An etching device for producing semiconductor chips

Abstract

The invention discloses an etching device for semiconductor chip production, which relates to the technical field of semiconductor chip production. The device comprises an etching cylinder, a cylinder cover and a hydraulic cylinder. A flushing piece is arranged on the inner top surface of the cylinder cover. A hollow shaft is rotatably arranged on the cylinder cover. A gear 1 is fixedly connected to the top of the hollow shaft, a circular placement box is rotatably arranged on the bottom, and a stirring piece is arranged on the outer wall of the hollow shaft. A rotating shaft is rotatably arranged in the hollow shaft, a gear 2 is fixedly connected to the top of the rotating shaft, and an arc-shaped sealing plate is evenly fixedly connected to the bottom of the rotating shaft. An electric telescopic rod is arranged on the top surface of the cylinder cover, and a transmission component is arranged on the telescopic end of the electric telescopic rod. The invention realizes the opening of a through-hole area by using the transmission component, so that strong acid can enter the circular placement box conveniently, which is beneficial to the etching of the chip. After the etching of the chip is completed, the through-hole area can be closed to prevent water used for flushing the chip from entering the etching cylinder, thereby diluting the strong acid in the etching cylinder and ensuring the concentration of the strong acid.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production, and in particular to an etching device for semiconductor chip production. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. The invention of semiconductor chips is an innovation in the 20th century, which pioneered the information age. As one of the most important processes frequently used in the manufacturing process of semiconductor chips, semiconductor chip etching is particularly important; an etching device is required when etching semiconductors; when the existing etching device etches semiconductors, all semiconductors are placed in a placement basket, and then the placement basket is placed in a strong acid for etching. Since the chips are stacked in the placement basket, the chips are stacked together, so that the stacked position of the chips cannot contact the strong acid solution, further causing uneven chip etching, thereby affecting the etching of the chip; therefore, an etching device for semiconductor chip production is proposed to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide an etching device for producing semiconductor chips in order to solve the above-mentioned problems.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] An etching device for semiconductor chip production comprises an etching cylinder, a cylinder cover and a hydraulic cylinder, wherein a flushing member for chip cleaning is provided on the inner top surface of the cylinder cover, a hollow shaft is rotatably provided on the cylinder cover, a gear is fixedly connected to the top of the hollow shaft, a circular placing box cooperating with the etching cylinder is rotatably provided on the bottom outer wall, and a stirring member for chip stirring is provided on the outer wall of the hollow shaft;

[0006] A rotating shaft is rotatably arranged in the hollow shaft, a second gear is fixedly connected to the top of the rotating shaft, a plurality of through-hole areas are evenly arranged at the bottom of the circular placement box, and a plurality of arc-shaped sealing plates for sealing the through-hole areas are evenly fixedly connected to the bottom of the rotating shaft;

[0007] An electric telescopic rod is arranged on the top surface of the cylinder cover, and a transmission component which first acts on the second gear and then acts on the first gear is arranged at the telescopic end of the electric telescopic rod.

[0008] Preferably, the transmission assembly includes a rectangular frame arranged at the telescopic end of the electric telescopic rod, a movable block and a compression spring slidably arranged in the rectangular frame, and the compression spring is located at an end away from the electric telescopic rod, a bar tooth plate 2 cooperating with gear 2 is provided on the top surface of the movable block, a limit piece acting on bar tooth plate 2 is provided on the cylinder cover, and a bar tooth plate 1 cooperating with gear 1 is provided on the side of the rectangular frame.

[0009] Preferably, the limiting member comprises a limiting rod arranged on the top surface of the cylinder cover, and limiting grooves matching with the limiting rod are formed on two side surfaces of the strip-shaped tooth plate.

[0010] Preferably, the stirring member comprises an annular plate fixedly connected to the outer wall of the bottom of the hollow shaft, a plurality of rotating plates are evenly arranged on the outer wall of the annular plate, and the rotating plates are rotatably arranged with the circular placement box.

[0011] Preferably, an arc-shaped slider is provided at the outer end of the rotating plate, and an arc-shaped groove is provided on the inner wall of the circular placement box to cooperate with the arc-shaped slider, and the arc of the arc-shaped groove is 110°.

[0012] Preferably, the through hole area is arc-shaped, and the arc of the through hole area is 60°, and the arc-shaped sealing plate and the bottom of the circular placement box are arranged in a dynamic sealing structure.

[0013] Preferably, the flushing component comprises a spiral water pipe arranged on the inner top surface of the cylinder cover, a plurality of nozzles are evenly installed on the spiral water pipe, and a water inlet pipe connected to the spiral water pipe is provided on the top of the cylinder cover.

[0014] Preferably, a water pipe is provided at the bottom of the outer wall of the circular placement box, a placement groove is opened on the outer wall of the circular placement box to cooperate with the water pipe, and the water pipe is made of elastic and flexible rubber material.

[0015] Preferably, the bottom of the etching cylinder is provided with a cylinder bottom, and a liquid outlet pipe with a valve is provided at the bottom of the etching cylinder, and one end of the liquid outlet pipe passes through the cylinder bottom.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0017] The present invention uses a transmission component to first realize the rotation of the arc-shaped sealing plate, thereby realizing the opening of the through-hole area, making it easy for the strong acid to enter the circular placement box, which is beneficial to the etching of the chip; after the chip etching is completed, the through-hole area can be closed to prevent water used to wash the chip from entering the etching cylinder, thereby diluting the strong acid in the etching cylinder, ensuring the concentration of the strong acid, further facilitating the reuse of the strong acid, and saving resources; then, the rotating plate is driven to rotate to realize stirring of the chips in the circular placement box, so that the chips can be separated, so that the chips are fully contacted with the strong acid, which is further beneficial to the etching of the chip; at the same time, under the cooperation of the arc groove and the arc slider, the rotating plate will drive the circular placement box to rotate after rotating to a certain angle, so as to realize stirring of the strong acid in the etching cylinder, so that the concentration of the strong acid is more uniform, which is beneficial to the etching of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It shows a schematic structural diagram of a front viewing angle provided by an embodiment of the present invention;

[0019] Figure 2 It shows a schematic structural diagram of a side viewing angle provided by an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of a cross-sectional structure at a front viewing angle provided by an embodiment of the present invention is shown;

[0021] Figure 4 It shows a schematic structural diagram of removing the etching cylinder according to an embodiment of the present invention;

[0022] Figure 5 It shows a schematic structural diagram of a cylinder cover according to an embodiment of the present invention at a bottom-up viewing angle;

[0023] Figure 6 It shows a schematic structural diagram of a circular placement box connected to a hollow shaft according to an embodiment of the present invention;

[0024] Figure 7 A schematic diagram of the cross-sectional structure of a circular placement box provided in accordance with an embodiment of the present invention from a top view is shown.

[0025] Legend:

[0026] 1. Etching cylinder; 2. Cylinder cover; 3. Cylinder bottom; 4. Liquid outlet pipe; 5. Valve; 6. Strip tooth plate 1; 7. Gear 1; 8. Electric telescopic rod; 9. Water inlet pipe; 10. Gear 2; 11. Rotating shaft; 12. Hydraulic cylinder; 13. Limiting groove; 14. Limiting rod; 15. Strip tooth plate 2; 16. Rectangular frame; 17. Hollow shaft; 18. Round placement box; 19. Movable block; 20. Through hole area; 21. Water guide pipe; 22. Placement groove; 23. Rotating plate; 24. Arc groove; 25. Arc sealing plate; 26. Spiral water pipe; 27. Sprinkler; 28. Extrusion spring; 29. ​​Arc slider; 30. Ring plate. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-7 , the present invention provides a technical solution:

[0029] An etching device for semiconductor chip production comprises an etching cylinder 1, a cylinder cover 2 arranged on the top of the etching cylinder 1 and a hydraulic cylinder 12 installed on the cylinder cover 2, wherein the fixed end of the hydraulic cylinder 12 is installed on the outer wall of the cylinder bottom 3 to realize the lifting and lowering of a circular placement box 18; a flushing piece for chip cleaning is arranged on the inner top surface of the cylinder cover 2, and the use of the flushing piece facilitates the flushing of the etched chip to avoid the strong acid on the surface of the chip from sticking to the operator's hand or body, thereby facilitating the protection of the operator; a hollow shaft 17 is rotatably arranged on the cylinder cover 2, a gear 17 is fixedly connected to the top of the hollow shaft 17, a circular placement box 18 matched with the etching cylinder 1 is rotatably arranged on the outer wall of the bottom, and a stirring piece for chip stirring is arranged on the outer wall of the hollow shaft 17; the use of the stirring piece facilitates the stirring of the chip in the circular placement box 18 to avoid the phenomenon of chip stacking, so that the chip is fully in contact with the strong acid, further facilitating the etching of the chip.

[0030] A rotating shaft 11 is rotatably arranged inside the hollow shaft 17, a gear 2 10 is fixedly connected to the top of the rotating shaft 11, a plurality of through-hole areas 20 are evenly arranged at the bottom of the circular placement box 18, and a plurality of arc-shaped sealing plates 25 for sealing the through-hole areas 20 are evenly fixedly connected to the bottom of the rotating shaft 11; the use of the arc-shaped sealing plates 25 facilitates the sealing of the through-hole areas 20, and avoids the phenomenon of water falling into the etching cylinder 1 when the chip is rinsed, thereby avoiding the dilution of the strong acid in the etching cylinder 1, ensuring the concentration of the strong acid, and further facilitating the reuse of the strong acid, saving resources.

[0031] An electric telescopic rod 8 is provided on the top surface of the cylinder cover 2, and the telescopic end of the electric telescopic rod 8 is provided with a transmission assembly that first acts on the gear 2 10 and then acts on the gear 1 7; by using the transmission assembly, the arc-shaped sealing plate 25 is first rotated, thereby realizing the opening of the through-hole area 20, so that the strong acid can enter the circular placement box 18, which is beneficial to the etching of the chip; then the rotating plate 23 is driven to rotate, so as to stir the chips in the circular placement box 18, so that the chips can be separated, so that the chips are fully in contact with the strong acid, which is further beneficial to the etching of the chip; at the same time, under the cooperation of the arc groove 24 and the arc slider 29, the rotating plate 23 will drive the circular placement box 18 to rotate after rotating to a certain angle, so as to stir the strong acid in the etching cylinder 1, so that the concentration of the strong acid is more uniform, which is beneficial to the etching of the chip; wherein, a plurality of convex strips (not shown in the figure) for stirring the solution are evenly provided on the outer wall of the circular placement box 18, which are used to stir the acid solution in the etching cylinder 1.

[0032] In the present invention, the transmission assembly includes a rectangular frame 16 arranged at the telescopic end of the electric telescopic rod 8, a movable block 19 slidably arranged in the rectangular frame 16, and an extrusion spring 28, and the extrusion spring 28 is located at an end away from the electric telescopic rod 8, so as to facilitate the extrusion of the movable block 19, so that the movable block 19 moves with the rectangular frame 16; a bar tooth plate 2 15 matching with the gear 2 10 is provided on the top surface of the movable block 19, and a limiting member acting on the bar tooth plate 2 15 is provided on the cylinder cover 2. Through the use of the limiting member, it is convenient to limit the bar tooth plate 2 15 to realize the precise rotation of the arc sealing plate 25; a bar tooth plate 1 6 matching with the gear 1 7 is provided on the side of the rectangular frame 16.

[0033] In the present invention, the limiting member includes a limiting rod 14 arranged on the top surface of the cylinder cover 2, and a limiting groove 13 matching the limiting rod 14 is opened on the side of the strip-shaped tooth plate 15; wherein, when the limiting rod 14 moves from one end of the limiting groove 13 to the other end, the arc-shaped sealing plate 25 rotates 60° to open or close the through hole area 20.

[0034] In the present invention, the stirring member includes an annular plate 30 fixedly connected to the outer wall of the bottom of the hollow shaft 17, and a plurality of rotating plates 23 are evenly arranged on the outer wall of the annular plate 30, and the rotating plates 23 are rotatably arranged with the circular placement box 18. The rotating plates 23 are driven to rotate by the rotation of the hollow shaft 17 to achieve stirring of the chips in the circular placement box 18, avoiding overlap between the chips, facilitating the contact between the chips and the strong acid, and thus facilitating the etching of the chips.

[0035] In the present invention, an arc-shaped slider 29 is provided at the outer end of the rotating plate 23, and an arc-shaped groove 24 is provided on the inner wall of the circular placement box 18 to cooperate with the arc-shaped slider 29, and the arc of the arc-shaped groove 24 is 110°. Through the coordinated use of the arc-shaped groove 24 and the arc-shaped slider 29, it is convenient to rotate the rotating plate 23 and then drive the circular placement box 18 to rotate, so as to change the position of the chip in the strong acid, avoid insufficient concentration of strong acid in contact with the chip, and thus facilitate the etching of the chip.

[0036] In the present invention, the through hole area 20 is arc-shaped, and the arc of the through hole area 20 is 60°, and the arc sealing plate 25 and the bottom of the circular placement box 18 are set as a dynamic sealing structure to prevent water from leaking from the bottom of the circular placement box 18 into the etching cylinder 1, thereby facilitating the protection of the strong acid in the etching cylinder 1 and facilitating the reuse of the strong acid.

[0037] In the present invention, the flushing part includes a spiral water pipe 26 arranged on the inner top surface of the cylinder cover 2, and multiple nozzles 27 are evenly installed on the spiral water pipe 26. The top of the cylinder cover 2 is provided with a water inlet pipe 9 connected to the spiral water pipe 26, which is convenient for flushing the etched chip and removing the strong acid on the chip surface.

[0038] In the present invention, a water pipe 21 is provided at the bottom of the outer wall of the circular placement box 18, and a placement groove 22 is opened on the outer wall of the circular placement box 18 to cooperate with the water pipe 21. The water pipe 21 is made of elastic and flexible rubber material, which is convenient for the bending of the water pipe 21 and also convenient for the automatic resetting of the water pipe 21, thereby facilitating the discharge of water.

[0039] In the present invention, a bottom 3 is provided at the bottom of the etching cylinder 1, a liquid outlet pipe 4 with a valve 5 is provided at the bottom of the etching cylinder 1, and one end of the liquid outlet pipe 4 passes through the bottom 3 to facilitate the discharge of waste liquid in the etching cylinder 1.

[0040] Working principle: When the present invention is used, the electric hydraulic cylinder 12 is first opened, and the cylinder cover 2 is driven to move upward by the extension of the telescopic end of the hydraulic cylinder 12, thereby driving the transmission assembly, the hollow shaft 17 and the rotating shaft 11 to move upward, thereby driving the circular placement box 18 to move upward, and the circular placement box 18 is placed at the upper end of the etching cylinder 1 by controlling the hydraulic cylinder 12; then the chips are placed in the circular placement box 18 one by one; due to the uneven surface of the chips, the chips will not be adsorbed to each other;

[0041] Then, the electric telescopic rod 8 is opened, and the rectangular frame 16 is driven to move by the contraction of the telescopic end of the electric telescopic rod 8. The movement of the rectangular frame 16 is divided into two processes:

[0042] Process 1: When the telescopic end of the electric telescopic rod 8 moves from the initial position to a certain distance (i.e., point A), the rectangular frame 16 moves within this distance, and the movable block 19 moves under the action of the extrusion spring 28, thereby driving the bar-shaped toothed plate 15 to move, thereby driving the gear 10 to rotate, and further driving the rotating shaft 11 to rotate, thereby driving the arc-shaped sealing plate 25 to rotate; when the arc-shaped sealing plate 25 rotates 60°, the limiting rod 14 moves from one end of the limiting groove 13 to the other end, and at this time, the arc-shaped sealing plate 25 is separated from the through-hole area 20, so that the through-hole area 20 is opened, so that the strong acid solution can enter the circular placement box 18;

[0043] After the arc-shaped sealing plate 25 rotates 60°, the bar-shaped toothed plate 16 and the gear 17 are meshed, and then the telescopic end of the hydraulic cylinder 12 is contracted to allow the circular placement box 18 to enter the etching cylinder 1, and then the strong acid in the etching cylinder 1 etches the chip;

[0044] Process 2: When the strong acid is corroding the chip, the telescopic end of the electric telescopic rod 8 is controlled to move from point A to the end. At this time, it is divided into two small processes:

[0045] Small process 1: The movement of the rectangular frame 16 will drive the bar-shaped toothed plate 16 to move, and then drive the gear 17 to rotate, thereby driving the hollow shaft 17 to rotate, and then driving the annular plate 30 and the rotating plate 23 to rotate, while the circular placement box 18 will not rotate under the cooperation of the arc groove 24 and the arc slider 29. At this time, the rotating plate 23 stirs the chips in the circular placement box 18 to avoid direct overlap of the chips, thereby facilitating the contact between the chips and the strong acid solution, and further facilitating the etching of the chips;

[0046] Small process 2: When the arc-shaped slider 29 moves from one end of the arc-shaped groove 24 to the other end, as the hollow shaft 17 continues to rotate, the circular placement box 18 will be driven to rotate, so as to stir the strong acid in the etching cylinder 1, so that the strong acid solution in the etching cylinder 1 is uniform, which is conducive to the etching of the chip;

[0047] Then the telescopic end of the electric telescopic rod 8 is controlled to reciprocate from the end to point A and from point A to the end until the chip is completely etched;

[0048] When the chip etching is completed, the telescopic end of the hydraulic cylinder 12 is controlled to extend so that the circular placement box 18 moves to the top of the etching cylinder 1, and then the electric telescopic rod 8 is controlled to restore the circular placement box 18 to its initial position, and finally, the arc-shaped sealing plate 25 blocks the through-hole area 20; wherein, when the circular placement box 18 moves to the top of the etching cylinder 1, the water pipe 21 returns to normal, and then the water pipe 21 is connected to the external wastewater collection device, and the water inlet pipe 9 is connected to the external water supply equipment, and then the water is transported to the spiral water pipe 26 through the water inlet pipe 9 through the water supply equipment, and finally sprayed on the chip through the nozzle 27 to clean the chip, and then the cleaned water flows into the wastewater collection device through the water pipe 21. After cleaning, the chip is removed.

[0049] The above description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An etching device for semiconductor chip production, comprising an etching cylinder (1), a cylinder cover (2) and a hydraulic cylinder (12), characterized in that: A flushing part for cleaning the chip is provided on the inner top surface of the cylinder cover (2), a hollow shaft (17) is rotatably provided on the cylinder cover (2), a gear (7) is fixedly connected to the top of the hollow shaft (17), a circular placement box (18) matching the etching cylinder (1) is rotatably provided on the bottom outer wall, and a stirring part for stirring the chip is provided on the outer wall of the hollow shaft (17); A rotating shaft (11) is rotatably disposed inside the hollow shaft (17), a gear 2 (10) is fixedly connected to the top of the rotating shaft (11), a plurality of through hole areas (20) are evenly disposed at the bottom of the circular placement box (18), and a plurality of arc-shaped sealing plates (25) for sealing the through hole areas (20) are evenly fixedly connected to the bottom of the rotating shaft (11); An electric telescopic rod (8) is provided on the top surface of the cylinder cover (2), and a transmission component is provided at the telescopic end of the electric telescopic rod (8) which first acts on gear 2 (10) and then acts on gear 1 (7); The transmission assembly comprises a rectangular frame (16) arranged at the telescopic end of the electric telescopic rod (8), a movable block (19) slidably arranged in the rectangular frame (16) and a compression spring (28), wherein the compression spring (28) is located at an end away from the electric telescopic rod (8), a bar-shaped toothed plate 2 (15) matching with gear 2 (10) is provided on the top surface of the movable block (19), a limiting member acting on the bar-shaped toothed plate 2 (15) is provided on the barrel cover (2), and a bar-shaped toothed plate 1 (6) matching with gear 1 (7) is provided on the side surface of the rectangular frame (16).

2. The etching device for semiconductor chip production according to claim 1, characterized in that: The limiting member comprises a limiting rod (14) arranged on the top surface of the cylinder cover (2), and a limiting groove (13) matching with the limiting rod (14) is formed on the side surface of the second strip-shaped tooth plate (15).

3. The etching device for semiconductor chip production according to claim 2, characterized in that: The stirring member comprises an annular plate (30) fixedly connected to the outer wall of the bottom of the hollow shaft (17), a plurality of rotating plates (23) are evenly arranged on the outer wall of the annular plate (30), and the rotating plates (23) are rotatably arranged with the circular placement box (18).

4. The etching device for semiconductor chip production according to claim 3, characterized in that: An arc-shaped slide block (29) is provided at the outer end of the rotating plate (23), and an arc-shaped groove (24) is provided on the inner wall of the circular placement box (18) to match the arc-shaped slide block (29), and the arc of the arc-shaped groove (24) is 110°.

5. The etching device for semiconductor chip production according to claim 4, characterized in that: The through hole area (20) is in an arc shape, and the arc of the through hole area (20) is 60°, and the arc-shaped sealing plate (25) and the bottom of the circular placement box (18) are arranged in a dynamic sealing structure.

6. The etching device for producing semiconductor chips according to claim 5, characterized in that: The flushing component comprises a spiral water pipe (26) arranged on the inner top surface of the cylinder cover (2), a plurality of spray heads (27) are evenly mounted on the spiral water pipe (26), and a water inlet pipe (9) connected to the spiral water pipe (26) is provided on the top of the cylinder cover (2).

7. The etching device for semiconductor chip production according to claim 1, characterized in that: A water pipe (21) is provided at the bottom of the outer wall of the circular placement box (18), a placement groove (22) is provided on the outer wall of the circular placement box (18) to cooperate with the water pipe (21), and the water pipe (21) is made of elastic and flexible rubber material.

8. The etching device for semiconductor chip production according to claim 1, characterized in that: The bottom of the etching cylinder (1) is provided with a cylinder bottom (3), and the bottom of the etching cylinder (1) is provided with a liquid outlet pipe (4) with a valve (5), and one end of the liquid outlet pipe (4) passes through the cylinder bottom (3).

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