle;
[0023] Figure 6 It is a schematic diagram of an enlarged part of the structure of the radiation protection device of the present invention;
[0024] Figure 7 It is a schematic diagram of the marking device of the present invention;
[0025] Figure 8 This is a schematic diagram of the marking device of the present invention from a back view;
[0026] Fig. 9 For the present invention Figure 8 Enlarged schematic diagram of the structure at point B in the middle.
[0027] In the figure: 1. conveying component; 2. fixed rod; 21. electric slide rail; 22. telescopic component; 23. electric suction cup; 3. long board; 4. radiation protection device; 41. flat plate; 42. L-shaped light shielding plate; 43. cylinder; 44. insulating wheel; 45. transmission plate; 46. rotating wheel; 47. rotating rod; 48. shielding plate; 5. marking device; 51. cam; 52. resistance rod; 53. hinged rod; 54. inclined rod; 55. low temperature component; 56. circular frame; 57. octagonal plate; 58. transmission rod; 59. sliding ring; 510. reset frame; 511. movable plate; 512. hinged plate; 6. protective plate; 7. elastic telescopic rod; 8. bubble level; 9. testing table; 10. vertical rod; 11. L-shaped plate; 12. scale plate; 13. spring; 14. reciprocating screw rod; 15. fill light component. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0029] See also Figure 1-Figure 9One embodiment of the present invention is: a semiconductor device production sampling inspection device, comprising a conveying component 1, the conveying component 1 is connected by an external pulley transmission, a plurality of partitions 101 are equidistantly arranged on the outer wall of the conveying component 1, a fixed rod 2 is arranged on the back of the conveying component 1, a motor is arranged inside the fixed rod 2, an electric slide rail 21 is arranged on the top of the output end of the motor inside the fixed rod 2, a telescopic component 22 is slidably installed inside the electric slide rail 21, an electric suction cup 23 is arranged at the bottom of the telescopic end of the telescopic component 22, the electric suction cup 23 is located above the conveying component 1, and the bottom of the fixed rod 2 A long board 3 is provided at the top, and a slider is provided at the top of the long board 3. A protective plate 6 is fixedly installed at the top edge of the long board 3. A motor is provided on the back of the protective plate 6. Four elastic telescopic rods 7 are hinged on the top of the slider of the long board 3. The four elastic telescopic rods 7 are grouped in two, and the elastic telescopic rods 7 are composed of a fixed end and a telescopic end. A bubble level 8 is hinged on the top of the telescopic end of the elastic telescopic rod 7. A detection table 9 is fixedly installed on the top of the bubble level 8. A square groove is opened at the center of the inner wall of the detection table 9. The front and back of the inner wall of the square groove fit the diameter of the semiconductor wafer. The inner wall of the detection table 9 is A slide groove is provided on the top of the detection platform 9, and the detection platform 9 is light-transmissive. A vertical rod 10 is fixedly installed at the top edge of the detection platform 9, and an L-shaped plate 11 is fixedly installed on the top of the vertical rod 10. The L-shaped plate 11 is hollow in design, and two scale plates 12 are slidably installed inside the L-shaped plate 11 through a spring. A spring piece 13 is fixedly installed on the front of the scale plate 12, and the arc surface of the spring piece 13 is located on the left motion track of the electric slide rail 21. A reciprocating screw rod 14 is fixedly installed on the output end of the motor on the back of the protective plate 6, and a fill light component 15 is sleeved and slidably installed on the outer wall of the reciprocating screw rod 14. Through the above cooperation, the detection personnel are prompted The bubble orientation can be used to quickly locate the semiconductor wafer, thereby shortening the time for centered observation, and the fill light effect of the fill light component 15 makes the semiconductor wafer bright and transparent during inspection, so that the staff can find defects in time. The above coordination expands the extension range of the scale plate 12 to facilitate the staff to determine the power-off discharge orientation of the electric suction cup 23, speeding up the inspection preparation of the semiconductor wafer, avoiding the need for the staff to align the semiconductor wafer multiple times when placing the semiconductor wafer, reducing the inspection efficiency, and avoiding bumps and damages to the semiconductor wafer.
[0030] The two scale plates 12 are symmetrically distributed around the axis of the L-shaped plate 11, one front end of the reciprocating screw 14 passes through the inside of the protective plate 6, the top of the fill light component 15 is slidably installed at the bottom of the detection table 9, and the left and right sides of the fill light component 15 are provided with radiation protection devices 4 for absorbing high-energy particles emitted when radioactive materials such as uranium or thorium inside the semiconductor wafer decay.
[0031] When in use, the conveying component 1 is driven by an external pulley, and the conveying component 1 drives the partition 101 to drive. The partition 101 separates and transports the semiconductor wafers, and the electric slide 21 and the telescopic component 22 are started. The fixed rod 2 limits the electric slide 21. After the electric slide 21 causes the telescopic component 22 to slide inside itself to an appropriate position, the telescopic end of the telescopic component 22 drives the electric suction cup 23 to descend and suck the semiconductor wafer and then rise. The electric slide 21 is driven by the output end of the motor inside the fixed rod 2 to rotate toward the detection platform 9, and the semiconductor wafer is placed in the square groove of the detection platform 9 for manual detection. At the same time, the detection platform 9 generates a slight downward pressure under the gravity of the semiconductor wafer. The bubble level 8 is gradually displaced downward slightly, and the bubble level 8 presses the telescopic end of the elastic telescopic rod 7 to move downward synchronously. When the semiconductor wafer deviates from the center position of the detection table 9, the bubble level 8 rotates slightly, and the elastic telescopic rod 7 and the bubble level 8 are hinged, so it does not affect the rotation of the bubble level 8. At this time, the bubble inside the bubble level 8 leaves its own center position, and the inspection personnel manually or with the help of tools moves the semiconductor wafer in position, observes the position of the bubble inside the bubble level 8 to make the semiconductor wafer in the center position of the detection table 9, and starts the motor on the back of the protective plate 6. The output end of the motor drives the reciprocating screw 14 to rotate, and the reciprocating screw 14 rotates through the reciprocating spiral groove on its outer wall to align the fill light component 15 is limited, and the internal block of the fill light component 15 constantly contacts the inner wall of the reciprocating spiral groove. Therefore, when the reciprocating screw rod 14 rotates, the fill light component 15 slides forward along the bottom of the detection table 9, and the square groove of the detection table 9 is filled with light through the light transmittance of the detection table 9. Through the above cooperation, the detection personnel can quickly locate the semiconductor wafer through the bubble orientation, thereby shortening the central observation time, and the fill light effect of the fill light component 15 makes the semiconductor wafer bright and transparent during detection, which is convenient for the staff to find out whether there are defects in time; when the electric slide rail 21 rotates, it will resist the arc surface of the spring piece 13 to generate a resistance force, and the spring piece 13 will be deformed by the resistance force. When the spring piece 13 is no longer deformed, the electric slide rail 21 is The resistance feedback stops the rotation through the set intelligence level, and at the same time, the spring piece 13 pushes the scale plate 12 to move away from the center of the L-shaped plate 11 and expand. At this time, the vertical rod 10 limits the L-shaped plate 11. After the detection is completed, the spring piece 13 resets and drives the scale plate 12 to reset. Then the electric slide rail 21 puts the qualified material back to the conveying component 1 for transportation, and the unqualified material electric slide rail 21 rotates in the opposite direction to be discarded. Through the above cooperation, the extension range of the scale plate 12 is expanded to facilitate the staff to determine the power-off discharge position of the electric suction cup 23, speed up the inspection preparation work of the semiconductor wafer, avoid the need for staff to position the semiconductor wafer multiple times when placing the semiconductor wafer, reduce the detection efficiency, and avoid the semiconductor wafer from being damaged by collision.
[0032] See also Figure 1-Figure 9, based on the above embodiment, another embodiment of the present invention further includes a radiation protection device 4;
[0033] The radiation protection device 4 includes a flat plate 41, an L-shaped light baffle plate 42, a cylinder 43 and an insulating wheel 44. The back of the flat plate 41 is fixedly installed on the front of the protective plate 6, and the flat plate 41 is located below the detection table 9. The L-shaped light baffle plate 42 is fixedly installed on the outer wall of the fill light component 15 near the center of the flat plate 41. A square groove is opened on the inner side of the L-shaped light baffle plate 42, and the outer wall of the L-shaped light baffle plate 42 is located inside the slide groove of the detection table 9. The upper and lower ends of the cylinder 43 are fixedly installed inside the square groove of the L-shaped light baffle plate 42. The outer wall of the cylinder 43 is rotatably installed with an insulating wheel 44. Through the above cooperation, the L-shaped light baffle plate 42 is prompted to block the light source inside the square groove of the detection table 9 to prevent the light source from scattering and irradiating other components to produce shadows that affect the judgment of the detection personnel, and the insulating wheel 44 rolls in contact with the outer wall of the semiconductor wafer to ensure that the semiconductor wafer is always in a centered position during the detection process.
[0034] The radiation protection device 4 also includes a transmission plate 45, a rotating wheel 46, a rotating rod 47 and a plurality of shielding plates 48. The top of the transmission plate 45 is hinged to the bottom of the L-shaped light blocking plate 42. A torsion spring is arranged between the top of the transmission plate 45 and the bottom of the L-shaped light blocking plate 42. The rotating wheel 46 is rotatably mounted on the inner wall of the transmission plate 45 away from the center of the flat plate 41. The left and right ends of the rotating rod 47 are fixedly mounted at the center of the inner wall of the rotating wheel 46. A plurality of shielding plates 48 are equidistant and fixedly mounted on the outer wall surface of the rotating rod 47. Through the above cooperation, when the shielding plate 48 rotates, the metal shielding coating on its outer wall absorbs high-energy particles emitted when radioactive materials such as uranium or thorium inside the semiconductor wafer decay, thereby reducing the content of radioactive materials in the working area and providing protection for the health of the inspectors to a certain extent.
[0035] The outer wall of the rotating wheel 46 contacts the top surface of the flat plate 41, the outer wall of the rotating rod 47 is provided with an arc groove, the outer wall of the shielding plate 48 is coated with a metal shielding layer, and a marking device 5 is arranged inside the L-shaped light blocking plate 42 for low-temperature treatment of the sampled material as a mark to calculate the material yield.
[0036] When in use, the fill light assembly 15 slides forward and when it is reset, it drives the L-shaped light blocking plate 42 to slide synchronously inside the slide groove of the detection platform 9, and the L-shaped light blocking plate 42 moves synchronously with the fill light assembly 15 to block the light source. At the same time, the L-shaped light blocking plate 42 drives the cylinder 43 to move synchronously, and the cylinder 43 drives the insulating wheel 44 to move synchronously. The outer wall of the insulating wheel 44 contacts the outer wall of the semiconductor wafer to generate friction, prompting the insulating wheel 44 to rotate along the outer wall of the cylinder 43. Through the above cooperation, the L-shaped light blocking plate 42 blocks the light source inside the square groove of the detection platform 9, preventing the light source from scattering and irradiating other components to generate shadows that affect the judgment of the detection personnel, and the insulating wheel 44 rolls in contact with the outer wall of the semiconductor wafer. The wall ensures that the semiconductor wafer is always in the center during the inspection process; when the L-shaped light blocking plate 42 moves, it drives the transmission plate 45 to move synchronously, and the transmission plate 45 drives the rotating wheel 46 to slide synchronously along the top of the flat plate 41. The rotating wheel 46 contacts the top of the flat plate 41 to generate friction and starts to rotate. When the rotating wheel 46 rotates, it drives the rotating rod 47 to rotate, and when the rotating rod 47 rotates, it drives the shielding plate 48 to rotate. Through the above cooperation, when the shielding plate 48 rotates, the metal shielding coating on its outer wall absorbs the high-energy particles emitted when the radioactive substances such as uranium or thorium inside the semiconductor wafer decay, thereby reducing the content of radioactive substances in the working area and providing protection for the health of the inspectors to a certain extent.
[0037] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes a marking device 5;
[0038] The marking device 5 includes a cam 51, a resistance rod 52, a hinged rod 53, an inclined rod 54, a low-temperature component 55 and a circular frame 56. The cam 51 is fixedly installed on the outer wall surface of the rotating rod 47. The resistance rod 52 is located at the top of the cam 51, and a ring is fixedly installed on the outer wall of the resistance rod 52. The hinged rod 53 is fixedly installed on the outer wall of the ring of the resistance rod 52 near the center of the rotating rod 47, and the hinged rod 53 is fixedly connected to the side away from the center of the rotating rod 47. The bottom of the inclined rod 54 is hinged to the top of the resistance rod 52, the bottom of the low-temperature component 55 is hinged to the top of the inclined rod 54, the bottom of the circular frame 56 is slidably installed on the bottom of the inner wall of the L-shaped light baffle 42, and the back of the low-temperature component 55 is fixedly installed on the front of the circular frame 56. Through the above cooperation, the activity range of the low-temperature component 55 is expanded, and the semiconductor wafers under inspection are marked for cooling. Later, statisticians will count the low-temperature semiconductor wafers that have not been discarded, and then roughly estimate the yield rate in the semiconductor wafer production process based on the total production volume to facilitate whether the production process needs to be improved.
[0039] The marking device 5 also includes an octagonal plate 57, a transmission rod 58 and a sliding ring 59. The bottom of the octagonal plate 57 is rotatably installed on the bottom of the inner wall of the L-shaped light-blocking plate 42, and the outer wall of the octagonal plate 57 contacts the outer wall of the circular frame 56. The bottom of the transmission rod 58 is fixedly installed on the top of the octagonal plate 57. A spiral groove is provided on the outer wall of the transmission rod 58. The inner wall of the sliding ring 59 is sleeved and slidably installed on the outer wall surface of the transmission rod 58.
[0040] The marking device 5 also includes a reset frame 510, a movable plate 511 and a hinged plate 512. The reset frame 510 is fixedly installed on the outer wall of the fill light component 15 near the center of the detection platform 9. A connecting plate is installed inside the reset frame 510 through spring sliding, and the inside of the connecting plate passes through and is fixedly installed on the outer wall surface of the sliding ring 59. The bottom of the movable plate 511 is fixedly installed on the top of the sliding ring 59. The top of the hinged plate 512 is hinged to the bottom of the detection platform 9 through a torsion spring, and the bottom of the hinged plate 512 is located on the movement trajectory of the movable plate 511. Through the above coordination, the cold air emitted by the low-temperature component 55 is evenly dispersed to avoid concentrated cooling, which causes the temperature of the semiconductor wafer to be too low and mix with the heat to generate mist, thereby avoiding blurring during semiconductor wafer detection. At the same time, the gas around the detection platform 9 and the cold air emitted by the low-temperature component 55 are evenly mixed, so that the semiconductor wafer is cooled faster and at a lower temperature within the same period of time, thereby improving the marking effect.
[0041] When in use, the rotating rod 47 rotates and drives the cam 51 to rotate. When the cam 51 rotates, the protrusion pushes the contact rod 52 to move upward. The contact rod 52 is restricted by the outer wall ring of the hinge rod 53, so that the contact rod 52 can only move up and down. When the contact rod 52 moves upward, it drives the inclined rod 54 to move synchronously. The hinge shaft between the inclined rod 54 and the low-temperature component 55 starts to rotate, causing the inclined rod 54 to push the low-temperature component 55 to move away from the center of the fill light component 15. The low-temperature component 55 drives the circular frame 56 to move along the bottom of the inner wall of the L-shaped light blocking plate 42 The above cooperation expands the range of activity of the low-temperature component 55, and the semiconductor wafers under inspection are marked for temperature reduction. Later, the statisticians will count the low-temperature semiconductor wafers that have not been discarded, and then roughly estimate the yield rate of the semiconductor wafer production process based on the total production volume to facilitate whether the production process needs to be improved; when the circular frame 56 slides, it contacts the outer wall of the octagonal plate 57 and generates friction to prompt the octagonal plate 57 to rotate gradually. When the octagonal plate 57 rotates, it drives the transmission rod 58 to rotate. When the transmission rod 58 rotates, it passes through its own outer wall non-automatic The locking spiral groove restricts the sliding ring 59. The built-in block of the sliding ring 59 contacts the inner wall of the spiral groove to drive the sliding ring 59 to slide upward along the outer wall of the driving rod 58 when the transmission rod 58 rotates. The sliding ring 59 drives the movable plate 511 to move synchronously. The top of the movable plate 511 contacts the hinge plate 512 to cause a resistance force. The hinge plate 512 causes the hinge shaft at the bottom of the inspection table 9 to start rotating through the resistance force. At this time, the bottom of the hinge plate 512 slides in an arc shape along the top of the movable plate 511, and then the reset frame 510 is reset by the built-in spring. The elastic force causes the connecting plate to reset, and the connecting plate drives the sliding ring 59 to reset, and the reciprocating motion of the movable plate 511 and the hinged plate 512 is caused to reciprocate. Through the above coordination, the cold air emitted by the low-temperature component 55 is evenly dispersed to avoid concentrated cooling, which causes the semiconductor wafer temperature to be too low and mix with heat to generate mist, thereby avoiding blurring during semiconductor wafer inspection. At the same time, the gas around the inspection table 9 is evenly mixed with the cold air emitted by the low-temperature component 55, which causes the semiconductor wafer to cool down faster and at a lower temperature within the same period of time, thereby improving the marking effect.
[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A semiconductor device production sampling inspection device, comprising a conveying component (1), the conveying component (1) is connected by an external pulley transmission, the outer wall of the conveying component (1) is equidistantly provided with a plurality of partitions (101), a fixed rod (2) is provided on the back of the conveying component (1), a motor is provided inside the fixed rod (2), an electric slide rail (21) is provided on the top of the motor output end inside the fixed rod (2), a telescopic component (22) is slidably installed inside the electric slide rail (21), an electric suction cup (23) is provided at the bottom of the telescopic end of the telescopic component (22), the electric suction cup (23) is located above the conveying component (1), a long board (3) is provided at the bottom of the fixed rod (2), and a slider is provided on the top of the long board (3), characterized in that: A protective plate (6) is fixedly installed at the top edge of the long board (3), a motor is arranged on the back of the protective plate (6), four elastic telescopic rods (7) are hinged on the top of the slider of the long board (3), two of the four elastic telescopic rods (7) form a group, and the elastic telescopic rods (7) are composed of a fixed end and a telescopic end, a bubble level (8) is hinged on the top of the telescopic end of the elastic telescopic rod (7), a detection platform (9) is fixedly installed on the top of the bubble level (8), and a square groove is opened at the center of the detection platform (9), the front and back of the inner wall of the square groove are matched with the diameter of the semiconductor wafer, and a slide groove is opened inside the detection platform (9), The detection platform (9) is light-transmissive, a vertical rod (10) is fixedly mounted at the top edge of the detection platform (9), an L-shaped plate (11) is fixedly mounted on the top of the vertical rod (10), the L-shaped plate (11) is hollow in design, two scale plates (12) are slidably mounted inside the L-shaped plate (11) via springs, a spring sheet (13) is fixedly mounted on the front of the scale plate (12), the arc surface of the spring sheet (13) is located on the left motion track of the electric slide rail (21), a reciprocating screw rod (14) is fixedly mounted on the motor output end on the back of the protective plate (6), and a fill light component (15) is sleeved and slidably mounted on the outer wall of the reciprocating screw rod (14); When the electric slide rail (21) rotates, it will contact the arc surface of the spring sheet (13) to generate a resistance force. The spring sheet (13) is deformed by the resistance force. When the spring sheet (13) is no longer deformed, the electric slide rail (21) receives resistance feedback and stops rotating through a set intelligent program. At the same time, the spring sheet (13) pushes the scale plate (12) to move away from the center of the L-shaped plate (11). At this time, the vertical rod (10) limits the L-shaped plate (11). After the detection is completed, the spring sheet (13) is reset to drive the scale plate (12) to reset. After that, the electric slide rail (21) puts the qualified material back into the conveying component (1) for conveying. The unqualified material is discarded by the electric slide rail (21) rotating in the opposite direction. Through the above cooperation, the extension range of the scale plate (12) is expanded to facilitate the staff to determine the power-off discharge direction of the electric suction cup (23), speed up the inspection preparation of semiconductor wafers, avoid the need for the staff to position the semiconductor wafers multiple times when placing the semiconductor wafers, reduce the inspection efficiency, and avoid the semiconductor wafers from being damaged by collision.
2. A semiconductor device production sampling inspection device according to claim 1, characterized in that: The two scale plates (12) are symmetrically distributed about the axis of the L-shaped plate (11); one front end of the reciprocating screw rod (14) penetrates the interior of the protective plate (6); the top of the fill light component (15) is slidably mounted on the bottom of the detection platform (9); and radiation protection devices (4) for absorbing high-energy particles emitted when uranium or thorium radioactive materials decay inside the semiconductor wafer are arranged on the left and right sides of the fill light component (15).
3. A semiconductor device production sampling inspection device according to claim 2, characterized in that: The radiation protection device (4) comprises a flat plate (41), an L-shaped light blocking plate (42), a cylinder (43) and an insulating wheel (44); the back of the flat plate (41) is fixedly mounted on the front of the protective plate (6); the flat plate (41) is located below the detection platform (9); the L-shaped light blocking plate (42) is fixedly mounted on the outer wall of the fill light assembly (15) near the center of the flat plate (41); a square groove is formed on the inner side of the L-shaped light blocking plate (42); the outer wall of the L-shaped light blocking plate (42) is located inside the slide groove of the detection platform (9); the upper and lower ends of the cylinder (43) are fixedly mounted inside the square groove of the L-shaped light blocking plate (42); and the outer wall of the cylinder (43) is rotatably mounted with an insulating wheel (44).
4. A semiconductor device production sampling inspection device according to claim 3, characterized in that: The radiation protection device (4) further comprises a transmission plate (45), a rotating wheel (46), a rotating rod (47) and a plurality of shielding plates (48); the top of the transmission plate (45) is hinged to the bottom of the L-shaped light shielding plate (42); a torsion spring is provided between the top of the transmission plate (45) and the bottom of the L-shaped light shielding plate (42); the rotating wheel (46) is rotatably mounted on the inner wall of the transmission plate (45) at a side away from the center of the flat plate (41); the left and right ends of the rotating rod (47) are fixedly mounted at the center of the inner wall of the rotating wheel (46); and the plurality of shielding plates (48) are equidistantly and fixedly mounted on the outer wall surface of the rotating rod (47).
5. A semiconductor device production sampling inspection device according to claim 4, characterized in that: The outer wall of the rotating wheel (46) contacts the top surface of the flat plate (41), the outer wall of the rotating rod (47) is provided with an arc-shaped groove, the outer wall of the shielding plate (48) is coated with a metal shielding layer, and a marking device (5) is provided inside the L-shaped light shielding plate (42) for performing low-temperature treatment on the sampled material as a mark to calculate the material yield rate.
6. A semiconductor device production sampling inspection device according to claim 5, characterized in that: The marking device (5) comprises a cam (51), a resisting rod (52), a hinged rod (53), an inclined rod (54), a low-temperature assembly (55) and a circular frame (56); the interior of the cam (51) is fixedly mounted on the outer wall surface of the rotating rod (47); the resisting rod (52) is located at the top of the cam (51); and a collar is fixedly mounted on the outer wall of the resisting rod (52); the hinged rod (53) is fixedly mounted on the outer wall of the collar of the resisting rod (52) on a side close to the center of the rotating rod (47); and the hinged rod (53) is fixedly connected on a side away from the center of the rotating rod (47); the bottom of the inclined rod (54) is hinged to the top of the resisting rod (52); the bottom of the low-temperature assembly (55) is hinged to the top of the inclined rod (54); the bottom of the circular frame (56) is slidably mounted on the bottom of the inner wall of the L-shaped light blocking plate (42); and the back of the low-temperature assembly (55) is fixedly mounted on the front of the circular frame (56).
7. A semiconductor device production sampling inspection device according to claim 6, characterized in that: The marking device (5) further comprises an octagonal plate (57), a transmission rod (58) and a sliding ring (59); the bottom of the octagonal plate (57) is rotatably mounted on the bottom of the inner wall of the L-shaped light blocking plate (42); the outer wall of the octagonal plate (57) contacts the outer wall of the circular frame (56); the bottom of the transmission rod (58) is fixedly mounted on the top of the octagonal plate (57); the outer wall of the transmission rod (58) is provided with a spiral groove; the inner wall of the sliding ring (59) is sleeved and slidably mounted on the outer wall surface of the transmission rod (58).
8. A semiconductor device production sampling inspection device according to claim 7, characterized in that: The marking device (5) further comprises a reset frame (510), a movable plate (511) and a hinged plate (512); the reset frame (510) is fixedly mounted on the outer wall of the fill light assembly (15) near the center of the detection platform (9); a connecting plate is slidably mounted inside the reset frame (510) via a spring, and the connecting plate penetrates through the inside of the connecting plate and is fixedly mounted on the outer wall surface of the sliding ring (59); the bottom of the movable plate (511) is fixedly mounted on the top of the sliding ring (59); the top of the hinged plate (512) is hinged to the bottom of the detection platform (9) via a torsion spring, and the bottom of the hinged plate (512) is located on the movement trajectory of the movable plate (511).