Spacing adjusting device

Abstract

The utility model belongs to the technical field of PCB production and manufacturing, and discloses a spacing adjusting device. The device comprises a rack, a conveying mechanism, a plate beating mechanism, a plate arranging mechanism and an adjusting mechanism. The conveying mechanism is arranged on the rack, the conveying mechanism is used for conveying the PCBs to the second station along the first station, and the conveying speed of the conveying mechanism can be adjusted in the conveying direction; the board beating mechanism is arranged on the rack, and the board beating mechanism is used for pushing the PCB to a preset position; the board arranging mechanism is arranged on the rack and used for pushing the PCBs to the fixed edge position of the conveying mechanism from the preset position. The adjusting mechanism is used for adjusting the distance between two adjacent PCBs. According to the utility model, the continuity of two production processes of the PCB can be ensured, meanwhile, the consumption of relatively high labor cost and economic cost is not needed, and the production efficiency and the production rhythm of an assembly line are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board production and manufacturing, in particular to a spacing adjustment device. Background Art

[0002] The horizontal chemical copper process and horizontal electroplating process of PCB (Printed Circuit Board) are two continuous production processes.

[0003] In the prior art, the two different processes of horizontal chemical copper process and horizontal electroplating process are carried out separately. First, the chemical copper plating production equipment collects the boards after production, and then manually transfers them to the predetermined workstations, where special equipment places the boards on the electroplating copper equipment for production.

[0004] In the above two continuous production processes, the production speeds are different, the relative layout positions of the PCB boards are different, and the front-to-back spacings of adjacent PCB boards are also different. Therefore, the two production equipment cannot be simply docked. The above problems limit the improvement of the automation level of PCB boards, consume large labor costs and economic costs, and reduce the assembly line production efficiency and production rhythm of PCB boards. Utility Model Content

[0005] The utility model aims to provide a spacing adjustment device to solve the technical problems of limited automation level of PCB boards, high labor cost and economic cost, and reduced production efficiency and production rhythm of PCB boards due to different production speeds of horizontal chemical copper process and horizontal electroplating process, different relative arrangement positions of PCB boards and different spacings of PCB boards under the two processes.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The spacing adjustment device is used to adjust the spacing of PCB boards, including:

[0008] frame;

[0009] A conveying mechanism, arranged on the frame, used to convey the PCB board from the first station to the second station, and capable of adjusting the conveying speed in the conveying direction;

[0010] A clapper mechanism is provided on the frame, and is used to push the PCB board to a preset position;

[0011] A board-straightening mechanism, arranged on the frame, and used for pushing the PCB board from the preset position to the fixed side position of the conveying mechanism;

[0012] The adjustment mechanism is used to adjust the distance between two adjacent PCB boards.

[0013] As an optional solution of the spacing adjustment device, the conveying mechanism includes a servo motor and a plurality of transmission rollers arranged side by side and drivingly connected to the servo motor, and the PCB board is arranged on the transmission rollers.

[0014] As an optional solution of the spacing adjustment device, the outer surface of the transmission roller is ground.

[0015] As an optional solution of the spacing adjustment device, the clapper mechanism includes a sensor, a first driving member and a plurality of first baffles connected to the first driving member, the first driving member can drive the first baffles to push the PCB board to the preset position, the sensor is connected to the first driving member signal, and the sensor is used to identify the PCB board.

[0016] As an optional solution of the spacing adjustment device, the whole board mechanism includes a second driving member and a second baffle connected to the second driving member, and the second driving member can drive the second baffle to push the PCB board from the preset position to the fixed edge position.

[0017] As an optional solution of the spacing adjustment device, the adjustment mechanism includes a first mechanical arm and a positioning pin connected to the driving end of the mechanical arm, and the positioning pin can move the PCB board to adjust the spacing between two adjacent PCB boards.

[0018] As an optional solution for the spacing adjustment device, the driving end of the first mechanical arm is connected to one end of a connecting flange, the other end of the connecting flange is connected to a mounting bracket, and a plurality of positioning pins are slidably connected to the mounting bracket.

[0019] As an optional solution of the spacing adjustment device, the spacing adjustment device also includes a spray mechanism, which is arranged on the frame and located downstream of the whole board mechanism. The spray mechanism includes a spray rod placed above the conveying mechanism, and the spray rod is used to spray water onto the PCB board to form a water film on the surface of the PCB board.

[0020] As an optional solution of the spacing adjustment device, the spacing adjustment device also includes a detection mechanism arranged downstream of the whole board mechanism, the detection mechanism is signal-connected to the adjustment mechanism, the detection mechanism includes a detection sensor, and the detection sensor is used to detect the distance between two adjacent PCB boards after adjustment.

[0021] As an optional solution for the spacing adjustment device, the spacing adjustment device also includes a plate replenishing mechanism for replenishing the PCB board onto the conveying mechanism. The plate replenishing mechanism includes a second mechanical arm and a suction nozzle driven and connected to the second mechanical arm. When the board spacing between two adjacent PCB boards is greater than the length of a single PCB board, the suction nozzle is used to suck the PCB board and place it on the conveying mechanism.

[0022] Beneficial effects:

[0023] In the utility model, the frame is used to provide support and positioning for other functional mechanisms of the device. The conveying mechanism can convey the PCB board from the first station to the second station along the conveying direction. Specifically, two different process schemes are respectively executed for the PCB board at the two stations. In fact, the two different process schemes have different production speeds, different relative arrangement positions of the PCB boards and different spacings between the PCB boards. The present application adjusts the conveying speed of the conveying mechanism along the conveying direction to adapt to the different production speeds under the two production processes, so as to ensure the continuity of the two production processes, and at the same time, does not require large labor costs and economic costs, thereby improving the assembly line production efficiency and production rhythm of the PCB board; further, the PCB board on the conveying mechanism is pushed to the preset position for executing the process by the clapping mechanism, and when the conveying mechanism conveys the PCB board to the execution area of ​​the whole board mechanism, the whole board mechanism continues to push the PCB board from the preset position to the fixed edge position of the conveying mechanism, and the PCB board arriving at this position can adapt to the production mode of the second station, thereby completing the adjustment of the relative arrangement of the PCB board during the conveying process from the first station to the second station; in addition, the spacing between the two PCB boards can be adjusted by the adjustment mechanism, so that the spacing between the PCB boards is completed during the conveying process from the first station to the second station. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is an axonometric diagram of the spacing adjustment device provided by an embodiment of the utility model;

[0025] Figure 2 It is a structural schematic diagram of the conveying mechanism provided by an embodiment of the utility model;

[0026] Figure 3 It is a partial schematic diagram of the clapper mechanism provided in the embodiment of the utility model;

[0027] Figure 4 It is a structural schematic diagram of the whole plate mechanism provided by an embodiment of the utility model;

[0028] Figure 5 It is a structural schematic diagram of the adjustment mechanism provided by the embodiment of the utility model;

[0029] Figure 6It is a partial schematic diagram of the spray mechanism provided by the embodiment of the utility model;

[0030] Figure 7 It is a partial schematic diagram of the detection mechanism provided by the embodiment of the utility model;

[0031] Figure 8 It is a structural schematic diagram of a plate filling mechanism provided in an embodiment of the utility model.

[0032] In the figure:

[0033] 1. Frame;

[0034] 2. Conveying mechanism; 21. Servo motor; 22. Transmission roller; 23. Servo controller; 24. Transmission spindle; 25. Feeding sensor;

[0035] 3. Clapper mechanism; 31. Sensor; 32. First driving member; 33. First stopper; 34. Guide rail; 35. Connecting plate;

[0036] 4. whole plate mechanism; 41. second driving member; 42. second stop rod; 43. reference stop plate; 44. slide rail;

[0037] 5. Adjustment mechanism; 51. First mechanical arm; 52. Positioning pin; 53. Connecting flange; 54. Mounting bracket;

[0038] 6. Spray mechanism; 61. Spray rod; 62. Water pump; 63. Check valve; 64. Filter; 65. Solenoid valve; 66. Flow meter;

[0039] 7. Detection mechanism; 71. Detection sensor; 72. CCD camera; 73. Fixing seat;

[0040] 8. Plate-repairing mechanism; 81. Second mechanical arm; 82. Suction nozzle;

[0041] 9. Material rack. DETAILED DESCRIPTION

[0042] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0043] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0046] Please refer to the attached Figure 1 The present embodiment relates to a spacing adjustment device (hereinafter referred to as "device"), which is used to adjust the spacing of PCB boards, and specifically includes a frame 1, a conveying mechanism 2, a paving mechanism 3, a board-straightening mechanism 4 and an adjusting mechanism 5. The conveying mechanism 2 is arranged on the frame 1, and is used to convey the PCB board from the first station to the second station, and the conveying mechanism 2 can adjust the conveying speed in the conveying direction; the paving mechanism 3 is arranged on the frame 1, and is used to push the PCB board to a preset position; the board-straightening mechanism 4 is arranged on the frame 1, and is used to push the PCB board from the preset position to the fixed edge position of the conveying mechanism 2; the adjusting mechanism 5 is used to adjust the spacing between two adjacent PCB boards.

[0047] In this embodiment, the frame 1 is an open frame structure or a closed box structure, which is used to provide support and positioning for other functional mechanisms of the device. The conveying mechanism 2 can convey the PCB board from the first station to the second station along the conveying direction. Specifically, the first station is a horizontal chemical copper station, and the second station is a horizontal electroplating station. Two different process schemes are respectively performed on the PCB board at these two stations. In fact, the two different process schemes have different production speeds, different relative layout positions of PCB boards, and different PCB board spacings. This embodiment adjusts the conveying speed of the conveying mechanism 2 along the conveying direction to adapt to the different production speeds under the two production processes to ensure the continuity of the two production processes. At the same time, it does not require large labor costs and economic costs, and improves the assembly line of PCB boards. Production efficiency and production rhythm; further, the PCB board on the conveying mechanism 2 is pushed to the preset position for executing the process through the clapping mechanism 3. After the conveying mechanism 2 conveys the PCB board to the execution area of ​​the whole board mechanism 4, the whole board mechanism 4 continues to push the PCB board from the preset position to the fixed edge position of the conveying mechanism 2. The PCB board arriving at this position can adapt to the single-sided edge alignment production method of the horizontal electroplating station, thereby completing the adjustment of the relative arrangement of the PCB boards during the conveying process from the first station to the second station; in addition, the spacing between the two PCB boards can be adjusted through the adjustment mechanism 5, so that the spacing between the PCB boards is adjusted during the conveying process from the first station to the second station.

[0048] Please refer to Appendix 1 and Appendix Figure 2 Optionally, the conveying mechanism 2 includes a servo motor 21 and a plurality of transmission rollers 22 arranged side by side and drivingly connected to the servo motor 21 , and the PCB board is arranged on the transmission rollers 22 .

[0049] In this embodiment, the conveying mechanism 2 is provided with driving source power by the servo motor 21, and the servo controller 23 controls the servo motor 21 to achieve speed adjustment. At the same time, a feeding sensor 25 is installed at the feeding position of the conveying mechanism 2. When it senses that a PCB board passes through, it can transmit a signal to the servo controller 23, so that the servo controller 23 controls the start and speed adjustment of the servo motor 21; the execution structure of the conveying mechanism 2 is a plurality of transmission rollers 22 arranged in parallel, and the servo motor 21 drives the transmission main shaft 24 to rotate. The transmission main shaft 24 extends along the conveying direction and is connected to the transmission roller 22 to realize the rolling of the transmission roller 22, thereby driving the PCB board from the first station to the second station.

[0050] Furthermore, the outer surface of the transmission roller 22 is processed by grinding.

[0051] In this embodiment, the outer wall of the transmission roller 22 is mirror-finished by precision grinding, and the precision-ground surface remains smooth, thereby preventing the surface of the PCB board from being scratched during speed regulation, board clapping, board adjustment and other working conditions.

[0052] Please see attached Figure 1 and attached Figure 3 Optionally, the clapper mechanism 3 includes a sensor 31, a first driving member 32 and a plurality of first levers 33 connected to the first driving member 32. The first driving member 32 can drive the first levers 33 to push the PCB board to a preset position. The sensor 31 is signal-connected to the first driving member 32, and the sensor 31 is used to identify the PCB board.

[0053] In this embodiment, the sensor 31 is used to sense the PCB board that arrives at the clapperboard operation area on the conveying mechanism 2. After sensing the incoming material, the sensor 31 can transmit the signal to the first driving member 32. The first driving member 32 adopts a cylinder, so that the first driving member 32 drives the first baffle 33 to move. The first baffle 33 pushes the PCB board to a preset position. Multiple first baffles 33 are perpendicular to the conveying plane of the conveying mechanism 2, and multiple first baffles 33 are arranged at intervals on the connecting plate 35 to improve efficiency. In addition, the first driving member 32 drives the connecting plate 35 along the pushing direction. In order to ensure the accuracy of the movement of the connecting plate 35, a guide rail 34 is passed through the connecting plate 35. The displacement of the connecting plate 35 is always along the extension direction of the guide rail 34 to achieve precise guiding.

[0054] Please see attached Figure 1 and attached Figure 4 The whole board mechanism 4 includes a second driving member 41 and a second baffle 42 connected to the second driving member 41. The second driving member 41 can drive the second baffle 42 to push the PCB board from the preset position to the movable fixed edge position.

[0055] In this embodiment, the structure of the whole plate mechanism 4 is similar to that of the clapping mechanism 3, the second driving member 41 can be a cylinder, the second gear rod 42 has the same structure as the first gear rod 33, and the difference between the two is that the second gear rod 42 pushes the PCB board from a preset position to a fixed edge position through the action of the second driving member 41, so as to ensure the accurate positioning of the PCB and avoid poor conductivity caused by the difference in the clamping point position between the conductive clamp and the PCB board during the electroplating process. Multiple second gear rods 42 are fixed on the reference baffle 43 at intervals, and the reference baffle 43 provides an installation position for multiple second gear rods 42. At the same time, the slide rail 44 passes through the reference baffle 43, and the slide rail 44 provides a guide for the movement of the reference baffle 43.

[0056] Please see attached Figure 1 and attached Figure 5Optionally, the adjustment mechanism 5 includes a first mechanical arm 51 and a positioning pin 52 connected to the driving end of the first mechanical arm 51, and the positioning pin 52 can move the PCB board to adjust the distance between two adjacent PCB boards.

[0057] In this embodiment, the positioning pin 52 is a columnar structure, which is used to abut against the edge of the PCB board to change the position of the PCB board in the conveying mechanism 2, thereby adjusting the distance between two adjacent PCB boards. In order to improve the accuracy of the position adjustment, the positioning pin 52 is accurately adjusted by the first mechanical arm 51.

[0058] Furthermore, the driving end of the first mechanical arm 51 is connected to one end of the connecting flange 53 , the other end of the connecting flange 53 is connected to the mounting bracket 54 , and the plurality of positioning pins 52 are slidably connected to the mounting bracket 54 .

[0059] In this embodiment, the connecting flange 53 is connected to the mounting bracket 54, and a plurality of positioning pins 52 are slidably connected to the mounting bracket 54. The mounting bracket 54 is a rectangular structure, and a slide groove is provided on the mounting bracket 54. The positioning pins 52 can slide along the slide groove and can be fixed in an appropriate position, thereby facilitating the position adjustment of the positioning pins 52. The connecting flange 53 can facilitate the fixation of the mounting bracket 54.

[0060] Please see attached Figure 1 and attached Figure 6 Optionally, the device also includes a spray mechanism 6, which is arranged on the frame 1 and located downstream of the whole board mechanism 4. The spray mechanism 6 includes a spray rod 61 arranged above the conveying mechanism 2, and the spray rod 61 is used to spray water onto the PCB board to form a water film on the surface of the PCB board.

[0061] In this embodiment, the spray mechanism 6 can ensure that the PCB board with the chemical copper plating layer remains moist during the dynamic conveying process, and the electroplating copper process is entered after the chemical copper process in the front section is completed, thereby preventing the chemical copper plating layer from being oxidized. Specifically, the spray rod 61 is parallel to the transmission roller 22, and a plurality of spray heads for spraying water are provided along the extension direction of the spray rod 61 to ensure the water spraying efficiency and the integrity of the coating.

[0062] Furthermore, the spray mechanism 6 also includes a water pump 62 , a one-way valve 63 , a filter 64 , a solenoid valve 65 and a flow meter 66 .

[0063] The water pump 62 is arranged inside the box-type frame 1. The water pump 62 transports water to the one-way valve 63, enters the filter 64 through the water pipe, and outputs pure water through the filtering effect of the filter 64 to enter the spray rod 61 through the solenoid valve 65. In addition, the water output is counted by the flow meter 66 before entering the spray rod 61.

[0064] Please see attached Figure 1 and attached Figure 7 The device also includes a detection mechanism 7 arranged downstream of the whole board mechanism 4, the detection mechanism 7 is connected to the adjustment mechanism 5 by signal, and the detection mechanism 7 includes a detection sensor 71, and the detection sensor 71 is used to detect the distance between two adjacent PCB boards after adjustment.

[0065] In this embodiment, the detection sensor 71 is fixed to the edge of the frame 1 through the fixing seat 73. The detection sensor 71 can detect the PCB board on the conveying mechanism 2 and record the feeding signal of the PCB. The PLC performs logical operations, maintains the position data, and performs position adjustment through the adjustment mechanism 5. After the adjustment action is performed, the adjusted detection work is performed through the CCD camera 72 to confirm whether the adjustment work meets the preset standard. If it meets the standard, the next PCB board will continue to run. If it does not meet the standard, the difference data will be given in the logical operation and given to the adjustment mechanism 5 to perform compensation adjustment again. After the compensation adjustment is completed, the CCD camera 72 is used for retesting the accuracy after the execution of the adjustment action, and outputs fine-tuning correction to ensure that the adjustment of the spacing is accurate and correct.

[0066] Please refer to the attached Figure 1 and attached Figure 8 Optionally, the device also includes a plate replenishing mechanism 8, which is used to replenish PCB boards on the conveying mechanism 2. The plate replenishing mechanism 8 includes a second mechanical arm 81 and a suction nozzle 82 driven and connected to the second mechanical arm 81. When the board spacing between two adjacent PCB boards is greater than the length of a single PCB board, the suction nozzle 82 is used to suck the PCB board and place it on the conveying mechanism 2.

[0067] Since the adjustment mechanism 5 continuously adjusts the spacing between PCB boards, the spacing between the outgoing materials is continuously reduced, while the distance between the incoming materials will on the contrary accumulate and become larger and larger. By arranging a board filling mechanism 8 on the side of the incoming materials, when the detection system of the adjustment section detects that the spacing between two PCB boards exceeds the length of a single PCB board, the second mechanical arm 81 sucks a new PCB board from the material rack 9 through the suction nozzle 82 and places it on the conveying mechanism 2. The adjustment mechanism 5 can avoid the problem of no PCB boards being able to be continuously connected due to the cumulative distance being too large after adjusting the spacing.

[0068] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A spacing adjustment device, used to adjust the spacing between PCB boards, characterized in that: include: Rack (1); A conveying mechanism (2) is arranged on the frame (1), the conveying mechanism (2) is used to convey the PCB board from the first station to the second station, and the conveying mechanism (2) can adjust the conveying speed in the conveying direction; A clapper mechanism (3) is arranged on the frame (1), and the clapper mechanism (3) is used to push the PCB board to a preset position; A board-straightening mechanism (4) is arranged on the frame (1), and the board-straightening mechanism (4) is used to push the PCB board from the preset position to the fixed edge position of the conveying mechanism (2); The adjustment mechanism (5) is used to adjust the distance between two adjacent PCB boards.

2. The spacing adjustment device according to claim 1, characterized in that: The conveying mechanism (2) comprises a servo motor (21) and a plurality of transmission rollers (22) arranged side by side and drivingly connected to the servo motor (21), and the PCB board is arranged on the transmission rollers (22).

3. The spacing adjustment device according to claim 2, characterized in that: The outer surface of the transmission roller (22) is processed by grinding.

4. The spacing adjustment device according to claim 1, characterized in that: The clapper mechanism (3) comprises a sensor (31), a first driving member (32) and a plurality of first baffles (33) connected to the first driving member (32); the first driving member (32) can drive the first baffles (33) to push the PCB to the preset position; the sensor (31) is signal-connected to the first driving member (32); and the sensor (31) is used to identify the PCB.

5. The spacing adjustment device according to claim 1, characterized in that: The whole board mechanism (4) comprises a second driving member (41) and a second baffle rod (42) connected to the second driving member (41), and the second driving member (41) can drive the second baffle rod (42) to push the PCB board from the preset position to the fixed edge position.

6. The spacing adjustment device according to claim 1, characterized in that: The adjustment mechanism (5) comprises a first mechanical arm (51) and a positioning pin (52) connected to a driving end of the mechanical arm (51); the positioning pin (52) can move the PCB board to adjust the distance between two adjacent PCB boards.

7. The spacing adjustment device according to claim 6, characterized in that: The driving end of the first mechanical arm (51) is connected to one end of a connecting flange (53), the other end of the connecting flange (53) is connected to a mounting bracket (54), and a plurality of positioning pins (52) are slidably connected to the mounting bracket (54).

8. The spacing adjustment device according to any one of claims 1 to 7, characterized in that: The spacing adjustment device also includes a spray mechanism (6), which is arranged on the frame (1) and located downstream of the whole board mechanism (4). The spray mechanism (6) includes a spray rod (61) arranged above the conveying mechanism (2), and the spray rod (61) is used to spray water onto the PCB board to form a water film on the surface of the PCB board.

9. The spacing adjustment device according to any one of claims 1 to 7, characterized in that: The spacing adjustment device also includes a detection mechanism (7) arranged downstream of the whole board mechanism (4), the detection mechanism (7) being signal-connected to the adjustment mechanism (5), the detection mechanism (7) including a detection sensor (71), and the detection sensor (71) being used to detect the distance between two adjacent PCB boards after adjustment.

10. The spacing adjustment device according to any one of claims 1 to 7, characterized in that: The spacing adjustment device also includes a board replenishing mechanism (8) for replenishing the PCB board on the conveying mechanism (2); the board replenishing mechanism (8) includes a second mechanical arm (81) and a suction nozzle (82) drivingly connected to the second mechanical arm (81); when the board spacing between two adjacent PCB boards is greater than the length of a single PCB board, the suction nozzle (82) is used to suck the PCB board and place it on the conveying mechanism (2).

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