An edge grinding machine for processing quartz wafers

Abstract

The present invention relates to the technical field of quartz wafer processing, and in particular to an edge grinding machine for processing quartz wafers, comprising an external frame, a grinding table, a mounting frame, a main motor and a rotating shaft, wherein the rotating shaft is rotatably connected to the external frame, the main motor provides power to the rotating shaft, the mounting frame is fixed in the external frame, the upper part of the mounting frame is fixed with the grinding table, and the rotating shaft passes through the grinding table. A plurality of quartz wafer substrates are respectively placed in a placement bracket, and then the main motor drives the grinding head in the middle of the grinding table to rotate through the rotating shaft. At the same time, the rotating shaft drives the universal coupling through the first synchronous gear set, and the universal coupling drives the turntable in the placement bracket to rotate, thereby, the grinding head can grind the edge of the rotating quartz wafer substrate.

Description

Technical Field

[0001] The invention relates to the technical field of quartz wafer processing, in particular to an edge grinding machine for processing quartz wafers. Background Art

[0002] Quartz wafer substrate is an important part of the semiconductor industry, and its processing accuracy and quality have a vital impact on the performance of the entire product. In the manufacturing process of quartz wafers, substrate edge grinding is an indispensable process, which aims to achieve uniform specifications of the wafer carrier and ensure the smooth progress of subsequent processes.

[0003] Specifically, the edge grinding process is to carefully trim the edge of the quartz wafer substrate through precise mechanical operations. This step not only requires the removal of burrs and irregularities on the edge, but also ensures that the edge is smooth and flat after grinding to meet uniform specifications. Such processing not only helps to improve the appearance quality of the wafer, but more importantly, it is of great significance to ensure the physical properties and stability of the wafer.

[0004] However, in the existing quartz wafer substrate primary processing, although the application of grinders is extensive, their processing methods still have some limitations. At present, most grinders process quartz wafer substrates one by one, that is, only one wafer is processed at a time. This method is relatively inefficient, especially in the face of large-scale production needs, and it is difficult to meet the high-efficiency and high-quality production requirements.

[0005] In order to improve processing efficiency, it is possible to consider technical upgrading and transformation of existing grinders. Summary of the invention

[0006] In order to overcome the disadvantage that the prior art is relatively inefficient in the initial processing of quartz wafer substrates, which can only be performed by a single grinding method and its production efficiency needs to be improved, the technical problem is: to provide a multi-station edge grinding machine for processing quartz wafers.

[0007] The technical solution is: a grinding machine for processing quartz wafers, including an external frame, a grinding table, a mounting frame, a main motor and a rotating shaft. The top of the external frame is open and the bottom is closed. The rotating shaft is rotatably connected to the midpoint of the bottom cover of the external frame. The main motor provides power to the rotating shaft. Four groups of mounting frames are orthogonally distributed with the rotating shaft as the center and are fixedly connected to the bottom cover inside the external frame. The upper part of the mounting frame is fixedly connected to the grinding table. The rotating shaft passes through the grinding table and also includes a grinding unit and a fixing unit. The grinding unit includes a slide rail, a sliding bracket and a grinding head. The upper part of the rotating shaft is radially provided with a slide rail, the sliding bracket is slidably connected to the slide rail, and the centrifugal end of the sliding bracket is connected to the grinding head. The fixing unit includes a placing bracket, an electric push rod, a limit rod, a first synchronous gear set, a universal coupling and a turntable. The placing bracket is rotatably connected to the top of the mounting bracket, and a torsion spring is connected between the placing bracket and the mounting bracket. The rack is in the shape of a missing disc, and the openings of the missing disc all point to the rotating shaft. The upper part of the placement bracket is connected with an electric push rod through the bracket, and a turntable is rotatably connected inside the placement bracket. A limit rod that can slide horizontally is arranged on the inner side of the placement bracket, and the limit rod can limit the quartz wafer substrate on the turntable. The first synchronous gear group is arranged in the external frame, and the rotating shaft transmits the first synchronous gear group, and the first synchronous gear group transmits the turntable through the universal coupling, thereby driving the quartz wafer substrate to rotate, and the grinding head rotates with the rotating shaft and facilitates the grinding of the quartz wafer substrate. The first synchronous gear group consists of a center gear a and a planetary gear a. The center gear a is fixed on the rotating shaft, and four planetary gears a are rotatably connected in the external frame. The center gear a is meshed with the planetary gear a at the same time. The lower end of the universal coupling is connected to the center of the planetary gear a, and the upper end of the universal coupling is connected to the center of the bottom surface of the turntable.

[0008] Furthermore, the grinding unit also includes a threaded end, a control ring, a lifting ring and a connecting rod. The threaded end is fixedly connected to the top of the rotating shaft, the control ring is connected to the threaded end through a thread, the bottom of the control ring is connected to the lifting ring through a spline rotation, and the lifting ring and the sliding bracket are hinged with a connecting rod at the centripetal end.

[0009] Furthermore, the fixing unit also includes a correction component for correcting the quartz wafer substrate to the center of the turntable, the correction component includes a moving ring and a lever, the moving ring is rotatably embedded in the placement bracket, an oblique groove is opened in the moving ring, the limit rod limits radial sliding on the placement bracket and simultaneously limits sliding in the oblique groove, the lever is fixed to the moving ring, and the lever passes through the placement bracket.

[0010] Furthermore, the grinding head can be replaced by means of a fixing bolt.

[0011] Furthermore, a rotating rubber head is provided at the telescopic end of the electric push rod, and a rubber gasket is provided on the turntable.

[0012] Furthermore, it also includes a second synchronous gear set and a brush shaft. The brush shaft is rotatably connected to the grinding table. A brush plate is arranged on the outside of the brush shaft. The rotating shaft transmits the power to the brush shaft through the second synchronous gear set. The second synchronous gear set consists of a center gear b and a planetary gear b. The center gear b is fixed in the middle of the rotating shaft. The planetary gear b is connected to the lower end of the brush shaft. The center gear b and the planetary gear b are meshed with each other.

[0013] Furthermore, it also includes a threaded rod, a cone block and a wedge block. The brush plate is slidably connected to the brush shaft through the sliding rod. A spring is connected between the brush plate and the brush shaft. The inner end of the sliding rod is fixedly connected to the wedge block. The threaded rod is threadedly connected to the top of the brush shaft. The lower end of the threaded rod is rotatably connected to the cone block. The inclined surface of the cone block frictionally contacts the inclined surface of the wedge block.

[0014] Furthermore, it also includes a wave plate, a ball shaft and a return spring. The brush shaft is a telescopic rod structure, and a return spring is connected between the upper part and the lower part of the brush shaft. The wave plate is fixed to the grinding table and is located outside the brush shaft. The upper part of the brush shaft is fixed to the ball shaft, and the ball shaft can be slidably embedded in the wave plate.

[0015] Furthermore, it also includes a cam shaft, a transmission gear and a limiting ring, the limiting ring is rotatably connected in the external frame, the transmission gear is rotatably connected to the inner bottom surface of the external frame, the transmission gear is meshed with the planetary gear a in the first synchronous gear set, a gear ring is arranged at the bottom of the limiting ring, the gear ring is meshed with the transmission gear, a guide groove is opened on the upper part of the limiting ring, a cam shaft is fixedly connected to the placement bracket, the cam shaft is limited and slid in the guide groove, and a first slide groove, a second slide groove and a third slide groove with decreasing heights but smoothly connected are arranged in the guide groove.

[0016] The beneficial effects are as follows: 1. Multiple quartz wafer substrates are placed in the placement brackets respectively, and then the main motor drives the grinding head in the middle of the grinding table to rotate through the rotating shaft. At the same time, the rotating shaft transmits the universal coupling through the first synchronous gear set, and the universal coupling will drive the turntable in the placement bracket to rotate. Thus, the grinding head can grind the edge of the rotating quartz wafer substrate. Compared with the existing method of processing the quartz wafer substrates by grinding one by one, this device can grind four quartz wafers at the same time, and the grinding effect is uniform, thereby improving the productivity of quartz wafers.

[0017] 2. The rotating shaft drives the brush shaft to rotate through the second synchronous gear set. The brush plate outside the brush shaft can clean the grinding head in friction contact, reducing the impact of quartz debris on grinding. The extension length of the brush plate can be adjusted by rotating the threaded rod, which is very convenient and practical to use.

[0018] 3. The upper part of the limit ring is provided with the first slide groove, the second slide groove and the third slide groove with decreasing height but smoothly connected. By limiting and guiding the convex shaft fixed to the placement bracket, the inclination angle of the placement bracket can be automatically adjusted, so that the grinding head can evenly grind the upper edge, side and lower edge of the edge of the quartz wafer substrate, and make a perfect transition on the edge of the grinding surface, thereby improving the finished product quality of the quartz wafer substrate and enhancing market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 It is a cross-sectional view of the three-dimensional structure of the present invention;

[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of the grinding unit of the present invention;

[0022] Figure 4 This is a three-dimensional structural separation diagram of the grinding unit of the present invention;

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the fixing unit of the present invention;

[0024] Figure 6 A three-dimensional structural separation diagram of the correction component of the present invention;

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the brush shaft of the present invention;

[0026] Figure 8 It is a schematic diagram of the three-dimensional structure of the brush plate, cone block and wedge block of the present invention;

[0027] Fig. 9 It is a three-dimensional structural schematic diagram of the cam shaft, the limiting ring and the transmission gear of the present invention;

[0028] Fig.10 It is a three-dimensional structural cross-sectional view of the limiting ring of the present invention.

[0029] Parts names and serial numbers in the figure: 1_external frame, 2_grinding table, 3_main motor, 4_rotating shaft, 401_threaded end, 402_slide rail, 6_control ring, 7_lifting ring, 8_connecting rod, 9_sliding bracket, 10_grinding head, 11_fixing bolt, 12_mounting frame, 13_placing bracket, 14_electric push rod, 1401_rubber head, 15_limit rod, 16_moving ring, 1601_oblique groove, 17_push rod, 1 9_first synchronous gear set, 20_universal coupling, 21_turntable, 2101_rubber gasket, 22_second synchronous gear set, 23_brush shaft, 2301_brush plate, 24_threaded rod, 25_cone block, 26_wedge block, 27_wave plate, 28_ball shaft, 29_reset spring, 30_cam shaft, 31_limiting ring, 3101_first slide groove, 3102_second slide groove, 3103_third slide groove, 32_transmission gear. DETAILED DESCRIPTION

[0030] The preferred technical solutions of the present invention are described in detail below with reference to the accompanying drawings.

[0031] Embodiment: A grinding machine for processing quartz wafers, such as Figure 1-Figure 10As shown, it includes an external frame 1, a grinding table 2, a mounting frame 12, a main motor 3 and a rotating shaft 4. The external frame 1 is open at the top and closed at the bottom. The rotating shaft 4 is rotatably connected to the midpoint of the bottom cover of the external frame 1. The main motor 3 provides power to the rotating shaft 4. Four groups of mounting frames 12 are orthogonally distributed with the rotating shaft 4 as the center and are fixed to the bottom cover inside the external frame 1. The upper part of the mounting frame 12 is fixedly connected to the grinding table 2. The rotating shaft 4 passes through the grinding table 2. It also includes a grinding unit and a fixing unit. The grinding unit includes a slide rail 402, a sliding bracket 9 and a grinding head 10. Eight slide rails 402 are radially arranged on the upper part of the rotating shaft 4. The sliding bracket 9 is slidably connected to the slide rail 402, the centrifugal end of the sliding bracket 9 is connected to a grinding head 10, and the grinding head 10 can be replaced by a fixing bolt 11. The fixing unit includes a placement bracket 13, an electric push rod 14, a limit rod 15, a first synchronous gear set 19, a universal coupling 20 and a turntable 21. The placement bracket 13 is rotatably connected to the top of the mounting frame 12. A torsion spring is connected between the placement bracket 13 and the mounting frame 12. The placement bracket 13 is in the shape of a missing disc, and the openings of the missing disc all point to the rotating shaft 4. The upper part of the placement bracket 13 is connected to an electric push rod 14 through a bracket. The telescopic end of the electric push rod 14 is provided with a rotating rubber head 1401. The placement bracket 13 is rotated in The rotating disk 21 is dynamically connected to the rotating disk 21, and a rubber gasket 2101 is arranged on the rotating disk 21. A limit rod 15 capable of horizontal sliding is arranged on the inner side of the placing bracket 13, and the limit rod 15 can limit the quartz wafer substrate on the rotating disk 21. The first synchronous gear set 19 is arranged in the external frame 1, and the rotating shaft 4 drives the first synchronous gear set 19. The first synchronous gear set 19 drives the rotating disk 21 through the universal coupling 20, thereby driving the quartz wafer substrate to rotate. The grinding head 10 rotates with the rotating shaft 4 and facilitates the grinding of the quartz wafer substrate. Specifically, the first synchronous gear set 19 is composed of a central gear a and a planetary gear a. The central gear a Fixed on the rotating shaft 4, the four planetary gears a are rotatably connected in the external frame 1, and the central gear a is meshed with the planetary gears a at the same time. The lower end of the universal coupling 20 is connected to the center of the planetary gear a, and the upper end of the universal coupling 20 is connected to the center of the bottom surface of the turntable 21. After the main motor 3 drives the rotating shaft 4 to rotate, the four planetary gears a can be driven to rotate synchronously through the central gear a. The planetary gears a drive the turntable 21 to rotate through the universal coupling 20. Since the electric push rod 14 fixes the quartz wafer substrate on the turntable 21, the turntable 21 will drive the quartz wafer substrate to rotate continuously, and then the edge of the quartz wafer substrate is polished by the polishing head 10.

[0032] like Figure 3 and Figure 4As shown, the grinding unit also includes a threaded end 401, a control ring 6, a lifting ring 7 and a connecting rod 8. The threaded end 401 is fixedly connected to the top of the rotating shaft 4, the control ring 6 is connected to the threaded end 401 by a thread, and the bottom of the control ring 6 is rotatably connected to the lifting ring 7 by a spline. The lifting ring 7 and the sliding bracket 9 are hinged with a connecting rod 8 at the centripetal end. The counterclockwise rotation of the control ring 6 can drive the lifting ring 7 to descend, and the lifting ring 7 will push the sliding bracket 9 to move centrifugally in the slide rail 402 through the connecting rod 8. At this time, the grinding head 10 will be close to the placement bracket 13, and the reverse rotation of the control ring 6 will drive the lifting ring 7 to rise, and the lifting ring 7 will pull the sliding bracket 9 to move centrifugally in the slide rail 402 through the connecting rod 8. At this time, the grinding head 10 will be away from the placement bracket 13 and the quartz wafer substrate, which has the effect of being able to appropriately adjust the position of the grinding head 10 according to the actual required diameter of the quartz wafer substrate.

[0033] like Figure 5 and Figure 6 As shown, the fixing unit also includes a correction component for correcting the quartz wafer substrate to the center of the turntable 21, the correction component includes a moving ring 16 and a lever 17, the moving ring 16 is rotatably embedded in the placement bracket 13, an oblique groove 1601 is provided in the moving ring 16, the limiting rod 15 is limited to radial sliding on the placement bracket 13 and simultaneously limited to sliding in the oblique groove 1601, the lever 17 is fixed to the moving ring 16, the lever 17 passes through the placement bracket 13, after the quartz wafer substrate is placed on the turntable 21, the staff horizontally pushes the lever 17, and the lever 17 will drive the moving ring 16 to The placement bracket 13 rotates inside. Since the oblique groove 1601 opened in the movable ring 16 limits the limit rod 15, the oblique groove 1601 can push the three limit rods 15 to move radially. The limit rod 15 centers the quartz wafer substrate on the turntable 21, and then the lever 17 is moved in the opposite direction to retract the limit rod 15. Finally, the electric push rod 14 presses and fixes the quartz wafer substrate on the turntable 21. In order to improve the production efficiency and the automation level of the device, a cylinder can be installed on the placement bracket 13, and the lever 17 is pushed by the telescopic rod of the cylinder.

[0034] like Figure 7 As shown, it also includes a second synchronous gear set 22 and a brush shaft 23. The brush shaft 23 is rotatably connected to the grinding table 2. A brush plate 2301 is arranged on the outside of the brush shaft 23. The rotating shaft 4 transmits the brush shaft 23 through the second synchronous gear set 22. The second synchronous gear set 22 is composed of a central gear b and a planetary gear b. The central gear b is fixed in the middle of the rotating shaft 4. The planetary gear b is connected to the lower end of the brush shaft 23. The central gear b and the planetary gear b are meshed with each other. During the rotation of the rotating shaft 4, the planetary gear b is driven to rotate synchronously through the central gear b, thereby driving the brush shaft 23 to rotate continuously. The brush shaft 23 is used to clean the outside of the grinding head 10.

[0035] like Figure 7 and Figure 8 As shown, it also includes a threaded rod 24, a cone block 25, a wedge block 26, a wave plate 27, a ball shaft 28 and a return spring 29. The brush plate 2301 is slidably connected to the brush shaft 23 through a sliding rod. A spring is connected between the brush plate 2301 and the brush shaft 23. The inner end of the sliding rod is fixedly connected with a wedge block 26. The threaded rod 24 is threadedly connected to the top of the brush shaft 23. The lower end of the threaded rod 24 is rotatably connected with the cone block 25. The inclined surface of the cone block 25 frictionally contacts the inclined surface of the wedge block 26, that is, rotating the threaded rod 24 can push the cone block 25 to move downward, and the cone block 25 can contact and push the wedge block 26 to move horizontally, thereby pushing the brush plate 2301 outward, so that the brush plate 2301 fits the grinding head 10 more closely, thereby improving the cleaning effect of the grinding head 10. The brush shaft 23 is telescopic Rod structure, and the upper and lower parts of the brush shaft 23 slide with each other and are connected with a return spring 29, the wave plate 27 is fixed to the grinding table 2 and is located outside the brush shaft 23, and the upper part of the brush shaft 23 is fixed with a ball shaft 28, and the ball shaft 28 can be slidably embedded in the wave plate 27, and the planetary gear b is connected to the lower part of the brush shaft 23. Therefore, during the period when the planetary gear b drives the brush shaft 23 to rotate, the upper part of the brush shaft 23 can rotate relative to the wave plate 27, and the ball shaft 28 will also fluctuate along the upper shape of the wave plate 27, thereby driving the upper part of the brush shaft 23 to move up and down, thereby achieving the effect of the brush shaft 23 rotating under the drive of the planetary gear b and moving back and forth longitudinally, which will greatly improve the cleaning effect of the brush shaft 23 on the grinding head 10.

[0036] like Fig. 9 and Fig.10As shown, it also includes a cam 30, a transmission gear 32 and a limiting ring 31. The limiting ring 31 is rotatably connected in the external frame 1, and the transmission gear 32 is rotatably connected to the inner bottom surface of the external frame 1. The transmission gear 32 is meshed with the planetary gear a in the first synchronous gear set 19. A gear ring is arranged at the bottom of the limiting ring 31, and the gear ring is meshed with the transmission gear 32. A guide groove is opened on the upper part of the limiting ring 31. The placement bracket 13 is fixedly connected with the cam 30, and the cam 30 is limited and slides in the guide groove. The guide groove is provided with a first slide groove 3101, a second slide groove 3102 and a third slide groove 3103 with decreasing heights but smoothly connected. The rotating shaft 4 drives the first synchronous gear set 19 to rotate, and then the transmission gear 32 drives the limiting ring 31 to rotate. Since the cam 30 is located at the centrifugal end of the placement bracket 13, it can be known from the lever principle that the placement bracket 13 can be flipped by adjusting the longitudinal height of the cam 30, thereby being able to Adjust the corresponding position of the grinding head 10 contacting the edge of the quartz wafer substrate, so that when the limit ring 31 rotates to make the convex shaft 30 move to the first slide groove 3101, the centripetal end of the placement bracket 13 is tilted downward, that is, the upper edge of the edge of the quartz wafer substrate is in contact with the grinding head 10 for grinding, and when the limit ring 31 rotates to make the convex shaft 30 move to the second slide groove 3102, the placement bracket 13 is horizontal at this time, and the side of the quartz wafer substrate is ground, and when the limit ring 31 rotates until the convex shaft 30 is located in the third slide groove 3103, the centripetal end of the placement bracket 13 will tilt upward, and the grinding head 10 grinds the lower edge of the edge of the quartz wafer substrate. As the limit ring 31 continues to rotate, the grinding head 10 will evenly grind the upper edge, side surface and lower edge of the quartz wafer substrate, and make a perfect transition on the edge portion of the grinding surface, thereby improving the finished product quality of the quartz wafer substrate and improving market competitiveness.

[0037] The working principle of the embodiment of the present invention is as follows: the staff places the quartz wafer substrate to be polished on the turntable 21, and then horizontally pushes the lever 17, the lever 17 will drive the moving ring 16 to rotate in the placement bracket 13, because the oblique groove 1601 provided in the moving ring 16 limits the limit rod 15, therefore, the oblique groove 1601 can simultaneously push the three limit rods 15 to move radially, the limit rod 15 will center the quartz wafer substrate on the turntable 21, and then the lever 17 is moved in the opposite direction to retract the limit rod 15, the electric push rod 14 is started to unfold the telescopic end, the electric push rod 14 presses and fixes the quartz wafer substrate to the turntable 21 through the rubber head 1401, the control ring 6 is rotated to make the polishing head 10 move radially, the distance between the polishing head 10 and the quartz wafer substrate is adjusted according to the actual production specifications of the quartz wafer substrate, and then the main motor 3 is turned on, the main motor 3 drives the rotating shaft 4 The grinding head 10 rotates continuously, during which the rotating shaft 4 drives the universal coupling 20 to rotate through the first synchronous gear set 19, and the universal coupling 20 drives the turntable 21 to rotate continuously, and the quartz wafer substrate fixed in the turntable 21 will rotate synchronously, and the grinding head 10 will also efficiently grind the edge of the continuously rotating quartz wafer substrate. Compared with the traditional single grinding method, the device is provided with four placement brackets 13, which greatly improves the processing efficiency of the quartz wafer substrate. When the rotating shaft 4 rotates continuously, the brush plate 2301 on the brush shaft 23 will also perform contact cleaning on the grinding head 10. The brush plate 2301 can be pushed outward by rotating the threaded rod 24, thereby increasing the contact area between the brush plate 2301 and the grinding head 10. The brush shaft 23 rotates driven by the second synchronous gear set 22 and moves back and forth longitudinally, thereby improving the cleaning effect of the brush shaft 23 on the grinding head 10.

[0038] The above is a detailed introduction to the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An edge grinding machine for processing quartz wafers, comprising an external frame (1), a grinding table (2), a mounting frame (12), a main motor (3) and a rotating shaft (4), wherein the rotating shaft (4) is rotatably connected to the external frame (1), the main motor (3) provides power to the rotating shaft (4), the mounting frame (12) is fixedly connected to the external frame (1), the grinding table (2) is fixedly connected to the upper part of the mounting frame (12), and the rotating shaft (4) passes through the grinding table (2), characterized in that: The invention also comprises a grinding unit and a fixing unit. The grinding unit comprises a slide rail (402), a sliding bracket (9) and a grinding head (10). The upper part of the rotating shaft (4) is radially provided with the slide rail (402). The sliding bracket (9) is slidably connected in the slide rail (402). The centrifugal end of the sliding bracket (9) is connected to the grinding head (10). The fixing unit comprises a placement bracket (13), an electric push rod (14), a limit rod (15), a first synchronous gear set (19), a universal coupling (20) and a rotating disk (21). The placement bracket (13) rotates The mounting bracket (12) is connected to the top of the mounting bracket (12). The upper part of the mounting bracket (13) is connected to an electric push rod (14) through the bracket. A turntable (21) is rotatably connected inside the mounting bracket (13). A limit rod (15) capable of horizontal sliding is provided on the inner side of the mounting bracket (13). The limit rod (15) can limit the position of the quartz wafer substrate on the turntable (21). A first synchronous gear set (19) is provided in the outer frame (1). The rotating shaft (4) drives the first synchronous gear set (19). The first synchronous gear set (19) is connected to the outer frame (12). The first synchronous gear set (19) is connected to the outer frame (12). (20) drives the turntable (21), thereby driving the quartz wafer substrate to rotate, and the grinding head (10) rotates with the rotating shaft (4) to facilitate grinding of the quartz wafer substrate; the grinding unit also includes a threaded end (401), a control ring (6), a lifting ring (7) and a connecting rod (8), the top of the rotating shaft (4) is fixedly connected to the threaded end (401), the control ring (6) is connected to the threaded end (401) through a thread, the bottom of the control ring (6) is rotatably connected to the lifting ring (7) through a spline, and the lifting ring (7) and the sliding bracket (9) are connected to the centripetal end A connecting rod (8) is hingedly connected; the fixing unit also includes a correction component for correcting the quartz wafer substrate to the center of the turntable (21), the correction component including a moving ring (16) and a lever (17), the moving ring (16) is rotatably embedded in the placement bracket (13), an oblique groove (1601) is provided in the moving ring (16), a limiting rod (15) is limited in radial sliding on the placement bracket (13) and simultaneously limited in sliding in the oblique groove (1601), the lever (17) is fixedly connected to the moving ring (16), and the lever (17) passes through the placement bracket (13).

2. An edge grinding machine for processing quartz wafers according to claim 1, characterized in that: The grinding head (10) can be replaced by means of the fixing screw (11).

3. The edge grinding machine for processing quartz wafers according to claim 2, characterized in that: A rotatable rubber head (1401) is provided at the telescopic end of the electric push rod (14), and a rubber gasket (2101) is provided on the turntable (21).

4. The edge grinding machine for processing quartz wafers according to claim 3, characterized in that: It also includes a second synchronous gear set (22) and a brush shaft (23); the brush shaft (23) is rotatably connected to the grinding table (2); a brush plate (2301) is arranged outside the brush shaft (23); and the rotating shaft (4) transmits power to the brush shaft (23) via the second synchronous gear set (22).

5. The edge grinding machine for processing quartz wafers according to claim 4, characterized in that: The invention also comprises a threaded rod (24), a cone block (25) and a wedge block (26); the brush plate (2301) is slidably connected to the brush shaft (23) via a sliding rod; a spring is connected between the brush plate (2301) and the brush shaft (23); the wedge block (26) is fixedly connected to the inner end of the sliding rod; the threaded rod (24) is threadedly connected to the top of the brush shaft (23); the lower end of the threaded rod (24) is rotatably connected to the cone block (25); the inclined surface of the cone block (25) is in frictional contact with the inclined surface of the wedge block (26).

6. An edge grinding machine for processing quartz wafers according to claim 5, characterized in that: The invention also comprises a wave plate (27), a ball shaft (28) and a return spring (29); the brush shaft (23) is a telescopic rod structure, and a return spring (29) is connected between the upper part and the lower part of the brush shaft (23); the wave plate (27) is fixedly connected to the grinding table (2) and is located outside the brush shaft (23); the upper part of the brush shaft (23) is fixedly connected to the ball shaft (28), and the ball shaft (28) can be slidably embedded in the wave plate (27).

7. An edge grinding machine for processing quartz wafers according to claim 6, characterized in that: The invention also comprises a convex shaft (30), a transmission gear (32) and a limiting ring (31), wherein the limiting ring (31) is rotatably connected to the inside of the external frame (1), the transmission gear (32) is rotatably connected to the inner bottom surface of the external frame (1), the transmission gear (32) is meshed with the first synchronous gear set (19), a gear ring is arranged at the bottom of the limiting ring (31), the gear ring is meshed with the transmission gear (32), a guide groove is arranged at the top of the limiting ring (31), a convex shaft (30) is fixedly connected to the placement bracket (13), the convex shaft (30) is limitedly slidable in the guide groove, and a first slide groove (3101), a second slide groove (3102) and a third slide groove (3103) are arranged in the guide groove, the heights of which are gradually reduced but which are smoothly connected.

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