A high-frequency microwave printed circuit board with high heat dissipation performance and a preparation method thereof

By preparing nanocomposite powder and modified ceramic powder in high-frequency microwave printed circuit boards, the compatibility problem between ceramics and polytetrafluorovinyl matrix is ​​solved, the thermal conductivity and dielectric properties of the material are improved, and signal transmission is enhanced and mechanical properties.

CN118973157BActive Publication Date: 2024-12-10HUIZHOU RUNZHONG TECH CO LTD
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Patent Information

Application Number
CN202411449811.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-17
Publication Date
2024-12-10
Estimated Expiration
2044-10-17

AI Technical Summary

Technical Problem

The material mismatch between the ceramic filler and the polytetrafluorovinyl matrix in high-frequency microwave printed circuit boards leads to poor chemical compatibility and difficulty in uniform dispersion, affecting the dielectric and thermal conductivity of the material.

Method used

The nanocomposite powder is prepared by hydrothermal reaction between magnesium acetate solution and aqueous ammonia solution, and the polytetrafluoroethylene powder and low-mediated heat microwave ceramic powder are modified by natural surface treatment agent to form a uniform composite material, improving ceramics and polytetrafluoroethylene powder The compatibility of vinyl fluoride promotes its uniform dispersion in the composite material.

Benefits of technology

It improves the thermal conductivity and dielectric properties of high-frequency microwave printed circuit boards, reduces dielectric losses, enhances signal transmission performance and mechanical strength, and extends the operating frequency and life of the circuit board.

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Abstract

The present invention relates to the technical field of printed circuit boards, and in particular to a high-frequency microwave printed circuit board with high heat dissipation performance and a preparation method thereof. The present invention comprises the following steps: preparation of low-dielectric microwave ceramic powder; modification of high-frequency microwave substrate raw materials; and composite pressing of microwave printed circuit boards. The present invention prepares a precursor solution I by using a magnesium acetate solution and an ammonia solution, and then adds BaCl 2 Titanium tetrachloride is dropped into the solution to obtain a precursor solution II, and the precursor solution I is subjected to a hydrothermal reaction first. When the reaction is halfway through, the precursor solution II and urea are added, and the heating is continued to allow the two precursor solutions to undergo a hydrothermal reaction at the same time. Nano-boron nitride is then added midway to generate a nano-composite powder with a three-phase composite structure having high thermal conductivity, low dielectric constant and high mechanical strength, so that the obtained high-frequency microwave thermal conductive single-layer copper-clad substrate also has high thermal conductivity, low dielectric constant and high mechanical strength, thereby improving the signal transmission performance of the obtained circuit board.
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Citation Information

Patent Citations

  • High-efficiency and high-frequency microwave composite multilayer board manufacturing method

    CN107567209A

  • Microwave dielectric ceramics and polytetrafluoroethylene-ceramic composite substrate, and preparation methods thereof

    CN107746272A

  • Preparation method of low-loss ultrathin PTFE microwave dielectric substrate

    CN117429141A

  • Ceramic filler, method of preparing the ceramic filler and applications as resonator and laminate thereof

    US20150274926A1