A plastic packaging device for patch components and a manufacturing method for patch components

Abstract

The invention discloses a patch component plastic sealing device and a patch component manufacturing method, and relates to the field of patch component manufacturing technology. The invention comprises a control main platform, wherein the upper surface of the control main platform located at the left end thereof is provided with a plastic sealing component for plastic sealing the outside of a chip; the invention first controls the cylinder to drive the inner template to move upward when it is started, and the upward movement of the inner template can drive the plastic sealing chip to move upward, and when the plastic sealing chip is fully moved to the outside of a lower mold groove, the automatic demoulding of the chip is quickly completed, thereby greatly improving the user experience, and then controls the stepper motor to start, and the stepper motor can drive the main drive gear to rotate when it is started, and the rotation of the main drive gear can drive the gear ring and the inner cylinder to rotate at the same time, and the rotation of the inner cylinder can drive the turntable to rotate, and the rotation of the turntable can drive the demoulding chip to rotate, thereby quickly completing the transportation of the chip, and further improving the production efficiency of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field related to the manufacture of patch components, and in particular to a patch component plastic packaging device and a method for manufacturing the patch components. Background Art

[0002] SMD products are an important part of compact circuit design because of their thinness. However, the heat dissipation performance of SMD packaging is a major factor restricting its application. In order to meet the application of the circuit, sometimes the performance of the components to be selected must be much greater than the actual requirements, which results in a waste of resources. Among them, the SMD component packaging form is a packaging form of semiconductor devices.

[0003] At present, the production process of chip components includes processes such as die bonding, bonding, and plastic sealing. Most of the existing plastic sealing devices for chip components insert the chip into the lower mold groove, and the staff needs to manually take it out after compression molding. Since the chip is small, manual removal is more troublesome, and the existing plastic sealing device lacks a demolding structure, which greatly reduces the production efficiency of the chip. At the same time, the existing component plastic sealing device is inconvenient when collecting the plastic-sealed chips, which reduces the user experience of the staff. Summary of the invention

[0004] In order to solve the defects of the prior art, the present invention provides a patch component plastic packaging device and a method for manufacturing the patch component.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The present invention discloses a plastic sealing device for patch components, comprising a control main platform, wherein a plastic sealing component is arranged on the upper surface of the control main platform at the left end thereof, and is used for plastic sealing the outside of the chip;

[0007] The plastic sealing assembly includes an outer cylinder, the bottom of the outer cylinder is fixedly connected to the left side of the upper surface of the control main platform, the inner wall of the outer cylinder at the upper end is sleeved with a bearing 1, the inner wall of the bearing 1 located at the inner ring is fixedly sleeved with an inner cylinder, the inner wall of the inner cylinder at the lower end is connected with a gear ring, the outer cylinder is installed with a stepper motor at the left side of the bottom surface of the inner cavity, the stepper motor is installed with a main drive gear meshing with the gear ring at the upper end, and the top of the inner cylinder is connected with a turntable;

[0008] The upper surface of the control main platform at the right end is provided with a discharge assembly for automatically discharging and collecting plastic-encapsulated chips;

[0009] The unloading assembly includes a baffle ring, the bottom of which is fixedly connected to the inner side of the upper surface of the turntable, the inner wall of the baffle ring is equidistantly provided with a plurality of alignment holes, twelve in number, a frame plate is connected to the right side of the bottom surface of the inner cavity of the outer cylinder, a column is inserted into the hole at the upper end of the frame plate, the right end of the column is fixedly connected to an unloading block, and a spring is sleeved on the outside of the right end of the column.

[0010] As a preferred technical solution of the present invention, the plastic packaging assembly also includes a lower mold groove, which is equidistantly arranged on the upper surface of the turntable, and the inner walls at both ends of the lower mold groove are connected to two pin brackets, and the bottom surface of the inner cavity of the lower mold groove is provided with a stepped hole, and the inner cavity of the stepped hole is inserted with a driven support rod, and the upper ends of the driven support rods are fixedly connected to the inner mold plate, and the lower ends of the driven support rods are fixedly connected to the lower follower ring, and the outer wall of the lower follower ring is fixedly sleeved with bearing 2, and the outer wall of the outer cylinder is located on its left side outer wall with cylinder 1 installed, and the upper end of cylinder 1 is fixedly connected to the left side outer wall of bearing 2.

[0011] As a preferred technical solution of the present invention, a rear bracket is fixedly connected to the upper left corner of the upper surface of the main control platform, and a cylinder 2 is installed in front of the upper surface of the rear bracket, and a carrier plate is fixedly connected to the lower end of the cylinder 2, and branch material boxes are equidistantly connected to the periphery of the lower surface of the carrier plate, and the two side surfaces of the branch material box at the upper end are respectively connected by docking pipes, and an upper module is fixedly connected to the middle of the lower surface of the branch material box.

[0012] As a preferred technical solution of the present invention, four slots are provided on both sides of the upper module and located on the lower surface of the branch material box, the top surfaces of the inner cavities of the slots are fixedly connected with positioning springs, the lower ends of the positioning springs are fixedly connected with four positioning blocks, the upper surfaces of the contact positions of the carrier plate and the branch material box are provided with insertion holes, and the lower surfaces of the branch material box and the upper module are provided with injection holes.

[0013] As a preferred technical solution of the present invention, the inner cavities of the injection hole and the socket are both plugged with sealing columns, the upper ends of the sealing columns are fixedly connected with upper slave rings, cylinder three is installed on the upper surface of the right end of the carrier plate, and the right end of cylinder three is fixedly connected to the upper surface of the right end of the upper slave ring, the rear of the upper surface of the rear bracket is fixedly connected with a main material box, a liquid pump is arranged between the main material box and cylinder two, the liquid suction port at the top of the liquid pump is connected to the front of the main material box through a main suction pipe, and the discharge port at the front end of the liquid pump is connected to the upper surface of the rearmost branch material box.

[0014] As a preferred technical solution of the present invention, the unloading assembly also includes a servo motor, which is installed on the right side of the upper surface of the control main platform. The upper end of the servo motor is fixedly connected to a carrier, and the upper surface of the carrier away from one end is provided with a clamping hole, and the inner cavity of the clamping hole is plugged with a carrier column, and the outer part of the upper end of the carrier column is sleeved with a spring 2, and the upper end of the carrier column is fixedly connected to a collection box, and the inner wall of the collection box away from one end is fixedly connected to two limit plates, and a pressure sensor is arranged on the left side of the servo motor, and the pressure sensor is installed on the upper surface of the control main platform.

[0015] As a preferred technical solution of the present invention, the widths of the two inner grooves of the pin bracket are both .mm, and the widths of the two outer grooves are .mm and .mm respectively.

[0016] As a preferred technical solution of the present invention, the front and rear inner walls of the alignment hole are both arc surfaces, and the right end surface of the unloading block is a semicircular arc plate.

[0017] As a preferred technical solution of the present invention, a chamfer is provided at the periphery of the upper surface of the turntable.

[0018] A method for manufacturing a patch component comprises the following steps:

[0019] S1. Die bonding: We first need to reheat the conductive adhesive in an environment of 25°C. After reheating, we use equipment to automatically bond the die. After bonding, the product is baked in an environment of 195°C for 2 hours. The manufacturing is carried out in a Class 10,000 clean workshop.

[0020] S2. Bonding: The chip pad is then bonded to the corresponding frame pins with copper wire. In production, the welding time, current, pressure and arc need to be strictly controlled in combination with the thickness of the product. The frame pins of the solid crystal are led out from the middle of the body. The bonding process is carried out in a Class 10,000 clean workshop.

[0021] S3. Plastic sealing: First, the plastic sealing component performs compression molding and plastic sealing on the chip, and then automatically removes the plastic sealed chip from the mold. Then, the unloading component pushes and collects the plastic sealed chips removed from the mold, and automatically adjusts the replacement of the collection box, so as to facilitate the staff to clean the plastic sealed chips in the collection box;

[0022] S4. Molding: In order to make the heat sink and pins of the product fit with the circuit board to facilitate heat dissipation, the designed pin standing height is 0.5-0.99mm. Since the No. 3 pin is a wide pin, the problem of balanced force during molding must be considered. Therefore, the whole molding process is divided into cutting, pre-molding, molding and separation;

[0023] S5. Test and sorting: First, the formed and separated products are put into the vibration plate, and then sent into the track by the vibration plate. The products are sucked from the track to the turntable by a suction nozzle. After entering the turntable, the direction is selected, the appearance is inspected, and the standing degree of the pins is inspected. After passing the inspection, they enter the parameter test. Products with poor appearance and poor parameters enter the corresponding classification positions. Products with qualified appearance and electrical parameters enter the carrier packaging.

[0024] The beneficial effects of the present invention are:

[0025] 1. This type of SMD component plastic sealing device, through the provision of cylinder 2, cylinder 3 and liquid pump, first control cylinder 2 to start, it can drive the upper module and the positioning block to enter the lower mold groove at the same time, when the positioning block and the pins on the chip are fully squeezed, the positioning of the chip is completed, and then control the liquid pump to start to transfer the plastic sealing solution to the rear branch material box, and then the docking tube will transfer the plastic sealing solution to the interior of multiple branch material boxes respectively, then control cylinder 3 to start, cylinder 3 start can drive the upper slave ring and the sealing column to move upward at the same time, when the lower end of the sealing column is sufficiently away from the injection hole When the upper die is filled with plastic, the upper die is pressed into the cavity, and the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity. When the upper die is filled with plastic, the upper die is pressed into the cavity.

[0026] 2. This chip component plastic sealing device, through the provided cylinder 1 and stepper motor, first controls the cylinder 1 to start, which can drive the inner template to move upward, and the inner template moving upward can drive the plastic-sealed chip to move upward, and when the plastic-sealed chip is fully moved to the outside of the lower mold groove, the chip is automatically demolded quickly, which greatly improves the user experience, and then controls the stepper motor to start, which can drive the main drive gear to rotate, and the rotation of the main drive gear can drive the gear ring and the inner cylinder to rotate at the same time, and the rotation of the inner cylinder can drive the turntable to rotate, and the rotation of the turntable can drive the demolded chip to rotate, so that the chip can be quickly transported, and the production efficiency of the chip is further improved.

[0027] 3. This type of plastic sealing device for patch components, through the set unloading assembly, first starts the turntable and the retaining ring through the stepper motor to rotate synchronously. When the alignment hole on the retaining ring corresponds to the position of the unloading block, the spring will push the unloading block to quickly enter the alignment hole and push the demolded chip to the right. The chip moving to the right will automatically fall into the inside of the collection box. At this time, the automatic unloading of the chip is quickly completed, thereby effectively improving the manufacturing rate of the chip. When the chip enters the inside of the collection box, it will drive the carrier column to move downward. When the bottom of the carrier column is in full contact with the pressure sensor, the pressure sensor will control the servo motor to start. The servo motor start can drive the carrier column and the collection box to rotate 90° at the same time. In this way, the replacement of the fully loaded collection box can be quickly completed, thereby effectively ensuring that the unloading assembly can be used continuously, thereby greatly improving the practicality of the plastic sealing device for patch components. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0029] Figure 1 It is a schematic diagram of the structure of the present invention;

[0030] Figure 2 It is a right side view of the present invention;

[0031] Figure 3 is a cross-sectional view of the turntable of the present invention after rotating 15°;

[0032] Figure 4 is a front cross-sectional view of the present invention;

[0033] Figure 5 is an oblique cross-sectional view of a carrier plate of the present invention;

[0034] Figure 6 is a side cross-sectional view of the present invention;

[0035] Figure 7 is a cross-sectional view of a portion of the structure of the present invention;

[0036] Figure 8 is a cross-sectional view of the alignment hole of the present invention;

[0037] Fig. 9 The present invention Figure 3 The enlarged view of point A in the middle;

[0038] Fig.10 The present invention Figure 4 The enlarged view of point B in the middle;

[0039] Fig.11 The present invention Figure 5 Enlarged view of point C in the middle;

[0040] Fig.12 The present invention Figure 7 The enlarged view of point D in the middle;

[0041] Fig.13 The present invention Figure 7 Enlarged view of point E in the middle;

[0042] Fig.14 The present invention Figure 8 The enlarged view of F in the middle;

[0043] Fig.15 It is a three-view drawing of the patch product of the present invention;

[0044] Fig.16 It is a back view of the patch product of the present invention.

[0045] In the figure: 1. Control main platform; 2. Plastic packaging assembly; 201. Outer cylinder; 202. Bearing 1; 203. Inner cylinder; 204. Gear ring; 205. Stepper motor; 206. Main drive gear; 207. Turntable; 208. Lower die groove; 209. Pin bracket; 210. Step hole; 211. Follower support rod; 212. Inner template; 213. Lower follower ring; 214. Bearing 2; 215. Cylinder 1; 216. Rear bracket; 217. Cylinder 2; 218. Carrier; 219. Branch material box; 220. Butt pipe; 221. Upper module; 222. Slot; 223. Adaptor 1. Position spring; 224. Positioning block; 225. Socket; 226. Injection hole; 227. Sealing column; 228. Upper follower ring; 229. Cylinder three; 230. Main material box; 231. Suction pump; 232. Main suction pipe; 233. Infusion pipe; 3. Unloading assembly; 301. Retaining ring; 302. Alignment hole; 303. Shelf; 304. Plug column; 305. Unloading block; 306. Spring one; 307. Servo motor; 308. Carrier; 309. Clamp hole; 310. Carrier column; 311. Spring two; 312. Collecting box; 313. Limit plate; 314. Pressure sensor. DETAILED DESCRIPTION

[0046] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0047] Example: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, a plastic sealing device for patch components of the present invention comprises a control main platform 1, and a plastic sealing component 2 is arranged on the upper surface of the control main platform 1 at its left end, which is used to plastic seal the outside of the chip; the plastic sealing component 2 comprises an outer cylinder 201, and the bottom of the outer cylinder 201 is fixedly connected to the left side of the upper surface of the control main platform 1, and the inner wall of the outer cylinder 201 at its upper end is sleeved with a bearing 202, and the inner wall of the bearing 202 at its inner ring is fixedly sleeved with an inner cylinder 203, and the inner wall of the inner cylinder 203 at its lower end is connected with a gear ring 204, and the outer cylinder 201 is installed with a stepper motor 205 on the left side of the bottom surface of the inner cavity, and the stepper motor 205 is installed at its upper end with a gear meshing with the gear ring 204 The main driving gear 206 is connected to the top of the inner cylinder 203 with a turntable 207; the upper surface of the control main platform 1 at its right end is provided with a discharge assembly 3 for automatically discharging and collecting the plastic-sealed chips; the discharge assembly 3 includes a retaining ring 301, the bottom of the retaining ring 301 is fixedly connected to the inner side of the upper surface of the turntable 207, and the inner wall of the retaining ring 301 is equidistantly provided with a plurality of alignment holes 302, and the number is twelve; the right side of the bottom surface of the inner cavity of the outer cylinder 201 is connected to a frame plate 303, and a column 304 is inserted in the hole at the upper end of the frame plate 303, and the right end of the column 304 is fixedly connected to an unloading block 305, and the outer side of the column 304 at its right end is sleeved with a spring 306.

[0048] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Fig. 9 , Fig.10 , Fig.12 and Fig.13As shown, the plastic packaging component 2 also includes a lower mold groove 208, which is equidistantly arranged on the upper surface of the turntable 207, and the inner walls of both ends of the lower mold groove 208 are connected to two pin brackets 209, and the bottom surface of the inner cavity of the lower mold groove 208 is provided with a stepped hole 210, and the inner cavity of the stepped hole 210 is plugged with a driven support rod 211, and the upper ends of the driven support rods 211 are fixedly connected to the inner mold plate 212, and the lower ends of the driven support rods 211 are fixedly connected to the lower follower ring 213, and the outer wall of the lower follower ring 213 is fixedly sleeved with a bearing 214, and the outer cylinder 201 is located at A cylinder 1 215 is installed on its left outer wall, and the upper end of the cylinder 1 215 is fixedly connected to the left outer wall of the bearing 2 214; a rear bracket 216 is fixedly connected to the upper left corner of the upper surface of the control main platform 1, and a cylinder 217 is installed on the rear bracket 216 in front of the upper surface of the control main platform 1, and a carrier plate 218 is fixedly connected to the lower end of the cylinder 217, and a branch material box 219 is equidistantly connected to the periphery of the lower surface of the carrier plate 218, and the two side surfaces of the branch material box 219 at its upper end are connected by a butt pipe 220 respectively, and the middle part of the lower surface of the branch material box 219 is fixedly connected The upper module 221 is connected; four slots 222 are provided on both sides of the upper module 221 and on the lower surface of the branch material box 219, and the top surface of the inner cavity of the slot 222 is fixedly connected with a suitable spring 223, and the lower end of the suitable spring 223 is fixedly connected with four positioning blocks 224, and the upper surface of the contact position of the carrier plate 218 and the branch material box 219 is provided with a plug hole 225, and the lower surface of the branch material box 219 and the upper module 221 is provided with an injection hole 226; the injection hole 226 and the inner cavity of the plug hole 225 are plugged with a sealing column 227, and the sealing column The upper end of 227 is fixedly connected with an upper slave ring 228, the upper surface of the right end of the carrier plate 218 is installed with a cylinder three 229, and the right end of the cylinder three 229 is fixedly connected to the upper surface of the right end of the upper slave ring 228, and the rear of the upper surface of the rear bracket 216 is fixedly connected with a main material box 230, and a liquid pump 231 is arranged between the main material box 230 and the cylinder two 217, and the liquid suction port at the top of the liquid pump 231 is connected to the front of the main material box 230 through the main suction pipe 232, and the discharge port at the front end of the liquid pump 231 is connected to the upper surface of the rearmost branch material box 219.

[0049] Among them, through the plastic sealing component 2 set up, first control cylinder 1 215 to start, which can drive the lower follower ring 213 and the driven support rod 211 to move upward at the same time, the driven support rod 211 moving upward can drive the inner template 212 to move upward, and the inner template 212 moving upward can drive the plastic sealing chip to move upward. When the plastic sealing chip is fully moved to the outside of the lower mold groove 208, the automatic demoulding of the chip is quickly completed, which greatly improves the user experience, and then control the stepper motor 205 to start, the stepper motor 205 starts to drive the main drive gear 206 to rotate, the main drive gear 206 rotates, and the ring gear 204 and the inner cylinder 203 rotate at the same time. The rotation of the inner cylinder 203 can drive the turntable 207 to rotate, and the rotation of the turntable 207 can drive the demoulding chip to rotate, so that the chip can be quickly transported, thereby effectively improving the production efficiency of the chip.

[0050] like Figure 2 , Figure 3 , Figure 8 , Fig. 9 , Fig.11 and Fig.14 As shown, the unloading assembly 3 also includes a servo motor 307, which is installed on the right side of the upper surface of the control main platform 1, and the upper end of the servo motor 307 is fixedly connected to a carrier 308, and the upper surface of the carrier 308 away from one end is provided with a clamping hole 309, and the inner cavity of the clamping hole 309 is plugged with a carrier column 310, and the outer portion of the upper end of the carrier column 310 is sleeved with a spring 2 311, and the upper end of the carrier column 310 is fixedly connected to a collection box 312, and the inner wall of the collection box 312 away from one end is fixedly connected with two limit plates 313, and a pressure sensor 314 is provided on the left side of the servo motor 307, and the pressure sensor 314 is installed on the upper surface of the control main platform 1.

[0051] Among them, through the unloading assembly 3, the stepper motor 205 is first started to drive the turntable 207 to rotate, and the rotation of the turntable 207 can drive the retaining ring 301 to rotate. When the alignment hole 302 on the retaining ring 301 corresponds to the position of the unloading block 305, the spring 306 will push the unloading block 305 to quickly enter the alignment hole 302 and push the demoulded chip to move to the right. The chip moving to the right will automatically fall into the inside of the collecting box 312. At this time, the automatic unloading of the chip is quickly completed, thereby effectively improving the manufacturing rate of the chip. When the chip is inserted into the chip, the column 310 is driven to move downward. When the bottom of the column 310 is in full contact with the pressure sensor 314, the pressure sensor 314 controls the servo motor 307 to start. The servo motor 307 can drive the carrier 308 to rotate 90°. The rotation of the carrier 308 by 90° can drive the column 310 and the material collection box 312 to rotate 90° at the same time. The pressure sensor 314 and the servo motor 307 are used in conjunction to quickly replace the fully loaded material collection box 312, thereby effectively ensuring that the unloading component 3 can be used continuously.

[0052] like Fig.13 As shown, the widths of the two inner grooves of the pin support 209 are both 0.35 mm, and the widths of the two outer grooves are 0.4 mm and 0.9 mm respectively.

[0053] Among them, the overall size of the product is 4*2.6mm, the thickness is 0.95mm, the plastic package body of the product is 2.6*2.6mm, the product contains 4 legs, the leg length is 0.6mm, among which the width of pins 1, 2, and 4 is 0.35-0.4mm, and the width of pin 3 is 0.9mm. It is connected to the heat sink on the back, and the minimum spacing between the heat sink and pins 1 and 2 is 0.8mm. The size of the heat sink mounted on the circuit board is 1.92*1.4mm, which is large enough to ensure sufficient packaging. The product's standing height is designed to be 0.05±0.05mm to ensure the reliability of the product during the mounting process; the overall circuit board area occupied by the product is 4*2.6mm, which is only 34.7% of the ESOP8, while the total heat dissipation area of ​​pin 3 and the heat sink on the back is 40% of the ESOP8 heat dissipation area. The product meets the packaging requirements of existing chips and greatly saves packaging materials and mounting area, so it can also reduce the packaging cost of the product. The design of the heat sink can achieve application scenarios with a dissipated power of more than 1.5w, which can meet the application of most products today. The product picture is as follows Fig.15 and Fig.16 .

[0054] like Figure 8 and Fig. 9 As shown, the front and rear inner walls of the alignment hole 302 are both arc surfaces, and the right end surface of the unloading block 305 is a semicircular arc plate.

[0055] Among them, the alignment hole 302 can facilitate the entry of the unloading block 305, and the rotation of the turntable 207 can facilitate the unloading block 305 to leave the inner cavity of the alignment hole 302, so that the unloading block 305 can continuously enter and exit the inner cavities of multiple alignment holes 302, thereby quickly completing the unloading of multiple plastic-encapsulated chips.

[0056] like Figure 2 and Fig. 9 As shown, the outer periphery of the upper surface of the rotating disk 207 is provided with a chamfer.

[0057] The chamfering can facilitate the plastic-encapsulated chip to quickly enter the interior of the collection box 312.

[0058] When working, first control cylinder 217 to start. When cylinder 217 starts, it can drive carrier plate 218 and branch material box 219 to move downward at the same time. When branch material box 219 moves downward, it can drive upper module 221 and positioning block 224 to enter lower mold groove 208 at the same time. When positioning block 224 is fully squeezed with the pins on the chip, the positioning of the chip is completed. Then control liquid pump 231 to start. When liquid pump 231 starts, it can drive main pumping tube 232 to transfer epoxy resin solution inside main material box 230 to inside of infusion tube 233. Infusion tube 233 then transfers plastic sealing solution to inside of branch material box 219 at the rear. Then, docking tube 220 will transfer plastic sealing solution to inside of multiple branch material boxes 219 respectively. At this time, control cylinder 3 229 to start. When cylinder 3 229 starts, it can drive upper slave ring 228 and sealing column 227 to move upward at the same time. When the lower end of sealing column 227 When the upper mold 221 is sufficiently far away from the inner cavity of the injection hole 226, the injection hole 226 can transfer the injection solution to the interior of the lower mold groove 208 respectively. The cooperation between the pin bracket 209 and the positioning block 224 can form a closed space between the upper module 221 and the lower mold groove 208. After the injection solution is injected, the cylinder three 229 is controlled to start again. The start of the cylinder three 229 can drive the upper follower ring 228 and the sealing column 227 to move downward at the same time. When the lower end of the sealing column 227 is fully moved to the inner cavity of the injection hole 226, the automatic closure of the injection hole 226 is quickly completed, so that the flatness of the upper surface of the chip during plastic sealing can be effectively guaranteed. Finally, the cylinder two 217 is controlled to start. The start of the cylinder two 217 can drive the carrier plate 218 and the branch material box 219 to move downward at the same time. The downward movement of the branch material box 219 can drive the upper module 221 to continue to extrude downward, so that the plastic sealing of the chip can be quickly completed.

[0059] Demolding: First, the air cylinder 215 is controlled to start, which can drive the lower follower ring 213 and the driven support rod 211 to move upward at the same time. The driven support rod 211 moves upward, which can drive the inner template 212 to move upward. The inner template 212 moves upward, which can drive the plastic-sealed chip to move upward. When the plastic-sealed chip is fully moved to the outside of the lower mold groove 208, the automatic demoulding of the chip is quickly completed, which greatly improves the user experience. Then, the stepper motor 205 is controlled to start. The stepper motor 205 starts and can drive the main drive gear 206 to rotate. The rotation of the main drive gear 206 can drive the gear ring 204 and the inner cylinder 203 to rotate at the same time. The rotation of the inner cylinder 203 can drive the turntable 207 to rotate. The rotation of the turntable 207 can drive the demoulded chip to rotate, so that the chip can be quickly transported.

[0060] Unloading: First, the stepper motor 205 is started to drive the turntable 207 to rotate. The turntable 207 rotates 15° each time. The rotation of the turntable 207 can drive the retaining ring 301 to rotate. When the alignment hole 302 on the retaining ring 301 corresponds to the position of the unloading block 305, the spring 306 will push the unloading block 305 to quickly enter the alignment hole 302 and push the demoulded chip to move to the right. The chip moving to the right will automatically fall into the inside of the collecting box 312. At this time, the automatic unloading of the chip is quickly completed, thereby effectively improving the manufacturing rate of the chip. The collecting box 312 When the chip enters the inside, it will drive the supporting column 310 to move downward. When the bottom of the supporting column 310 is in full contact with the pressure sensor 314, the pressure sensor 314 will control the servo motor 307 to start. The servo motor 307 can drive the carrier 308 to rotate 90° when it starts. The rotation of the carrier 308 by 90° will drive the supporting column 310 and the collection box 312 to rotate 90° at the same time. Through the coordinated use of the pressure sensor 314 and the servo motor 307, the replacement of the fully loaded collection box 312 can be quickly completed, thereby effectively ensuring that the unloading component 3 can be used continuously.

[0061] A method for manufacturing a patch component comprises the following steps:

[0062] S1. Die bonding: We first need to reheat the conductive adhesive in an environment of 25°C. After reheating, we use equipment to automatically bond the die. After bonding, the product is baked in an environment of 195°C for 2 hours. The manufacturing is carried out in a Class 10,000 clean workshop.

[0063] S2. Bonding: The chip pad is then bonded to the corresponding frame pins with copper wire. In production, the welding time, current, pressure and arc need to be strictly controlled in combination with the thickness of the product. The frame pins of the solid crystal are led out from the middle of the body. The bonding process is carried out in a Class 10,000 clean workshop.

[0064] S3. Plastic sealing: First, the plastic sealing component 2 performs compression molding on the chip, and then the plastic sealed chip is automatically demolded, and then the unloading component 3 pushes and collects the plastic sealed chip out of the mold, and automatically adjusts the replacement of the collection box 312, so as to facilitate the staff to clean the plastic sealed chip in the collection box 312;

[0065] S4. Molding: In order to make the heat sink and pins of the product fit with the circuit board to facilitate heat dissipation, the designed pin standing height is 0.5-0.99mm. Since the No. 3 pin is a wide pin, the problem of balanced force during molding must be considered. Therefore, the whole molding process is divided into cutting, pre-molding, molding and separation;

[0066] S5. Test and sorting: First, the formed and separated products are put into the vibration plate, and then sent into the track by the vibration plate. The products are sucked from the track to the turntable by a suction nozzle. After entering the turntable, the direction is selected, the appearance is inspected, and the standing degree of the pins is inspected. After passing the inspection, they enter the parameter test. Products with poor appearance and poor parameters enter the corresponding classification positions. Products with qualified appearance and electrical parameters enter the carrier packaging.

[0067] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plastic packaging device for patch components, comprising a control main station (1), characterized in that: The upper surface of the control main platform (1) at the left end thereof is provided with a plastic sealing component (2) for plastic sealing the outside of the chip; The plastic sealing component (2) comprises an outer cylinder (201), the bottom of the outer cylinder (201) is fixedly connected to the left side of the upper surface of the control main platform (1), the inner wall of the outer cylinder (201) at the upper end is sleeved with a bearing 1 (202), the inner wall of the inner ring of the bearing 1 (202) is fixedly sleeved with an inner cylinder (203), the inner wall of the inner cylinder (203) at the lower end is connected with a gear ring (204), the outer cylinder (201) is installed with a stepper motor (205) at the left side of the bottom surface of the inner cavity, the stepper motor (205) is installed with a main drive gear (206) meshing with the gear ring (204) at the upper end, and the top of the inner cylinder (203) is connected with a turntable (207); The plastic packaging component (2) also includes a lower mold groove (208), the lower mold groove (208) is equidistantly opened on the upper surface of the turntable (207), the inner walls at both ends of the lower mold groove (208) are connected to two pin brackets (209), the bottom surface of the inner cavity of the lower mold groove (208) is opened with a stepped hole (210), the inner cavity of the stepped hole (210) is inserted with a driven support rod (211), the upper end of the driven support rod (211) is fixedly connected to the inner mold plate (212), the lower end of the driven support rod (211) is fixedly connected to the lower follower ring (213), the outer wall of the lower follower ring (213) is fixedly sleeved with a second bearing (214), the outer cylinder (201) is located on its left outer wall with a cylinder one (215), and the upper end of the cylinder one (215) is fixedly connected to the left outer wall of the second bearing (214); A rear bracket (216) is fixedly connected to the upper left corner of the upper surface of the control main platform (1); a second cylinder (217) is installed in front of the rear bracket (216) on the upper surface; a carrier plate (218) is fixedly connected to the lower end of the second cylinder (217); a branch material box (219) is equidistantly connected to the periphery of the lower surface of the carrier plate (218); two side surfaces of the branch material box (219) at the upper end are connected via a butt joint (220); and an upper module (221) is fixedly connected to the middle of the lower surface of the branch material box (219); Four slots (222) are provided on both sides of the upper module (221) and on the lower surface of the branch material box (219); the top surfaces of the inner cavities of the slots (222) are fixedly connected with suitable springs (223); the lower ends of the suitable springs (223) are fixedly connected with four positioning blocks (224); the upper surfaces of the contact positions of the carrier plate (218) and the branch material box (219) are provided with insertion holes (225); and the lower surfaces of the branch material box (219) and the upper module (221) are provided with injection holes (226); The inner cavities of the injection hole (226) and the insertion hole (225) are both plugged with sealing columns (227), and the upper ends of the sealing columns (227) are both fixedly connected to the upper slave ring (228). The upper surface of the right end of the carrier plate (218) is installed with cylinder three (229), and the right end of cylinder three (229) is fixedly connected to the upper surface of the right end of the upper slave ring (228). The rear of the upper surface of the rear bracket (216) is fixedly connected to the main material box (230), and a liquid pump (231) is provided between the main material box (230) and cylinder two (217). The liquid pumping port at the top of the liquid pump (231) is connected to the front of the main material box (230) through a main pumping pipe (232), and the liquid discharge port at the front end of the liquid pump (231) is connected to the upper surface of the rearmost branch material box (219); The upper surface of the control main platform (1) at the right end thereof is provided with a discharge assembly (3) for automatically discharging and collecting plastic-encapsulated chips; The unloading assembly (3) comprises a retaining ring (301), the bottom of which is fixedly connected to the inner side of the upper surface of the rotating disk (207), the inner wall of which is equidistantly provided with a plurality of alignment holes (302), the number of which is twelve, the right side of the bottom surface of the inner cavity of the outer cylinder (201) being connected to a frame plate (303), a hole at the upper end of the frame plate (303) being inserted with a plug post (304), the right end of the plug post (304) being fixedly connected to a unloading block (305), and the outer portion of the plug post (304) at the right end being sleeved with a spring 1 (306).

2. A plastic packaging device for patch components according to claim 1, characterized in that: The unloading assembly (3) further comprises a servo motor (307), wherein the servo motor (307) is mounted on the right side of the upper surface of the control main platform (1), wherein the upper end of the servo motor (307) is fixedly connected to a carrier (308), wherein a clamping hole (309) is provided on the upper surface of the carrier (308) away from one end, wherein a carrier column (310) is inserted into the inner cavity of the clamping hole (309), wherein a spring 2 (311) is sleeved on the outer portion of the upper end of the carrier column (310), wherein the upper end of the carrier column (310) is fixedly connected to a material collection box (312), wherein two limit plates (313) are fixedly connected to the inner wall of the material collection box (312) away from one end, and wherein a pressure sensor (314) is provided on the left side of the servo motor (307), wherein the pressure sensor (314) is mounted on the upper surface of the control main platform (1).

3. A chip component plastic packaging device according to claim 1, characterized in that: The widths of the two inner grooves of the pin support (209) are both 0.35 mm, and the widths of the two outer grooves are respectively 0.4 mm and 0.9 mm.

4. The chip component plastic packaging device according to claim 1, characterized in that: The front and rear inner walls of the alignment hole (302) are both arc surfaces, and the right end surface of the unloading block (305) is a semicircular arc plate.

5. The chip component plastic packaging device according to claim 1, characterized in that: The outer periphery of the upper surface of the rotating disk (207) is provided with a chamfer.

6. A method for manufacturing a patch component, applicable to the patch component plastic packaging device according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1. Die bonding: We first need to reheat the conductive adhesive in an environment of 25°C. After reheating, we use equipment to automatically bond the die. After bonding, the product is baked in an environment of 195°C for 2 hours. The manufacturing is carried out in a Class 10,000 clean workshop. S2. Bonding: The chip pad is then bonded to the corresponding frame pins with copper wire. In production, the welding time, current, pressure and arc need to be strictly controlled in combination with the thickness of the product. The frame pins of the solid crystal are led out from the middle of the body. The bonding process is carried out in a Class 10,000 clean workshop. S3. Plastic sealing: First, the plastic sealing component performs compression molding and plastic sealing on the chip, and then automatically removes the plastic sealed chip from the mold. Then, the unloading component pushes and collects the plastic sealed chips removed from the mold, and automatically adjusts the replacement of the collection box, so as to facilitate the staff to clean the plastic sealed chips in the collection box; S4. Molding: In order to make the heat sink and pins of the product fit with the circuit board to facilitate heat dissipation, the designed pin standing height is 0.5-0.99mm. Since the No. 3 pin is a wide pin, the problem of balanced force during molding must be considered. Therefore, the whole molding process is divided into cutting, pre-molding, molding and separation; S5. Test and sorting: First, the formed and separated products are put into the vibration plate, and then sent into the track by the vibration plate. The products are sucked from the track to the turntable by a suction nozzle. After entering the turntable, the direction is selected, the appearance is inspected, and the standing degree of the pins is inspected. After passing the inspection, they enter the parameter test. Products with poor appearance and poor parameters enter the corresponding classification positions. Products with qualified appearance and electrical parameters enter the carrier packaging.

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