Chip bonding film and preparation method thereof, fingerprint sensor packaging structure

Abstract

The present invention provides a chip bonding film and a preparation method thereof, and a fingerprint sensor packaging structure. The chip bonding film comprises the following components by mass: 20 to 40 parts of spherical silica, 20 to 35 parts of polyphenol oxide resin, 20 to 30 parts of polyurethane modified epoxy resin, 15 to 20 parts of flexible epoxy resin, 1 to 4 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.3 to 0.5 parts of silane coupling agent, and 0.3 to 0.5 parts of leveling agent. The chip bonding film prepared by the present invention through a specific formula ratio has high bonding strength, can accurately control the thickness of the chip film, and maintain the consistency of the film thickness, prevent the chip from tilting, thereby maintaining the stability of the chip package, and improving the stability of the fingerprint sensor packaging structure.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a chip bonding film and a preparation method thereof, and a fingerprint sensor packaging structure. Background Art

[0002] With the continuous development of electronic technology and semiconductor technology, fingerprint sensor technology has become more and more mature. Fingerprint sensors are used in more and more electronic devices. In the specific practice, fingerprint sensors are made into packaging structures and embedded in electronic devices. In the packaging structure, the chip and the substrate are isolated and packaged by the chip bonding film, and electrically connected by wires to achieve fingerprint sensing. However, the chip bonding film is prone to breakage at high temperatures, and the adhesion to the substrate is poor, causing the chip to lose control and the fingerprint sensing to fail.

[0003] Therefore, how to provide a chip bonding film to improve the silicon wafer adhesion of the chip bonding film by adjusting the ratio of the three base resins of polyphenol oxide resin, polyurethane modified epoxy resin and flexible epoxy resin, and then improve the stability of the fingerprint sensor packaging structure, is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0004] The object of the present invention is to provide a chip bonding film and a preparation method thereof, and a fingerprint sensor packaging structure to solve at least one of the above technical problems.

[0005] To achieve the above-mentioned purpose, the first aspect of the present invention provides a chip bonding film, which comprises the following components in parts by mass: 20 to 40 parts of spherical silica, 20 to 35 parts of polyphenol oxide resin, 20 to 30 parts of polyurethane modified epoxy resin, 15 to 20 parts of flexible epoxy resin, 1 to 4 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.3 to 0.5 parts of silane coupling agent, and 0.3 to 0.5 parts of leveling agent.

[0006] In the first aspect, the average particle size of the spherical silica is 10 to 15 μm.

[0007] In the first aspect, the epoxy equivalent of the flexible epoxy resin is 440 to 480 g / eq.

[0008] In the first aspect, the epoxy equivalent of the polyurethane-modified epoxy resin is 210 to 280 g / eq.

[0009] In the first aspect, the molecular weight of the polyphenol oxide resin is 32,000 to 52,000, and the epoxy equivalent of the polyphenol oxide resin is 25 g / eq.

[0010] In the first aspect, the curing agent is a polyamine curing agent; the polyamine curing agent includes at least one of diethylenetriamine, metaphenylenediamine and dicyandiamide.

[0011] In the first aspect, the accelerator is an imidazole accelerator; the imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-methylimidazole.

[0012] In the first aspect, the model of the leveling agent includes KL-730.

[0013] The second aspect of the present invention provides a method for preparing the die bonding film as described in the first aspect, the preparation method comprising: weighing the components of the raw materials respectively, wherein the components include, by mass, 20 to 40 parts of spherical silica, 20 to 35 parts of polyphenol oxide resin, 20 to 30 parts of polyurethane modified epoxy resin, 15 to 20 parts of flexible epoxy resin, 1 to 4 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.3 to 0.5 parts of silane coupling agent, and 0.3 to 0.5 parts of leveling agent; adding propylene glycol methyl ether acetate to the weighed polyphenol oxide resin, stirring evenly, to obtain to a first mixed liquid; to the first mixed liquid, add the weighed polyurethane modified epoxy resin and the flexible epoxy resin in sequence, stir evenly, and obtain a second mixed liquid; to the second mixed liquid, add the weighed spherical silica, the curing agent and the accelerator, stir evenly, and obtain a third mixed liquid; transfer the third mixed liquid to a bead mill for grinding to obtain a colloid; add the weighed silane coupling agent and the leveling agent to the colloid, perform vacuum degassing, and obtain a glue solution; apply the glue solution by a coater, dry, and obtain a chip bonding film.

[0014] According to a third aspect of the present invention, there is provided a fingerprint sensor packaging structure, the packaging structure comprising: a substrate, wherein circuits are arranged on both the front and back sides of the substrate; a control chip, wherein a first chip bonding film is arranged between the control chip and the back side of the substrate, and the control chip is electrically connected to the circuits on the back side of the substrate; a hard material, wherein the hard material is a fingerprint sensing area; a first metal frame, wherein one end of the first metal frame is fixedly connected to the front side of the substrate, and the other end of the first metal frame is fixedly connected to one side of the hard material; a second metal frame, wherein one end of the second metal frame is fixedly connected to the front side of the substrate, and the other end of the second metal frame is fixedly connected to the other side of the hard material, and the substrate, the hard material, the first metal frame and the second metal frame together form an accommodating space; a sensing chip, wherein a second chip bonding film is arranged between the sensing chip and the front side of the substrate, the sensing chip is electrically connected to the circuits on the front side of the substrate, the sensing chip is placed in the accommodating space, and the accommodating space is filled with epoxy molding compound; the first chip bonding film and the second chip bonding film are the chip bonding films described in the first aspect.

[0015] Beneficial effects:

[0016] The present invention provides a chip bonding film, which comprises the following components by mass: 20-40 parts of spherical silica, 20-35 parts of polyphenol oxide resin, 20-30 parts of polyurethane modified epoxy resin, 15-20 parts of flexible epoxy resin, 1-4 parts of curing agent, 0.1-0.5 parts of accelerator, 0.3-0.5 parts of silane coupling agent and 0.3-0.5 parts of leveling agent. The toughness and bonding strength of three resins, namely, polyphenol oxide resin, polyurethane modified epoxy resin and flexible epoxy resin, are used to provide basic performance for the chip bonding film, and the bonding strength of the chip bonding film is regulated by adjusting the ratio between the three resins. The spherical silica is used to reduce the internal stress and thermal expansion coefficient of the chip bonding film. The resin is cured by the curing agent, and the accelerator is used to reduce the curing time and improve the curing efficiency. At the same time, the leveling agent is used to increase the film-forming property, so that the prepared chip bonding film has thickness consistency, can avoid the tilt of the attached chip, and maintain the stability of the chip package. The chip bonding film prepared by the specific formula ratio of the present invention has high bonding strength, can accurately control the thickness of the chip film, and maintain the consistency of the film thickness, prevent the chip from tilting, thereby maintaining the stability of the chip packaging and improving the stability of the fingerprint sensor packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A flow chart of a method for preparing a die bonding film provided by the present invention;

[0019] Figure 2 A schematic diagram of a fingerprint sensor packaging structure provided by the present invention;

[0020] Reference numerals:

[0021] 1. Substrate; 2. Control chip; 3. Hard material; 4. First metal frame; 5. Second metal frame; 6. Sensor chip; 7. First chip bonding film; 8. Second chip bonding film; 9. Epoxy molding compound; 10. Fingerprint. DETAILED DESCRIPTION

[0022] The present invention will be described in detail below in conjunction with specific implementations and examples, and the advantages and various effects of the present invention will be more clearly presented. It should be understood by those skilled in the art that these specific implementations and examples are used to illustrate the present invention, rather than to limit the present invention.

[0023] Throughout the specification, unless otherwise specifically stated, the terms used herein should be understood as meanings commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. In the event of a conflict, the present specification takes precedence.

[0024] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or obtained by existing methods.

[0025] The present invention provides a chip bonding film, which comprises the following components in parts by mass: 20 to 40 parts of spherical silica, 20 to 35 parts of polyphenol oxide resin, 20 to 30 parts of polyurethane modified epoxy resin, 15 to 20 parts of flexible epoxy resin, 1 to 4 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.3 to 0.5 parts of silane coupling agent, and 0.3 to 0.5 parts of leveling agent.

[0026] Specifically, the present invention provides a chip bonding film, which includes the following components in parts by mass: 20-40 parts of spherical silica, 20-35 parts of polyphenol oxide resin, 20-30 parts of polyurethane modified epoxy resin, 15-20 parts of flexible epoxy resin, 1-4 parts of curing agent, 0.1-0.5 parts of accelerator, 0.3-0.5 parts of silane coupling agent, and 0.3-0.5 parts of leveling agent; the toughness and bonding strength of the three resins of polyphenol oxide resin, polyurethane modified epoxy resin and flexible epoxy resin are used to provide basic performance for the chip bonding film, and the bonding strength of the chip bonding film is regulated by adjusting the ratio between the three resins; the internal stress and thermal expansion coefficient of the chip bonding film are reduced by spherical silica; the resin is cured by a curing agent, and an accelerator is used to reduce the curing time and improve the curing efficiency, and the leveling agent is used to increase the film-forming property, so that the prepared chip bonding film has a consistent thickness, and can avoid the tilt of the attached chip, and maintain the stability of the chip package. The chip bonding film prepared by the specific formula ratio of the present invention has high bonding strength, can accurately control the thickness of the chip film, and maintain the consistency of the film thickness, prevent the chip from tilting, thereby maintaining the stability of the chip packaging and improving the stability of the fingerprint sensor packaging structure.

[0027] In some possible embodiments, the average particle size of the spherical silica is 10 to 15 μm.

[0028] This is because, by selecting spherical silica as the filling material and controlling the average particle size of the spherical silica to 10-15 μm, not only the thermal expansion coefficient of the film can be reduced, but also the fluidity of the film before curing can be controlled, and the surface properties of the film can be improved in combination with a leveling agent.

[0029] In some possible embodiments, the epoxy equivalent of the flexible epoxy resin is 440-480 g / eq.

[0030] In some possible embodiments, the epoxy equivalent of the polyurethane-modified epoxy resin is 210 to 280 g / eq.

[0031] In some possible embodiments, the molecular weight of the polyphenol oxide resin is 32,000 to 52,000, and the epoxy equivalent of the polyphenol oxide resin is 25 g / eq.

[0032] Those skilled in the art can understand that flexible epoxy resin has excellent toughness and good bonding strength, and the optional models are YX7400 or YX7105; polyurethane modified epoxy resin has good bonding strength, high peel strength and high toughness, and the optional models are EPU-133 or EPU-302; polyphenol oxide resin has good toughness and adhesion strength, and is soluble in a variety of organic solvents, and the optional models are PKHB or PKHH; by adjusting the ratio of the three resins, the toughness and bonding strength of the film can be adjusted, and combined with a silane coupling agent, the adhesion between the film and the chip can be further improved, so that the chip can be stably attached to the film, thereby improving the stability of the chip package.

[0033] In some possible embodiments, the curing agent is a polyamine curing agent; the polyamine curing agent includes at least one of diethylenetriamine, meta-phenylenediamine and dicyandiamide.

[0034] In some possible embodiments, the accelerator is an imidazole accelerator; the imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-methylimidazole.

[0035] This is because the three selected resins have excellent adaptability, and a polyamine curing agent is used to react with the resin, and an imidazole accelerator is combined to increase the reaction rate; among them, diethylenetriamine is a fatty amine with an active hydrogen equivalent of 45g / eq; metaphenylenediamine is an aromatic amine with an active hydrogen equivalent of 21g / eq; and dicyandiamide has an active hydrogen equivalent of 21g / eq.

[0036] In some possible embodiments, the model of the leveling agent includes KL-730.

[0037] Those skilled in the art can understand that the leveling agent KL-730 is a type of modified polymer containing silicone in the side chain, which can improve the leveling and uniformity of the adhesive, facilitate curing into a film, and the film surface has excellent performance.

[0038] Based on a general inventive concept, see Figure 1 The second aspect of the present invention provides a method for preparing a die bonding film, the method comprising:

[0039] S1. Weigh the raw material components respectively, wherein the components include, by mass, 20-40 parts of spherical silica, 20-35 parts of polyphenol oxide resin, 20-30 parts of polyurethane modified epoxy resin, 15-20 parts of flexible epoxy resin, 1-4 parts of curing agent, 0.1-0.5 parts of accelerator, 0.3-0.5 parts of silane coupling agent, and 0.3-0.5 parts of leveling agent;

[0040] S2, adding propylene glycol methyl ether acetate to the weighed polyphenol oxide resin, stirring evenly to obtain a first mixed solution;

[0041] S3, adding the weighed polyurethane-modified epoxy resin and the flexible epoxy resin to the first mixed solution in sequence, stirring evenly, to obtain a second mixed solution;

[0042] S4, adding the weighed spherical silica, the curing agent and the accelerator to the second mixed liquid, stirring evenly to obtain a third mixed liquid;

[0043] S5, transferring the third mixed solution to a bead mill for grinding to obtain a colloid;

[0044] S6, adding the weighed silane coupling agent and the leveling agent to the colloid, performing vacuum degassing to obtain a glue solution;

[0045] S7, coating the adhesive solution with a coating machine, and drying to obtain a chip bonding film.

[0046] In the process of preparing the chip bonding film of the present invention, in order to reduce the stress between the raw material components, the polyphenol oxide resin is firstly dissolved by propylene glycol methyl ether acetate, and then the polyurethane modified epoxy resin and the flexible epoxy resin are added to make them evenly mixed, and then the spherical silica, the curing agent and the accelerator are added, and the solid auxiliary agent is ground by a bead mill so that the solid auxiliary agent can be evenly dispersed in the liquid resin and fully contacted, thereby increasing the contact area between the raw materials and providing a basis for the subsequent rapid reaction. Finally, the silane coupling agent and the leveling agent are added, and vacuum degassing is performed to remove the bubbles in the glue solution, which is beneficial to coating and can control the thickness of the coated glue solution. After the coating is completed, drying is performed to remove the solvent and initiate a curing reaction so that the raw material components react with each other to obtain a chip bonding film with high bonding strength, so as to fix the chip in the fingerprint sensor and maintain the stability of the chip.

[0047] Based on a general inventive concept, see Figure 2In a third aspect, the present invention provides a fingerprint sensor packaging structure, the packaging structure comprising: a substrate 1, wherein the front and back sides of the substrate 1 are both provided with circuits; a control chip 2, wherein a first chip bonding film 7 is provided between the control chip 2 and the back side of the substrate 1, and the control chip 2 is electrically connected to the circuits on the back side of the substrate 1; a hard material 3, wherein the hard material 3 is a fingerprint sensing area; a first metal frame 4, wherein one end of the first metal frame 4 is fixedly connected to the front side of the substrate 1, and the other end of the first metal frame 4 is fixedly connected to one side of the hard material 3; a second metal frame 5, wherein one end of the second metal frame 5 The second metal frame 5 is fixedly connected to the front side of the substrate 1, and the other end of the second metal frame 5 is fixedly connected to the other side of the hard material 3, and the substrate 1, the hard material 3, the first metal frame 4 and the second metal frame 5 together form a accommodating space; a sensing chip 6, a second chip bonding film 8 is arranged between the sensing chip 6 and the front side of the substrate 1, the sensing chip 6 is electrically connected to the circuit on the front side of the substrate 1, the sensing chip 6 is placed in the accommodating space, and the accommodating space is filled with epoxy molding compound 9; the first chip bonding film 7 and the second chip bonding film 8 are the chip bonding films described in the first aspect.

[0048] A first chip bonding film 7 is arranged between the control chip 2 and the substrate 1, and a second chip bonding film 8 is arranged between the sensing chip 2 and the substrate 1. The chip is fixed on the substrate 1 by using the first chip bonding film 7 and the second chip bonding film 8, and an epoxy molding compound 9 is arranged on the sensing chip 2. The hard material 3, the first metal frame 4 and the second metal frame 5 are combined for packaging, and a fingerprint sensing area is formed on the hard material 3. When the fingerprint 10 contacts the hard material 3, the sensing chip 2 receives the signal and transmits the signal to the control chip 2 through the wire. The control chip 2 recognizes the received signal to complete fingerprint recognition, thereby maintaining the stability of the fingerprint sensor packaging structure and improving fingerprint sensing recognition.

[0049] The present application will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are intended only to illustrate the present application and are not intended to limit the scope of the present application. The experimental methods for which specific conditions are not specified in the following examples are usually measured according to national standards. If there is no corresponding national standard, then the conditions recommended by the manufacturer are followed.

[0050] The components of the die bonding films in Comparative Examples 1-9 and Examples 1-8 are shown in Table 1-2 below in terms of mass fractions:

[0051] Table 1 Weight fraction of raw material components in comparative examples

[0052]

[0053] Table 2 Distribution ratio of each group of raw materials in the embodiment

[0054]

[0055] The die bonding films provided in Examples 1-8 and Comparative Examples 1-9 were subjected to film tensile strength and elongation at break tests, post-curing tensile strength and elongation at break tests, water absorption and silicon wafer adhesion tests. The specific test process is as follows:

[0056] 1. Film tensile strength and elongation at break test: Cut the film material of 10 mm × 80 mm, tear off the light release film, stick the two ends of the sample with tape, clamp the tapes at both ends of the universal material testing machine, and then tear off the heavy release film to test the tensile strength and elongation at break of the film;

[0057] 2. Test of tensile strength and elongation at break after curing: The film was cured at 175°C for 2h, and samples of 50 mm × 10 mm × 1 mm were made into dumbbell shapes. The tensile strength and elongation at break were tested using a universal material testing machine.

[0058] 3. Water absorption test: Take 3 films of 35 mm × 35 mm, weigh them after curing at 175℃ for 2 h, and then place them in a high temperature and high pressure cooking apparatus at a constant temperature of 120℃ for 24 h. After the curing, wipe off the surface moisture, weigh them one by one, calculate the water absorption, and then take the average value;

[0059] 4. Silicon wafer adhesion test: A 20 μm thick chip adhesive film is attached to a 10 mm × 10 mm silicon wafer, and then a 2 mm × 2 mm small silicon wafer is attached to the film. After curing at 175 ° C for 2 h, the shear strength is measured using a multi-function thrust machine, and the thrust blade height is set to 30 μm.

[0060] The test results are shown in Table 3 below:

[0061] Table 3 Test results

[0062]

[0063] From the above table, we can see that:

[0064] (1) Although three kinds of resins, namely, polyphenol oxide resin, polyurethane modified epoxy resin and flexible epoxy resin, were used as the matrix resins in Comparative Examples 1-5, the addition ranges thereof were all outside the specific proportions of the present invention. Therefore, the prepared chip bonding films had low film tensile strength and film elongation, low tensile strength and elongation at break after curing, and low adhesion to the silicon wafer, which was insufficient to stably attach the sensing chip / control chip to the substrate and prevent the chip from moving.

[0065] (2) Comparative Example 7 uses only polyphenol oxide resin as the base resin, and Comparative Example 9 uses only polyurethane modified epoxy resin as the base resin. The performance of the prepared film is the worst. This is because the performance of a single resin is relatively simple and the improvement on the overall performance of the film is small. Comparative Example 8 uses polyphenol oxide resin and polyurethane modified epoxy resin as the base resin, and the performance of the prepared film is still poor, indicating that the flexible epoxy resin in this application has a greater impact on the overall performance of the film;

[0066] (3) Examples 1-8 use three types of resins, namely, polyphenol oxide resin, polyurethane modified epoxy resin and flexible epoxy resin, as the base resins. The comprehensive performance of the prepared chip bonding film is significantly changed, and its adhesion to the silicon wafer is significantly increased, thereby improving the stability of the sensing chip / control chip, thereby improving the sensing recognition of the fingerprint sensor.

[0067] Finally, it should be noted that the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements that are inherent to such process, method, article, or apparatus.

[0068] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0069] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A die bonding film, characterized in that: The die bonding film comprises the following components by weight: 20-40 parts of spherical silica, 20-35 parts of polyphenol oxide resin, 20-30 parts of polyurethane modified epoxy resin, 15-20 parts of flexible epoxy resin, 1-4 parts of curing agent, 0.1-0.5 parts of accelerator, 0.3-0.5 parts of silane coupling agent, and 0.3-0.5 parts of leveling agent; The epoxy equivalent of the flexible epoxy resin is 440-480 g / eq; the flexible epoxy resin is YX7400 or YX7105; The epoxy equivalent of the polyurethane modified epoxy resin is 210 to 280 g / eq; the polyurethane modified epoxy resin is EPU-133 or EPU-302; The molecular weight of the polyphenol oxide resin is 32000-52000, the epoxy equivalent of the polyphenol oxide resin is 25 g / eq; and the polyphenol oxide resin is PKHB or PKHH.

2. The die attach film according to claim 1, wherein: The average particle size of the spherical silicon dioxide is 10 to 15 μm.

3. The die attach film according to claim 1, wherein: The curing agent is a polyamine curing agent; the polyamine curing agent includes at least one of diethylenetriamine, metaphenylenediamine and dicyandiamide.

4. The die attach film according to claim 1, wherein: The accelerator is an imidazole accelerator; the imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-methylimidazole.

5. The die attach film according to claim 1, wherein: The model of the leveling agent includes KL-730.

6. A method for preparing a die bonding film according to any one of claims 1 to 5, characterized in that: The preparation method comprises: Weigh the raw material components respectively, wherein the components include, by mass, 20 to 40 parts of spherical silica, 20 to 35 parts of polyphenol oxide resin, 20 to 30 parts of polyurethane modified epoxy resin, 15 to 20 parts of flexible epoxy resin, 1 to 4 parts of curing agent, 0.1 to 0.5 parts of accelerator, 0.3 to 0.5 parts of silane coupling agent, and 0.3 to 0.5 parts of leveling agent; Adding propylene glycol methyl ether acetate to the weighed polyphenol oxide resin, stirring evenly to obtain a first mixed solution; Adding the weighed polyurethane-modified epoxy resin and the flexible epoxy resin to the first mixed liquid in sequence, stirring evenly, to obtain a second mixed liquid; Adding the weighed spherical silica, the curing agent and the accelerator to the second mixed liquid, stirring evenly, to obtain a third mixed liquid; Transferring the third mixed solution to a bead mill for grinding to obtain a colloid; Adding the weighed silane coupling agent and the leveling agent into the colloid, performing vacuum degassing to obtain a glue solution; The adhesive solution is coated by a coating machine and dried to obtain a chip bonding film.

7. A fingerprint sensor packaging structure, characterized in that: The packaging structure comprises: A substrate, wherein circuits are arranged on the front and back sides of the substrate; A control chip, wherein a first chip bonding film is disposed between the control chip and the back side of the substrate, and the control chip is electrically connected to the circuit on the back side of the substrate; A hard material, wherein the hard material is a fingerprint sensing area; a first metal frame, one end of which is fixedly connected to the front surface of the substrate, and the other end of which is fixedly connected to one side of the hard material; a second metal frame, one end of which is fixedly connected to the front surface of the substrate, and the other end of which is fixedly connected to the other side of the hard material, and the substrate, the hard material, the first metal frame and the second metal frame together form an accommodating space; A sensing chip, wherein a second chip bonding film is arranged between the sensing chip and the front surface of the substrate, the sensing chip is electrically connected to the circuit on the front surface of the substrate, the sensing chip is placed in the accommodation space, and the accommodation space is filled with epoxy molding compound; The first die attach film and the second die attach film are the die attach films according to any one of claims 1 to 5.

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